Display panel and detection method thereof

Abstract

This application relates to a display panel and a testing method thereof. The display panel includes: a substrate; a test pad assembly disposed on the substrate; a ground pad disposed on the substrate and spaced apart from the test pad assembly; and a test trace disposed on the substrate; wherein the test trace is provided between the test pad assembly and the ground pad; and / or, the test pad assembly includes a plurality of test pads arranged at intervals, and the test trace is provided between two adjacent test pads. Thus, after applying conductive adhesive, the resistance, capacitance, or voltage value of the test trace can be detected to determine whether the conductive adhesive has overflowed, thereby enabling rapid testing of the display panel. This not only helps to improve signal short circuits and display anomalies during cell assembly testing but also improves the manufacturing yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and in particular to a display panel and a method for testing the same. Background Technology

[0002] With the development of display technology, LCD display panels have been widely used. However, existing display panels still need improvement. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel and a detection method thereof to address at least one of the above problems.

[0004] In a first aspect, embodiments of this application provide a display panel, the display panel comprising:

[0005] substrate;

[0006] A test pad assembly is disposed on the substrate and includes a plurality of test pads arranged at intervals.

[0007] A grounding pad is disposed on the substrate and spaced apart from the test pad group;

[0008] A detection trace is provided on the substrate; wherein the detection trace is provided between the test pad group and the ground pad; and / or,

[0009] The test pad group includes multiple test pads arranged at intervals, and the detection traces are provided between two adjacent test pads.

[0010] The display panel provided in this application embodiment uses detection traces between the ground pad and the test pad group and / or two adjacent test pads. If conductive adhesive overflows from the ground pad to the test pad group, or if conductive adhesive overflows on two adjacent test pads, the conductive adhesive will simultaneously overflow onto the detection traces, causing changes in the resistance or capacitance parameters of the detection traces. Thus, after applying the conductive adhesive, the overflow of conductive adhesive can be determined by detecting the resistance, capacitance, or voltage values ​​of the detection traces, thereby enabling rapid testing of the display panel. This not only helps improve signal short circuits and display anomalies during cell assembly testing but also improves the manufacturing yield of the display panel.

[0011] In one embodiment, the grounding pad is disposed on one side of the test pad group along a first direction, the detection trace includes a first main line and a second main line that are electrically isolated from each other, the detection trace also includes at least one line group, the line group includes two branch lines that are electrically isolated from each other, the two branch lines being electrically connected to the first main line and the second main line respectively; the line group is provided between the test pad group and the grounding pad; and / or, the line group is provided between two adjacent test pads;

[0012] The first direction is perpendicular to the thickness direction of the substrate;

[0013] Optionally, in the two branches of the line group, at least a portion of one branch is arranged in parallel with at least a portion of the other branch;

[0014] Optionally, in the extension direction of the branch, the test pad is located between the two ends of the portion where the two branches are arranged in parallel.

[0015] In one embodiment, the first main line and the second main line are arranged in parallel, and the test pad set is located between the first main line and the second main line;

[0016] Optionally, the wire group includes a first wire group and a second wire group, the second wire group being disposed between the first main wire and the test pad group; the first wire group being disposed between the test pad group and the grounding pad; and / or, the first wire group being disposed between two adjacent test pads; the first wire group includes two electrically isolated branch lines; the second wire group includes two electrically isolated branch lines.

[0017] Optionally, the wire group further includes a third wire group, which is disposed between the second main wire and the test pad group; the third wire group includes the two branch wires that are electrically isolated from each other.

[0018] In one embodiment, two of the branches in the first line group extend along a second direction; the second direction is perpendicular to the thickness direction of the substrate and intersects the first direction;

[0019] Optionally, two of the branches in the second line group extend along the first direction;

[0020] Optionally, two of the branches in the third line group extend along the first direction;

[0021] Optionally, the first main line and the second main line extend along the first direction;

[0022] Optionally, the first main line and the second main line are arranged on the same layer, and the first main line and the branch line are arranged on different layers;

[0023] Optionally, the test pad includes multiple test layers stacked together, one of the test layers being disposed on the same layer as the branch line; and / or, one of the test layers being disposed on the same layer as the first main line or the second main line;

[0024] Optionally, the branch line has a transparent conductive layer on the surface opposite to the substrate.

[0025] In one embodiment, the grounding pad is disposed on one side of the test pad group along a first direction, and the test trace includes a first trace and a second trace that are electrically isolated from each other.

[0026] The first trace includes:

[0027] The first main line is located on one side of the plurality of test pads along the second direction;

[0028] The first branch line connects to the first main line;

[0029] The second routing includes:

[0030] The second main line is disposed on the side of the plurality of test pads opposite to the first main line along the second direction; the first direction and the second direction are perpendicular to the thickness direction of the substrate, and the second direction intersects the first direction;

[0031] The second branch line connects to the second main line;

[0032] The first branch line is located between the test pad group and the grounding pad, and the second branch line is located between the test pad group and the grounding pad; the orthographic projection of the first branch line located between the test pad group and the grounding pad on the first preset plane has a first overlapping area with the orthographic projection of the second branch line located between the test pad group and the grounding pad on the first preset plane.

[0033] And / or, the first branch line is disposed between two adjacent test pads, and the second branch line is disposed between two adjacent test pads; the orthographic projection of the first branch line located between the test pad group and the grounding pad on the first preset plane has a second overlapping area with the orthographic projection of the second branch line located between the test pad group and the grounding pad on the first preset plane;

[0034] The first direction is perpendicular to the thickness direction of the substrate; the first preset plane is parallel to the thickness direction of the substrate and perpendicular to the first direction.

[0035] Optionally, at least a portion of the orthographic projection of the test pad assembly onto the first preset plane coincides with the first overlapping region; and / or, at least a portion of the orthographic projection of the test pad onto the first preset plane coincides with the second overlapping region;

[0036] Optionally, the dimension of the first overlapping region along the second direction is greater than or equal to the dimension of the test pad assembly along the second direction;

[0037] And / or, the dimension of the second overlapping region along the second direction is greater than or equal to the dimension of the test pad along the second direction;

[0038] The second direction is perpendicular to the thickness direction of the substrate and intersects the first direction.

[0039] In one embodiment, the first trace further includes a plurality of third branches connected to the first main line, and the second trace further includes a plurality of fourth branches connected to the second main line; each third branch and each fourth branch are respectively disposed on one side of each test pad along the second direction.

[0040] The orthographic projection of each third branch on the second preset plane has a third overlapping area with the orthographic projection of each fourth branch on the second preset plane.

[0041] The second preset plane is parallel to the thickness direction of the substrate and perpendicular to the second direction;

[0042] Optionally, the dimension of the third overlapping region along the first direction is greater than or equal to the dimension of each test pad along the first direction;

[0043] Optionally, at least a portion of the orthographic projection of the test pad onto the second preset plane coincides with the third overlapping region.

[0044] In one embodiment, the first trace further includes a plurality of fifth branches connected to the first main line, and the second trace further includes a plurality of sixth branches connected to the second main line; each fifth branch and each sixth branch are respectively disposed on the side of each test pad away from the third branch along the second direction.

[0045] The orthographic projection of each fifth branch line on the second preset plane and the orthographic projection of each sixth branch line on the second preset plane have a fourth overlapping area;

[0046] Optionally, the dimension of the fourth overlapping region along the first direction is greater than or equal to the dimension of each test pad along the first direction;

[0047] Optionally, at least a portion of the orthographic projection of the test pad onto the second preset plane coincides with the fourth overlapping region;

[0048] Optionally, the display panel includes a first conductive layer, an insulating layer, and a second conductive layer stacked on the substrate;

[0049] The first main line and the second main line are located in the first conductive layer, and the first branch line, the second branch line, the third branch line, the fourth branch line, the fifth branch line and the sixth branch line are all located in the second conductive layer;

[0050] Optionally, a transparent conductive layer is further provided on the surface of the first branch, the second branch, the third branch, the fourth branch, the fifth branch, and the sixth branch that is away from the insulating layer.

[0051] In one embodiment, the display panel further includes:

[0052] A detection chip is disposed on the substrate; the connection terminal of the detection trace is electrically connected to the detection chip;

[0053] Alternatively, the display panel may further include a circuit board disposed on the substrate, wherein the connection end of the detection trace is electrically connected to the circuit board; and the circuit board is provided with a test port.

[0054] Secondly, embodiments of this application provide a method for detecting a display panel as described in any embodiment of the first aspect, the method comprising:

[0055] The measured values ​​of the detection traces of the display panel were tested;

[0056] The measured value is compared with a preset threshold to determine whether the display panel is short-circuited.

[0057] In one embodiment, the measured values ​​include at least one of measured voltage, measured capacitance, and measured resistance.

[0058] Optionally, when the measured values ​​include the measured voltage values, if the measured voltage value is greater than 0, it is determined that the display panel is short-circuited;

[0059] When the measured values ​​include the measured capacitance values, if the measured capacitance value is equal to 0, the display panel is determined to be short-circuited.

[0060] When the measured value includes the measured resistance value, if the measured resistance value is less than the preset resistance value, the display panel is determined to be short-circuited.

[0061] The display panel testing method provided in this application embodiment can determine whether conductive adhesive has overflowed by detecting the measured values ​​of the test traces, thereby enabling rapid testing of the display panel. This not only helps to improve signal short circuits and display abnormalities during cell assembly testing, but also helps to improve the manufacturing yield of the display panel. Attached Figure Description

[0062] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 This is a schematic diagram of conductive adhesive overflow in related technologies.

[0064] Figure 2 This is a partial structural diagram of a display panel provided in an embodiment of this application.

[0065] Figure 3 This is a partial structural diagram of another display panel provided in an embodiment of this application.

[0066] Figure 4 This is a partial structural schematic diagram of another display panel provided in an embodiment of this application.

[0067] Figure 5 for Figure 4 The diagram shows a partial structural schematic of the detection trace.

[0068] Figure 6 This is a schematic cross-sectional view of a display panel provided in an embodiment of this application.

[0069] Figure 7 This is a schematic flowchart of a method for detecting a display panel according to an embodiment of this application.

[0070] Explanation of reference numerals in the attached figures:

[0071] 1. Display panel; 11. Substrate; 12. Test pad assembly; 121. Test pad; 13. Grounding pad; 14. Detection trace; 141. First trace; 1411. First main line; 1412. First branch line; 1413. Third branch line; 1414. Fifth branch line; 142. Second trace; 1421. Second main line; 1422. Second branch line; 1423. Fourth branch line; 1424. Sixth branch line; 143. Line group; 15. Detection chip; 16. Circuit board; 17. First conductive layer; 18. Insulating layer; 19. Second conductive layer; 20. Transparent conductive layer; 21. Conductive adhesive. Detailed Implementation

[0072] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0073] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0074] In this document, spatial terms such as “upper” and “lower” are defined with reference to the accompanying drawings. Therefore, it will be understood that “upper” and “lower” are used interchangeably. It will be understood that when a layer is referred to as being “on” another layer, it can be formed directly on that other layer, or there may be intermediate layers. Therefore, it will be understood that when a layer is referred to as being “directly” on another layer, no intermediate layer is inserted in between.

[0075] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between two layers," the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0076] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are used only to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions unless the singular form has a distinct meaning in the context. Furthermore, in the embodiments below, it will also be understood that the terms “comprising” and / or “having” as used herein indicate the presence of the stated feature or component, but do not exclude the presence or addition of one or more other features or components.

[0077] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0078] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one of..." follows a list of elements, it modifies the entire list of elements, not individual elements within that list.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0080] It should also be understood that the terms “including / comprise” or “have” specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0081] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0082] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0083] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0084] In IPS (In-Plane Switching) LCD display panels, conductive adhesive is often used to connect the CF (Color Filter) side surface and the grounding pad on the TFT (Thin Film Transistor) to discharge static electricity on the CF side and reduce reliability issues caused by static electricity on the CF side.

[0085] Reference Figure 1As shown, during the application of conductive adhesive 21, due to abnormal equipment or personnel operation, the conductive adhesive 21 overflows into the area where the test pad 121 is located and remains on the test pad 121. This causes electrical connection between the test pad 121 and the grounding pad 13, as well as between different test pads 121, resulting in a short circuit in the test pad 121. This leads to signal short circuits and abnormal screen display during cell assembly testing. However, there is currently no corresponding method to detect defects caused by the overflow of conductive adhesive 21.

[0086] Furthermore, there are many types of defects caused by the residue of conductive adhesive 21, and some abnormalities cannot even be detected when the module is lit. There is no corresponding method to specifically investigate these issues, making it impossible for the factory to intercept and inspect them. In addition, the abnormal products often require a lot of time to remove the module and other steps according to traditional analysis methods, which reduces the analysis efficiency and affects customer satisfaction.

[0087] In view of at least one of the above-mentioned problems, embodiments of this application provide a display panel and a testing method thereof, by setting a test trace between a ground pad and a test pad group and / or two adjacent test pads. If conductive adhesive overflows from the ground pad to the test pad group, or overflows between two adjacent test pads, the conductive adhesive will simultaneously overflow onto the test trace, causing a change in the resistance or capacitance parameters of the test trace. Thus, after applying the conductive adhesive, the overflow of conductive adhesive can be determined by detecting the resistance, capacitance, or voltage values ​​of the test trace, thereby enabling rapid testing of the display panel. This not only helps to improve signal short circuits and display anomalies during cell assembly testing, but also helps to improve the manufacturing yield of the display panel.

[0088] Firstly, referring to Figure 2 , Figure 3 and Figure 4 As shown, this application embodiment provides a display panel 1, which includes a substrate 11, a test pad group 12, a ground pad 13, and a test trace 14.

[0089] The test pad assembly 12 is disposed on the substrate 11. The grounding pad 13 is disposed on the substrate 11 and spaced apart from the test pad assembly 12. The detection trace 14 is disposed on the substrate 11. Furthermore, the detection trace 14 is provided between the test pad assembly 12 and the grounding pad 13.

[0090] And / or, the test pad group 12 includes a plurality of test pads 121 arranged at intervals, and a test line 14 is provided between two adjacent test pads 121.

[0091] It should be noted that since the CF (Color Filter) side surface is connected to the grounding pad 13 when the conductive adhesive 21 is applied, any overflow of the conductive adhesive 21 will flow from the grounding pad 13 towards the area where the test pad group 12 is located, and may even overflow between two adjacent test pads 121. It is understandable that, since the detection trace 14 is located between the test pad group 12 and the grounding pad 13, if the conductive adhesive 21 overflows onto the test pad group 12, it will inevitably overflow onto the detection trace 14. And / or, if the conductive adhesive 21 overflows onto two adjacent test pads 121, it will inevitably overflow onto the detection trace 14 between the two test pads 121. Therefore, by obtaining the measured parameters of the detection trace 14, it can be determined whether the conductive adhesive 21 has overflowed. In one example, the measured parameters could be the measured voltage value, the measured capacitance value, or the measured resistance value.

[0092] In the display panel 1 provided in this application embodiment, if the conductive adhesive 21 overflows from the grounding pad 13 onto the test pad group 12, and / or if the conductive adhesive 21 overflows on two adjacent test pads 121, the conductive adhesive 21 will simultaneously overflow onto the detection trace 14, causing a change in the resistance or capacitance parameters of the detection trace 14. Thus, after applying the conductive adhesive 21, the overflow of the conductive adhesive 21 can be determined by detecting the resistance, capacitance, or voltage values ​​of the detection trace 14, thereby enabling rapid testing of the display panel 1. This not only helps to improve signal short circuits and display anomalies during cell assembly testing but also improves the manufacturing yield of the display panel 1.

[0093] It is understandable that when obtaining the measured parameters of the test trace 14, external testing tools (such as a multimeter) can be used to measure the parameters of the test trace 14.

[0094] In one embodiment, a grounding pad 13 is disposed on one side of the test pad group 12 along a first direction X, which is perpendicular to the thickness direction of the substrate 11. The detection trace 14 includes a first main line 1411 and a second main line 1421 that are electrically isolated from each other. The detection trace 14 also includes at least one line group 143, which includes two branch lines that are electrically isolated from each other and are electrically connected to the first main line 1411 and the second main line 1421.

[0095] Specifically, a wire group 143 is provided between the test pad group 12 and the grounding pad 13. And / or, a wire group 143 is provided between two adjacent test pads 121.

[0096] Thus, when the conductive adhesive 21 overflows between the test pad group 12 and the grounding pad 13, it electrically connects the two branches of the wire group 143, causing a change in the resistance or capacitance parameters of the wire group 143. Therefore, it can be determined whether the conductive adhesive 21 has overflowed between the test pad group 12 and the grounding pad 13 by detecting the resistance, capacitance, or voltage value of the wire group 143. When the conductive adhesive 21 overflows between two adjacent test pads 121, it electrically connects the two branches of the wire group 143, causing a change in the resistance or capacitance parameters of the wire group 143. Therefore, it can be determined whether the conductive adhesive 21 has overflowed between two adjacent test pads 121 by detecting the resistance, capacitance, or voltage value of the wire group 143.

[0097] In one embodiment, for two branches in line group 143, at least a portion of one branch is arranged parallel to at least a portion of the other branch. Exemplarily, in the width direction of the two branches, at least a portion of one branch overlaps with at least a portion of the other branch.

[0098] In one example, for the wire group 143 located between the test pad group 12 and the ground pad 13, the two branches of the wire group 143 are arranged side by side and spaced apart from each other, so that when the conductive adhesive 21 overflows from the ground pad 13 onto the test pad group 12, it must pass through the two branches.

[0099] In another example, for a wire group 143 located between two adjacent test pads 121, the two branches of the wire group 143 are arranged side by side and spaced apart from each other between the two adjacent test pads 121, such that when the conductive adhesive 21 overflows from one test pad 121 to the other test pad 121, it must pass through the two branches.

[0100] In one embodiment, the test pad 121 is located between the two ends of the portion of the two branches that are arranged in parallel, in the direction of extension of the branches. For example, the test pad 121 is located between the two ends of the overlapping portion of the two branches.

[0101] In this way, the two branch lines can completely cover the overflow path of the conductive adhesive 21 to the test pad 121. When the conductive adhesive 21 overflows onto the test pad 121, it will inevitably overflow onto the branch lines, thereby improving the detection accuracy of the detection trace 14.

[0102] In one embodiment, the first main line 1411 and the second main line 1421 are arranged in parallel, and the test pad assembly 12 is located between the first main line 1411 and the second main line 1421. In one example, both the first main line 1411 and the second main line 1421 extend along a first direction X.

[0103] In one embodiment, wire group 143 includes a first wire group and a second wire group, the second wire group being disposed between the first main wire 1411 and the test pad group 12. The first wire group is disposed between the test pad group 12 and the grounding pad 13, and / or, the first wire group is disposed between two adjacent test pads 121.

[0104] In one example, refer to Figure 2 As shown, the first line group includes a first branch line 1412 and a second branch line 1422.

[0105] Thus, when the conductive adhesive 21 overflows between the test pad group 12 and the grounding pad 13, it electrically connects the first branch 1412 and the second branch 1422, causing a change in the resistance or capacitance parameters of the first wire group. Therefore, it can be determined whether the conductive adhesive 21 has overflowed between the test pad group 12 and the grounding pad 13 by detecting the resistance, capacitance, or voltage values ​​of the first wire group. When the conductive adhesive 21 overflows between two adjacent test pads 121, it electrically connects the first branch 1412 and the second branch 1422, causing a change in the resistance or capacitance parameters of the first wire group. Therefore, it can be determined whether the conductive adhesive 21 has overflowed between two adjacent test pads 121 by detecting the resistance, capacitance, or voltage values ​​of the first wire group.

[0106] In one example, refer to Figure 4 As shown, the second line group includes a third branch line 1413 and a fourth branch line 1423. The third branch line 1413 and the fourth branch line 1423 are arranged in parallel between the first main line 1411 and the second main line 1421.

[0107] Thus, when the conductive adhesive 21 overflows from one side of the first main line 1411 toward the test pad group 12, the conductive adhesive 21 will electrically connect the third branch line 1413 and the fourth branch line 1423, thereby causing a change in the resistance or capacitance parameters of the second line group. Therefore, it can be determined whether the conductive adhesive 21 overflows from one side of the first main line 1411 toward the test pad group 12 by detecting the resistance, capacitance or voltage value of the second line group.

[0108] It is understandable that there can be multiple second wire groups, with each second wire group being set on the side of the test pad 121 close to the first main wire 1411.

[0109] In one embodiment, wire group 143 further includes a third wire group disposed between the second main wire 1421 and the test pad group 12.

[0110] In one example, refer to Figure 4As shown, the third line group includes a fifth branch line 1414 and a sixth branch line 1424, which are arranged in parallel between the second main line 1421 and the test pad group 12.

[0111] Thus, when the conductive adhesive 21 overflows from one side of the second main line 1421 toward the test pad group 12, the conductive adhesive 21 will electrically connect the fifth branch line 1414 and the sixth branch line 1424, thereby causing a change in the resistance or capacitance parameters of the third line group. Therefore, it can be determined whether the conductive adhesive 21 overflows from one side of the second main line 1421 toward the test pad group 12 by detecting the resistance, capacitance or voltage value of the third line group.

[0112] It is understandable that there can be multiple third wire groups, with each third wire group being set on the side of the test pad 121 closest to the second main wire 1421.

[0113] In one embodiment, the first wire group includes two electrically isolated branches extending along a second direction Y. The second direction Y is perpendicular to the thickness direction of the substrate 11 and intersects the first direction X.

[0114] In one specific embodiment, refer to Figure 2 As shown, the first line group includes a first branch line 1412 and a second branch line 1422. The first branch line 1412 and the second branch line 1422 extend along the second direction Y, and the first branch line 1412 and the second branch line 1422 are spaced apart along the first direction X.

[0115] In a preferred embodiment, the first direction X is perpendicular to the second direction Y.

[0116] In one embodiment, the second wire group includes two electrically isolated branches that extend along a first direction X.

[0117] In one embodiment, the third wire group includes two electrically isolated branches that extend along a first direction X.

[0118] In one specific embodiment, the second wire group includes a third branch 1413 and a fourth branch 1423, which extend along a first direction X and are spaced apart along a second direction Y. The third wire group includes a fifth branch 1414 and a sixth branch 1424, which extend along the first direction X and are spaced apart along the second direction Y.

[0119] In one embodiment, the first main line 1411 and the second main line 1421 are arranged on the same layer, while the first main line 1411 and the branch line are arranged on different layers. This facilitates the arrangement of the detection traces 14 on the display panel 1 and prevents the detection traces 14 from interfering with other conductive structures.

[0120] In one embodiment, the test pad 121 includes a plurality of test layers stacked together, one of which is co-layered with a branch line. And / or, one of the test layers is co-layered with either the first main line 1411 or the second main line 1421.

[0121] In this way, the original film layer on the display panel 1 is utilized, reducing the manufacturing difficulty of the detection trace 14.

[0122] In one embodiment, a transparent conductive layer 20 is provided on the surface of the branch line facing away from the substrate 11. Exemplarily, the transparent conductive layer 20 may be indium tin oxide, zinc indium oxide, zinc gallium oxide, or zinc aluminum oxide. This provides corrosion protection for the branch line.

[0123] In one embodiment, reference Figure 2 As shown, the display panel 1 also includes a detection chip 15, which is disposed on the substrate 11, and the connection end of the detection trace 14 is electrically connected to the detection chip 15.

[0124] In this way, the resistance, capacitance or voltage value of the detection trace 14 can be detected by the detection chip 15.

[0125] Specifically, the detection chip 15 can be integrated on the driver chip of the display panel 1. The detection chip 15 can acquire the measured voltage value, measured capacitance value, or measured resistance value of the detection trace 14.

[0126] In one example, the detection chip 15 acquires the measured voltage value of the detection trace 14 and compares the measured voltage value with the preset voltage value. If the measured voltage value is different from the preset voltage value, for example, if the measured voltage value is greater than the preset voltage value, the detection chip 15 determines that the conductive adhesive 21 has overflowed. The detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0127] In another example, the detection chip 15 obtains the measured capacitance value of the detection trace 14 and compares the measured capacitance value with the preset voltage value. If the measured capacitance value is different from the preset capacitance value, for example, the measured capacitance value is less than the preset capacitance value, the detection chip 15 determines that the conductive adhesive 21 has overflowed. The detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0128] In another example, the detection chip 15 obtains the measured resistance value of the detection trace 14 and compares the measured resistance value with the preset resistance value. If the measured resistance value is less than the preset resistance value, the detection chip 15 determines that the conductive adhesive 21 has overflowed. The detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0129] In one embodiment, reference Figure 3 As shown, the display panel 1 also includes a circuit board 16, which is disposed on the substrate 11. The connection terminal of the detection trace 14 is electrically connected to the circuit board 16. The circuit board 16 is provided with a test port.

[0130] In this way, the actual resistance value of the test trace 14 can be quickly measured with the help of a multimeter. By comparing the actual resistance value with the preset resistance value, if the actual resistance value is less than the preset resistance value, it can be determined that the conductive adhesive 21 has overflowed.

[0131] It is understandable that there are two test ports, and the two connection ends of the test trace 14 are connected to these two test ports respectively.

[0132] In one embodiment, a grounding pad 13 is disposed on one side of the test pad group 12 along a first direction X, and the detection trace 14 includes a first trace 141 and a second trace 142 that are electrically isolated from each other. The first trace 141 includes a first main line 1411 and a first branch line 1412, with the first main line 1411 disposed on one side of the plurality of test pads 121 along a second direction Y. The first branch line 1412 is connected to the first main line 1411. The second trace 142 includes a second trace 142 and a second branch line 1422, with the second main line 1421 disposed on the side of the plurality of test pads 121 along the second direction Y away from the first main line 1411, and the second branch line 1422 is connected to the second main line 1421. In one example, the first main line 1411 and the second main line 1421 extend along the first direction X, and the first branch line 1412 and the second branch line 1422 extend along the second direction Y.

[0133] Specifically, a first branch line 1412 is disposed between the test pad group 12 and the ground pad 13, and a second branch line 1422 is disposed between the test pad group 12 and the ground pad 13. The orthographic projection of the first branch line 1412 located between the test pad group 12 and the ground pad 13 onto a first preset plane has a first overlap area with the orthographic projection of the second branch line 1422 located between the test pad group 12 and the ground pad 13 onto the first preset plane. The first direction X is perpendicular to the thickness direction of the substrate 11. The first preset plane is parallel to the thickness direction of the substrate 11 and perpendicular to the first direction X.

[0134] In one example, at least a portion of the orthographic projection of the test pad assembly 12 onto the first preset plane coincides with the first overlapping region.

[0135] Specifically, please refer to Figure 5 As shown, along the first direction X, the first branch 1412 and the second branch 1422 have a first overlapping portion A1. The orthographic projection of the first overlapping portion A1 onto the first preset plane is the first overlapping area. In this way, "interception inspection" can be performed by detecting the trace 14 to detect whether the conductive adhesive 21 has overflowed from the grounding pad 13 onto the test pad group 12.

[0136] In a preferred embodiment, the orthographic projection of the test pad assembly 12 on the first preset plane coincides with the first overlapping region. This can also be understood as follows: along the first direction X, the orthographic projection of the test pad assembly 12 on the second branch line 1422 is completely located within the first overlapping portion A1. This ensures that the area "blocked" by the detection trace 14 is large enough to cover the path of the conductive adhesive 21 overflowing from the grounding pad 13 towards the test pad assembly 12.

[0137] In one embodiment, the dimension of the first overlapping region along the second direction Y is greater than or equal to the dimension of the test pad group 12 along the second direction Y. In one example, the dimension of the first overlapping portion A1 along the second direction Y is greater than or equal to the dimension of the test pad group 12 along the second direction Y. The second direction Y is perpendicular to the thickness direction of the substrate 11 and intersects the first direction X. Exemplarily, the second direction Y is perpendicular to the first direction X. For the two branches in the line group 143 described above, at least a portion of one branch is arranged parallel to at least a portion of the other branch, and the dimension of the portion of the two branches arranged parallel is equal to the dimension of the first overlapping portion A1 along the second direction Y.

[0138] This ensures that the area of ​​the test trace 14 that is "blocked" is large enough to cover the path of the conductive adhesive 21 overflowing from one test pad 121 to another test pad 121.

[0139] In one embodiment, a first branch line 1412 is disposed between two adjacent test pads 121, and a second branch line 1422 is disposed between two adjacent test pads 121. The orthographic projection of the first branch line 1412 located between the test pad group 12 and the ground pad 13 on a first preset plane has a second overlapping area with the orthographic projection of the second branch line 1422 located between the test pad group 12 and the ground pad 13 on the first preset plane.

[0140] In one example, at least a portion of the orthographic projection of the test pad 121 onto the first preset plane coincides with the second overlapping region.

[0141] Specifically, please refer to Figure 5As shown, along the first direction X, the first branch 1412 and the second branch 1422 have a first overlapping portion A1. The orthographic projection of this first overlapping portion A1 onto the first preset plane is the second overlapping area. In this way, "interception" can be performed by detecting the trace 14 to detect whether the conductive adhesive 21 has overflowed from one test pad 121 to another test pad 121.

[0142] It is understandable that the first and second overlapping regions can completely overlap.

[0143] In a preferred embodiment, the orthographic projection of test pad 121 on the first preset plane coincides with the first overlapping area. This can also be understood as follows: along the first direction X, the orthographic projection of test pad 121 on the second branch 1422 lies entirely within the first overlapping portion A1. This ensures that the area "blocked" by the detection trace 14 is large enough to cover the path of the conductive adhesive 21 overflowing from one test pad 121 to another.

[0144] In one embodiment, the dimension of the second overlapping region along the second direction Y is greater than or equal to the dimension of the test pad 121 along the second direction Y. In one example, the dimension of the first overlapping portion A1 along the second direction Y is greater than or equal to the dimension of the test pad 121 along the second direction Y. This ensures that the area “blocked” by the detection trace 14 is large enough to cover the path of the conductive adhesive 21 overflowing from one test pad 121 to another.

[0145] Understandably, when conductive adhesive 21 overflows from grounding pad 13 onto test pad group 12, or when conductive adhesive 21 overflows from one test pad 121 onto another, the conductive adhesive 21 will pass through the overlapping area of ​​the first trace 141 and the second trace 142, thereby connecting the first trace 141 and the second trace 142, making the detection trace 14 form a loop. In this way, by obtaining the measured voltage value, measured capacitance value, or measured resistance value of the detection trace 14, it can be determined whether conductive adhesive 21 has overflowed into the area where the test pad group 12 is located.

[0146] In one example, the detection chip detects the voltage value on the detection trace 14. Specifically, the detection chip outputs a fixed voltage to the first trace 141 and detects the voltage on the second trace 142. When conductive adhesive 21 overflows from the ground pad 13 onto the test pad group 12, or when conductive adhesive 21 overflows from one test pad 121 onto another, the detection chip will detect a voltage value greater than 0 on the second trace 142. That is, when the detection chip detects a measured voltage value greater than 0 on the second trace 142, it indicates that the test pad group 12 is short-circuited.

[0147] In another example, the detection chip detects the capacitance value of detection trace 14. Specifically, the detection chip applies voltage to the first trace 141 and the second trace 142 respectively, and detects the capacitance between the first trace 141 and the second trace 142. When the first trace 141 and the second trace 142 are not conducting, there is a preset capacitance between them. When the first trace 141 and the second trace 142 are conducting, the detection chip detects that the capacitance between the first trace 141 and the second trace 142 is 0, indicating that the test pad group 12 is short-circuited.

[0148] In another example, the detection chip detects the resistance value of detection trace 14. Specifically, when the first trace 141 and the second trace 142 are not conducting, the resistance value across detection trace 14 is relatively high. When the first trace 141 and the second trace 142 are conducting, the resistance value across detection trace 14 decreases, indicating that the test pad assembly 12 is short-circuited.

[0149] In this way, the test trace 14 can be "intercepted" on both sides of the test pad assembly 12 along the second direction Y, thereby covering more paths where the conductive adhesive 21 may overflow.

[0150] In one embodiment, reference Figure 2 , Figure 3 and Figure 4 As shown, there are multiple first branch lines 1412 and second branch lines 1422. A first branch line 1412 and a second branch line 1422 are provided between the test pad group 12 and the grounding pad 13. At least one first branch line 1412 and at least one second branch line 1422 are provided between two adjacent test pads 121.

[0151] In one example, please refer to Figure 2 and Figure 3 As shown, a first branch line 1412 and a second branch line 1422 are provided between each of two adjacent test pads 121.

[0152] In another example, please refer to Figure 4 As shown, two first branch lines 1412 and two second branch lines 1422 are provided between two adjacent test pads 121. Each first branch line 1412 and each second branch line 1422 are respectively provided on one side of a test pad 121 along the first direction X.

[0153] This allows for a larger "blocking" range of the detection line 14, thereby improving the detection accuracy of the detection line 14.

[0154] Reference Figure 4 and Figure 5As shown, in one embodiment, the first trace 141 further includes multiple third branches 1413 connected to the first main trace 1411, and the second trace 142 further includes multiple fourth branches 1423 connected to the second main trace 1421. Each third branch 1413 and each fourth branch 1423 are respectively disposed on one side of each test pad 121 along the second direction Y.

[0155] The orthographic projection of each third branch 1413 onto the second preset plane and the orthographic projection of each fourth branch 1423 onto the second preset plane have a third overlapping region. The second preset plane is parallel to the thickness direction of the substrate 11 and perpendicular to the second direction Y.

[0156] In one example, at least a portion of the orthographic projection of the test pad 121 onto the second preset plane coincides with the third overlapping region.

[0157] This allows for a larger "blocking" range of the detection line 14, thereby improving the detection accuracy of the detection line 14.

[0158] In one example, the third branch 1413 is connected to the corresponding first branch 1412. The fourth branch 1423 is connected to the corresponding second branch 1422.

[0159] In one embodiment, the size of the third overlapping region along the first direction X is greater than or equal to the size of each test pad 121 along the first direction X.

[0160] This can increase the "blocking" range of the detection line 14, further improving the detection accuracy of the detection line 14.

[0161] Specifically, please refer to Figure 5 As shown, along the second direction Y, the orthographic projection of the third branch 1413 onto the fourth branch 1423 has a second overlapping portion A2 with the fourth branch 1423. The orthographic projection of the second overlapping portion A2 onto the second preset plane is the third overlapping region. The size of the second overlapping portion A2 along the first direction X is greater than or equal to the size L1 of the test pad assembly 12 along the first direction X. This can also be understood as: along the second direction Y, the orthographic projection of the test pad 121 onto the fourth branch 1423 is completely located within the second overlapping portion A2. This ensures that the area "intercepted" by the detection trace 14 is large enough, further improving the detection accuracy of the detection trace 14.

[0162] In one embodiment, the first trace 141 further includes multiple fifth branches 1414 connected to the first main line 1411, and the second trace 142 further includes multiple sixth branches 1424 connected to the second main line 1421. Each fifth branch 1414 and each sixth branch 1424 are respectively disposed on the side of each test pad 121 opposite to the third branch 1413 along the second direction Y.

[0163] The orthographic projection of each fifth branch 1414 on the second preset plane and the orthographic projection of each sixth branch 1424 on the second preset plane have a fourth overlapping region.

[0164] In one example, at least a portion of the orthographic projection of the test pad 121 onto the second preset plane coincides with the fourth overlapping region.

[0165] This allows for a larger "blocking" range of the detection line 14, thereby improving the detection accuracy of the detection line 14.

[0166] In one example, the fifth branch 1414 is connected to the corresponding first branch 1412. The sixth branch 1424 is connected to the corresponding second branch 1422.

[0167] In one embodiment, the size of the fourth overlapping region along the first direction X is greater than or equal to the size of each test pad 121 along the first direction X.

[0168] This allows for a larger "blocking" range of the detection line 14, thereby improving the detection accuracy of the detection line 14.

[0169] Specifically, please refer to Figure 5 As shown, along the second direction Y, the orthographic projection of the fifth branch 1414 onto the sixth branch 1424 has a third overlapping portion A3 with the sixth branch 1424. The orthographic projection of the third overlapping portion A3 onto the second preset plane is the fourth overlapping region. The dimension of the third overlapping portion A3 along the first direction X is greater than or equal to the dimension L1 of the test pad assembly 12 along the first direction X. This can also be understood as: along the second direction Y, the orthographic projection of the test pad 121 onto the sixth branch 1424 is completely located within the third overlapping portion A3. This ensures that the area "intercepted" by the detection trace 14 is large enough, further improving the detection accuracy of the detection trace 14. It is understood that the third overlapping region and the fourth overlapping region can completely coincide.

[0170] In one embodiment, reference Figure 6 As shown, the display panel 1 includes a first conductive layer 17, an insulating layer 18, and a second conductive layer 19 stacked on a substrate 11.

[0171] The first main line 1411 and the second main line 1421 are disposed on the first conductive layer 17, and the first branch line 1412, the second branch line 1422, the third branch line 1413, the fourth branch line 1423, the fifth branch line 1414 and the sixth branch line 1424 are all disposed on the second conductive layer 19. That is, the first main line 1411 and the second main line 1421 are located on the first conductive layer 17, and the first branch line 1412, the second branch line 1422, the third branch line 1413, the fourth branch line 1423, the fifth branch line 1414 and the sixth branch line 1424 are located on the second conductive layer 19.

[0172] Here, the first conductive layer 17 corresponds to M1, and the second conductive layer 19 corresponds to M2. At least a portion of the driving circuit of the display panel 1 is typically disposed on M1 and M2. In this embodiment, by disposing the main line and branch lines of the detection trace 14 on the first conductive layer 17 and the second conductive layer 19 respectively, the existing metal layers on the display panel 1 are utilized, reducing the manufacturing difficulty of the detection trace 14. For example, the first branch line 1412, the third branch line 1413, and the fifth branch line 1414 can be electrically connected to the first main line 1411 via vias.

[0173] In one embodiment, a transparent conductive layer 20 is further disposed on the surfaces of the first branch line 1412, the second branch line 1422, the third branch line 1413, the fourth branch line 1423, the fifth branch line 1414, and the sixth branch line 1424. This provides corrosion protection for the second conductive layer 19. For example, the transparent conductive layer 20 may be indium tin oxide, zinc indium oxide, zinc gallium oxide, or zinc aluminum oxide.

[0174] Secondly, referring to Figure 7 As shown, this application provides a method for detecting a display panel as described in any embodiment of the first aspect. The method for detecting a display panel includes:

[0175] S100: Measured value of the detection trace 14 of the detection display panel 1.

[0176] S200: Compare the measured value with the preset threshold to determine whether the display panel 1 is short-circuited.

[0177] In one embodiment, the measured values ​​include measured voltage values, measured capacitance values, or measured resistance values.

[0178] The display panel testing method provided in this application embodiment can determine whether the conductive adhesive 21 has overflowed by detecting the measured value of the detection trace 14, thereby enabling rapid testing of the display panel 1. This method not only helps to improve signal short circuits and display abnormalities during cell assembly testing, but also helps to improve the manufacturing yield of the display panel 1.

[0179] In one embodiment, the actual resistance value of the detection trace 14 can be quickly measured using a multimeter. By comparing the actual resistance value with the preset resistance value, if the actual resistance value is less than the preset resistance value, it can be determined that the conductive adhesive 21 has overflowed.

[0180] In one embodiment, whether the display panel 1 is short-circuited can be determined by the detection chip 15 on the display panel 1. Specifically, the detection chip can be integrated on the driver chip of the display panel 1.

[0181] In one example, the detection chip 15 detects the voltage value of the detection trace 14. Specifically, the detection chip 15 outputs a fixed voltage to the first trace 141 and detects the voltage on the second trace 142. When the conductive adhesive 21 overflows onto the test pad group 12, and / or when the conductive adhesive 21 overflows onto two adjacent test pads 121, the detection chip 15 will detect a voltage value greater than 0 on the second trace 142. That is, when the detection chip 15 detects a measured voltage value greater than 0 on the second trace 142, it indicates that the test pad group 12 is short-circuited, the detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0182] In another example, the detection chip 15 detects the capacitance value of the detection trace 14. Specifically, the detection chip 15 applies voltage to the first trace 141 and the second trace 142 respectively, and detects the capacitance between the first trace 141 and the second trace 142. When the first trace 141 and the second trace 142 are not conducting, there is a preset capacitance between them. When the first trace 141 and the second trace 142 are conducting, the detection chip 15 detects that the capacitance between the first trace 141 and the second trace 142 is 0, indicating that the test pad group 12 is short-circuited. The detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0183] In another example, the detection chip 15 detects the resistance value of the detection trace 14. Specifically, when the first trace 141 and the second trace 142 are not conductive, the detection chip 15 detects that the resistance value across the detection trace 14 is a preset resistance value. When the first trace 141 and the second trace 142 are conductive, the detection chip 15 detects that the measured resistance value across the detection trace 14 is less than the preset resistance value, indicating that the test pad assembly 12 is short-circuited. The detection chip 15 sends a signal to the driver chip, and the driver chip reports an error.

[0184] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0185] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; Test pads are disposed on the substrate; A grounding pad is disposed on the substrate and spaced apart from the test pad group; A detection trace is disposed on the substrate; wherein the detection trace is provided between the test pad group and the ground pad; and / or, the test pad group includes a plurality of test pads arranged at intervals, and the detection trace is provided between two adjacent test pads; The grounding pad is disposed on one side of the test pad group along the first direction. The test trace includes a first main line and a second main line that are electrically isolated from each other. The test trace also includes at least one line group, which includes two branch lines that are electrically isolated from each other. The two branch lines are respectively electrically connected to the first main line and the second main line. The line group is provided between the test pad group and the grounding pad. And / or, the line group is provided between two adjacent test pads. The first direction is perpendicular to the thickness direction of the substrate.

2. The display panel according to claim 1, characterized in that, In the two branches of the line group, at least a portion of one branch is arranged in parallel with at least a portion of the other branch.

3. The display panel according to claim 2, characterized in that, In the direction of extension of the branch, the test pad is located between the two ends of the portion where the two branches are arranged in parallel.

4. The display panel according to claim 1, characterized in that, The first main line and the second main line are arranged in parallel, and the test pad group is located between the first main line and the second main line.

5. The display panel according to claim 4, characterized in that, The wire group includes a first wire group and a second wire group, the second wire group being disposed between the first main wire and the test pad group; the first wire group is disposed between the test pad group and the grounding pad; and / or, the first wire group is disposed between two adjacent test pads; the first wire group includes two electrically isolated branch lines; the second wire group includes two electrically isolated branch lines.

6. The display panel according to claim 5, characterized in that, The wire group also includes a third wire group, which is located between the second main wire and the test pad group; the third wire group includes the two branch wires that are electrically isolated from each other.

7. The display panel according to claim 6, characterized in that, Two of the branches in the first line group extend along a second direction; the second direction is perpendicular to the thickness direction of the substrate and intersects the first direction.

8. The display panel according to claim 7, characterized in that, The two branches in the second line group extend along the first direction.

9. The display panel according to claim 7, characterized in that, The two branches in the third line group extend along the first direction.

10. The display panel according to claim 7, characterized in that, The first main line and the second main line extend along the first direction.

11. The display panel according to claim 7, characterized in that, The first main line and the second main line are set on the same layer, and the first main line and the branch line are set on different layers.

12. The display panel according to claim 7, characterized in that, The test pad includes multiple test layers stacked together, one of which is disposed on the same layer as the branch line; and / or, one of which is disposed on the same layer as the first main line or the second main line.

13. The display panel according to claim 7, characterized in that, The branch line has a transparent conductive layer on its surface away from the substrate.

14. The display panel according to claim 1, characterized in that, The grounding pad is disposed on one side of the test pad group along the first direction, and the test trace includes a first trace and a second trace that are electrically isolated from each other. The first trace includes: A first main line is disposed on one side of a plurality of test pads along a second direction; the first direction and the second direction are perpendicular to the thickness direction of the substrate, and the second direction intersects the first direction; The first branch line connects to the first main line; The second routing includes: The second main line is located on the side of the plurality of test pads opposite to the first main line along the second direction; The second branch line connects to the second main line; The first branch line is located between the test pad group and the grounding pad, and the second branch line is located between the test pad group and the grounding pad; the orthographic projection of the first branch line located between the test pad group and the grounding pad on the first preset plane has a first overlapping area with the orthographic projection of the second branch line located between the test pad group and the grounding pad on the first preset plane. And / or, the first branch line is disposed between two adjacent test pads, and the second branch line is disposed between two adjacent test pads; the orthographic projection of the first branch line located between the test pad group and the grounding pad on the first preset plane has a second overlapping area with the orthographic projection of the second branch line located between the test pad group and the grounding pad on the first preset plane; The first preset plane is parallel to the thickness direction of the substrate and perpendicular to the first direction.

15. The display panel according to claim 14, characterized in that, At least a portion of the orthographic projection of the test pad assembly onto the first preset plane coincides with the first overlapping region; and / or, at least a portion of the orthographic projection of the test pad onto the first preset plane coincides with the second overlapping region.

16. The display panel according to claim 15, characterized in that, The dimension of the first overlapping region along the second direction is greater than or equal to the dimension of the test pad assembly along the second direction; And / or, the dimension of the second overlapping region along the second direction is greater than or equal to the dimension of the test pad along the second direction.

17. The display panel according to claim 14, characterized in that, The first wiring also includes multiple third branch lines connected to the first main line, and the second wiring also includes multiple fourth branch lines connected to the second main line; each third branch line and each fourth branch line are respectively disposed on one side of each test pad along the second direction. The orthographic projection of each third branch on the second preset plane has a third overlapping area with the orthographic projection of each fourth branch on the second preset plane. The second preset plane is parallel to the thickness direction of the substrate and perpendicular to the second direction.

18. The display panel according to claim 17, characterized in that, The dimension of the third overlapping region along the first direction is greater than or equal to the dimension of each test pad along the first direction.

19. The display panel according to claim 17, characterized in that, At least a portion of the orthographic projection of the test pad onto the second preset plane coincides with the third overlapping region.

20. The display panel according to claim 17, characterized in that, The first wiring also includes multiple fifth branch lines connected to the first main line, and the second wiring also includes multiple sixth branch lines connected to the second main line; each fifth branch line and each sixth branch line are respectively arranged on the side of each test pad away from the third branch line along the second direction. The orthographic projection of each fifth branch line on the second preset plane has a fourth overlapping area with the orthographic projection of each sixth branch line on the second preset plane.

21. The display panel according to claim 20, characterized in that, The dimension of the fourth overlapping region along the first direction is greater than or equal to the dimension of each test pad along the first direction.

22. The display panel according to claim 20, characterized in that, At least a portion of the orthographic projection of the test pad onto the second preset plane coincides with the fourth overlapping region.

23. The display panel according to claim 20, characterized in that, The display panel includes a first conductive layer, an insulating layer, and a second conductive layer stacked on the substrate. The first main line and the second main line are located in the first conductive layer, and the first branch line, the second branch line, the third branch line, the fourth branch line, the fifth branch line and the sixth branch line are all located in the second conductive layer.

24. The display panel according to claim 23, characterized in that, A transparent conductive layer is further provided on the surface of the first branch, the second branch, the third branch, the fourth branch, the fifth branch, and the sixth branch that is away from the insulating layer.

25. The display panel according to claim 1, characterized in that, The display panel also includes: A detection chip is disposed on the substrate; the connection terminal of the detection trace is electrically connected to the detection chip; Alternatively, the display panel may further include a circuit board disposed on the substrate, wherein the connection end of the detection trace is electrically connected to the circuit board; and the circuit board is provided with a test port.

26. A method for detecting a display panel as described in any one of claims 1-25, characterized in that, include: The measured values ​​of the detection traces of the display panel were tested; The measured value is compared with a preset threshold to determine whether the display panel is short-circuited.

27. The method for detecting a display panel according to claim 26, characterized in that, The measured values ​​include at least one of the measured voltage value, measured capacitance value, and measured resistance value.

28. The method for detecting a display panel according to claim 27, characterized in that, When the measured values ​​include the measured voltage values, if the measured voltage value is greater than 0, the display panel is determined to be short-circuited. When the measured values ​​include the measured capacitance values, if the measured capacitance value is equal to 0, the display panel is determined to be short-circuited. When the measured value includes the measured resistance value, if the measured resistance value is less than the preset resistance value, the display panel is determined to be short-circuited.

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