Cooling system and data center

Abstract

This application provides a cooling system and a data center. The cooling system includes a liquid cooling module, a liquid collection tank, a heat dissipation device, and a liquid pump. The liquid collection tank is installed below the liquid cooling module and contains cooling medium. The liquid collection tank is connected to the inlet end of the heat dissipation device. The liquid cooling module includes a mounting box, a spray assembly, and electronic equipment. The spray assembly is located inside the mounting box and is connected to the outlet end of the heat dissipation device. The liquid pump drives the cooling medium in the liquid collection tank to flow through the heat dissipation device to the spray assembly. At least a portion of the electronic equipment is installed inside the mounting box, and the spray assembly sprays cooling medium onto the portion of the electronic equipment located inside the mounting box. The bottom of the mounting box has a drain port that communicates with the inner cavity of the liquid collection tank. In this way, heat dissipation can be achieved by spraying circulating cooling medium onto the electronic equipment, resulting in fewer pipes required in the data center and easier pipe connections.

Description

Technical Field

[0001] This application relates to the field of data center technology, and in particular to a cooling system and a data center. Background Technology

[0002] Internet service providers, enterprise platforms, and research institutions all have significant computing needs. The operating platforms that support these needs, including storage, computing, and networking, are called data centers. Data centers include electronic devices (such as servers). With the rapid development of information and communication technologies, the integration and heat density of electronic devices in data centers are increasing, placing increasingly higher demands on their heat dissipation.

[0003] Electronic devices may include a housing and electronic components installed within the housing. In related technologies, data centers may further include heat exchangers and heat dissipation devices. The heat exchanger has hot runners and cold runners. The inlet of the cold runner is connected to the outlet of the heat dissipation device via a pipe, and the outlet of the cold runner is connected to the inlet of the heat dissipation device via a pipe. A primary cooling medium circulates between the cold runner and the heat dissipation device. The housing of the electronic device may contain a secondary cooling medium, which is a two-phase liquid cooling medium. The electronic components are at least partially immersed in the liquid phase of the secondary cooling medium. The secondary cooling medium is used for heat exchange with the electronic components and can absorb the heat generated by the electronic components. The housing may have an air outlet and a liquid inlet. The air outlet is connected to the inlet of the hot runner via a pipe, and the liquid inlet is connected to the outlet of the hot runner via a pipe, allowing the secondary cooling medium to circulate between the hot runner of the heat exchanger and the housing. The secondary cooling medium in the hot runner exchanges heat with the primary cooling medium in the cold runner. After absorbing the heat from the secondary cooling medium, the primary cooling medium flows to the heat dissipation device for heat dissipation.

[0004] However, in related technologies, data centers require the deployment of numerous pipelines, and the pipeline connections are quite complex. Summary of the Invention

[0005] This application provides a cooling system that dissipates heat by spraying a circulating cooling medium onto electronic devices. This system requires fewer pipes to be laid in the data center and the pipe connections are relatively easy.

[0006] This application provides a cooling system, including a liquid cooling module, a liquid collection tank, a heat dissipation device, a liquid pump, an outlet pipe, and a supply pipe. The liquid collection tank is installed below the liquid cooling module and contains a primary cooling medium. The liquid collection tank is connected to the inlet end of the heat dissipation device via the outlet pipe. The liquid cooling module includes a mounting box, a spray assembly, and electronic equipment. The spray assembly is located inside the mounting box and is connected to the outlet end of the heat dissipation device via the supply pipe. A liquid pump is installed on either the supply or outlet pipe. The liquid pump drives the primary cooling medium in the liquid collection tank to flow through the outlet pipe, the heat dissipation device, and the supply pipe to the spray assembly. At least a portion of the electronic equipment is installed inside the mounting box, and the spray assembly sprays the primary cooling medium onto the portion of the electronic equipment located inside the mounting box. The bottom of the mounting box has a first drain port, which communicates with the inner cavity of the liquid collection tank.

[0007] The cooling system of this embodiment sprays primary coolant onto the portion of the electronic device located within the mounting housing to remove heat generated by the electronic device. After removing heat from the surface of the electronic device, the sprayed primary coolant flows back to the collection tank through the first drain port. Driven by a liquid pump, the primary coolant in the collection tank flows to the heat dissipation device to dissipate heat generated by the electronic device. After being cooled at the heat dissipation device, the primary coolant flows back to the spray assembly to spray the electronic device. The electronic device can dissipate heat through the primary coolant circulating in the collection tank, outlet pipe, heat dissipation device, supply pipe, spray assembly, and mounting housing. In this cooling system, cooling the electronic device only requires the installation of piping for the circulation of the primary coolant, resulting in fewer piping requirements and easier piping connections in the data center. Furthermore, when the cooling system includes multiple electronic devices, since the electronic devices do not need to remove heat through secondary coolant flowing inside and outside their housings, there is no need to control the pressure balance at the outlet of the secondary coolant within the housing, leading to more stable cooling of the electronic devices. Furthermore, cooling of electronic devices requires only one circulation of the cooling medium, necessitating only a liquid pump to drive the primary cooling medium flow. This means that even if the electronic device's casing contains secondary cooling medium, a separate pump is unnecessary, reducing the cooling system's energy consumption. Moreover, even if the electronic device's casing contains secondary cooling medium, this medium does not need to circulate within or outside the casing. This means that components outside the casing do not require secondary cooling medium, resulting in a smaller volume of secondary cooling medium used and further reducing costs.

[0008] In one possible implementation, the mounting box has a connector on one side of its wall in a first direction. The connector extends through the wall along the first direction, and the inner wall of the connector has an elastic sealing structure for sealing the connector. An electronic device is installed within the connector, with part of the electronic device located inside the mounting box and part located outside. The elastic sealing structure is located between the electronic device and the inner wall of the connector, sealing the gap between them. The first direction is either the length or width direction of the electronic device and is perpendicular to the vertical direction.

[0009] In one possible implementation, the electronic device is provided with a connector located at one end of the electronic device outside the mounting housing.

[0010] In one possible implementation, the outer surface of the casing wall with the insertion interface is provided with a liquid receiving tray, which is located below the insertion interface. In a second direction, the insertion interface is located between the two ends of the liquid receiving tray. The second direction is perpendicular to the vertical direction and also perpendicular to the first direction.

[0011] In one possible implementation, the bottom of the receiving tray has a second drain port, which communicates with the inner cavity of the collection tank.

[0012] In one possible implementation, the second drain outlet is located above the first drain outlet, and the second drain outlet is connected to the inner cavity of the mounting box, so that the second drain outlet is connected to the inner cavity of the collection tank through the inner cavity of the mounting box.

[0013] In one possible implementation, the liquid cooling module further includes a liquid inlet pipe, the inlet end of which is connected to the outlet end of the heat dissipation device via a liquid supply pipe. A spray assembly is installed on the liquid inlet pipe, such that the spray assembly is connected to the outlet end of the heat dissipation device via the liquid inlet pipe and the liquid supply pipe. A first flow regulating valve is provided at the inlet end of the liquid inlet pipe.

[0014] In one possible implementation, the upper part of the box wall on one side in the second direction has a through hole, and the liquid inlet pipe passes through the through hole, such that the inlet end of the liquid inlet pipe is located outside the box, and the part of the liquid inlet pipe used for installing the spray assembly is located inside the box.

[0015] In one possible implementation, the spray assembly includes a spray pipe with both ends extending along a first direction. The inlet end of the spray pipe is connected to the outlet end of the heat dissipation device via a liquid supply pipe, and spray holes are formed on the pipe wall. A liquid pump drives the primary cooling medium in the collection tank to flow through the outlet pipe, the heat dissipation device, and the liquid supply pipe to the spray pipe. The spray pipe sprays the primary cooling medium through the spray holes onto the upper part of the portion of the electronic equipment located inside the mounting housing.

[0016] In one possible implementation, the liquid cooling module includes a plurality of electronic devices spaced apart along a second direction, and the spray assembly includes a plurality of spray pipes spaced apart along the second direction. In the second direction, spray pipes are provided on both sides of the electronic devices, and the spray pipes are used to spray a cooling medium onto the upper part of the portion of the adjacent electronic device located inside the mounting housing through spray holes. The second direction refers to the thickness direction of the electronic device.

[0017] In one possible implementation, electronic devices and spray pipes are arranged alternately along a second direction, and spray holes are formed on the pipe walls on both sides of the spray pipe located between two adjacent electronic devices in the second direction. The spray pipe located between two adjacent electronic devices is used to spray a cooling medium onto the upper part of the portion of the adjacent electronic devices located inside the mounting box.

[0018] In one possible implementation, the spray holes are strip-shaped holes extending along the extension direction of the spray pipe.

[0019] In one possible implementation, the spray pipe has a plurality of spray holes spaced apart along the extension direction of the spray pipe.

[0020] In one possible implementation, a second flow regulating valve is provided at the inlet end of the spray pipe.

[0021] In one possible implementation, the electronic device includes electronic components and a sealed housing. At least a portion of the housing is mounted within a mounting box, the electronic components are mounted within the housing, and the housing contains a secondary cooling medium, with the electronic components at least partially immersed in the secondary cooling medium. A spray assembly is used to spray primary cooling medium onto the portion of the housing located within the mounting box, and the secondary cooling medium within the housing is used for heat exchange with the primary cooling medium on the housing surface.

[0022] In one possible implementation, at least a portion of the housing is made of an elastic material.

[0023] In one possible implementation, one end of the housing is located inside the mounting box and the other end is located outside the mounting box. The side walls of the housing and the end wall of the housing located outside the mounting box are made of rigid material, while the end wall of the housing located inside the mounting box is made of elastic material.

[0024] In one possible implementation, the cooling system further includes a drain pipe. The cooling system includes multiple liquid cooling modules, each of which has a first drain port connected to the inner cavity of a collection tank via a drain pipe.

[0025] In one possible implementation, the cooling system also includes a rack, on which the liquid cooling module and the liquid collection tank are mounted.

[0026] This application also provides a data center, including a server room and a cooling system as described in any of the above embodiments. The liquid cooling module and the liquid collection tank of the cooling system are installed inside the server room, while the heat dissipation device of the cooling system is installed outside the server room. Attached Figure Description

[0027] Figure 1 A schematic diagram of a data center provided for an embodiment of this application;

[0028] Figure 2 A schematic diagram of a cooling system provided in an embodiment of this application;

[0029] Figure 3 A perspective view of one end of an electronic device in another cooling system provided in an embodiment of this application;

[0030] Figure 4 A perspective view of the other end of an electronic device for another cooling system provided in an embodiment of this application;

[0031] Figure 5 A perspective view of a cooling system provided in an embodiment of this application;

[0032] Figure 6 A perspective view of a cooling system provided in this application before installation on an electronic device;

[0033] Figure 7 A perspective view of a liquid cooling module of a cooling system provided in this application embodiment, before installation on an electronic device;

[0034] Figure 8 A perspective view of a liquid cooling module in a cooling system provided in an embodiment of this application;

[0035] Figure 9 A schematic diagram showing the assembly of an electronic device in a cooling system at the pick-and-place port, as provided in an embodiment of this application.

[0036] Figure 10 A perspective view of a liquid cooling module in a cooling system provided in an embodiment of this application;

[0037] Figure 11 A schematic diagram of a spray pipe for another cooling system provided in an embodiment of this application;

[0038] Figure 12 A schematic diagram of a spray pipe for another cooling system provided in an embodiment of this application;

[0039] Figure 13 A perspective view of another cooling system provided in this application embodiment before installation on an electronic device;

[0040] Figure 14 A perspective view of the liquid cooling module of another cooling system provided in an embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1. Liquid cooling module;

[0043] 2. Liquid collecting tank;

[0044] 21. Liquid outlet; 22. Liquid return outlet; 23. Primary cooling medium;

[0045] 3. Discharge pipe;

[0046] 4. Heat dissipation device;

[0047] 5. Liquid supply pipe;

[0048] 6. Liquid pump;

[0049] 7. Fan;

[0050] 8. Drainage pipe;

[0051] 9. Rack;

[0052] 10. Computer room;

[0053] 100. Installation box;

[0054] 110. Drain tray; 111. Second drain outlet;

[0055] 120. First box wall; 121. Insertion interface; 122. Elastic sealing structure;

[0056] 130. Second box wall; 131. Pipe hole;

[0057] 140. First drain outlet;

[0058] 200. Electronic devices;

[0059] 210. Connector;

[0060] 220. Shell; 221. First sidewall; 222. Second sidewall; 223. Third sidewall; 224. Fourth sidewall; 225. First endwall; 226. Second endwall;

[0061] 230. Electronic components;

[0062] 240. Secondary cooling medium;

[0063] 300. Liquid inlet pipe;

[0064] 400. First flow regulating valve;

[0065] 500. Spray assembly; 510. Spray pipe; 511. Spray hole; 520. Second flow regulating valve;

[0066] x, vertical direction; y, primary direction; z, secondary direction. Detailed Implementation

[0067] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0068] Figure 1 This is a schematic diagram of a data center provided in an embodiment of this application.

[0069] like Figure 1 As shown in the embodiment of this application, the data center may include a computer room 10 and a cooling system. The cooling system may include a liquid cooling module 1 and a rack 9. Both the liquid cooling module 1 and the rack 9 may be installed in the computer room 10, and the liquid cooling module 1 may be installed on the rack 9.

[0070] It is understood that server room 10 can be a closed room or a room open on one or more sides. Server room 10 can be a temporary room or a permanent room. For example, server room 10 can be a shipping container, and the data center can be a containerized data center.

[0071] In some examples, the cooling system may also include a cabinet located within the computer room 10. The cabinet may include a cabinet body and a rack 9 for mounting the liquid cooling module 1. The rack 9 is located within the cabinet body; that is, the rack 9 for mounting the liquid cooling module 1 is the rack 9 of the cabinet. In this case, the liquid cooling module 1 can be located within the cabinet body, and the rack 9 can be installed within the computer room 10 through the cabinet body.

[0072] In other examples, rack 9 can also be placed directly on the floor of server room 10.

[0073] Figure 2 This is a schematic diagram of a cooling system provided in an embodiment of this application. In the figure, the x-direction is the vertical direction, the y-direction is the first direction, and the z-direction is the second direction. Both the first and second directions are perpendicular to the vertical direction, and the first direction is perpendicular to the second direction.

[0074] like Figure 2 As shown, and see Figure 1 In this embodiment, the liquid cooling module 1 may include an electronic device 200, which may be mounted on a rack 9. The cooling system may also include a heat dissipation device 4, which may be installed outside the computer room 10. The electronic device 200 inside the computer room 10 can be cooled by the heat dissipation device 4 outside the computer room 10.

[0075] It is understood that electronic equipment 200 may include, but is not limited to, servers, distribution boxes, power supplies, etc.

[0076] It is understandable that the heat dissipation device 4 may include, but is not limited to, a radiator, a cooling tower, etc.

[0077] In some examples, a fan 7 may also be provided at the heat dissipation device 4 to accelerate the airflow at the heat dissipation device 4 in order to improve the heat dissipation efficiency at the heat dissipation device 4.

[0078] Figure 3 A perspective view of one end of an electronic device in another cooling system provided in this application embodiment. Figure 4 A perspective view of the other end of an electronic device for another cooling system provided in an embodiment of this application.

[0079] like Figure 3 , Figure 4 As shown in the embodiments of this application, the electronic device 200 may include an electronic component 230 and a housing 220. The housing 220 is used to mount on the frame 9, and the electronic component 230 is mounted inside the housing 220.

[0080] It is understood that electronic device 230 may include, but is not limited to, chips, resistors, inductors, etc.

[0081] In related technologies, the cooling system also includes a heat exchanger with hot runners and cold runners. The inlet of the cold runner is connected to the outlet of the heat dissipation device via a pipe, and the outlet of the cold runner is connected to the inlet of the heat dissipation device via a pipe. A primary cooling medium circulates between the cold runner and the heat dissipation device. The housing of the electronic device contains a secondary cooling medium, which is a two-phase liquid cooling medium. The electronic components inside the housing are at least partially immersed in the liquid phase of the secondary cooling medium. The secondary cooling medium can be used to exchange heat with the electronic components to absorb the heat generated by the electronic components. The housing of the electronic device can have an air outlet and a liquid inlet. The air outlet is connected to the inlet of the hot runner via a pipe, and the liquid inlet is connected to the outlet of the hot runner via a pipe, allowing the secondary cooling medium to circulate between the hot runner of the heat exchanger and the housing. The secondary cooling medium in the hot runner exchanges heat with the primary cooling medium in the cold runner. After absorbing the heat from the secondary cooling medium, the primary cooling medium can flow to the heat dissipation device for heat dissipation.

[0082] In related technologies, piping is required between the casing of electronic devices and the heat exchanger for the circulation of secondary cooling media, and piping is required between the heat exchanger and the heat dissipation device for the circulation of primary cooling media. Data centers require numerous piping installations, making the connections complex. Furthermore, when the cooling system includes multiple electronic devices, the air outlets of the casings of these devices are connected to the hot runners of the heat exchanger. Since the power consumption and heat generation of the electronic components in different devices may vary, the pressure within the casings of different devices may differ. Maintaining pressure balance at the air outlets of each electronic device in the cooling system is difficult. Without pressure balance control at the air outlets of each electronic device, some devices may experience obstructed secondary cooling media circulation due to lower pressure within their casings compared to the pressure in the piping connected to their air outlets, potentially leading to cooling failure in some devices. Additionally, a drive pump is required in both the primary and secondary cooling media circulation loops, resulting in high energy consumption for the cooling system. Furthermore, in addition to the secondary cooling medium contained in the casing of electronic equipment, the heat exchanger's hot runner and the pipes connecting the heat exchanger and the casing also contain secondary cooling medium. The required amount of secondary cooling medium is large, resulting in high costs.

[0083] Figure 5 This is a perspective view of a cooling system provided in an embodiment of this application.

[0084] like Figure 5 As shown, based on this, the cooling system provided in this embodiment further includes a liquid collection tank 2, a liquid pump 6, an outlet pipe 3, and a supply pipe 5. The liquid collection tank 2 is installed below the liquid cooling module 1, and contains primary cooling medium 23. The liquid collection tank 2 is connected to the inlet end of the heat dissipation device 4 through the outlet pipe 3. The liquid cooling module 1 includes a mounting box 100, a spray assembly 500, and electronic equipment 200. The spray assembly 500 is located inside the mounting box 100, and is connected to the outlet end of the heat dissipation device 4 through the supply pipe 5. The supply pipe 5 or the outlet pipe 3 is equipped with a liquid pump 6, which drives the primary cooling medium 23 in the liquid collection tank 2 to flow through the outlet pipe 3, the heat dissipation device 4, and the supply pipe 5 to the spray assembly 500. At least a portion of the electronic equipment 200 is installed inside the mounting box 100, and the spray assembly 500 sprays the primary cooling medium 23 onto the portion of the electronic equipment 200 located inside the mounting box 100. The bottom of the mounting box 100 has a first drain port 140, which is connected to the inner cavity of the collection tank 2.

[0085] In this way, the portion of the electronic device 200 located within the mounting housing 100 can be sprayed with primary coolant to remove the heat generated by the electronic device 200. After the primary cooling medium 23 removes heat from the surface of the electronic device 200, it flows back to the collection tank 2 through the first drain port 140. Driven by the liquid pump 6, the primary cooling medium 23 in the collection tank 2 can flow to the heat dissipation device 4 to dissipate heat generated by the electronic device 200. After being dissipated at the heat dissipation device 4, the primary cooling medium 23 flows back to the spray assembly 500 to spray the electronic device 200. The electronic device 200 can dissipate heat through the primary cooling medium 23 circulating in the collection tank 2, the outlet pipe 3, the heat dissipation device 4, the supply pipe 5, the spray assembly 500, and the mounting housing 100. In the cooling system, cooling the electronic device 200 only requires the installation of a pipeline for the circulation of the primary cooling medium 23. The data center requires fewer pipelines, and the pipeline connection is relatively easy. Furthermore, when the cooling system includes multiple electronic devices 200, since the electronic devices 200 do not require the secondary cooling medium 240 flowing inside and outside the housing 220 of the electronic device 200 to remove the heat generated by the electronic device 200, there is no need to control the pressure balance at the outlet of the secondary cooling medium 240 within the housing 220, resulting in more stable cooling of the electronic devices 200. In addition, only a single circulation of the cooling medium 23 is needed to cool and dissipate heat from the electronic devices 200. Only a liquid pump 6 is needed to drive the flow of the primary cooling medium 23. That is, even if the housing 220 of the electronic device 200 contains the secondary cooling medium 240, there is no need to install a drive pump to drive the flow of the secondary cooling medium 240, which helps reduce the energy consumption of the cooling system. Moreover, even if the housing 220 of the electronic device 200 contains the secondary cooling medium 240, the secondary cooling medium 240 does not need to circulate inside and outside the housing 220. That is, the components outside the housing 220 do not need to contain the secondary cooling medium 240, resulting in a smaller amount of secondary cooling medium 240 used, which helps reduce costs.

[0086] Understandably, an outlet 21 can be provided on the wall of the liquid collection tank 2, and an outlet pipe 3 can be connected to the outlet 21 so that the liquid collection tank 2 can be connected to the inlet end of the heat dissipation device 4 through the outlet pipe 3. The outlet pipe 3 can be located outside the liquid collection tank 2. Alternatively, the outlet pipe 3 can be partially located inside the liquid collection tank 2 and partially located outside the liquid collection tank 2.

[0087] It is understandable that the liquid collection tank 2 can be located directly below the mounting box 100 or diagonally below the mounting box 100, so that the primary cooling medium 23 in the mounting box 100 can flow into the liquid collection tank 2 through the first drain port 140 under its own gravity.

[0088] It is understood that the housing 220 of the electronic device 200 is at least partially installed inside the mounting box 100, and the spray assembly 500 is used to spray a primary cooling medium 23 onto the portion of the housing 220 located inside the mounting box 100.

[0089] It is understandable that the first drain port 140 can be located on the bottom wall of the mounting box 100 or on the side wall of the mounting box 100.

[0090] For example, the mounting box 100 and the liquid collection tank 2 are arranged adjacent to each other in the vertical direction. The first drain port 140 is provided on the box wall of the bottom surface of the mounting box 100. The top of the liquid collection tank 2 is an open structure, or the box wall of the top surface of the liquid collection tank 2 has a return port 22. The first drain port 140 is opposite to the open structure or the return port 22, so that the first drain port 140 is connected to the inner cavity of the liquid collection tank 2 through the open structure or the return port 22.

[0091] This reduces the number of pipes and cables that need to be installed within the data center.

[0092] For example, the first drain port 140 can be located on the side wall of the mounting box 100, and the side wall of the liquid collection tank 2 has a return port 22. The cooling system also includes a drain pipe 8. The first drain port 140 can be connected to the return port 22 through the drain pipe 8, so that the first drain port 140 is connected to the inner cavity of the liquid collection tank 2 through the drain pipe 8 and the return port 22.

[0093] In this way, the relative position between the liquid cooling module 1 and the liquid collection tank 2 is more flexible, and the first drain port 140 is more convenient to communicate with the inner cavity of the liquid collection tank 2.

[0094] For example, the primary cooling medium 23 may include, but is not limited to, cooling water, cooling oil, etc.

[0095] In this embodiment, the liquid cooling module 1 further includes an inlet pipe 300. The inlet end of the inlet pipe 300 is connected to the outlet end of the heat dissipation device 4 through a liquid supply pipe 5. The spray assembly 500 is installed on the inlet pipe 300, so that the spray assembly 500 is connected to the outlet end of the heat dissipation device 4 through the inlet pipe 300 and the liquid supply pipe 5. The liquid pump 6 is used to drive the primary cooling medium 23 in the liquid collection tank 2 to flow to the spray assembly 500 through the outlet pipe 3, the heat dissipation device 4, the liquid supply pipe 5 and the inlet pipe 300.

[0096] This makes it easier to connect the spray assembly 500 to the liquid supply pipe 5, and reduces restrictions on the placement of the spray assembly 500. Furthermore, when there are multiple liquid cooling modules 1, it facilitates connecting the liquid supply pipe 5 to multiple spray assemblies 500.

[0097] In this embodiment, both the liquid cooling module 1 and the liquid collection tank 2 are mounted on the frame 9. Specifically, the mounting box 100 of the liquid cooling module 1 is mounted on the frame 9, and the electronic equipment 200, the spray assembly 500 and the liquid inlet pipe 300 can be mounted on the frame 9 through the mounting box 100.

[0098] This design facilitates the installation of the liquid cooling module 1 above the liquid collection tank 2, making installation of both modules more convenient. Furthermore, the liquid cooling module 1 and liquid collection tank 2, mounted vertically on the rack 9, occupy less floor space in the server room 10. Additionally, when multiple liquid cooling modules 1 are used, they can be arranged vertically on a single rack 9, allowing for convenient installation and maximizing space utilization.

[0099] Understandably, the liquid collection tank 2 can be located directly below the liquid cooling module 1.

[0100] In the embodiments of this application, the cooling system includes a plurality of liquid cooling modules 1, and the first drain port 140 of each liquid cooling module 1 is connected to the inner cavity of the liquid collection tank 2 through a drain pipe 8.

[0101] This facilitates communication between the first drain ports 140 of multiple liquid cooling modules 1 and the inner cavity of the liquid collection tank 2, allowing the primary cooling medium 23 in the mounting boxes 100 of multiple liquid cooling modules 1 to flow back into the liquid collection tank 2. Furthermore, electronic devices 200 with different power ratings can be installed in different mounting boxes 100 of the liquid cooling modules 1, allowing for the use of different flow rates of primary cooling medium 23 for heat dissipation. Compared to arranging all electronic devices 200 in a single liquid cooling module 1, the arrangement of the electronic devices 200 is more flexible. Additionally, the distributed arrangement of the liquid cooling modules 1 ensures that if one liquid cooling module 1 fails, the others can continue to operate normally.

[0102] Understandably, multiple liquid cooling modules 1 arranged vertically can be installed on rack 9.

[0103] It is understandable that the mounting boxes 100 of the liquid cooling modules 1 installed on the same rack 9 can all have a first drain port 140 on the same side wall. The wall where the return port 22 of the liquid collection tank 2 installed on the same rack 9 is located can be oriented in the same direction as the wall where the first drain port 140 of the mounting box 100 is located. The first drain port 140 of the mounting box 100 installed on the same rack 9 can be connected to the return port 22 of the liquid collection tank 2 through the same drain pipe 8.

[0104] In some examples, the liquid pump 6 is installed on the liquid outlet pipe 3, and part of the liquid outlet pipe 3 is located inside the liquid collection tank 2. The liquid pump 6 is installed inside the liquid collection tank 2, that is, the liquid pump 6 is installed on the part of the liquid outlet pipe 3 that is located inside the liquid collection tank 2.

[0105] In this way, the liquid pump 6 does not occupy the external space of the liquid collection tank 2. When the liquid pump 6 is installed inside the computer room 10, it helps to improve the space utilization rate of the computer room 10 of the data center. In addition, the liquid collection tank 2 can also protect the liquid pump 6, making it less prone to damage.

[0106] It is understandable that when part of the liquid outlet pipe 3 is located inside the liquid collection tank 2 and part of it is located outside the liquid collection tank 2, the liquid outlet pipe 3 is installed inside the liquid outlet 21.

[0107] In some examples, the liquid pump 6 is located outside the machine room 10.

[0108] This helps improve the space utilization rate within the data center's server room 10. Furthermore, the heat generated by the liquid pump 6 during operation will not accumulate within the server room 10, thus helping to lower the temperature inside the server room 10.

[0109] In some examples, the liquid pump 6 is located inside the machine room 10 and outside the liquid collection tank 2.

[0110] Below, we will use a liquid cooling module 1 as an example for explanation. When the cooling system includes multiple liquid cooling modules 1, the other liquid cooling modules 1 can be set up in the same way.

[0111] like Figure 3 , Figure 4 As shown, in some embodiments of this application, the housing 220 of the electronic device 200 is a sealed housing 220, and a secondary cooling medium 240 can be contained inside the housing 220. The electronic device 230 is at least partially immersed in the secondary cooling medium 240. The secondary cooling medium 240 can be used to exchange heat with the electronic device 230 to absorb the heat generated by the electronic device 230. The secondary cooling medium 240 inside the housing 220 is used to exchange heat with the primary cooling medium 23 on the surface of the housing 220.

[0112] In this way, the secondary cooling medium 240 can absorb the heat generated by the electronic device 230, thus cooling the electronic device 230 and preventing heat accumulation at the electronic device 230, which is less likely to cause overheating. Furthermore, the large heat exchange surface between the secondary cooling medium 240 and the housing 220 facilitates the rapid transfer of heat through the housing 220 to the primary cooling medium 23 on the surface of the housing 220, allowing heat inside the housing 220 to be transferred to the outside more quickly, resulting in better heat dissipation performance of the electronic device 200.

[0113] It is understandable that the secondary cooling medium 240 is an insulating cooling medium.

[0114] It is understood that the secondary cooling medium 240 can be a single-phase cooling medium or a two-phase cooling medium. For example, the secondary cooling medium 240 can be a fluorinated liquid.

[0115] In some other embodiments of this application, the housing 220 of the electronic device 200 may also be without a secondary cooling medium 240. The electronic device 230 is used to exchange heat with the housing 220. The electronic device 230 inside the housing 220 can exchange heat with the primary cooling medium 23 on the surface of the housing 220 through the housing 220.

[0116] In this embodiment, the housing 220 may include a first sidewall 221, a second sidewall 222, a third sidewall 223, a fourth sidewall 224, a first endwall 225, and a second endwall 226. The first sidewall 221 and the second sidewall 222 are disposed opposite to each other, the third sidewall 223 and the fourth sidewall 224 are disposed opposite to each other, and the first endwall 225 and the second endwall 226 are disposed opposite to each other. The first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, the first endwall 225, and the second endwall 226 are joined together to form a cavity for mounting electronic devices 230.

[0117] It is understandable that when the housing 220 contains the secondary cooling medium 240, the secondary cooling medium 240 is contained within the cavity formed by the splicing and enclosing of the first side wall 221, the second side wall 222, the third side wall 223, the fourth side wall 224, the first end wall 225, and the second end wall 226.

[0118] It is understandable that when the electronic device 200 is installed inside the mounting box 100, the first side wall 221, the second side wall 222, the third side wall 223, the fourth side wall 224, the first end wall 225, and the second end wall 226 are all located inside the mounting box 100.

[0119] like Figures 3-5 As shown, it can be understood that when the electronic device 200 is partially installed inside the mounting box 100, one of the first end wall 225 and the second end wall 226 is located outside the mounting box 100 and the other is located inside the mounting box 100, and parts of the first side wall 221, the second side wall 222, the third side wall 223 and the fourth side wall 224 are located inside the mounting box 100 and parts are located outside the mounting box 100.

[0120] In some embodiments of this application, the housing 220 is made of a rigid material, that is, the first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, the first endwall 225, and the second endwall 226 are all made of a rigid material.

[0121] In other embodiments of this application, at least a portion of the housing 220 is made of an elastic material. Specifically, one or more of the first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, the first endwall 225, and the second endwall 226 may be made of an elastic material.

[0122] In this way, the shape of the shell 220 can change with the pressure changes inside the shell 220, thereby reducing pressure fluctuations inside the shell 220. For example, when the secondary cooling medium 240 is a two-phase cooling medium, the pressure fluctuations inside the shell 220 caused by the phase change of the secondary cooling medium 240 can be reduced.

[0123] It is understandable that when the electronic device 200 is located inside the mounting box 100, the first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, the first endwall 225, and the second endwall 226 may all be made of elastic material, or one or a portion of the first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, the first endwall 225, and the second endwall 226 may be made of elastic material.

[0124] It is understandable that when part of the electronic device 200 is located inside the mounting box 100 and part is located outside the mounting box 100, the part that can be used to connect with the mounting box 100 can be made of rigid material, and the remaining part can be made of rigid material or elastic material.

[0125] In this embodiment of the application, the electronic device 200 further includes a connector 210. At least one of the first end wall 225 and the second end wall 226 has a mounting hole for mounting the connector 210. The mounting hole communicates with a chamber for mounting electronic device 230. The connector 210 is mounted in the mounting hole. The electronic device 230 in the housing 220 can be electrically connected to the connector 210. The connector 210 is used to electrically connect to an external device, so that the electronic device 230 in the housing 220 can be electrically connected to an external device.

[0126] It is understandable that when the housing 220 contains the secondary cooling medium 240, the connector 210 is made into a sealed structure so that the secondary cooling medium 240 cannot flow out of the housing 220 through the connector 210.

[0127] It is understandable that when the connector 210 is provided inside the mounting box 100, the housing 220 is a sealed structure at the location of the connector 210 located inside the mounting box 100, so that the primary cooling medium 23 cannot flow into the housing 220 through the location of the connector 210.

[0128] Figure 6 This is a perspective view of a cooling system provided in an embodiment of this application before installation on an electronic device. Figure 7 This is a perspective view of a liquid cooling module of a cooling system provided in an embodiment of this application before installation on an electronic device.

[0129] In an embodiment of this application, the mounting box 100 includes a first box wall 120 located on one side in a first direction. The first box wall 120 has a plug-in interface 121 that extends through the first box wall 120 along the first direction. The inner wall of the plug-in interface 121 is provided with an elastic sealing structure 122 for sealing the plug-in interface 121. The first direction is either the length direction or the width direction of the electronic device 200.

[0130] Figure 8 A perspective view of a liquid cooling module in a cooling system provided in this application embodiment. Figure 9 This is a schematic diagram illustrating the assembly of an electronic device in a cooling system at the loading / unloading port, as provided in an embodiment of this application. Figure 10 Another perspective view of the liquid cooling module of a cooling system provided in an embodiment of this application.

[0131] like Figures 8-10 As shown, and see Figure 6 , Figure 7 In this embodiment, the electronic device 200 is disposed inside the plug-in interface 121, with part of the electronic device 200 located inside the mounting box 100 and part located outside the mounting box 100. The elastic sealing structure 122 is located between the electronic device 200 and the inner wall of the plug-in interface 121, and the elastic sealing structure 122 seals the gap between the electronic device 200 and the inner wall of the plug-in interface 121.

[0132] This facilitates the assembly of the electronic device 200 from the side of the mounting box 100 into the mounting box 100, enabling the installation of the electronic device 200 on multiple mounting boxes 100 that are stacked vertically. Furthermore, the primary cooling medium 23 within the mounting box 100 is less likely to leak out through the mounting point for the electronic device 200. Additionally, the electronic device 200 is easily installed and removed from the mounting box 100. When multiple electronic devices 200 are installed on the mounting box 100, each electronic device 200 can be independently installed and removed. While one or more electronic devices 200 are being removed or maintained, the others can continue to operate normally, making maintenance and replacement of the electronic devices 200 more convenient. Moreover, the elastic sealing structure 122 can also scrape away the primary cooling medium 23 from the surface of the electronic device 200 after it is pulled out from the insertion interface 121, preventing the primary cooling medium 23 from being carried out when the electronic device 200 is pulled out.

[0133] Understandably, when no electronic device 200 is inserted into the connector 121, the elastic sealing structure 122 can seal the connector 121 to prevent the primary cooling medium 23 from flowing out of the mounting box 100 through the connector 121. When the electronic device 200 is inserted into the connector 121, the elastic sealing structure 122 can seal the gap between the electronic device 200 and the inner wall of the connector 121 to prevent the primary cooling medium 23 from flowing out of the mounting box 100 through the gap between the electronic device 200 and the inner wall of the connector 121. When the electronic device 200 is pulled out of the connector 121, the elastic sealing structure 122 can scrape the primary cooling medium 23 adhering to the surface of the electronic device 200 into the mounting box 100, making it less likely that the primary cooling medium 23 will be carried out when the electronic device 200 is pulled out of the connector 121.

[0134] It is understandable that the elastic sealing structure 122 can be an elastic sealing strip, an elastic sealing valve, etc.

[0135] It is understood that the mounting box 100 is provided with a fixing structure for fixing the electronic device 200. The electronic device 200 can be inserted into the fixing structure along the first direction to fix the electronic device 200.

[0136] It is understood that the housing 220 of the electronic device 200 passes through the plug-in interface 121, with part of the housing 220 located inside the mounting box 100 and part located outside the mounting box 100. The elastic sealing structure 122 is located between the housing 220 and the inner wall of the plug-in interface 121, and the elastic sealing structure 122 seals the gap between the housing 220 and the inner wall of the plug-in interface 121. The mounting box 100 is provided with a fixing structure for fixing the housing 220, and the housing 220 can be inserted into the fixing structure along the first direction.

[0137] It is understood that when the housing 220 of the electronic device 200 includes a first sidewall 221, a second sidewall 222, a third sidewall 223, a fourth sidewall 224, a first endwall 225, and a second endwall 226, the first endwall 225 and the second endwall 226 are arranged opposite each other along a first direction, the first sidewall 221 and the second sidewall 222 are arranged opposite each other along a vertical direction, and the third sidewall 223 and the fourth sidewall 224 are arranged opposite each other along a second direction. The first sidewall 221, the second sidewall 222, the third sidewall 223, and the fourth sidewall 224 are used to contact the elastic sealing structure 122.

[0138] In this embodiment of the application, the mounting box 100 is equipped with a plurality of electronic devices 200 spaced apart along the second direction, and the spray assembly 500 inside the mounting box 100 can be used to spray a cooling medium 23 onto the portion of all electronic devices 200 installed in the mounting box 100 located inside the mounting box 100.

[0139] In an embodiment where the electronic device 200 is inserted into the interface 121, the first housing wall 120 has a plurality of interfaces 121 spaced apart along a second direction, and an electronic device 200 is inserted into each interface 121, so that the mounting housing 100 is equipped with a plurality of electronic devices 200 spaced apart along the second direction.

[0140] Below, we will use one electronic device 200 as an example for explanation. When multiple electronic devices 200 are installed on the mounting box 100, the other electronic devices 200 can be set up in the same way.

[0141] In an embodiment of this application, the connector 210 of the electronic device 200 is located at the end of the electronic device 200 outside the mounting box 100.

[0142] This allows for easy connection and maintenance of the electronic device 200 from outside the mounting enclosure 100. Furthermore, it reduces the requirements for the waterproofing of connectors, cables, and other components connected to the electronic device 200.

[0143] It is understood that the connector 210 of the electronic device 200 is located on the end wall of the housing 220 at the end outside the mounting box 100. Specifically, the first end wall 225 can be located outside the mounting box 100 and the second end wall 226 can be located inside the mounting box 100. The first end wall 225 has a mounting hole for mounting the connector 210, and the connector 210 of the electronic device 200 is mounted in the mounting hole of the first end wall 225.

[0144] In this embodiment of the application, one end of the housing 220 of the electronic device 200 is located inside the mounting box 100 and the other end is located outside the mounting box 100. The side wall of the housing 220 and the end wall of the housing 220 located outside the mounting box 100 are made of rigid material, while the end wall of the housing 220 located inside the mounting box 100 is made of elastic material.

[0145] This facilitates the installation of the connector 210 on the end wall of the housing 220 located outside the mounting box 100, reduces pressure fluctuations within the housing 220, and allows the elastic sealing structure 122 to seal the gap between the housing 220 and the inner wall of the insertion interface 121.

[0146] Specifically, when the housing 220 of the electronic device 200 includes a first sidewall 221, a second sidewall 222, a third sidewall 223, a fourth sidewall 224, a first endwall 225, and a second endwall 226, the first endwall 225 can be located outside the mounting box 100, and the second endwall 226 can be located inside the mounting box 100. The first sidewall 221, the second sidewall 222, the third sidewall 223, the fourth sidewall 224, and the first endwall 225 are all made of rigid materials, while the second endwall 226 can be made of elastic materials.

[0147] In an embodiment of this application, a liquid receiving tray 110 is provided on the outer surface of the first tank wall 120, and the liquid receiving tray 110 is located below the insertion interface 121. In the second direction, the insertion interface 121 is located between the two ends of the liquid receiving tray 110.

[0148] In this way, the drip tray 110 can be used to receive the first cooling medium that may be brought out when the electronic device 200 is pulled out from the plug-in interface 121, so that the first cooling medium is not likely to spill onto the ground or the electronic device 200 below when the electronic device 200 is pulled out from the plug-in interface 121.

[0149] It is understandable that when the first box wall 120 has a plurality of insertion ports 121 spaced apart along the second direction, in the second direction, all the insertion ports 121 on the first box wall 120 are located between the two ends of the liquid receiving tray 110.

[0150] In some examples, the drip tray 110 is detachably connected to the first tank wall 120.

[0151] In this way, the primary cooling medium 23 collected in the drip tray 110 can be poured out by removing the drip tray 110.

[0152] In the embodiments of this application, the bottom of the liquid receiving tray 110 has a second drain port 111, which is connected to the inner cavity of the liquid collection tank 2.

[0153] In this way, the primary cooling medium 23 collected in the receiving pan 110 can flow back to the collecting tank 2 through the second drain port 111 to continue to participate in the circulation, which can reduce the loss of the primary cooling medium 23.

[0154] In some embodiments of this application, the second drain port 111 can be connected to the collection tank 2 via a pipeline.

[0155] In some other embodiments of this application, the second drain port 111 is located above the first drain port 140, and the second drain port 111 is connected to the inner cavity of the mounting box 100, so that the second drain port 111 is connected to the inner cavity of the collection box 2 through the inner cavity of the mounting box 100.

[0156] In this way, the primary cooling medium 23 collected in the receiving tray 110 can flow into the mounting box 100 by its own gravity, and flow back to the collection tank 2 through the first drain port 140 of the mounting box 100. This makes the cooling system require fewer pipes, the pipe connections are more convenient, and it occupies less space in the computer room 10 of the data center.

[0157] In an embodiment where the liquid receiving tray 110 has a second drain port 111 at the bottom, the liquid receiving tray 110 and the first tank wall 120 can be an integral structure.

[0158] In this way, the connection between the liquid receiving tray 110 and the first box wall 120 is stable. In addition, it is more convenient to assemble the liquid cooling module 1. Furthermore, it is also convenient to open a second drain port 111 at the bottom of the liquid receiving tray 110 to connect to the inner cavity of the mounting box 100.

[0159] In the embodiments of this application, the mounting box 100 includes a second box wall 130 located on one side in the second direction. The upper part of the second box wall 130 has a through hole 131. The liquid inlet pipe 300 passes through the through hole 131, such that the inlet end of the liquid inlet pipe 300 is located outside the mounting box 100, and the part of the liquid inlet pipe 300 used for installing the spray assembly 500 is located inside the mounting box 100.

[0160] This facilitates the placement of the liquid supply pipe 5 and the electronic device 200 on different sides of the mounting box 100, ensuring that the liquid supply pipe 5 does not obstruct the insertion or removal of the electronic device 200. Furthermore, when multiple electronic devices 200 are spaced apart along the second direction in the mounting box 100, it is convenient to arrange a spray assembly 500 on the liquid inlet pipe 300 to spray all the electronic devices 200.

[0161] In the embodiments of this application, a first flow regulating valve 400 is provided at the inlet end of the liquid inlet pipe 300.

[0162] In this way, the first flow regulating valve 400 can regulate the flow rate of the primary cooling medium 23 flowing into its inlet pipe 300. It can adjust the flow rate of the primary cooling medium 23 sprayed by the spray assembly 500 of each liquid cooling module 1 according to the heat dissipation requirements of each liquid cooling module 1, which facilitates more precise distribution of the primary cooling medium 23, resulting in higher cooling efficiency of the primary cooling medium 23 and helping to reduce the energy consumption of the cooling system.

[0163] In the embodiments of this application, the spray assembly 500 includes a spray pipe 510, with both ends of the spray pipe 510 extending along a first direction. The inlet end of the spray pipe 510 is connected to the outlet end of the heat dissipation device 4 via a liquid supply pipe 5. Spray holes 511 are provided on the pipe wall of the spray pipe 510. The liquid pump 6 is used to drive the primary cooling medium 23 in the liquid collection tank 2 to flow through the liquid outlet pipe 3, the heat dissipation device 4, and the liquid supply pipe 5 to the spray pipe 510. The spray pipe 510 is used to spray the primary cooling medium 23 onto the upper part of the portion of the electronic device 200 located inside the mounting box 100 through the spray holes 511.

[0164] In this way, the spray pipe 510 extending along the first direction can spray the side of the electronic device 200 facing the spray pipe 510, and the spray pipe 510 can spray a large area of ​​the electronic device 200, resulting in better heat dissipation of the electronic device 200. In addition, the primary cooling medium 23 on the surface of the electronic device 200 flows from top to bottom, and the primary cooling medium 23 stays on the surface of the electronic device 200 for a longer time, which can absorb more heat, making the utilization efficiency of the primary cooling medium 23 higher.

[0165] Understandably, the spray assembly 500 can be installed on the upper part of the mounting box 100.

[0166] It is understandable that when the liquid cooling module 1 includes the liquid inlet pipe 300, the inlet end of the spray pipe 510 is connected to the liquid inlet pipe 300, so that the inlet end of the spray pipe 510 is connected to the outlet end of the heat dissipation device 4 through the liquid inlet pipe and the liquid supply pipe 5. The liquid pump 6 is used to drive the primary cooling medium 23 in the liquid collection tank 2 to flow to the spray pipe 510 through the liquid outlet pipe 3, the heat dissipation device 4, the liquid supply pipe 5 and the liquid inlet pipe 300.

[0167] In an embodiment where the liquid cooling module 1 includes a plurality of electronic devices 200 spaced apart along a second direction, that is, when the mounting housing 100 is equipped with the plurality of electronic devices 200 spaced apart along the second direction, the spray assembly 500 includes a plurality of spray pipes 510 spaced apart along the second direction. In the second direction, spray pipes 510 are provided on both sides of each electronic device 200, and the spray pipes 510 are used to spray a primary cooling medium 23 onto the upper part of the portion of the adjacent electronic device 200 located within the mounting housing 100 through spray holes 511. The second direction refers to the thickness direction of the electronic device 200.

[0168] This facilitates the spray assembly 500 to spray multiple electronic devices 200 spaced apart along the second direction. Furthermore, since the electronic devices 200 are cooled by spray from adjacent spray pipes 510, they are less affected by the spray from other spray pipes 510, allowing for independent control of the spray volume from the spray pipes 510 according to the cooling requirements of the electronic devices 200.

[0169] It is understandable that when the first direction is the length direction of the electronic device 200, the width direction of the electronic device 200 is vertical. When the second direction is the width direction of the electronic device 200, the length direction of the electronic device 200 is vertical.

[0170] In an embodiment where the spray assembly 500 includes multiple spray pipes 510 spaced apart along a second direction, the electronic devices 200 and the spray pipes 510 are arranged alternately along the second direction. Spray holes 511 are provided on the pipe walls on both sides of the spray pipe 510 located between two adjacent electronic devices 200. The spray pipe 510 located between two adjacent electronic devices 200 is used to spray a primary cooling medium 23 onto the upper part of the portions of the adjacent electronic devices 200 located within the mounting housing 100.

[0171] In this way, only one spray pipe 510 needs to be arranged between two adjacent electronic devices 200. The number of spray pipes 510 arranged between two adjacent electronic devices 200 is small, and the spray assembly 500 needs to occupy less space, which makes it easier to arrange more electronic devices 200 in the mounting box 100 or reduce the volume of the mounting box 100.

[0172] Figure 11 This is a schematic diagram of a spray pipe for another cooling system provided in an embodiment of this application.

[0173] like Figure 11 As shown in the embodiments of this application, the spray hole 511 is a strip-shaped hole extending along the extension direction of the spray pipe 510.

[0174] In this way, the primary cooling medium 23 sprayed from the spray hole 511 can cover a larger area, and can spray a larger area of ​​the surface of the electronic device 200, resulting in a better cooling effect on the electronic device 200.

[0175] Figure 12 This is a schematic diagram of a spray pipe for another cooling system provided in an embodiment of this application.

[0176] like Figure 12 As shown in the embodiments of this application, a plurality of spray holes 511 are provided on the pipe wall of the spray pipe 510, which are spaced apart along the extension direction of the spray pipe 510.

[0177] In this way, the spray pipe 510 can spray a large area of ​​the surface of the electronic device 200, resulting in a better cooling effect on the electronic device 200.

[0178] Figure 13 This is a perspective view of another cooling system provided in this application before installation on an electronic device. Figure 14 A perspective view of the liquid cooling module of another cooling system provided in an embodiment of this application.

[0179] like Figure 13 , Figure 14 As shown in the embodiment of this application, a second flow regulating valve 520 is provided at the inlet end of the spray pipe 510.

[0180] In this way, the second flow regulating valve 520 can regulate the flow rate of the primary cooling medium 23 sprayed by the spray pipe 510. It can adjust the flow rate of the primary cooling medium 23 according to the heat dissipation requirements of the electronic equipment 200 sprayed by the spray pipe 510, which facilitates more precise distribution of the primary cooling medium 23, resulting in higher cooling efficiency of the primary cooling medium 23 and helping to reduce the energy consumption of the cooling system.

[0181] It is understandable that the liquid cooling module 1 can be equipped with a first flow regulating valve 400 but without a second flow regulating valve 520. Alternatively, the liquid cooling module 1 can be equipped with a second flow regulating valve 520 but without a first flow regulating valve 400. Or, the liquid cooling module 1 can be equipped with both a first flow regulating valve 400 and a second flow regulating valve 520.

[0182] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0183] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0184] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling system, characterized by, It includes a liquid cooling module, a liquid collection tank, a heat dissipation device, a liquid pump, a liquid outlet pipe, and a liquid supply pipe; The liquid collection tank is installed below the liquid cooling module. The liquid collection tank contains primary cooling medium. The liquid collection tank is connected to the inlet end of the heat dissipation device through the liquid outlet pipe. The liquid cooling module includes a mounting box, a spray assembly, and electronic equipment; The spray assembly is located inside the mounting box. The spray assembly is connected to the outlet end of the heat dissipation device through the liquid supply pipe. The liquid supply pipe or the liquid outlet pipe is equipped with the liquid pump. The liquid pump is used to drive the primary cooling medium in the liquid collection tank to flow through the liquid outlet pipe, the heat dissipation device and the liquid supply pipe to the spray assembly. At least a part of the electronic device is installed inside the mounting box. The spray assembly is used to spray the primary cooling medium onto the part of the electronic device located inside the mounting box. The bottom of the installation box has a first drain port, which is connected to the inner cavity of the collection tank. The mounting box has an insertion interface on one side of the box wall in the first direction. The insertion interface passes through the box wall along the first direction. The inner wall of the insertion interface is provided with an elastic sealing structure for sealing the insertion interface. The electronic device is installed inside the connector, with part of the electronic device located inside the mounting box and part located outside the mounting box. The elastic sealing structure is located between the electronic device and the inner wall of the connector, and the elastic sealing structure seals the gap between the electronic device and the inner wall of the connector. Wherein, the first direction is the length direction or width direction of the electronic device, and the first direction is perpendicular to the vertical direction.

2. The cooling system of claim 1, wherein, The electronic device is provided with a connector, which is located at one end of the electronic device outside the mounting box.

3. Cooling system according to claim 1 or 2, characterized in that The outer surface of the box wall having the plug-in interface is provided with a liquid receiving tray, which is located below the plug-in interface; In the second direction, the insertion interface is located between the two ends of the liquid receiving tray; Wherein, the second direction is perpendicular to the vertical direction, and the second direction is perpendicular to the first direction.

4. The cooling system of claim 3, wherein, The bottom of the liquid receiving tray has a second drain port, which is connected to the inner cavity of the liquid collection tank.

5. The cooling system of claim 4, wherein, The second drain outlet is located above the first drain outlet, and the second drain outlet is connected to the inner cavity of the mounting box, so that the second drain outlet is connected to the inner cavity of the collection tank through the inner cavity of the mounting box.

6. Cooling system according to any of claims 1, 2, 4, 5, characterized in that, The liquid cooling module also includes a liquid inlet pipe, the inlet end of which is connected to the outlet end of the heat dissipation device through the liquid supply pipe. The spray assembly is installed on the liquid inlet pipe, so that the spray assembly is connected to the outlet end of the heat dissipation device through the liquid inlet pipe and the liquid supply pipe. The inlet end of the liquid inlet pipe is provided with a first flow regulating valve.

7. Cooling system according to any of claims 1, 2, 4, 5, characterized in that The spray assembly includes a spray pipe with both ends extending along a first direction. The inlet end of the spray pipe is connected to the outlet end of the heat dissipation device through the liquid supply pipe, and spray holes are provided on the pipe wall of the spray pipe. The liquid pump is used to drive the primary cooling medium in the collection tank to flow through the outlet pipe, the heat dissipation device and the supply pipe to the spray pipe. The spray pipe is used to spray the primary cooling medium onto the upper part of the portion of the electronic device located inside the mounting box through the spray holes.

8. The cooling system of claim 7, wherein, The liquid cooling module includes a plurality of said electronic devices spaced apart along the second direction, and the spray assembly includes a plurality of said spray pipes spaced apart along the second direction; In the second direction, the spray pipes are provided on both sides of the electronic device, and the spray pipes are used to spray the primary cooling medium onto the upper part of the adjacent electronic device located inside the mounting box through the spray holes thereon; The second direction is the thickness direction of the electronic device.

9. The cooling system of claim 8, wherein, The electronic devices and the spray pipes are arranged alternately along the second direction, and the spray pipes located between two adjacent electronic devices have spray holes on the pipe walls on both sides of the second direction. The spray pipe located between two adjacent electronic devices is used to spray the primary cooling medium onto the upper part of the portions of the adjacent electronic devices located inside the mounting box.

10. Cooling system according to claim 8 or 9, characterized in that The inlet end of the spray pipe is equipped with a second flow regulating valve.

11. Cooling system according to any of claims 1, 2, 4, 5, 8, 9, characterized in that The electronic device includes electronic components and a sealed housing; At least a portion of the housing is installed inside the mounting box, the electronic device is installed inside the housing, the housing contains a secondary cooling medium, and the electronic device is at least partially immersed in the secondary cooling medium; The spray assembly is used to spray the primary cooling medium onto the portion of the housing located inside the mounting box, and the secondary cooling medium inside the housing is used to exchange heat with the primary cooling medium on the surface of the housing.

12. The cooling system of claim 11, wherein, At least a portion of the shell is made of an elastic material.

13. The cooling system of claim 12, wherein, One end of the housing is located inside the mounting box, and the other end is located outside the mounting box. The side walls of the housing and the end wall of the housing located outside the mounting box are made of rigid material, while the end wall of the housing located inside the mounting box is made of elastic material.

14. The cooling system of any one of claims 1, 2, 4, 5, 8, 9, 12, 13, wherein, It also includes a drain pipe; The cooling system includes multiple liquid cooling modules, and the first drain port of each liquid cooling module is connected to the inner cavity of the liquid collection tank through the drain pipe.

15. The cooling system of any one of claims 1, 2, 4, 5, 8, 9, 12, 13, wherein, It also includes a frame, on which both the liquid cooling module and the liquid collection tank are mounted.

16. A data center, comprising: Includes a computer room and a cooling system as described in any one of claims 1-15; The liquid cooling module and liquid collection tank of the cooling system are installed inside the computer room, while the heat dissipation device of the cooling system is installed outside the computer room.

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