Integrated chip heat dissipation device and method based on heat pipe and flow line wing microchannel

Abstract

The application discloses an integrated chip heat dissipation device and method based on a heat pipe and a microchannel of a streamline wing, which comprises a heat dissipation base body and a cover plate, the cover plate is arranged on the heat dissipation base body, a plurality of microchannels parallel to each other are arranged in the heat dissipation base body, each microchannel comprises two oppositely arranged side plates, at least two rows of streamline wings are arranged between the two side plates, and the two rows of streamline wings are arranged in an up-and-down staggered mode; a plurality of heat pipes are embedded in the bottom surface of the heat dissipation base body, the heat pipes extend out of the heat dissipation base body and are connected with a heat lead-out device. The microchannel is provided with two rows of streamline wings arranged in an up-and-down staggered mode, on the basis of dividing and impacting the bottom surface to disturb the thermal boundary layer, cold and hot fluids are fully mixed, so that the fluids have better heat carrying capacity.

Description

Technical Field

[0001] This invention relates to the field of integrated chip heat dissipation technology, and in particular to an integrated chip heat dissipation device and method based on heat pipes and streamlined microchannels. Background Technology

[0002] The statements in this section are merely background information related to the present invention and do not necessarily constitute prior art.

[0003] In many electronic devices, especially high-power, high-performance chips, processors, and servers, the integration of circuits and power consumption are constantly increasing, leading to a significant amount of heat generation. If heat cannot be dissipated effectively and promptly, the temperature will rise rapidly, potentially causing overheating, performance degradation, or even damage. Traditional cooling methods such as fan cooling and heat sink cooling have limited effectiveness and cannot meet the heat dissipation requirements of high-power electronic devices. Microchannel cooling technology has emerged to address this need.

[0004] Microchannels are extremely small channel structures, typically ranging from 10μm to 100μm, usually arranged in parallel. These channels can be straight, curved, or spiral, and their size is typically on the micrometer scale. Coolant flows through microchannels, conducting more heat away through the larger heat dissipation area. Most current microchannel radiators use a flat-bottom design, which leads to the formation of a continuous, thick thermal boundary layer at the bottom as the fluid flows, negatively impacting heat dissipation. Furthermore, to remove more heat, increased pressure loss and pump power are required, but due to the tiny size of the channels, blockage is highly likely. Therefore, current research on microchannel radiators focuses on maximizing heat dissipation efficiency without sacrificing pressure.

[0005] In existing technologies, researchers have proposed microchannels of various shapes for heat dissipation, but pressure loss and heat dissipation performance cannot be balanced. There are cases where both heat dissipation performance and pressure loss increase simultaneously, or neither is significantly improved. Summary of the Invention

[0006] To address the issues of low heat dissipation efficiency and the incompatibility between existing microchannel heat sinks and pressure loss, this invention proposes an integrated chip heat dissipation device and method based on heat pipes and streamlined microchannels. This method improves heat dissipation performance and meets the heat dissipation requirements of high power and high heat flux density without increasing pressure loss and ensuring stable fluid flow through the microchannels.

[0007] In some implementations, the following technical solutions are adopted:

[0008] An integrated chip heat dissipation device based on heat pipes and streamlined wing microchannels includes: a heat dissipation substrate and a cover plate. The cover plate is disposed on the heat dissipation substrate. The heat dissipation substrate has multiple parallel microchannels. Each microchannel includes two oppositely arranged side plates. At least two rows of streamlined wings are arranged between the two side plates. The two rows of streamlined wings are staggered vertically. Multiple heat pipes are embedded in the bottom surface of the heat dissipation substrate. The heat pipes extend out of the heat dissipation substrate and are connected to a heat ducting device.

[0009] In this configuration, each surface of the streamlined airfoil is a rhombus; or, the streamlined airfoil is an ellipsoid.

[0010] The cover plate is provided with a first coolant inlet and a first coolant outlet. The first coolant enters the heat dissipation substrate from the first coolant inlet of the cover plate, flows through each microchannel, enters the confluence area, and then flows out from the first coolant outlet of the cover plate.

[0011] When the first coolant flows through the streamlined airfoil at the bottom, the fluid forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary layer; when the first coolant flows through the streamlined airfoil at the top, the hot and cold fluids mix thoroughly, carrying away more heat.

[0012] The heat exporter is provided with a second coolant inlet and a second coolant outlet, which are located at the same end. Rectangular baffles are staggered vertically at the second coolant outlet section. The rectangular baffles are perpendicular to the flow direction of the coolant, and a coolant outflow channel is formed between the staggered rectangular baffles.

[0013] The heat pipes are arranged perpendicularly to the direction of the microchannels within the heat dissipation substrate. The ends of the heat pipes extend into the inlet section of the heat duct.

[0014] In other embodiments, the following technical solutions are adopted:

[0015] A heat dissipation method for integrated chips based on heat pipes and streamlined microchannels, characterized in that,

[0016] The integrated chip is placed below the heat dissipation substrate. The first coolant enters the heat dissipation substrate from the first coolant inlet of the cover plate, flows through the microchannel with the upper and lower staggered streamlined wings, and then flows out from the first coolant outlet of the cover plate.

[0017] When the first coolant flows through the streamlined airfoil at the bottom, the fluid forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary layer; when the first coolant flows through the streamlined airfoil at the top, the hot and cold fluids mix thoroughly, carrying away more heat.

[0018] The heat pipe at the bottom of the heat dissipation base absorbs some heat from the heat dissipation base, and the heat is transferred to the heat evaporator through the heat pipe, where it exchanges heat with the second coolant inside the heat evaporator.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] (1) This invention uses microchannels to dissipate heat from high-power integrated chips, increasing the heat dissipation area and enabling the removal of more heat, thus improving efficiency compared to traditional water-cooled heat sinks. The microchannels of this invention feature two rows of streamlined fins arranged in an alternating pattern. These fins divert fluid flow to disrupt the thermal boundary layer on the bottom surface, while simultaneously mixing hot and cold fluids, resulting in a better ability to remove heat. Traditional microchannels typically increase resistance to achieve adequate heat dissipation; however, this invention does not lose pressure, allowing fluid to flow stably through the microchannels and eliminating the risk of microchannel blockage caused by pressure loss resulting from improved heat dissipation performance.

[0021] (2) This invention incorporates heat pipe devices embedded in the bottom surface of the heat dissipation substrate, which are perpendicular to the flow direction. Traditional microchannels typically disrupt the formation of a continuous thermal boundary layer at the bottom by altering the bottom shape (e.g., a sawtooth shape). However, this method creates heat accumulation points at the corners, resulting in uneven heat sinking and extremely high temperatures. The heat pipe devices employed in this invention, on the one hand, interrupt the formation of the continuous thermal boundary layer, preventing heat accumulation points and improving the structural heat dissipation capacity of the heat dissipation substrate; on the other hand, the heat pipes absorb some heat, accelerating heat sinking.

[0022] (3) The present invention adds a heat duct at the end of the heat pipe, and the heat at the end of the heat pipe exchanges heat with the coolant in the heat duct. The coolant inlet and outlet of the heat duct are set at the same end, and rectangular baffles are staggered in the outlet direction, so that the heat and coolant can be fully mixed, which promotes the heat pipe end to be fully cooled. The cooling speed is faster and the heat absorption efficiency is higher than that of the traditional heat pipe end.

[0023] Other features and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the heat export path in an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the overall structure of the integrated chip heat dissipation device based on heat pipes and streamlined microchannels in an embodiment of the present invention.

[0026] Figure 3(a) is a schematic diagram of the heat dissipation substrate structure in an embodiment of the present invention;

[0027] Figure 3(b) is a cross-sectional view of AA in Figure 3(a);

[0028] Figure 4 This is a schematic diagram of the streamlined wing microchannel in an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the internal structure of the heat extractor;

[0030] Among them, 1. cover plate, 1.1. first coolant inlet, 1.2. first coolant outlet, 2. heat dissipation base, 2.1. side plate, 2.2. streamlined wing, 3. heat pipe, 4. heat duct, 4.1. second coolant inlet, 4.2. second coolant outlet, 4.3. rectangular partition. Detailed Implementation

[0031] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0032] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0033] Example 1

[0034] In one or more embodiments, an integrated chip heat dissipation device based on heat pipe 3 and streamlined microchannel is disclosed, combined with Figure 1 and Figure 2 Specifically, it includes a heat dissipation substrate 2 and a cover plate 1. The cover plate 1 is disposed on the heat dissipation substrate and connected to the heat dissipation substrate by means of screws, riveting, or bonding. The heat dissipation substrate has multiple parallel microchannels. The cover plate 1 is respectively provided with a first coolant inlet 1.1 and a first coolant outlet 1.2, which are respectively located at both ends of the microchannels. The first coolant enters the heat dissipation substrate 2 from the first coolant inlet 1.1 of the cover plate 1, flows through each microchannel and enters the confluence area, and then flows out from the first coolant outlet 1.2.

[0035] The integrated chip is located below the heat dissipation substrate. After the heat from the integrated chip enters the heat dissipation substrate, it exchanges heat with the first coolant, which can carry away some of the heat.

[0036] Multiple heat pipes 3 are embedded in the bottom surface of the heat dissipation substrate. The heat pipes are arranged perpendicularly to the flow direction of the first coolant in the heat dissipation substrate (i.e., the arrangement direction of the microchannels). The heat pipes extend out of the heat dissipation substrate and are connected to the heat duct 4. The heat absorbed by the heat pipes enters the heat duct 4 and exchanges heat with the second coolant in the heat duct 4, so that the heat carried at the end of the heat pipe is fully cooled.

[0037] In this embodiment, the heat pipe 3 is embedded in the bottom surface of the heat dissipation substrate and is located below the microchannel; the heat pipe 3 is welded to the heat dissipation substrate, and the positions where the heat pipe 3 extends out of the heat dissipation substrate and the positions where the heat pipe 3 extends into the heat exporter 4 are both welded and fixed.

[0038] In this embodiment, the vertical distribution of heat pipe 3 and microchannel can interrupt heat transfer on the bottom surface of the heat dissipation substrate, avoid the formation of a continuous and thick bottom thermal boundary layer, and because the bottom surface of the microchannel is flat, it will not form heat accumulation points, thereby improving the structural heat dissipation capacity of the heat dissipation substrate. On the other hand, heat pipe 3 will absorb some heat, accelerating heat sinking.

[0039] In this embodiment, referring to Figures 3(a)-(b) and Figure 4 Each microchannel includes two opposing side plates 2.1, forming a microchannel between the two side plates 2.1; two rows of streamlined fins 2.2 are provided between the two side plates 2.1; the upper and lower rows are staggered, which can increase the contact time of the fluid and improve the heat dissipation effect; the design of the streamlined fins reduces the flow resistance of the coolant and reduces pressure loss. In this embodiment, the streamlined fins can be the structure shown in the figure, that is, each surface is rhomboid; or they can be other streamlined structures, such as ellipsoids.

[0040] In this embodiment, the streamlined wing 2.2, which is staggered vertically between the microchannels, not only diverts the fluid to impact the bottom surface and disrupts the thermal boundary layer, but also fully mixes the hot and cold fluids. This allows the fluid to have a better ability to carry away heat without losing pressure, and the fluid can pass through the microchannels stably, eliminating the risk of microchannel blockage caused by pressure loss due to improved heat dissipation performance.

[0041] When the fluid flows through the lower streamlined airfoil, it forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary, which helps to remove more heat. When the fluid flows through the upper streamlined airfoil, the hot and cold fluids are fully mixed, which increases the heat absorption capacity and allows it to remove more heat. The upper and lower diamond-shaped airfoils are arranged alternately, making the fluid mixing more uniform.

[0042] In this embodiment, combined with Figure 5The heat exporter 4 is provided with a second coolant inlet and a second coolant outlet. The second coolant inlet 4.1 and the second coolant outlet 4.2 are located at the same end. Rectangular baffles 4.3 are staggered vertically in the second coolant outlet section. The rectangular baffles 4.3 are perpendicular to the flow direction of the second coolant. The staggered rectangular baffles 4.3 form the outlet channel of the second coolant.

[0043] The end of heat pipe 3 extends into the inlet section of heat extractor 4. The second coolant enters heat extractor 4 from the second coolant inlet 4.1, flows through the end of heat pipe 3 and carries away the heat at the end of heat pipe 3; then it enters the outlet section, passes through the vertically intersecting rectangular baffles 4.3, and flows out from the second coolant outlet 4.2.

[0044] The staggered rectangular baffles 4.3 can promote the full exchange of heat between the heat pipe 3 and the second coolant, so that the end of the heat pipe 3 can be fully cooled, improving the heat dissipation efficiency. At the same time, the pressure loss is changed from the traditional microchannel loss to the heat duct 4 with larger channels, avoiding the blockage of the microchannel. Without increasing the pressure loss, the heat dissipation performance can be improved to meet the heat dissipation requirements of high power and high heat flux density.

[0045] It should be noted that the first coolant and the second coolant in this embodiment can be the same coolant or different coolants. Those skilled in the art may choose according to actual needs.

[0046] Example 2

[0047] In one or more embodiments, an integrated chip heat dissipation method based on heat pipe 3 and streamlined microchannel is disclosed, specifically including:

[0048] The integrated chip is placed below the heat dissipation substrate. The first coolant enters the heat dissipation substrate from the first coolant inlet 1.1 of the cover plate 1, flows through the microchannel with the upper and lower interlaced streamlined wings 2.2, and then flows out from the first coolant outlet 1.2 of the cover plate 1.

[0049] When the first coolant flows through the lower streamlined airfoil 2.2, the fluid forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary layer; when the first coolant flows through the upper streamlined airfoil 2.2, the hot and cold fluids mix thoroughly, carrying away more heat.

[0050] The heat pipe 3 at the bottom of the heat dissipation base absorbs some heat from the heat dissipation base, and the heat is transferred to the heat duct 4 through the heat pipe 3, where it exchanges heat with the second coolant in the heat duct 4.

[0051] The second coolant inlet 4.1 and the second coolant outlet 4.2 in the heat ductor 4 are located at the same end. The second coolant enters from the second coolant inlet 4.1, passes through the channel formed by the vertically intersecting rectangular baffles 4.3 of the outlet section, and flows out from the second coolant outlet 4.2.

[0052] The specific effects of the above process are the same as those in Example 1, and will not be repeated here.

[0053] While the specific embodiments of the present invention have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solutions of the present invention are still within the scope of protection of the present invention.

Claims

1. An integrated chip heat dissipation device based on heat pipes and streamlined microchannels, characterized in that, include: The heat dissipation substrate and the cover plate are provided. The cover plate is set on the heat dissipation substrate. The heat dissipation substrate has multiple parallel microchannels. Each microchannel includes two oppositely arranged side plates. At least two rows of streamlined wings are provided between the two side plates. The two rows of streamlined wings are staggered vertically. When the first coolant flows through the streamlined airfoil at the bottom, the fluid forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary layer; when the first coolant flows through the streamlined airfoil at the top, the hot and cold fluids mix thoroughly, carrying away more heat. Multiple heat pipes are embedded in the bottom surface of the heat dissipation substrate and are located below the microchannels; the heat pipes are arranged perpendicularly to the direction of the microchannels inside the heat dissipation substrate; the heat pipes extend out of the heat dissipation substrate and are connected to the heat ductor; the ends of the heat pipes extend into the inlet section of the heat ductor. The heat exporter is provided with a second coolant inlet and a second coolant outlet, which are located at the same end. Rectangular baffles are staggered vertically at the second coolant outlet section. The rectangular baffles are perpendicular to the flow direction of the coolant, and a coolant outflow channel is formed between the staggered rectangular baffles.

2. The integrated chip heat dissipation device based on heat pipes and streamlined microchannels as described in claim 1, characterized in that, Each surface of the streamlined airfoil is a rhombus.

3. The integrated chip heat dissipation device based on heat pipes and streamlined microchannels as described in claim 1, characterized in that, The streamlined airfoil is ellipsoidal.

4. The integrated chip heat dissipation device based on heat pipes and streamlined microchannels as described in claim 1, characterized in that, The cover plate is provided with a first coolant inlet and a first coolant outlet. The first coolant enters the heat dissipation substrate from the first coolant inlet of the cover plate, flows through each microchannel, enters the confluence area, and then flows out from the first coolant outlet of the cover plate.

5. A method for heat dissipation of an integrated chip based on heat pipes and streamlined microchannels, employing the integrated chip heat dissipation device based on heat pipes and streamlined microchannels as described in any one of claims 1-4, characterized in that, The integrated chip is placed below the heat dissipation substrate. The first coolant enters the heat dissipation substrate from the first coolant inlet of the cover plate, flows through the microchannel with the upper and lower staggered streamlined wings, and then flows out from the first coolant outlet of the cover plate. When the first coolant flows through the streamlined airfoil at the bottom, the fluid forms a downward force, impacting the thermal boundary layer formed at the bottom and disrupting the formation of a continuous thermal boundary layer; when the first coolant flows through the streamlined airfoil at the top, the hot and cold fluids mix thoroughly, carrying away more heat. The heat pipe at the bottom of the heat dissipation base absorbs some heat from the heat dissipation base, and the heat is transferred to the heat evaporator through the heat pipe, where it exchanges heat with the second coolant in the heat evaporator.

6. The integrated chip heat dissipation method based on heat pipes and streamlined microchannels as described in claim 5, characterized in that, The second coolant inlet and the second coolant outlet in the heat exporter are located at the same end. The second coolant enters from the second coolant inlet, passes through the channel formed by the vertically staggered rectangular baffles of the outlet section, and flows out from the second coolant outlet.

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