Cooling structure and cooling system comprising the same

Abstract

A cooling structure for cooling electrical components housed in a housing includes a plate heat exchanger having plates defining a first set of gaps and a second set of gaps. The cooling structure also includes a first liquid cooling circuit and a second liquid cooling circuit. A liquid cooling device in the first liquid cooling circuit absorbs heat from the electrical components by receiving a first liquid, guided by a pump, into the first set of gaps. Heat is transferred from the first set of gaps to a second liquid in the second set of gaps of the plate heat exchanger. A pressure relief valve is closed or opened to connect the first and second liquid cooling circuits, thereby selectively allowing the first cooling liquid to flow into the second liquid cooling circuit; the pressure relief valve switches between a closed and an open state based on the pressure in the first liquid cooling circuit.

Description

[0001] This application is a divisional application of Chinese invention patent application filed on May 28, 2021, with application number 2021105907477 and invention title "Uninterruptible Power Supply with Liquid Cooling Device". Technical Field

[0002] This technology relates to uninterruptible power supplies, and more particularly to those used in data centers. Background Technology

[0003] Uninterruptible power supplies (UPS) are used to provide backup power to a target load in case of failure of the target load's primary power supply or other changes that may negatively impact the target load. Specifically, if the primary power supply to the target load is interrupted or otherwise affected, the UPS connected to the target load will immediately take over the power supply without causing any disruption to the system. Therefore, UPSs are critical components in data centers, ensuring the continuous operation of servers and other equipment housed within the data center, such as cooling systems.

[0004] While UPS systems are undoubtedly useful, they typically generate significant amounts of heat, which must be considered in their design and their surrounding environment (e.g., their placement within a data center). Numerous thermal management solutions exist for UPS systems, including, for example, providing a dedicated air-cooling unit (e.g., an air handling unit) between two UPSs to allow them to draw in air exhausted from the air-cooling unit, or, for example, providing a partition wall for each UPS to ensure cool air is introduced into that UPS. However, these solutions can require substantial resources to implement and can occupy considerable space within the data center. For instance, in some cases, raised floors and / or false ceilings may be implemented to provide pathways for the circulation of heated or cooled air.

[0005] Therefore, a UPS that can mitigate at least some of these drawbacks is desired. Summary of the Invention

[0006] The purpose of this technology is to improve at least some of the inconveniences existing in the prior art.

[0007] According to one aspect of the present technology, an uninterruptible power supply (UPS) is provided. The UPS includes: a housing defining an internal space; a door operably connected to the housing, the door being configured to selectively open and close for access to the internal space of the housing; an electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling the target component, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device partially defining a liquid cooling circuit, the pumping module being mounted to the door and disposed outside the door.

[0008] In some embodiments, the door defines at least one opening. The UPS also includes a gas-liquid heat exchanger configured to cool air flowing through it, the gas-liquid heat exchanger being mounted to the door and located on the outside of the door and at least partially aligned with at least one opening. The gas-liquid heat exchanger includes: a cooling coil for circulating fluid therethrough; and a plurality of heat sinks in thermal contact with the cooling coil. The UPS also includes at least one fan housed within the housing when the door is closed, the at least one fan being configured to force airflow through at least one opening of the door and through the gas-liquid heat exchanger.

[0009] In some implementations, the gas-liquid heat exchanger is positioned vertically above the pumping module.

[0010] In some implementations, at least one fan is mounted to the door and located on the inside of the door.

[0011] In some embodiments, the housing includes a top wall defining a top opening so that air is introduced into the interior space of the housing through the top opening.

[0012] In some embodiments, the housing includes a bottom wall that defines a bottom opening so that air can be introduced into the interior space of the housing through the bottom opening.

[0013] In some embodiments, the pumping module further includes at least one plate heat exchanger defining a portion of a liquid cooling circuit, the at least one plate heat exchanger being fluidly connected to at least one pump and at least one liquid cooling device. Fluid in the liquid cooling circuit cooled by the at least one plate heat exchanger is routed to the at least one liquid cooling device.

[0014] In some embodiments, the door defines at least one opening. The UPS also includes a gas-liquid heat exchanger configured to cool air flowing through it, the gas-liquid heat exchanger being mounted to the door and located on the outside of the door and at least partially aligned with the at least one opening. The gas-liquid heat exchanger includes: a cooling coil for circulating fluid through it, the cooling coil defining a portion of an air cooling circuit; and a plurality of heat sinks in thermal contact with the cooling coil. The pumping module also includes at least one plate heat exchanger defining a portion of a liquid cooling circuit and a portion of an air cooling circuit, such that heat can be transferred between the fluid in the liquid cooling circuit and the fluid in the air cooling circuit at the at least one plate heat exchanger.

[0015] In some implementations, the cooling coils of the gas-liquid heat exchanger are configured to connect to an external cooling system, such that the air cooling circuit is at least partially defined outside the UPS. The liquid cooling circuit is entirely defined locally within the UPS.

[0016] In some embodiments, the door is a first door; the gas-liquid heat exchanger is a first gas-liquid heat exchanger; at least one fan is at least one first fan; and the pumping module is a first pumping module. The UPS also includes: a second door operatively connected to the housing, configured to selectively open and close for access to the interior space of the housing, the second door defining at least one opening; a second pumping module including at least one pump fluidly connected to at least one liquid cooling device to circulate fluid through a liquid cooling loop, the second pumping module being mounted to the second door and positioned outside the second door; and a second gas-liquid heat exchanger mounted to the second door and located on the outside of the second door, the second gas-liquid heat exchanger being configured to cool air flowing through it, the second gas-liquid heat exchanger being at least partially aligned with at least one opening of the second door. The gas-liquid heat exchanger includes: a cooling coil for circulating fluid therethrough; and a plurality of heat sinks in thermal contact with the cooling coil of the second gas-liquid heat exchanger. The UPS also includes at least one second fan housed within the housing when the second door is closed, the at least one second fan being configured to force airflow through at least one opening of the second door and through a second gas-liquid heat exchanger.

[0017] In some implementations, the electrical system includes: a rectifier module configured to be electrically connected to at least one battery for charging it; and an inverter module electrically connected to at least one battery for supplying power from the at least one battery to a target load. The target component is a part of the UPS electrical system.

[0018] In some embodiments, at least one of the inverter module and the rectifier module includes: a plurality of semiconductors; and at least one liquid cooling device mounted to at least one semiconductor.

[0019] According to another aspect of the present technology, a door assembly for an uninterruptible power supply (UPS) is provided, the UPS including a housing defining an internal space. The door assembly includes: a door having an inner side and an outer side, the door being configured operably connected to the UPS housing such that the door can be selectively opened and closed for access to the internal space of the housing; and at least one pumping module including at least one pump configured to be fluidly connected to at least one liquid cooling device disposed in the internal space of the UPS to circulate fluid therethrough, the pumping module being mounted to the door and disposed on the outer side of the door.

[0020] In some embodiments, the door defines at least one opening. The door assembly also includes a gas-liquid heat exchanger configured to cool air flowing through it, the gas-liquid heat exchanger being mounted to the door and located on the outside of the door and at least partially aligned with the at least one opening. The gas-liquid heat exchanger includes: a cooling coil for circulating fluid therethrough; and a plurality of heat sinks in thermal contact with the cooling coil.

[0021] In some embodiments, the door assembly also includes at least one fan mounted to the door and located on the inside of the door, the at least one fan being configured to force airflow through at least one opening of the door and through a gas-liquid heat exchanger.

[0022] The embodiments of this technology each have at least one of the above-described objectives and / or aspects, but not necessarily all of them. It should be understood that some aspects of this technology arising from attempts to achieve the above objectives may not satisfy those objectives and / or may satisfy other objectives not specifically described herein.

[0023] Additional and / or alternative features, aspects and advantages of embodiments of the present technology will become apparent from the following description, drawings and appended claims. Attached Figure Description

[0024] To better understand this technology, as well as other aspects and additional features thereof, reference is made to the following description used in conjunction with the accompanying drawings, wherein:

[0025] Figure 1 This is a perspective view of an uninterruptible power supply (UPS) according to an embodiment of the present technology, taken from the upper right side.

[0026] Figure 2 yes Figure 1 A 3D view of the UPS taken from the top left;

[0027] Figure 3 yes Figure 1 Front view of the UPS;

[0028] Figure 4yes Figure 1 The right-side front view of the UPS;

[0029] Figure 5 yes Figure 1 Top plan view of the UPS;

[0030] Figure 6 yes Figure 1 A schematic illustration of the electrical system of a UPS;

[0031] Figure 7 From Figure 1 The 3D view of the UPS taken from the upper left shows different walls of the UPS housing being removed and the UPS door being opened.

[0032] Figure 8 yes Figure 7 A 3D view of the UPS taken from the upper right side;

[0033] Figure 9 yes Figure 7 A 3D view of a portion of the UPS, taken from the upper left, showing the multiple liquid cooling units of the UPS;

[0034] Figure 10 yes Figure 9 Top floor plan of a portion of the UPS;

[0035] Figure 11 yes Figure 1 A schematic diagram of the UPS pump module and cooling circuit;

[0036] Figure 12 yes Figure 11 A schematic diagram of a plate heat exchanger for a pumping module;

[0037] Figure 13 yes Figure 1 A diagram showing the liquid cooling circuit and air cooling circuit of a UPS;

[0038] Figure 14 yes Figure 1 Front view of the gas-liquid heat exchanger of the UPS;

[0039] Figure 15 It is a 3D view of the UPS boost bridge and three rectifier / inverter bridges, with liquid cooling equipment installed on each bridge;

[0040] Figure 16 yes Figure 15 Front view of the bridge;

[0041] Figure 17 yes Figure 1 A 3D view of one of the liquid cooling devices in a UPS;

[0042] Figure 18 yes Figure 17 Front view of the liquid cooling equipment;

[0043] Figure 19 yes Figure 17 Bottom plan view of the liquid cooling equipment;

[0044] Figure 20 yes Figure 17 An exploded view of a liquid cooling device, showing three semiconductors to be cooled by the liquid cooling device;

[0045] Figure 21 yes Figure 17 A perspective view of the base components of a liquid cooling device;

[0046] Figure 22 yes Figure 21 Top plan view of the base components;

[0047] Figure 23 yes Figure 21 A top plan view of the base component, with the semiconductor located below shown in dashed lines; and

[0048] Figure 24 This is an exploded view of a liquid cooling device according to an alternative embodiment. Detailed Implementation

[0049] Figures 1 to 5 An uninterruptible power supply (UPS) 10 according to an embodiment of the present technology is shown. In use, the UPS 10 is electrically connected to a target load 13 (see figure 10). Figure 6 The UPS 10 is designed to provide backup power to the target load 13 in case the main power source 17 (e.g., the power grid) supplying power to the target load 13 fails or experiences intermittent performance (e.g., voltage spikes). The UPS 10 can be used in different types of applications, and therefore the target load 13 can be configured as different types of devices depending on the application. For example, in this particular example, the UPS 10 is used in a data center 100 to provide backup power to data center devices housed within the data center 100. Therefore, in this example, the target load 13 is a data center device, which may include, but is not limited to, servers, network devices, cooling devices, etc.

[0050] As will be described in more detail below, UPS 10 is at least partially cooled by a liquid cooling system supplied and discharged via at least one pumping module of UPS 10. This helps to cool UPS 10 more effectively while maintaining its safe operating conditions. Furthermore, as will be discussed further below, it also provides greater flexibility in the configuration of data center 100, as UPS 10 can be subject to fewer design constraints compared to conventional UPS systems.

[0051] like Figure 1 As shown, the UPS 10 has a housing 12 that defines an internal space 15 in which the various electrical components of the UPS 10 are housed. The housing 12 has left and right walls 14, a top wall 16, a bottom wall 18, and a rear wall (not shown), which together define the internal space 15. The top wall 16 and bottom wall 18 extend generally horizontally, while the left and right walls 14 and the rear wall extend generally vertically. The housing 12 also includes a frame 20 (in... Figure 7 and Figure 8 (shown in more detail below) to support the different walls of housing 12 and the different electrical components of UPS 10. For example, in this embodiment, frame 20 includes: four vertical beams 22 (one beam located at each corner of UPS 10); three upper lateral beams and three lower lateral beams 24, each extending laterally between two of the vertical beams 22; and two upper transverse beams and two lower transverse beams 26 extending laterally to the vertical and lateral beams 22, 24. Each transverse beam 26 connects between two of the vertical beams 22. Frame 20 also includes four legs 27, each connected to the lower end of a corresponding vertical beam in vertical beam 22. Legs 27 are configured to be supported by a support surface (e.g., floor). Furthermore, legs 27 lift the bottom wall 18 away from the support surface. In other embodiments, housing 12 and its frame 20 may be configured in any other suitable manner.

[0052] The interior space 15 of the housing 12 can be accessed via two doors 30 located on the front side of the UPS 10 and operably connected to the housing 12. The doors 30 are selectively opened and closed to access the interior space 15. Specifically, the doors 30 are hinged to the housing 12 such that each door 30 can be pivotally opened and closed about a corresponding hinge 32 defining a vertically extending hinge axis. Each door 30 is generally rectangular and has an inner side 34 and an outer side 36. When the door 30 is closed, the inner side 34 faces the interior space 15. One of the doors 30 has a lock 36, which is actuated by a key (not shown) when the door 30 is closed to lock or unlock the door 30. Such locks are known and will therefore not be described in detail herein.

[0053] Door 30 supports the pumping module 60 and the gas-liquid heat exchanger 90 for auxiliary cooling of the UPS 10. Notably, the pumping module 60 and the gas-liquid heat exchanger 90 are mounted to door 30, allowing the UPS 10 to be cooled more autonomously than a conventional UPS. The pumping module 60 and the gas-liquid heat exchanger 90 will be described further below.

[0054] like Figure 6 As shown, the UPS 10 has an electrical system 40 enclosed within a housing 12, i.e., an internal space 15. The electrical system 40 includes multiple electrical components that work together to ensure the operation of the UPS 10 to provide backup power to a target load. In this embodiment, the UPS 10 is a double-conversion online UPS. Notably, the electrical system 40 includes: a rectifier module 42 configured to receive power from a main power source 17; an inverter module 44 configured to supply power to the target load 15; and an internal static bypass switch 46 configured to bypass the rectifier module 42 and the inverter module 44.

[0055] A rectifier module 42 is electrically connected to a plurality of batteries 45 for charging. In this embodiment, the batteries 45 are located externally to the UPS 10, i.e., in a space adjacent to the space of the data center 100 in which the UPS 10 is located. In other embodiments, the batteries 45 may be part of the electrical system 40 of the UPS 10 and are enclosed within the internal space 15 of the housing 12. The rectifier module 42 charges the batteries 45 by converting alternating current (AC) charge supplied by the main power supply 17 into direct current (DC) charge, which is used as the input for charging the batteries 45. On the other hand, an inverter module 44 is electrically connected to the batteries 45 to supply power from the batteries 45 to the target load 13. Specifically, the inverter module 44 is configured to convert the DC charge of the batteries 45 into AC charge to supply power to the target load 13. In itself, the internal static bypass switch 46 allows for momentary bypass of the rectifier module 42, inverter module 44, and battery 45 to supply power directly to the target load 13 via the main power source 17, for example, in the event of an internal fault or failure within the electrical system 40 of the UPS 10. This thus ensures power continuity to the target load 13 when the UPS 10 is repaired.

[0056] like Figure 15 and Figure 16 As shown, the electrical system 40 also includes a boost module 52 electrically connected to the battery 45 and rectifier and inverter modules 42, 44. The boost module 52 is configured to compensate for undervoltage of the power supplied by the battery 45. The boost module 52 includes a boost bridge 53, which may include multiple choke coils.

[0057] The rectifier module 42, inverter module 44, internal static bypass switch 46, and boost module 52 include different types of semiconductors. For example, Figure 15 and Figure 16 As shown, rectifier module 42, inverter module 44, and boost module 52 include multiple semiconductors 115. The semiconductors can be of any suitable type. In this embodiment, the semiconductors 115 of rectifier module 42, inverter module 44, and boost module 52 are insulated-gate bipolar transistors (IGBTs). The semiconductors 115 of rectifier module 42 and inverter module 44 are formed by a rectifier-inverter bridge 48. The semiconductors 115 of boost module 52 are formed by a boost bridge 53. Furthermore, the internal static bypass switch 46 also has multiple semiconductors (not shown) serving as a thyristor module. The semiconductors of rectifier and inverter modules 42, 44, the semiconductor of the internal static bypass switch 46, and the semiconductor of boost module 52 are well-known and manufactured by, for example, Semikron©. Other different types of semiconductors are also conceivable.

[0058] As can be seen, in Figure 19 and Figure 20 In this embodiment, each semiconductor 115 has a generally rectangular upper surface. Furthermore, each semiconductor 115 has two connectors at its opposite ends, which allow the semiconductor 115 to be secured to a liquid cooling device, as will be described in more detail below. Notably, each connector is configured to receive a fastener therein.

[0059] It is conceivable that in other embodiments, the electrical system 40 may be configured differently. For example, in other embodiments, the UPS 10 may be a type other than a double-conversion online UPS, and therefore, the electrical system 40 may include additional electrical components or may omit some components.

[0060] Furthermore, those skilled in the art will understand that electrical system 40 includes various other electrical components—not described herein for the sake of brevity; that is, because the specific configuration of electrical system 40 is not particularly important in the context of this application, this description of electrical system 40 is not intended to be exhaustive. For example, other electrical components such as feedback protection devices, filters, chokes, capacitors, fuses, etc., are also part of electrical system 40.

[0061] The various components of the electrical system 40 generate a significant amount of heat during operation. Therefore, to prevent overheating of these components (which could negatively impact their performance), the UPS 10 incorporates a cooling system that combines liquid and air cooling. More specifically, the UPS 10 is cooled by: (i) circulating ambient air through the internal space 15 of the UPS 10, thereby exhausting heated air from it via two gas-liquid heat exchangers 90; and (ii) routing water to multiple liquid cooling devices 50 disposed within the internal space 15 of the UPS 10 to cool certain components of the electrical system 40.

[0062] The method by which the gas-liquid heat exchanger 90 ensures air cooling of the UPS 10 will now be described. Both gas-liquid heat exchangers 90 are identical, and therefore this document will refer to... Figure 14 This description refers to only one gas-liquid heat exchanger in the gas-liquid heat exchanger 90. It should be understood that this description applies to two gas-liquid heat exchangers 90.

[0063] A gas-liquid heat exchanger 90 is configured to cool air flowing through it. The gas-liquid heat exchanger 90 includes a cooling coil 92 for circulating fluid through it. Figure 14 (Shown in dashed lines). Specifically, in this embodiment, water is circulated through a cooling coil 92. For this purpose, the cooling coil 92 has an inlet 96 and an outlet 98 to supply water to and discharge water from the cooling coil 92, respectively. As will be explained in more detail below, the cooling coil 92 is fluidly connected to a corresponding pumping module in the pumping module 60. The gas-liquid heat exchanger 90 also includes a plurality of heat sinks 94 in thermal contact with the cooling coil 92. The heat sinks 94 are spaced apart from each other to allow air to flow therebetween and thus through the gas-liquid heat exchanger 90. The gas-liquid heat exchanger 90 has a frame 95 supporting the cooling coil 92 and the heat sinks 94.

[0064] In this embodiment, the gas-liquid heat exchanger 90 is installed into a corresponding door in the door 30. Notably, the frame 95 of the gas-liquid heat exchanger 90 is fixed to the outer side 36 of the door 30. The gas-liquid heat exchanger 90 is positioned vertically higher than the corresponding pumping module 60. As will be explained in more detail below, this vertically elevated position of the gas-liquid heat exchanger 90 facilitates the circulation of air through the UPS 10. Furthermore, the gas-liquid heat exchanger 90 is connected to the door opening 91 defined by the door 30 (in... Figure 3 (shown in dashed line) Alignment allows air to flow from the interior space 15 through the door opening 91 and through the gas-liquid heat exchanger 90.

[0065] In order to force air through the gas-liquid heat exchanger 90, in this embodiment, as... Figure 7As shown, multiple fans 102 are mounted to each door 30, located on its inner side 34. Specifically, in this embodiment, twelve fans 102 are mounted to each door 30 and aligned with the corresponding door opening 91, such that when the fans 102 are activated, they force air through the door opening 91 and through the gas-liquid heat exchanger 90. As can be seen, when the door 30 is closed, the fans 102 are housed within the housing 12. In this embodiment, the fans 102 are relatively small in size, and the axis of rotation of the impeller of each fan 102 extends generally horizontally.

[0066] like Figure 4 As indicated by arrow 97, the operation of fan 102 draws air into the interior space 15 of housing 12 through top wall 16 and bottom wall 18, and forces it out through door opening 91 and gas-liquid heat exchanger 90. Specifically, top wall 16 defines a plurality of top openings 23 (… Figure 5 In this embodiment, the plurality of top openings are slits. Similarly, the bottom wall 18 defines a plurality of bottom openings (not shown) in the shape of slits. Ambient air is thus introduced into the interior space 15 through the top openings 23 and bottom openings of the top wall 16 and bottom wall 18. The air introduced into the interior space 15 absorbs some of the heat generated by the UPS 10 and is then forced out through the door opening 91 and the gas-liquid heat exchanger 90, where heat is transferred from the air to the water circulating through the cooling coil 92. Thus, the air exhausted on the other side of the gas-liquid heat exchanger 90 is cooled, and therefore a cool ambient temperature can be maintained around the UPS 10 (in this case, the data center). As will be understood, the vertical positioning of the gas-liquid heat exchanger 90 above the pumping module 60 on the door 30 facilitates the expulsion of air entering from the top openings 23 and bottom openings of the top wall 16 and bottom wall 18 (through the gas-liquid heat exchanger 90) in a suitable airflow distribution manner, since the gas-liquid heat exchanger 90 is approximately at the mid-height of the door 30.

[0067] As stated above, and as in Figure 9 and Figure 10As shown, the UPS 10 includes multiple liquid cooling devices 50 enclosed within an internal space 15 of the housing 12 for cooling various electrical components of the electrical system 40. Specifically, in this embodiment, the liquid cooling devices 50 are mounted to the semiconductors of the rectifier module 42, inverter module 44, and internal static bypass switch 46 to cool them. Notably, because the semiconductors generate heat during their operation, each liquid cooling device 50 absorbs heat from the corresponding semiconductor and dissipates the heat via a fluid circulating through a fluid conduit 125 defined by the liquid cooling device 50 (described in further detail below). Such liquid cooling devices 50 are also commonly referred to as “cold plates” or “water seals,” and different types of fluids can be used to transfer heat out of the liquid cooling device. In this embodiment, water circulates through the liquid cooling device 50 to dissipate heat therefrom. It is contemplated that other fluids (e.g., dielectric fluids) can be used instead of water.

[0068] It should be understood that the liquid cooling device 50 can be installed on electrical components other than semiconductors. Notably, the liquid cooling device 50 can be installed on various other heat-generating electrical components of the electrical system 40, including, for example, chokes.

[0069] The liquid cooling device 50 will be described in further detail below.

[0070] Liquid cooling device 50 defines a portion of an internal fluid circuit C1 through which water circulates locally at UPS 10. Conversely, in this embodiment, during use, the cooling coil 92 of gas-liquid heat exchanger 90 defines a portion of an external fluid circuit C2 through which water circulates at least partially outside UPS 10, i.e., through external cooling device 75 (in Figure 11 and Figure 13 (Illustrated schematically). The external cooling unit 75 can be any type of device configured to cool water routed to the unit from the cooling system of the UPS 10. For example, in this embodiment, the external cooling unit 75 is a dry cooler installed outside the data center (e.g., on the roof of the data center).

[0071] Since an internal fluid circuit C1 is provided to supply water to the liquid cooling device 50, the internal fluid circuit C1 can be alternatively referred to as the "liquid cooling circuit". Similarly, since an external fluid circuit C2 is provided to supply water to the gas-liquid heat exchanger 90, the external fluid circuit C2 can be alternatively referred to as the "air cooling circuit".

[0072] To circulate water through the liquid cooling circuit C1 (including the liquid cooling device 50), two pumping modules 60 are provided. Notably, as described above, each pumping module 60 is mounted to a corresponding door among the two doors 30 and is positioned on the outer side 36 of that door. In this embodiment, the two pumping modules 60 are configured identically, i.e., mirror images of each other. Therefore, only one of the pumping modules 60 will be described in detail herein. It should be understood that this description applies to both pumping modules 60.

[0073] refer to Figure 11 and Figure 13 The pumping module 60 includes two pumps 62 fluidly connected to the liquid cooling device 50 to circulate water through the liquid cooling circuit C1 of the UPS 10. It is conceivable that fewer or more pumps 62 (e.g., a single pump 62) could be provided in other embodiments. In this embodiment, the two pumps 62 are relatively small to accommodate their positioning on the corresponding gate 30, which has a limited surface area for housing the pumping module 60. Notably, the pumps 62 are fluidly connected in series and therefore could functionally be replaced by a larger, more powerful pump. However, due to the size limitation of the gate 30, two pumps 62 are provided in this embodiment instead of a single larger pump. Furthermore, the fluidly connected two pumps 62 add a degree of redundancy to the pumping module 60; notably, in the event that one of the pumps 62 stops working, the second pump 62 can continue to ensure the flow of water in the liquid cooling circuit C1.

[0074] The pumping module 60 also includes two plate heat exchangers 64 fluidly connected in series for transferring heat from water circulating in the liquid cooling circuit C1 to water circulating in the air cooling circuit C2. Therefore, in use, the plate heat exchangers 64 define a portion of both the liquid cooling circuit and the air cooling circuits C1 and C2 (no actual water exchange occurs between the two circuits C1 and C2 at the plate heat exchangers 64). Figure 13 As shown, in the liquid cooling circuit C1, the plate heat exchanger 64 is fluidly connected to the pump 62 and the liquid cooling device 50. In the air cooling circuit C2, the plate heat exchanger 64 of the pumping module 60 is fluidly connected to the cooling coil 92 of the corresponding gas-liquid heat exchanger 90 (located on the same gate 30 as the pumping module 60) and also fluidly connected to the external cooling device 75. It is conceivable that in other embodiments, fewer or more plate heat exchangers 64 may be provided (e.g., a single plate heat exchanger).

[0075] refer to Figure 12This illustration shows a simplified representation of a plate heat exchanger 64, each comprising a plurality of plates 65 stacked on top of each other and defining gaps 67 between them to allow fluid circulation between the plates 65. Each plate heat exchanger 64 has two inlets and two outlets, one inlet and one outlet corresponding to each loop C1, C2. Each plate 65 defines an orifice to separately fluidly connect a first subgroup of gaps 67 to a second subgroup of gaps 67, wherein each subgroup of gaps 67 defines a portion of a corresponding one of a liquid cooling loop C1 and an air cooling loop C2. The gaps 67 in each subgroup of gaps 67 are arranged in an alternating manner such that a gap 67 defining a portion of one of loops C1, C2 is adjacent to a gap 67 defining a portion of the other of loops C1, C2. Thus, heat is transferred from one of loops C1, C2 to the other of loops C1, C2 via the plates 65. As will be understood, the water from the liquid cooling circuit and the air cooling circuits C1 and C2 will not mix in the plate heat exchanger 64. Such a plate heat exchanger 64 is known and will therefore not be described in detail herein.

[0076] like Figure 11 and Figure 13 As shown, the pumping module 60 also includes an expansion tank 66 fluidly connected to the liquid cooling circuit C1. The expansion tank 66 compensates for pressure changes in the liquid cooling circuit C1 based on temperature variations. The expansion tank 66 can be fluidly connected to the liquid cooling circuit C1 at different locations. A pressure reducing valve 68 is fluidly connected between the junction J1 of the liquid cooling circuit C1 and the junction J2 of the air cooling circuit C2. Junction J1 is located between the liquid cooling device 50 and the pump 62, such that water heated at the liquid cooling device 50 passes through junction J1 before reaching the pump 62. Junction J2 is located between the plate heat exchanger 64 and an external cooling device 75 that defines a portion of the air cooling circuit C2. Water heated at the plate heat exchanger 64 in the air cooling circuit C2 passes through junction J2 before reaching the external cooling device 75. The pressure reducing valve 68 ensures that makeup water is added to the liquid cooling circuit C1 when the pressure in the liquid cooling circuit C1 drops below a certain value (e.g., 1.5 bar). In different embodiments of the liquid used in the liquid cooling circuit C1 and the air cooling circuit C2, the pressure reducing valve 68 is omitted.

[0077] A pressure relief valve 70 is fluidly connected between the junction J3 of the liquid cooling circuit C1 and the junction J4 of the air cooling circuit C2 to open the liquid cooling circuit C1 to the air cooling circuit C2 when the pressure in the liquid cooling circuit C1 exceeds a certain value (e.g., 3 bar). Junction J3 is located between the pump 62 and the plate heat exchanger 64, such that the water pumped by the pump 62 passes through junction J3 before reaching the plate heat exchanger 64. Junction J4 is located between junction J2 and the external cooling device 75. In embodiments where different liquids are used in the liquid cooling circuit C1 and the air cooling circuit C2, the pressure relief valve 70 is omitted.

[0078] The pumping module 60 also includes a filter 72 for filtering water in the air-cooled circuit C2 before it enters the plate heat exchanger 64. The filter 72 also filters water in the liquid-cooled circuit C1 when it is initially filled (during setup of the cooling system of the UPS 10). In some embodiments, an additional filter with higher filtration capacity may be installed between the joint J2 and the pressure reducing valve 68 to enhance filtration of water in the liquid-cooled circuit C1 when it is initially filled.

[0079] like Figure 11 As shown, in this embodiment, components 62, 64, 66, 68, 70, and 72 of the pumping module 60 are mounted to a base frame 74 connected to the outside of the corresponding door 30. The base frame 74 includes a planar plate 76 and a plurality of protrusions (not shown) extending generally perpendicular to the plate 76. The various components 62, 64, 66, 68, 70, and 72 of the pumping module 60 are supported by the protrusions. Specifically, the plate 76 and the protrusions of the base frame 74 are made of a single sheet of metal material that has been cut and bent. In other embodiments, the base frame 74 may be made in different ways. Additionally, as... Figures 1 to 3 As shown, the cover plate 80 is removably connected to the base frame 74 to cover the components of the pumping module 60 supported by the base frame 74.

[0080] Now back Figure 13 The liquid cooling circuit C1 fluidly connects the pump 62, the plate heat exchanger 64, and the liquid cooling device 50 to each other. Specifically, in the liquid cooling circuit C1, water from the liquid cooling device 50 flows to the pump 62 (via pipe 71). Figure 1 , Figure 2Here, water is pumped to plate heat exchanger 64 for cooling. Therefore, pump 62 ensures water circulation through liquid cooling circuit C1. At plate heat exchanger 64, as heat is transferred from the water in liquid cooling circuit C1 to the water routed to plate heat exchanger 64 in air cooling circuit C2, the water routed to the plate heat exchanger by pump 62 is cooled. Therefore, in liquid cooling circuit C1, cooled water is routed from plate heat exchanger 64 to liquid cooling device 50 (via pipe 73, Figures 1 to 3 This allows for the cooling of components in the electrical system 40, which is equipped with liquid cooling device 50. Therefore, the process continuously circulates as heated water is routed from liquid cooling device 50 to pump 62, etc. Simultaneously, air cooling circuit C2 fluidly connects the plate heat exchanger 64 of pumping module 60, external cooling device 75, and corresponding gas-liquid heat exchanger 90. Specifically, in air cooling circuit C2, cooled water is discharged through external cooling device 75 and flows from external cooling device 75 to inlet 96 of cooling coil 92. The water then flows through cooling coil 92, where heat is transferred from the air flowing between heat sinks 94 (and thus through gas-liquid heat exchanger 90) to the water in cooling coil 92. The water then flows from outlet 98 of cooling coil 92 to inlet of one of the plate heat exchangers 64. In plate heat exchanger 64, heat is transferred from water in liquid cooling circuit C1 to water in air cooling circuit C2. Therefore, in the air cooling circuit C2, the heated water is discharged through the outlet of the second continuous plate heat exchanger 64 and routed to the external cooling device 75. Thus, the process continuously cycles as the water cooled by the external cooling device 75 is routed back to the cooling coil 92 of the gas-liquid heat exchanger 90.

[0081] The piping extending between the main piping of the UPS 10 (which is connected to various components of the pumping module 60 and to the gas-liquid heat exchanger 90) and the liquid cooling equipment 50 is flexible piping with quick-connect fittings to facilitate its installation and maintenance, and also to improve safety by reducing the chance of leaks in the piping system.

[0082] Other devices may also define a portion of loops C1 and C2, but are not described for simplicity. For example, air cooling loop C2 is also partially defined by one or more pumps (not shown) to ensure water circulation in air cooling loop C2. In this embodiment, these pumps are not present in UPS 10, but rather form part of the data center installation, because air cooling loop C2 can also be used in part to route water to other devices in the data center (e.g., servers) for cooling.

[0083] Although the liquid cooling circuit C1 has been described for simplicity with respect to a single pumping module in pumping module 60, it should be understood that in this embodiment, the liquid cooling circuit C1 of UPS 10 is defined by components of the two pumping modules 60 described above. It is noteworthy that, as Figure 10 As shown in the optimal configuration, a T-shaped or Y-shaped pipe fitting 77 is provided along the liquid cooling circuit C1, which is in fluid communication with pipes 71 and 73 to distribute water from the two pumping modules 60 to all liquid cooling devices 50, and vice versa. Furthermore, the fluid connection of the two pumping modules 60 adds a degree of redundancy. Notably, if one of the pumping modules 60 must cease operation or be removed for maintenance, the second pumping module 60 continues to ensure water flow in the liquid cooling circuit C1.

[0084] Similarly, although the air cooling circuit C2 has been described for simplicity with respect to a single pumping module in pumping module 60, it should be understood that in this embodiment, the air cooling circuit C2 is defined by components of the two pumping modules 60 and two gas-liquid heat exchangers 90. Notably, although each gas-liquid heat exchanger 90 is fluidly connected to the plate heat exchanger 64 of the corresponding pumping module 60 (mounted to the same door 30), the water in the portion of the air cooling circuit C2 defined by the plate heat exchangers 64 of the two pumping modules 60 is combined into the same conduit for routing to the external cooling device 75 conduit. Furthermore, both gas-liquid heat exchangers 60 are fluidly connected to the external cooling device 75 to receive cooling water from it.

[0085] Liquid cooling of the electrical components of the UPS 10 via liquid cooling unit 50 and pumping module 60 significantly dissipates the heat generated by the UPS 10. For example, 70% to 90% of the heat generation capacity of the UPS 10 can be dissipated by liquid cooling provided by liquid cooling unit 50. Therefore, air cooling of the UPS 10 via gas-liquid heat exchanger 90 only requires dissipating a small fraction of the UPS 10's heat generation capacity. Compared to conventional UPSs, this allows for a reduction in the size of the UPS 10's air cooling system, thereby optimizing space utilization within the data center. It is worth noting that conventional UPSs typically rely solely on forced air convection for cooling, and therefore, the air cooling system must be powerful and large enough to handle all of the UPS's heat generation capacity. For example, in some cases, conventional UPSs rely on air processors located between UPS units for cooling, or on large computer room air conditioning (CRAC) units to cool the room where the UPS is located.

[0086] As described above, placing the pump module 60 and the gas-liquid heat exchanger 90 on the door 30 of the UPS 10 offers several advantages. Notably, the pump module 60 and its pump 62 can remain compact and locally accessible within the UPS 10, rather than requiring a large pumping system to circulate water to all UPS units in the data center. Furthermore, the easy accessibility of the pump module 60 and the gas-liquid heat exchanger 90 facilitates their maintenance. For example, components of the pump module 60, including, for example, the pump 62, and the gas-liquid heat exchanger 90, can be removed from the UPS 10 from the outside. Similarly, the location of the fan 102 on the door 30 allows for easy access to it. Additionally, positioning the pump module 60 outside the internal space 15 of the UPS 10 ensures that any potential leaks at the pump module 60 will not adversely affect components of the electrical system 40, thereby generally ensuring the safety of the UPS 10 and the data center. Similarly, the location of the gas-liquid heat exchanger 90 on the outside of the door 30 allows the connection between the external cooling unit 75 and the UPS 10 to be external to the UPS 10, thereby preventing any potential leakage at the connection from affecting the function of the UPS 10. This can facilitate the process of obtaining safety certification for the UPS 10, even though its implemented liquid cooling circuit extends partially within the internal space 15.

[0087] Furthermore, as will be understood, placing the pump module 60 and the gas-liquid heat exchanger 90 on the front side of the UPS 10, particularly on the outer side 36 of the door 30, allows for the two UPS 10s to be positioned side-by-side, thereby reducing the surface area required for housing and maintaining the UPS 10s within the data center. Additionally, this method of cooling the UPS 10 eliminates the need for any fixtures on top of the UPS 10 (i.e., above the top wall 16 of the housing 12), allowing the UPS 10 to be installed in facilities with low ceilings, as only a small gap is needed above the top wall 16 to allow air to be introduced into the interior space 15. In contrast, conventional UPS systems often require a sideways placement of an air handling unit between two UPSs for air to circulate through, with the air handling unit occupying a significant amount of space. Furthermore, conventional UPS systems often require an isolation barrier above the UPS to create "hot" and "cold" pathways to prevent hot air from mixing with the cold air circulating through the UPS. In addition to requiring a considerable amount of space, this also presents challenges in terms of ceiling height and UPS cable management. Furthermore, the hot and cold pathways formed by the isolation barrier typically require the implementation of raised floors and false ceilings to allow the circulation of cooled and hot air, which can be eliminated by this technology.

[0088] Furthermore, the above configuration can facilitate the retrofitting of conventional UPS systems to improve their cooling capacity and provide them with cooling autonomy. Notably, a door assembly including door 30 and the associated pumping module 60, as well as the gas-liquid heat exchanger 90, can be supplied separately for retrofitting conventional UPS systems. Specifically, the target component to be cooled in a conventional UPS can be removed to install the liquid cooling device 50 (if applicable, the conventional radiator may have to be removed). After installing the liquid cooling device 50, the target component is reinstalled. The conventional door of the UPS is removed and replaced with a door assembly including door 30 and the associated pumping module 60, as well as the gas-liquid heat exchanger 90 (both doors can be replaced if necessary). Piping is then connected to ensure the establishment of loops C1 and C2.

[0089] The power capacity of UPS 10 can be increased by implementing the cooling system as described above. Notably, by using the aforementioned cooling system, the power capacity of UPS 10 can be increased by up to 10%, while using the same electrical components as those used in conventional UPS systems. In fact, when the electrical capacity of the components remains the same, the operating temperature of water-cooled components is lower than that of the same air-cooled components. Therefore, the electrical capacity of water-cooled components can be increased while maintaining their temperature below the temperature reached when the component is air-cooled.

[0090] The autonomy gained by placing the pumping module 60 and the gas-liquid heat exchanger 90 on the UPS 10 also provides greater flexibility in placing the UPS 10 within the data center. Notably, the UPS 10 can be placed in the same space as the server racks housing the servers, rather than being isolated in a dedicated "power room" as is often the case with conventional UPS systems.

[0091] It should be noted that in some embodiments, only one pumping module 60 and one gas-liquid heat exchanger 90 may be installed on one of the doors 30. However, including two pumping modules 60 and two gas-liquid heat exchangers 90 provides redundancy for the cooling system of the UPS 10, because one of the pumping modules 60 and / or one of the gas-liquid heat exchangers 90 can be disabled or removed for maintenance, while the other pumping module 60 and the other gas-liquid heat exchanger 90 still ensure a certain level of cooling for the UPS 10.

[0092] In some embodiments, the two pumping modules 60 may define two separate and independent liquid cooling circuits C1 (T- or Y-shaped piping fittings 77 will be omitted), wherein a first liquid cooling circuit C1 supplies water to some (e.g., half) of the fluid lines 125 of each liquid cooling device 50, and a second liquid cooling circuit C1 supplies water to the remaining (e.g., the other half) of the fluid lines 125 of the liquid cooling device 50. Although this may not provide redundancy between the two pumping modules 60 as described above, redundancy may be provided at a local level for each liquid cooling device because the fluid lines 125 of each fluid cooling device 50 are supplied by two fluid-independent liquid cooling circuits.

[0093] Now refer to Figures 17 to 22 The configuration and function of the liquid cooling devices 50 are described in more detail below. Each liquid cooling device 50 is configured to cool multiple target components 115. In the illustrated example, the target components 115 are semiconductors of any component of the electrical system 40 of the UPS 10. Notably, in this embodiment example, each cooling device 50 is configured to cool three semiconductors 115. The target components 115 can be any other suitable components that generate heat and can benefit from cooling. Since each liquid cooling device 50 is identical in this example, only one of the liquid cooling devices 50 will be described in detail herein. It should be understood that the same description applies to the other liquid cooling devices 50.

[0094] As in Figure 20 As best shown, the liquid cooling device 50 includes a base member 110 and a plurality of cover members 112 connected to the base member 110. As will be described in more detail below, the cover members 112, together with the base member 110, define a plurality of fluid conduits 125. The fluid conduits 125 define a portion of a liquid cooling circuit C1. The fluid conduits 125 of the liquid cooling device 50 are independent of each other because water flows through the fluid conduits 125 in parallel. In this way, each fluid conduit 125 receives at its inlet cooling water that has not yet circulated through another fluid conduit in the fluid conduit 125 (this would be the case if they were connected in series).

[0095] The base member 110 and the cover member 112 are made of copper for efficient heat conduction. Other heat-conducting materials are also conceivable.

[0096] like Figure 17 and Figure 18 As shown, the base member 110 of the liquid cooling device 50 is in thermal contact with three semiconductors 115 intended to be cooled by the liquid cooling device 50. More specifically, the lower surface 114 of the base member 110 on its lower side 116 (in) Figure 19The lower surface 114 (shown in the diagram) is positioned to contact the semiconductor 115. The lower surface 114 is generally flat to ensure proper contact between the semiconductor 115 and the lower surface 114. Thermal paste may be disposed between the lower surface 114 and the semiconductor 115 to efficiently transfer heat from the semiconductor 115 to the base member 110. The base member 110 defines a plurality of fastener openings 113 configured to receive corresponding fasteners (not shown) to secure the semiconductor 115 to the base member 110. The fastener openings 113 extend from a lower side 116 to an upper side 118 of the base member 110.

[0097] In this embodiment, the base member 110 is generally rectangular. The size of the base member 110 is determined to span three semiconductors 115. The thickness of the base member 110, which provides rigidity to the base member 110, depends on the surface area of ​​the base member 110. In this embodiment, the thickness of the base member 110 is between 8 mm and 15 mm, including endpoint values. More specifically, the thickness of the base member 110 is approximately 10 mm. It is desirable to provide the thinnest possible base member 110 while ensuring sufficient rigidity for a given surface area of ​​the base member 110, as providing a thinner base member 110 reduces the manufacturing cost of the liquid cooling device 50.

[0098] like Figure 21 and Figure 22 As shown, the base member 110 defines a plurality of spaced-apart recesses 120 on its upper side 118 (opposite to the lower side 116). The recesses 120 are generally rectangular, and particularly generally square, and receive corresponding cover members from the cover members 112 therein. Each recess 120 is defined by an upper surface 124 and a sidewall 126 (in... Figure 21 (As shown in the image).

[0099] In this embodiment, the number of recesses 120 defined by the base member 110 corresponds to the number of cover members 112 of the liquid cooling device 50. Notably, the base member 110 defines an even number of recesses 120, i.e., six recesses 120, to receive corresponding cover members among the six cover members 112. It is conceivable that in other embodiments, the base member 110 may define a different number of recesses 120 (e.g., if fewer or more semiconductors are to be cooled by the liquid cooling device 50). For example, in some embodiments, if a single semiconductor 115 is to be cooled by the liquid cooling device 50, the base member 110 may define only two recesses 120.

[0100] The recesses 120 are arranged such that when the liquid cooling device 50 is mounted to the semiconductors 115, each of the three semiconductors 115 is at least partially stacked (i.e., vertically positioned above or below) with a corresponding pair of recesses 120. Each pair of recesses stacked with a given semiconductor 115 in the recesses 120 will be referred to herein as a recess pair 121. In this embodiment, the recesses 120 are arranged in a rectangular array because the semiconductors 115 are arranged generally parallel to each other and spaced apart from each other. More specifically, the three recess pairs 121 are spaced apart along the lateral direction of the liquid cooling device 50, which is parallel to the median plane MP of the base member 110. The distance between the recesses 120 of two adjacent recess pairs 121 is greater than the distance between the recesses 120 of a given recess pair 121. The median plane MP, perpendicular to the lower surface 114 (and the recess surface 124), is centrally disposed between the two recesses 120 of each recess pair 121. In this embodiment, because the semiconductor 115 is centered relative to the base member 110, the intermediate plane MP bisects the base member 110. Notably, the position of the intermediate plane MP is defined by the position of the semiconductor 115 relative to the base member 110, because the semiconductor 115 is centered relative to the intermediate plane MP to effectively cool the semiconductor 115.

[0101] It is conceivable that, in some embodiments, a single recess may be provided for each semiconductor 115 to be cooled. Notably, in such an embodiment, the single recess will be configured to receive one of the cover members 112, such that the number of semiconductors 115 is equal to the number of cover members 112.

[0102] refer to Figure 22 To form fluid conduits 125, the base member 110 defines a plurality of fluid path recesses 122 on its upper side 118. The fluid path recesses 122 define the path of each fluid conduit 125 through which water in the liquid cooling circuit C1 flows to absorb heat from the semiconductor 115. Each of the upper surfaces 124 of the recess defines one of the fluid path recesses 122, such that each fluid path recess 122 is disposed in a corresponding recess in the recess 120, and as... Figure 23 As shown, it is aligned with the corresponding semiconductor 115. The base member 110 thus defines six fluid path recesses 122. In this embodiment, each fluid path recess 122 has the same shape; therefore, only one fluid path recess 122 of one of the recesses 120 will be described herein, with reference to this description for the fluid path recess 122 in the other recess 120 of the same pair of recesses 121.

[0103] The fluid path recess 122 has a circular inlet region 130 and a circular outlet region 132, which correspond to the points where the fluid path recess 122 (and the corresponding fluid conduit 125) receives and discharges water, respectively. At the inlet region 130, the fluid path recess 122 splits into two separate channels 134, which merge again at the outlet region 132. Each channel in the channels 134 defines a sinusoidal pattern along most of its span. That is, each channel in the channels 134 has a repeating pattern that approximates a sinusoidal pattern along at least half the span of the channel 134.

[0104] The inlet region 130 of the fluid path recess 122 is positioned closer to the intermediate plane MP than the outlet region 132 (i.e., the distance between the inlet region 130 and the intermediate plane MP is less than the distance between the outlet region 132 and the intermediate plane MP). In other words, water entering the fluid path recess 122 is closer to the intermediate plane MP than water exiting the fluid path recess 122. Furthermore, the inlet region 130 is generally centered between the sidewalls 126 (of the corresponding recess 120) extending perpendicular to the intermediate plane MP. Thus, a central axis CA extending centered between the sidewalls 126 extending perpendicular to the intermediate plane MP of a given pair of recesses 121 extends through the inlet region 130 of the fluid path recess 122 in both recesses 120 of the given pair of recesses 121. Conversely, the outlet region 132 is offset from the central axis CA and is therefore closer to one of the sidewalls 126 extending perpendicular to the intermediate plane MP. The outlet region 132 of the fluid path recess in the recess 120 of the same recess pair 121 is located on the opposite side of the central axis CA.

[0105] The positions of the inlet and outlet regions 130, 132 have been specifically chosen to provide optimized cooling for the corresponding semiconductors 115. Notably, since the water flowing through the fluid path recess 122 is coldest when it enters at the inlet region 130, the inlet region 130 is positioned to align with the region of the corresponding semiconductor 115 that experiences the highest temperature during the operation of the UPS 10. Furthermore, since the water flowing through the fluid path recess 122 is hottest when it exits at the outlet region 132, the outlet region 132 of the fluid path recess 122, aligned with one of the semiconductors 115, is specifically positioned on the opposite side of the central axis CA. Thermal analysis of these configurations of the fluid path recess 122 has demonstrated that they provide optimized heat dissipation for each semiconductor 115.

[0106] The shape of the fluid path recess 122 may be different in other embodiments, such as in embodiments where the component other than the semiconductor is the target component that the liquid cooling device 50 intends to cool.

[0107] In this embodiment, the channel 134 of the fluid path recess 122 has a width of approximately 2 mm and a depth of approximately 4 mm. Notably, the fluid path recess 122 is milled into a cavity upper surface 124. This simplifies and accelerates the production of the liquid cooling device 50, and it is noteworthy that different base components 110 can be mounted on a computer numerical control (CNC) milling machine, and the six fluid path recesses 122 of each base component 110 can be machined in a single operation.

[0108] Return to Figure 20 Each cover member 112 is received in a corresponding recess in the recess 120 to define a corresponding fluid passage 125 together with the corresponding fluid path recess 122. The cover member 112 is a planar plate whose shape and size are configured to conform to the shape of the recess 120. Notably, in this embodiment, the cover member 112 is generally square with rounded corners. Each cover member 112 has a lower side (not shown) and a upper side 140. The lower surface (not shown) of each cover member 112 is planar and faces the fluid path recess 122 of the corresponding recess 120 to define the corresponding fluid passage 125 together with it. Each cover member 112 has a fluid inlet and a fluid outlet for receiving and discharging water through the corresponding fluid passage 125 defined by the cover member 112. The fluid inlet and fluid outlet of the cover member 112 are defined by an inlet opening and an outlet opening, respectively. An inlet pipe 142 and an outlet pipe 144 are connected to each cover member 112. Specifically, inlet pipe 142 is welded to each cover member 112 and fluidly connected to a corresponding inlet opening defined by cover member 112. Similarly, outlet pipe 144 is welded to each cover member 112 and fluidly connected to a corresponding outlet opening defined by cover member 112. In this embodiment, inlet pipe 142 and outlet pipe 144 are welded to cover member 112 via a self-fusion welding process. Notably, inlet pipe 142 and outlet pipe 144 are welded to cover member 112 via laser welding (also known as “laser beam welding”). That is, as will be described in more detail below, self-fusion welding processes such as laser welding offer advantages in terms of quality, which is particularly important for ensuring safety in situations where liquid is supplied to the interior space 15 of UPS 10, which has numerous electrical components that may be negatively affected by leaks.

[0109] When the cover member 112 is in place in the corresponding recess 120, the fluid inlet and fluid outlet of each cover member 112 are aligned with the inlet region 130 and outlet region 132 of the fluid path recess 122 provided in the corresponding recess 120, respectively.

[0110] As in Figure 20As can be seen, the cover members 112 are relatively thin. Notably, the thickness of each cover member 112 is between 2 mm and 5 mm, including endpoint values. In particular, in this embodiment, the thickness of each cover member 112 is approximately 3 mm. This thinness of the cover members 112 allows for the use of a small amount of material to manufacture them, making the production of the liquid cooling devices 50 more affordable. This is particularly advantageous considering that the UPS 10 includes many liquid cooling devices 50.

[0111] The thinness of the cover member 112 presents a challenge in connecting it to the base member 110. Notably, to reduce the number of parts in the liquid cooling device 50, it is desirable to weld the cover member 112 to the base member 110, as fastening the cover member 112 to the base member 110 via fasteners (e.g., screws, bolts, rivets) would require the addition of sealing members (e.g., gaskets) to prevent leakage. However, because both the cover member 112 and the base member 110 are thin, welding the cover could cause the material of the cover member 112 to warp, potentially leading to leakage during use of the liquid cooling device 50. To address this issue, the cover member 112 has a relatively small perimeter, allowing each cover member 112 to be quickly welded along its perimeter to the sidewall 126 of the corresponding recess 120. Notably, at least in part for this reason, the liquid cooling device 50 is designed such that each semiconductor 115 is cooled by two fluid conduits 125 defined by two smaller, separate cap members 112 rather than by a larger cap member spanning an equivalent surface area. This limits the heat absorbed by the cap members 112 during their welding. Furthermore, the pauses between welding each cap member 112 allow the base member 110 to cool, preventing warping. In this embodiment, the cap members 112 are connected to the base member 110 via a self-fluxing welding process. That is, the cap members 112 are welded to the base member 110 without adding material to form a weld. This contrasts with non-self-fluxing welding processes, where filler metal is added to connect the components. Specifically, in this embodiment, the cap members 112 are connected to the base member 110 via laser welding (similar to the outlet and inlet pipes 142, 144 described above). This ensures that the liquid cooling device 50 is properly sealed because the weld connecting the cover member 112 to the base member 110 is made of the same material as the cover member 112 and the base member 110, rather than depending on the quality of the filler metal. Furthermore, with laser welding, the weld is not as susceptible to contaminants as it is in the presence of laser materials, and the quality of the weld is not as dependent on the flow pattern of the welding material as in non-self-fluxing welding processes.

[0112] As can be seen, the cover member 112 (and the corresponding recess 120) is relatively small in size. Notably, in this embodiment, each cover member 112 and each recess 120 extends approximately 20 cm... 2 The surface area extends. In this way, the periphery of the cover member 112 is relatively small, which allows the cover member 112 to be welded without exposing the cover member 112 or the base member 110 to excessive heat during assembly, which could cause defects in the liquid cooling device 50 as described above.

[0113] In alternative implementations, refer to Figure 24 Liquid cooling device 250 can be provided instead of liquid cooling device 50. Liquid cooling device 250 includes a base member 210, a plurality of cover members 212, and a plurality of intermediate members 235, which are connected to each other. The base member 210 is similar to the base member 110 described above, and the cover members 212 are similar to the cover member 112 described above, and therefore will not be described in detail herein. Each intermediate member 235 is received in a corresponding recess of the base member 210. Each cover member 212 is stacked on top of one of the intermediate members 235. The addition of intermediate members 235 allows for defining two separate fluid lines for each recess defined by the base member 210, which are fluidly connected in parallel (rather than in series) to provide redundancy in the event that one of the fluid lines is disabled (e.g., blocked). Notably, for each recess of the base member 210, a lower fluid conduit is defined between the base member 210 and the corresponding intermediate member 235, and an upper fluid conduit is defined between the intermediate member 235 and the corresponding cover member 212. Each intermediate member 235 defines a fluid inlet and a fluid outlet to receive fluid into and discharge fluid from the lower fluid conduit. A liquid cooling device having this type of upper and lower fluid conduit is described in more detail in European Patent Application No. 18315027.5, filed September 4, 2018, the entire contents of which are incorporated herein by reference. In some embodiments of the UPS 10 equipped with liquid cooling devices 250, two pumping modules 60 may define two separate and independent liquid cooling circuits C1 (T-shaped or Y-shaped pipe fittings 77 will be omitted), wherein a first liquid cooling circuit C1 supplies water to some lower (or upper) fluid lines of some liquid cooling devices 250, and a second liquid cooling circuit C1 supplies water to corresponding upper (or lower) fluid lines of these liquid cooling devices 250.

[0114] Now back Figure 17 , Figure 18 and Figure 20The liquid cooling device 50 further includes: an inlet manifold 160 fluidly connected to a fluid inlet of the cover member 112 via an inlet pipe 142; and an outlet manifold 162 fluidly connected to a fluid outlet of the cover member 112 via an outlet pipe 144. The inlet and outlet manifolds 160 and 162 are disposed outside the base member 110, particularly above it. The inlet manifold 160 is configured to supply water to the fluid line 125. Notably, the inlet manifold 160 receives cooled water from the plate heat exchanger 64 of the pumping module 60. The outlet manifold 162 is configured to discharge water from the fluid line 125. Specifically, heated water discharged through the fluid outlet of the cover member 112 flows through the outlet manifold 162 and is routed back toward the pump 62 of the pumping module 60, where it is cooled again at the plate heat exchanger 64.

[0115] In this embodiment, inlet manifold 160 and outlet manifold 162 are fluidly connected to each fluid line 125 to establish a Tichelmann (sometimes written as "Tickelman") loop through the liquid cooling device 50. More specifically, the distance between inlet manifold 160 and outlet manifold 162 through each fluid line 125 is approximately the same. This balances the fluid flow rates through the fluid lines 125 of the liquid cooling device 50, making them approximately the same, which avoids the need to implement valves to achieve similar flow rates through the fluid lines 125.

[0116] The above-described configuration of the liquid cooling device 50 is simple and cost-effective to manufacture, while ensuring optimized cooling of the semiconductor 115. Notably, the separate fluid lines 125 in each liquid cooling device 50 ensure that heat is dissipated from most, and indeed the entire, upper surface of each semiconductor 115. In particular, the base member 110 contacts the entire upper surface of each semiconductor 115—including its central portion. This would not be the case, for example, if each semiconductor 115 were instead cooled by two smaller, separate liquid cooling devices (each defining its corresponding fluid line). That is, in this case, the central portion of the semiconductor 115 would not be in contact with any liquid cooling device, thereby reducing the heat dissipation efficiency of the semiconductor 15. Furthermore, the size of the base member 110 spans the different semiconductors 115, which facilitates the positioning of the liquid cooling device 50 within the UPS 10. Additionally, as described above, the manufacture of the liquid cooling device 50 is greatly simplified by machining the base member 110 and welding the cover member 112, while ensuring safe use of the liquid cooling device 50 in an electrically powered environment.

[0117] Modifications and improvements to the above-described embodiments of this technology may become apparent to those skilled in the art. The foregoing description is intended to be exemplary and not restrictive. Therefore, the scope of this technology is intended to be limited only by the scope of the appended claims.

Claims

1. A cooling structure for cooling at least one electrical component housed in a housing (12), the cooling structure comprising: A plate heat exchanger (64) comprising a group of plates (65) with a first set of gaps (67) and a second set of gaps (67) defined between the group of plates (65). A first liquid cooling circuit (C1), the first liquid cooling circuit comprising: At least one liquid cooling device (50) is enclosed within the internal space (15) of the housing (12) and configured to absorb heat from a corresponding electrical component among the at least one electrical component to cool that component. The at least one liquid cooling device (50) defines a fluid conduit (125) adapted to receive a first liquid for transferring heat from the corresponding electrical component among the at least one electrical component to the first liquid flowing in the fluid conduit (125) of the at least one liquid cooling device (50). The fluid conduit (125) of the at least one liquid cooling device (50) is fluidly connected to the first set of gaps (67). A pump (62) fluidly connected between the first set of gaps (67) of the plate heat exchanger (64) and the at least one liquid cooling device (50), the pump (62) being adapted to cause the first liquid to flow within the liquid cooling circuit (C1); The second liquid cooling circuit (C2) includes: The second set of gaps (67) of the plate heat exchanger is configured to transfer heat from the first liquid flowing in the first set of gaps (67) to the second liquid flowing in the second set of gaps (67) in response to the temperature of the first liquid flowing in the first set of gaps (67) being higher than the temperature of the second liquid flowing in the second set of gaps (67); and A pressure relief valve (70) selectively fluidly connects the first liquid cooling circuit (C1) and the second liquid cooling circuit (C2), the pressure relief valve (70) being operable to be in the following states: (i) a closed state, in which the pressure relief valve (70) prevents the first cooling liquid from flowing through the pressure relief valve between the first liquid cooling circuit (C1) and the second liquid cooling circuit (C2); and (ii) an open state, in which the pressure relief valve (70) fluidly connects the first liquid cooling circuit (C1) to the second liquid cooling circuit (C2), thereby allowing the first cooling liquid to flow into the second liquid cooling circuit (C2), the pressure relief valve (70) switching between the closed state and the open state based on the pressure in the first liquid cooling circuit (C1).

2. The cooling structure according to claim 1, wherein: The pressure relief valve (70) switches from the closed state to the open state in response to the pressure being greater than a predetermined pressure threshold.

3. The cooling structure according to claim 1, wherein The pressure relief valve (70) fluidly connects the junction (J3) of the first liquid cooling circuit (C1) to the junction (J4) of the second liquid cooling circuit (C2).

4. The cooling structure according to claim 2, wherein, The pressure relief valve (70) fluidly connects the junction (J3) of the first liquid cooling circuit (C1) to the junction (J4) of the second liquid cooling circuit (C2).

5. The cooling structure according to any one of claims 1 to 4 further includes a pressure reducing valve (68) which is fluidly connected to the junction (J1) of the first liquid cooling circuit (C1) and the junction (J2) of the second liquid cooling circuit (C2).

6. The cooling structure according to claim 5 further includes an expansion tank (66), the expansion tank being fluidly connected to the first liquid cooling circuit (C1) and used to compensate for pressure in the first liquid cooling circuit (C1) according to temperature changes in the first liquid cooling circuit (C1).

7. The cooling structure according to claim 5, wherein, The pressure reducing valve (68) is also configured to allow the addition of supplemental water to the first liquid cooling circuit (C1) when the pressure in the first liquid cooling circuit (C1) drops below a predetermined value.

8. The cooling structure according to claim 6, wherein, The pressure reducing valve (68) is also configured to allow the addition of supplemental water to the first liquid cooling circuit (C1) when the pressure in the first liquid cooling circuit (C1) drops below a predetermined value.

9. The cooling structure according to any one of claims 1 to 4, wherein: The plate heat exchanger (64) is the first plate heat exchanger (64). The group of boards (65) is the first group of boards (65); The cooling structure further includes a second plate heat exchanger (64), which includes a second set of plates (65) and defines a third set of gaps (67) and a fourth set of gaps (67) between the second set of plates (65). The first set of gaps (67) and the third set of gaps (67) are fluidly connected in series; and The second set of gaps (67) and the fourth set of gaps (67) are fluidly connected in series.

10. The cooling structure according to any one of claims 1 to 4 further includes a gas-liquid heat exchanger (90) in the second liquid cooling circuit (C2).

11. The cooling structure according to any one of claims 1 to 4 further includes an external cooling device (75) fluidly connected to the second liquid cooling circuit (C2).

12. A cooling system, the cooling system comprising: Housing (12) for receiving at least one electrical component of electrical system (40); as well as The cooling structure according to any one of claims 1 to 11 is used to cool the at least one electrical component.

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