A liquid cooling plate

Abstract

This invention provides a liquid cooling plate, comprising: a substrate having a first surface and a second surface facing away from each other; the first surface having multiple mounting areas; and the second surface having upstream and downstream flow channels; and pins disposed on the second surface of the substrate corresponding to the mounting areas. Each mounting area includes multiple micro-units corresponding to multiple heat-generating areas of a chip. Each micro-unit includes a first unit and a second unit. The pins are formed as first pin units and second pin units, the total surface area of ​​the first pin units being smaller than the total surface area of ​​the second pin units. The first pin unit is a combination of pins located in the upstream flow channel and corresponding to the second unit, and the second pin unit is a combination of pins located in the downstream flow channel and corresponding to the first unit. The liquid cooling plate of this invention can increase the temperature uniformity of various areas during actual chip operation.

Description

Technical Field

[0001] This invention relates to the field of chips, and in particular to a liquid cooling plate. Background Technology

[0002] Currently, some chips are quite large and generate a lot of heat. If the heat dissipation is not good, it will cause the chip to malfunction. In order to save costs, multiple chips are placed on the heat sink.

[0003] However, existing heat sinks can cause uneven heat dissipation for chips, failing to meet the requirements for stable and uniform heat dissipation for all chips. Summary of the Invention

[0004] In view of the above-mentioned problems in the prior art, the purpose of the present invention is to provide a liquid cooling plate that can increase the temperature uniformity of various regions during the actual operation of the chip.

[0005] To address the above problems, the present invention provides a liquid cooling plate, the liquid cooling plate comprising:

[0006] The substrate includes a first surface and a second surface facing away from each other. The first surface has a plurality of mounting areas, and the second surface has an upstream flow channel and a downstream flow channel. Coolant can flow from the upstream flow channel into the downstream flow channel to flow across the second surface of the substrate.

[0007] Needle fins, the needle fins being disposed on the second surface of the substrate and in the area corresponding to the mounting area.

[0008] The mounting areas are arranged sequentially and spaced apart along the flow direction of the coolant. Each mounting area includes multiple micro-units corresponding to multiple heat-generating areas of the chip, and each micro-unit has the same area.

[0009] The micro-unit includes a first unit and a second unit, wherein the heat generation of the heat-generating area of ​​the chip corresponding to the first unit is higher than the heat generation of the heat-generating area of ​​the chip corresponding to the second unit.

[0010] The needle wing is formed with a first needle wing unit and a second needle wing unit. The total surface area of ​​the first needle wing unit is smaller than the total surface area of ​​the second needle wing unit. The first needle wing unit is a combination of needle wings located in the upstream flow channel and corresponding to the second unit. The second needle wing unit is a combination of needle wings located in the downstream flow channel and corresponding to the first unit.

[0011] Furthermore, the needle wing includes a broken wing, a regular wing, and a fused wing. The height of the broken wing is lower than that of the regular wing. Adjacent regular wings merge to form the fused wing. The first needle wing unit includes the broken wing and / or the fused wing, and the second needle wing unit includes only the regular wing.

[0012] Furthermore, the liquid cooling plate also includes at least one housing or block, the bottom end of which is open and the rest is closed, the bottom end of which is connected to the substrate and covers the area on the second surface of the substrate located in the upstream flow channel and corresponding to the second unit.

[0013] Furthermore, the needle fin is detachably connected to the substrate, and the number of needle fins in the first needle fin unit is less than the number of needle fins in the second needle fin unit.

[0014] Furthermore, the needle fin is threaded, interference-fitted, or snap-fitted to the substrate.

[0015] Furthermore, the needle wing is composed of multiple wing segments, and the broken wing contains fewer wing segments than the conventional wing.

[0016] Furthermore, the different fin segments are connected by threads or snap-fit ​​connections.

[0017] Furthermore, the needle wing also forms a third needle wing unit and a fourth needle wing unit. The first needle wing unit has the smallest total surface area, the second needle wing unit has the largest total surface area, and the third needle wing unit has a larger total surface area than the fourth needle wing unit. The third needle wing unit is a combination of the needle wings located in the upstream flow channel and corresponding to the first unit, and the fourth needle wing unit is a combination of the needle wings located downstream and corresponding to the second unit.

[0018] Furthermore, the needle wings are formed into columns of uniform height, the cross-sectional area of ​​the needle wings in the first needle wing unit is smaller than the cross-sectional area of ​​the needle wings in the fourth needle wing unit, the cross-sectional area of ​​the needle wings in the fourth needle wing unit is smaller than the cross-sectional area of ​​the needle wings in the third needle wing unit, and the cross-sectional area of ​​the needle wings in the third needle wing unit is smaller than the cross-sectional area of ​​the needle wings in the second needle wing unit.

[0019] Furthermore, the end face of the tip of the needle wing is formed as a polygon, an ellipse, or a circle.

[0020] Due to the above technical solution, the present invention has the following beneficial effects:

[0021] According to the liquid cooling plate of the present invention, a plurality of mounting areas are formed on the first surface of the substrate, and a plurality of micro-units corresponding to a plurality of heat-generating areas are divided in each mounting area. The micro-units include a first unit with high heat generation and a second unit with low heat generation. A pin fin is provided on the second surface of the substrate. The pin fin is formed as a first pin fin unit located in the upstream flow channel and corresponding to the second unit, and a second pin fin unit located in the downstream flow channel and corresponding to the first unit. The total surface area of ​​the first pin fin unit is smaller than the total surface area of ​​the second pin fin unit, thereby increasing the heat dissipation of the high heat generation area of ​​the chip corresponding to the downstream flow channel and reducing the heat dissipation of the low heat generation area of ​​the chip corresponding to the upstream flow channel. This efficiently utilizes the heat dissipation of the coolant and increases the temperature uniformity of each area during the actual operation of the chip. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0023] Figure 1 This is a structural diagram of the first surface of the substrate of a liquid cooling plate according to an embodiment of the present invention.

[0024] Figure 2 This is a structural diagram of the second surface of the substrate and the pin fins of the liquid cooling plate of the first embodiment of the present invention.

[0025] Figure 3 This is a structural diagram of the liquid cooling plate with parallel fins and conventional fins according to an embodiment of the present invention.

[0026] Figure 4 This is a structural diagram of a liquid cooling plate with broken fins and conventional fins according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram showing the detachable connection between the pin fins and the substrate of a liquid cooling plate according to an embodiment of the present invention.

[0028] Figure 6 This is a schematic diagram of a fin segment according to an embodiment of the present invention;

[0029] Figure 7 This is a structural diagram of the liquid cooling plate according to the second embodiment of the present invention;

[0030] Figure 8 This is a structural diagram of a liquid cooling plate according to a third embodiment of the present invention.

[0031] Figure label:

[0032] 100, Substrate; 110, Mounting area; 111, First unit; 112, Second unit; 200, Needle wing; 200a, First needle wing unit; 200b, Second needle wing unit; 200c, Third needle wing unit; 200d, Fourth needle wing unit; 210, Conventional wing; 220, Combined wing; 230, Broken wing; 240, Wing segment; 300, Shell. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0035] The liquid cooling plate according to an embodiment of the present invention will be described below.

[0036] like Figures 1 to 8 As shown, the liquid cooling plate in this embodiment of the invention includes a substrate 100 and needle fins 200.

[0037] First, let’s describe the substrate 100. The substrate 100 includes a first surface and a second surface that are opposite to each other. A plurality of mounting areas 110 are formed on the first surface, and an upstream flow channel and a downstream flow channel are formed on the second surface of the substrate 100. Coolant can flow from the upstream flow channel into the downstream flow channel to flow over the second surface of the substrate 100.

[0038] Multiple chips are respectively mounted on multiple mounting areas 110 on the first surface of the substrate 100 (e.g., Figure 1 Two mounting areas 110 are formed in the middle, and the coolant flows from the second surface of the substrate 100, from the upstream channel to the downstream channel (e.g., Figure 1 and Figure 2 The coolant flows from left to right through the channel, thereby dissipating heat from the chip on the first surface of the substrate 100 and reducing the chip temperature.

[0039] Next, the needle fin 200 will be described. The needle fin 200 is disposed on the second surface of the substrate 100 and in the area corresponding to the mounting area 110.

[0040] The finned design increases the heat exchange area between the coolant and the liquid cooling plate, thereby increasing the heat exchange capacity of the liquid cooling plate and thus increasing the heat dissipation of the chip.

[0041] Optionally, the end face of the tip of the needle wing 200 is formed as a polygon, an ellipse, or a circle. It should be noted that the above are merely optional examples, and needle wings of any shape should be understood to be within the scope of this invention.

[0042] The micro-unit includes a first unit 111 and a second unit 112. The heat generation of the heating area of ​​the chip corresponding to the first unit 111 is higher than that of the heating area of ​​the chip corresponding to the second unit 112. The needle fin 200 is formed with a first needle fin unit 200a and a second needle fin unit 200b. The total surface area of ​​the first needle fin unit 200a is smaller than the total surface area of ​​the second needle fin unit 200b. The first needle fin unit 200a is located in the upstream flow channel and is a combination of the needle fin 200 corresponding to the second unit 112. The second needle fin unit 200b is located in the downstream channel and is a combination of the needle fin 200 corresponding to the first unit 111.

[0043] According to the applicant's analysis, the uneven heat dissipation of the chips is caused by the gradual increase in temperature of the fins 200 on the second surface of the substrate 100 corresponding to each chip during the coolant flow process. The increased temperature of the coolant reduces its heat dissipation to the chips located downstream in the coolant flow direction. Moreover, the heat generation of different areas of the chip also varies (for example, there is a significant difference in heat generation between the core heat-generating area of ​​the chip and other areas). Even with uniform cooling, the actual operating temperature of the chips will still differ.

[0044] This application divides the installation area 110 into multiple micro-units of the same area (e.g., Figure 1 The installation area 110 is divided into nine micro-units, including a second unit 112 with lower heat generation (such as...). Figure 1 (the empty area in the middle) and the first unit 111 with higher heat generation (such as the ... Figure 1 (The area filled with diagonal lines in the text).

[0045] The fins 200 form a first fin unit 200a located in the upstream flow channel and corresponding to the second unit 112, and a second fin unit 200b located in the downstream flow channel and corresponding to the first unit 111. The total surface area of ​​the first fin unit 200a is smaller than the total surface area of ​​the second fin unit 200b. This concentrates the heat dissipation of the coolant from the liquid cooling plate on the second unit 112 corresponding to the downstream flow channel, thereby increasing heat dissipation in the high-heat-generating areas of the chip corresponding to the downstream flow channel and reducing heat dissipation in the low-heat-generating areas of the chip corresponding to the upstream flow channel. This efficiently utilizes the heat dissipation of the coolant and increases the temperature uniformity of various areas of the chip.

[0046] like Figure 2 As shown, the number of needles 200 in the first needle wing unit 200a is less than the number of needle wing units 200b, so that the total surface area of ​​the first needle wing unit 200a is less than the total surface area of ​​the second needle wing unit 200b.

[0047] In the above liquid cooling plate, the first surface of the substrate 100 forms multiple mounting areas 110. Each mounting area 110 is divided into multiple micro-units corresponding to multiple heat-generating areas. The micro-units include a first unit 111 with higher heat generation and a second unit 112 with lower heat generation. A pin fin 200 is provided on the second surface of the substrate 100. The pin fin 200 forms a first pin fin unit 200a located in the upstream flow channel and corresponding to the second unit 112, and a second pin fin unit 200b located in the downstream flow channel and corresponding to the first unit 111. The total surface area of ​​the first pin fin unit 200a is smaller than the total surface area of ​​the second pin fin unit 200b, thereby increasing the heat dissipation of the high-heat-generating areas of the chip corresponding to the downstream flow channel and reducing the heat dissipation of the low-heat-generating areas of the chip corresponding to the upstream flow channel. This efficiently utilizes the heat dissipation of the coolant and increases the temperature uniformity of each area during the actual operation of the chip.

[0048] In some embodiments of the present invention, the needle wing 200 includes a broken wing 230, a regular wing 210, and a fused wing 220. The height of the broken wing 230 is lower than that of the regular wing 210. Adjacent regular wings 210 are merged to form a fused wing 220. The first needle wing unit 200a includes the broken wing 230 and / or the fused wing 220, and the second needle wing unit 200b includes only the regular wing 210.

[0049] like Figure 3 As shown, the needle wing 200 includes a fused wing 220 and a conventional wing 210. The fused wing 220 is formed by merging the conventional wings 210. Since the total surface area of ​​the conventional wings 210 is greater than the total surface area of ​​the merged conventional wings 210, for example in 3, two conventional wings 210 are merged to form the fused wing 220. The first needle wing unit 200a includes the fused wing 220, and the second needle wing unit 200b only includes the conventional wings 210, so that the total surface area of ​​the first needle wing unit 200a is smaller than the total surface area of ​​the second needle wing unit 200b.

[0050] like Figure 4 As shown, the needle wing 200 includes a broken wing 230 and a regular wing 210. The height of the broken wing 230 is lower than that of the regular wing 210, so that the surface area of ​​the broken wing 230 is smaller than that of the regular wing 210, thereby making the total surface area of ​​the first needle wing unit 200a smaller than the total surface area of ​​the second needle wing unit 200b.

[0051] In some embodiments of the present invention, the liquid cooling plate further includes at least one housing 300 or block, the bottom end of the housing 300 being open and the rest being closed, the bottom end of the housing 300 or block being connected to the substrate 100 and covering the area in the second surface located in the upstream flow channel and corresponding to the second unit 112.

[0052] like Figure 7 As shown, upstream of the coolant, a housing 300 covers all areas corresponding to the second unit 112. Compared to the multiple pins 200 corresponding to the first unit 111, this effectively reduces the surface area, thereby increasing heat dissipation for the high-heat areas of the chip corresponding to the downstream flow channel and reducing heat dissipation for the low-heat areas of the chip corresponding to the upstream flow channel, thus efficiently utilizing the coolant for heat dissipation.

[0053] For example, by covering the upstream flow channel with a block, and in the area corresponding to the second unit flow channel, the surface area can be reduced and the heat dissipation of this area can be decreased compared to the distribution of multiple needles in this area.

[0054] Optionally, both the block and the housing are detachably connected to the substrate, allowing for easy adjustment of flow resistance or heat dissipation area.

[0055] In some embodiments of the present invention, the needle fin 200 is detachably connected to the substrate 100, and the number of needle fins 200 in the first needle fin unit 200a is less than the number of needle fins 200 in the second needle fin unit 200b.

[0056] like Figure 5 As shown, the pin fin 200 is detachably connected to the substrate 100. The detachable connection of the pin fin 200 to the substrate 100 allows for easy removal or installation of the pin fin 200, thereby precisely reducing the number of pin fins 200 and accurately adjusting the total surface area of ​​the first pin fin unit 200a and / or the total surface area of ​​the second pin fin unit 200b, resulting in a more uniform temperature of the chip.

[0057] Optionally, the pin fin 200 is threaded, interference-fitted, or snap-fitted to the substrate 100.

[0058] The needle fin 200 is threadedly connected to the substrate 100. The needle fin 200 can be removed or installed by screwing it out or screwing it in. The needle fin 200 is interference-fitted with the substrate 100. The needle fin 200 can be removed or installed by pulling it out or inserting it. The needle fin 200 is snap-fitted to the substrate 100. The needle fin 200 can be removed or installed by pulling it out or inserting it.

[0059] In some embodiments of the present invention, the needle wing 200 is composed of multiple wing segments 240, and the broken wing 230 contains fewer wing segments 240 than the conventional wing 210.

[0060] like Figure 6 As shown, the needle fin 200 includes three fin segments 240. By disassembling the fin segments 240, the height of the needle fin 200 can be adjusted more conveniently and precisely, forming a broken fin 230. This allows for precise adjustment of the total surface area of ​​the first needle fin unit 200a and / or the total surface area of ​​the second needle fin unit 200b, resulting in a more uniform temperature distribution on the chip.

[0061] Alternatively, the different fin sections 240 can be connected by threads or snap-fit ​​connections.

[0062] For fins 240 with threaded connections, unscrewing / screwing in fins 240 allows for easy disassembly and installation. For fins 240 with bayonet connections, pulling out / inserting in fins 240 allows for easy disassembly and installation.

[0063] In some embodiments of the present invention, the needle fin 200 further forms a third needle fin unit 200c and a fourth needle fin unit 200d. The first needle fin unit 200a has the smallest total surface area, the second needle fin unit 200b has the largest total surface area, and the third needle fin unit 200c has a larger total surface area than the fourth needle fin unit 200d. The third needle fin unit 200c is a combination of needle fins 200 located in the upstream channel and corresponding to the first unit 111, and the fourth needle fin unit 200d is a combination of needle fins 200 located downstream and corresponding to the second unit 112.

[0064] like Figure 2 , Figure 7 and Figure 8 As shown, the total surface area of ​​the second needle-wing unit 200b is greater than that of the third needle-wing unit 200c, which is greater than that of the fourth needle-wing unit 200d, which is greater than that of the first needle-wing unit 200a.

[0065] In other words, priority is given to the areas of the chip with high heat generation (corresponding to the first unit 111), providing sufficient total heat dissipation surface area (total surface area of ​​the pin fins 200) for heat dissipation. Then, considering the high coolant temperature in the downstream flow channel of the coolant, a larger total heat dissipation surface area (total surface area of ​​the pin fins 200) is provided to compensate. This better meets the requirements for the uniformity of the actual operating temperature of the chip.

[0066] Furthermore, the needle fins 200 are formed into columns of uniform height. The cross-sectional area of ​​the needle fins 200 in the first needle fin unit 200a is smaller than that in the fourth needle fin unit 200d. The cross-sectional area of ​​the needle fins 200 in the fourth needle fin unit 200d is smaller than that in the third needle fin unit 200c. The cross-sectional area of ​​the needle fins 200 in the third needle fin unit 200c is smaller than that in the second needle fin unit 200b.

[0067] By forming a column with a uniform height by means of the needle fins 200, during the assembly of the liquid cooling plate and other heat dissipation plates, the top of the needle fins 200 can be brazed or otherwise connected to other heat dissipation plates, which can make the structure of the needle fins 200 stable and reduce the deformation of the needle fins 200.

[0068] like Figure 8 As shown, the cross-section of the needle fin 200 is circular, and the circular area of ​​the second needle fin unit 200b is greater than that of the third needle fin unit 200c, which is greater than that of the fourth needle fin unit 200d, which is greater than that of the first needle fin unit 200a. This allows for targeted heat dissipation based on the temperature changes of the coolant and the heat-generating areas of the chip, ensuring temperature consistency across all areas during actual chip operation.

[0069] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A liquid-cooled plate, characterized in that, The application relates to a liquid cooling plate, comprising: a substrate, wherein the substrate comprises a first surface and a second surface opposite to each other, the first surface is provided with a plurality of mounting areas, and the second surface is provided with an upstream flow channel and a downstream flow channel, cooling liquid can flow from the upstream flow channel into the downstream flow channel to flow through the second surface of the substrate, pin fins, which are arranged on the second surface of the substrate and correspond to the mounting areas, wherein the plurality of mounting areas are arranged in sequence and are spaced apart along the flow direction of the cooling liquid, the mounting areas comprise a plurality of micro units corresponding to a plurality of heat generating areas of a chip, and the area of each micro unit is consistent, the micro units comprise first units and second units, the heat generating amount of the heat generating area of the chip corresponding to the first units is higher than the heat generating amount of the heat generating area of the chip corresponding to the second units, the pin fins are provided with first pin fin units and second pin fin units, the total surface area of the first pin fin units is smaller than the total surface area of the second pin fin units, the first pin fin units are located in the upstream flow channel and correspond to the pin fins corresponding to the second units, and the second pin fin units are located in the downstream flow channel and correspond to the pin fins corresponding to the first units, the liquid cooling plate further comprises at least one shell or block, the bottom end of the shell is open and the remaining part is closed, and the bottom end of the shell or block is connected to the substrate and covers the area in the second surface of the substrate located in the upstream flow channel and corresponding to the second units, the pin fins further comprise third pin fin units and fourth pin fin units, the total surface area of the first pin fin units is the smallest, the total surface area of the second pin fin units is the largest, the total surface area of the third pin fin units is larger than that of the fourth pin fin units, the third pin fin units are located in the upstream flow channel and correspond to the pin fins corresponding to the first units, and the fourth pin fin units are located in the downstream flow channel and correspond to the pin fins corresponding to the second units.

2. The liquid cold plate of claim 1, wherein, The pin fins comprise broken fins, regular fins and combined fins, the height of the broken fins is lower than that of the regular fins, adjacent regular fins are combined to form the combined fins, the first pin fin units comprise the broken fins and / or the combined fins, and the second pin fin units only comprise the regular fins.

3. The liquid cold plate of claim 1, wherein, The pin fins are detachably connected to the substrate, and the number of the pin fins in the first pin fin units is smaller than that in the second pin fin units.

4. The liquid cold plate of claim 3, wherein, The pin fins are threadedly connected, interference-fitted or buckled to the substrate.

5. The liquid cold plate of claim 2, wherein, The pin fins are combined by a plurality of fin segments, and the number of the fin segments contained in the broken fins is smaller than that contained in the regular fins.

6. The liquid cold plate of claim 5, wherein, The different fin segments are threadedly connected or buckled.

7. The liquid cold plate of claim 1, wherein, The pin fins are formed into columns with consistent heights, the cross-sectional area of the pin fins in the first pin fin units is smaller than that in the fourth pin fin units, the cross-sectional area of the pin fins in the fourth pin fin units is smaller than that in the third pin fin units, the cross-sectional area of the pin fins in the third pin fin units is smaller than that in the second pin fin units.

8. The liquid cold plate of claim 1, wherein, The end surface of the tip of the needle fin is formed in a polygonal shape, an elliptical shape, and a circular shape.

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