高频模块和通信装置

By employing a multi-layered high-frequency module in mobile communication devices and utilizing a combination of components such as filters and switches, the problem of decreased receiving sensitivity caused by high-order harmonics intruding into the receiving path was solved, resulting in higher received signal quality.

CN117063395BActive Publication Date: 2026-07-17MURATA MFG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2022-03-11
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In mobile communication devices, the intrusion of high-order harmonics into the receiving path leads to a decrease in receiving sensitivity.

Method used

A high-frequency module with a multi-layer structure is adopted, including first and second module substrates. Electronic components are arranged on their respective main surfaces and are designed with multiple external connection terminals through the combination of filters, switches, power amplifiers and low-noise amplifiers to suppress the propagation of high-order harmonics.

Benefits of technology

It effectively suppresses the impact of high-order harmonics on receiver sensitivity and improves the quality of the received signal.

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Abstract

高频模块(1A)具备：第一电子部件，其配置于主面(91a)上和主面(92b)上中的一者；以及第二电子部件，其配置于主面(91a)上和主面(92b)上中的另一者，其中，第一电子部件包括以下部件中的至少一个：具有包含第一频段的通带的滤波器(61)；与滤波器(61)连接的开关(51)；与滤波器(61)连接的功率放大器(11)；以及与滤波器(61)连接的开关(52)，第二电子部件包括以下部件中的至少一个：具有包含第二频段的通带的滤波器(66)，该第二频段包含第一频段的信号的高次谐波的频率；与滤波器(66)连接的开关(54)；与滤波器(66)连接的低噪声放大器(22)；连接于将低噪声放大器(22)与天线连接端子(102)连结的路径的电感器。
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