Wafer warpage detection method, device, terminal, medium and semiconductor robot

Abstract

This invention provides a method, apparatus, terminal, medium, and semiconductor robot for detecting wafer warpage. Upon receiving a wafer pick-up command, the invention controls the semiconductor robot's motion mechanism to perform corresponding motion operations. This allows the robot's follow-up vision system to acquire complete image information of the test surface of the wafer. Based on this image information, the warpage of the wafer is calculated. This invention enables real-time detection of warpage before wafer handling, preventing wafers with excessive warpage from being transferred to the next process, thus avoiding unnecessary production waste.

Description

Technical Field

[0001] This invention relates to the field of wafer handling robots, and in particular to a wafer warpage detection method, apparatus, terminal, medium, and semiconductor robot. Background Technology

[0002] As the feature size of memory cells approaches the lower limit of process technology, three-dimensional NAND flash memory is being widely adopted. Due to the increasing number of stacked layers and the increasingly intricate structure of 3D NAND, the overall stress distribution on wafers containing this technology is prone to unevenness, leading to wafer warping. Wafer warping causes numerous problems, such as stack layer delamination, stack layer misalignment, wafer cracking, unstable layout alignment, and difficulty in wafer bonding. Currently, wafer warping is not detected in real time and requires specialized equipment. Therefore, the real-time and rapid detection of wafers with non-compliant warping has become extremely urgent. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a wafer warpage detection method, device, terminal, medium, and semiconductor robot to solve the problems of the prior art.

[0004] To achieve the above and other related objectives, the present invention provides a wafer warpage detection method applied to a semiconductor robot, comprising: a motion mechanism and a follow-up vision system disposed on the motion mechanism. The method comprises: when receiving a wafer pick-up command, controlling the motion mechanism to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test; and calculating the warpage of the wafer under test based on the complete image information of the test surface of the wafer under test.

[0005] In one embodiment of the present invention, the motion mechanism includes: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism and a second end effector mechanism, each having an actuator; the follow-up vision system is mounted on the rotating shaft of the first end effector mechanism; wherein, when a wafer pick-up command is received, one or more of the following motion operations are performed by controlling the lifting mechanism to perform a lifting operation, the first robotic arm mechanism to perform a first rotation operation, the second robotic arm mechanism to perform a second rotation operation, the first end effector mechanism to perform a third rotation operation, and the second end effector mechanism to perform a fourth rotation operation, so as to control the follow-up vision system to acquire complete image information of the test surface of the wafer to be tested.

[0006] In one embodiment of the present invention, when a wafer pick-up command is received, controlling the motion mechanism to perform a corresponding motion operation so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test includes: when a first wafer pick-up command is received, performing a first control operation on the motion mechanism to drive the follow-up vision system to one or more preset positions to acquire complete image information of the side of the wafer under test located in the wafer cassette; wherein, the first control operation includes: lifting control operation, translation control operation, and influence control operation; the lifting control operation includes: controlling the lifting mechanism to perform a lifting operation to drive the follow-up vision system to move up and down to the horizontal height of the wafer under test; The translation control operation includes: controlling the first robotic arm mechanism and / or the second robotic arm mechanism to perform corresponding rotation operations, so as to drive the follow-up vision system located at the horizontal height to a set distance between the vertical plane of the wafer box door and the vertical plane of the wafer box door, and to drive the follow-up vision system to translate to one or more preset positions with a set distance between the horizontal height and the vertical plane of the wafer box door, so as to control the follow-up vision system to acquire side images of the wafer under test located in the wafer box at each preset position, thereby obtaining complete side image information; the influence control operation includes: controlling the first end effector mechanism and the end effector of the second end effector located in the image acquisition area of ​​the follow-up vision system to move outside the image acquisition area.

[0007] In one embodiment of the present invention, calculating the warpage of the wafer under test based on the complete image information of the test surface of the wafer under test includes: stitching and extracting the edge contour of the side image of the wafer under test located in the wafer cassette acquired by the follow-up vision system at each preset position, and calculating the position of the upper convex point or indentation point of the edge contour to obtain the warpage of the wafer under test.

[0008] In one embodiment of the present invention, when a wafer pick-up command is received, controlling the motion mechanism to perform a corresponding motion operation so that the follow-up vision system can acquire complete image information of the surface to be tested of the wafer includes: when a second wafer pick-up command is received, performing a second control operation on the motion mechanism so that the follow-up vision system can scan the complete depth image information of the surface of the wafer to be tested held by the actuators of the first end effector mechanism and the second end effector mechanism; the second control operation includes: controlling the motion mechanism to perform a wafer pick-up operation so that the actuators of the first end effector mechanism and the second end effector mechanism can pick up the wafer to be tested from the wafer cassette and stop it, so as to control the follow-up vision system to scan the upper surface of the wafer to be tested held by the actuators to obtain complete depth image information of the surface.

[0009] In one embodiment of the present invention, calculating the warpage of the wafer under test based on the complete image information of the surface under test includes: performing feature extraction based on the complete depth image information of the surface of the wafer under test to obtain the depth value of the upper surface of the wafer under test, and calculating the warpage of the wafer under test.

[0010] In one embodiment of the present invention, the preset positions are at least three, including: a first preset position corresponding to the center position of the wafer to be tested, a second preset position corresponding to the left edge position of the wafer to be tested, and a third preset position corresponding to the right edge position of the wafer to be tested.

[0011] In one embodiment of the present invention, the follow-up vision system includes: an optical sensor and a rotating shaft motor; wherein, the optical sensor is used to acquire complete image information of the test surface of the wafer under test; and the rotating shaft motor is used to drive the optical sensor to perform a rotation operation based on a received control signal.

[0012] To achieve the above and other related objectives, the present invention provides a wafer warpage detection device for use in a semiconductor robot, comprising: a motion mechanism and a follow-up vision system mounted on the motion mechanism. The device includes: an image acquisition module, used to control the motion mechanism to perform corresponding motion operations when a wafer picking instruction is received, so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test; and a warpage calculation module, connected to the image acquisition module, used to perform mechanical performance diagnostic analysis on each motion mechanism based on vibration data acquired by each vibration acquisition device, so as to obtain the mechanical performance diagnostic analysis results of each motion mechanism in the wafer intelligent robot.

[0013] To achieve the above and other related objectives, the present invention provides a wafer warpage detection terminal, comprising: one or more memories and one or more processors; the one or more memories are used to store a computer program; the one or more processors are connected to the memories and are used to run the computer program to execute the wafer warpage detection method.

[0014] To achieve the above and other related objectives, the present invention provides a computer-readable storage medium storing a computer program, which is executed by one or more processors to perform the wafer warpage detection method.

[0015] To achieve the above and other related objectives, the present invention provides a semiconductor robot, comprising: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism, a second end effector mechanism, a follow-up vision system, and a control device; wherein, the follow-up vision system is mounted on the rotating shaft of the first end effector mechanism; the control device is connected to the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism, the second end effector mechanism, and the follow-up vision system, and is used to, upon receiving a wafer pick-up command, control the lifting mechanism to perform a lifting operation, the first robotic arm mechanism to perform a first rotation operation, the second robotic arm mechanism to perform a second rotation operation, the first end effector mechanism to perform a third rotation operation, and the second end effector mechanism to perform a fourth rotation operation to perform corresponding motion operations, so as to control the follow-up vision system to acquire complete image information of the test surface of the wafer under test; and calculate the warpage of the wafer under test based on the complete image information of the test surface of the wafer under test.

[0016] As described above, this invention provides a wafer warpage detection method, apparatus, terminal, medium, and semiconductor robot, offering the following advantages: When a wafer pick-up command is received, this invention controls the semiconductor robot's motion mechanism to perform corresponding motion operations. This allows the semiconductor robot's follow-up vision system to acquire complete image information of the test surface of the wafer under test. Based on this complete image information, the warpage of the wafer under test is calculated. This invention enables real-time detection of warpage before wafer handling, preventing wafers with excessive warpage from being transferred to the next process, thus avoiding unnecessary production waste. Attached Figure Description

[0017] Figure 1 The diagram shown is a flowchart of a wafer warpage detection method according to an embodiment of the present invention.

[0018] Figure 2 The diagram shown is a schematic representation of the structure of a semiconductor robot according to an embodiment of the present invention.

[0019] Figure 3 The diagram shown illustrates a first application scenario of the semiconductor robot according to an embodiment of the present invention.

[0020] Figure 4 The diagram shows an optical sensor acquiring a side image of a wafer under test inside a wafer cassette, according to an embodiment of the present invention.

[0021] Figure 5 The diagram shows the vertical distance between the servo vision system and the wafer box door in one embodiment of the present invention.

[0022] Figure 6The diagram shows the movement position of the end effector in one embodiment of the present invention.

[0023] Figure 7 The diagram shows a schematic side profile of the wafer under test in one embodiment of the present invention.

[0024] Figure 8 The diagram shows a second application scenario of the semiconductor robot according to an embodiment of the present invention.

[0025] Figure 9 The diagram shown is a flowchart of a wafer warpage detection method according to an embodiment of the present invention.

[0026] Figure 10 This is a schematic diagram showing the relative positions between the optical sensor and the wafer under test in one embodiment of the present invention.

[0027] Figure 11 The diagram shown is a schematic of an optical sensor moving to the left to acquire an image of the wafer under test in one embodiment of the present invention.

[0028] Figure 12 The diagram shown is a schematic of an optical sensor moving to the right to acquire an image of the wafer under test in one embodiment of the present invention.

[0029] Figure 13 The diagram shown is a flowchart of a wafer warpage detection method according to an embodiment of the present invention.

[0030] Figure 14 The diagram shown is a schematic representation of a wafer warpage detection device according to an embodiment of the present invention.

[0031] Figure 15 The diagram shown is a structural schematic of a wafer warpage detection terminal according to an embodiment of the present invention.

[0032] Figure 16 The diagram shown is a schematic representation of the structure of a semiconductor robot according to an embodiment of the present invention. Detailed Implementation

[0033] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0034] It should be noted that in the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the invention. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical system, and operation may be made without departing from the spirit and scope of the invention. The following detailed description should not be considered limiting, and the scope of the embodiments of the invention is defined only by the claims of the published patents. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0035] Throughout this specification, when it is said that a part is "connected" to another part, this includes not only "direct connection" but also "indirect connection" by placing other elements in between. Furthermore, when it is said that a part "includes" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather means that other constituent elements may also be included.

[0036] The terms "first," "second," and "third," etc., used herein are for the purpose of describing various parts, components, regions, layers, and / or segments, but are not limiting. These terms are used only to distinguish one part, component, region, layer, or segment from others. Therefore, the "first part," "component," "region," "layer," or "segment" described below may refer to a "second part," "component," "region," "layer," or "segment" without departing from the scope of this invention.

[0037] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition arise only when combinations of elements, functions, or operations are inherently mutually exclusive in some manner.

[0038] Therefore, this invention provides a wafer warpage detection method. When a wafer pick-up command is received, the motion mechanism of a semiconductor robot is controlled to perform corresponding motion operations. This allows the robot's follow-up vision system to acquire complete image information of the test surface of the wafer. Based on this complete image information, the warpage of the wafer is calculated. This invention enables real-time detection of warpage before wafer handling, preventing wafers with excessive warpage from being transferred to the next process, thus avoiding unnecessary production waste.

[0039] The present invention will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can readily implement it. The present invention can be embodied in many different forms and is not limited to the embodiments described herein.

[0040] like Figure 1 This is a schematic flowchart illustrating a wafer warpage detection method according to an embodiment of the present invention.

[0041] Applications in semiconductor robots include: a motion mechanism and a follow-up vision system mounted on the motion mechanism.

[0042] The method includes:

[0043] Step S101: When a wafer picking instruction is received, the motion mechanism is controlled to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test.

[0044] Step S102: Calculate the warpage of the wafer under test based on the complete image information of the test surface of the wafer under test.

[0045] The CA124 semiconductor robot is designed for the transfer and handling of silicon-based and non-silicon-based wafers in semiconductor manufacturing processes. It can be used in all wafer-type manufacturing processes and equipment. It is a system designed for high safety, high reliability, high consistency, high repeatability, and high positioning accuracy requirements in semiconductor manufacturing environments. It is a precision semiconductor wafer transport system applicable to semiconductor laboratories, small-batch semiconductor manufacturing, and large-scale semiconductor manufacturing environments, suitable for all semiconductor manufacturing applications. For semiconductor wafer transport applications, the CA124 provides a safer and more reliable high-quality vision system, sensor system, and pre-judgment algorithms to further meet the requirements of high safety and high reliability.

[0046] Therefore, the wafer warpage detection method of the CA124 semiconductor robot is described below with reference to the following embodiments.

[0047] In one embodiment, such as Figure 2The motion mechanism includes: a lifting mechanism 1, a first robotic arm mechanism 2, a second robotic arm mechanism 3, a first end effector mechanism 4 and a second end effector mechanism 5, each having an actuator; the follow-up vision system 6 is mounted on the rotating shaft of the first end effector mechanism 5.

[0048] The lifting mechanism 1 includes a lifting motor, which is used to drive the first robotic arm mechanism 2, the second robotic arm mechanism 3, the first end effector mechanism 4, and the second end effector mechanism 5 to move up and down along the lifting shaft J1 in conjunction with the lead screw, thereby driving the follow-up vision system 6 to move up and down along the lifting shaft J1.

[0049] The first robotic arm mechanism 2 includes: a first rotating shaft motor, which is used to drive the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector 5 mechanism to rotate around the first rotating shaft J2 in conjunction with a synchronous belt pulley, thereby driving the follow-up vision system 6 to rotate around the first rotating shaft J2;

[0050] The second robotic arm mechanism 3 includes: a second rotating shaft motor, which, in conjunction with the synchronous belt pulley 32, drives the first end effector mechanism and the second end effector mechanism to rotate around the second rotating shaft J3, thereby driving the follow-up vision system 6 to rotate around the second rotating shaft J3;

[0051] The first end effector mechanism 4 includes: a third rotating shaft motor, which is used to drive the first end effector to rotate around the third rotating shaft J4 in conjunction with the synchronous pulley 42, thereby driving the follow-up vision system 6 to rotate around the third rotating shaft J4;

[0052] The second end effector mechanism 5 includes a fourth rotary motor 41, which, in conjunction with a synchronous pulley 42, drives the second end effector to rotate around a fourth rotary axis J5, thereby driving the follow-up vision system 6 to rotate around a third rotary axis J5. The third rotary axis J4 and the fourth rotary axis J5 are rotary axes in the same direction.

[0053] Furthermore, the lifting shaft J1 is parallel to the first rotating shaft J2, the second rotating shaft J3, and the third rotating shaft J4.

[0054] Step S101 includes:

[0055] When a wafer retrieval command is received, the system controls one or more of the following motion operations: lifting mechanism 1 performs lifting operation; first robotic arm mechanism 2 performs first rotation operation; second robotic arm mechanism 3 performs second rotation operation; first end effector mechanism 4 performs third rotation operation; and second end effector mechanism 5 performs fourth rotation operation. This allows the system to control the follow-up vision system 6 to acquire complete image information of the test surface of the wafer.

[0056] In one embodiment, the follow-up vision system 6 includes: an optical sensor and a rotating shaft motor; wherein, the optical sensor is used to acquire complete image information of the test surface of the wafer under test; the rotating shaft motor is used to drive the optical sensor to rotate around a fifth rotation axis J6 based on a received control signal. The fifth rotation axis J6 and the fourth rotation axis J5 are rotation axes in the same direction.

[0057] The wafer warpage detection method based on the above semiconductor robot application has two approaches, which are described in the following embodiments.

[0058] The first application method for wafer warpage detection involves directly detecting the warpage of the wafer under test located within the wafer cassette without performing a wafer removal operation. This method is illustrated below with reference to the following examples:

[0059] In one embodiment, step S101 includes:

[0060] like Figure 3 As shown, when the semiconductor robot receives the first wafer picking instruction, it performs a first control operation on the motion mechanical mechanism to drive the follow-up vision system 6 to one or more preset positions to collect complete side image information of the wafer to be tested located in the wafer box 00.

[0061] The first control operation includes: lifting control operation, translation control operation, and influence control operation;

[0062] The lifting control operation includes: controlling the lifting mechanism 1 to perform a lifting operation, so as to drive the follow-up vision system to move up and down to the horizontal height of the wafer under test; specifically, making the center of the lens of the optical sensor 61 and the upper surface of the wafer under test on the same horizontal plane, such as... Figure 4 As shown.

[0063] The translation control operation includes: controlling the first robotic arm mechanism 2 and / or the second robotic arm mechanism 3 to perform corresponding rotation operations, so as to drive the vertical distance between the follow-up vision system 6 located at the horizontal height and the wafer box door to a set distance R, such as... Figure 5 As shown.

[0064] The system controls the servo vision system 6 to translate to preset positions with a set distance R between it and one or more horizontal planes and the vertical planes of the wafer cassette doors of the wafer cassette 00. This allows the servo vision system 6 to acquire side images of the wafer under test located within the wafer cassette 00 at each preset position, ensuring that complete side image information is acquired collectively. Specifically, there can be one preset position, where a complete side image of the wafer under test can be acquired. Alternatively, there can be multiple preset positions, where side images of the wafer under test acquired at multiple positions can be stitched together to form a complete side image of the wafer under test.

[0065] The influence control operation includes: controlling the end effectors of the first end effector mechanism 4 and the second end effector 5 located in the image acquisition area of ​​the follow-up vision system 6 to move outside the image acquisition area; that is, moving them to an area that does not affect the lifting control operation, including the translation control operation, and does not affect image acquisition, such as... Figure 6 As shown, the rotation angle can be any angle that does not affect the shooting.

[0066] It should be noted that the influence control operation can be performed before or after the descent control operation and the translation control operation.

[0067] In one embodiment, step S102 includes:

[0068] The side images of the wafer under test located in the wafer cassette, acquired by the follow-up vision system at each preset position, are stitched together and edge contours are extracted. The positions of the upper convex points or indented points of the edge contours are calculated to obtain the warpage of the wafer under test.

[0069] Specifically, if a complete image of the test surface of the wafer under test located within the wafer cassette is acquired at a single preset location, an edge extraction algorithm is used to directly extract the wafer's contour on the horizontal plane from this image information to calculate the wafer's warpage. If complete image information of the test surface of the wafer under test located within the wafer cassette is acquired at multiple preset locations, the complete image information of the test surface is first stitched together, and then an edge extraction algorithm is used to extract the wafer's contour on the horizontal plane from the stitched image information.

[0070] like Figure 7 As shown, the horizontal contour of the wafer is extracted after image processing. The leftmost edge of the wafer is defined as the origin of the XY coordinate system, and the rightmost edge is defined as the positive X direction. If the warpage is convex (lower at the edges and higher at the center), the absolute value of the Y coordinate of the highest point A (convex) of the warped wafer curve can be calculated as the warpage value. If the warpage is concave (higher at the edges and lower at the center), the absolute value of the Y coordinate of the lowest point B (concave) of the warped wafer curve can be calculated as the warpage value.

[0071] In one specific embodiment, the preset positions are at least three, including: a first preset position corresponding to the center position of the wafer under test, a second preset position corresponding to the left edge position of the wafer under test, and a third preset position corresponding to the right edge position of the wafer under test.

[0072] Specifically, the optical sensor is moved to a first preset position, aligned with the center of the wafer, and acquires an image. Then, it moves horizontally to the left to a second preset position, aligned with the left edge of the wafer, and acquires a left image. Next, it moves horizontally to the right to a third preset position, aligned with the right edge of the wafer, and acquires a right image. After obtaining these three images, they are stitched together, and an edge extraction algorithm extracts the wafer's outline in the horizontal plane, thereby calculating the wafer's warpage.

[0073] The second application of the wafer warpage detection method requires a wafer removal operation first, in which the wafer to be tested is removed from the wafer cassette, and then the warpage of the wafer held by the actuator is detected. This method is illustrated in the following examples:

[0074] In one embodiment, step S101:

[0075] like Figure 8 As shown, when the semiconductor robot receives the second wafer picking instruction, it performs a second control operation on the motion mechanism to control the follow-up vision system to scan the complete depth image information of the surface of the wafer to be tested, which is gripped by the first end effector 41 of the first end effector mechanism 4 and the second end effector 51 of the second end effector mechanism 5.

[0076] The second control operation includes: controlling the motion mechanism to perform the wafer removal operation, so that the actuators of the first end effector mechanism 5 and the second end effector mechanism 6 can remove the wafer from the wafer cassette and stop it, so as to control the follow-up vision system 6 to scan the upper surface of the wafer held by the first end effector 41 and the second end effector 51 to obtain complete surface depth image information.

[0077] Specifically, after receiving the instruction to retrieve the wafer, the semiconductor robot controls the first and second robotic arm mechanisms to rotate to the designated wafer cassette and retrieve the designated wafer. After the wafer to be tested 01 is removed from the wafer cassette, the first end effector 41 and the second end effector 51 immediately stop, and the optical sensor scans and samples the upper surface of the retrieved wafer to be tested 01, which can acquire complete depth image information of the upper surface.

[0078] The optical sensor in this solution needs to have laser ranging capabilities.

[0079] In one embodiment, step S102 includes:

[0080] Feature extraction is performed based on the complete depth image information of the surface of the wafer under test to obtain the depth value of the upper surface of the wafer under test, and the warpage of the wafer under test is calculated.

[0081] Specifically, by utilizing the spatial position of the optical sensor and the spatial position of the wafer, feature extraction is performed on the complete depth image information of the surface of the wafer under test, and the corresponding surface contour and depth map are calculated to obtain the wafer warpage.

[0082] To better illustrate the above-mentioned wafer warpage detection method, the present invention provides the following specific embodiments.

[0083] Example 1: A method for detecting wafer warpage. For example... Figure 9 The diagram shown is a flowchart of the wafer warpage detection method in this embodiment.

[0084] The CA124 intelligent semiconductor robot system includes: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism, a second end effector mechanism, and a follow-up vision system. The follow-up vision system 6 includes optical sensors (e.g., linear arrays of cameras, grating laser beams, light-emitting diodes (LEDs) or laser diodes, and various combinations thereof) and a rotating shaft motor.

[0085] The method includes:

[0086] After receiving the wafer pick-up instruction, the CA124 intelligent semiconductor robot's robotic arm rotates to the designated wafer cassette and assumes a ready position. The z-axis is adjusted so that the center of the optical sensor lens and the top surface of the wafer to be picked up are on the same horizontal plane. (See...) Figure 1 Both end effectors were rotated to the rear of the shaft. The position of the robotic arm was adjusted so that the distance between the lens of the optical sensor and the vertical plane formed by the wafer cassette door was 80mm. Figure 10 The optical sensor 61 moves to align with the center of the wafer and acquires an image. Alternatively, an image can be acquired first at the center, and then the sensor can be moved horizontally 100mm to the left to acquire a left-side image. (See [link to documentation]). Figure 11 Then move horizontally 100mm to the right to acquire the right image, see... Figure 12 After obtaining three images, the images are stitched together, and the edge extraction algorithm extracts the outline of the wafer on the horizontal plane, thereby calculating the warpage of the wafer.

[0087] Example 2: A method for detecting wafer warpage. For example... Figure 13 The diagram shown is a flowchart of the wafer warpage detection method in this embodiment.

[0088] The CA124 intelligent semiconductor robot system includes: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism, a second end effector mechanism, and a follow-up vision system. The follow-up vision system 6 includes an optical sensor (capable of acquiring depth image information) and a rotating shaft motor.

[0089] The method includes:

[0090] Upon receiving a wafer retrieval instruction, the CA124 intelligent semiconductor robot's robotic arm rotates to the designated wafer cassette and retrieves the specified wafer. After the wafer is removed from the cassette, the end effector immediately stops, and an optical sensor scans and samples the surface of the retrieved wafer. Using the spatial position of the optical sensor and the spatial position of the wafer, the corresponding surface profile and depth map are calculated, thereby determining the wafer warpage. The optical sensor in this solution must have laser ranging capabilities.

[0091] Similar in principle to the above embodiments, the present invention provides a wafer warpage detection device.

[0092] The following specific embodiments are provided in conjunction with the accompanying drawings:

[0093] like Figure 14 A schematic diagram of a wafer warpage detection device according to an embodiment of the present invention is shown.

[0094] An application in semiconductor robots includes: a motion mechanism and a follow-up vision system disposed on the motion mechanism, the device comprising:

[0095] The image acquisition module 131 is used to control the motion mechanism to perform corresponding motion operations when a wafer picking instruction is received, so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test;

[0096] The warpage calculation module 132 is connected to the image acquisition module 131 and is used to perform mechanical performance diagnosis and analysis on each motion mechanical mechanism based on the vibration data collected by each vibration acquisition device, so as to obtain the mechanical performance diagnosis and analysis results of each motion mechanical mechanism in the wafer intelligent robot.

[0097] Since the implementation principle of the wafer warpage detection device has been described in the foregoing embodiments, it will not be repeated here.

[0098] In one embodiment, the motion mechanism includes: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism, and a second end effector mechanism, each having an actuator; the follow-up vision system is mounted on the rotating shaft of the first end effector mechanism; wherein, when a wafer pick-up command is received, one or more of the following motion operations are performed by controlling the lifting mechanism to perform a lifting operation, the first robotic arm mechanism to perform a first rotation operation, the second robotic arm mechanism to perform a second rotation operation, the first end effector mechanism to perform a third rotation operation, and the second end effector mechanism to perform a fourth rotation operation, so as to control the follow-up vision system to acquire complete image information of the test surface of the wafer to be tested.

[0099] In one embodiment, when a wafer pick-up command is received, controlling the motion mechanism to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the test surface of the wafer includes: when a first wafer pick-up command is received, performing a first control operation on the motion mechanism to move the follow-up vision system to one or more preset positions to acquire complete image information of the side of the wafer under test located in the wafer cassette; wherein, the first control operation includes: lifting control operation, translation control operation, and influence control operation; the lifting control operation includes: controlling the lifting mechanism to perform a lifting operation to move the follow-up vision system up and down to the horizontal height of the wafer under test; The translation control operation includes: controlling the first robotic arm mechanism and / or the second robotic arm mechanism to perform corresponding rotation operations, so as to drive the follow-up vision system located at the horizontal height to a set distance between the vertical plane of the wafer box door and the vertical plane of the wafer box door, and to drive the follow-up vision system to translate to one or more preset positions with a set distance between the horizontal height and the vertical plane of the wafer box door, so as to control the follow-up vision system to acquire side images of the wafer under test located in the wafer box at each preset position, thereby obtaining complete side image information; the influence control operation includes: controlling the first end effector mechanism and the end effector of the second end effector located in the image acquisition area of ​​the follow-up vision system to move outside the image acquisition area.

[0100] In one embodiment, calculating the warpage of the wafer under test based on the complete image information of the test surface of the wafer under test includes: stitching and extracting the edge contour of the side image of the wafer under test located in the wafer cassette acquired by the follow-up vision system at each preset position, and calculating the position of the upper convex point or indentation point of the edge contour to obtain the warpage of the wafer under test.

[0101] In one embodiment, when a wafer pick-up command is received, controlling the motion mechanism to perform a corresponding motion operation so that the follow-up vision system can acquire complete image information of the surface to be tested of the wafer includes: when a second wafer pick-up command is received, performing a second control operation on the motion mechanism to control the follow-up vision system to scan the complete depth image information of the surface of the wafer to be tested held by the actuators of the first end effector mechanism and the second end effector mechanism; the second control operation includes: controlling the motion mechanism to perform a wafer pick-up operation so that the actuators of the first end effector mechanism and the second end effector mechanism pick up the wafer to be tested from the wafer cassette and stop it, so as to control the follow-up vision system to scan the upper surface of the wafer to be tested held by the actuators to obtain complete depth image information of the surface.

[0102] In one embodiment, calculating the warpage of the wafer under test based on the complete image information of the surface under test includes: extracting features based on the complete depth image information of the surface of the wafer under test to obtain the depth value of the upper surface of the wafer under test, and calculating the warpage of the wafer under test.

[0103] In one embodiment, the preset positions are at least three, including: a first preset position corresponding to the center position of the wafer under test, a second preset position corresponding to the left edge position of the wafer under test, and a third preset position corresponding to the right edge position of the wafer under test.

[0104] In one embodiment, the servo vision system includes: an optical sensor and a rotating shaft motor; wherein the optical sensor is used to acquire complete image information of the test surface of the wafer under test; and the rotating shaft motor is used to drive the optical sensor to perform a rotation operation based on a received control signal.

[0105] like Figure 15 A schematic diagram of the structure of the wafer warpage detection terminal 140 in an embodiment of the present invention is shown.

[0106] The wafer warpage detection terminal 140 includes a memory 141 and a processor 142. The memory 141 stores a computer program; the processor 142 runs the computer program to implement, for example, […]. Figure 1 The aforementioned wafer warpage detection method.

[0107] Optionally, the number of memories 141 can be one or more, and the number of processors 142 can be one or more. Figure 15 Each example is taken as an instance.

[0108] Optionally, the processor 142 in the wafer warpage detection terminal 140 will perform the following... Figure 1 The steps described involve loading one or more instructions corresponding to the process of an application into memory 141, and having the processor 142 run the application stored in the first memory 141, thereby achieving the following: Figure 1 The various functions of the wafer warpage detection method.

[0109] Optionally, the memory 141 may include, but is not limited to, high-speed random access memory and non-volatile memory. For example, one or more disk storage devices, flash memory devices, or other non-volatile solid-state storage devices; the processor 142 may include, but is not limited to, a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0110] Optionally, the processor 142 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0111] The present invention also provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed, implements as follows: Figure 1 The method for detecting wafer warpage is illustrated. The computer-readable storage medium may include, but is not limited to, floppy disks, optical disks, CD-ROMs (Read-Only Optical Disk Memory), magneto-optical disks, ROMs (Read-Only Memory), RAMs (Random Access Memory), EPROMs (Erasable Programmable Read-Only Memory), EEPROMs (Electrically Erasable Programmable Read-Only Memory), magnetic cards or optical cards, flash memory, or other types of media / machine-readable media suitable for storing machine-executable instructions. The computer-readable storage medium may be a product not connected to a computer device or a component used in a computer device.

[0112] like Figure 16 This is a schematic diagram of the circuit structure of a semiconductor robot according to an embodiment of the present invention.

[0113] The semiconductor robot includes: a lifting mechanism 1, a first robotic arm mechanism 2, a second robotic arm mechanism 3, a first end effector mechanism 4, a second end effector mechanism 5, a follow-up vision system 6, and a control device 7.

[0114] The follow-up vision system 6 is mounted on the rotating shaft of the first end effector mechanism 2;

[0115] The control device 7 is connected to the lifting mechanism 1, the first robotic arm mechanism 2, the second robotic arm mechanism 3, the first end effector mechanism 4, the second end effector mechanism 5, and the follow-up vision system 6. When a wafer pick-up command is received, it controls the lifting mechanism 1 to perform a lifting operation, the first robotic arm mechanism 2 to perform a first rotation operation, the second robotic arm mechanism 3 to perform a second rotation operation, the first end effector mechanism 4 to perform a third rotation operation, and the second end effector mechanism 5 to perform a fourth rotation operation to perform corresponding motion operations. This allows the follow-up vision system 6 to acquire complete image information of the test surface of the wafer under test. Based on the complete image information of the test surface of the wafer under test, the warpage of the wafer under test is calculated.

[0116] It should be noted that the control device 7 can achieve the following: Figure 14 All functions of the wafer warpage detection device shown are described herein, and therefore will not be elaborated upon. The mechanical structure and function of the semiconductor robot are the same as those described in the above embodiments, and will not be elaborated upon therein.

[0117] In summary, the wafer warpage detection method, apparatus, terminal, medium, and semiconductor robot of the present invention control the motion mechanism of the semiconductor robot to perform corresponding motion operations when a wafer pick-up command is received. This allows the semiconductor robot's follow-up vision system to acquire complete image information of the test surface of the wafer under test, and then calculate the warpage of the wafer under test based on the complete image information of the test surface. The present invention can detect warpage in real time before wafer handling, avoiding unnecessary production waste caused by wafers with excessive warpage being transferred to the next process. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0118] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for detecting wafer warpage, characterized in that, An application in semiconductor robots, comprising: a motion mechanism and a follow-up vision system disposed on the motion mechanism, the method comprising: When a wafer picking instruction is received, the motion mechanical mechanism is controlled to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the test surface of the wafer under test. Based on the complete image information of the test surface of the wafer under test, the warpage of the wafer under test is calculated; The motion mechanism includes: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism, and a second end effector mechanism, each having an actuator; the follow-up vision system is mounted on the rotating shaft of the first end effector mechanism; wherein, when a wafer pick-up command is received, one or more of the following motion operations are performed by controlling the lifting mechanism to perform a lifting operation, the first robotic arm mechanism to perform a first rotation operation, the second robotic arm mechanism to perform a second rotation operation, the first end effector mechanism to perform a third rotation operation, and the second end effector mechanism to perform a fourth rotation operation, so as to control the follow-up vision system to acquire complete image information of the test surface of the wafer to be tested; When a wafer pick-up command is received, controlling the motion mechanism to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the test surface of the wafer includes: when a first wafer pick-up command is received, performing a first control operation on the motion mechanism to move the follow-up vision system to one or more preset positions to acquire complete image information of the side of the wafer under test located in the wafer cassette; wherein, the first control operation includes: lifting control operation, translation control operation, and influence control operation; the lifting control operation includes: controlling the lifting mechanism to perform a lifting operation to move the follow-up vision system up and down to the horizontal height of the wafer under test; the translation ... The operation includes: controlling the first robotic arm mechanism and / or the second robotic arm mechanism to perform corresponding rotation operations, so as to drive the follow-up vision system located at the horizontal height to a set distance between the vertical plane of the wafer cassette door and the vertical plane of the wafer cassette door, and to drive the follow-up vision system to translate to one or more preset positions with a set distance between the horizontal height and the vertical plane of the wafer cassette door, so as to control the follow-up vision system to acquire side images of the wafer under test located in the wafer cassette at each preset position, thereby obtaining complete side image information; the influence control operation includes: controlling the first end effector mechanism and the end effector of the second end effector located in the image acquisition area of ​​the follow-up vision system to move outside the image acquisition area; When a wafer pick-up command is received, controlling the motion mechanism to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the surface to be tested of the wafer includes: when a second wafer pick-up command is received, performing a second control operation on the motion mechanism to control the follow-up vision system to scan the complete depth image information of the surface of the wafer to be tested held by the actuators of the first end effector mechanism and the second end effector mechanism; the second control operation includes: controlling the motion mechanism to perform a wafer pick-up operation so that the actuators of the first end effector mechanism and the second end effector mechanism pick up the wafer to be tested from the wafer cassette and stop it, so as to control the follow-up vision system to scan the upper surface of the wafer to be tested held by the actuators to obtain complete depth image information of the surface.

2. The wafer warpage detection method according to claim 1, characterized in that, Based on the complete image information of the test surface of the wafer under test, the warpage of the wafer under test is calculated as follows: The side images of the wafer under test located in the wafer cassette, acquired by the follow-up vision system at each preset position, are stitched together and edge contours are extracted. The positions of the upper convex points or indented points of the edge contours are calculated to obtain the warpage of the wafer under test.

3. The wafer warpage detection method according to claim 1, characterized in that, Based on the complete image information of the test surface of the wafer under test, the warpage of the wafer under test is calculated as follows: Feature extraction is performed based on the complete depth image information of the surface of the wafer under test to obtain the depth value of the upper surface of the wafer under test, and the warpage of the wafer under test is calculated.

4. The wafer warpage detection method according to claim 1, characterized in that, The preset positions are at least three, including: a first preset position corresponding to the center of the wafer under test, a second preset position corresponding to the left edge of the wafer under test, and a third preset position corresponding to the right edge of the wafer under test.

5. The wafer warpage detection method according to claim 1, characterized in that, The servo vision system includes: an optical sensor and a rotating shaft motor; The optical sensor is used to acquire complete image information of the test surface of the wafer under test; The rotating shaft motor is used to drive the optical sensor to perform rotation operations based on the received control signal.

6. A wafer warpage detection terminal, characterized in that, include: One or more memories and one or more processors; The one or more memories are used to store computer programs; The one or more processors are connected to the memory and are used to run the computer program to perform the method as described in claims 1 to 5.

7. A computer-readable storage medium, characterized in that, The device contains a computer program that is executed by one or more processors to perform the method as described in any one of claims 1 to 5.

8. A semiconductor robot, characterized in that, include: The lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism, the second end effector mechanism, the follow-up vision system, and the control device; The follow-up vision system is mounted on the rotating shaft of the first end effector mechanism; The control device, connected to the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism, the second end effector mechanism, and the follow-up vision system, is used to, upon receiving a wafer pick-up command, control the lifting mechanism to perform a lifting operation, the first robotic arm mechanism to perform a first rotation operation, the second robotic arm mechanism to perform a second rotation operation, the first end effector mechanism to perform a third rotation operation, and the second end effector mechanism to perform a fourth rotation operation to perform corresponding motion operations. This allows the follow-up vision system to acquire complete image information of the test surface of the wafer under test; and based on the complete image information of the test surface of the wafer under test, the warpage of the wafer under test is calculated. Upon receiving a first wafer pick-up command, a first control operation is executed on the motion mechanism to move the follow-up vision system to one or more preset positions to acquire complete side image information of the wafer under test located in the wafer cassette. The first control operation includes: a lifting control operation, a translation control operation, and an influence control operation. The lifting control operation includes controlling the lifting mechanism to perform a lifting operation, thereby moving the follow-up vision system to the horizontal height of the wafer under test. The translation control operation includes controlling the first robotic arm mechanism and / or the second robotic arm mechanism to perform corresponding rotations. The operation involves moving the follow-up vision system, located at the horizontal height, to a predetermined distance between its vertical plane and the wafer cassette door, and then moving the follow-up vision system to one or more preset positions at the same horizontal height and with a predetermined distance between its vertical plane and the wafer cassette door. This allows the follow-up vision system to acquire side images of the wafer under test located within the wafer cassette at each preset position, thereby obtaining complete side image information. The influence control operation includes: controlling the first end effector mechanism and the end effector of the second end effector, both located within the image acquisition area of ​​the follow-up vision system, to move outside the image acquisition area. When a wafer pick-up command is received, controlling the motion mechanism to perform corresponding motion operations so that the follow-up vision system can acquire complete image information of the surface to be tested of the wafer includes: when a second wafer pick-up command is received, performing a second control operation on the motion mechanism to control the follow-up vision system to scan the complete depth image information of the surface of the wafer to be tested held by the actuators of the first end effector mechanism and the second end effector mechanism; the second control operation includes: controlling the motion mechanism to perform a wafer pick-up operation so that the actuators of the first end effector mechanism and the second end effector mechanism pick up the wafer to be tested from the wafer cassette and stop it, so as to control the follow-up vision system to scan the upper surface of the wafer to be tested held by the actuators to obtain complete depth image information of the surface.

Images