Sensor device, footwear and footwear set

Abstract

The present application relates to a sensor device, footwear, and a footwear set. A technique capable of easily attaching and detaching a sensor device from footwear is provided. The sensor device includes a main body portion including a first surface on the side to be attached to the footwear and a second surface opposite the first surface, and a sensor portion housed in the main body portion. A first chamfer portion and a second chamfer portion are formed on the first surface. The footwear includes a housing recess provided in a sole of the footwear and capable of housing the sensor device in a state of covering the side portions of the sensor device. The housing recess includes a first recess having a first depth and a second recess having a second depth different from the first depth.

Description

Technical Field

[0001] This invention relates to sensor devices that can be installed on footwear, footwear, and footwear sets. Background Technology

[0002] Previously, it was known that shoes and other footwear included small sensor devices with built-in sensors and communicators housed in recesses in the soles. These sensor devices could calculate various motion-related parameters (e.g., calorie consumption, running distance) based on data measured by the sensors, and then transmit the measured data and calculated parameters to the user's smartphone or other portable device. Thus, the user could use these motion-related parameters for personal health management, etc. (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 2009-535157 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The sensor devices installed on footwear are mounted in a way that prevents them from easily detaching from the footwear during exercise.

[0008] For such sensor devices, it is necessary to remove them from the footwear for reasons such as battery replacement. However, in such cases, there is a problem that it is not easy to remove the sensor device from the footwear.

[0009] Therefore, the object of the present invention is to provide a sensor device, footwear, and footwear set that can be easily removed from footwear.

[0010] Solution for solving the problem

[0011] One technical solution of the present invention is a sensor device that can be installed on footwear, wherein the sensor device comprises: a main body including a first surface on the side to which the footwear is installed and a second surface opposite to the first surface; and a sensor part housed in the main body, wherein a first chamfer and a second chamfer are formed on the first surface.

[0012] One technical solution of the present invention is a footwear set, which includes a sensor device and a footwear capable of mounting the sensor device. The sensor device includes: a main body, which includes a first surface on the side to which the sensor device is mounted on the footwear and a second surface opposite to the first surface; and a sensor part, which is housed in the main body, having a first chamfer and a second chamfer formed on the first surface. The footwear has a receiving recess located on the sole of the footwear and capable of accommodating the sensor device in a state that covers the side of the sensor device. The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth.

[0013] One technical solution of the present invention is a footwear that can accommodate a sensor device. The sensor device has a first chamfer and a second chamfer on the side on which it is mounted. The footwear includes a receiving recess located on the sole of the footwear and capable of accommodating the sensor device in a manner that covers the side of the sensor device. The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth. The receiving recess is configured such that, when the sensor device is accommodated, the side of the sensor device opposite to the side with the first and second chamfers is located above the bottom surface of the second recess. Attached Figure Description

[0014] Figure 1 This is a left-side view of shoe 1 according to this embodiment.

[0015] Figure 2 This is a diagram showing an example of the structure of the sole 10 and the sensor device 2, and it is a top view of the shoe 1 viewed from directly above.

[0016] Figure 3 This is a 3D view of sensor device 2.

[0017] Figure 4 This is the front view of sensor device 2.

[0018] Figure 5 This is a rear view of sensor device 2.

[0019] Figure 6 This is a top view of sensor device 2.

[0020] Figure 7 This is a bottom view of sensor device 2.

[0021] Figure 8 This is a left-side view of sensor device 2.

[0022] Figure 9 This is a right-side view of sensor device 2.

[0023] Figure 10This is a diagram showing the relationship between the receiving recess 14 of shoe 1 and sensor device 2.

[0024] Figure 11 This diagram schematically illustrates the situation where the sensor device 2 is removed from the receiving recess 14.

[0025] Figure 12 This is a diagram showing the relationship between the receiving recess 14 of the shoe 1 and the sensor device 2 in a modified example 1 of the embodiment.

[0026] Figure 13 This is a diagram showing the relationship between the receiving recess 14 of the shoe 1 in the second embodiment and the sensor device 2.

[0027] Figure 14 This diagram schematically illustrates the situation where the sensor device 2 is removed from the self-receiving recess 14 according to the second embodiment.

[0028] Explanation of reference numerals in the attached figures

[0029] 1. Shoe; 2. Sensor device; 10. Shoe sole; 11. Midsole; 12. Outsole; 13. Insole; 14. Receiving recess; 20. First surface; 21. Main body; 22. Cover; 23. Fixing part; 30. Second surface; 41. First side end; 42. Second side end; 43. Third side end; 44. Fourth side end; 24. First chamfer; 24a. First inclined surface; 24b. Second inclined surface; 25. Second chamfer; 25a. Third inclined surface; 25b. Fourth inclined surface; 31. Pressing part; 141. Recess; 142. Recess; 143. Second recess; 151. First recess; 152. Second recess; 153. Protruding post. Detailed Implementation

[0030] The embodiments of the present invention are described below.

[0031] <First Embodiment>

[0032] The first embodiment of the present invention will be described. In this embodiment, shoe 1 is used as an example of footwear, but other types of footwear such as sandals may also be used. Furthermore, shoe 1 is described as a shoe for the right foot, but it may also be a shoe for the left foot. Additionally, the present invention can be applied to both shoes for the right foot and shoes for the left foot.

[0033] Figure 1 This is a left-side view of the shoe 1 according to this embodiment. The shoe 1 has a sole 10 and a sensor device 2. When the sole 10 is divided into three parts in the front-to-back direction: a forefoot part, a midfoot part, and a heel part, the sensor device 2 can be detached relative to the midfoot part.

[0034] The sole 10 has a midsole 11 and an outsole 12. Depending on the manufacturing method of the shoe 1, it may also be a single piece without distinction between the two. In addition, an insole 13 can be appropriately provided. Furthermore, the sole 10 has a receiving recess 14 of a fitting shape on the upper surface side of the midsole 11, which can accommodate the sensor device 2.

[0035] Figure 2 This is a diagram showing an example of the structure of the sole 10 and the sensor device 2, and it is a top view of the shoe 1 viewed from directly above.

[0036] Viewed from above, the receiving recess 14 has a fitting shape at the midfoot of the midsole 11 that corresponds to the external shape of the sensor device 2 in its stored state. The midsole 11 is made, for example, of EVA resin (ethylene-vinyl acetate copolymer resin). EVA resin is flexible, therefore, the receiving recess 14 can be fixed in a way that tightly adheres to and covers the sensor device 2 when it is mounted. Furthermore, the detailed shape of the receiving recess 14 will be described later.

[0037] Next, sensor device 2 will be described.

[0038] The sensor device 2 has a profile shape that is symmetrical about the left and right sides with respect to the axis of symmetry A when it is housed in the receiving recess 14 of the sole 10. Here, "left and right" refers to the left and right sides when the sensor device 2 is housed in the receiving recess 14. In this embodiment, the shoe 1 is exemplified as being for the right foot; therefore, with the axis of symmetry A pointing towards the front and back of the shoe 1, the left side corresponds to the inner side of the shoe, and the right side corresponds to the outer side of the shoe.

[0039] Figure 3 This is a 3D view of sensor device 2. Figure 4 This is the front view of sensor device 2. Figure 5 This is a rear view of sensor device 2. Figure 6 This is a top view of sensor device 2. Figure 7 This is a bottom view of sensor device 2. Figure 8 This is a left-side view of sensor device 2. Figure 9 This is a right-side view of sensor device 2.

[0040] The sensor device 2 includes: a main body 21 that houses the battery and electronic components; a cover 22 that can be detached from the main body 21; and a fixing part 23 for fixing the cover 22 to the main body 21. The battery is, for example, a coin-type button battery. The electronic components include an electronic circuit board equipped with various electronic components, such as a triaxial accelerometer, a microprocessor, an IC memory, and a small wireless communication device. Other electronic components and circuitry can also be mounted. The triaxial accelerometer measures acceleration in each direction along the XYZ orthogonal axes. The measured values ​​are stored directly in the IC memory while maintaining the measured values ​​using predefined computational processing by the microprocessor, or converted into parameter values ​​representing the movement of the shoe 1, parameter values ​​related to the amount of movement of the user of the shoe 1, etc., and stored in the IC memory. Furthermore, the measured values ​​and parameter values ​​are transmitted via communication control by the microprocessor to an external device (e.g., a user-held smartphone, smartwatch, smart glasses, or other wearable computer with communication capabilities).

[0041] The sensor device 2 has a first surface 20 on the side that is mounted to the sole 10 of the shoe 1 and a second surface 30 on the side opposite to the first surface 20. The first surface 20 and the second surface 30 are in a substantially parallel relationship.

[0042] The first side 20 includes a first side end 41, a second side end 42, a third side end 43 and a fourth side end 44, with the first side end 41 opposite to the third side end 43 and the second side end 42 opposite to the fourth side end 44.

[0043] A first chamfer 24 is formed in a portion of the first end portion 41 and a portion of the fourth end portion 44. Furthermore, the first chamfer 24 includes a first inclined surface 24a and a second inclined surface 24b. The first inclined surface 24a and the second inclined surface 24b are inclined at different angles toward the same inclined direction (e.g., the first end portion 51). In this embodiment, the inclination angle of the first inclined surface 24a is gentler than that of the second inclined surface 24b. Moreover, the first chamfer 24 is formed only on the first surface 20 and does not extend to the second surface 30.

[0044] A second chamfer 25 is formed in a portion of the first end portion 41 and a portion of the second end portion 42. Furthermore, the second chamfer 25 includes a third inclined surface 25a and a fourth inclined surface 25b. The third inclined surface 25a and the fourth inclined surface 25b are inclined at different angles toward the same inclined direction (e.g., the second end portion 52). In this embodiment, the inclination angle of the third inclined surface 25a is gentler than that of the fourth inclined surface 25b. Moreover, the second chamfer 25 is formed only on the first surface 20 and does not extend to the second surface 30.

[0045] The first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) are formed to be linearly symmetrical about the centerline B of the first side end 41, and are partially connected (in this embodiment, the first inclined surface 24a and the third inclined surface 25a are connected).

[0046] The area of ​​the first inclined surface 24a is approximately the same as the area of ​​the third inclined surface 25a. The area of ​​the second inclined surface 24b is approximately the same as the area of ​​the fourth inclined surface 25b. Furthermore, the area of ​​the first inclined surface 24a is larger than the area of ​​the second inclined surface 24b. The area of ​​the third inclined surface 25a is larger than the area of ​​the fourth inclined surface 25b. Moreover, the angle formed between the inclination direction of the first chamfered portion 24 (the first and second inclined surfaces 24b) and the inclination direction of the second chamfered portion 25 (the third and fourth inclined surfaces 25b) is an angle of 60 degrees or more and 120 degrees or less, and in this embodiment, it is approximately 90 degrees.

[0047] Thus, the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) are formed on the first side end 41, the second side end 42, and the fourth side end 44, but are not formed on the third side end 43 side. Furthermore, as a method for forming the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b), there are methods such as bevel surface processing.

[0048] Additionally, a pressing part 31 is provided on the second surface 30 of the main body 21. When the sensor device 2 is installed into the receiving recess 14 or when the sensor device 2 is removed from the receiving recess 14, the pressing part 31 is used to press the sensor device 2.

[0049] Next, the relationship between the sensor device 2 and the receiving recess 14 of the shoe 1 will be explained. Figure 10 This is a diagram showing the relationship between the receiving recess 14 of shoe 1 and sensor device 2.

[0050] The receiving recess 14 is shaped to accommodate the sensor device 2 within the sole 11 of the shoe. However, the bottom surface of the receiving recess 14 is not flat; there is a partial depression on the bottom surface of the receiving recess 14 towards the heel of the shoe 1. This recess 141 ( Figure 10 The depth of the blackened portion is such that it is the depth at the position corresponding to the fixing portion 23 of the sensor device 1 for the protruding fixing portion 23 of the sensor device 1 to fit into, and then, from this portion, the depth increases while tilting towards the end in the direction of the shoe heel portion of the receiving recess 14.

[0051] The sensor device 2 is housed in the receiving recess 14 by its fixing part 23 engaging with the semi-circular recess 142 of the receiving recess 14. The semi-circular recess 142 of the receiving recess 14 can be used as a mark to indicate when the sensor device 2 is installed in the correct position. For example, even if the sensor device 2 is attempted to be fitted into the receiving recess 14 in an incorrect housing posture, the sensor device 2 cannot smoothly enter the receiving recess 14 because the convex shape of the fixing part 23 is not aligned with the position of the recess 142, and the user can immediately notice the incorrect orientation of the sensor device 2.

[0052] Furthermore, when the sensor device 2 is installed in the receiving recess 14, the bottom surface of the receiving recess 14 does not contact the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2. Moreover, the sidewall of the receiving recess 14 does not contact the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2.

[0053] The sole 11 is made of materials such as EVA resin (ethylene-vinyl acetate copolymer resin). Since EVA resin is flexible, the receiving recess 14 formed on the sole 11 can press the installed sensor device 2 from the side wall of the receiving recess 14 and fix the sensor device 2 in a tight fit.

[0054] Next, the process of removing the sensor device 2 from the receiving recess 14 will be described.

[0055] Figure 11 This diagram schematically illustrates the situation where the sensor device 2 is removed from the receiving recess 14.

[0056] When the sensor device 2 is removed from the receiving recess 14, press the pressing part 31 of the sensor device 2 with your finger or the like. As a result, the main body 21 of the sensor device 2 tilts towards the recess 141 of the receiving recess 14, and a portion of the surface 20 on the side of the main body 21 contacts the bottom surface of the recess 141, causing the cover 22 of the sensor device 2 to lift up from the receiving recess 14.

[0057] Importantly, the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2 do not contact the sidewall of the receiving recess 14. As a result, the area of ​​the side of the sensor device 2 near the cover portion 22 in contact with the sidewall of the receiving recess 14 is relatively small.

[0058] Therefore, when the cover 22 of the sensor device 2 is tilted up, the friction between the side of the cover 22 and the side wall of the receiving recess 14 is small, making it easy to tilt the cover 22 of the sensor device 2 up and remove the sensor device 2. This structure is particularly suitable for footwear such as children's shoes and shoes for users with less strength.

[0059] Furthermore, when the user performs an ankle-twisting motion, the sensor device 2 housed in the sole 10 of the shoe 1 experiences a torque relative to the sole 10 about its vertical axis. This torque causes twisting between the outer periphery of the sensor device 2 and the sidewall of the receiving recess 14. However, according to this embodiment, the first chamfer 24 and the second chamfer 25 are composed of two inclined surfaces with different angles, thus reducing the portion of the sensor device 2 in contact with the sidewall of the receiving recess 14 and reducing the gap between the first chamfer 24 and the second chamfer 25 and the bottom surface and sidewall of the receiving recess 14. This minimizes the displacement of the sensor device 2 caused by the twisting. As a result, the housing state of the sensor device 2 can be stably maintained.

[0060] <Modification 1 of the first embodiment>

[0061] Example 1 of this embodiment is explained.

[0062] Figure 12 This is a diagram showing the relationship between the receiving recess 14 of the shoe 1 and the sensor device 2 in a modified example 1 of the embodiment.

[0063] In a variation of this embodiment, a second recess (recess) 143 is formed on the bottom surface of the receiving recess 14 at the portion corresponding to the positions of the first chamfer 24 and the second chamfer 25. Figure 12 (The blackened portion). The second recess 143 slopes towards the end of the receiving recess 14 in the direction of the foreleg, while increasing in depth, starting from the position corresponding to the chamfering start position of the first chamfer 24 and the second chamfer 25.

[0064] By providing the second recess 143, the gap between the first chamfered portion 24 and the second chamfered portion 25 and the bottom surface and side wall of the receiving recess 14 is increased, making it easier to remove the sensor device 2 from the receiving recess 14.

[0065] <Modification 2 of the first embodiment>

[0066] In this embodiment, an example is described where the receiving recess 14 is formed directly in the sole 11. However, it is also possible to embed a recess-forming accessory with the same shape as the receiving recess 14 into the sole 11. The recess-forming accessory is, for example, made of TPU resin (thermoplastic polyurethane resin).

[0067] <Second Implementation>

[0068] The second embodiment of the present invention will be described. The shape of the receiving recess 14 of the shoe 1 in the second embodiment is different from that in the first embodiment. Figure 13 This is a diagram showing the relationship between the receiving recess 14 of the shoe 1 in the second embodiment and the sensor device 2.

[0069] The receiving recess 14 is shaped to accommodate the sensor device 2 in a fitting recess shape on the sole 11. The receiving recess 14 includes a first recess 151 and a second recess 152. Figure 13 (The blackened part).

[0070] The first recess 151 is located at a position corresponding to the cover portion 22 side of the sensor device 2, and is configured as a generally trapezoidal shape that narrows relative to the direction of the toe. The depth of the first recess 151 is greater than the height of the side surface of the sensor device 2, and it is formed such that the sidewall of the first recess 151 partially contacts the side surface of the sensor device 2 near the cover portion 22. Moreover, when the sensor device 2 is housed in the receiving recess 14, the bottom surface of the first recess 151 is in a relative positional relationship with the portion of the surface 20 of the sensor device 2 near the cover portion 22, and they are in partial contact. However, the bottom surface of the first recess 151 does not contact the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2. In addition, the sidewall of the receiving recess 14 does not contact the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2.

[0071] The second recess 152 is located at a position corresponding to the main body 21 side of the sensor device 2. The depth of the second recess 152 is deeper than the depth of the first recess 151, and is such that, when the sensor device 2 is accurately housed in the receiving recess 14, the bottom surface of the second recess 152 does not contact the portion of the surface 20 of the sensor device 2 on the side facing the main body 21 (the side opposite to the first chamfer 24 and the second chamfer 25). The depth of the second recess 152 is, for example, about half the height of the side surface of the sensor device 2 that is deeper than the first recess 151. With this shape, when the sensor device 2 is accurately housed in the receiving recess 14, the portion of the surface 20 of the sensor device 2 on the side facing the main body 21 is located above the bottom surface of the second recess 152. In addition, a protruding post 153 is formed near the junction between the two walls of the second recess 152 and the first recess 151. With the sensor device 2 installed and detachable from the receiving recess 14, the protruding part 153 supports (clamps) the side of the sensor device 2. By clamping the sensor device 2 with the protruding part 153, the sensor device 2 can be fixed to the receiving recess 14.

[0072] Next, the process of removing the sensor device 2 from the receiving recess 14 will be described.

[0073] Figure 14 This diagram schematically illustrates the situation where the sensor device 2 is removed from the self-receiving recess 14 according to the second embodiment.

[0074] When the sensor device 2 is removed from the receiving recess 14, press the pressing part 31 of the sensor device 2 with your finger or the like. As a result, the main body 21 of the sensor device 2 tilts towards the second recess 152 of the receiving recess 14, and a portion of the surface 20 on the side closest to the main body 21 contacts the bottom surface of the second recess 152. The cover 22 of the sensor device 2 then lifts up from the receiving recess 14. That is, portions of the first chamfer 24 and the second chamfer 25 of the sensor device 2 are partially exposed.

[0075] Importantly, the first chamfered portion 24 (first inclined surface 24a and second inclined surface 24b) and the second chamfered portion 25 (third inclined surface 25a and fourth inclined surface 25b) of the sensor device 2 do not contact the sidewalls and bottom surface of the receiving recess 14. As a result, the contact area between the side of the sensor device 2 near the cover 22 and the sidewall of the receiving recess 14 is smaller. Consequently, when the cover 22 side of the sensor device 2 is lifted, the friction between the side of the cover 22 and the sidewall of the receiving recess 14 is less, making it easier to lift the cover 22 side of the sensor device 2 and easily remove the sensor device 2. This structure is particularly suitable for footwear such as children's shoes, which are suitable for users with less strength.

[0076] Furthermore, even if the main body 21 of the sensor device 2 is tilted to the side of the second recess 152, the sensor device 2 will not suddenly fall off because it is held by the protruding post 153, thus preventing it from falling off when the sensor device 2 is removed.

[0077] The present invention has been described above with reference to preferred embodiments, but the present invention is not limited to the above embodiments, but can be modified and implemented in various ways within the scope of its technical concept.

[0078] In addition, some or all of the above-described embodiments may also be recorded as the following notes, but are not limited to the following content.

[0079] [Postscript 1]

[0080] A sensor device that can be installed in footwear, wherein,

[0081] This sensor device has the following features:

[0082] The main body includes a first surface on the side where the footwear is mounted and a second surface opposite the first surface; and

[0083] The sensor unit is housed within the main body.

[0084] A first chamfer and a second chamfer are formed on the first surface.

[0085] [Postscript 2]

[0086] According to the sensor device described in Appendix 1, wherein,

[0087] The first chamfered portion and the second chamfered portion are formed to be linearly symmetrical about the centerline of one end edge of the first surface.

[0088] [Postscript 3]

[0089] According to the sensor device described in Appendix 1 or Appendix 2, wherein,

[0090] The portion of the first chamfer is connected to the portion of the second chamfer.

[0091] [Postscript 4]

[0092] The sensor device according to any one of Annexes 1 to 3, wherein,

[0093] The first chamfer is formed on the first surface along the first direction.

[0094] The second chamfer is formed on the first surface along the second direction.

[0095] The second direction forms an azimuth angle of more than 60 degrees and less than 120 degrees relative to the first direction.

[0096] [Postscript 5]

[0097] The sensor device according to any one of Appendices 1 to 4, wherein,

[0098] The first surface includes a first side end, a second side end, a third side end, and a fourth side end.

[0099] The first side end is opposite to the third side end.

[0100] The second side end is opposite to the fourth side end.

[0101] The first chamfer is formed in a portion of the first side end and a portion of the fourth side end.

[0102] The second chamfer is formed in a portion of the first side end and a portion of the second side end.

[0103] [Postscript 6]

[0104] The sensor device according to any one of Appendices 1 to 5, wherein,

[0105] The first chamfer and the second chamfer are not formed at the third side end.

[0106] [Postscript 7]

[0107] The sensor device according to any one of Annexes 1 to 6, wherein,

[0108] The first chamfered portion includes a first inclined surface and a second inclined surface, wherein the inclination angle of the first inclined surface is different from that of the second inclined surface.

[0109] The second chamfered portion includes a third inclined surface and a fourth inclined surface, and the inclination angle of the third inclined surface is different from that of the fourth inclined surface.

[0110] [Postscript 8]

[0111] According to the sensor device described in Appendix 7, wherein...

[0112] The area of ​​the first inclined surface is approximately the same as the area of ​​the third inclined surface.

[0113] The area of ​​the second inclined surface is approximately the same as the area of ​​the fourth inclined surface.

[0114] [Postscript 9]

[0115] According to the sensor device described in Appendix 7 or Appendix 8, wherein,

[0116] The area of ​​the first inclined surface is greater than the area of ​​the second inclined surface.

[0117] The area of ​​the third inclined surface is greater than the area of ​​the fourth inclined surface.

[0118] [Postscript 10]

[0119] The sensor device according to any one of Appendices 1 to 9, wherein,

[0120] The first chamfer and the second chamfer were subjected to bevel surface processing.

[0121] [Postscript 11]

[0122] The sensor device according to any one of Appendices 1 to 10, wherein,

[0123] The portion of the first surface, excluding the first chamfer and the second chamfer, is parallel to the second surface.

[0124] [Postscript 12]

[0125] According to the sensor device described in Appendix 11, wherein,

[0126] A pressing portion is formed in a part of the second surface that is parallel to the first surface.

[0127] [Postscript 13]

[0128] A footwear set comprising a sensor device and footwear capable of mounting the sensor device, wherein,

[0129] The sensor device includes:

[0130] The main body includes a first surface on the side where the footwear is mounted and a second surface opposite the first surface; and

[0131] The sensor unit is housed within the main body.

[0132] A first chamfer and a second chamfer are formed on the first surface.

[0133] The footwear includes a receiving recess located on the sole of the footwear, which is capable of accommodating the sensor device in a manner that covers the sides of the sensor device.

[0134] The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth.

[0135] [Postscript 14]

[0136] According to the footwear set described in Appendix 13, wherein,

[0137] The receiving recess is configured such that, in a state where the sensor device can be detached from the receiving recess, a portion of the side of the first surface opposite to the side where the first chamfer and the second chamfer are formed is in contact with the bottom surface of the second recess.

[0138] [Postscript 15]

[0139] According to the footwear set described in Appendix 14, wherein,

[0140] The receiving recess is configured such that, in a state where a portion of the side of the first surface opposite to the side where the first chamfer and the second chamfer are formed is in contact with the bottom surface of the second recess, at least a portion of the first chamfer and the second chamfer are exposed.

[0141] [Postscript 16]

[0142] The footwear set according to any one of Appendices 13 to 15, wherein,

[0143] The receiving recess is configured such that, when the sensor device is installed, the first chamfered portion and the second chamfered portion do not contact the bottom surface of the receiving recess.

[0144] [Postscript 17]

[0145] The footwear set according to any one of Appendices 13 to 16, wherein,

[0146] The receiving recess is configured to cover the side of the sensor device in a close-fitting manner when the sensor device is installed.

[0147] [Postscript 18]

[0148] According to the footwear set described in Appendix 17, wherein,

[0149] A support portion is formed in the second recess, which supports the side of the sensor device when the sensor device is installed and when the sensor device can be detached from the receiving recess.

[0150] [Postscript 19]

[0151] A type of footwear that can accommodate a sensor device, the sensor device having a first chamfer and a second chamfer on the side facing the footwear to which it is mounted, wherein...

[0152] The footwear has a receiving recess located on the sole, which can accommodate the sensor device in a manner that covers the sides of the sensor device.

[0153] The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth. The receiving recess is formed such that, in the state of receiving the sensor device, the side of the sensor device opposite to the side where the first chamfer and the second chamfer are formed is located above the bottom surface of the second recess.

Claims

1. A sensor device that can be installed in footwear, wherein, This sensor device has the following features: The main body includes a first surface on the side where the footwear is mounted, a second surface opposite to the first surface, and a first side end, a second side end, a third side end, and a fourth side end located on a portion of the first surface, wherein the first side end is opposite to the third side end, and the second side end is opposite to the fourth side end; and The sensor unit is housed within the main body. A first chamfer and a second chamfer are formed on the first surface. The first chamfer is formed in a portion of the first side end and a portion of the fourth side end. The second chamfer is formed in a portion of the first side end and a portion of the second side end. The first chamfer and the second chamfer are formed to be linearly symmetrical about the centerline of one end edge of the first surface as an axis of symmetry. The first chamfer includes a first inclined surface and a second inclined surface. The inclination angle of the first inclined surface is different from that of the second inclined surface. The first chamfer is formed on the first surface along a first direction. The second chamfer includes a third inclined surface and a fourth inclined surface. The inclination angle of the third inclined surface is different from that of the fourth inclined surface. The second chamfer is formed on the first surface along a second direction, and the second direction forms an azimuth angle of 60 degrees or more and 120 degrees or less relative to the first direction. The first inclined surface is connected to the third inclined surface, while the second inclined surface is not connected to the fourth inclined surface. The first, second, and fourth side ends form a shape that protrudes outwards in a localized manner when viewed from the main viewpoint.

2. The sensor device according to claim 1, wherein, The first chamfer and the second chamfer are not formed at the third side end.

3. The sensor device according to claim 1, wherein, The area of ​​the first inclined surface is approximately the same as the area of ​​the third inclined surface. The area of ​​the second inclined surface is approximately the same as the area of ​​the fourth inclined surface.

4. The sensor device according to claim 1, wherein, The area of ​​the first inclined surface is greater than the area of ​​the second inclined surface. The area of ​​the third inclined surface is greater than the area of ​​the fourth inclined surface.

5. The sensor device according to claim 1, wherein, The first chamfer and the second chamfer were subjected to bevel surface processing.

6. The sensor device according to claim 1, wherein, The portion of the first surface, excluding the first chamfer and the second chamfer, is parallel to the second surface.

7. The sensor device according to claim 6, wherein, A pressing portion is formed in a part of the second surface that is parallel to the first surface.

8. A footwear set comprising a sensor device and footwear capable of mounting said sensor device, wherein, The sensor device is the sensor device according to any one of claims 1 to 7. The footwear includes a receiving recess located on the sole of the footwear, which is capable of accommodating the sensor device in a manner that covers the sides of the sensor device. The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth.

9. The footwear set according to claim 8, wherein, The receiving recess is configured such that, in a state where the sensor device can be detached from the receiving recess, a portion of the side of the first surface opposite to the side where the first chamfer and the second chamfer are formed is in contact with the bottom surface of the second recess.

10. The footwear set according to claim 9, wherein, The receiving recess is configured such that, in a state where a portion of the side of the first surface opposite to the side where the first chamfer and the second chamfer are formed is in contact with the bottom surface of the second recess, at least a portion of the first chamfer and the second chamfer are exposed.

11. The footwear set according to any one of claims 8 to 10, wherein, The receiving recess is configured such that, when the sensor device is installed, the first chamfered portion and the second chamfered portion do not contact the bottom surface of the receiving recess.

12. The footwear set according to claim 8, wherein, The receiving recess is configured to cover the side of the sensor device when the sensor device is installed.

13. The footwear set according to claim 12, wherein, A support portion is formed in the second recess, which supports the side of the sensor device when the sensor device is installed and when the sensor device can be detached from the receiving recess.

14. A type of footwear capable of housing a sensor device, the sensor device being any one of claims 1 to 7, wherein, The footwear has a receiving recess located on the sole, which can accommodate the sensor device in a manner that covers the sides of the sensor device. The receiving recess includes a first recess of a first depth and a second recess of a second depth different from the first depth. The receiving recess is formed such that, in the state of receiving the sensor device, the side of the sensor device opposite to the side where the first chamfer and the second chamfer are formed is located above the bottom surface of the second recess.

Images