Probe card apparatus and circuit protection assembly therefor

Abstract

A probe card apparatus and a circuit protection assembly thereof, the probe card apparatus includes a wiring board, a probe head and a circuit protection assembly. The wiring board has a plurality of contacts. The probe head includes a needle carrier and a plurality of conductive probes. The conductive probes are arranged on the needle carrier respectively. The circuit protection assembly includes an insulating plate, a plurality of through holes and a plurality of self-restoring electrical cut-off units. The insulating plate is sandwiched between the wiring board and the probe head. The through holes are formed on the insulating plate respectively and arranged in an array. The self-restoring electrical cut-off units are located in the through holes respectively. Each self-restoring electrical cut-off unit is electrically connected to one contact and one conductive probe respectively. Therefore, through the above structure, the apparatus can avoid the needle melting phenomenon of the probe head, thereby reducing the opportunity of specific probe failure and improving the continuous electrical detection work.

Description

Technical Field

[0001] This invention relates to a probe card device, and more particularly to a probe card device with circuit protection components. Background Technology

[0002] Generally, semiconductor components, such as dies and wafers, are placed in a test stage (ChipProbe; CP) during the die testing phase. Then, probes on a probe card located above the test stage can press down on the semiconductor components to perform electrical testing on them.

[0003] However, when the probe card performs electrical tests on semiconductor components, a few probes often burn or melt due to fault current, causing specific probe failures and preventing the continuous execution of the corresponding electrical tests. This not only increases the failure rate and maintenance costs but also prolongs the testing time of semiconductor components.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, requiring further improvement. Therefore, effectively addressing these inconveniences and shortcomings is a crucial research and development issue and a pressing goal for improvement in related fields. Summary of the Invention

[0005] One object of the present invention is to provide a probe card device and its circuit protection components to solve the difficulties mentioned in the prior art.

[0006] An embodiment of the present invention provides a probe card device. The probe card device includes a wiring carrier, a probe head, and a circuit protection component. The wiring carrier has a plurality of first contacts. The probe head includes a pin holder and a plurality of first conductive probes. These first conductive probes are respectively arranged on the pin holder. The circuit protection component includes an insulating plate, a plurality of first through holes, and a plurality of self-resetting electrical cut-off units. The insulating plate is sandwiched between the wiring carrier and the probe head. These first through holes are respectively formed on the insulating plate and arranged in an array on the insulating plate. These self-resetting electrical cut-off units are respectively located in these first through holes. Each self-resetting electrical cut-off unit is electrically connected to one of the first contacts and one of the first conductive probes.

[0007] According to one or more embodiments of the present invention, in the probe card device described above, when the temperature of one of the self-recovering electrical cut-off units rises to a critical value, the self-recovering electrical cut-off unit can switch from a conductive state to a de-energized state.

[0008] According to one or more embodiments of the present invention, in the probe card device described above, the critical value is between 150 and 200 degrees Celsius.

[0009] According to one or more embodiments of the present invention, in the probe card device described above, each self-resetting electrical cut-off unit includes a self-resetting fuse, a first solder pad, and a second solder pad. The self-resetting fuse is embedded in a first through hole. The first solder pad is located on the side of the insulating plate facing the wiring carrier and within the first through hole. The first solder pad electrically connects the first contact to one end of the self-resetting fuse. The second solder pad is located on the side of the insulating plate facing the probe head and within the first through hole. The second solder pad electrically connects the first conductive probe to the other end of the self-resetting fuse. The self-resetting fuse is sandwiched between the first solder pad and the second solder pad within the first through hole.

[0010] According to one or more embodiments of the present invention, in the probe card device described above, the self-resetting fuse material is a polymer substrate with a positive temperature coefficient.

[0011] According to one or more embodiments of the present invention, in the probe card device described above, the self-resetting fuse material is a ceramic positive temperature coefficient substrate.

[0012] According to one or more embodiments of the present invention, in the probe card device described above, the wiring carrier further includes a plurality of second contacts surrounding the first contacts. The probe head further includes a plurality of second conductive probes arranged on a pin carrier and surrounding the first conductive probes. The circuit protection assembly further includes a plurality of second through-holes and a plurality of conductive metals. The second through-holes are formed on an insulating plate and surround the first through-holes. The conductive metals are located within the second through-holes. Each conductive metal electrically connects one of the second contacts to one of the second conductive probes.

[0013] According to one or more embodiments of the present invention, in the probe card device described above, these self-recovering electrical cut-off units are respectively a power supply channel or a grounding channel, and these conductive metals are respectively a signal channel.

[0014] According to one or more embodiments of the present invention, in the above-described probe card device, the probe card device is a vertical probe card, and the first conductive probes and the second conductive probes are cobra probes respectively.

[0015] According to one or more embodiments of the present invention, in the probe card device described above, the probe head includes an upper guide plate, a lower guide plate, a base, a plurality of first positioning ports, and a plurality of second positioning ports. The upper guide plate is connected to a circuit protection component. The lower guide plate is opposite to the upper guide plate. The base is sandwiched between the upper and lower guide plates. The first positioning ports are respectively formed on the base and arranged on the base in the array manner described above, for holding the first conductive probes. The second positioning ports are arranged on the base, surrounding the first positioning ports, for holding the second conductive probes.

[0016] According to one or more embodiments of the present invention, in the above-described probe card device, the probe card device further includes a spatial conversion layer. The spatial conversion layer is located between the probe tip and the circuit protection component, and has a plurality of first conductive pads, a plurality of second conductive pads, and a plurality of conductive channels. These first conductive pads and these second conductive pads are respectively arranged on two opposite faces of the spatial conversion layer. These first conductive pads are electrically connected to these self-resetting electrical cut-off units, and these second conductive pads are respectively electrically connected to these first conductive probes. These conductive channels are spaced apart within the spatial conversion layer. Each conductive channel is electrically connected to one of the first conductive pads and one of the second conductive pads. The spacing between any two first conductive pads is greater than the spacing between any two second conductive pads.

[0017] An embodiment of the present invention provides a circuit protection component for a probe card device. The circuit protection component includes an insulating plate, a plurality of first through holes, and a plurality of self-resetting electrical cut-off units. These first through holes are respectively formed on the insulating plate and arranged thereon. These self-resetting electrical cut-off units are respectively embedded within these first through holes to reversibly block the current from the wiring carrier to the conductive probes of the probe head. These self-resetting electrical cut-off units form a patterned array on the insulating plate.

[0018] According to one or more embodiments of the present invention, in the circuit protection assembly described above, when the temperature of one of the self-resetting electrical cut-off units rises to a critical value, the self-resetting electrical cut-off unit changes from a conductive state to a de-energized state.

[0019] According to one or more embodiments of the present invention, in the above-described circuit protection component, the critical value is between 150 and 200 degrees Celsius.

[0020] According to one or more embodiments of the present invention, in the above-described circuit protection assembly, each self-resetting electrical disconnect unit includes a self-resetting fuse, a first solder pad, and a second solder pad. The self-resetting fuse is embedded in a first through-hole. The first solder pad is located on one side of the insulating plate and within the first through-hole. The first solder pad is electrically connected to one end of the self-resetting fuse. The second solder pad is located on the other side of the insulating plate and within the first through-hole. The second solder pad is electrically connected to the other end of the self-resetting fuse. The self-resetting fuse is sandwiched between the first solder pad and the second solder pad within the first through-hole.

[0021] According to one or more embodiments of the present invention, in the above-described circuit protection assembly, the self-resetting fuse material is a high-molecular polymer with a positive temperature coefficient.

[0022] According to one or more embodiments of the present invention, in the above-described circuit protection assembly, the resettable fuse material is a ceramic positive temperature coefficient substrate.

[0023] According to one or more embodiments of the present invention, the circuit protection component further includes a plurality of second through holes and a plurality of conductive metals. These second through holes are respectively formed on an insulating plate and surround the first through holes. The conductive metals are respectively embedded within these second through holes, each conductive metal serving to electrically connect a wiring carrier board to another conductive probe of the probe head.

[0024] According to one or more embodiments of the present invention, in the above-described circuit protection assembly, these self-resetting electrical cut-off units are respectively a power supply channel or a grounding channel, and these conductive metals are respectively a signal channel.

[0025] Thus, through the architecture described in the above embodiments, this disclosure can avoid the chance of probe tip burning or melting, thereby reducing the chance of specific probe failure and improving continuous electrical testing.

[0026] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0027] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0028] Figure 1 This is a schematic diagram of a probe card device according to an embodiment of the present invention;

[0029] Figure 2 for Figure 1 Enlarged cross-sectional view of the circuit protection components;

[0030] Figure 3 This is a schematic diagram of a probe card device according to an embodiment of the present invention;

[0031] Figure 4 for Figure 3 Enlarged cross-sectional view of the circuit protection components; and

[0032] Figure 5 for Figure 3 Top view of the circuit protection components.

[0033] [Symbol Explanation]

[0034] 10, 11: Probe card device

[0035] 100, 101: Wiring carrier board

[0036] 110:Substrate

[0037] 120: First contact point

[0038] 130: Second contact point

[0039] 200, 201: Circuit protection components

[0040] 210: Insulating plate

[0041] 211: First Page

[0042] 212: Second page

[0043] 220: First through hole

[0044] 230: Second through hole

[0045] 240: Self-resetting electrical cut-off unit

[0046] 241: Self-resetting fuse material

[0047] 242: First solder pad

[0048] 243: Second solder pad

[0049] 250: Conductive metal

[0050] 300, 301: Probe head

[0051] 310: Needle Carrier

[0052] 311: Upper guide plate

[0053] 312: Lower guide plate

[0054] 313: base body

[0055] 314: First positioning port

[0056] 315: Second positioning port

[0057] 400: First conductive probe

[0058] 500: Second conductive probe

[0059] 800: Connecting carrier plate

[0060] 810: First conductive pad

[0061] 820: Second conductive pad

[0062] 830: First conductive channel

[0063] 840: Third conductive pad

[0064] 850: Fourth conductive pad

[0065] 860: Second conductive channel

[0066] G1~G4: Spacing

[0067] B1~B4: Solder balls

[0068] C: Central District

[0069] S: Surrounding area Detailed Implementation

[0070] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the invention. Furthermore, for the sake of simplicity, some conventional structures and elements will be illustrated in the drawings in a simple schematic manner.

[0071] Figure 1 This is a schematic diagram of a probe card device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 Enlarged cross-sectional view of the circuit protection component 200. (See attached image.) Figure 1 and Figure 2 As shown, the probe card device 10 includes a wiring carrier 100, a circuit protection component 200, and a probe head 300. The wiring carrier 100 includes a substrate 110 and a plurality of first contacts 120. These first contacts 120 are spaced apart on one side of the substrate 110 and arranged in an array on the substrate 110. The probe head 300 includes a pin holder 310 and a plurality of first conductive probes 400. The pin holder 310 is located on one side of the wiring carrier 100. These first conductive probes 400 are spaced apart on the pin holder 310 and arranged in the array as described above. These first conductive probes 400 are used to contact a conductive protrusion (not shown) of a test object. The circuit protection component 200 is located between the wiring carrier 100 and the probe head 300, and the circuit protection component 200 includes an insulating plate 210, a plurality of first through holes 220, and a plurality of self-resetting electrical cut-off units 240. An insulating plate 210 is located between a substrate 110 and a pin carrier 310. First through holes 220 are formed on the insulating plate 210 and arranged in an array. Self-resetting electrical cut-off units 240 are embedded within these first through holes 220; in other words, the self-resetting electrical cut-off units 240 form a patterned array on the insulating plate 210. Each self-resetting electrical cut-off unit 240 is in a conductive state at room temperature and is electrically connected to the first contact 120 of the wiring carrier 100 and the first conductive probe 400 of the probe head 300. Therefore, the detection current can travel from the first contact 120 of the wiring carrier 100 through the self-resetting electrical cut-off unit 240 to the corresponding first conductive probe 400 for detection of the test object.

[0072] Thus, when a fault current flows from the wiring carrier 100 to one of the self-resetting electrical cut-off units 240 of the circuit protection component 200, the self-resetting electrical cut-off unit 240 instantly cuts off the power flow between the wiring carrier 100 and the circuit protection component 200, so as to protect the first conductive probe 400 from burning or melting, reduce the chance of probe failure, and thus improve the continuous electrical detection work.

[0073] In this embodiment, the probe card device 10 further includes a connecting carrier plate 800 (e.g., a space conversion layer). The connecting carrier plate 800 is fixed to one side of the probe head 300 and is located between the circuit protection component 200 and the probe head 300. The connecting carrier plate 800 has a plurality of first conductive pads 810, a plurality of second conductive pads 820, and a plurality of first conductive channels 830. The first conductive pads 810 are respectively arranged on the side of the connecting carrier plate 800 facing the probe head 300, and each first conductive pad 810 is electrically connected to one of the self-resetting electrical cut-off units 240. The second conductive pads 820 are configured opposite to the first conductive pads 810 and are respectively arranged on the side of the connecting carrier plate 800 facing the probe head 300. Each second conductive pad 820 is electrically connected to one of the first conductive probes 400. The first conductive channels 830 are spaced apart within the connecting carrier plate 800. Each first conductive channel 830 is electrically connected to one of the first conductive pads 810 and one of the second conductive pads 820. The spacing G1 of any two first conductive pads 810 is greater than the spacing G2 of any two second conductive pads 820. For example, the probe card device 10 is a vertical probe card; the insulating plate 210 is a ceramic substrate 110, which has strong mechanical properties and low warpage, and the first conductive probes 400 are cobra probes.

[0074] Thus, when the fault current causes the self-resetting power cut-off unit 240 to heat up, and its temperature rises to a critical value, the corresponding self-resetting power cut-off unit 240 can switch from a conductive state to a de-energized state, thereby instantly cutting off the power flow between the wiring carrier board 100 and the circuit protection component 200. More specifically, in this embodiment, the critical value is between 150 and 200 degrees Celsius; however, the invention is not limited thereto.

[0075] More specifically, such as Figure 2As shown, the insulating plate 210 has a first surface 211 and a second surface 212 facing each other. The first surface 211 of the insulating plate 210 faces the wiring carrier 100, and the second surface 212 of the insulating plate 210 faces the probe head 300. Each first through hole 220 penetrates the insulating plate 210 and simultaneously connects the first surface 211 and the second surface 212 of the insulating plate 210. Each self-resetting electrical disconnect unit 240 includes a self-resetting fuse 241, a first solder pad 242, and a second solder pad 243. The self-resetting fuse 241 is embedded in one of the first through holes 220. A portion of the first solder pad 242 is located in the first through hole 220, and another portion is located on the first surface 211 of the insulating plate 210. The first solder pad 242 is electrically connected to a first contact 120 and one end of the self-resetting fuse 241, and the first solder pad 242 is soldered to one of the first contacts 120, for example, through a solder ball B1. A portion of the second solder pad 243 is located within the first through hole 220, and another portion is located on the second surface 212 of the insulating plate 210. The second solder pad 243 electrically connects the first conductive probe 400 to the other end of the resettable fuse 241. More specifically, the second solder pad 243 is soldered, for example, through solder ball B2 to one of the first conductive pads 810, the corresponding first conductive channel 830, and the corresponding second conductive pad 820 of the connecting carrier 800, thereby electrically connecting the first conductive probe 400. The resettable fuse 241 is located only within the corresponding first through hole 220 and is directly and sealingly sandwiched between the corresponding first solder pad 242 and the corresponding second solder pad 243.

[0076] More specifically, these self-resetting fuse materials 241 are made of a polymer with a positive temperature coefficient (PPTC) substrate. The PPTC substrate is made of a mixture of semi-crystalline polymer and conductive particles to maintain low resistance at room temperature. Thus, when a peak current exceeds a critical temperature, the internal crystals melt and change structure, causing the resistance to rise sharply to millions of ohms, thereby cutting off the conductive path. Conversely, when the PPTC substrate cools and returns to room temperature, it recrystallizes, allowing the conductive particles to reopen the conductive path.

[0077] It should be understood that, compared to disposable fuses, the self-resetting fuse 241 of this embodiment can be reused for a long time. Its normal operating resistance can be as low as 10 milliohms (Ohms), and it can reach megaohms (mega-Ohms) when subjected to peak current to avoid probe damage. However, the present invention is not limited to this. In other embodiments, these self-resetting fuses 241 can also be ceramic positive temperature coefficient (CPTC) substrates.

[0078] Figure 3 This is a schematic diagram of a probe card device 11 according to an embodiment of the present invention. Figure 4 for Figure 3 Enlarged cross-sectional view of circuit protection component 201. Figure 5 for Figure 3 The top view of the circuit protection component 201. (See attached image.) Figures 3 to 5 As shown, the probe card device 11 of this embodiment is substantially the same as the probe card device 10 described above, except that the wiring carrier 101 further includes a plurality of second contacts 130. These second contacts 130 are spaced apart on the surface of the substrate 110 and spaced apart around the first contacts 120. The first contacts 120 are used to transmit power or ground signals, and the second contacts 130 are used to transmit information signals. The probe head 301 further includes a plurality of second conductive probes 500, which are respectively arranged on the pin holder 310 and around the first conductive probes 400.

[0079] The first conductive probes 400 are used to contact the power or ground pins (not shown) of the device under test (DUT), and the second conductive probes 500 are used to contact the signal pins (not shown) of the DUT. The circuit protection assembly 201 also includes a plurality of second through-holes 230 and a plurality of conductive metals 250. The second through-holes 230 are formed on the insulating plate 210, and the conductive metals 250 are located within the second through-holes 230 surrounding the first through-holes 220. Each conductive metal 250 is electrically connected to one of the second contacts 130 and one of the second conductive probes 500. For example, one end of the conductive metal 250 is soldered to the second contact 130 via a solder ball B3, and the other end is soldered to one of the second conductive probes 500 via a solder ball B4. More specifically, this conductive metal 250 is connected to the second conductive probe 500 via a corresponding solder ball B4 and a connecting carrier 800.

[0080] Furthermore, the connecting carrier 800 has a plurality of third conductive pads 840, a plurality of fourth conductive pads 850, and a plurality of second conductive channels 860. The third conductive pads 840 are arranged on the side of the connecting carrier 800 facing the probe tip 300 and surrounding the first conductive pad 810. Each third conductive pad 840 is electrically connected to a conductive metal 250 via a solder ball B4. The fourth conductive pads 850 are positioned opposite the third conductive pads 840 and are arranged on the side of the connecting carrier 800 facing the probe tip 300 and surrounding the third conductive pads 840. Each fourth conductive pad 850 is electrically connected to a second conductive probe 500. The second conductive channels 860 are spaced apart within the connecting carrier 800. Each second conductive channel 860 is electrically connected to one third conductive pad 840 and one fourth conductive pad 850. The spacing G3 between any two third conductive pads 840 is greater than the spacing G4 between any two fourth conductive pads 850.

[0081] The insulating plate 210 of the circuit protection assembly 201 is divided into a central area C and a surrounding area S. The surrounding area S surrounds the central area C. The first through-hole 220 and the self-resetting electrical cut-off unit 240 are both located entirely within the central area C, and these self-resetting electrical cut-off units 240 are power channels or ground channels used to transmit the aforementioned power or ground signals. The second through-hole 230 and the conductive metal 250 are both located entirely within the surrounding area S, and these conductive metal 250 are signal channels used to transmit the aforementioned information signals.

[0082] Furthermore, the needle holder 310 includes an upper guide plate 311, a lower guide plate 312, a body 313, a plurality of first positioning ports 314, and a plurality of second positioning ports 315. The upper guide plate 311 is connected to the circuit protection assembly 201. The lower guide plate 312 is opposite to the upper guide plate 311. The body 313 is sandwiched between the upper guide plate 311 and the lower guide plate 312. The first positioning ports 314 are respectively formed on the body 313 and arranged on the body 313 in the array manner described above, for holding the first conductive probes 400. The second positioning ports 315 are arranged on the body 313, surrounding the first positioning ports 314, for holding the second conductive probes 500.

[0083] It should be understood that the number of self-recovering electrical cut-off units 240 in the figures is only an example. For example, the number of self-recovering electrical cut-off units 240 may be as high as thousands or even tens of thousands. However, the present invention is not limited thereto.

[0084] Thus, through the architecture described in the above embodiments, this disclosure can avoid the chance of probe tip burning or melting, thereby reducing the chance of specific probe failure and improving continuous electrical testing.

[0085] Finally, the embodiments disclosed above are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit and scope of the present invention are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the scope defined in the appended claims.

Claims

1. A probe card device, characterized in that, Include: A wiring carrier board with multiple first contacts; A probe head includes a needle carrier and a plurality of first conductive probes, the first conductive probes being arranged on the needle carrier; and A circuit protection component, comprising: An insulating plate is sandwiched between the wiring carrier and the probe head. The insulating plate has a first side and a second side facing each other. The first side of the insulating plate faces the wiring carrier, and the second side of the insulating plate faces the probe head. Multiple first through holes are formed on the insulating plate and arranged in an array. Each first through hole penetrates the insulating plate and simultaneously connects the first surface and the second surface of the insulating plate. Multiple self-resetting electrical cut-off units are respectively located within the first through holes. Each self-resetting electrical cut-off unit is electrically connected to one of the first contacts and one of the first conductive probes to reversibly block the current from the wiring board to the first conductive probe. Each self-resetting electrical cut-off unit includes a self-resetting fuse, a first solder pad, and a second solder pad. The self-resetting fuse is embedded in one of the first through holes. A portion of the first solder pad is located within one of the first through holes, and another portion is located on the first surface of the insulating plate. The first solder pad is electrically connected to one of the first contacts and one end of the self-resetting fuse. A portion of the second solder pad is located within one of the first through holes, and another portion is located on the second surface of the insulating plate. The second solder pad is electrically connected to one of the first conductive probes and the other end of the self-resetting fuse. The self-resetting fuse is sandwiched between the first solder pad and the second solder pad within one of the first through holes.

2. The probe card device as described in claim 1, characterized in that, When the temperature of one of these self-resetting electrical cut-off units rises to a critical value, that self-resetting electrical cut-off unit can switch from a conductive state to a de-energized state.

3. The probe card device as described in claim 2, characterized in that, The critical value is between 150 and 200 degrees Celsius.

4. The probe card device as described in claim 1, characterized in that, The self-resetting fuse material is a high-molecular polymer with a positive temperature coefficient.

5. The probe card device as described in claim 1, characterized in that, The self-resetting fuse material is a ceramic positive temperature coefficient substrate.

6. The probe card device as described in claim 1, characterized in that, The wiring carrier also includes a plurality of second contacts surrounding the first contacts; The probe tip also includes a plurality of second conductive probes, which are respectively arranged on the needle carrier and surround the first conductive probes; and The circuit protection assembly also includes a plurality of second through holes and a plurality of conductive metals. The second through holes are respectively formed on the insulating plate and surround the first through holes. The conductive metals are respectively located in the second through holes. Each of the conductive metals is electrically connected to one of the second contacts and one of the second conductive probes.

7. The probe card device as described in claim 6, characterized in that, These self-recovering electrical cut-off units are either a power supply channel or a grounding channel, and these conductive metals are either a signal channel or a signal channel.

8. The probe card device as described in claim 6, characterized in that, The probe card device is a vertical probe card, and the first conductive probes and the second conductive probes are cobra probes.

9. The probe card device as described in claim 8, characterized in that, The probe head contains: The upper guide plate connects to the circuit protection component; The lower guide plate corresponds to the upper guide plate; A single body, sandwiched between the upper guide plate and the lower guide plate; Multiple first positioning ports are formed on the base body and arranged on the base body in the array manner to hold the first conductive probes. as well as Multiple second positioning ports are arranged on the base body, surrounding the first positioning ports, to hold the second conductive probes.

10. The probe card device as claimed in claim 1, characterized in that, Also includes: A spatial transition layer, located between the probe head and the circuit protection component, has multiple first conductive pads, multiple second conductive pads, and multiple conductive channels. The first conductive pads and the second conductive pads are respectively arranged on two opposite surfaces of the spatial transition layer. The first conductive pads are electrically connected to the self-resetting electrical cut-off units, and the second conductive pads are respectively electrically connected to the first conductive probes. The conductive channels are arranged at intervals within the spatial transition layer. Each conductive channel is electrically connected to one of the first conductive pads and one of the second conductive pads, wherein the distance between any two of the first conductive pads is greater than the spacing between any two of the second conductive pads.

11. A circuit protection component for a probe card device, characterized in that, Suitable for clamping between a wiring carrier and a probe head, characterized in that the circuit protection assembly comprises: An insulating plate having a first side and a second side facing each other, the first side facing the wiring carrier and the second side facing the probe head; Multiple first through holes are formed on the insulating plate and arranged thereon. Each first through hole penetrates the insulating plate and simultaneously connects the first surface and the second surface of the insulating plate. Multiple self-resetting electrical cut-off units are respectively embedded in the first through-holes to reversibly interrupt the current from the wiring carrier to a conductive probe of the probe head. The self-resetting electrical cut-off units are formed in a pattern array on the insulating plate. Each self-resetting electrical cut-off unit includes a self-resetting fuse, a first solder pad, and a second solder pad. The self-resetting fuse is embedded in one of the first through-holes. A portion of the first solder pad is located in one of the first through-holes, and another portion is located on the first surface of the insulating plate. The first solder pad is electrically connected to one end of the self-resetting fuse. A portion of the second solder pad is located in one of the first through-holes, and another portion is located on the second surface of the insulating plate. The second solder pad is electrically connected to the other end of the self-resetting fuse. The self-resetting fuse is sandwiched between the first solder pad and the second solder pad within one of the first through holes.

12. The circuit protection component of the probe card device as described in claim 11, characterized in that, When the temperature of one of these self-resetting electrical cut-off units rises to a critical value, one of the self-resetting electrical cut-off units changes from a conductive state to a de-energized state.

13. The circuit protection component of the probe card device as described in claim 12, characterized in that, The critical value is between 150 and 200 degrees Celsius.

14. The circuit protection component of the probe card device as described in claim 11, characterized in that, The self-resetting fuse material is made of a high-molecular polymer with a positive temperature coefficient.

15. The circuit protection component of the probe card device as described in claim 11, characterized in that, The self-resetting fuse material is a ceramic positive temperature coefficient substrate.

16. The circuit protection component of the probe card device as described in claim 11, characterized in that, Also includes: Multiple second through holes are formed on the insulating plate and surround the first through holes; and Multiple conductive metals are embedded in the second through holes, and each of the conductive metals is used to electrically connect the wiring carrier to another conductive probe of the probe head.

17. The circuit protection component of the probe card device as described in claim 16, characterized in that, These self-recovering electrical cut-off units are either a power supply channel or a grounding channel, and these conductive metals are either a signal channel or a signal channel.

Images