Antenna radio frequency module, radio frequency module assembly, and antenna device including the same

Abstract

The present invention relates to a radio frequency (RF) module for an antenna, a radio frequency (RF) module assembly, and an antenna device including the same. In particular, the radio frequency (RF) module for an antenna includes a radio frequency (RF) filter, a radiator module disposed on one side of the radio frequency (RF) filter, and an amplifier substrate disposed on the other side of the radio frequency (RF) filter and having an analog amplifier device mounted thereon. A plurality of the radio frequency (RF) modules for an antenna are arranged to form a radio frequency (RF) module assembly, and the radio frequency (RF) module assembly and an antenna housing are included to form an antenna device. Accordingly, a radome that obstructs heat dissipation toward the front of the antenna is not required, and heat generated from heat generating devices of the antenna device is spatially separated, so that heat dissipation is dispersed toward the front and rear of the antenna device, thereby having an effect of greatly improving heat dissipation performance.

Description

Technical Field

[0001] This invention relates to an antenna radio frequency (RF) module, an RF module assembly, and an antenna device including the same component. More specifically, it relates to an antenna RF module, an RF module assembly, and an antenna device including the same component that do not require a conventional antenna device and are configured to expose the radiating device module and RF device to the front of the antenna housing, thereby improving heat dissipation, enabling thinner manufacturing, and reducing product manufacturing costs. Background Technology

[0002] Base station antennas, including repeaters used in mobile communication systems, have various shapes and structures, including a structure with multiple radiating devices appropriately arranged on at least one reflector that is usually upright in the longitudinal direction.

[0003] Recently, while meeting the high-performance requirements of multiple input multiple output (MIMO) antennas, research is actively underway to achieve miniaturized, lightweight, and low-cost structures. In particular, when antenna devices using patch-type radiating devices to achieve linear or circular polarization are employed, a method is commonly used where gold is plated onto the radiating device formed on a dielectric substrate of plastic or ceramic material and then soldered onto a printed circuit board (PCB).

[0004] Figure 1 This is an exploded perspective view showing an example of an antenna device according to the prior art.

[0005] like Figure 1 As shown, in the antenna device 1 according to the prior art, a plurality of radiating devices 35 output in the desired direction and are arranged in such a way that they are exposed to the front surface of the antenna housing body 10, which is the beam output direction, so that the beam can be easily shaped. In order to protect it from the influence of the external environment, a radome 50 is installed at the front end of the antenna housing body 10, with the plurality of radiating devices 35 in between.

[0006] More specifically, the antenna device 1 according to the prior art includes: an antenna housing body 10, which is a thin cuboid housing with an opening on the front surface, and a plurality of heat sinks 11 are integrally formed on the rear surface; a main board 20, which is stacked on the rear surface inside the antenna housing body 10; and an antenna board 30, which is stacked on the front surface inside the antenna housing body 10.

[0007] The front surface of the antenna plate 30 is equipped with a patch-type radiating device or a dipole-type radiating device 35. The front surface of the antenna housing body 10 may be provided with an antenna cover 50 to protect the internal components from external influences, while ensuring smooth radiation from the radiating device 35.

[0008] However, in one example 1 of the antenna device according to the prior art, the front part of the antenna housing body 10 is shielded by the radome 50, and the radome 50 itself acts as a factor hindering heat dissipation from the front of the antenna device. Furthermore, the radiating device 35 is designed to only perform radio frequency (RF) signal transmission / reception, and the heat generated by the radiating device 35 cannot be dissipated forward. Therefore, the heat generated by the high-heat-generating components inside the antenna housing body 10 can only be dissipated to the rear of the antenna housing body 10, resulting in a significant reduction in heat dissipation efficiency. To solve these problems, the demand for designing new heat dissipation structures is increasing.

[0009] Furthermore, according to an example 1 of the prior art antenna device, due to the volume of the radome 50 and the volume occupied by the structure in which the radiating device 35 is separated from the front surface of the antenna plate 30, it is practically difficult to achieve the ultra-thin base station required in-building or 5G shadow areas. Summary of the Invention

[0010] Technical issues

[0011] In order to solve the technical problems mentioned above, the present invention aims to provide an antenna radio frequency (RF) module, an RF module assembly, and an antenna device including the RF module, which removes the radome and places the antenna radio frequency (RF) module outside the antenna housing to expose it to the outside air, thereby enabling dispersed heat dissipation to the front and rear of the antenna housing, and thus greatly improving heat dissipation performance.

[0012] Furthermore, another object of the present invention is to provide an antenna radio frequency (RF) module including a reflector, an RF module assembly, and an antenna device including the component, wherein the reflector is used to stably protect the RF filter internally, perform a grounding function between the radiating device and the RF filter, and easily dissipate heat generated from the RF filter side to the outside while grounding the radiating device (GND).

[0013] The technical problem of this invention is not limited to the technical problem mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0014] Solution to the problem

[0015] In one embodiment of the antenna radio frequency (RF) module according to the present invention, an antenna RF module is provided, the antenna RF module including an analog RF component, the analog RF component including: an RF filter; a radiating device module disposed on one side of the RF filter; and an amplifying substrate disposed on the other side of the RF filter and on which an analog amplifying device is mounted, the antenna RF module being disposed in a manner exposed to a frontal air, the frontal air being defined as the front of the front surface of the antenna housing, a reflector being disposed between the RF filter and the radiating device module, the reflector being used to ground the radiating device module (GND) and mediate the heat generated by the RF filter to dissipate to the frontal air.

[0016] The heat generated from the analog amplifier device can be dissipated through one of the sidewalls of the radio frequency (RF) filter adjacent to the amplification substrate, and then mediated by the reflector.

[0017] Furthermore, the reflector can be made of metal and can be formed into a mesh including multiple heat dissipation holes.

[0018] Furthermore, the size of the heat dissipation holes can be designed taking into account the durability and heat dissipation characteristics of the reflector.

[0019] Furthermore, the size of the heat dissipation hole can be designed with the wavelength of the operating frequency in mind to maintain the grounding (GND) function of the radio frequency (RF) filter.

[0020] Furthermore, the size of the heat dissipation hole can be set to a size in the range of 1 / 10λ to 1 / 20λ with the operating frequency.

[0021] Furthermore, the radio frequency (RF) filter may include a filter body that is combined with the front surface of the radiating device module, the front surface of which may be combined with the rear surface of the reflector in a surface thermal contact manner.

[0022] Furthermore, the front end of the filter body can protrude further forward than the front end of the antenna housing on which the motherboard is located.

[0023] Furthermore, the reflector may be formed to cover the entire front surface of the filter body, and may be formed to cover the side portion of the filter body.

[0024] Furthermore, the antenna housing may include: a rear housing forming an internal space where the motherboard is disposed; and a front housing configured to cover the front of the rear housing and separate the internal space from the front exterior. The reflector may have a frame bending plate formed therein, the frame portions of the frame bending plate bending rearward to surround and protect the sides of the radio frequency (RF) module.

[0025] Furthermore, in the curved frame plate, multiple bolt fixing slots can be spaced apart at multiple locations along the edge of the curved frame plate, and in the front housing, multiple bolt through holes can be formed along the edge. The reflector can be attached to the front of the front housing by fastening multiple assembly bolts in the multiple bolt fixing slots and bolt through holes.

[0026] Furthermore, the antenna mounting portion in the reflector, which is installed in a manner that makes surface thermal contact with the front surface of the filter body and with the back surface of the radiating device module, may be planar.

[0027] An antenna radio frequency (RF) module assembly according to an embodiment of the present invention includes an antenna RF module, the antenna RF module including analog RF components, the analog RF components including: a plurality of RF filters; a plurality of radiating device modules disposed on one side of each of the plurality of RF filters; and a plurality of amplification substrates disposed on the other side of each of the plurality of RF filters and on which analog amplification devices are mounted, the antenna RF module being disposed in a manner exposed to a frontal air, the frontal air being defined as the front of the front surface of the antenna housing, a reflector being disposed between the RF filters and the radiating device modules, the reflector being used to ground the radiating device modules and mediate heat dissipation from the RF filters to the frontal air.

[0028] An antenna device according to an embodiment of the present invention includes: a motherboard, on which at least one digital device is mounted on a front or rear surface; a housing-shaped antenna housing with a front opening for mounting the motherboard; and a radio frequency (RF) module assembly connected to the motherboard via an electrical signal line, the RF module assembly including an antenna RF module, the antenna RF module including an analog RF component, the analog RF component including: a plurality of RF filters; a plurality of radiating device modules disposed on one side of each of the plurality of RF filters; and a plurality of amplification substrates disposed on the other side of each of the RF filters and on which analog amplification devices are mounted, the antenna RF module being disposed in a manner exposed to a frontal air, the frontal air being defined as the front of the front surface of the antenna housing, a reflector disposed between the RF filters and the radiating device modules, the reflector being used to ground the radiating device modules and mediate heat dissipation from the RF filters to the frontal air.

[0029] The effects of the invention

[0030] According to one embodiment of the antenna radio frequency (RF) module, radio frequency (RF) module assembly, and antenna device including the component, various effects as described below can be achieved.

[0031] First, by spatially separating the heat generated by the heat-generating components of the antenna device, heat can be dispersed to the front and rear of the antenna device, thereby greatly improving heat dissipation performance.

[0032] Secondly, it eliminates the need for an antenna cover that obstructs heat dissipation to the front of the antenna, thus significantly reducing product manufacturing costs.

[0033] Third, the radio frequency (RF) related amplifier devices and radio frequency (RF) filters that were previously installed on the conventional motherboard side are combined into an RF module and placed outside the antenna housing, thereby greatly improving the overall heat dissipation performance of the antenna device.

[0034] Fourth, separating the radio frequency (RF) related amplifier devices from the motherboard greatly reduces the number of layers in the motherboard as a multi-layer board, thus reducing the manufacturing cost of the motherboard.

[0035] Fifth, frequency-dependent radio frequency (RF) components are configured as RF modules and can be detached and mounted onto the antenna housing. Therefore, when individual RF components that make up the antenna device malfunction or break, only the corresponding RF module for the antenna needs to be replaced, which facilitates the maintenance and repair of the antenna device.

[0036] Sixth, since the antenna device can achieve distributed heat dissipation, the length and volume of the heat sink integrally formed on the rear surface of the antenna housing can be reduced, thus achieving the effect of overall product thinning design.

[0037] Seventh, it can dissipate heat through a radiation guide that performs the electromagnetic wave radiation function in the radiation device module, thus maximizing the heat dissipation area of ​​the front surface of the antenna device.

[0038] The effects of this invention are not limited to those mentioned above, and those skilled in the art can clearly understand other unmentioned effects from the scope of protection of the invention claims. Attached Figure Description

[0039] Figure 1 This is an exploded perspective view showing an example of an antenna device according to the prior art.

[0040] Figure 2 This is a perspective view of the front and rear portions of an antenna device according to an embodiment of the present invention.

[0041] Figure 3a and Figure 3b yes Figure 2 The front and rear partial solution diagrams of the solid.

[0042] Figure 4 It is along Figure 2 The cross-sectional view obtained by the AA line and its enlarged portion.

[0043] Figure 5 It is along Figure 2 Partial cross-sectional stereoscopic view and its enlarged view obtained by the BB line.

[0044] Figure 6 It is shown Figure 2 A three-dimensional diagram of the reflector in the structure.

[0045] Figure 7 It shows relative to Figure 2 A three-dimensional diagram showing the shape of the motherboard set in the rear casing of the structure.

[0046] Figure 8 It shows relative to Figure 2An exploded perspective view of the motherboard's configuration, showing the radio frequency (RF) module.

[0047] Figure 9 It is shown Figure 8 A 3D view of the filter body separating from the rear casing during the setup process.

[0048] Figure 10 It is shown Figure 8 A 3D view of the radio frequency (RF) module in the structure.

[0049] Figure 11 It is along Figure 10 The cross-sectional view obtained by the CC line is a projected cross-sectional three-dimensional view of the internal morphology.

[0050] Figure 12a and Figure 12b It is shown Figure 10 An exploded 3D view of the radio frequency (RF) module.

[0051] Figure 13 yes Figure 10 A detailed diagram of the amplification section substrate in the configuration of a radio frequency (RF) module.

[0052] Figure 14 This is a cross-sectional perspective view showing the assembly configuration of the magnification section substrate relative to the main board.

[0053] Figure 15 This is an exploded perspective view showing the assembly configuration of the radio frequency (RF) module relative to the motherboard in the structure shown in Figure 3.

[0054] Figure 16 This is an exploded perspective view showing the assembly configuration of the radiating device module relative to the reflector in the configuration of Figure 3.

[0055] Explanation of reference numerals in the attached figures

[0056] 100: Antenna assembly; 105: Antenna housing

[0057] 110: Rear exterior 110S: Internal space

[0058] 111: Rear heatsink 120: Motherboard

[0059] 125: External connector; 128a: First heating element

[0060] 128b: Second heating element; 130: Front housing

[0061] 140: Radio Frequency (RF) Filter 141: Filter Body

[0062] 142a: Bolt through hole; 143: Partition plate

[0063] 146: Enlargement section substrate 146': Internal insertion section

[0064] 146a-1, 146a-2: Power amplifier (PA) devices

[0065] 146c: Low Noise Amplifier (LNA) Device

[0066] 147: Fixed boss 148: Heat dissipation panel

[0067] 149a: Bolt fixing hole; 149b: Bolt through hole

[0068] 150: Reflector; 151: Antenna mounting section

[0069] 155: Multiple heat dissipation holes; 157: Boss through-hole

[0070] 160: Radiation device module 161: Radiation device module cover

[0071] 162: Printed Circuit Board; 163a: Patch Antenna Circuit Section

[0072] 163b: Feeder cable; 165: Radiation guide

[0073] 166: Reinforcing rib; 167: Guide fixing part

[0074] 168: Guide fixing protrusion; 200: Radio frequency (RF) module

[0075] 500: External mounting components Detailed Implementation

[0076] Hereinafter, with reference to the accompanying drawings, a radio frequency (RF) module for an antenna, an RF module assembly, and an antenna device including the component are described in detail according to an embodiment of the present invention.

[0077] When adding reference numerals to components in each of the accompanying drawings, it is important to note that the same components should be labeled with the same symbol whenever possible, even if they are labeled in different drawings. Furthermore, in describing embodiments of the invention, detailed descriptions of well-known structures or functions are omitted if it is believed that such detailed descriptions would hinder understanding of the embodiments of the invention.

[0078] When describing the components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used to distinguish one component from another, and the nature, order, or sequence of the corresponding components are not limited by the terminology. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Commonly used terms, such as those defined in dictionaries, should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and are not to be interpreted as having an ideal or exaggerated form of meaning unless expressly defined herein.

[0079] The key concept of this invention is to eliminate the need for a radome in conventional antenna devices. Instead, the radio frequency (RF) related amplifiers and RF filters, traditionally mounted inside the antenna housing, are integrated into an RF module. This spatially separates the heat generated by the various heat-generating components of the antenna device. The following description, based on an embodiment shown in the accompanying drawings, will illustrate an antenna RF module, an RF module assembly, and an antenna device including this assembly.

[0080] Figure 2 These are perspective views (a) of the front portion and (b) of the rear portion of an antenna device according to an embodiment of the present invention. Figure 3a and Figure 3b yes Figure 2 The front and rear parts of the solid-state diagram. Figure 4 It is along Figure 2 The cross-sectional view obtained by the AA line and its enlarged portion. Figure 5 It is along Figure 2 Partial cross-sectional stereoscopic view and its enlarged view obtained by the BB line. Figure 6 It is shown Figure 2 A three-dimensional diagram of the reflector in the structure.

[0081] like Figures 2 to 5 As shown, an antenna device 100 according to an embodiment of the present invention includes an antenna housing 105 that forms the appearance of the antenna device. The antenna housing 105 includes a rear housing 110 that forms the appearance of the rear side of the antenna device 100 and a front housing 130 that forms the appearance of the front side of the antenna device 100.

[0082] In addition, according to an embodiment of the present invention, the antenna device 100 further includes a main board 120 disposed in close proximity to the internal space 110S of the antenna housing 105 and an antenna radio frequency (RF) module 200 (hereinafter referred to as "RF module") stacked on the front surface of the front housing 130.

[0083] The antenna housing 105, combined with the RF module 200, forms the overall appearance of the antenna device 100. Although not shown, it can facilitate connection with a support pole prepared for mounting the antenna device 100. However, as long as there is no limitation on the installation space of the antenna device 100, the antenna housing 105 does not necessarily need to be combined with the support pole; it can also be directly mounted and fixed to vertical structures such as the interior or exterior walls of a building. In particular, for the antenna device 100 according to one embodiment of the present invention, designing it as thin as possible to minimize its front and rear thickness is of great significance in facilitating wall-mounting installation. This will be described in further detail below.

[0084] The antenna housing 105 is made of a metal material with excellent thermal conductivity to facilitate heat dissipation through heat conduction as a whole, and is in the shape of a relatively thin cuboid housing with a generally front-to-back orientation. The front surface of the rear housing 110 is open, thus having a predetermined internal space 110S. Although not shown, it facilitates the arrangement of a motherboard 120 in which digital devices (e.g., Field Programmable Gate Array (FPGA) devices and / or Power Supply Unit (PSU) devices) are mounted.

[0085] On the other hand, although not shown, the inner surface of the rear housing 110 can be shaped to conform to the protruding shape of digital devices (FPGA devices, etc.) and / or power supply unit (PSU) devices mounted on the rear surface of the motherboard 120. This is to maximize heat dissipation performance by increasing the thermal contact area with the back of the motherboard 120.

[0086] Although not shown in the figure, handles that can be gripped may also be provided on the left and right sides of the antenna housing 105 so that operators can transport the antenna device 100 of one embodiment of the present invention in the actual field or facilitate manual installation on a support pole (not shown) or the inner or outer wall of a building.

[0087] Additionally, various external mounting components 500 for cable connection with a base station device (not shown) and adjustment of internal components can be assembled through the lower outer side of the antenna housing 105. The external mounting components 500 are provided in the form of at least one optical fiber connection terminal (plug), and each connection terminal can be interconnected with the connection terminal of a coaxial cable (not shown).

[0088] Reference Figure 2Multiple rear heat sinks 111 with a predetermined pattern shape can be integrally formed on the back of the rear housing 110. Heat generated from the motherboard 120 disposed in the internal space 110S of the rear housing 110 can be directly dissipated to the rear through the multiple rear heat sinks 111.

[0089] Multiple rear heat sinks 111 are designed as follows: based on the middle part of the left and right width, they tilt upwards as they move towards the left and right ends (see reference). Figure 2 (b) The heat dissipated to the rear of the rear outer casing 110 forms rising airflows that disperse to the left and right sides of the rear outer casing 110, so as to disperse the heat more quickly.

[0090] However, the shape of the rear heat sink 111 is not necessarily limited to this. Although not shown, it can be assumed that the following arrangement is adopted: when a fan module (not shown) is provided on the rear side of the rear housing 110, the rear heat sink 111 can be parallel to the left and right ends of the fan module located in the middle, so as to release the heat dissipated by the fan module more quickly.

[0091] Furthermore, although not shown, a mounting portion (not shown) may be integrally formed within a portion of the plurality of rear heat sinks 111, incorporating a clamping device (not shown) for attaching the antenna device 1 to the support rod (not shown). The clamping device may be configured to rotate the antenna device 100, located at its front end according to one embodiment of the present invention, in a left-right direction or tilt it in an up-down direction to adjust the directivity of the antenna device 100.

[0092] However, the mounting section does not necessarily have to incorporate clamping devices for tilting and rotating the antenna device 100. For example, when the antenna device 100 is mounted on the interior or exterior wall of a building, the mounting section can incorporate a padlock-shaped clamp panel that is easy to mount on a wall.

[0093] Hereinafter, with reference to the accompanying drawings, the RF module 200 for antenna according to the present invention will be described in further detail.

[0094] RF module 200 may include a radio frequency (RF) filter 140, a radiating device module 160, and an amplification substrate 146. Additionally, RF module 200 may include a reflector 150 for grounding (GND) of the radiating device module 160. However, reflector 150 not only serves as grounding for the radiating device module 160 but also protects the RF filter 140, located within the antenna housing 105 and exposed to external airflow (described later), from external influences. External airflow is defined as the area in front of the front surface of the front housing 130.

[0095] like Figures 2 to 5 As shown, the RF module 200 configured as described above can be stacked on the front surface of the motherboard 120 via the front housing 130 in the antenna housing 105.

[0096] In an antenna device 100 according to an embodiment of the present invention, a plurality of radio frequency (RF) filters 140 are composed of an antenna RF module assembly.

[0097] Among them, such as Figure 2 As shown in Figure 3, there are eight radio frequency (RF) filters 140 arranged adjacent to each other in the left and right directions, and four columns of the multiple RF filters 140 arranged in the up and down directions as described above. However, this is not necessarily the case; the arrangement and number of RF filters 140 can be varied to create various designs.

[0098] Furthermore, in one embodiment of the present invention, a predetermined space is formed on one side of the radio frequency (RF) filter 140, wherein a cavity filter comprising a resonator made of a dielectric resonator (DR) or a metal resonator rod is provided in the space. However, the RF filter 140 is not limited thereto, and various filters such as dielectric filters may be used.

[0099] Furthermore, the plurality of radiating device modules 160 correspond to the number of each of the plurality of radio frequency (RF) filters 140, and each of the radiating device modules 160 implements 2T2R. Therefore, the antenna device 100 according to one embodiment of the present invention illustrates a model that implements a total of 64T64R, but is not limited thereto.

[0100] On the other hand, as described above, the RF module 200 may also include a reflector 150 configured to cover a plurality of radio frequency (RF) filters 140 and to ground a plurality of radiating device modules 160. Preferably, the reflector 150 is made of a metallic material.

[0101] The reflector 150 may also function as the reflective layer of the radiating device module 160. Therefore, the reflector 150 can reflect the radio frequency (RF) signal output from the radiating device module 160 in a direction corresponding to the orientation, thereby concentrating the radio frequency (RF) signal.

[0102] In addition, the reflector 150 is a unique feature of the RF module 200 according to an embodiment of the present invention, and can perform the function of dissipating heat from the outside air generated by the system heat from the antenna device.

[0103] Therefore, such as Figure 6As shown, the reflector 150 can be formed as a mesh with multiple heat dissipation holes 155. The structure of the multiple heat dissipation holes 155 allows the inside and outside of the reflector 150 to be connected, and can also serve as heat dissipation holes to release heat generated by the radio frequency (RF) filter 140 located in the space behind the reflector 150 to the outside of the reflector 150. Therefore, external air can be actively used in the heat dissipation of the antenna device 100.

[0104] On the other hand, the size of the heat dissipation hole 155 can be appropriately designed by simulating the durability and heat dissipation characteristics of the reflector 150. In particular, in order to maintain a smooth grounding (GND) function, the size of the heat dissipation hole 155 can be designed with the wavelength of the operating frequency in mind. For example, the size of the heat dissipation hole 155 can be set to a size in the range of 1 / 10λ to 1 / 20λ of the operating frequency.

[0105] The interval 1 / 10λ has the meaning of the upper limit threshold for the full grounding (GN D) function of the radiation device module 160, and the interval 1 / 20λ has the meaning of the lower limit threshold for ensuring minimum external air flow through the heat dissipation hole 155 of the reflector 150.

[0106] Therefore, preferably, the size of the heat dissipation hole 155 is formed in the range of 1 / 20λ greater than the operating frequency and less than 1 / 10λ less than the operating frequency.

[0107] In particular, regarding the grounding (GND) function, the reflector 150 is provided in an odd number between the multiple radio frequency (RF) filters 140 and the multiple heat dissipation device modules 160, and can be defined as a configuration that performs the common ground function.

[0108] More specifically, such as Figure 6 As shown, the reflector 150 can be formed as a four-cornered metal plate stacked on the front end of a plurality of radio frequency (RF) filters 140. On the front surface of the reflector 150, an antenna mounting portion 151 for placing each heat dissipation device module 160 (described later) can be formed in a planar shape at a position corresponding to the RF filter 140. Because the antenna mounting portion 151 is formed in a planar shape, in the configuration of the rear RF filter 140, the front surface of the filter body 141 has surface thermal contact, and the back surface of the front RF device module 160 has surface thermal contact, thereby improving heat dissipation performance through heat conduction.

[0109] And, as Figure 6As shown, a bezel-shaped curved plate 154 is formed in the reflector 150 in such a way that the bezel portion bends rearward to surround and protect the sides of a plurality of radio frequency (RF) filters 140 that are coupled to the front surface of the front housing 130. A plurality of bolt fixing slots 153 are spaced apart at a plurality of locations along the edge of the bezel-shaped curved plate 154, and a plurality of bolt through holes 133 formed along the plurality of bolt fixing slots 153 and the edge of the front housing 130 can be fastened to the front of the front housing 130 by a plurality of assembly bolts (not marked in the figures).

[0110] like Figures 2 to 5 As shown, the antenna RF module 200 is detachably integrated into the antenna housing 105. The antenna RF module 200 can be physically secured to the front housing 130 via bolts (or screws), and the amplification board 146 constituting the antenna RF module 200 can be detached and mounted to the main board 120 via a pin-type connection. Specifically, the amplification board 146 has the features described later. Figure 12a The motherboard 120 may have an external socket 125 on its front surface that is connected to the internal socket 146' of the amplifier substrate 146 by a socket pin. The specific structure and function of the amplifier substrate 146 will be described in further detail below.

[0111] like Figure 3a and Figure 3b As shown, the front housing 130 serves to separate the motherboard 120 disposed in the internal space 110S of the antenna housing 105 from the RF module 200 stacked on its front surface. Furthermore, the front housing 130 is configured to distinguish the internal space 110S on the antenna housing 105 side from other spaces, thereby enabling thermal blocking and separation functions to prevent heat generated from the internal space 110S on the antenna housing 105 side from affecting the radio frequency (RF) filter 140 side.

[0112] Preferably, "thermal blocking" means blocking the intrusion of heat generated by the RF module 200 located in the front air (or front space) into the rear space of the front housing 130 (i.e., the internal space 110S of the rear housing 110), where the front air is defined as the front of the front surface of the front housing 130. Preferably, "thermal separation" means separating a portion of the multiple heat-generating devices that are centrally and dispersedly installed in the front and back surfaces of the motherboard 120 to separate the thermal structure, so that both rear and front heat dissipation can be carried out, where the motherboard 120 is initially stacked in the internal space 110S of the rear housing 110.

[0113] Furthermore, given the existence of numerous manufacturers of antenna devices and components or equipment included in such devices in the current market, from the perspective of a manufacturer that only manufactures RF modules 200, it has the advantage of establishing a new market environment by pre-assembling multiple RF modules 200 in the front housing 130 or by distributing and selling them in units of modules that can be temporarily assembled.

[0114] In the front housing 130, a plurality of bolt through holes 133 for bolt fixing of the reflector 150 can be formed at multiple locations along the edge. Furthermore, in the front housing 130, the inner socket portions 146' formed on the amplification substrate 146 of the radio frequency (RF) filter 140 are respectively through to form through slits 135 for pin-connection with the outer socket portion 125 of the main board 120.

[0115] Between the rear surface frame portion of the front housing 130 and the front surface frame portion of the rear housing 110, the heat dissipation holes 155 of the reflector 150 described above are exposed to the outside. Therefore, when the antenna device 100 according to an embodiment of the present invention is installed outside the building (i.e., outdoors), rainwater may seep in during rainy weather. To prevent the inflow of rainwater, a waterproof gasket (not shown) can be inserted. Furthermore, anti-foreign-entry rings (not shown) can be inserted into the front and rear surfaces of the plurality of through slits 135 penetrating the front housing 130, respectively. These anti-foreign-entry rings protect the inner insertion portion 146' of the magnification substrate 146 penetrating the slit from external influences and prevent rainwater and other foreign objects from flowing into the internal space 110S side of the rear housing 110 through the slits.

[0116] As described above, the antenna device 100 according to an embodiment of the present invention employs a simple pin-connection method when constructing the predetermined electrical signal line between the motherboard 120 and the radio frequency (RF) filter 140. Therefore, it eliminates the need for the additional coaxial connector (DCC) conventionally used for electrical connection between the radio frequency (RF) filter 140 and the motherboard 120, thus providing the advantage of significantly reducing product manufacturing costs.

[0117] However, the use of a pin-connection method for the radio frequency (RF) filter 140 here can be understood as creating an effective electrical connection. In terms of physical bonding, to prevent arbitrary movement of the RF filter 140, multiple bolt fastening methods could also be added. For example, as described later... Figure 12a and Figure 12bAs shown, in the configuration of the radio frequency (RF) filter 140, a more stable fixing effect can be created by using the bolt fastening method of fixing bolts 142 to the front housing 130 through the multiple bolt through holes 142a formed on the rear end edge of the filter body 141.

[0118] Figure 7 It shows relative to Figure 2 An exploded 3D view showing the shape of the motherboard located in the rear casing of the device. Figure 8 It shows relative to Figure 2 An exploded perspective view of the RF module assembly configuration of the motherboard. Figure 9 It is shown Figure 8 A 3D view showing the filter body separating from the rear casing during the setup process. Figure 10 It is shown Figure 8 A 3D diagram of the RF module in the structure. Figure 11 It is along Figure 10 The cross-sectional view obtained from the CC line is a projected sectional three-dimensional view of the internal morphology. Figure 12a and Figure 12b It is shown Figure 10 Exploded 3D view of the RF module. Figure 13 yes Figure 10 A detailed diagram of the amplification section substrate in the RF module. Figure 14 This is a cross-sectional perspective view showing the assembly configuration of the magnification section substrate relative to the motherboard. Figure 15 This is an exploded perspective view showing the assembly configuration of the RF module relative to the motherboard in Figure 3. Figure 16 This is an exploded perspective view showing the assembly configuration of the radiating device module relative to the reflector in the configuration of Figure 3.

[0119] In one embodiment of the antenna RF module 200 according to the present invention, it may include: a radio frequency (RF) filter 140; a radiating device module 160 disposed on one side of the RF filter 140; and an amplification substrate 146 disposed on the other side of the RF filter 140, on which an analog amplification device is mounted.

[0120] The radio frequency (RF) filter 140 may have at least four outer faces. That is, the RF filter 140 is configured as a tetrahedron when it has four outer faces, a pentahedron when it has five outer faces, and a hexahedron when it has six outer faces. Therefore, when the terms "one side" and "the other side" of the RF filter 140 are used below, "one side" and "the other side" mean any one of the at least four outer faces and all other faces except that one, and do not refer to physically opposite faces, but should be understood as any one face and one of the other faces except that one.

[0121] Therefore, as Figures 2 to 5 As shown, another embodiment of the antenna RF module 200 according to the present invention can be defined as an embodiment in which heat generated from the radio frequency (RF) filter 140 and heat generated from the analog amplifier device are dissipated in different directions.

[0122] Furthermore, from the viewpoint that the antenna RF module 200 of the present invention is configured such that the amplification substrate 146 is disposed inside the radio frequency (RF) filter 140, it can of course be further defined as an embodiment in which the basic shape of the RF module 200 can be composed of the radio frequency (RF) filter 140 and the radiating device module 160 disposed at its front end.

[0123] Furthermore, the RF module 200 is an assembly of analog radio frequency (RF) components. For example, the amplification substrate 146 is an RF component on which an analog amplification device for amplifying RF signals is mounted, the RF filter 140 is an RF component for filtering the frequency of the input RF signal to the desired frequency band, and the radiating device module 160 is an RF component that has the function of receiving and transmitting RF signals.

[0124] Therefore, the RF module 200 for antenna according to the present invention can also be defined in another embodiment as described below.

[0125] The antenna RF module 200 according to the present invention includes an analog radio frequency (RF) component, which includes: an RF filter 140 having at least four outer surfaces; a radiating device module 160 disposed on any one of the outer surfaces of the RF filter 140; and analog amplifier devices 146a-1, 146a-2, and 146c on an amplification substrate 146 disposed on the other outer surface of the RF filter 140.

[0126] The amplification substrate 146 can be electrically connected to the main board 120 inside the antenna housings 110 and 130. More specifically, as described below, the amplification substrate 146 can be electrically connected to the main board 120 via a pin connector.

[0127] Furthermore, another embodiment of the antenna RF module 200 according to the present invention can be defined as follows: including: a radio frequency (RF) filter 140; a radiating device module 160 disposed on the front surface of the RF filter 140; and a reflector 150 disposed between the RF filter 140 and the radiating device module 160, so that the radiating device module 160 is grounded (GND) and mediates the heat generated from the RF filter 140 to be dissipated to the outside.

[0128] In further detail, in another embodiment of the antenna RF module 200 according to the present invention, it may include: a radio frequency (RF) filter 140, stacked relative to the front surface of a motherboard 120 disposed in the internal space 110S of the antenna housings 110, 130; a radiating device module 160, stacked on the front surface of the RF filter 140; and a reflector 150, configured to cover the RF filter 140, serving as the ground (GND) of the radiating device module 160, and mediating heat dissipation from the RF filter 140 side to the outside. As described above, the reflector 150 may also further function as a reflective layer capable of concentrating the radiated signal.

[0129] In particular, when the radio frequency (RF) filter 140 has at least four outer surfaces, the radiating device module 160 is stacked on any one surface (front surface) of the RF filter 140, and the amplification substrate 146 is disposed on the other side of the outer surface of the RF filter 140. The heat generated by at least one amplification substrate 146 on which an analog amplification device is mounted can be dissipated through one of the side walls of the RF filter 140 adjacent to the amplification substrate 146, and then finally dissipated to the outside through the reflector 150.

[0130] On the other hand, in another embodiment of the antenna RF module 200 according to the present invention, it can be detachably connected to the antenna housing 105. That is, the antenna RF module 200 according to the present invention can be defined as another embodiment including: a radio frequency (RF) filter 140; a radiating device module 160 disposed on the front surface of the RF filter 140; and a reflector 150 disposed between the RF filter 140 and the radiating device module 160, wherein the antenna RF module 200 is detachably connected to the antenna housing 105. Specifically, the object of detaching and assembling the antenna RF module 200 is the main board 120 disposed in the internal space 110S of the rear housing 110 in the configuration of the antenna housing 105, and it can be detachably combined with the front housing 130 as a medium.

[0131] Accordingly, the frequency-dependent radio frequency (RF) components are configured as RF modules, and these modules are installed and removed from the antenna housing 105. Therefore, when the radio frequency (RF) components constituting the antenna device 100 malfunction or are damaged, only the corresponding antenna RF module 200 is replaced, thus providing the advantage of facilitating the maintenance and repair of the antenna device 100.

[0132] Furthermore, the reflector 150 is configured to cover the radio frequency (RF) filter 140, and can be configured to cover the entire RF filter 140 protruding and exposed to the front outer side of the front housing 130, with reference to the internal space 110S of the antenna housing 105. As described above, the reflector 150 is used to protect the RF filter 140, which is exposed to the front air (or front space) defined as the front surface of the front housing 130, from the influence of the external environment, and as described above, the numerous heat dissipation holes 155 facilitate smooth airflow to the inside and outside, thereby achieving further improved front heat dissipation performance.

[0133] On the other hand, the RF module 200 implemented in the various embodiments described above has multiple components, thereby constituting the antenna RF module assembly 300 described later.

[0134] like Figure 12a and Figure 12b As shown, the plurality of radio frequency (RF) filters 140 may include: a filter body 141, with a central partition 143 as a reference, forming predetermined spaces C1 and C2 on one side and the other side in the width direction respectively; a plurality of resonators (DR, not shown), any one of the predetermined spaces C1 and C2 (refer to...). Figure 12a The magnifying portion substrate 146 is disposed in one of the multiple cavities (not shown) in the predetermined spaces C1 and C2 (see reference numeral "C1"); the magnifying portion substrate 146 is disposed in another of the predetermined spaces C1 and C2 (see reference numeral "C1"). Figure 12b The filter body 141 (marked with reference numeral "C2") is electrically connected to the external connector 125 of the motherboard 120. The filter body 141 is made of metal and manufactured using a die-casting process.

[0135] Multiple radio frequency (RF) filters 140 can be used as cavity filters to filter the frequency band of the output signal relative to the input signal by using frequency modulation of multiple resonators (DRs) disposed on the "C1" side in a predetermined space. However, the RF filters 140 are not necessarily limited to cavity filters, and as mentioned above, ceramic waveguide filters are not excluded.

[0136] The thinness of the radio frequency (RF) filter 140 in the front-to-back direction is beneficial for the overall thinner design of the product. In terms of the aforementioned thinner design, compared to cavity filters with limited front-to-back thickness reduction, the RF filter 140 can be considered a ceramic waveguide filter, which is more conducive to miniaturization. However, to meet the high functional performance requirements of base station antennas in the 5G frequency environment, the accompanying antenna heat dissipation problem must be solved. To effectively release the heat generated inside the antenna, the RF filter 140 can be used as a heat transfer medium to transfer the heat generated by the RF filter 140 to the front of the antenna housing 105. From this perspective, a cavity filter is preferable.

[0137] In particular, in an antenna device 100 according to an embodiment of the present invention, a plurality of radio frequency (RF) filters 140 are detached from the limited internal space 110S of the antenna housing 105 in the form of RF modules 200 and directly exposed to the outside air. From this point of view, heat dissipation can be achieved through the periphery except for the mounting surface of the RF filters 140, therefore, cavity filters are more preferably used. Hereinafter, the use of cavity filters in an antenna device 100 according to an embodiment of the present invention will be described as an example of RF filters 140.

[0138] like Figures 10 to 12b As shown, in an embodiment of the present invention, the antenna device 100 separates the radio frequency (RF) devices, namely the RF IC devices (not shown), power amplifier (PA) devices 146a-1, 146a-2 and low noise amplifier (LNA) devices 146c, which were conventionally mounted on the front or rear surface of the motherboard 120, and mounts them on the amplification substrate 146 of the RF filter 140. This exposes the entire RF filter 140 to the outside air, thereby providing the advantage of significantly improved heat dissipation performance.

[0139] In other words, the radome, traditionally located at the front of the antenna housing, not only obstructs heat dissipation to the front but also causes heat concentration inside the antenna housing by mounting high-heat-generating digital devices or power supply units (PSUs) together with radio frequency (RF) devices (RFICs, power amplifiers (PAs), and low-noise amplifiers (LNAs)) on the motherboard. Furthermore, this concentrated heat needs to be dissipated to the rear of the antenna housing, resulting in significantly reduced heat dissipation efficiency.

[0140] However, as Figure 13As shown, for an antenna device 100 according to an embodiment of the present invention, a plurality of RF modules 200 are separately disposed in front of the antenna housing 105, which is independent of the internal space 110S of the antenna housing 105 and directly exposed to the outside air. An amplification substrate 146 is added to a portion of the sidewall of the radio frequency (RF) filter 140, and radio frequency (RF) devices 146a-1, 146a-2, and 146c, which are conventionally mounted on the motherboard, are distributed to achieve heat dissipation and to dissipate the dispersed heat to the outside more quickly.

[0141] The radio frequency (RF) device can be an analog amplifier device, as described above, including power amplifier (PA) devices 146a-1 and 146a-2, low noise amplifier (LNA) device 146c, etc.

[0142] More specifically, in the amplification substrate 146, a pair of power amplifier (PA) devices 146a-1 and 146a-2, one of the analog amplifier devices, are mounted on either side, and a low noise amplifier (LNA) device, one of the analog amplifier devices, can be mounted on it, and circulators 146d-1 and 146d-2 for decoupling the two are connected in a circuit.

[0143] However, it is not necessary to mount the aforementioned analog amplifier device on either side of the amplification substrate 146. According to the embodiment, it is also natural to mount it on both sides of the amplification substrate 146.

[0144] Furthermore, the amplification substrate 146 is separately mounted on the radio frequency (RF) filter 140 side, thereby reducing the number of layers in the motherboard 120 which is made of multiple layers, thus providing the advantage of reducing the manufacturing cost of the motherboard 120.

[0145] The amplification substrate 146 can be installed inside the other C2 of the predetermined spaces C1 and C2, and at least the end of the inner socket portion 146' protrudes and is exposed to the rear surface side of the filter body 141.

[0146] On the other hand, such as Figures 10 to 12b As shown, the plurality of radio frequency (RF) filters 140 may further include a filter heat dissipation panel 148, which can dissipate the heat generated by the amplification substrate 146 from the predetermined space C2 to the outside of the filter body 141.

[0147] Multiple bolt fixing holes 149a are formed around the predetermined space C2 of the filter body 141, and multiple bolt through holes 149b are formed on the edge portion of the filter heat dissipation panel 148. Multiple fixing bolts 149 pass through the multiple bolt through holes 149b on the outside of the filter body 141, and the filter heat dissipation panel 148 can be fixed in the filter body 141 by tightening it into the multiple bolt fixing holes 149a.

[0148] The outer side of the amplification substrate 146 disposed inside the predetermined space C2 of the filter body 141 makes surface thermal contact with the inner side of the filter heat dissipation panel 148. The heat generated by the amplification substrate 146 is conducted through the filter heat dissipation panel 148 and can be released to the outside through the filter heat dissipation fin 148a integrally formed on its exterior.

[0149] On the other hand, although not shown, the antenna radio frequency (RF) filter 140 according to the present invention may also include a heat transfer medium disposed between the filter heat dissipation panel 148 and the amplification substrate 146 to collect the heat generated by the amplification substrate 146 and transfer it to the filter heat dissipation panel 148.

[0150] The heat transfer medium can be formed from either a vapor chamber or a heat pipe, which is configured to transfer heat through the phase change of a refrigerant flowing within a closed interior. When the distance between the amplification substrate 146, which serves as the heat source, and the filter heat dissipation panel 148 is relatively small, a vapor chamber is preferred; conversely, when the distance between the amplification substrate 146, which serves as the heat source, and the filter heat dissipation panel 148 is relatively large, a heat pipe is preferred.

[0151] like Figures 10 to 12b and Figure 14 As shown, in the plurality of radio frequency (RF) filters 140, the inner socket portion 146' formed in the amplification section substrate 146 is detachably connected to the outer socket portion 125 provided on the front surface of the main board 120, and is further stably fixed by bolting with fixing bolts 142 through the plurality of bolt through holes 142a formed on the rear end edge of the filter body 141. Figure 14 As shown, in the inner socket portion 146' formed on the amplification portion substrate 146, a through slit 135 formed in the front surface of the front housing 130 corresponding to the external space is connected to the outer socket portion 125 by a pin. From this point, a ring (not shown) to prevent foreign matter from entering can be inserted between the filter body 141 and the front housing 130. These have been explained.

[0152] On the other hand, such as Figures 10 to 12bAs shown, at least one fixing boss 147 for bolt fixing of the plurality of radiating device modules 160 described later may be provided on the front surface of the filter body 141. The at least one fixing boss 147 is exposed on the front surface of the antenna mounting portion 151 of the reflector 150 through a boss through hole 157 formed in the reflector 150, and is the location for fastening the device fixing bolts 180 for fixing the plurality of radiating device modules 160.

[0153] At least one fixed boss 147 may be made of a thermally conductive metallic material. Therefore, as described above, since the filter body 141 and the fixed boss 147 are made of a thermally conductive metallic material, even in a limited manner, the heat generated from the filter body 141 can be easily dissipated to the front of the radome. Furthermore, the radiation guide 165 in the radiation device module 160, described later, is also made of a thermally conductive metallic material, which can further improve the front heat dissipation performance by increasing the front heat dissipation area. This will be described in more detail later.

[0154] like Figures 2 to 5 As shown, to achieve beamforming, an array antenna requires multiple radiating device modules 160, which can generate narrow directional beams, increasing concentrated propagation in a specified direction. Recently, among the multiple radiating device modules 160, dipole antennas or patch antennas have been most frequently used, and they are designed to be spaced apart to minimize mutual signal interference. Previously, to prevent changes in the arrangement of these multiple radiating device modules 160 due to external environmental factors, a radome was typically used to protect the modules from external influences. Therefore, only the area covered by the radome is exposed to the outside air, and the heat dissipation from the antenna device 100 is very limited.

[0155] like Figures 10 to 12bAs shown, the radiating device module 160 of the antenna device 100 according to an embodiment of the present invention may include: a radiating device module cover 161, which is formed vertically and vertically, and has a plurality of antenna mounting portions 151 arranged on the front surface of the reflector 150; a radiating device printed circuit board 162, which is disposed in close contact with the back side of the radiating device module cover 161 and between the radiating device module cover 161 and the antenna mounting portions 151, and has a patch antenna circuit portion 163a and a feed line 163b printed thereon; and a radiating guide 165, which is formed of a conductive metal material and is electrically connected to the patch antenna circuit portion 163a of the radiating device printed circuit board 162.

[0156] The patch antenna circuit section 163a described above can be printed on the front surface of the printed circuit board 162 for the radiating device. This patch antenna circuit section 163a generates a dual-polarized patch device with either orthogonal ±45° polarization or vertical / horizontal polarization. The patch antenna circuit section 163a can be printed in three separate pieces spaced apart in the vertical (length) direction, and each patch antenna circuit section 163a can be interconnected via feed lines 163b.

[0157] In conventional antenna devices, feed lines need to be formed separately on the lower part of the printed circuit board on which the patch antenna circuit section is mounted. This makes the feed line structure complex, for example, having multiple through holes. The feed line structure occupies the lower space of the printed circuit board 162 for the radiating device, thus causing interference factors that serve as direct surface thermal contact between the radio frequency (RF) filter 140 and the printed circuit board 162 for the radiating device. However, according to the embodiment of the present invention, the feed line 163b is patterned and formed together with the patch antenna circuit section 163a on the same front surface as the printed circuit board 162 for the radiating device on which the patch antenna circuit section 163a is patterned. This has the following advantages: the feed line structure becomes very simple, and the bonding space for direct surface thermal contact between the radio frequency (RF) filter 140 and the printed circuit board 162 for the radiating device can be ensured.

[0158] On the other hand, the radiation guide 165 is formed of a thermally conductive or electrically conductive metal material to be electrically connected to the patch antenna circuit section 163a. ​​While guiding the radiation beam in all directions, the radiation guide 165 can also simultaneously transfer heat generated behind the printed circuit board 162 of the radiation device to the front via conduction. The radiation guide 165 can be made of a metal material with good electrical conductivity and can be spaced apart in front of each patch antenna circuit section 163a.

[0159] In an embodiment of the present invention, a radiating device using patch antenna circuit section 163a and radiating guide 165 is described. However, when a dipole antenna is used, the radiating guide can be omitted. Since the dipole antenna is relatively high, heat can be dissipated to a place further than the front surface of the reflector 150 to increase the amount of heat dissipation.

[0160] Reference Figure 4 and Figures 10 to 12b The radiation guide 165 can be electrically connected to the patch antenna circuit section 163a through the guide through-hole 164c. The overall size, shape, and installation position of the radiation guide 165 can be appropriately designed by measuring the characteristics of the radiation beam emitted from the corresponding patch antenna circuit section 163a and conducting experiments or simulating the corresponding characteristics. The radiation guide 165 has the function of guiding the direction of the radiation beam generated by the patch antenna circuit section 163a to all directions, thus further reducing the overall antenna beam width and improving the characteristics of the side wings. Moreover, it can compensate for the losses caused by the patch antenna, and since it is made of conductive metal, it can also perform heat dissipation function at the same time. The shape of the radiation guide 165 is a suitable shape for guiding the direction of the radiation beam to all directions, for example, an omnidirectional circle is preferred, but it is not limited to this.

[0161] On the other hand, at least two patch antenna circuit sections 163a and radiation guides 165 can constitute a radiation device module 160. Figures 10 to 12b The diagram shows an example of three patch antenna circuit sections 163a and radiation guides 165 forming a unit radiation device module 160. The number of patch antenna circuit sections 163a and radiation guides 165 can be varied depending on the optimal design of the radiation device module for maximizing gain. Specifically, in an antenna RF module 200 according to an embodiment of the present invention, a total of three radiation guides 165 are provided in each RF module 200 to ensure maximum gain, but the number is not limited to this.

[0162] A through-hole 164c is formed in the radiation guide 165, through which the radiation guide 165 can be electrically connected to the patch antenna circuit section 163a. ​​More specifically, the radiation guide 165 and the patch antenna circuit section 163a can be electrically connected via a device fixing bolt 180 for fixing to the front surface of the filter body 141.

[0163] The radiation device module cover 161 is injection molded from a non-conductive plastic material, such as... Figure 12a and Figure 12bAs shown, a guide fixing part 167 that fits with the back of the radiation guide 165 is provided on one side of the radiation device module cover 161. In the guide fixing part 167, a guide fixing protrusion 168 that can be combined with the radiation guide 165 protrudes forward.

[0164] The radiation guide 165 can be pressed into at least one guide fixing groove (not marked in the figure) formed in a recess at a position corresponding to at least one guide fixing protrusion 168.

[0165] Furthermore, at least one substrate mounting hole 164b for coupling with the radio frequency (RF) filter 140 is formed through the radiating device module cover 161. After the device fixing bolt 180 passes through the through hole 164c of the radiating guide 165 and the substrate mounting hole 164b of the radiating device module cover 161 through the substrate through hole 164a formed on the radiating device printed circuit board 162, it can be securely coupled to the antenna mounting portion 151 of the reflector 150.

[0166] Furthermore, at least one reinforcing rib 166 is formed on the front surface of the radiation device module cover 161 to shape the appearance of the radiation device module cover 161 and enhance the strength of the radiation device module cover 161, which is made of plastic material.

[0167] In the RF module 200 formed by the structure described above, with reference to the front housing 130, the heat generated by the front radio frequency (RF) filter 140 can be directly released to the outside through contact with the back of the reflector 150 or through the heat dissipation holes 155 formed in the reflector 150.

[0168] On the other hand, the antenna RF module assembly 300 according to the present invention can be defined as including an RF module 200 implemented through the following various embodiments.

[0169] As one embodiment, it may include: a plurality of radio frequency (RF) filters 140 detachably coupled to the front surface of the motherboard 120; a plurality of radiating device modules 160 stacked on the front surface of the plurality of RF filters 140; and a reflector 150 configured to cover the plurality of RF filters 140, serve as grounding (GN D) for the plurality of radiating device modules 160, and mediate heat dissipation from the plurality of RF filters 140 to the outside.

[0170] In another embodiment, the RF module 200 includes: a plurality of radio frequency (RF) filters 140, which are spaced apart by predetermined distances in the up-down and left-right directions; a plurality of radiating device modules 160, which are stacked on the front surface of the plurality of RF filters 140; and a reflector 150, which is arranged to separate the plurality of RF filters 140 and the plurality of radiating device modules 160. The plurality of RF filters 140 can be implemented in such a way that they are detachably connected to the front surface of the main board 120, which is stacked in the internal space 110S of the antenna housing 105, by means of a pin connection.

[0171] In another embodiment, the RF module 200 includes: a plurality of radio frequency (RF) filters 140, each having at least four outer surfaces; a plurality of radiating device modules 160, stacked on any one of the outer surfaces (e.g., the front surface) of each of the plurality of RF filters 140; an amplification substrate 146, disposed on the other side of the outer surface of each of the plurality of RF filters 140, and on which at least one analog amplification device is mounted; and a reflector 150, which is configured such that it is disposed between the plurality of RF filters 140 and the plurality of radiating device modules 160, serving as a common ground for the plurality of radiating device modules 160, and that heat generated by at least one analog amplification device can be dissipated through one of the sidewalls of the plurality of RF filters 140, and then dissipated forward via the reflector 150.

[0172] Finally, as another embodiment, the RF module 200 includes: a plurality of radio frequency (RF) filters 140 detachably coupled to the front surface of the motherboard 120, each having at least four outer surfaces; a plurality of radiating device modules 160 stacked on any one of the outer surfaces (e.g., the front surface) of each of the plurality of RF filters 140; and a reflector 150 configured to cover the plurality of RF filters 140, the reflector 150 being formed of a metallic material to perform a grounding function between the plurality of RF filters 140 and the plurality of radiating device modules 160, and to reflect electromagnetic waves irradiated by the radiating device modules 160 forward, and may be configured to form a plurality of heat dissipation holes 155 to release heat generated from the plurality of RF filters 140 to the front or side.

[0173] Refer to the attached figures (in particular, Figure 7 (and the following figures) briefly describe the assembly process of an RF module 200 and antenna device 100 configured according to an embodiment of the present invention as described above.

[0174] First, such as Figures 10 to 12bAs shown, in one embodiment of the assembly method of the antenna RF module 200 according to the present invention, an amplification substrate 146 of an analog amplifier device is attached to either one or the other side of a filter body 140 manufactured by die casting. Next, a plurality of heat dissipation holes 155 and a reflector 150 are formed on the front surface of the radio frequency (RF) filter 140, and then a radiating device printed circuit board 162 of a radiating device module 160 is disposed on the reflector 150. After a radiating device module cover 161 of the radiating device module 160 is disposed on the radiating device printed circuit board 162, a radiating guide 165 of the radiating device module 160 is assembled onto the radiating device module cover 161, and the radiating guide 165 is electrically connected to the radiating device printed circuit board 162, thereby completing the assembly of the RF module 200. Thereafter, the amplification substrate 146 can be attached to the front surface of the main board 120 by means of a pin connection.

[0175] On the other hand, in one embodiment of the assembly method of the antenna device 100 according to the present invention, such as Figure 8 , Figure 9 as well as Figure 15 As shown, in order to completely divide the internal space 110S and the external space of the antenna housing 105 on which the motherboard 120 is provided, the front housing 130 is attached to the front end of the rear housing 110 for fixation, and then the inner socket portion 146' of the amplification board 146 of the multiple RF modules 200 is attached to the outer socket portion 125 of the motherboard 120 by means of a connector pin.

[0176] And, as Figure 16 As shown, the reflector 150 is fixed with screws along the edge of the rear housing 110, and then multiple radiating device modules 160 are connected to the antenna mounting section 151 to complete the assembly of the antenna device 100.

[0177] As described above, in an antenna device 100 according to an embodiment of the present invention, by removing the radome, the internal system heat of the antenna device 100 can be easily released to the area exposed to the outside air in all directions, including the rear and front. The radiating device module 160 is configured to be exposed to the outside air through the reflector 150, thereby achieving dispersed heat dissipation to the front and rear of the antenna device 100. Therefore, the heat dissipation performance is greatly improved compared with the prior art.

[0178] Furthermore, the forward protrusion length can be reduced to the same volume as that of a conventional radome, and heat can be dissipated forward. Therefore, the front-to-back length of the multiple rear heat sinks 111 integrally formed with the back of the rear housing 130 can be reduced. Thus, the front-to-back thickness of the antenna device 100 can be designed to be thin overall. This creates the advantage of easy installation on the inner or outer wall of a building.

[0179] The various embodiments of the antenna RF module, RF module assembly, and antenna device including the component according to the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it is obvious that various modifications and equivalent implementations can be made by those skilled in the art to which this invention pertains. Therefore, the true scope of protection of the present invention should be determined by the appended claims.

[0180] Industrial availability

[0181] The present invention provides an antenna RF module and an antenna device including the RF module, which can greatly improve heat dissipation performance by removing the radome and placing the antenna RF module outside the antenna housing to expose it to the outside air.

Claims

1. An antenna radio frequency module, the antenna radio frequency module comprising analog radio frequency components, wherein, The analog radio frequency component includes: Radio frequency filters; A radiation device module is disposed on one side of the radio frequency filter; and An amplification section substrate is disposed on the other side of the RF filter and an analog amplification device is mounted thereon. The antenna radio frequency module is positioned to expose itself to the external air in front, which is defined as the area in front of the front surface of the antenna housing. A reflector is provided between the radio frequency filter and the radiating device module. The reflector is used to ground the radiating device module and mediate the heat generated by the radio frequency filter to dissipate heat to the outside air in front. The heat generated from the analog amplifier device is dissipated through one of the sidewalls of the RF filter adjacent to the amplification substrate, and then mediated by the reflector.

2. The radio frequency module for antennas according to claim 1, wherein, The reflector is made of metal and is formed into a mesh with multiple heat dissipation holes.

3. The radio frequency module for antennas according to claim 2, wherein, The size of the heat dissipation hole is designed taking into account the durability and heat dissipation characteristics of the reflector.

4. The radio frequency module for antennas according to claim 2, wherein, The size of the heat dissipation hole is designed with the wavelength of the operating frequency in mind in order to maintain the grounding function of the RF filter.

5. The radio frequency module for antennas according to claim 3 or 4, wherein, The size of the heat dissipation hole is set to be within the range of 1 / 10λ to 1 / 20λ of the operating frequency.

6. The radio frequency module for antennas according to claim 1, wherein, The radio frequency filter includes a filter body integrated with the front surface of the radiating device module. The front surface of the filter body is joined to the rear surface of the reflector by means of surface thermal contact.

7. The radio frequency module for antennas according to claim 6, wherein, The front end of the filter body protrudes further forward than the front end of the antenna housing on which the motherboard is located.

8. The radio frequency module for antennas according to claim 6, wherein, The reflector is formed to cover the entire front surface of the filter body and to cover the side portion of the filter body.

9. The radio frequency module for antennas according to claim 1, wherein, The antenna housing includes: a rear housing forming an internal space where a motherboard is disposed; and a front housing configured to cover the front of the rear housing and separate the internal space from the front exterior. The reflector has a frame bending plate formed therein, and the frame portion of the frame bending plate bends backward to surround and protect the side of the radio frequency module.

10. The radio frequency module for an antenna according to claim 9, wherein, In the curved frame plate, multiple bolt fixing slots are spaced apart at multiple locations along the edge of the curved frame plate. In the front housing, a plurality of bolt through holes are formed along the edge. The reflector is attached to the front of the front housing by means of fastening a plurality of assembly bolts in the plurality of bolt fixing slots and bolt through holes.

11. The radio frequency module for an antenna according to claim 9, wherein, The radio frequency filter includes a filter body integrated with the front surface of the radiating device module. In the reflector, the antenna mounting portion, which is installed in a manner that makes surface thermal contact with the front surface of the filter body and with the back surface of the radiating device module, is planar.

12. An antenna radio frequency module assembly, the antenna radio frequency module assembly comprising an antenna radio frequency module, the antenna radio frequency module comprising analog radio frequency components, wherein, The analog radio frequency component includes: Multiple radio frequency filters; Multiple radiating device modules are disposed on one side of each of the multiple radio frequency filters; and Multiple amplification substrates are disposed on the opposite side of each of the multiple RF filters, and analog amplification devices are mounted thereon. The antenna radio frequency module is positioned to expose itself to the external air in front, which is defined as the area in front of the front surface of the antenna housing. A reflector is provided between the radio frequency filter and the radiating device module. The reflector is used to ground the radiating device module and mediate the heat generated by the radio frequency filter to dissipate heat to the outside air in front. The heat generated from the analog amplifier device is dissipated through one of the sidewalls of the RF filter adjacent to the amplification substrate, and then mediated by the reflector.

13. An antenna device, wherein, include: A motherboard, with at least one digital device mounted on the front or rear surface; The antenna housing is shell-shaped, with an opening at the front to accommodate the main board. as well as The radio frequency module assembly is connected to the motherboard via electrical signal lines. The radio frequency module assembly includes an antenna radio frequency module, which includes analog radio frequency components. The analog radio frequency component includes: Multiple radio frequency filters; Multiple radiating device modules are disposed on one side of each of the multiple radio frequency filters; and Multiple amplification substrates are disposed on the other side of each of the aforementioned RF filters, and analog amplification devices are mounted thereon. The antenna radio frequency module is positioned to expose itself to the external air in front, which is defined as the area in front of the front surface of the antenna housing. A reflector is provided between the radio frequency filter and the radiating device module. The reflector is used to ground the radiating device module and mediate the heat generated by the radio frequency filter to dissipate heat to the outside air in front. The heat generated from the analog amplifier device is dissipated through one of the sidewalls of the RF filter adjacent to the amplification substrate, and then mediated by the reflector.

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