Carbon fiber components, housings, and electronic devices

Abstract

This invention proposes a carbon fiber component, a housing, and an electronic device. The carbon fiber component is defined as having an inner surface and an outer surface facing each other. The carbon fiber component includes a carbon fiber layer and further includes at least one of an electrostatic shielding layer and a conductive structure. The electrostatic shielding layer is stacked with the carbon fiber layer, and the conductive structure is located on the inner surface of the carbon fiber component. The technical solution of this application can improve the electrostatic shielding performance of the carbon fiber component.

Description

Technical Field

[0001] This invention relates to the field of composite material technology, and in particular to a carbon fiber component, housing, and electronic device. Background Technology

[0002] Carbon fiber composites have the characteristics of high strength and low density, which can meet the high strength requirements with thinner wall thickness and lower weight. They are a good material for making shells for wearable electronic devices such as AR (Augmented Reality) and VR (Virtual Reality) glasses, which have high requirements for lightweight and miniaturization.

[0003] However, carbon fiber components have good conductivity along the fiber length direction, but poor conductivity in the direction perpendicular to the fiber length. Therefore, when using this carbon fiber composite material with anisotropic conductivity as the shell, there are high design requirements for electrostatic protection of electronic devices. Summary of the Invention

[0004] The main objective of this invention is to provide a carbon fiber component, housing, and electronic device, which aims to improve the electrostatic protection performance of the carbon fiber component.

[0005] To achieve the above objectives, the present invention proposes a carbon fiber component, which is defined as having an inner surface and an outer surface arranged opposite to each other, the carbon fiber component including a carbon fiber layer, and the carbon fiber component further including at least one of an electrostatic shielding layer and a conductive structure;

[0006] The electrostatic shielding layer is stacked with the carbon fiber layer, and the conductive structure is located on the inner surface of the carbon fiber component.

[0007] In one embodiment of this application, the outer surface of the carbon fiber component is provided with the electrostatic shielding layer.

[0008] In one embodiment of this application, the inner surface of the carbon fiber component is provided with the electrostatic shielding layer.

[0009] In one embodiment of this application, the carbon fiber layer is a unidirectional carbon fiber prepreg, and the carbon fiber component includes at least two layers of the unidirectional carbon fiber prepreg, wherein the layup directions of the two layers of the unidirectional carbon fiber prepreg are arranged at an angle.

[0010] In one embodiment of this application, a plurality of carbon fiber unidirectional prepregs of the carbon fiber component are stacked sequentially in an alternating manner of 0° and 90°.

[0011] And / or, the carbon fiber component comprises four layers of the carbon fiber unidirectional prepreg.

[0012] And / or, the thickness of the carbon fiber component does not exceed 0.5 mm;

[0013] And / or, the carbon fiber unidirectional prepreg is made of thermosetting carbon fiber material or thermoplastic carbon fiber material.

[0014] In one embodiment of this application, the electrostatic shielding layer is provided between the two carbon fiber layers.

[0015] In one embodiment of this application, the thickness of the electrostatic shielding layer is t, which satisfies t≤0.05mm.

[0016] In one embodiment of this application, the electrostatic shielding layer is an antistatic film or an antistatic coating.

[0017] In one embodiment of this application, the carbon fiber layer is a carbon fiber woven fabric.

[0018] In one embodiment of this application, the inner surface of the carbon fiber component is provided with a conductive layer, and the conductive layer forms the conductive structure.

[0019] In one embodiment of this application, the conductive layer is at least one of a metal foil, a metal mesh, a metal coating, or a conductive cloth;

[0020] And / or, the thickness T of the conductive layer satisfies that T≤0.03mm;

[0021] And / or, the resistivity R of the conductive layer is ≤0.05Ω.

[0022] In one embodiment of this application, a portion of the resin layer of the innermost carbon fiber layer is open, exposing the carbon fibers to form the conductive structure.

[0023] In one embodiment of this application, the opening of the resin layer is provided with a conductive plating layer.

[0024] This application also proposes a housing made of carbon fiber material as described in any of the preceding claims.

[0025] This application also proposes an electronic device comprising the housing as described above.

[0026] In one embodiment of this application, the inner surface of the housing has a conductive structure, which is electrically connected to the grounding structure of the electronic device.

[0027] The technical solution of this invention improves the ESD shielding performance of carbon fiber components by setting an electrostatic shielding layer on the carbon fiber component and a conductive structure on the inner surface of the carbon fiber component. The carbon fiber component can have only one of the electrostatic shielding layer and the conductive structure, or both. When the carbon fiber component has an electrostatic shielding layer stacked with carbon fiber layers, the electrostatic shielding layer can act as an anti-static shield, preventing external static electricity from breaking down the carbon fiber component. Therefore, when the carbon fiber component is used to make a shell or baffle, external static electricity cannot reach the components inside the shell, providing better protection. When the carbon fiber component has a conductive structure on its inner surface, the conductive structure can be electrically connected to the overall grounding structure of the electronic device. With this configuration, even if external static electricity breaks down the carbon fiber component, it will be connected to the electrical ground of the electronic device and will not reach the components, thus providing better protection for the components.

[0028] Setting at least two carbon fiber layers on a carbon fiber component allows the carbon fiber filaments in the two layers to be arranged in different directions. This can improve the mechanical properties of the carbon fibers in different directions and also give the carbon fiber component good electrical conductivity in different directions. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 This is a cross-sectional view of the first embodiment of the carbon fiber part of the present invention;

[0031] Figure 2 This is a cross-sectional view of the second embodiment of the carbon fiber part of the present invention;

[0032] Figure 3 This is a cross-sectional view of the third embodiment of the carbon fiber part of the present invention;

[0033] Figure 4 This is a cross-sectional view of the fourth embodiment of the carbon fiber part of the present invention;

[0034] Figure 5 for Figure 4 A structural diagram showing the connection between the carbon fiber component and the grounding structure.

[0035] Figure 6 This is a structural diagram showing the fifth embodiment of the carbon fiber component of the present invention and its connection with the grounding structure.

[0036] Explanation of icon numbers:

[0037] 100 carbon fiber parts 51 conductive layer 10 carbon fiber layer 53 conductive coating 11 carbon fiber 200 Grounding structure 30 electrostatic shielding layer 300 Conductive structure 50 conductive structure

[0038] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0043] In view of the technical problems mentioned in the background art, the present invention proposes a carbon fiber component 100 with better ESD shielding performance.

[0044] Please refer to Figures 1 to 6In some embodiments of this application, the carbon fiber component 100 is defined to have an inner surface and an outer surface disposed opposite to each other, the carbon fiber component 100 includes a carbon fiber layer 10, and the carbon fiber component 100 further includes at least one of an electrostatic shielding layer and a conductive structure 50.

[0045] The electrostatic shielding layer is stacked with the carbon fiber layer 10, and the conductive structure 50 is located on the inner surface of the carbon fiber component 100.

[0046] Carbon fiber component 100 is a composite material component made of carbon fiber layer 10 and resin. It has the characteristics of high strength and light weight, which can better meet the requirements of electronic devices, especially head-mounted devices (such as VR devices and AR devices), for high strength and light weight of the shell.

[0047] Among them, the carbon fiber layer 10 can exist in the form of unidirectional fabric or in the form of woven fabric (for example, the weaving texture adopts 2×2 twill weave); on the other hand, the carbon fiber 11 in the carbon fiber layer 10 can also be selected with various strength grades, such as T300 grade, T700 grade, etc.; in addition, the layup method of the carbon fiber layer 10 can be a single layer arrangement or a multi-layer arrangement (for example, two or more layers).

[0048] As for the resin, thermoplastic resins such as PC, PA, PP, PEEK, and PPS are selected. Furthermore, various flame retardant grades are available, such as [V2] and [V0]. The resin is used to encapsulate the carbon fiber layer 10; thus, after the resin cures, the carbon fiber layer 10 is encapsulated within the resin matrix, forming the carbon fiber component 100.

[0049] The carbon fiber component 100 proposed in this application has at least one of an electrostatic shielding layer 30 and a conductive structure 50 on the basis of the carbon fiber layer 10. That is, the electrostatic shielding layer can be provided on any surface of any carbon fiber layer 10, or the conductive structure 50 can be provided on the innermost surface of the carbon fiber component 100. For example, the electrostatic shielding layer can be provided between any two carbon fiber layers 10, or on the innermost or outermost side of the carbon fiber component 100, without limitation. The electrostatic shielding layer can be an antistatic plexiglass layer or an antistatic acrylic layer, or an antistatic polyvinyl chloride layer, an antistatic polycarbonate layer, or an antistatic nylon layer, etc., without limitation. The electrostatic shielding layer can play a blocking role to prevent external static electricity from breaking down the carbon fiber component 100. Therefore, when the carbon fiber component 100 is made into the shell of an electronic device, it can prevent external static electricity from being transmitted to the components inside the electronic device, thereby preventing damage to the components or interference with the normal operation of the components. When a conductive structure 50 is provided on the innermost surface of the carbon fiber component 100, the conductive layer 51 can be provided on the surface of the carbon fiber layer 10, or a portion of the resin layer covering the carbon fiber 11 can be peeled off to expose a portion of the carbon fiber 11 as the conductive structure 50. For electronic devices, a whole-machine electrical grounding structure 200 is usually provided inside the electronic device. In this case, the static electricity that penetrates the carbon fiber component 100 and reaches the conductive structure 50 can be transferred to the grounding structure 200 of the electronic device, thereby preventing external static electricity from being transferred to the components of the electronic device. This can also prevent damage to the components or interference with the normal operation of the components, and improve the safety of the electronic device.

[0050] Therefore, it is understood that the technical solution of the present invention improves the ESD shielding performance of the carbon fiber component 100 by providing an electrostatic shielding layer 30 on the carbon fiber component 100 and a conductive structure 50 on the inner surface of the carbon fiber component 100. The carbon fiber component 100 may only have one of the electrostatic shielding layer 30 and the conductive structure 50, or both may be provided simultaneously. When the carbon fiber component 100 has the electrostatic shielding layer 30 stacked with the carbon fiber layer 10, the electrostatic shielding layer 30 can act as an anti-static shield, preventing external static electricity from breaking down the carbon fiber component 100. Thus, when the carbon fiber component 100 is used to make a shell or baffle, external static electricity cannot reach the components inside the shell, providing better protection. When the carbon fiber component 100 has the conductive structure 50 on its inner surface, the conductive structure 50 can be electrically connected to the overall grounding structure 200 inside the electronic device. With this configuration, even if external static electricity breaks down the carbon fiber component 100, it will be connected to the electrical ground of the electronic device and will not reach the components, thus providing better protection for the components.

[0051] Please refer to Figure 1In some embodiments of this application, the outer surface of the carbon fiber component 100 is provided with the electrostatic shielding layer.

[0052] In this embodiment, an electrostatic shielding layer is disposed on the outer surface of the carbon fiber component 100. With this arrangement, an electrostatic coating or antistatic film can be applied to the outer surface of the carbon fiber component 100 by spraying or pasting, which facilitates the preparation of the carbon fiber component 100 and eliminates the need to add an electrostatic shielding layer during the stacking of the carbon fiber layers 10.

[0053] Please refer to Figure 2 In some embodiments of this application, the inner surface of the carbon fiber component 100 is provided with the electrostatic shielding layer.

[0054] In this embodiment, the electrostatic shielding layer is disposed on the inner surface of the carbon fiber component 100. With this arrangement, when the carbon fiber component 100 is used to make the shell, the electrostatic shielding layer is located on the inner side of the shell. This arrangement can also prevent the electrostatic shielding layer from being exposed on the outside and easily worn, and can make the outer surface of the shell uniform and smooth, with a good three-dimensional appearance and good stability.

[0055] Please refer to Figures 1 to 6 In some embodiments of this application, the carbon fiber layer 10 is a unidirectional carbon fiber prepreg, and the carbon fiber component 100 includes at least two layers of the unidirectional carbon fiber prepreg, wherein the layup directions of the two layers of the unidirectional carbon fiber prepreg are arranged at an angle.

[0056] In this embodiment, the carbon fiber component 100 is provided with at least two carbon fiber layers 10, each carbon fiber layer 10 being a unidirectional carbon fiber prepreg. The unidirectional carbon fiber prepreg is formed by pre-impregnating unidirectionally extending carbon fibers 11 with resin and then curing them. The carbon fibers 11 in the at least two unidirectional carbon fiber prepregs are arranged in different directions. This arrangement can improve the mechanical properties of the carbon fiber component 100 in different directions and also make the carbon fiber component 100 have good conductivity in different directions.

[0057] Please refer to Figures 1 to 6 In some embodiments of this application, a plurality of carbon fiber unidirectional prepregs of the carbon fiber component 100 are stacked sequentially in an alternating manner of 0° and 90°.

[0058] And / or, the carbon fiber component 100 comprises four layers of the carbon fiber unidirectional prepreg.

[0059] And / or, the thickness of the carbon fiber component 100 does not exceed 0.5 mm;

[0060] And / or, the carbon fiber unidirectional prepreg is made of thermosetting carbon fiber 11 material or thermoplastic carbon fiber 11 material.

[0061] In this embodiment, the carbon fiber unidirectional prepregs in the carbon fiber component 100 are perpendicular to the carbon fiber 11 extending from bottom to top. Taking four layers of carbon fiber unidirectional prepregs as an example, from bottom to top, they are 90° carbon fiber unidirectional prepregs, 0° carbon fiber unidirectional prepregs, 90° carbon fiber unidirectional prepregs, and 0° carbon fiber unidirectional prepregs. This can ensure the strength of the carbon fiber layer 10, thereby ensuring the overall strength performance of the composite structure after composite molding, improving the mechanical properties of the carbon fibers 11 in different directions, and also making the carbon fiber component 100 have good conductivity in different directions.

[0062] In some embodiments, four layers of unidirectional carbon fiber prepreg are selected for lamination. The four-layer lamination can better ensure the strength of the carbon fiber layer 10, thereby ensuring the overall strength performance of the composite structure after composite molding. At the same time, the four-layer lamination will not result in a large weight of the composite structure, which is beneficial to the lightweighting of the carbon fiber component 100 and broadens the application range of the carbon fiber component 100.

[0063] Furthermore, to meet lightweighting requirements and enable the carbon fiber part 100 to be better applied (e.g., in the shell of virtual reality glasses), the thickness of the carbon fiber unidirectional prepreg should not be too large to avoid excessive weight affecting the lightweighting performance. Therefore, a 0.1 mm thick thermosetting carbon fiber unidirectional prepreg can be used. In this case, the thickness of the carbon fiber part 100 after compression molding can reach 0.4 mm or even lower, offering a 15%–25% weight reduction advantage compared to traditional plastics. When using thermoplastic carbon fiber unidirectional prepreg, the thickness of the carbon fiber part 100 can also be controlled within 0.5 mm, similarly contributing to the product's lightweighting requirements.

[0064] In this embodiment, the unidirectional carbon fiber prepreg is made of thermosetting carbon fiber 11 or thermoplastic carbon fiber 11. Thermoplastic carbon fiber 11 is an intermediate material formed by using thermoplastic resin as the matrix material and combining it with different types of carbon fiber 11 tows. Thermoplastic carbon fiber 11 composite materials can be used to manufacture thermoplastic carbon fiber parts 100. Thermoplastic carbon fiber 11 has good corrosion resistance, wear resistance, and reshapeability. During heating, thermoplastic carbon fiber 11 can be softened and hardened multiple times, allowing for reprocessing, repair, and adjustment, improving the maintainability and plasticity of the product. It also has high impact toughness and energy absorption capacity. Excellent high-temperature performance of thermosetting materials: Thermosetting carbon fiber unidirectional prepreg has excellent high-temperature resistance, maintaining good strength and stiffness at high temperatures. It provides excellent mechanical properties, making it suitable for applications requiring high strength. It maintains good dimensional stability at high temperatures and is not prone to shape changes.

[0065] Please refer to Figure 3In some embodiments of this application, the electrostatic shielding layer is provided between the two carbon fiber layers 10.

[0066] In this embodiment, an electrostatic shielding layer is provided between two adjacent carbon fiber layers 10. This electrostatic shielding layer can be provided between only two carbon fiber layers 10. When three or more carbon fiber layers 10 are provided, two or more electrostatic shielding layers can be provided sandwiched between the carbon fiber layers 10 and stacked alternately with the carbon fiber layers 10. Providing the electrostatic shielding layer between the carbon fiber layers 10 can prevent wear of the electrostatic shielding layer and make the inner and outer surfaces of the carbon fiber part 100 have a consistent appearance, thus improving the aesthetics of the product.

[0067] Please refer to Figures 1 to 3 In some embodiments of this application, the thickness of the electrostatic shielding layer is t, which satisfies t≤0.05mm.

[0068] In this embodiment, the thickness of the electrostatic shielding layer in the carbon fiber component 100 is set to no more than 0.05 mm. The thickness t of the electrostatic shielding layer can take any value within 0.01 mm, 0.02 mm, 0.03 mm, 0.035 mm, 0.04 mm, 0.05 mm, and 0.05 mm, without limitation. This setting ensures that the electrostatic shielding layer meets the antistatic shielding requirements while avoiding excessive thickness that would increase the product weight. It also gives the electrostatic shielding layer better transparency and flexibility. When the carbon fiber component 100 is used to process the required structure, the electrostatic shielding layer is less likely to be damaged or cracked, and can maintain good antistatic capability. Furthermore, when the electrostatic shielding layer is placed on the outer or inner surface of the carbon fiber component 100, the carbon fiber layer 10 can be seen through it, giving it a better appearance and texture, which is conducive to the development of products towards lightweight, aesthetic, and comfortable designs.

[0069] In some embodiments of this application, the electrostatic shielding layer is an antistatic film or an antistatic coating.

[0070] In this embodiment, the electrostatic shielding layer can be an antistatic film or an antistatic coating. The antistatic film is made by adding an antistatic agent to polyethylene raw materials to increase their surface resistance. The antistatic film itself does not generate static electricity through friction, and its wear resistance is improved after high-temperature setting, thus achieving a good antistatic effect and effectively preventing external static electricity from entering the electronic device and damaging its internal components. The antistatic coating utilizes the conductivity of conductive materials. A conductive material is applied to the surface of an object to form a conductive film, thereby dispersing static charge onto the conductive film and preventing the accumulation and discharge of static electricity. The conductive materials of the antistatic coating are typically metals or carbon fibers, etc. These materials have good conductivity and can disperse static charge onto the conductive film, thereby preventing the generation and discharge of static electricity. The conductive materials of the antistatic coating can be prepared by spraying, coating, electroplating, etc., and have good conductivity and durability.

[0071] In some embodiments of this application, the carbon fiber layer 10 is a carbon fiber woven fabric.

[0072] It should be noted that, since it is difficult to make the wall thickness of products using unidirectional fabric thinner, this embodiment uses carbon fiber woven fabric to obtain carbon fiber parts 100 with thinner walls. The strength grade of carbon fiber 11 can be T300 or T700; for appearance considerations, the weave texture can be 2×2 twill weave; and the volume content of carbon fiber 11 can be 45%.

[0073] Please refer to Figures 4 to 6 In some embodiments of this application, the inner surface of the carbon fiber component 100 is provided with a conductive layer 51, and the conductive layer 51 forms the conductive structure 50.

[0074] In this embodiment, a conductive layer 51 is formed on the inner surface of the carbon fiber component 100 to create a conductive structure 50. When the carbon fiber component 100 is used in the casing of an electronic device, the conductive structure 50 is electrically connected to the overall grounding structure 200 provided inside the electronic device. With this configuration, even if external electrostatic discharge causes a breakdown of the carbon fiber component 100, the electrical components will be connected to the ground of the electronic device's electrical design and will not reach the components, thus providing better protection for the components. The conductive layer 51 can be a conductive metal layer, such as metal foil, metal mesh, metal coating, or conductive cloth as described in the following embodiments, and is not limited thereto.

[0075] In some embodiments of this application, the conductive layer 51 is at least one of a metal foil, a metal mesh, a metal coating, or a conductive cloth.

[0076] In this embodiment, the conductive layer 51 can be a metal foil, metal mesh, metal coating, or conductive cloth, etc. It has high conductivity, low resistance, and can cover the inner surface of the carbon fiber component 100, so that the inner surface of the carbon fiber component 100 has conductivity everywhere. This allows external static electricity that breaks down the carbon fiber component 100 from different locations to be guided to the grounding position of the electronic device, resulting in reliable and stable shielding performance, and convenient installation and use.

[0077] Please refer to Figure 4 and Figure 5 In some embodiments of this application, the thickness T of the conductive layer 51 satisfies T≤0.03mm;

[0078] And / or, the resistivity R of the conductive layer 51 is ≤0.05Ω.

[0079] Understandably, as the thickness of the conductive layer 51 increases, its resistance and mass also increase. When it is necessary to use the conductive layer 51 to conduct static electricity and prevent static current from flowing to the components of electronic devices, the resistance of the conductive layer 51 needs to be reduced. In this embodiment, the thickness of the conductive layer 51 is kept to no more than 0.03 mm, which can effectively reduce the resistance of the conductive layer 51, improve the static electricity conduction capability of the conductive layer 51, and enable the external static electricity that breaks down the casing to be quickly guided to the grounding position, thereby improving the antistatic capability.

[0080] Similarly, the resistivity of the conductive layer 51 is kept below 0.05Ω to improve its electrostatic discharge capability, allowing external static electricity from breaking down the casing to be quickly conducted to the grounding location, thus improving its antistatic capability. The thickness and resistance of the conductive layer 51 can be adjusted to meet these conditions based on the material and structural form used. However, with different materials and structural designs, the thickness of the conductive layer 51 may exceed 0.03mm even when the resistivity meets these conditions. Therefore, only one of the above conditions needs to be met; no specific limitation is made here.

[0081] Please refer to Figure 6 In some embodiments of this application, the resin layer of the innermost carbon fiber layer 10 is opened in a portion to expose the carbon fiber 11 to form the conductive structure 50.

[0082] Whether it is carbon fiber unidirectional prepreg or carbon fiber woven fabric forming carbon fiber layer 10, a resin layer is wrapped around the outside of carbon fiber 11. In this embodiment, the resin layer in a part of the innermost carbon fiber layer 10 in the carbon fiber component 100 is peeled off to expose the carbon fiber 11 inside the resin layer. At this time, the carbon fiber 11 of the innermost carbon fiber layer 10 is used as a conductive layer 51, and the exposed carbon fiber 11 is used as a conductive structure 50. By utilizing the conductivity of carbon fiber 11, the conductivity between the inner layer of the entire carbon fiber component 100 and the grounding point is achieved, which is used to electrically connect with the whole-machine grounding structure 200 set in the electronic device. With this setting, when the external electrostatic discharge breaks down the carbon fiber component 100 and reaches the innermost carbon fiber 11, it will be guided by the carbon fiber 11 to the ground of the electronic device's electrical design, and will not reach the components, thereby playing a better protective role for the components.

[0083] Please refer to Figure 6 In some embodiments of this application, the opening of the resin layer is provided with a conductive plating layer 53.

[0084] In this embodiment, a conductive plating layer 53 is provided at the opening position of the resin layer of the exposed carbon fiber 11. The conductive plating layer 53 can be formed by electroplating or penetration to form a conductive area at the opening position. This arrangement makes it easier to connect the inner layer of the carbon fiber component 100 to the grounding point, thereby improving the connection convenience of electronic devices.

[0085] This application also proposes a housing made of carbon fiber material 100 as described in any of the preceding claims. It is understood that the housing proposed in this application can be applied to various electronic devices, such as: mobile phones, tablets, televisions, monitors, laptops, digital photo frames, personal digital assistants (PDAs), e-book readers, MP3 (Moving Picture Experts Group Audio Layer III) players, MP4 (Moving Picture Experts Group Audio Layer IV) players, wearable devices, navigators, handheld game consoles, virtual reality devices, augmented reality devices, etc.

[0086] Since the shell proposed in this application applies all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought by all the foregoing technical solutions, which will not be elaborated here.

[0087] This application also proposes an electronic device comprising the housing described above. The electronic device may also be a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, personal digital assistant (PDA), e-book reader, MP3 (Moving Picture Experts Group Audio Layer III) player, MP4 (Moving Picture Experts Group Audio Layer IV) player, wearable device, navigator, handheld game console, virtual reality (VR) device, augmented reality (AR) device, etc. In the case of eyeglasses, the housing constitutes the frame and temples, and the components include at least one of a sensor assembly, a camera assembly, an indicator light assembly, and an antenna assembly.

[0088] Since the electronic device proposed in this application applies all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought by all the foregoing technical solutions, which will not be elaborated here.

[0089] Please refer to Figure 5 and Figure 6 In some embodiments of this application, the inner surface of the housing has a conductive structure 50, which is electrically connected to the grounding structure 200 of the electronic device.

[0090] In this embodiment, a grounding structure 200 for grounding the entire device is provided inside the electronic device, and the outer shell is made of carbon fiber component 100 with a conductive structure 50 on the inner surface. The conductive structure 50 can be a conductive layer 51, or it can be a partial resin layer covering carbon fiber 11 that is peeled off and exposed as a conductive structure 50. In this case, static electricity that penetrates the carbon fiber component 100 and reaches the conductive structure 50 can be transferred to the grounding structure 200 of the electronic device, thereby preventing external static electricity from being transferred to the components of the electronic device. This also prevents damage to the components or interference with their normal operation, and improves the safety of the electronic device. The grounding conductive structure 300 can be a metal spring, or in the form of conductive adhesive, conductive foam, conductive cloth, etc.

[0091] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A carbon fiber component, defined as having an inner surface and an outer surface facing away from each other, characterized in that, The carbon fiber component includes a carbon fiber layer and a conductive structure; The conductive structure is located on the inner surface of the carbon fiber part. The resin layer of the innermost carbon fiber layer has an opening and exposes the carbon fiber to form the conductive structure. The exposed carbon fiber serves as the conductive structure, which is used for electrical connection with the grounding structure of the electronic device.

2. The carbon fiber component as described in claim 1, characterized in that, The outer surface of the carbon fiber component is provided with an electrostatic shielding layer, which is stacked with the carbon fiber layer.

3. The carbon fiber article of claim 1, wherein The inner surface of the carbon fiber component is provided with an electrostatic shielding layer, which is stacked with the carbon fiber layer.

4. The carbon fiber article of claim 1, wherein, The carbon fiber layer is a unidirectional carbon fiber prepreg, and the carbon fiber component includes at least two layers of the unidirectional carbon fiber prepreg, wherein the layup directions of the two layers of the unidirectional carbon fiber prepreg are arranged at an angle.

5. The carbon fiber article of claim 4, wherein, The carbon fiber component comprises several carbon fiber unidirectional prepregs stacked sequentially in an alternating manner of 0° and 90°. And / or, the carbon fiber component comprises four layers of the carbon fiber unidirectional prepreg; And / or, the thickness of the carbon fiber component does not exceed 0.5 mm; And / or, the carbon fiber unidirectional prepreg is made of thermosetting carbon fiber material or thermoplastic carbon fiber material.

6. The carbon fiber article of claim 4, wherein An electrostatic shielding layer is provided between the two carbon fiber layers, and the electrostatic shielding layer is stacked with the carbon fiber layers.

7. The carbon fiber article of claim 1, wherein The carbon fiber component further includes an electrostatic shielding layer, which is stacked with the carbon fiber layer. The thickness of the electrostatic shielding layer is t, which satisfies t≤0.05mm.

8. The carbon fiber article of claim 1, wherein, The carbon fiber component also includes an electrostatic shielding layer, which is stacked with the carbon fiber layer. The electrostatic shielding layer is an antistatic film or an antistatic coating.

9. The carbon fiber article of claim 1, wherein, The carbon fiber layer is a carbon fiber woven fabric.

10. The carbon fiber article of claim 1, wherein The inner surface of the carbon fiber component is provided with a conductive layer, which forms the conductive structure.

11. The carbon fiber article of claim 10, wherein The conductive layer is at least one of a metal foil, a metal mesh, a metal coating, or a conductive cloth; And / or, the thickness T of the conductive layer satisfies that T≤0.03mm; And / or, the resistivity R of the conductive layer is ≤0.05Ω.

12. The carbon fiber article of claim 1, wherein The openings of the resin layer are provided with a conductive plating layer.

13. A housing characterized by The outer shell is made of carbon fiber as described in any one of claims 1 to 12.

14. An electronic device, comprising: The electronic device includes the housing as described in claim 13.

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