Silicone pattern logo molding process

Through the molded silicone molding process, the problem of silicone pattern identification needs to be cut and feel uncomfortable is solved, and a three-dimensional silicone pattern identification without cutting is achieved. The surface is smooth and the three-dimensional contour is clear, reducing costs.

CN117067478BActive Publication Date: 2025-08-08曹计华
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Patent Information

Application Number
CN202310993011.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-08-08
Publication Date
2025-08-08
Estimated Expiration
2043-08-08

AI Technical Summary

Technical Problem

The existing silicone pattern marking process requires cutting and feel uncomfortable, and the outer contour is unclear.

Method used

The molded silicone is stirred with diluent to form a dispensing liquid, and is formed in the mold using a dispensing machine, combined with hot melt adhesive film and high-temperature paper, and a three-dimensional silicone pattern mark is formed through molding and demolding, which is directly applied to clothing or shoes.

Benefits of technology

It can be applied to clothing or shoes without cutting, with a smooth surface and a clear three-dimensional contour, reducing production costs and improving touch.

✦ Generated by Eureka AI based on patent content.

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    Figure CN117067478B_ABST
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Abstract

The invention discloses a forming process for a silicone pattern mark, comprising the following steps: stirring molded silicone and a diluent to obtain a stirred liquid, wherein the weight ratio of the molded silicone to the diluent is 10:1-2, pouring the diluent and a color paste into the stirred liquid to obtain a dispensing liquid, wherein the additive accounts for 5-10% of the total weight of the stirred liquid, and the color paste accounts for 5-10% of the total weight of the stirred liquid; placing a preheated lower mold on a dispensing machine, dispensing the dispensing liquid into a forming cavity of the lower mold, and placing a hot melt adhesive film and high-temperature paper covering the hot melt adhesive film in the forming cavity of the lower mold; closing the upper mold and the lower mold for molding when the mold temperature of the upper mold reaches 70-90 degrees; molding and demolding, first cooling the temperature, and then demolding after molding, using a high-viscosity adhesive film to separate a low-viscosity film from the forming block to obtain the silicone pattern mark; compared with the prior art, the silicone pattern mark can be attached to clothing or shoes without cutting, and the molded silicone pattern mark has a smooth surface and a relatively clear three-dimensional contour.
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Description

Technical Field

[0001] The invention relates to the field of logo printing, and in particular to a molding process for silicone pattern logos. Background Art

[0002] Existing clothing and shoes often feature logos for decoration or logo display. The current process involves printing the desired logo texture layer on a base fabric. Silicone is then applied to the textured layer to cover it. A mesh or gauze is then placed on top of the base fabric. Finally, an upper template matching the textured layer is placed over the mesh or gauze and pressed down. This forces the silicone to extrude from the mesh or gauze, which is then dried.

[0003] However, in actual application, this pattern logo processing method requires cutting the dried base fabric to the corresponding silicone parts before it can be applied to clothing or shoes, which involves many steps. In addition, the silicone is squeezed out of the mesh or gauze, resulting in the pattern logo surface being composed of upwardly raised raised particles, which makes the touch uncomfortable. In addition, the outer contour boundary of the processed pattern logo is not clear.

[0004] In view of this, the inventor of this case conducted in-depth research on the problem, which led to the creation of this case. Summary of the Invention

[0005] The purpose of the present invention is to provide a molding process for a silicone pattern logo, so as to solve the problems that the existing logo molding process needs to cut the pattern logo before it can be used, and has an uncomfortable touch and an unclear outer contour.

[0006] In order to achieve the purpose, the present invention adopts such technical solution:

[0007] The molding process of the silicone pattern logo is processed through the following steps:

[0008] Step 1: Pre-dispensing treatment: prepare molded silicone, additives, diluents, and color pastes. Stir the molded silicone and diluents to obtain a stirring liquid. The weight ratio of molded silicone to diluent is 10:1-2. Pour the diluent and color paste into the stirring liquid and stir evenly to obtain a dispensing liquid. The additives account for 5-10% of the total weight of the stirring liquid, and the color paste accounts for 5-10% of the total weight of the stirring liquid.

[0009] A lower mold and an upper mold mated with the lower mold are produced, wherein the lower mold has a molding cavity that matches the silicone pattern mark, and the upper mold has a molding core that matches the molding cavity;

[0010] Step 2: Glue dispensing. Preheat the lower mold of step 1 to a mold temperature of 130-150 degrees. Place the preheated lower mold on a glue dispensing machine. Pour the glue liquid of step 1 into the glue dispensing machine. Use the glue dispensing machine to dispense the glue liquid of step 1 into the forming cavity of the lower mold. Finally, place a hot melt adhesive film that matches the forming cavity of the lower mold and covers the glue liquid, and a high-temperature paper covering the hot melt adhesive film in the forming cavity of the lower mold to obtain a mold to be pressed with glue liquid.

[0011] Step 3: Molding: Preheat the upper mold from step 1. When the mold temperature of the upper mold is between 70-90 degrees, the upper mold and the lower mold are closed and molded. A molding block with a high-temperature paper layer, a hot-melt adhesive film layer, and a silicone layer is formed in the molding cavity of the lower mold from top to bottom.

[0012] Step 4: Molding and demoulding. Use a shovel to place the lower mold in step 3 on a cooling machine for cooling and molding. After molding, tear off the high-temperature paper layer, and then use a shovel to transfer the lower mold to the work platform for demoulding. When demoulding, use a low-viscosity film to stick to the hot-melt adhesive film layer of the molded block and then pull the low-viscosity film upward to make the molded block fall out of the molding mold of the lower mold, forming a molding block with a low-viscosity film. Finally, stick a high-viscosity film on the low-viscosity film of the molding block. After bonding, tear off the high-viscosity film. The high-viscosity film separates the low-viscosity film from the molding block to obtain a silicone pattern logo.

[0013] The mold temperature of the upper mold is 80 degrees, and the mold temperature of the lower mold is 140 degrees.

[0014] The model of the molded silicone is XG-360W, and the model of the additive is XG-360B.

[0015] The molding process of the silicone pattern logo of the present invention adopts the above-mentioned process to directly obtain the required molded silicone pattern logo, and there is no need to further cut the silicone logo before applying it to clothing or shoes. In addition, the dispensing liquid is molded in the molding cavity, so that the finished product of the entire silicone pattern logo has a three-dimensional structure, and the outer contour of the entire silicone pattern logo is clearer, thereby improving the quality of the molded silicone pattern logo. In addition, because the upper and lower surfaces of the molding block are pressed by the upper mold and the lower mold, the upper and lower surfaces of the final silicone pattern logo are relatively smooth and have a better touch. Compared with the prior art, there is no need to scrape the silicone on the base cloth, which reduces the production cost. There is no need to cut. By utilizing the pressing force of the thermal transfer equipment, the side of the silicone pattern logo with the hot melt adhesive film layer is pressed on the clothing or shoes to attach the silicone pattern logo to the clothing or shoes. The process is simple, and the molded silicone pattern logo has a smooth surface, a good three-dimensional sense, and a clearer three-dimensional contour. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a structural schematic diagram of the present invention. DETAILED DESCRIPTION

[0017] In order to further explain the technical solution of the present invention, it is described in detail below with reference to the accompanying drawings.

[0018] The molding process of silicone pattern logo, such as Figure 1 As shown, it is processed through the following steps:

[0019] Step 1: Pre-dispensing treatment. Pre-dispensing treatment includes preparing molded silicone, additives, diluents and color pastes. The molded silicone and diluents are stirred to obtain a stirred liquid. The weight ratio of the molded silicone and the diluent is 10:1-2. Preferably, the model of the molded silicone is XG-360W, the diluent is liquid silicone diluent, the additive is silicone curing agent, and the model of the additive is XG-360B. The diluent and color paste are poured into the stirring liquid and stirred evenly to obtain a dispensing liquid. The additive accounts for 5-10% of the total weight of the stirring liquid, and the color paste accounts for 5-10% of the total weight of the stirring liquid. During use, the molded silicone can use other existing silicones that can play the same role. When the silicone is in liquid form, it is more viscous and cannot be directly extruded. Adding silicone diluent can dilute the silicone liquid, and then using silicone curing agent to make the diluted silicone liquid have an appropriate consistency so that the dispensing liquid can be extruded. At the same time, the diluent and additives are preferably prepared using diluents and additives from the same manufacturer during use for better results.

[0020] A lower mold 1 and an upper mold 2 mated with the lower mold 1 are produced. The lower mold 1 has a molding cavity that matches the silicone pattern logo, and the upper mold 2 has a molding core 21 that matches the molding cavity. The lower mold 1 and the upper mold 2 are made using a 25T silicone trademark machine.

[0021] Step 2: Glue dispensing. Preheat the lower mold 1 of step 1. The mold temperature of the lower mold 1 is 130-150 degrees. Preferably, the mold temperature of the lower mold 1 is 140 degrees. The preheated lower mold 1 is placed on a glue dispensing machine. Then pour the glue dispensing liquid of step 1 into the glue dispensing machine, adjust the glue output data of the glue dispensing machine, and use the glue dispensing machine to dispense the glue dispensing liquid of step 1 into the forming cavity of the lower mold 1. Note that the highest point of the glue dispensing liquid is lower than the highest point of the forming cavity. Finally, a hot melt adhesive film 3 that coincides with the forming cavity of the lower mold 1 and covers the glue dispensing liquid and a high-temperature paper 4 covering the hot melt adhesive film 3 are placed in the forming cavity of the lower mold 1 to obtain a mold to be pressed with glue dispensing liquid;

[0022] Step 3: Molding. Preheat the upper mold 2 of step 1. When the mold temperature of the upper mold 2 is 70-90 degrees, the upper mold 2 and the lower mold 1 are molded together for molding. Preferably, the mold temperature of the upper mold 2 is 80 degrees. It should be noted that the upper mold 2 must be preheated to the required temperature before molding can begin. A molding block 5 is formed in the molding cavity of the lower mold 1, which has a high-temperature paper layer, a hot-melt adhesive film layer and a silicone layer from top to bottom. Preferably, the temperature of the preheated lower mold is higher than the temperature of the preheated upper mold, so that the glue liquid enters the molding cavity and can be quickly molded; the setting of the high-temperature paper layer prevents the molding of the molding block 5 from being affected by excessively high temperatures. At the same time, when molding silicone, the setting of the high-temperature paper layer will not cause the molding block to stick to the upper mold.

[0023] Step 4: Molding and demoulding. Use a shovel to place the lower mold 1 of step 3 on a cooling machine for cooling and molding. After molding, tear off the high-temperature paper layer, and then use a shovel to transfer the lower mold 1 to the work platform for demoulding. When demoulding, use a low-viscosity film to stick to the hot-melt adhesive film layer of the molding block 5 and then pull the low-viscosity film upward to make the molding block 5 fall out of the molding mold of the lower mold 1, forming a molding block with a low-viscosity film. Finally, stick a high-viscosity film on the low-viscosity film of the molding block. After bonding, tear off the high-viscosity film. The high-viscosity film separates the low-viscosity film from the molding block to obtain a silicone pattern logo with a hot-melt adhesive film layer on one side; the setting of the hot-melt adhesive film layer makes it convenient to use thermal transfer equipment to hot-press the hot-melt adhesive film layer and clothing or shoes together after molding. It is easy to use, and thermal transfer equipment is a well-known technology for those skilled in the art.

[0024] The molding process of the silicone pattern logo of the present invention directly obtains the required molded silicone pattern logo after adopting the above process, and the silicone logo does not need to be further cut before it can be applied to clothing or shoes. In addition, the dispensing liquid is molded in the molding cavity, so that the finished product of the entire silicone pattern logo has a three-dimensional structure, the outer contour of the entire silicone pattern logo is clearer, and the quality of the molded silicone pattern logo is improved. In addition, because the upper and lower surfaces of the molding block are pressed by the upper mold 2 and the lower mold 1, the upper and lower surfaces of the final silicone pattern logo are relatively smooth and have a better touch. Compared with the prior art, there is no need to scrape the silicone on the base cloth, which reduces the production cost. There is no need to cut, and the silicone pattern logo can be attached to the clothing or shoes by directly using the pressing force of the thermal transfer equipment. The side of the silicone pattern logo with the hot melt adhesive film layer is pressed on the clothing or shoes. The process is simple, and the molded silicone pattern logo has smooth upper and lower surfaces, and gives people a better three-dimensional sense and a clearer three-dimensional contour.

[0025] In the present invention, it is preferable to set the required surface texture of the silicone pattern mark at the bottom of the cavity of the lower mold 1; when used, after the silicone pattern mark is formed, the surface of the silicone pattern mark can have a texture, increasing the diversity of the silicone pattern mark to produce different tactile sensations.

[0026] The product form of the invention is not limited to the illustrations and embodiments of this case. Any appropriate changes or modifications made by anyone with similar ideas should be deemed to be within the patent scope of the present invention.

Claims

1. A molding process for a silicone pattern logo, characterized in that: It is processed through the following steps: Step 1: Pre-dispensing treatment: prepare molded silicone, additives, and color paste. Stir the molded silicone with a diluent to obtain a stirring liquid. The weight ratio of the molded silicone to the diluent is 10:1-2. Pour the diluent and color paste into the stirring liquid and stir evenly to obtain a dispensing liquid. The additive accounts for 5-10% of the total weight of the stirring liquid, and the color paste accounts for 5-10% of the total weight of the stirring liquid. A lower mold and an upper mold mated with the lower mold are produced, wherein the lower mold has a molding cavity that matches the silicone pattern mark, and the upper mold has a molding core that matches the molding cavity; Step 2: Glue dispensing. Preheat the lower mold of step 1 to a mold temperature of 130-150 degrees. Place the preheated lower mold on a glue dispensing machine. Pour the glue liquid of step 1 into the glue dispensing machine. Use the glue dispensing machine to dispense the glue liquid of step 1 into the forming cavity of the lower mold. Finally, place a hot melt adhesive film that matches the forming cavity of the lower mold and covers the glue liquid, and a high-temperature paper covering the hot melt adhesive film in the forming cavity of the lower mold to obtain a mold to be pressed with glue liquid. Step 3: Molding: Preheat the upper mold from step 1. When the mold temperature of the upper mold is between 70-90 degrees, the upper mold and the lower mold are closed and molded. A molding block with a high-temperature paper layer, a hot-melt adhesive film layer, and a silicone layer is formed in the molding cavity of the lower mold from top to bottom. Step 4: Molding and demoulding. Use a shovel to place the lower mold in step 3 on a cooling machine for cooling and molding. After molding, tear off the high-temperature paper layer, and then use a shovel to transfer the lower mold to the work platform for demoulding. When demoulding, use a low-viscosity film to stick to the hot-melt adhesive film layer of the molded block and then pull the low-viscosity film upward to make the molded block fall out of the molding mold of the lower mold, forming a molding block with a low-viscosity film. Finally, stick a high-viscosity film on the low-viscosity film of the molding block. After bonding, tear off the high-viscosity film. The high-viscosity film separates the low-viscosity film from the molding block to obtain a silicone pattern logo.

2. The molding process of the silicone pattern mark according to claim 1, characterized in that: Place The mold temperature of the upper mold is 80 degrees, and the mold temperature of the lower mold is 140 degrees.

3. The molding process of the silicone pattern mark according to claim 1, characterized in that: The model of the molded silicone is XG-360W, and the model of the additive is XG-360B.

4. The molding process of the silicone pattern marker according to claim 1, characterized in that: The auxiliary agent is a silicone curing agent, and the diluent is a silicone diluent.

Citation Information

Patent Citations

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