Fluid distribution assembly and cooling system comprising the same
Patent Information
- Application Number
- CN202210750757.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-06
- Filing Date
- 2022-06-28
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2042-06-28
AI Technical Summary
[0009]根据本发明前述实施例所公开的流体分布组件与包括其的冷却系统,由于流体分布组件具有可罩覆热源的罩体以及连通于罩体的冷却液腔室以用于驱使冷却液腔室内的流体流出于外的流体驱动构件的配置,使得冷却系统只需相应所需冷却的热源与散热鳍片等构件的整体体积提供适量的冷却液,即可有效地对热源与散热鳍片进行冷却,因而并不需要如传统做法将外壳件内的冷却液注入至整体高度盖过热源与散热鳍片的程度。换句话说,相较于传统做法,本发明前述实施例所公开的流体分布组件至少省下了设备槽体的容置空间与罩体的冷却液腔室在罩体的内外液面高度的容积差。这在单相式冷却液的成本高昂的情况下,本发明前述实施例的冷却系统可借由流体分布组件在达到有效冷却热源的同时,解决传统需要大量使用冷却液所产生的成本负担。
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Figure CN117062386B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a cooling device, and more particularly to a fluid distribution component and a cooling system including the same. Background Technology
[0002] With the rapid development of technology, especially in an era of dramatically increased demand for networks, artificial intelligence, and cloud services, data centers are processing ever-growing volumes of data. To maintain or improve their processing efficiency, continuous and effective cooling is essential. However, due to the high power density of data centers, the heat generated is enormous, and traditional cooling methods require increasing power or scale. This approach is extremely energy-intensive, significantly increasing costs and environmental impact.
[0003] Therefore, water-cooling technologies such as immersion cooling have gained increasing attention in recent years. Specifically, immersion cooling equipment immerses heat sources in data centers, such as motherboards and their electronic components, in a non-conductive coolant. Because the electronic components can fully contact the coolant, immersion cooling achieves higher heat dissipation efficiency than traditional air cooling. Furthermore, immersion cooling eliminates the need for fans, helping to reduce energy consumption, cost, operating noise, and space requirements. Due to these advantages, immersion cooling technology is gradually replacing air cooling.
[0004] Broadly speaking, immersion cooling can be divided into two types: two-phase and single-phase. The former utilizes the low boiling point of the coolant, using vaporization from liquid to gas to remove heat, and then condensing and recovering the gas through a condenser above the liquid surface, achieving the purpose of coolant recycling. The latter involves immersing the entire system requiring heat dissipation in the coolant, taking advantage of the coolant's high specific heat to remove more heat. However, for single-phase systems, the high cost of coolant means that using large quantities can impose a significant cost burden.
[0005] As Figure 1 For example, it illustrates a conventional single-phase immersion cooling system, which generally involves covering the heat source 71 and heat dissipation fins 72 on the circuit board 90 with a housing 911 containing space 911. In order for the coolant 8 to completely immerse the heat source 71 and heat dissipation fins 72, the coolant 8 needs to fill the internal space of the housing 91 to the point that the height of the liquid level 81' is higher than the height of the heat dissipation fins 72. It is evident that the conventional method requires a large amount of coolant. Summary of the Invention
[0006] In view of this, one object of the present invention is to provide a fluid distribution component and a cooling system including the same, which helps to achieve the required heat dissipation performance with less coolant consumption, thereby effectively solving the related problems caused by the aforementioned conventional single-phase heat dissipation methods.
[0007] According to some embodiments of the present invention, a fluid distribution assembly is provided, which is adapted to at least one heat source and includes at least one enclosure and at least one fluid drive member, the enclosure surrounding and defining a coolant chamber, the enclosure being adapted to cover the heat source which is housed in the coolant chamber, and the fluid drive member communicating with the coolant chamber for driving fluid out of the coolant chamber.
[0008] According to some embodiments of the present invention, a cooling system is provided, which is adapted to at least one heat source and includes a device tank and at least one fluid distribution assembly. The device tank defines a receiving space and has a tank inlet and a tank outlet that are opposite to each other and communicate with the receiving space. The fluid distribution assembly includes at least one cover and at least one fluid driving member. The cover is received in the receiving space and defines a coolant chamber. The cover is adapted to cover the heat source so that the heat source is received in the coolant chamber. The fluid driving member communicates with the coolant chamber to drive the fluid in the coolant chamber to flow out.
[0009] According to the fluid distribution assembly and cooling system disclosed in the foregoing embodiments of the present invention, since the fluid distribution assembly has a cover that can cover the heat source and a fluid drive member communicating with the coolant chamber in the cover for driving the fluid in the coolant chamber to flow out, the cooling system only needs to provide an appropriate amount of coolant corresponding to the overall volume of the heat source and heat dissipation fins to effectively cool the heat source and heat dissipation fins. Therefore, it is not necessary to inject coolant into the outer casing to the extent that the overall height covers the heat source and heat dissipation fins, as in the conventional method. In other words, compared with the conventional method, the fluid distribution assembly disclosed in the foregoing embodiments of the present invention saves at least the accommodating space of the equipment tank and the volume difference of the coolant chamber in the cover in terms of the liquid level height inside and outside the cover. In the case of the high cost of single-phase coolant, the cooling system of the foregoing embodiments of the present invention can solve the cost burden caused by the traditional need to use a large amount of coolant while effectively cooling the heat source by means of the fluid distribution assembly.
[0010] The above description of the disclosure of this invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of this invention, and to provide a further explanation of the scope of this patent application. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the fluid flow in a traditional single-phase immersion cooling system.
[0012] Figure 2 This is a perspective view of a cooling system according to an embodiment of the present invention.
[0013] Figure 3 This is for Figure 2 A three-dimensional exploded view of the fluid distribution components.
[0014] Figure 4 This is for Figure 2 A side-section exploded view of the fluid distribution components and support plate.
[0015] Figures 5-7 This is for Figure 2 A schematic diagram of the flow of coolant in the fluid distribution components after the cooling system is started.
[0016] Figure 8 This is for Figure 2 A schematic diagram of the flow field simulation at the fluid distribution component of the cooling system.
[0017] Figure 9 This is a schematic diagram of a cooling system according to another embodiment of the present invention.
[0018] The reference numerals in the attached figures are explained as follows: 1, 1': Fluid distribution components 2, 2': Cooling system 7: Equipment tank 8: Coolant 10: Cover 11: Coolant Chamber 12: Chamber liquid inlet 13: Chamber liquid outlet 20: Fluid-driven components 30: Guiding tube 31: Connecting end 32: Liquid outlet end 70: Storage space 71: Tank inlet 72: Tank outlet 91: Housing components 90: Circuit board 81, 81': Liquid surface 911: Storage Space CDU: Coolant Distribution Unit B: Bottom F: Heat dissipation fins H: Heat source h1-h3: Height L1-L2: Length O: Opening P: Support plate T: Top W1-W2: Width Detailed Implementation
[0019] The present invention will now be described in sufficient detail, with reference to the accompanying drawings and other embodiments, to enable those skilled in the art to thoroughly understand and practice the invention. However, it should be understood that the following description is not intended to limit the invention to certain specific embodiments. Rather, it is intended to cover substitutions, modifications, and equivalents to the various embodiments defined in the claims. Furthermore, for ease of understanding and viewing, various features in the drawings may not be drawn to scale.
[0020] The following text may use terms such as “substantially,” “about,” and “probably” to describe a reasonable or acceptable deviation from the modified situation or event that may still achieve the expected result. The following text may also use “at least one” to describe the quantity of the described items, but unless explicitly stated otherwise, it should not be limited to the case of “only one.” The following text may also use the term “and / or,” which should be understood to include any of the listed items and all combinations of one or more. The following text may also use terms such as “connected,” “linked,” and “set up” to describe the relative positional relationship of multiple described items, but unless explicitly stated otherwise, it should not be limited to the case where a described item is “connected,” “linked,” or “set up” to another described item directly without an intermediary, but can be understood to include the case where one or more intermediaries may be present between the described items. The following text may also use terms such as “connected” to describe the relationship between two spaces, areas, channels, passages, and / or openings. Unless otherwise stated, “connected” in the following text specifically refers to the case where fluids such as air or liquids can flow between the described items.
[0021] Please see Figure 2 One embodiment of the present invention provides a cooling system 2, which may include a tank 7 and at least one fluid distribution component 1. The fluid distribution component 1 is adapted to be housed in the tank 7, and the tank 7 is adapted to be externally connected to an external drive device. For example, the tank 7 may be connected to one or more external coolant distribution units (CDUs) through suitable pipes (not labeled), thereby receiving coolant 8 from the coolant distribution units (CDUs). The coolant 8 may be driven by the coolant distribution units (CDUs) to continuously flow in the flow path formed by the tank 7, the coolant distribution units (CDUs), and the related pipes, thereby forming a cooling cycle. It should be noted that the coolant distribution units (CDUs) shown in the illustrations are for illustrative purposes only, and the present invention is not limited to coolant distribution units (CDUs) or their types, models, quantities, etc.
[0022] Furthermore, the equipment tank 7 may have a accommodating space 70 and a tank inlet 71 and a tank outlet 72 respectively connected to opposite sides of the accommodating space 70. For example, the tank inlet 71 and the tank outlet 72 may be connected to opposite sides of the accommodating space 70. The accommodating space 70 refers to the area of the equipment tank 7 used to accommodate the fluid distribution assembly 1, coolant 8, or other related electronic / non-electronic components, but the present invention is not limited to its size, shape, etc. The tank inlet 71 refers to the opening of the equipment tank 7 used to receive coolant 8 from the outside so that the coolant 8 can flow into the accommodating space 70, and is therefore suitable for external connection to the aforementioned coolant distribution device CDU via suitable piping, but the present invention is not limited to the tank inlet 71 and its size, shape, number, position, etc. The aforementioned tank outlet 72 refers to the opening in the equipment tank 7 for discharging the coolant 8 from the containing space 70, and is therefore suitable for external connection to the aforementioned coolant distribution device CDU via a suitable pipeline. However, the present invention is not limited to the tank outlet 72 and its size, shape, quantity, position, etc.
[0023] Furthermore, the coolant 8 used herein can be, but is not limited to, any suitable non-conductive cooling solution. Therefore, the coolant 8 is a substance suitable for direct thermal contact with a heat source and capable of effectively absorbing the heat energy generated by the heat source, but the present invention is not limited to the coolant 8 and its types and physical properties.
[0024] Please continue here. Figure 2 Please refer to the following: Figures 3-4 As shown in the figure, the equipment tank 7 can be set on a support plate P in any suitable manner. Therefore, it can also be said that the aforementioned accommodating space 70 is defined by the inner wall surface of the equipment tank 7 and the surface of the support plate P. In this case, the equipment tank 7 and the support plate P can be regarded as forming a hollow box that is only connected to the outside by the tank inlet 71 and the tank outlet 72.
[0025] The support plate P is suitable for supporting the required electronic / non-electronic components or modules. For example, the support plate P can be a circuit board on which one or more heat sources H can be supported. The heat source H can be, but is not limited to, any electronic component that generates heat during operation and requires heat dissipation. For example, the heat source H can be a central processing unit. However, it should be noted that the heat source H is provided for illustrative purposes only, and the present invention is not limited to the heat source H or its type, quantity, size, or scale. In addition, optionally, a heat sink F can be mounted on the heat source H. The heat sink F can be, but is not limited to, any suitable and common heat sink fin, which is adapted to be in thermal contact with the heat source H to absorb the heat generated by the heat source H, thereby dissipating the absorbed heat from its surface to the outside.
[0026] To more effectively utilize the coolant 8 to cool the heat source H and heat dissipation fins F supported on the support plate P, the heat source H and heat dissipation fins F can be housed within the fluid distribution assembly 1. Specifically, in this embodiment, the fluid distribution assembly 1 may include at least one cover 10 and at least one fluid drive member 20. The cover 10 is a hollow box made of any suitable material, which may define a coolant chamber 11, and the cover 10 has an opening O on one side of the coolant chamber 11. Therefore, the cover 10 is adapted to cover the heat source H and heat dissipation fins F and house the heat source H and heat dissipation fins F within its coolant chamber 11.
[0027] Furthermore, the cover 10 may also have at least one chamber inlet 12 and at least one chamber outlet 13 communicating with the coolant chamber 11. Here, the cover 10 may be defined as having a top T and a bottom B opposite each other, to illustrate the relative positional relationship of the chamber inlet 12 and the chamber outlet 13 on the cover 10. The top T refers to the portion of the cover 10 that is relatively far from the support plate P under normal use, for example, the top plate of the cover 10. The bottom B refers to the portion of the cover 10 that is relatively close to or used for direct mounting on the support plate P under normal use, for example, the bottom edge or bottom region of each side plate of the cover 10. It can be understood that the aforementioned opening O may be defined by the bottom B (or, the bottom edge of each side plate of the cover 10). In other words, the top T and the opening O (or the bottom B) refer to the portions of the cover 10 that are relatively far from and relatively close to the support plate P, respectively.
[0028] The chamber inlet 12 and chamber outlet 13 are located on opposite sides of the cover 10, with the chamber inlet 12 situated at the bottom B (or opening O) of the cover 10. For example, the chamber inlet 12 may be an opening formed by a recess in the edge of the bottom B region of one side plate of the cover 10. The chamber outlet 13 may be located at or adjacent to the top T of the cover 10. In short, the chamber inlet 12 and chamber outlet 13 are opposite to each other, and their distances relative to the support plate P are different; or, the chamber inlet 12 and chamber outlet 13 are opposite to each other, and the position of the chamber outlet 13 is higher than that of the chamber inlet 12 relative to the support plate P.
[0029] The fluid drive component 20 can be, but is not limited to, any suitable pump. The fluid drive component 20 can, for example, be housed in the coolant chamber 11 of the housing 10 and adjacent to the chamber outlet 13 of the housing 10. In this configuration, when the fluid drive component 20 is in operation, the fluid (including gas and liquid) within the coolant chamber 11 can be discharged to the outside via the chamber outlet 13.
[0030] Optionally, a guide tube 30 may be externally connected to the chamber outlet 13 of the cover 10 in this embodiment. As shown in the figure, the guide tube 30 may have a connecting end 31 and an outlet end 32 facing each other. The connecting end 31 can be used to connect to the chamber outlet 13 of the cover 10 to receive gas and liquid discharged from the chamber outlet 13. The outlet end 32 can be used to discharge the gas and liquid received by the guide tube 30 to the outside. Further, the guide tube 30 in this embodiment has a shape that extends from the chamber outlet 13 to the support plate P, so that its outlet end 32 is close to the support plate P. For example, the liquid outlet 32 of the guide tube 30 may extend to be flush with the upper edge of the chamber inlet 12 of the cover 10; or, the liquid outlet 32 of the guide tube 30 may be aligned with the chamber inlet 12 of the cover 10; more specifically, the liquid outlet 32 of the guide tube 30 may be aligned with the side of the chamber inlet 12 of the cover 10 that is relatively far from the opening O. However, it should be noted that the present invention is not limited to the guide tube 30 and its shape, length, etc.; for example, in other embodiments, the chamber outlet 13 of the cover 10 may not be externally connected to any guide tube.
[0031] Next, please refer to the following: Figures 5-7 The specific purpose and effect of the fluid distribution component 1 will be explained by observing the flow of coolant 8 at the fluid distribution component 1 after the cooling system 2 is started. First, as... Figure 5 As can be seen, the electronic devices to be cooled, such as the heat source H and the heat sink fins F, are located in the coolant chamber 11 of the cover 10 of the fluid distribution assembly 1, and the coolant 8 can gradually enter the accommodating space 70 from the tank inlet 71 of the equipment tank 7. Since the chamber inlet 12 of the cover 10 is located at the bottom B of the cover 10 (or adjacent to the opening O), the coolant 8 can enter the coolant chamber 11 of the cover 10 through the chamber inlet 12. As the coolant 8 is gradually injected into the accommodating space 70, the height of the coolant level 81 gradually rises and exceeds the height of the chamber inlet 12 of the cover 10.
[0032] At the same time or subsequently, such as Figure 6The fluid drive component 20 located at the chamber outlet 13 in the fluid distribution assembly 1 can be activated to discharge the gas in the coolant chamber 11 from the chamber outlet 13 to the outside of the cover 10, thereby making the pressure in the coolant chamber 11 lower than the pressure outside the coolant chamber 11, and thus driving the liquid level 81' of the coolant 8 in the coolant chamber 11 to gradually rise. During the process, since the accommodating space 70 of the equipment tank 7 can be connected to the outside through the tank outlet 72, the accommodating space 70 (other than the coolant chamber 11 defined by the cover 10) and the outside of the accommodating space 70 can maintain pressure balance. Therefore, the liquid level 81 outside the cover 10 can maintain substantially the same water level or height during the operation of the fluid drive component 20 (or, in other words, during the gradual rise of the liquid level 81' in the coolant chamber 11).
[0033] Next, as the fluid drive component 20 continues to operate, the liquid level 81' of the coolant 8 in the coolant chamber 11 will rise above the height of the heat source H and the heat dissipation fins F due to the internal and external pressure difference, and may even fill the coolant chamber 11. Specifically, as... Figure 7 Taking the support plate P as a reference, when the liquid level 81' of the coolant 8 rises above the heat source H and the heat dissipation fins F, it can have a height of h1, and h1 is at least higher than the height h2 of the heat source H and the height h3 of the heat dissipation fins; in other words, this refers to the situation where the heat source H and the heat dissipation fins F in the coolant chamber 11 are sufficiently submerged in the coolant 8. In this way, the coolant 8 in the coolant chamber 11 can be discharged from the chamber outlet 13 of the cover 10 outside the cover 10, and the heat energy generated by the heat source H and the heat dissipation fins F can be directly transferred to the coolant 8 and discharged outside through the flow of the coolant 8. (In conjunction with the aforementioned...) Figure 2 Understandably, with the operation of the coolant distribution unit (CDU), coolant 8 will be continuously supplied through... Figure 7 The area indicated by the arrow allows for continuous cooling of the heat source H and the heat dissipation fins F, thus forming a... Figure 8 The flow field shown.
[0034] Due to the aforementioned design of the fluid distribution component 1 in the above embodiments of the present invention, the heat source H and heat sink F, and other electronic components, can be effectively cooled with only an appropriate amount of coolant (such as the volume of the coolant chamber 11 of the housing 10), without the need to inject coolant into the housing to the extent that the overall height covers the heat source and heat sink fins, as is the case in the conventional method. Specifically, compared with the aforementioned Figure 1 and Figure 7Compared to conventional methods, the fluid distribution component 1 of the foregoing embodiments of the present invention saves at least the volume difference between the liquid level 81 and the liquid level 81' of the equipment tank 7 and the coolant chamber 11 of the cover 10. In one practical example, if the fluid distribution component 1 of the foregoing embodiments of the present invention uses a 1U 19-inch equipment tank 7 with a single-phase coolant costing approximately US$180 per liter, a 1 cm drop in the overall coolant level of the equipment tank 7's storage space can save approximately 3.74 liters of coolant, resulting in a coolant cost saving of approximately US$673.2. In another practical example, if the fluid distribution component 1 of the foregoing embodiments of the present invention uses a 2U 19-inch equipment tank 7 with a single-phase coolant costing approximately US$180 per liter, a 1 cm drop in the overall coolant level of the equipment tank 7's storage space can save approximately 20.2 liters of coolant, resulting in a coolant cost saving of approximately US$3636. Therefore, since the cooling system 2 of the aforementioned embodiment of the present invention employs the fluid distribution component 1, it is more efficient than... Figure 1 The traditional approach can effectively cool the heat source while avoiding the cost burden caused by the large-scale use of coolant.
[0035] Additionally, it should be noted that the dimensions of the cover 10 can be adjusted and modified according to the needs of practical applications. For example, in order to ensure that the coolant level 8 in the coolant chamber 11 of the cover 10 exceeds the height of the heat source to be cooled within the cover 10 (such as the aforementioned heat source H and heat dissipation fins F), the height of the cover 10 must be at least higher than the height of the heat source H, the heat dissipation fins F, or their stacked height. For example, in a practical case, the stacked heat source H and heat dissipation fins F may have a height of approximately 30 mm, and the height of the cover 10 suitable for this case may be approximately 50 mm.
[0036] Alternatively, in order to ensure that the coolant 8 in the coolant chamber 11 of the cover 10 can fully contact the areas of the heat source to be cooled (e.g., the aforementioned heat source H and heat dissipation fins F), the width and length of the cover 10 may be at least greater than the width and length of the heat source H, the heat dissipation fins F, or their stacked dimensions. Specifically, as... Figure 3The shroud 10 may have a width of W1 and a length of L1. The overall structure of the heat source H and the heat sink F stacked together may have a width of W2 and a length of L2, where W1 is at least greater than W2 and L1 is at least greater than L2. For example, in a practical case, the heat source H and the heat sink F stacked together may have a width of approximately 80 mm and a length of 120 mm, and the shroud 10 used thereto may have a width of approximately 90 mm and a length of 160 mm. In some embodiments, the width of the shroud 10 may be maintained at 1.1 times or more of the overall width of the heat source H and the heat sink F, and the length of the shroud 10 may be maintained at 1.3 times or more of the overall width of the heat source H and the heat sink F, but this ratio is merely an example and not intended to limit the invention.
[0037] Furthermore, it should be noted that the control of the fluid drive component 20 used in the aforementioned fluid distribution assembly 1 can employ any suitable means, such as proportional-integral-derivative (PID) control or linear control, but the present invention is not limited to the manner in which the fluid drive component 20 is controlled. Additionally, as long as the fluid drive component 20 can drive the coolant level in the housing 10 to rise above the height of the heat source H and the heat dissipation fins F and discharge it from the chamber outlet 13, the present invention is not limited to the position of the fluid drive component 20 as illustrated. For example, in some other embodiments, the placement height of the fluid drive component 20 within the coolant chamber 11 of the housing 10 can be higher than the highest height of the component to be cooled (such as the top edge of the heat dissipation fins F). For example, in other embodiments, the placement height of the fluid drive component 20 within the coolant chamber 11 of the housing 10 can be equal to the highest height of the component to be cooled (such as the top edge of the heat dissipation fins F).
[0038] It should also be noted that the fluid-driven components are not limited to the coolant chamber housed within the casing, and the present invention is not limited to the number and configuration of fluid-driven components that can be used with a single cooling system. For example, please refer to... Figure 9 Another embodiment of the present invention proposes a cooling system 2', which differs from the cooling system of the aforementioned embodiment only in the number of covers 10 of its fluid distribution component 1' and the location of the fluid drive member 20. Therefore, the following description focuses only on the differences. As shown in the figure, the fluid distribution component 1' housed in the equipment tank 7 of the cooling system 2' may include at least two covers 10, and these two covers 10 may be used to cover different heat sources (not shown), and these two covers 10 may be connected to the same fluid drive member 20. In this configuration, the fluid drive member 20 can still draw gas from the two covers 10 to drive the liquid level of the coolant in the covers 10 to rise above the heat source, thereby achieving the aforementioned effect of cooling the heat source while reducing the amount of coolant used.
[0039] Of course, based on the content described in the foregoing embodiments, those skilled in the art can use the fluid distribution assembly to cool other forms and configurations of heat sources according to actual needs. For example, in some practical applications, the overall size or shape of the fluid distribution assembly's housing can be adjusted to accommodate the required number of other types of heat sources (e.g., graphics processors) and heat dissipation fins together in its coolant chamber. Cooling can also be achieved through the aforementioned configuration of the housing's chamber inlet, chamber outlet, and fluid drive component. Since the principle is the same, further details are omitted.
[0040] In addition, as long as it is possible to introduce coolant from one side of the cover and discharge it from a higher area on the other side of the cover, the present invention is not limited to the positions of the chamber inlet and outlet shown in the aforementioned cover. For example, in some embodiments, the chamber inlet of the cover may also be offset to one side of the bottom (or opening) of the cover, and the chamber outlet of the cover may also be opened at the top plate (or top) of the cover and offset to one side of the top plate.
[0041] According to the fluid distribution assembly and cooling system including it disclosed in the foregoing embodiments of the present invention, due to the configuration of the chamber inlet and outlet of the fluid distribution assembly and the fluid drive component, the cooling system only needs to provide an appropriate amount of coolant corresponding to the overall volume of the heat source and heat dissipation fins to effectively cool the heat source and heat dissipation fins. Therefore, it is not necessary to inject coolant into the outer casing to the extent that the overall height covers the heat source and heat dissipation fins, as is the case in conventional methods. In other words, the fluid distribution assembly disclosed in the foregoing embodiments of the present invention saves at least the accommodating space of the equipment tank and the volume difference in the height of the coolant chamber inside and outside the casing compared to conventional methods. In the case of the high cost of single-phase coolant, the cooling system of the foregoing embodiments of the present invention can solve the cost burden caused by the traditional need to use a large amount of coolant while effectively cooling the heat source through the fluid distribution assembly.
[0042] Furthermore, since the size, quantity, and relative position of the fluid distribution component's housing and fluid drive components can be easily adjusted according to application requirements, users can easily introduce the fluid distribution component into any existing system. It offers high application flexibility and wide applicability, and the integration threshold and difficulty are low.
[0043] While the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the invention. Any modifications and refinements made without departing from the spirit and scope of the invention are within the scope of patent protection of the present invention. For details regarding the scope of protection defined in the present invention, please refer to the appended claims.
Claims
1. A cooling system adapted to at least one heat source, the cooling system comprising: A device tank surrounds a defined accommodating space, wherein the device tank has a tank inlet and a tank outlet that are opposite to each other and communicate with the accommodating space. as well as At least one fluid distribution component, including: At least one enclosure, housed within the accommodating space and surrounding a defined coolant chamber, wherein the enclosure is adapted to cover the at least one heat source such that the at least one heat source is housed within the coolant chamber; and At least one fluid-driven component is connected to the coolant chamber of the housing to drive the fluid in the coolant chamber to flow outwards. The at least one fluid distribution component further includes a guide tube connected to the outlet of the chamber. The guide tube includes a connecting end and an outlet end opposite to each other. The outlet end is connected to the outlet of the chamber via the connecting end and extends toward the support plate. The horizontal height of the outlet end of the guide tube is equal to the horizontal height of the upper edge of the inlet of the chamber. The at least one cover has a top, an opening, a chamber inlet and a chamber outlet that are opposite to each other. The chamber outlet and the chamber inlet are connected to the coolant chamber and are respectively adjacent to the top and the opening. The at least one fluid drive member is connected to the chamber outlet to drive the fluid in the coolant chamber to flow out through the chamber outlet.
2. The cooling system of claim 1 further includes a support plate, the equipment tank is disposed on the support plate, and the inlet of the chamber of the at least one cover of the at least one fluid distribution assembly is closer to the support plate than the outlet of the chamber.
3. The cooling system of claim 2, wherein the liquid inlet of the chamber of the at least one shroud of the at least one fluid distribution component is closer to the support plate than the at least one fluid drive member.
4. The cooling system of claim 1, wherein the at least one fluid drive member is located in the coolant chamber of the at least one housing.
5. The cooling system of claim 4, wherein the at least one fluid drive member is directly connected to the liquid outlet of the chamber.
6. The cooling system of claim 1, wherein the at least one fluid drive member is located outside the at least one housing.
7. The cooling system of claim 1, wherein the at least one cover comprises a plurality of covers, the covers being housed in the equipment tank, and the liquid outlet of the chamber of the cover is connected to the at least one fluid drive member.
8. The cooling system as claimed in claim 1 further includes a coolant distribution device, wherein the inlet and outlet of the tank are externally connected to the coolant distribution device, the inlet is used to receive the coolant from the coolant distribution device, and the outlet is used to discharge the received coolant to the outside and flow back to the coolant distribution device.
Citation Information
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