An ultrasonic probe and an ultrasonic apparatus

Abstract

Embodiments of the present specification provide an ultrasonic probe and an ultrasonic device. The ultrasonic probe comprises a backing block and a flexible circuit board; the backing block comprises an arc-shaped top surface and a first side surface connected to one side of the top surface; the flexible circuit board comprises a main plate part, a first connecting part and a first connecting structure; the main plate part covers the top surface; one end of the first connecting part is connected to one side of the main plate part, and the other end is connected to the first connecting structure; the first connecting part comprises a plurality of branches; the plurality of branches of the first connecting part cover the first side surface.

Description

Technical Field

[0001] This specification relates to the field of ultrasonic equipment technology, and in particular to an ultrasonic probe and ultrasonic equipment. Background Technology

[0002] Flexible circuit boards (PCBs) are printed circuits made with polyester film or polyimide as the substrate. They are widely used due to their high line density, light weight, and ability to be freely bent and folded. The flexible circuit boards of ordinary linear array ultrasonic probes can be folded directly downwards. For convex array probes, because the convex array structure has a specific curvature, the planar flexible circuit board needs to be folded into an arc-shaped flexible circuit board. When the planar flexible circuit board is folded downwards along the arc edge of the convex array, many wrinkles are generated. These folds occupy more space, increasing the difficulty of subsequent molding processes; at the same time, the folds mean that the internal circuitry of the circuit board has been bent and deformed, thus reducing the reliability of the internal electrical connections of the probe.

[0003] Therefore, it is hoped that an ultrasonic probe and ultrasonic device can be proposed to solve the above-mentioned problems caused by the folding of flexible circuit boards. Summary of the Invention

[0004] This specification provides one or more embodiments of an ultrasonic probe, including a backing block and a flexible circuit board; the backing block includes an arc-shaped top surface and a first side surface connected to one side of the top surface; the flexible circuit board includes a main board portion, a first connecting portion, and a first connecting structure; the main board portion covers the top surface; one end of the first connecting portion is connected to one side of the main board portion, and the other end is connected to the first connecting structure; the first connecting portion includes multiple branches; the multiple branches of the first connecting portion cover the first side surface.

[0005] In some embodiments, the backing block further includes a second side surface connected to the other side of the top surface, and the flexible circuit board includes a second connecting portion and a second connecting structure; one end of the second connecting portion is connected to the other side of the main board portion, and the other end is connected to the second connecting structure; the second connecting portion includes a plurality of branches; the plurality of branches of the second connecting portion cover the second side surface.

[0006] In some embodiments, adjacent branches of the first connecting portion are separated by a hollowed-out area.

[0007] In some embodiments, the number of branches of the first connecting portion may be the same as or different from the number of branches of the second connecting portion, and the interval between two adjacent branches of the first connecting portion may be the same as or different from the interval between two adjacent branches of the second connecting portion.

[0008] In some embodiments, the backing block further includes a bottom surface, the first side surface being connected between the top surface and the bottom surface; the first connecting structure includes a sub-plate portion and a transition portion, the first connecting portion being connected between the main plate portion and the sub-plate portion; the sub-plate portion being connected between the first connecting portion and the transition portion, and the sub-plate portion covering the bottom surface.

[0009] In some embodiments, the sub-plate portion includes multiple sub-sections.

[0010] In some embodiments, adjacent portions of the sub-plate are separated by a cutout area.

[0011] In some embodiments, the first connecting portion and the first connecting structure constitute an adapter plate, the top end of the adapter plate being connected to the main plate; the ultrasonic probe includes at least two of the adapter plates.

[0012] In some embodiments, the top of the adapter plate is arc-shaped.

[0013] In some embodiments, both ends of each of the hollowed-out areas have rounded chamfers.

[0014] In some embodiments, the ultrasound probe further includes a crystal layer, and the flexible circuit board is located between the crystal layer and the backing block, with the flexible circuit board leading out the signal from the crystal layer.

[0015] This specification provides one or more embodiments of an ultrasonic device, including the aforementioned ultrasonic probe.

[0016] The beneficial effects of this specification include: the ultrasonic probes of some embodiments in this specification, by setting a flexible circuit board, do not require adapters and have high reliability; they can effectively solve the problem of wrinkles caused by folding planar flexible circuit boards on convex curved surfaces, and avoid the impact of wrinkles on the reliability of electrical connections; at the same time, they simplify the circuit board assembly steps and make assembly simple. Attached Figure Description

[0017] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0018] Figure 1 These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification;

[0019] Figure 2 These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification;

[0020] Figure 3These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification;

[0021] Figure 4 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification;

[0022] Figure 5 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification;

[0023] Figure 6 These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification;

[0024] Figure 7 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification;

[0025] Figure 8 These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification;

[0026] Figure 9 This is an exemplary structural diagram of the adapter board shown according to some embodiments of this specification;

[0027] Figure 10 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification. Detailed Implementation

[0028] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0029] Flexible circuit boards can be used to transmit electrical signals between the main unit and piezoelectric crystals in ultrasonic equipment. For convex array probes, the array elements are arranged in an arc shape, and the surface is arc-shaped.

[0030] Figure 1 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification. In some embodiments, such as Figure 1 As shown, the flexible circuit board 200 of the linear ultrasound probe can be folded down directly.

[0031] Figure 2 These are exemplary structural diagrams of an ultrasonic probe according to some embodiments of this specification. In some embodiments, two... Figure 2As shown, for a convex array probe, since the convex array structure has a specific curvature, the planar flexible circuit board 300 needs to be folded into an arc-shaped flexible circuit board 300. When the planar flexible circuit board 300 is folded downward along the arc edge of the convex array structure, many wrinkles will be generated, which will affect the reliability of the internal electrical connection of the ultrasonic probe and increase the difficulty of subsequent molding processes in production.

[0032] Figure 3 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification. In some embodiments, such as Figure 3 As shown, the edge of the flexible circuit board 400 of the ultrasonic probe can lead out multiple individual pins 410, which can then be folded into a plane to form a convex array. Since each pin 410 of the flexible circuit board 400 is independent, the surface tension generated when the flexible circuit board 400 is folded is reduced, solving the problem of wrinkles in the flexible circuit board 400. However, the flexible circuit board 400 structure design of this solution is complex, has low space utilization, requires the use of more connectors, is cumbersome to assemble, and has poor reliability.

[0033] Figure 4 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification. In some embodiments, such as Figure 4 As shown, cutouts 510 are provided on both sides of the main board of the flexible circuit board 500. The outer edge of the cutouts 510 is designed as an arc that matches the curvature of the convex array structure. The flexible circuit board 500 is bent along this arc. However, the cutouts 510 in this scheme will arch up during the bending process, which will cause line overlap and affect the imaging quality.

[0034] In view of this, some embodiments of this specification provide an ultrasonic probe that solves the problem of wrinkles caused by folding of the circuit board by designing a flexible circuit board structure for the convex array structure, increases the reliability of the electrical connection of the flexible circuit board, and reduces the difficulty of subsequent processes.

[0035] Figure 5 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification. Figure 6 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification.

[0036] In some embodiments, such as Figure 5 and Figure 6As shown, the ultrasonic probe may include a backing block 210 and a flexible circuit board 100. The backing block 210 may include an arc-shaped top surface and a first side surface connected to one side of the top surface. The flexible circuit board 100 may include a main board portion 110, a first connecting portion 121, and a first connecting structure 122. The main board portion 110 covers the arc-shaped top surface of the backing block 210. One end of the first connecting portion 121 may be connected to one side of the main board portion 110, and the other end may be connected to the first connecting structure 122. The first connecting portion 121 may include multiple branches. The multiple branches of the first connecting portion 121 cover the first side surface of the backing block 210.

[0037] Backing block 210 refers to the sound-absorbing block bonded to one side behind the piezoelectric crystal layer used in an ultrasonic probe. For example, the material of backing block 210 can be made from a mixture of thermoplastic resin and tungsten powder. Backing block 210 can be used to absorb undesirable sound waves radiated from the back of the piezoelectric crystal layer, improving the signal quality of the ultrasonic probe. It can also serve as a structural support block, ensuring the reliability of the ultrasonic probe's element array structure.

[0038] The top surface of the backing block 210 corresponds to an arc-shaped outer arc surface, and the top surface protrudes away from its own interior. In some embodiments, the top surface of the backing block 210 may be a partially cylindrical surface. In some embodiments, a first side surface of the backing block 210 is connected to the edge of the top surface. The first side surface may be a plane or an arc surface with a certain curvature, and the first side surface may protrude away from its own interior. In some embodiments, when the top surface is a cylindrical surface, the generatrix of the cylindrical surface may form an angle with the first side surface, such as 90° or other angles. The generatrix refers to any side of the cylindrical side surface parallel to the central axis. In some embodiments, the top surface and the first side surface may be smoothly connected. In some embodiments, the top surface and the first side surface may also be non-smoothly connected, in which case the connection between the top surface and the first side surface has an edge. In some embodiments, the backing block 210 also includes a bottom surface and a second side surface, and more details about the bottom surface and the second side surface can be found in the description below.

[0039] Flexible circuit board 100 refers to a printed circuit made of a flexible material (such as polyester film or polyimide) as a substrate. Flexible circuit board 100 can partially cover backing block 210 to provide support through backing block 210, improve device stability, and make full use of the internal space of the ultrasonic probe.

[0040] In some embodiments, the motherboard portion 110, the first connecting portion 121, and the first connecting structure 122 can be integrally formed to form a flexible circuit board 100.

[0041] The main board 110 is a major component of the flexible circuit board 100. In some embodiments, the main circuit of the flexible circuit board 100 may be provided on the main board 110 to realize the main functions of the flexible circuit board 100.

[0042] In some embodiments, the length L of the mainboard 110 can be determined by the parameters of the ultrasonic probe, for example, it can be calculated according to the following formula 1: L≥d*N (1)

[0043] Where d is the distance between the centers of adjacent array elements inside the ultrasonic probe, and N is the number of array elements. In some embodiments, the piezoelectric crystal located in the ultrasonic probe is cut into several parts on an even basis, each part being the smallest unit capable of independently emitting and receiving ultrasonic waves, referred to as an array element.

[0044] In some embodiments, the main board portion 110 may cover the arcuate top surface of the backing block 210, so that the main board portion 110 can be closely fitted with the crystal layer covering the backing block 210, resulting in a compact structure, saving space, and enabling better signal transmission. In some embodiments, when the ultrasonic probe is a convex array probe, the main board portion 110 may cover the top surface of the backing block 210 based on the curvature of the convex array structure.

[0045] In some embodiments, the shape of the motherboard 110 is not limited and can be set according to the needs of the ultrasonic probe. It can be a regular shape or an irregular shape.

[0046] The first connection structure 122 is used to connect the main board 110 to other components of the ultrasonic probe. For example, the first connection structure 122 enables signal transmission between the main board 110 and the main unit of the ultrasonic probe. In some embodiments, when the ultrasonic probe is not assembled, the first connection structure 122 may be on the same plane as the main board 110; after the ultrasonic probe is assembled, the first connection structure 122 and the main board 110 are not on the same plane. In some embodiments, the first connection structure 122 can be a "gold finger". A gold finger is composed of multiple conductive contacts (such as golden conductive contacts), and is called a "gold finger" because its surface is gold-plated and the conductive contacts are arranged like fingers. For more information about the first connection structure 122, please refer to the relevant description below.

[0047] The first connecting portion 121 is used to connect the main board portion 110 and the first connecting structure 122. In some embodiments, when the ultrasonic probe is not assembled, the first connecting portion 121 may be on the same plane as the main board portion 110; after the ultrasonic probe is assembled, the first connecting portion 121 and the main board portion 110 are not on the same plane. In some embodiments, the first connecting portion 121 may cover the first side surface of the backing block 210.

[0048] In some embodiments, the width of the end of the first connecting portion 121 connected to the motherboard portion 110 may be greater than the width of the end of the first connecting portion 121 connected to the first connecting structure 122, so that the flexible circuit board 100 can well match the shape of the backing block 210. In some embodiments, the first connecting portion 121 includes multiple branches, and the two ends of each branch may have different widths. For example, the width of the end of each branch connected to the motherboard portion 110 may be greater than the width of the end of each branch connected to the first connecting structure 122. In some embodiments, the sum of the branch widths of the ends of the multiple branches connected to the motherboard portion 110 may be greater than the sum of the branch widths of the ends of the multiple branches connected to the first connecting structure 122.

[0049] In some embodiments, the first connecting portion 121 may include multiple branches. In some embodiments, the shape of each branch may be the same or different. In some embodiments, the dimensions (such as length, width, surface area, etc.) of each branch may be the same or different. In some embodiments, adjacent branches of the first connecting portion 121 are separated by a cutout area. In some embodiments, adjacent branches of the first connecting portion 121 may not be separated by a cutout area; for example, the side edges of adjacent branches may contact each other. In some embodiments, the cutout area may be a through hole on the flexible circuit board 100, and the cutout area may be of various regular or irregular shapes, such as rectangles, ellipses, etc. In some embodiments, the upper edge and lower edge of the cutout area may correspond to the edge of the top surface and the edge of the bottom surface of the backing block 210, respectively. In this case, one end of each branch of the first connecting portion 121 is connected to the main board portion 110, and the other end is connected to the first connecting structure 122. In some embodiments, the upper edge and lower edge of the cutout area may not correspond to the edge of the top surface and the edge of the bottom surface of the backing block 210. For example, the upper edge and lower edge of the cutout area may both be located in the first side surface of the backing block 210. For example, at least one of the upper and lower edges of the hollowed-out area may extend beyond the edge of the top surface and / or the edge of the bottom surface of the backing block 210, in which case the branch of the first connecting portion 121 may partially cover the top surface and / or the bottom surface.

[0050] In some embodiments, for an ultrasound probe that is a convex array probe, the branches can be distributed in an arc shape, that is, the lower edges of the branches are arranged in an arc shape (see...). Figure 7In some embodiments, the branches can be arranged uniformly or non-uniformly. For example, the branches can be randomly arranged, in which case the size of the cutout area (e.g., the area of ​​the cutout area) between adjacent branches is different. In some embodiments, the edge of the top surface of the backing block 210 does not exceed the upper edge of the branch, and the edge of the bottom surface of the backing block 210 does not exceed the lower edge of the branch. In some embodiments, the length of the branch can be the same as the thickness of the backing block 210 it covers, that is, the upper edge and lower edge of the branch correspond to the edge of the top surface and the edge of the bottom surface of the backing block 210, respectively, so that the branch can completely cover the first side surface. In some embodiments, the length of the branch can exceed the thickness of the backing block 210 it covers, that is, the upper edge of the branch can exceed the edge of the top surface of the backing block 210, and / or, the lower edge of the branch can exceed the edge of the bottom surface of the backing block 210.

[0051] In some embodiments of this specification, by setting multiple branches separated by a hollow area, the branches can completely cover the first side surface, thereby effectively reducing the wrinkles caused by the motherboard portion 110 covering the arc-shaped top surface of the backing block 210, saving space and improving circuit reliability.

[0052] In some embodiments, at least one end of the hollowed-out area between the branches has a rounded chamfer. In some embodiments, both ends of the hollowed-out area between the branches have rounded chamfers. By setting the rounded chamfers, the stress concentration that occurs after the flexible circuit board 100 is bent can be reduced, thus preventing the flexible circuit board from breaking during use.

[0053] In some embodiments, the backing block 210 further includes a second side surface connected to the other side of the top surface. The second side surface of the backing block 210 has the same structure and function as its first side surface, and the details of the second side surface can be found in the description of the first side surface, and will not be repeated here.

[0054] In some embodiments, such as Figure 5 As shown, the flexible circuit board 100 includes a second connecting portion 123 and a second connecting structure. One end of the second connecting portion 123 is connected to the other side of the main board portion 110, and the other end is connected to the second connecting structure. In some embodiments, the second connecting portion 123 includes multiple branches. In some embodiments, adjacent branches of the second connecting portion 123 are separated by a cutout area. In some embodiments, adjacent branches of the second connecting portion 123 may not be separated by a cutout area; for example, the side edges of adjacent branches may contact each other. In some embodiments, multiple branches of the second connecting portion 123 cover the second side surface.

[0055] The second connecting part 123 and the second connecting structure have the same structure and function as the first connecting part 121 and the first connecting structure 122. For details about the second connecting part 123 and the second connecting structure, please refer to the description of the first connecting part 121 and the first connecting structure 122.

[0056] In some embodiments, the number of branches in the first connecting portion 121 may be the same as or different from the number of branches in the second connecting portion 123. In some embodiments, the spacing between two adjacent branches of the first connecting portion 121 may be the same as or different from the spacing between two adjacent branches of the second connecting portion 123. In some embodiments, the branches of the first connecting portion 121 and the branches of the second connecting portion 123 may have the same or different shapes and sizes.

[0057] In some embodiments, by providing a first connecting portion 121, a first connecting structure 122, a second connecting portion 123, and a second connecting structure, the flexible circuit board 100 covers both sides of the first and second side surfaces of the backing block 210, which allows the circuit to be fully arranged, saves space, and facilitates stable signal transmission.

[0058] In some embodiments, such as Figure 5 and Figure 6 As shown, the backing block 210 may further include a bottom surface. In some embodiments, the bottom surface of the backing block 210 may be a plane or a curved surface. The curved bottom surface corresponds to an arc-shaped inner arc surface, which may or may not be concentric with the outer arc surface (top surface). In some embodiments, the edge lengths of the top surface and the bottom surface of the backing block 210 may be equal or unequal. For example, the edge length of the top surface of the backing block 210 may be greater than the edge length of the bottom surface. In some embodiments, the distance between the top surface and the bottom surface of the backing block 210 may be uniform or non-uniform (see...). Figure 8 In some embodiments, the first side surface of the backing block 210 may be connected between the top surface and the bottom surface, with the upper and lower edges of the first side surface connected to the edges of the top surface and the bottom surface, respectively. In some embodiments, the first side surface and the bottom surface may be at an angle, such as 90° or other angles. In some embodiments, the first side surface and the bottom surface may be smoothly connected. In some embodiments, the first side surface and the bottom surface may also be non-smoothly connected, in which case the connection between the first side surface and the bottom surface has an edge.

[0059] In some embodiments, such as Figure 5 and Figure 6As shown, the first connecting structure 122 may include a sub-plate portion 1221 and a transition portion 1222. The sub-plate portion 1221 is the transition area between the first connecting portion 121 and the transition portion 1222. In some embodiments, the sub-plate portion 1221 may be considered as a part of the first connecting portion 121 or a part of the transition portion 1222, that is, the sub-plate portion 1221 may be integrally formed with the first connecting portion 121 or the transition portion 1222.

[0060] In some embodiments, the first connecting portion 121 may be connected between the main board portion 110 and the sub-board portion 1221, and the sub-board portion 1221 may be connected between the first connecting portion 121 and the adapter portion 1222. In some embodiments, the sub-board portion 1221 may cover the bottom surface of the backing block 210. In some embodiments, the first connecting portion 121 includes multiple branches, each branch being connected to the adapter portion 1222 via the sub-board portion 1221.

[0061] In some embodiments of this specification, the sub-plate portion 1221 can cover the bottom surface, thereby enabling a portion of the structure of the flexible circuit board 100 to cover the bottom of the backing block 210. The flexible circuit board 100 can better adapt to the shape of the backing block 210, further preventing wrinkles and saving space inside the ultrasonic probe.

[0062] Figure 7 These are exemplary structural diagrams of flexible circuit boards shown according to some embodiments of this specification. Figure 8 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification.

[0063] In some embodiments, such as Figure 7 and Figure 8As shown, the sub-plate portion 1221 may include multiple portions. In some embodiments, adjacent portions of the sub-plate portion 1221 may be separated by a cutout area. In some embodiments, adjacent portions of the sub-plate portion 1221 may not have a cutout area separating them; for example, the side edges of adjacent portions may contact each other. The cutout area may be a through-hole on the flexible circuit board 100, and the cutout area may include, but is not limited to, rectangular, elliptical, or other shapes. In some embodiments, there are no specific limitations on the portions of the sub-plate portion 1221 and the branches of the first connecting portion 121, as long as the lines in the sub-plate portion 1221 and the first connecting portion 121 can be well arranged and reliably electrically connected. For example, the number of portions of the sub-plate portion 1221 and the number of branches of the first connecting portion 121 may be the same or different. For example, the portions of the sub-plate portion 1221 and the branches of the first connecting portion 121 may have the same or different shapes and sizes. In some embodiments, one end of each portion of the subplate portion 1221 is connected to the other end of each branch of the first connecting portion 121, and the other end of each portion of the subplate portion 1221 is connected to the adapter portion 1222.

[0064] In some embodiments, both ends of the hollowed-out areas between the sections may have rounded chamfers to reduce stress concentration after the flexible circuit board 100 is bent, thereby preventing the flexible circuit board from breaking during use.

[0065] In some embodiments of this specification, by providing a cutout space in the sub-plate portion 1221, the surface tension of the flexible circuit board 100 when bent can be reduced, which helps to eliminate wrinkles and makes bending easier.

[0066] Figure 9 This is an exemplary structural diagram of an adapter board according to some embodiments of this specification.

[0067] In some embodiments, such as Figure 9 As shown, the first connecting portion 121 and the first connecting structure 122 can constitute an adapter plate 120. The adapter plate 120 is used for signal transmission between the main board portion 110 and the host of the ultrasonic probe. In some embodiments, the first connecting portion 121 and the first connecting structure 122 can be formed by bonding, welding or other connection methods to constitute the adapter plate 120. In some embodiments, the first connecting portion 121 and the first connecting structure 122 can be integrally formed into the adapter plate 120. In some embodiments, the ultrasonic probe may include at least two adapter plates 120.

[0068] In some embodiments, the adapter plate 120 may be relatively independent of the main board 110. The top end of the adapter plate 120 may be connected to the main board 110, for example, by bonding, soldering, connector connection, or other feasible connection methods, thereby simplifying the installation process. The bottom end of the adapter plate 120 may be connected to the main unit of the ultrasound probe, for example, by plugging, snapping, or other feasible connection methods. In some embodiments, the adapter plate 120 may be integrally formed with the main board 110.

[0069] In some embodiments, the top of the adapter plate 120 may be arc-shaped. When the ultrasonic probe is a convex array probe, the arc-shaped top of the adapter plate 120 can match the shape of the main board 110 and the backing block 210, thereby achieving a stable connection with the main board 110, which is beneficial for signal transmission and effectively reduces wrinkles generated by the flexible circuit board, thus avoiding the flexible circuit board occupying too much space.

[0070] Figure 10 This is an exemplary structural diagram of an ultrasonic probe according to some embodiments of this specification.

[0071] In some embodiments, the number of adapter boards 120 can be at least two. The two adapter boards 120 can be connected to both sides of the main board 110 respectively, thereby saving space and improving the reliability of electrical connections. This avoids the problem of the lines not being able to be arranged on one side of the main board 110, and also reduces the failure rate of plugging and unplugging.

[0072] In some embodiments, the number of adapter boards 120 can be multiple, for example Figure 10 The number of the four adapter boards 120 shown is not limited, as long as the structure allows it and it can achieve good signal transmission function.

[0073] In some embodiments, such as Figure 5 As shown, the main board portion 110 may have a first pre-crease a between it and the first connecting portion 121. The position of the first pre-crease a corresponds to the position of the edge between the top surface and the first side surface after the flexible circuit board 100 covers the backing block 210, which is the connection point between the top surface and the first side surface. In some embodiments, the flexible circuit board 100 can be processed to make the position of the first pre-crease a easier to bend compared to other positions of the flexible circuit board 100. For example, the physical properties (such as stiffness) of the corresponding position can be changed by processing, so that the flexible circuit board 100 is easier to bend at the location where the pre-crease is provided. In some embodiments, the flexible circuit board 100 can be bent along the first pre-crease a, and after bending, the flexible circuit board 100 can present any angle between 0-180° with respect to the two sides of the first pre-crease a, such as 90°, 110°, etc.

[0074] In some embodiments, such as Figure 5 As shown, a second pre-crease b is provided between the sub-plate portion 1221 and the first connecting portion 121. The position of the second pre-crease b corresponds to the position of the edge between the first side surface and the bottom surface after the flexible circuit board 100 covers the backing block 210, which is the connection point between the first side surface and the bottom surface. In some embodiments, the flexible circuit board 100 can be processed to make the position of the second pre-crease b easier to bend relative to other positions of the flexible circuit board 100. In some embodiments, the flexible circuit board 100 can be bent along the second pre-crease b, and after bending, the flexible circuit board 100 can present any angle between 0-180° with respect to the two sides of the second pre-crease b, such as 90°, 110°, etc. In some embodiments, the length of the first pre-crease a can be greater than the length of the second pre-crease b.

[0075] In some embodiments, such as Figure 5 As shown, a third pre-crease c is present between the sub-plate portion 1221 and the adapter portion 1222. The position of the third pre-crease c corresponds to the position of the edge between the bottom surface of the flexible circuit board 100 after covering the backing block 210 and the plane where the adapter portion 1222 is located. The bottom surface and the plane where the adapter portion 1222 is located can be connected at an angle, such as 90°, so the bottom surface and the plane where the adapter portion 1222 is located have an edge, and the position of the edge is the connection point between the bottom surface and the plane where the adapter portion 1222 is located. In some embodiments, the flexible circuit board 100 can be processed so that the position of the third pre-crease c can be more easily bent relative to other positions of the flexible circuit board 100. In some embodiments, the flexible circuit board 100 can be bent along the third pre-crease c, and after bending, the flexible circuit board 100 can present any angle between 0-180° with respect to the two sides of the third pre-crease c, such as 90°, 110°, etc.

[0076] In some embodiments, the first pre-crease a, the second pre-crease b, and the third pre-crease c can be actual structures or preset positions to facilitate folding rather than actual structures. During bending, the flexible circuit board 100 will fold along the first pre-crease a, the second pre-crease b, and the third pre-crease c. The first pre-crease a, the second pre-crease b, and the third pre-crease c facilitate assembly by the assembly personnel. In some embodiments, bending can be performed to form pre-creases before actual assembly, and then assembly can be carried out according to the pre-creases to improve assembly accuracy.

[0077] In some embodiments, the ultrasonic probe may further include a crystal layer, the material of which may include, but is not limited to, quartz crystal, barium titanate, lead zirconate titanate, etc. A flexible circuit board 100 may be located between the crystal layer and the backing block 210. The flexible circuit board 100 can supply power to the crystal layer. The crystal layer can emit sound wave signals based on the piezoelectric effect. After the sound waves are reflected, the piezoelectric effect of the crystal layer is induced again, generating a signal. The flexible circuit board 100 can be electrically connected to the crystal layer to extract the signal from the crystal layer. After the signal from the crystal layer is converted into an electrical signal, it is received and processed by the main unit of the ultrasonic probe.

[0078] Some embodiments of this specification also provide an ultrasound device, such as an ultrasound diagnostic instrument. This ultrasound device includes the aforementioned ultrasound probe. By using the aforementioned ultrasound probe, the ultrasound device has a compact internal structure, reliable circuit connections, and good imaging quality.

[0079] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

[0080] Furthermore, this specification uses specific terms to describe embodiments thereof, such as "an embodiment". 、 "An Example" 、 The terms "and / or some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification can be appropriately combined.

[0081] Similarly, it should be noted that, in order to simplify the description disclosed herein and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of embodiments in this specification may sometimes combine multiple features into a single embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of a single embodiment disclosed above.

[0082] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0083] For each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, and documents, referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0084] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An ultrasonic probe, characterized in that, Includes a backing block (210) and a flexible circuit board (100); The backing block (210) includes an arc-shaped top surface, an arc-shaped bottom surface, and a first side surface connected to one side of the top surface; The flexible circuit board (100) includes a main board portion (110), a first connecting portion (121), and a first connecting structure (122); the main board portion (110) covers the top surface; one end of the first connecting portion (121) is connected to one side of the main board portion (110), and the other end is connected to the first connecting structure (122); the first connecting portion (121) includes multiple branches; the multiple branches of the first connecting portion (121) cover the first side surface; The two adjacent branches of the first connecting portion (121) are separated by a hollow area, which is a through hole on the flexible circuit board (100); at least one of the upper edge and lower edge of the hollow area extends beyond the edge of the top surface and / or the edge of the bottom surface of the backing block (210).

2. The ultrasonic probe according to claim 1, characterized in that, The backing block (210) also includes a second side surface connected to the other side of the top surface, and the flexible circuit board (100) includes a second connecting part (123) and a second connecting structure; one end of the second connecting part (123) is connected to the other side of the main board part (110), and the other end is connected to the second connecting structure; The second connecting portion (123) includes multiple branches; the multiple branches of the second connecting portion (123) cover the second side surface.

3. The ultrasonic probe according to claim 2, characterized in that, The number of branches of the first connecting part (121) is the same as or different from the number of branches of the second connecting part (123), and the interval between two adjacent branches of the first connecting part (121) is the same as or different from the interval between two adjacent branches of the second connecting part (123).

4. The ultrasonic probe according to claim 1, characterized in that, The first side surface is connected between the top surface and the bottom surface; the first connecting structure (122) includes a sub-plate portion (1221) and a connecting portion (1222), the first connecting portion (121) is connected between the main plate portion (110) and the sub-plate portion (1221); the sub-plate portion (1221) is connected between the first connecting portion (121) and the connecting portion (1222), and the sub-plate portion (1221) covers the bottom surface.

5. The ultrasonic probe according to claim 4, characterized in that, The sub-plate (1221) includes multiple sub-sections.

6. The ultrasonic probe according to claim 5, characterized in that, The adjacent two sub-plate portions (1221) are separated by the hollowed-out area.

7. The ultrasonic probe according to claim 1, characterized in that, The first connecting part (121) and the first connecting structure (122) constitute an adapter plate (120), the top of the adapter plate (120) is connected to the main board part (110); the ultrasonic probe includes at least two of the adapter plates (120).

8. The ultrasonic probe according to claim 7, characterized in that, The top of the adapter plate (120) is arc-shaped.

9. The ultrasonic probe according to claim 1, characterized in that, At least one end of each of the hollowed-out areas has a rounded chamfer.

10. The ultrasonic probe according to claim 1, characterized in that, The ultrasonic probe also includes a crystal layer, and the flexible circuit board (100) is located between the crystal layer and the backing block (210), and the flexible circuit board (100) draws out the signal from the crystal layer.

11. An ultrasonic device, characterized in that, The ultrasonic probe included in any one of claims 1-10.

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