SSD module with convection heat dissipation structure
By designing a convection-driven heat dissipation structure, a front fan draws in cool air and a rear fan exhausts hot air, solving the problem of poor heat dissipation in SSD modules and achieving rapid heat dissipation and extended lifespan.
Patent Information
- Application Number
- CN202311214844.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-20
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2043-09-20
AI Technical Summary
Existing SSD templates have poor heat dissipation when working for extended periods, resulting in heat not being dissipated quickly and affecting the template's lifespan.
It adopts a convection cooling structure, using a front fan to draw in cool air and a rear fan to expel hot air, forming a convection airflow to dissipate heat and improve cooling efficiency.
The convection air cooling structure quickly dissipates hot air, improving the heat dissipation effect of the SSD module, avoiding the problem of excessive heat generation caused by poor heat dissipation, and extending the life of the module.
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Figure CN117079679B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of SSD module heat dissipation technology, specifically to an SSD module with a convection heat dissipation structure. Background Technology
[0002] Solid-state drives, also known as SSDs, consist of a control unit and storage units (FLASH chips and DRAM chips).
[0003] In the prior art, in order to prevent the heat inside the SSD template from being difficult to dissipate, heat dissipation vents are opened on the side of the mounting frame of the SSD template to increase the heat loss inside the mounting frame.
[0004] However, traditional SSD modules simply create ventilation holes on the side of the mounting frame for heat dissipation. But relying solely on ventilation holes for heat dissipation is insufficient when the SSD module is in operation for extended periods. The heat cannot be dissipated quickly enough, which may lead to overheating and reduced lifespan of the SSD module. To address this issue, we propose an SSD module with a convection cooling structure to solve the above technical problems. Summary of the Invention
[0005] The purpose of this invention is to provide an SSD module with a convection heat dissipation structure to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: an SSD module with a convection heat dissipation structure, including an SSD template, a screw is provided at one end of the SSD template, a positioning plate is sleeved on the surface of the screw, a heat dissipation vent is provided on the side of the positioning plate, a positioning ring and a mounting frame are provided on the inner side of the positioning plate, and a heat dissipation pipe is inserted into the positioning ring;
[0007] The heat sink has a front fan inside, a mounting plate on the side of the positioning plate, a second heat sink inside the mounting plate, and a rear fan inside the second heat sink.
[0008] Preferably, the positioning plates are provided in two sets, which are symmetrically distributed about the SSD template. Positioning nuts are screwed onto the surface of the screw, and the positioning plates are fixed to the end face of the SSD template by the positioning nuts.
[0009] Preferably, the inner side of the positioning plate is provided with a fixing block, and one end of the mounting frame is provided with a fixing groove, into which the fixing block can be inserted. The fixing block has a square plate-shaped structure, and the mounting frame has a transparent structure.
[0010] Preferably, the positioning ring is fixedly connected to the side of the positioning plate, one end of the heat dissipation pipe can be inserted into the positioning ring, one end of the heat dissipation pipe is aligned with the heat dissipation port, and a heat inlet is opened on the surface of the heat dissipation pipe, which is aligned with the surface of the SSD template.
[0011] Preferably, the heat dissipation frame is fixedly connected to the side of the positioning plate. There are two sets of heat dissipation frames, which are symmetrically distributed about the center point of the long side of the positioning plate surface. The front fan is located inside the heat dissipation port and can draw in external cold air into the heat dissipation pipe.
[0012] Preferably, the mounting plate is fixedly connected to the surface of another set of positioning plates. There are two sets of mounting plates, which are symmetrically distributed about the center line of the long side of the positioning plate surface. The mounting plate has a placement groove on its side, and a positioning block is inserted into the placement groove. One end of the positioning block is fixedly connected to the side of the second heat sink frame. The rear fan in the second heat sink frame is located in the heat sink vent and can exhaust the hot air in the heat sink pipe.
[0013] Preferably, the mounting plate has a second placement groove at one end, a through hole on the side of the second placement groove, a spring at one end of the second placement groove, and a limit plate at one end of the spring. The limit plate has an "L" shaped plate structure.
[0014] Preferably, one end of the spring is fixedly connected to the end face of the second placement groove, and the other end of the spring is fixedly connected to the side of the limiting plate, which can limit the vertical displacement of the positioning block.
[0015] Preferably, the inner surface of the mounting plate is provided with a buffer pad, the bottom of which is fixedly connected to the surface of the mounting plate, and the other end of the buffer pad is provided with a protective plate, which has an arc-shaped plate structure.
[0016] Preferably, a connecting pipe is provided on the side of the heat dissipation pipe, and a heat inlet is also provided at the bottom of the connecting pipe. An auxiliary power supply is provided on the side of the heat dissipation frame, which can be used to charge the rear fan and the front fan. The auxiliary power supply is electrically connected to the rear fan and the front fan.
[0017] Compared with the prior art, the beneficial effects of the present invention are:
[0018] This invention proposes an SSD module with a convection-driven heat dissipation structure. During operation, the front fan first draws in cool air from the outside, and then the rear fan expels hot air from the heat pipes. The combination of front and rear fans, drawing in cool air and expelling it, creates a powerful convection airflow for efficient heat dissipation. This significantly improves the heat dissipation of the SSD module, avoiding the limitations of traditional SSD modules that rely solely on ventilation holes on the side of the mounting frame. In such cases, the ventilation holes become insufficient during prolonged operation, leading to overheating and reduced lifespan of the SSD module. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the present invention;
[0020] Figure 2 This is a side sectional view of the structure of the present invention;
[0021] Figure 3 This is a schematic diagram of the structure after the protective frame of the present invention has been removed;
[0022] Figure 4 This is a schematic diagram of the structure of the present invention after the heat dissipation pipe has been removed;
[0023] Figure 5 This is a cross-sectional view of the heat dissipation pipe structure of the present invention;
[0024] Figure 6 This is a schematic diagram of the heat dissipation pipe structure of the present invention;
[0025] Figure 7 This is a schematic diagram of the structural positioning frame of the present invention.
[0026] In the diagram: 1. SSD template; 2. Screw; 3. Positioning plate; 4. Heat sink; 5. Positioning ring; 6. Heat pipe; 7. Mounting frame; 8. Heat sink frame; 9. Front fan; 10. Mounting clip; 11. Second heat sink frame; 12. Rear fan; 13. Positioning nut; 14. Fixing block; 15. Fixing slot; 16. Heat inlet; 17. Placement slot; 18. Positioning block; 19. Second placement slot; 20. Through hole; 21. Spring; 22. Limiting plate; 23. Buffer pad; 24. Protective plate; 25. Connecting pipe; 26. Auxiliary power supply. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0028] In the description of this invention, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "a," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0030] For purposes of simplicity and illustration, the principles of the embodiments are described primarily by way of example. In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and structures have not been described in detail to avoid unnecessarily obscuring these embodiments. Furthermore, all embodiments can be used in combination with each other.
[0031] Example 1
[0032] Please see Figures 1 to 7The present invention provides a technical solution: an SSD module with a convection heat dissipation structure, including an SSD template 1, a screw 2 at one end of the SSD template 1, a positioning plate 3 on the surface of the screw 2, a heat dissipation port 4 on the side of the positioning plate 3, a positioning ring 5 and a mounting frame 7 on the inner side of the positioning plate 3, a heat dissipation pipe 6 inserted in the positioning ring 5; a heat dissipation frame 8, a front fan 9 disposed in the heat dissipation frame 8, a mounting plate 10 on the side of the positioning plate 3, a second heat dissipation frame 11 disposed in the mounting plate 10, and a rear fan 12 disposed in the second heat dissipation frame 11;
[0033] When in use, the front fan 9 is first turned on to draw in cool air from the outside, and then the rear fan 12 is turned on to expel the hot air from the heat pipe 6. The front fan 9 draws in cool air and the rear fan 12 then exhausts it. The combination of the front fan 9 and the rear fan 12 creates a powerful airflow for cooling, which allows the hot air drawn into the heat pipe 6 to be expelled quickly, greatly improving the heat dissipation effect of the SSD module 1.
[0034] Example 2
[0035] Based on Embodiment 1, a positioning plate 3 is provided. Two sets of positioning plates 3 are provided, symmetrically distributed about the SSD template 1. Positioning nuts 13 are screwed onto the surface of the screw 2, and the positioning plates 3 are fixed to the end face of the SSD template 1 using the positioning nuts 13. A fixing block 14 is provided on the inner side of the positioning plate 3. A fixing groove 15 is provided at one end of the mounting frame 7, into which the fixing block 14 can be inserted. The fixing block 14 has a square plate-like structure. The mounting frame 7 has a transparent structure. A heat dissipation frame 8 is fixedly connected to the side of the positioning plate 3. Two sets of heat dissipation frames 8 are provided, symmetrically distributed about the center point of the long side of the positioning plate 3. A front fan 9 is located inside the heat dissipation vent 4, and the front fan 9 can draw external cool air into the heat pipe 6. Mounting plate 1... The mounting plate 10 is fixedly connected to the surface of another set of positioning plates 3. There are two sets of mounting plates 10, which are symmetrically distributed about the center line of the long side of the surface of the positioning plate 3. The mounting plate 10 has a placement groove 17 on its side, and a positioning block 18 is inserted into the placement groove 17. One end of the positioning block 18 is fixedly connected to the side of the second heat sink frame 11. The rear fan 12 in the second heat sink frame 11 is located in the heat sink 4 and can exhaust the hot air in the heat sink 6. The heat sink 6 has a connecting pipe 25 on its side, and a heat inlet 16 is also opened at the bottom of the connecting pipe 25. The heat sink frame 8 has an auxiliary power supply 26 on its side, which can be used to charge the rear fan 12 and the front fan 9. The auxiliary power supply 26 is electrically connected to the rear fan 12 and the front fan 9.
[0036] When heat dissipation is required for the SSD module 1 during use, the front fan 9 and the rear fan 12 can be activated simultaneously. The rear fan 12 exhausts hot air from the heat pipe 6, while the front fan 9 draws in cool air, which is then exhausted by the rear fan 12. This in-and-out exhaust and intake by the front fan 9 and rear fan 12 creates convection current within the heat pipe 6. The heat generated by the SSD module 1 during operation is channeled through the heat pipe 6 and connecting pipe 25 into the heat inlet 16. The accelerated airflow within the heat pipe 6 further increases the heat output. The heat inlet 16, facing the SSD template 1, allows for convenient and concentrated heat collection into the heat pipe 6. The auxiliary power supply 26 enhances the battery life of the front fan 9 and the rear fan 12. The transparent mounting frame 7 allows easy observation of the SSD template 1. When the mounting frame 7 needs to be removed, the positioning nut 13 can be rotated to disengage from the screw 2, allowing the positioning plate 3 to be removed from the screw 2. Then, the fixing block 14 can also be disengaged from the fixing groove 15, making it convenient to remove the mounting frame 7 and the positioning plate 3 from the SSD template 1.
[0037] Example 3
[0038] Based on Embodiment 2, a mounting plate 10 is provided, which is fixedly connected to the surface of another set of positioning plates 3. Two sets of mounting plates 10 are provided, symmetrically distributed about the center line of the long side of the surface of the positioning plates 3. A placement groove 17 is provided on the side of the mounting plate 10, and a positioning block 18 is inserted into the placement groove 17. One end of the positioning block 18 is fixedly connected to the side of the second heat sink frame 11. The rear fan 12 inside the second heat sink frame 11 is located inside the heat dissipation vent 4, which can exhaust hot air from the heat dissipation pipe 6. A second placement groove 19 is provided at one end of the mounting plate 10. A through hole 20 is provided on the side of the second placement groove 19. A spring 21 is provided at one end of the second placement groove 19. A limiting plate 22 is provided at one end of the spring 21. The limiting plate 22 has an "L" shaped plate structure. One end of the spring 21 is fixedly connected to the end face of the second placement groove 19, and the other end of the spring 21 is fixedly connected to the side of the limiting plate 22. The limiting plate 22 can limit the vertical displacement of the positioning block 18. A buffer pad 23 is provided on the inner surface of the mounting plate 10. The bottom of the buffer pad 23 is fixedly connected to the surface of the mounting plate 10. A protective plate 24 is provided at the other end of the buffer pad 23. The protective plate 24 has an arc-shaped plate structure.
[0039] When the second heat sink 11 needs to be removed during use, first pull the limiting plate 22 to move it backward in the second placement slot 19. This will cause the limiting plate 22 to lose its limiting effect on the positioning block 18, and the second heat sink 11 can be directly removed. The spring 21 allows the limiting plate 22 to automatically reset after being pulled, which is convenient for subsequent re-fixing of the second heat sink 11. The buffer pad 23, together with the protective plate 24, can improve the buffering of the rear fan 12 during operation and prevent the rear fan 12 from vibrating and causing damage to its internal parts during long-term operation.
[0040] In actual use, the front fan 9 is first activated to draw in cool air from the outside, and then the rear fan 12 is activated to expel the hot air from the heat pipe 6. The combination of the front fan 9 drawing in cool air and the rear fan 12 expelling it creates a powerful airflow for stronger heat dissipation, allowing the hot air drawn into the heat pipe 6 to be quickly expelled, greatly improving the heat dissipation effect of the SSD template 1. This avoids the problem of traditional SSD templates simply opening a heat dissipation vent 4 on the side of the mounting frame 7 for heat dissipation. However, when the SSD template 1 is working for a long time, the heat dissipation effect of the heat dissipation vent 4 cannot meet the needs of the SSD template 1, and the heat cannot be dissipated quickly from the heat dissipation vent, which may lead to the SSD template 1 overheating and reduce its lifespan.
[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An SSD module with a convection heat dissipation structure, comprising an SSD template (1), characterized in that: The SSD template (1) is provided with a screw (2) at one end, a positioning plate (3) is fitted on the surface of the screw (2), a heat dissipation port (4) is provided on the side of the positioning plate (3), a positioning ring (5) and a mounting frame (7) are provided on the inner side of the positioning plate (3), and a heat dissipation pipe (6) is inserted into the positioning ring (5). Heat dissipation frame (8), a front fan (9) is provided inside the heat dissipation frame (8), a mounting plate (10) is provided on the side of the positioning plate (3), a second heat dissipation frame (11) is provided inside the mounting plate (10), and a rear fan (12) is provided inside the second heat dissipation frame (11). The positioning plate (3) is provided in two sets, and the two sets of positioning plates (3) are symmetrically distributed about the SSD template (1). The screw (2) is screwed with a positioning nut (13), and the positioning plate (3) is fixed to the end face of the SSD template (1) by the positioning nut (13). The positioning plate (3) has a fixing block (14) on its inner side, and a fixing groove (15) is provided at one end of the mounting frame (7). The fixing block (14) can be inserted into the fixing groove (15). The fixing block (14) has a square plate structure, and the mounting frame (7) has a transparent structure. The positioning ring (5) is fixedly connected to the side of the positioning plate (3). One end of the heat sink (6) can be inserted into the positioning ring (5). One end of the heat sink (6) is aligned with the heat sink (4). The surface of the heat sink (6) is provided with a heat inlet (16). The heat inlet (16) is aligned with the surface of the SSD template (1). The heat dissipation frame (8) is fixedly connected to the side of the positioning plate (3). There are two sets of heat dissipation frames (8). The two sets of heat dissipation frames (8) are symmetrically distributed about the center point of the long side of the surface of the positioning plate (3). The front fan (9) is located inside the heat dissipation port (4). The front fan (9) can draw the outside cold air into the heat dissipation pipe (6). When in use, the front fan (9) draws in cold air, and the rear fan (12) exhausts the hot air in the heat sink (6). The front fan (9) and the rear fan (12) exhaust and draw in air in turn, so that the air in the heat sink (6) forms a convection, and the convection direction is parallel to the SSD template (1). The heat generated by the SSD template (1) enters the heat inlet (16) through the heat sink (6) and the connecting pipe 25, and then the heat is quickly discharged by the accelerated airflow in the heat sink (6). The heat pipe (6), the heat sink (8), and the second heat sink (11) are located on the same side of the SSD template (1).
2. An SSD module with a convection heat dissipation structure according to claim 1, characterized in that: The mounting plate (10) is fixedly connected to the surface of another set of positioning plates (3). There are two sets of mounting plates (10). The two sets of mounting plates (10) are symmetrically distributed about the center line of the long side of the surface of the positioning plate (3). The mounting plate (10) has a placement groove (17) on its side. A positioning block (18) is inserted into the placement groove (17). One end of the positioning block (18) is fixedly connected to the side of the second heat sink frame (11). The rear fan (12) in the second heat sink frame (11) is located in the heat sink (4) and can exhaust the hot air in the heat sink pipe (6).
3. An SSD module with a convection heat dissipation structure according to claim 2, characterized in that: The mounting plate (10) has a second placement groove (19) at one end, a through hole (20) on the side of the second placement groove (19), a spring (21) at one end of the second placement groove (19), a limiting plate (22) at one end of the spring (21), and the limiting plate (22) has an "L" shaped plate structure.
4. An SSD module with a convection heat dissipation structure according to claim 3, characterized in that: One end of the spring (21) is fixedly connected to the end face of the second placement groove (19), and the other end of the spring (21) is fixedly connected to the side of the limiting plate (22). The limiting plate (22) can limit the vertical displacement of the positioning block (18).
5. An SSD module with a convection heat dissipation structure according to claim 4, characterized in that: The inner surface of the mounting plate (10) is provided with a buffer pad (23), the bottom of the buffer pad (23) is fixedly connected to the surface of the mounting plate (10), and the other end of the buffer pad (23) is provided with a protective plate (24), which has an arc-shaped plate structure.
6. An SSD module with a convection heat dissipation structure according to claim 5, characterized in that: The heat sink (6) has a connecting pipe (25) on its side, and a heat inlet (16) is also provided at the bottom of the connecting pipe (25). An auxiliary power supply (26) is provided on the side of the heat sink (8). The auxiliary power supply (26) can be used to charge the rear fan (12) and the front fan (9). The auxiliary power supply (26) is electrically connected to the rear fan (12) and the front fan (9).
Citation Information
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Blowing type computer host case with heat dissipation function
CN210804210U
SSD (Solid State Disk) heat dissipation device
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