Electroplated diamond polygonal wire saw

Abstract

The present application relates to a kind of electroplated diamond polygonal wire saw, belong to wire saw grinding field.It includes: wire saw matrix and diamond plating layer, the wire saw matrix is the polygonal wire structure of radial section, multiple first working surface and multiple second working surface that will be adjacent two first working surface transitionally connected are arranged on the wire saw matrix peripheral surface, diamond is plated on the first working surface and the second working surface by electroplating, and the plating area containing diamond is provided with the structure that makes the contact area of wire saw and workpiece change.The present application utilizes the structure of wire saw to assist wire saw when working, changes the contact area or orientation of wire saw and workpiece processing to automatically adapt the pressure required by working diamond to exert, realizes balanced displacement grinding, is favorable to improve the service life and cutting force of working diamond, enhances the processing efficiency of wire saw, reduces wire saw breakage rate, improves the parallelism of workpiece cutting surface, optimizes the cooling and chip removal of wire saw and other functions.

Description

Technical Field

[0001] This invention relates to the field of wire saw grinding, and more particularly to an electroplated diamond polygonal wire saw. Background Technology

[0002] Currently, the base (or base line, mother line) of electroplated working diamond wire saws with a diameter of less than 0.5mm is mostly optimized based on a comprehensive cost-effectiveness consideration of factors such as base diameter, working diamond grit size, working diamond concentration, cutting machine processing parameters, workpiece material price, and processing costs. This results in the use of single-strand round carbon steel wire or tungsten wire as the wire saw base, with a single layer of working diamond plated on the surface. Existing technologies employ various layouts for this single layer of working diamond, such as disordered, spiral, annular, and chip-guided groove designs. During operation, the circular wire saw rotates due to internal stress and other forces, but macroscopically, the working diamond on half of the circumference always contacts the workpiece for grinding, resulting in minimal change in the contact area. The working diamond is approximately spherical, and the single-layer plated working diamond is located within the same annular region. During the operation of a wire saw, under relatively fixed safety tension, the working diamond in contact with the workpiece wears down simultaneously. Microscopically, the working surface area of ​​the working diamond in contact with the workpiece continuously increases, causing the pressure applied to the working diamond in contact with the workpiece to decrease exponentially. This results in a continuous weakening of the working diamond's cutting ability, i.e., a continuous reduction in the sharpness of the wire saw. Under these conditions, the cutting trajectory of the wire saw is prone to lateral deviation, resulting in a tilted kerf and reduced parallelism of the processed material, rendering it unusable. Furthermore, due to the limitations of the wire saw's own strength (i.e., breaking force), increasing the tension applied to the wire saw can easily cause it to break, leading to workpiece damage and other accidents. In other words, it is difficult to increase the pressure applied to the working diamond in contact with the workpiece by increasing the wire saw tension. To prevent wire saw breakage, a certain safety factor needs to be ensured for the wire saw's sharpness, thus relatively reducing the lifespan of the wire saw. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electroplated diamond polygonal wire saw to solve or improve the above-mentioned problem.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: An electroplated diamond polygonal wire saw includes: a wire saw substrate and a diamond electroplating coating layer. The wire saw substrate is a linear structure with a polygonal radial cross-section. The peripheral surface of the wire saw substrate is provided with a plurality of first working surfaces and a plurality of second working surfaces that transition and connect two adjacent first working surfaces. The diamond electroplating coating layer is disposed on the first working surfaces and the second working surfaces. The plating area containing working diamond is provided with a structure that changes the contact area between the wire saw and the workpiece.

[0005] The beneficial effects of this invention are as follows: The second working surface of the polygonal wire saw has a mechanical crushing effect, which helps to reduce the proportion of grinding in the machining process, improves machining efficiency, and reduces the proportion and wear rate of the working diamond grinding; The natural change in the orientation of the polygonal wire saw creates a gap between the wire saw and the workpiece, which acts as a water-passing, water-retaining, and chip-collecting structure, making it easier for the cooling water to function and for rapid chip removal to be achieved, reducing unnecessary heat loss and wear of the working diamond and ineffective power consumption of the cooling water; The clamping effect in the cutting of the second working surface of the polygonal wire saw increases the difficulty of lateral deviation of the wire saw, reduces the "cross-cutting" phenomenon, and helps to obtain a higher parallelism of the workpiece cutting surface; Under the same kerf size conditions as the circular wire saw, the polygonal wire saw can adapt to machining parameters with smaller tension, reducing the wire breakage rate of the wire saw.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, within any length segment of the first working surface that is equal to the working diamond particle size along its axial direction, at most one complete working diamond particle can be coated on the radial polygonal cross-section of the wire saw substrate within the circumferential side length of the first working surface.

[0008] The beneficial effects of adopting the above-mentioned further scheme are: it facilitates the formation of a single row of axial working diamonds on the first working surface of the wire saw, that is, the axial working diamond particles on each first working surface overlap in circumferential width. When the wire saw moves forward in the axial direction, the subsequent working diamonds are prone to cutting along the cutting trajectory of the preceding working diamonds. The non-overlapping part on the circumferential width of the working diamond particles can effectively protect the coating's ability to hold the subsequent working diamonds on one side. The working mode of "orderly arrangement" with overlapping working diamonds makes the workpiece material between the rows of working diamonds on the wire saw easy to crush, without the need for working diamond grinding. Therefore, the wear rate of working diamonds is reduced and the utilization rate is increased. This indirectly provides space for reducing the working diamond concentration, which is conducive to improving the working diamond pressure, i.e., sharpness.

[0009] Furthermore, the first working surface is a plane or an arc surface.

[0010] The beneficial effects of adopting the above-mentioned further solution are: the first working surface being an arc surface helps to reduce the difficulty of manufacturing the wire saw base.

[0011] Furthermore, the wire saw base is manufactured using an openable wire drawing die. The wire saw base includes multiple segmented bases and multiple circular bases. The radial cross-section of the multiple segmented bases is polygonal and they are circumferentially staggered. Adjacent segmented bases are connected by transitioning through the circular bases.

[0012] The advantages of adopting the above-mentioned further solutions are: it is beneficial to ensure that the orientation and contact area of ​​the wire saw change when it is working in different sections; and it is beneficial to manufacture the base of the segmented staggered wire saw.

[0013] Furthermore, the circumferential side length of the first working surface on the radial polygonal cross section of the wire saw base is greater than 70% of the working diamond particle size.

[0014] The beneficial effect of adopting the above-mentioned further solution is that it helps the electroplating coating to better hold the working diamond, making it less likely for the working diamond to fall off under stress.

[0015] Furthermore, the wire saw employs an intermittent feed machining process during operation.

[0016] The beneficial effect of adopting the above-mentioned further solution is that by adjusting the processing technology, it is beneficial for the wire saw to perform balanced displacement grinding. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the wire saw structure provided in Embodiment 1 of the present invention;

[0018] Figure 2 This is a side view provided in Embodiment 1 of the present invention;

[0019] Figure 3 This is a processing diagram provided in Embodiment 1 of the present invention;

[0020] Figure 4 This is a top view of the machining process provided in Embodiment 1 of the present invention;

[0021] Figure 5 This is a processing side view provided in Embodiment 1 of the present invention;

[0022] Figure 6 This is a schematic diagram of the wire saw structure provided in Embodiment 2 of the present invention;

[0023] Figure 7 This is a top view of a wire saw provided in Embodiment 2 of the present invention;

[0024] Figure 8 This is a side view of a wire saw provided in Embodiment 2 of the present invention;

[0025] Figure 9 For along Figure 7 A schematic diagram of the structure cut along the center section line CC;

[0026] Figure 10 This is a processing diagram provided in Embodiment 2 of the present invention;

[0027] Figure 11 This is a top view of the machining process provided in Embodiment 2 of the present invention;

[0028] Figure 12 This is a processing side view provided in Embodiment 2 of the present invention;

[0029] Figure 13 For along Figure 11 A schematic diagram of the structure cut along the mid-section line BB;

[0030] Figure 14 A schematic diagram of a wire saw substrate coated with working diamond;

[0031] Figure 15 A side view of a wire saw substrate coated with working diamond;

[0032] Figure 16 This is a front view of a wire saw substrate coated with working diamond.

[0033] in, Figure 4 , Figure 5 , Figure 11 and Figure 12 The arrows in the diagram indicate the processing direction of the wire saw; Figure 2 and Figure 8 In this context, Φ represents the diameter of the circumcircle of the polygon on the cross-section of the wire saw base, and L represents the arc length of the second working surface. Figure 9 In this context, X represents the phase difference when multiple segmented substrates are misaligned. Figure 14-16 The small circles in the diagram represent the working diamonds plated onto the wire saw substrate.

[0034] The attached diagram lists the components represented by each number as follows:

[0035] 1. Wire saw base; 11. First working face; 12. Second working face; 13. Segmented base; 14. Circular base. Detailed Implementation

[0036] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0037] like Figures 1 to 16 As shown, an electroplated diamond polygonal wire saw includes: a wire saw base 1 and a diamond electroplating coating layer. The wire saw base 1 is a linear structure with a polygonal radial cross-section. The peripheral surface of the wire saw base 1 is provided with a plurality of first working surfaces 11 and a plurality of second working surfaces 12 that transition and connect two adjacent first working surfaces 11. The diamond electroplating coating layer is disposed on the first working surfaces 11 and the second working surfaces 12. The plating area containing working diamond is provided with a structure that changes the contact area between the wire saw and the workpiece.

[0038] It's important to understand that the polygons mentioned above are asymmetrical. This asymmetry is beneficial during wire saw operation, as changes in force can facilitate rotation or variations in contact area. The asymmetry can be due to an asymmetrical substrate or an asymmetrical arrangement of the working diamond concentration, particle size, and layout within the working diamond coating, resulting in asymmetrical forces during wire saw cutting. Furthermore, it's crucial to understand that the diamond coating contains both working and non-working diamonds. Working diamonds are those that actually participate in cutting and grinding, while non-working diamonds, such as small particles, do not participate in cutting but serve other functional roles.

[0039] When the working diamond is electroplated onto the first working surface 11 and the second working surface 12, the shape of the working diamond plating area needs to be set according to the actual processing requirements. This can be done in various ways, such as disordered, spiral, annular, with different particle sizes (i.e., different working diamond particle sizes are plated in different axial segments on the wire saw substrate 1), different particle size surfaces (i.e., different working diamond particle sizes are plated on the circumferential surface of the wire saw substrate 1), or different working diamond concentration ranges. This is to achieve or assist in achieving various functions, such as efficient cooling, rapid chip removal, orderly arrangement of working diamonds, intermittent grinding, and frequent or random changes in the grinding zone (i.e., the contact area between the wire saw and the workpiece). In a preferred embodiment of the invention, the structure that changes the contact area between the wire saw and the workpiece can include the following:

[0040] 1. Two different grit sizes of working diamond are provided in the plating area on the circumference of the wire saw base, and the length of each plating area is greater than the workpiece cutting length. In this case, the polygonal wire saw can change the contact area between the wire saw and the workpiece during operation. With the tension remaining constant, the change in area causes a change in the pressure applied to the working diamond. After the wire saw sharpness decreases to a certain extent, the cutting capability of the wire saw can be adapted by reducing the feed rate to continue cutting.

[0041] 2. Different concentrations of working diamonds are set in the plating area on the circumferential surface of the wire saw substrate, and the length of each plating area is greater than the cutting length of the workpiece. The circumferential working diamond concentration of each plating area is asymmetrically set. In this case, when the polygonal wire saw is working, the force caused by the difference in working diamond concentration when the wire saw and the workpiece are in contact is different, which leads to the wire saw automatically generating a force balance tendency, causing the contact area between the wire saw and the workpiece to change. In this process, balanced displacement grinding is achieved.

[0042] 3. An imaginary plating area is defined on the axial circumferential surface of the polygonal outer circle of the wire saw base 1. A spiral working diamond plating area is set with a lead less than the workpiece cutting length and a helix angle greater than 75° but less than 90°. The actual plating area is a portion of the first and second working surfaces. In this case, when the polygonal wire saw is working, the spiral working diamond plating area will cause the wire saw to rotate due to the reaction force. As the polygonal wire saw and the workpiece continue to contact, the wire saw will rotate, thereby changing the contact area between the wire saw and the workpiece. Balanced displacement grinding is achieved in this process.

[0043] Furthermore, the difference between "plated area containing working diamonds" and "working diamond electroplated coating layer" is that "working diamond electroplated coating layer" refers to the area from the outer diameter of the wire saw substrate 1 to the outer diameter of the wire saw, including "all coating layers + all working diamonds", which is a volume concept; while "plated area containing working diamonds" refers only to a localized plating area containing working diamonds, which is an area concept and also has a certain positional concept, such as the plating area in the three cases mentioned above.

[0044] The number of sides of the wire saw base polygon needs to be selected based on actual processing requirements, such as the cost of the wire saw base and the kerf length of the wire saw (i.e., the cutting depth). Figure 2 and Figure 8The dimensions of the polygon on the cross-section of the wire saw base are: the diameter Φ of the circumscribed circle of the polygon; the particle size of the working diamond; and any length segment equal to the working diamond particle size along the axial direction of the first working surface 11. The maximum number of intact particles bonded within the circumferential side length of the first working surface 11 on the radial polygon cross-section of the wire saw base 1 is also considered. The advantages and applicable scenarios of having a large and small number of polygonal sides for the wire saw base are described below: Compared to existing circular cross-section wire saw bases, under the same cross-sectional area, fewer sides result in a larger kerf. This leads to more pronounced polygonal corner contact cutting between the wire saw and the workpiece during grinding (the corners are the second working surface 12), forming a plowshare-like cutting action. This results in a more significant macroscopic mechanical crushing effect, reducing the proportion of grinding processing and lowering the cost of machining. As a load in the diamond processing process, the macroscopic sharpness is significantly improved (the so-called plow-like cutting refers to the fact that the volume of the workpiece cut by the wire saw includes not only the material removed by the wire saw through grinding by the working diamond, but also the debris generated by the working diamond in the polygonal circumferential direction pressing the workpiece around the contact surface. This processing method is similar to plowing, hence the name "plow-like cutting"); the macroscopic mechanical crushing refers to the fact that the fewer the number of polygonal sides, the larger the volume of debris generated by compression; the macroscopic sharpness refers to the fact that the fewer the number of polygonal sides, the smaller the contact area between the wire saw and the workpiece, and the greater the pressure on the working diamond in contact with the workpiece under the condition of constant applied force, the greater the sharpness of the wire saw).The more sides a polygon has, the fewer the maximum number of intact working diamond particles that can be bonded within the circumferential side length of the first working surface 11 on the radial polygonal cross-section of the wire saw matrix 1, and the more ordered the arrangement of the working diamonds (the ordered arrangement means that, in the extreme case where the side length of the polygon can only accommodate one working diamond, all working diamonds on the first working surface 11 are approximately arranged in a straight line along the axial direction of the wire saw matrix). The more pronounced the micro-mechanical crushing effect (the micro-mechanical crushing means that the more sides a polygon has, the larger the volume of debris generated by the polygonal wire saw extrusion). The smaller the polygon number (the more sides a polygon has), the more orderly the working diamonds become on the first working face 11, thus reducing unnecessary grinding wear caused by multiple rows of working diamonds on the first working face 11, thereby increasing the lifespan of the working diamonds. Simultaneously, because the number of working diamonds on the first working face 11 is reduced, the contact area between the wire saw and the workpiece is also reduced. With the applied force remaining constant, the pressure on the working diamonds in contact with the workpiece is greater, resulting in greater microscopic sharpness. Therefore, for applications requiring low surface roughness, a polygonal wire saw with a larger number of sides is preferred; for applications requiring high cutting sharpness (referring to macroscopic sharpness), a polygonal wire saw with a smaller number of sides is preferred.

[0045] The second working surface 12 is an arc-shaped surface that functions similarly to an edge-and-corner interlocking mechanism. Where possible, the radius of the arc on the second working surface 12 should be as small as possible. Using the smallest radius arc reduces the contact area between the second working surface 12 and the workpiece. This results in greater pressure on the working diamond within the contact surface, making it easier to form an interlocking shape and reducing the "cross-cutting" phenomenon. In electroplated wire saws with polygonal substrates, the second working surface 12 is used more extensively. Under small radius arc conditions, the working diamond on the second working surface 12 extends from the working diamonds of the two adjacent first working surfaces 11 into the area of ​​the second working surface 12, meaning the working diamond concentration is higher than that of the first working surfaces 11. This is beneficial for improving the wear resistance and lifespan of the second working surface 12. Setting the second working surface 12 between two adjacent first working surfaces 11 also helps reduce the tip discharge effect during wire saw substrate electroplating and balances the plating thickness.

[0046] When a polygonal wire saw contacts a workpiece, its orientation is random, and it is highly probable that the second working surface 12 contacts the workpiece first. At this point, the contact area is small, so the working diamond pressure applied to the wire saw contact surface is strong. The second working surface 12 quickly performs plow-like grinding on the workpiece and forms a locking effect. Unlike circular wire saws, polygonal wire saws do not easily rotate around the center of the wire saw. Instead, they use the locking point of the second working surface 12 as a fulcrum and perform balanced displacement grinding under the combined forces of radial force, axial force, internal stress, the force exerted by the workpiece on the wire saw, and the rotational force brought by the layout of the working diamond. During displacement grinding, the contact area between the wire saw and the workpiece changes. Different orientations of the polygonal wire saw result in different contact areas with the workpiece, which allows the polygonal wire saw to ensure that the baseline is within the safe force application range without breaking the line, and at an appropriate feed speed, adaptively change the contact area between the workpiece and the wire saw base, thereby ensuring sufficient pressure on the working diamond to achieve cutting.

[0047] When applying force within the safe range and maintaining high sharpness on a polygonal wire saw, a higher feed rate can be used while still meeting cutting quality requirements. When applying force within the safe range and the sharpness decreases but remains usable, a moderate feed rate can be used while still meeting cutting quality requirements. These techniques are the same as those used with circular wire saws. When applying force within the safe range and maintaining low sharpness on a polygonal wire saw, the feed rate can be appropriately reduced to decrease the macroscopic contact area, resulting in a local increase in pressure applied to the working diamond, achieving a relatively lower cutting efficiency. This differs from circular wire saws, where the macroscopic contact area cannot be changed, meaning the pressure applied to the working diamond cannot be increased. Therefore, when the sharpness decreases to a certain level, i.e., the pressure applied to the working diamond is too low to cut the workpiece, cutting becomes impossible. The principle described above is that, under the condition that the force is applied within the safe range of the wire saw, the polygonal wire saw can adapt to the pressure required for the working diamond cutting by changing the grinding contact area, and adapt the cutting capacity by adjusting the feed speed, so as to continue cutting and greatly improve the life of the wire saw under safe conditions.

[0048] The arc length of the cross-section of the second working surface 12 on the wire saw base also needs to be selected based on actual processing requirements and reference working diamond grit size. When the selected working diamond grit size is much smaller than the arc length of the cross-section of the second working surface 12, it is easier to coat the second working surface 12 with a relatively higher concentration of working diamond, which is beneficial to improving the wear resistance of the wire saw's corner parts (i.e., the service life of the second working surface 12); when the selected working diamond grit size is closer to the side length of the polygonal cross-section, it is less likely that the second working surface 12 will be coated with working diamond of a higher concentration than average, but the second working surface 12 is easily protected by the working diamond extension on the adjacent first working surface 11, and at the same time, it is easier to obtain an orderly arrangement of working diamonds on the first working surface 11. This structure is beneficial to increase the pressure of the working diamonds in contact with the workpiece by reducing the working diamond concentration, that is, to improve the sharpness of the wire saw.

[0049] The beneficial effects of this invention are as follows: The second working surface of the polygonal wire saw has a mechanical crushing effect, which helps to reduce the proportion of grinding in the machining process, improves machining efficiency, and reduces the proportion and wear rate of the working diamond grinding; The natural change in the orientation of the polygonal wire saw creates a gap between the wire saw and the workpiece, which acts as a water-passing, water-retaining, and chip-collecting structure, making it easier for the cooling water to function and for rapid chip removal to be achieved, reducing unnecessary heat loss and wear of the working diamond and ineffective power consumption of the cooling water; The clamping effect in the cutting of the second working surface of the polygonal wire saw increases the difficulty of lateral deviation of the wire saw, reduces the "cross-cutting" phenomenon, and helps to obtain a higher parallelism of the workpiece cutting surface; Under the same kerf size conditions as the circular wire saw, the polygonal wire saw can adapt to machining parameters with smaller tension, reducing the wire breakage rate of the wire saw.

[0050] Preferred, such as Figure 14-16 As shown, in any length segment of the first working surface 11 that is equal to the working diamond particle size in the axial direction, at most one complete working diamond particle can be coated on the radial polygonal cross section of the wire saw substrate 1 within the circumferential side length of the first working surface 11.

[0051] It should be understood that, in a preferred embodiment of the present invention, in any length segment of the first working surface 11 that is axially equal to the working diamond particle size, the first working surface 11 on the radial polygonal cross-section of the wire saw base 1 can be coated with at most one complete working diamond particle within the circumferential side length of the first working surface 11. In this case, a polygonal wire saw with more sides can be selected. The phrase "at most one complete working diamond particle" means that on the first working surface 11, there can be one complete working diamond particle while simultaneously having multiple incomplete working diamond particles; there can be multiple incomplete working diamond particles; or there can be no working diamond particle. In other embodiments of the present invention, in any length segment of the first working surface 11 that is axially equal to the working diamond particle size, two or more complete working diamond particles can be coated side-by-side on the circumferential side length of the first working surface 11 on the radial polygonal cross-section of the wire saw base 1. In this case, a polygonal wire saw with fewer sides is selected. The included angle between the two first working surfaces 11 of the wire saw base is smaller, which is suitable for the second working surface 12 to quickly form a clamping effect on the workpiece and perform plow-like grinding.

[0052] The advantages of adopting the above-mentioned preferred scheme are: it facilitates the formation of a single row of axial working diamonds on the first working surface of the wire saw, that is, the axial working diamond particles on each first working surface overlap in circumferential width. When the wire saw moves forward in the axial direction, the subsequent working diamonds are prone to cutting along the cutting trajectory of the preceding working diamonds. The non-overlapping part on the circumferential width of the working diamond particles can effectively protect the coating's holding ability on one side of the subsequent working diamonds. The working mode of "orderly arrangement" with overlapping working diamonds makes the workpiece material between the rows of working diamonds on the wire saw easy to crush, without the need for working diamond grinding. Therefore, the wear rate of working diamonds is reduced and the utilization rate is increased. This indirectly provides space for reducing the working diamond concentration, which is conducive to improving the working diamond pressure, i.e., sharpness.

[0053] Preferably, the first working surface 11 is a plane or an arc surface.

[0054] The advantages of adopting the above preferred scheme are: the first working surface is an arc surface, which helps to reduce the difficulty of manufacturing the wire saw base.

[0055] Preferably, the wire saw base 1 is manufactured by an openable wire drawing die. The wire saw base 1 includes multiple segmented bases 13 and multiple circular bases 14. The radial cross-section of the multiple segmented bases 13 is polygonal and they are circumferentially staggered. Adjacent segmented bases 13 are connected by the circular bases 14.

[0056] It should be understood that the circular base 14 serves as a transition segment between the two segmented bases 13, and its length should be as short as possible.

[0057] The advantages of adopting the above-mentioned preferred scheme are: it is beneficial to ensure that the orientation and contact area of ​​the wire saw change when it is working in different sections; and it is beneficial to manufacture the base of the segmented staggered wire saw.

[0058] Preferred, such as Figure 14-16 As shown, the circumferential side length of the first working surface 11 on the radial polygonal cross section of the wire saw base 1 is greater than 70% of the working diamond particle size.

[0059] The advantages of adopting the above preferred scheme are: it helps the electroplating coating to better hold the working diamond, making the working diamond less likely to fall off under force.

[0060] Preferred, such as Figure 4 , Figure 5 , Figure 11 and Figure 12 As shown, the wire saw uses an intermittent feed machining process during operation.

[0061] It's important to understand that the intermittent feed machining process involves the wire saw repeatedly moving back and forth along the workpiece's axis after contact with the workpiece surface, while simultaneously moving vertically downwards along the workpiece (the feed direction). After moving a certain distance vertically downwards, the feed stops or the wire saw is slightly retracted upwards before resuming feed. This causes the wire saw to rotate and shift under internal stress, changing the original contact position between the wire saw and the workpiece during the continued downward feed grinding, thus achieving a change in the contact area. It's also crucial to understand that appropriately adjusting the machining process can contribute to changes in the contact position or area between the wire saw and the workpiece.

[0062] The advantage of adopting the above-mentioned preferred scheme is that it facilitates balanced displacement grinding of the wire saw.

[0063] Example 1: As Figures 1 to 5 As shown, the wire saw base is a continuous polygonal linear structure, and the multiple first working surfaces 11 on the wire saw base 1 are all planes.

[0064] Example 2: Figures 6 to 13 As shown, the wire saw base is a discontinuous segmented circumferentially displaced polygonal linear structure. The multiple first working surfaces 11 on the wire saw base 1 are all planar, and the multiple segmented bases 13 are staggered in the circumferential direction.

[0065] Example 3: The multiple first working surfaces 11 on the wire saw base 1 are all arc surfaces, and the multiple wire saw bases 1 are staggered in the circumferential direction.

[0066] Example 4: Based on Examples 1 to 3, two different grit sizes of working diamonds are set in the working diamond coating area on the circumference of the wire saw substrate, and the length of each coating area is greater than the workpiece cutting length.

[0067] Example 5: Based on Examples 1 to 3, working diamonds of different concentrations are set in the working diamond coating area on the circumferential surface of the wire saw substrate, and the length of each coating area is greater than the cutting length of the workpiece. The circumferential working diamond concentration of each coating area is asymmetrically set.

[0068] Example 6: Based on Examples 1 to 3, a spiral coating area with a lead less than the workpiece cutting length and a helix angle greater than 75° but less than 90° is set on the working diamond coating area on the circumference of the wire saw substrate.

[0069] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0071] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0072] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0074] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A polygonal wire saw with electroplated diamond, characterized in that, include: The wire saw base (1) and the diamond electroplating coating are provided. The wire saw base (1) is a linear structure with a polygonal radial cross section. The wire saw base (1) has a plurality of first working surfaces (11) and a plurality of second working surfaces (12) that connect two adjacent first working surfaces (11). The diamond electroplating coating is provided on the first working surfaces (11) and the second working surfaces (12). The plating area containing the working diamond is provided with a structure that changes the contact area between the wire saw and the workpiece. The structure that changes the contact area between the wire saw and the workpiece includes: setting a variety of working diamonds with different particle sizes in the coating area on the circumferential surface of the wire saw substrate (1), and the length of each coating area is greater than the workpiece cutting length; or setting working diamonds with different concentrations in the coating area on the circumferential surface of the wire saw substrate (1), and the length of each coating area is greater than the workpiece cutting length, with the circumferential working diamond concentration of each coating area being asymmetrically set; or setting the axial circumferential surface of the polygonal circumcircle of the wire saw substrate (1) as an imaginary coating area, setting a spiral working diamond coating area with a lead less than the workpiece cutting length and a helix angle greater than 75° but less than 90°, and the actual coating area being a portion of the first working surface and the second working surface.

2. The electroplated diamond polygonal wire saw according to claim 1, characterized in that, In any length segment of the first working surface (11) that is equal to the working diamond particle size in the axial direction, at most one complete working diamond particle can be plated on the radial polygonal cross section of the wire saw substrate (1) within the circumferential side length of the first working surface (11).

3. The electroplated diamond polygonal wire saw according to claim 1, characterized in that, The first working surface (11) is a plane or an arc surface.

4. The electroplated diamond polygonal wire saw according to claim 1, characterized in that, The wire saw base (1) is manufactured by an openable wire drawing die. The wire saw base (1) includes multiple segmented bases (13) and multiple circular bases (14). The radial cross section of the multiple segmented bases (13) is polygonal and is circumferentially staggered. Adjacent segmented bases (13) are connected by the circular bases (14).

5. The electroplated diamond polygonal wire saw according to claim 1, characterized in that, The circumferential side length of the first working surface (11) on the radial polygonal cross section of the wire saw base (1) is greater than 70% of the working diamond particle size.

6. The electroplated diamond polygonal wire saw according to claim 1, characterized in that, The wire saw uses intermittent feed processing.

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