Wafer ring tensioning and aligning mechanism

Abstract

This invention discloses a wafer tension ring alignment mechanism, comprising a support base with support platforms on both sides, the support platforms being adapted to support the wafer tension ring; a drive gripper assembly mounted between the support platforms on both sides, the drive gripper assembly being adapted to grip the wafer tension ring and move along the length direction of the support base; a first positioning mechanism movably mounted on the support base, the positioning post of which stops against the wafer tension ring on the side of the drive mechanism adjacent to the gripper in the length direction; and a second positioning mechanism mounted on the support base, the second positioning mechanism being rotatable between alignment positions, the second positioning mechanism rotating when sensing movement of the first positioning mechanism and stopping the first positioning mechanism at the alignment position. The wafer tension ring alignment mechanism according to this invention can align wafer tension rings during wafer bonding, and has advantages such as simple structure, high alignment accuracy, high working efficiency, and high degree of automation.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and in particular to a wafer tensioning alignment mechanism. Background Technology

[0002] With economic development and social progress, people's demand for precision electronic instruments is growing, and the development of integrated circuits is particularly rapid. As a basic material for integrated circuits, wafers are becoming increasingly indispensable in modern production processes.

[0003] The wafer clamping alignment mechanism in related technologies usually requires a complex robotic arm structure for control. The robotic arm's gripping and transport of the wafer clamping ring can affect the stress state of the wafer, causing the wafer to slip and resulting in inaccurate positioning. In addition, the robotic arm has a complex structure, high cost, and low alignment accuracy. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a wafer tensioning alignment mechanism that can center wafer tensioning rings, and has advantages such as simple structure, high alignment accuracy, high working efficiency, and high degree of automation.

[0005] To achieve the above objectives, a wafer tensioning ring alignment mechanism according to an embodiment of the present invention includes: a support base, wherein support platforms are constructed on both sides of the support base, and the support platforms are adapted to support a wafer tensioning ring; a drive gripper assembly, wherein the drive gripper assembly is mounted between the support platforms on both sides, and the drive gripper assembly is adapted to grip the wafer tensioning ring and move along the length direction of the support base; a first positioning mechanism, wherein the first positioning mechanism is movably mounted on the support base, and the first positioning mechanism stops the wafer tensioning ring on the side of the drive mechanism adjacent to the gripper in the length direction of the drive mechanism; when the drive gripper assembly senses that the wafer tensioning ring touches the first positioning mechanism, it stops gripping the wafer tensioning ring, and the first positioning mechanism pushes the wafer tensioning ring to move in the opposite direction to the alignment position; and a second positioning mechanism, wherein the second positioning mechanism is mounted on the support base, and the second positioning mechanism is rotatable between the alignment positions; when the second positioning mechanism senses movement of the first positioning mechanism, the second positioning mechanism rotates and stops the first positioning mechanism at the alignment position.

[0006] The wafer snap ring alignment mechanism according to embodiments of the present invention has the advantages of being able to hit the wafer snap ring while transferring it, achieving high accuracy, improving working efficiency, simplifying processing steps, and increasing flexibility.

[0007] According to some specific embodiments of the present invention, the first positioning mechanism and the second positioning mechanism are arranged in pairs. The first positioning mechanism is located on both sides of the driving gripper assembly, and the second positioning mechanism is located on both sides of the driving gripper assembly. The first positioning mechanism and the second positioning mechanism are arranged at intervals along the length direction of the driving gripper assembly.

[0008] According to some specific embodiments of the present invention, the drive gripper assembly includes: a guide rail, which is mounted on the support and extends along the length direction of the support; a drive motor, which is mounted on one end of the guide rail; and grippers, which are movably mounted on the guide rail and driven by the drive motor, and grippers clamping the upper and lower surfaces of the wafer tension ring.

[0009] According to some specific embodiments of the present invention, the first positioning mechanism includes: a linear drive mechanism mounted on the support base; and a positioning column connected to the linear drive mechanism, wherein the linear drive mechanism drives the positioning column to move along the length direction of the support base.

[0010] According to some specific embodiments of the present invention, the positioning post of one of the first positioning mechanisms includes a mounting post and a lateral positioning pin, and the positioning post of another first positioning mechanism includes a mounting post and a longitudinal positioning pin. The lateral positioning pin and the longitudinal positioning pin are respectively mounted on the mounting post of the respective first positioning mechanism. The lateral positioning pin is adapted to engage with the lateral positioning notch of the wafer tensioner, and the longitudinal positioning pin is adapted to engage with the longitudinal positioning notch of the wafer tensioner.

[0011] According to some specific embodiments of the present invention, the second positioning mechanism includes: a rotation drive mechanism mounted on the support base; a connecting arm extending horizontally, one side of the connecting arm being connected to the rotation drive mechanism and being liftable relative to the rotation drive mechanism, the rotation drive mechanism driving the other side of the connecting arm to rotate around the rotation drive mechanism; and a stop block connected to the other side of the connecting arm, the rotation drive mechanism driving the connecting arm to rotate the stop block between an initial position and a stop position.

[0012] According to some specific embodiments of the present invention, the stop block is connected to the bottom of the connecting arm, and the rotation angle between the initial position and the stop position is 90°.

[0013] According to some specific embodiments of the present invention, a light sensor is provided, wherein the stop block is constructed with a sensing plane, the light sensor detects the sensing plane when the stop block is raised, and when the light sensor detects the sensing plane, the rotation drive mechanism controls the stop block to rotate.

[0014] According to some specific embodiments of the present invention, the side of the stop adjacent to the sensing plane is configured as an arc surface.

[0015] According to some specific embodiments of the present invention, the outer side of the support platform is provided with a baffle, the baffle being adapted to stop the wafer tension ring on the outer side of the support platform.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the wafer tensioning alignment mechanism according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the support plate of the wafer tensioning alignment mechanism according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the first positioning mechanism of the wafer tensioning alignment mechanism according to an embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of the second positioning mechanism of the wafer tensioning alignment mechanism according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the wafer tensioning mechanism according to an embodiment of the present invention.

[0018] Figure label: Wafer tensioning alignment mechanism 1, support base 100, drive gripper assembly 200, first positioning mechanism 300 Second positioning mechanism 400, support platform 110, baffle 111, guide rail 210, drive motor 220, gripper 230. Positioning column 310, linear drive mechanism 320, rotary drive mechanism 410, connecting arm 420 Stop 430, wafer tension ring 10, lateral positioning notch 11, longitudinal positioning notch 12, light sensor 20. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0022] In the description of this invention, "a plurality of" means two or more, and "several" means one or more.

[0023] The wafer banding alignment mechanism 1 according to the present invention is described below with reference to the accompanying drawings.

[0024] like Figure 1 As shown, the wafer tensioning alignment mechanism 1 according to an embodiment of the present invention includes a support base 100, a drive gripper assembly 200, a first positioning mechanism 300, and a second positioning mechanism 400.

[0025] The support base 100 has support platforms 110 on both sides, which are adapted to support the wafer tension ring 10. A drive gripper assembly 200 is mounted between the support platforms 110 on both sides, and is adapted to grip the wafer tension ring 10 and move along the length of the support base 100. A first positioning mechanism 300 is movably mounted on the support base 100. The first positioning mechanism 300 stops the wafer tension ring 10 on the side of the drive mechanism 320 adjacent to the gripper in the length direction. When the drive gripper assembly 200 senses that the wafer tension ring 10 touches the first positioning mechanism 300, it stops gripping the wafer tension ring 10, and the first positioning mechanism 300 pushes the wafer tension ring 10 to move in the opposite direction to the centering position. A second positioning mechanism 400 is mounted on the support base 100 and is rotatable between the centering positions. When the second positioning mechanism 400 senses movement of the first positioning mechanism 300, it rotates and stops the first positioning mechanism 300 at the centering position.

[0026] For example, the wafer tension ring 10 surrounds the outer periphery of the wafer, protecting it. The support base 100, located at the bottom of the wafer tension ring alignment mechanism 1, supports the driving jaw assembly 200, the first positioning mechanism 300, and the second positioning mechanism 400. The driving jaw assembly 200 extends along the length of the support base 100, and the first positioning mechanism 300 and the second positioning mechanism 400 are spaced apart along the length of the support base 100. The driving jaw assembly 200, the first positioning mechanism 300, and the second positioning mechanism 400 are all located between the two support platforms 110.

[0027] First, the workflow of the wafer tensioner alignment mechanism 1 according to an embodiment of the present invention is described. First, the gripper assembly 200 is driven to grip the wafer tensioner 10. At this time, the wafer tensioner is located in front of the support base 100 and the second positioning mechanism is lowered, placing the wafer tensioner above the second positioning mechanism 400. The gripper assembly 200 is then driven to move backward along the length of the support plate 100, meaning the wafer tensioner 10 moves from its initial position towards the first positioning mechanism 300. When the wafer tensioner 10 reaches the first positioning mechanism 300, the wafer tensioner 10 is stopped, thus restricting the wafer tensioner 10. As the displacement continues, the drive gripper assembly 200 senses the first positioning mechanism 300 stopping the wafer tension ring 10, causing a change in the force on the drive gripper assembly 200. The drive gripper assembly 200 then releases the wafer tension ring 10, which is no longer gripped. The first positioning mechanism 300 pushes the wafer tension ring 10 in the opposite direction (forward) to the second positioning mechanism 400. Simultaneously, the second positioning mechanism 400 rotates and stops the wafer tension ring 10 when it reaches the predetermined position. At this point, the wafer tension ring 10 is aligned by being stopped on both the front and rear sides by the first positioning mechanism 300 and the second positioning mechanism 400, respectively.

[0028] According to an embodiment of the present invention, the wafer tensioning ring alignment mechanism 1 uses a drive gripper assembly 200 to grip the wafer tensioning ring 10. The gripper assembly 200 transfers the wafer tensioning ring 10 to the first positioning mechanism 300, where it performs initial positioning. The first positioning mechanism 300 has an internal program that sets the required movement distance and moves to a predetermined position for alignment. The first positioning mechanism 300 and the second positioning mechanism 400 position the wafer tensioning ring 10 from the front and rear sides, respectively, to further transport the wafer to the accurate processing position. The engagement and restraint of the first positioning mechanism 300 and the second positioning mechanism 400 improve the accuracy of wafer alignment and also increase work efficiency.

[0029] Therefore, the wafer banding alignment mechanism 1 according to the present invention can center the wafer banding, and has the advantages of simple structure, high alignment accuracy, high working efficiency and high degree of automation.

[0030] In some specific embodiments of the present invention, the first positioning mechanism 300 and the second positioning mechanism 400 are arranged in pairs. The first positioning mechanism 300 is located on both sides of the drive gripper assembly 200, and the second positioning mechanism 400 is located on both sides of the drive gripper assembly 200. The first positioning mechanism 300 and the second positioning mechanism 400 are spaced apart along the length direction of the drive gripper assembly 200. The first positioning mechanism 300 and the second positioning mechanism 400 are located on both sides of the drive gripper assembly 200 and are arranged in pairs. The paired first positioning mechanisms 300 push the wafer tensioner 10 forward on the left and right sides of the wafer tensioner 10, and can engage with the wafer tensioner 10 to ensure the accurate left and right position of the rear part of the wafer tensioner 10. Similarly, the paired second positioning mechanisms stop the wafer tensioner 10 on the left and right sides of the wafer tensioner 10 to ensure the accurate left and right position of the front part of the wafer tensioner.

[0031] The wafer clamping ring 10 can be clamped at the correct position and angle by means of relative positions and intervals, so as to ensure the accuracy of the produced wafers for subsequent processing or handling operations. Secondly, the first positioning mechanism 300 and the second positioning mechanism 400 prevent the wafer clamping ring 10 from sliding and rotating, thereby ensuring the stability and balance of the wafer clamping ring 10.

[0032] In some specific embodiments of the present invention, such as Figure 1 As shown, the drive gripper assembly 200 includes a guide rail 210, a drive motor 220, and grippers 230. The guide rail 210 is mounted on the support base 100 and extends along the length of the support base 100. The drive motor 220 is mounted on one end of the guide rail 210. The grippers 230 are movably mounted on the guide rail 210 and driven by the drive motor 220, and grippers 230 clamp the upper and lower surfaces of the wafer tension ring 10. The guide rail 210 consists of a pair of parallel guide rails. The grippers 230 move linearly on the guide rail 210. The drive motor 220 is mounted on one end of the guide rail 210 and serves as a driving power source, converting electrical energy into mechanical energy to drive the grippers 230 to slide on the guide rail 210.

[0033] The guide rail 210 enables the gripper 230 to move in a specified direction during the movement of the wafer tension ring 10. The drive motor 220 provides driving force, enabling the gripper 230 to move smoothly. The gripper 230 includes an upper clamping plate and a lower clamping plate. The upper clamping plate clamps the upper and lower surfaces of the wafer tension ring 10 respectively. The gripper 230 can hold the wafer tension ring 10 in a fixed position, ensuring that the wafer tension ring 10 will not rotate or move during the movement, and ensuring that the wafer moves stably to the first positioning mechanism 300.

[0034] In some specific embodiments of the present invention, such as Figure 1 and Figure 3As shown, the first positioning mechanism 300 includes a linear drive mechanism 320 and a positioning post 310. The linear drive mechanism 320 is mounted on the support base 100. The positioning post 310 is connected to the linear drive mechanism 320, and the linear drive mechanism 320 drives the positioning post 310 to move along the length direction of the support base 100. The linear drive mechanism 320 can be a linear motor, allowing it to move linearly in the front-back direction, thereby achieving precise positioning of the wafer tension ring 10 in the front-back direction. The positioning post 310 is fixed to one end of the linear drive mechanism 320 and extends upward. Driven by the linear drive mechanism 320, it moves along the front of the support plate 100. The positioning post 310 stops the wafer tension ring 10 and moves forward a predetermined distance from its initial position, driving the wafer tension ring 10 to the accurate centering position.

[0035] In some specific embodiments of the present invention, such as Figure 3 As shown, the positioning post 310 of one of the first positioning mechanisms 300 includes a mounting post and a lateral positioning pin, and the positioning post 310 of the other first positioning mechanism 300 includes a mounting post and a longitudinal positioning pin. The lateral positioning pin and the longitudinal positioning pin are respectively mounted on the mounting post of the respective first positioning mechanism 300. The lateral positioning pin is adapted to cooperate with the lateral positioning notch 11 of the wafer tension ring 10, and the longitudinal positioning pin is adapted to cooperate with the longitudinal positioning notch 12 of the wafer tension ring 10.

[0036] For example, the wafer tension ring 10 has a lateral positioning notch 11 and a longitudinal positioning notch 12, and the two first positioning mechanisms 300 are respectively equipped with lateral positioning pins and longitudinal positioning pins that are adapted to the lateral positioning notch 11 and the longitudinal positioning notch 12. The lateral positioning pins and longitudinal positioning pins are respectively mounted on different positioning posts 310. When the drive gripper assembly 200 moves the wafer tension ring 10 backward, the wafer tension ring 10 is blocked by the lateral positioning pins and the longitudinal positioning pins, respectively. The lateral positioning pins engage with the lateral positioning notch 11 and the longitudinal positioning pins engage with the longitudinal positioning notch 12, respectively, restricting the front-back and left-right positions of the wafer tension ring 10, thus completing the initial positioning of the wafer tension ring 10. The lateral positioning pins and longitudinal positioning pins constructed by the first positioning mechanism 300 can position and align the wafer tension ring 10 in the horizontal direction, which helps to maintain the stability and balance of the wafer tension ring 10.

[0037] In some specific embodiments of the present invention, such as Figure 4As shown, the second positioning mechanism 400 includes a rotation drive mechanism 410, a connecting arm 420, and a stop 430. The rotation drive mechanism 410 is mounted on the support base 100. The connecting arm 420 extends horizontally, and one side of the connecting arm 420 is connected to the rotation drive mechanism 410 and is movable relative to the rotation drive mechanism 410. The rotation drive mechanism 410 drives the other side of the connecting arm 420 to rotate around the rotation drive mechanism 410. The stop 430 is connected to the other side of the connecting arm 420, and the rotation drive mechanism 410 drives the connecting arm 420 to rotate the stop 430 between an initial position and a stop position.

[0038] When the drive gripper assembly 200 grasps the wafer tension ring 10 and moves it backward, the connecting arm 420 descends relative to the rotation drive mechanism 410, and the wafer tension ring 10 is positioned above the connecting arm 420. When the first positioning mechanism 300 pushes the wafer tension ring 10 forward, the connecting arm 420 rises gradually.

[0039] The connecting arm 420 extends horizontally. One side of the connecting arm 420 is connected to the rotation drive structure 410, and the other side is connected to the stop block 430. When the wafer tension ring 10 is initially positioned by the first positioning mechanism 300, the drive gripper assembly 200 releases the wafer tension ring 10. At this time, the wafer tension ring 10 moves in the initial direction, and the connecting arm 420 is raised. The stop block 430 maintains the same height as the wafer tension ring 10. The stop block 430 is connected to one side of the connecting arm 420 and is driven by the rotation drive mechanism 410 to rotate between the initial position and the stop position. When the first positioning mechanism 300 pushes the wafer tension ring forward, the connecting arm 420 is rotated so that the stop block 430 reaches the designated position and stops the wafer tension ring 10 at the front, thus positioning the displacement of the wafer tension ring 10. Therefore, the wafer tension ring 10 is positioned at the rear by the lateral positioning pin and the longitudinal positioning pin, and at the front by the stop block. Specifically, the rotation drive mechanism 410 provides driving force to the second positioning mechanism 400, driving the connecting arm 420 and the stop 430 to rotate. The connecting arm 420 connects the rotation drive mechanism 410 and the stop 430, transmitting the driving force to the stop 430, thus playing the role of power transmission. The stop 430 contacts the wafer tension ring 10 to keep the wafer fixed, ensuring the correct alignment of the wafer during the working process, thereby achieving the function of centering and positioning.

[0040] In some specific embodiments of the present invention, such as Figure 1 and Figure 4As shown, the stop block 430 is connected to the bottom of the connecting arm 420, with a rotation angle of 90° between the initial position and the stop position. The initial position of the stop block 430 is perpendicular to the connecting arm 420 and spaced a certain distance from the wafer tension ring 10. At this point, the wafer tension ring 10 can move freely without being affected by the stop block 430. As the wafer tension ring 10 moves back, the stop block 430 rotates from the initial position to the stop position, controlling the wafer tension ring 10 to remain in a precise alignment position. The initial position and the stop position are exactly 90° apart. By controlling the position of the wafer tension ring 10, it can be ensured that the wafer tension ring can be accurately stopped and positioned according to the preset position on the rotation path.

[0041] In some specific embodiments of the present invention, such as Figure 1 As shown, the wafer tension ring alignment mechanism 1 also includes a photosensitive sensor 20. The stop 430 is constructed with a sensing plane. The photosensitive sensor 20 detects the sensing plane when the stop 430 is raised. When the photosensitive sensor 20 detects the sensing plane, the rotation drive mechanism 410 controls the stop 430 to rotate. The photosensitive sensor 20 can detect the presence and movement of the sensing plane. When the stop 430 is raised and detected by the photosensitive sensor 20, the photosensitive sensor 20 sends a signal to the rotation drive mechanism 410, at which point the stop 430 moves. In this way, the wafer tension ring 10 can be blocked from passing in time, and the rotation drive mechanism 410 and the linear drive mechanism 320 can be controlled in time to drive together and fix the wafer tension ring 10 in the accurate alignment position, ensuring alignment accuracy and improving work efficiency and stability.

[0042] In some specific embodiments of the present invention, such as Figure 1 As shown, the side of the stop 430 adjacent to the sensing plane is constructed as an arc surface. The stop 430 is connected to the connecting arm 420. When the wafer tensioner 10 moves to the appropriate position, the stop 430 blocks the wafer tensioner 10, limiting its excessive displacement. The arc surface of one side of the stop 430 allows for point contact, improving the accuracy of the wafer tensioner 10 during operation and reducing alignment errors. Compared to line or surface contact, the arc surface of the stop 430 better maintains contact stability and consistency, ensuring precise positioning and accuracy of the wafer tensioner 10 during displacement. Simultaneously, the arc surface design allows for smoother contact with the wafer tensioner 10, preventing damage to the wafer tensioner 10.

[0043] In some specific embodiments of the present invention, such as Figure 5As shown, the outer surface of the support platform 110 is equipped with a baffle 111, which is located on the outer side of the support platform 111 and is suitable for stopping the wafer tension ring 10. The baffle 111 is slightly higher than the height of the support platform 110, and the baffles 111 on both sides restrict the movement trajectory of the wafer tension ring 10. Through contact with the wafer tension ring 10, the baffle 111 provides a certain support force for the wafer tension ring 10, and at the same time, the baffle 111 prevents the wafer tension ring from moving left and right, playing a certain limiting role, maintaining the stability of the structure, and ensuring that the wafer tension ring 10 can be aligned according to the predetermined movement path.

[0044] Other configurations and operations of the wafer banding alignment mechanism 1 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0045] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0046] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer tension ring alignment mechanism, characterized in that, include: A support base, wherein the support base has support platforms on both sides, the support platforms being adapted to support wafer tension rings; A drive gripper assembly is mounted between the two support platforms and is adapted to grip the wafer tension ring and move along the length of the support base. A first positioning mechanism is movably mounted on the support base. The first positioning mechanism stops the wafer tension ring on the side of the drive mechanism adjacent to the gripper in the length direction. When the drive gripper assembly senses that the wafer tension ring touches the first positioning mechanism, it stops clamping the wafer tension ring. The first positioning mechanism pushes the wafer tension ring to move in the opposite direction to the centering position. A second positioning mechanism is mounted on the support base. The second positioning mechanism is rotatable between the centering positions. When the second positioning mechanism senses the movement of the first positioning mechanism, it rotates and stops the first positioning mechanism at the centering position. The second positioning mechanism includes: A rotation drive mechanism, which is mounted on the support base; A connecting arm extends horizontally, one side of the connecting arm is connected to the rotation drive mechanism and is movable relative to the rotation drive mechanism, and the rotation drive mechanism drives the other side of the connecting arm to rotate around the rotation drive mechanism. A stop block is connected to the other side of the connecting arm, and the rotation drive mechanism drives the connecting arm to rotate the stop block between an initial position and a stop position.

2. The wafer tensioning alignment mechanism according to claim 1, characterized in that, The first positioning mechanism and the second positioning mechanism are arranged in pairs. The first positioning mechanism is located on both sides of the driving gripper assembly, and the second positioning mechanism is located on both sides of the driving gripper assembly. The first positioning mechanism and the second positioning mechanism are spaced apart along the length direction of the driving gripper assembly.

3. The wafer tensioning alignment mechanism according to claim 2, characterized in that, The drive gripper assembly includes: A guide rail, which is mounted on the support base and extends along the length of the support base; A drive motor is mounted at one end of the guide rail; The gripper is movably mounted on the guide rail and driven by the drive motor, and the gripper clamps the upper and lower surfaces of the wafer tension ring.

4. The wafer tensioning alignment mechanism according to claim 2, characterized in that, The first positioning mechanism includes: A linear drive mechanism, which is mounted on the support base; A positioning column is connected to the linear drive mechanism, which drives the positioning column to move along the length direction of the support base.

5. The wafer tensioning alignment mechanism according to claim 4, characterized in that, One of the first positioning mechanisms has a positioning post including a mounting post and a lateral positioning pin, and the other first positioning mechanism has a positioning post including a mounting post and a longitudinal positioning pin. The lateral positioning pin and the longitudinal positioning pin are respectively mounted on the mounting post of the first positioning mechanism. The lateral positioning pin is adapted to engage with the lateral positioning notch of the wafer tensioner, and the longitudinal positioning pin is adapted to engage with the longitudinal positioning notch of the wafer tensioner.

6. The wafer tensioning alignment mechanism according to claim 1, characterized in that, The stop block is connected to the bottom of the connecting arm, and the rotation angle between the initial position and the stop position is 90°.

7. The wafer tensioning alignment mechanism according to claim 1, characterized in that, Also includes: A light sensor is provided, and the stop block is constructed with a sensing plane. When the stop block is raised, the light sensor detects the sensing plane. When the light sensor detects the sensing plane, the rotation drive mechanism controls the stop block to rotate.

8. The wafer tensioning alignment mechanism according to claim 7, characterized in that, The side of the block adjacent to the sensing plane is constructed as an arc surface.

9. The wafer tensioning alignment mechanism according to claim 1, characterized in that, The outer side of the support platform is provided with a baffle, which is adapted to stop the wafer tension ring on the outside of the support platform.

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