Multi-column radio frequency chip linking belt, radio frequency chip roll and rolling method

Abstract

The application discloses a multi-column radio frequency chip link belt, a radio frequency chip roll and a winding method, and belongs to the technical field of radio frequency wafer technology. The radio frequency chip roll comprises a chip link belt disc and a plurality of multi-column radio frequency chip link belts wound on the chip link belt disc. The plurality of multi-column radio frequency chip link belts are sequentially spliced to form a long belt. The multi-column radio frequency chip link belt is formed by cutting a radio frequency chip wafer, and the width of the multi-column radio frequency chip link belt is 15mm-25mm. A plurality of columns of radio frequency chips are arranged on the multi-column radio frequency chip link belt. In the winding process of the radio frequency chip roll, the multi-column radio frequency chip link belt is prepared first, then the long belt is formed by sequentially connecting the plurality of multi-column radio frequency chip link belts, and finally the radio frequency chip roll is formed by winding. In the application, the running range in the process of wafer cutting is far less than the running range of a traditional wafer, the chip binding and packaging process can be simplified, the corresponding processing efficiency is improved, the servo dynamic range of a radio frequency chip packaging device can be reduced, the cost of the binding and packaging device is reduced, the traditional dispensing process can be avoided, and excellent economic benefits are achieved.

Description

Technical Field

[0001] This invention relates to the field of radio frequency wafer technology, and more specifically, to a multi-column radio frequency chip linker, a radio frequency chip roll, and a roll-up method. Background Technology

[0002] Traditional wafer structures involve bonding silicon wafer disks to a wafer backing film connected by wafer steel rings, followed by dicing. Radio frequency (RF) chips in these wafers are only 0.4mm × 0.4mm × 0.1mm in size, with over 100,000 RF chips on an 8-inch wafer and over 250,000 on a 12-inch wafer. However, existing wafer structures have a series of drawbacks:

[0003] 1. Traditional RF chip wafer arrangement results in a large servo dynamic range during the chip removal process.

[0004] In the process of packaging RF chips onto RF antennas, wafers need to be mounted on a chip packaging machine. Chips and wafer films are then individually removed from the wafers and attached to the antenna, which is coated with anisotropic conductive resin. Therefore, the wafer servo movement range of the RF chip packaging (bonding) machine must be greater than the wafer diameter. Specifically, the longitudinal and lateral servo ranges of the RF chip packaging (bonding) machine must be greater than 200mm × 200mm (8-inch wafer) or 300mm × 300mm (12-inch wafer), with a servo accuracy of ±10μm to 15μm. Clearly, the high servo dynamic range and accuracy result in a very high price for RF chip packaging machines, making equipment depreciation and operating costs a significant factor in the high cost of RFID tags.

[0005] 2. Traditional RF chip wafer arrangement leads to high costs in the dispensing process.

[0006] Traditional RF chip packaging machines require dispensing adhesive onto the chips removed from the wafer. Each chip is dispensed once. Because the amount of adhesive dispensed is small and the positioning accuracy requirement is high, the dispensing machine and dispensing control system are extremely expensive, resulting in high cost of RF chip packaging and high equipment depreciation.

[0007] 3. The single-row RF chip chain makes the chip pulling process difficult.

[0008] Since the size of radio frequency chips is as small as 0.4mm to 0.5mm, and the width of a single row of chips is only 0.5mm and the thickness of the wafer film is 0.05mm, it is obvious that the tensile strength of a single row of radio frequency chip conveyors is extremely weak and does not meet the tensile strength requirements for transporting chips. Therefore, a single row of radio frequency chip conveyors is not feasible.

[0009] Due to the widespread application of radio frequency (RF) technology, there is an urgent need for technologies that can reduce the packaging cost of RF chips. Summary of the Invention

[0010] To overcome the shortcomings of existing technologies, this invention provides a multi-column RF chip linking strip, an RF chip roll, and a roll-up method.

[0011] The technical solution of this invention is as follows:

[0012] On one hand, the present invention provides a multi-column radio frequency chip link strip, which is formed by cutting radio frequency chip wafers, and each multi-column radio frequency chip link strip has a width of 15mm to 25mm, and has several columns of radio frequency chips on it, each radio frequency chip having a volume of 0.4mm × 0.4mm × 0.1mm.

[0013] On the other hand, the present invention also prepares an RF chip roll by means of multiple rows of RF chip linking strips, wherein several multiple rows of RF chip linking strips are wound on a chip chain reel, and several of the multiple rows of RF chip linking strips are spliced ​​together in sequence to form a long strip, and two adjacent multiple rows of RF chip linking strips are bonded together by transparent tape.

[0014] The outermost multi-column RF chip link strip is connected to a lead strip on its outer side, and the innermost multi-column RF chip link strip is connected to a lead strip on its inner side.

[0015] To reduce changes in mechanical stability when chips are bent in a multi-column RF chip chain, the inner diameter of the chip chain reel in this invention is greater than 140mm.

[0016] In the above-mentioned process of preparing the RF chip roll, multiple rows of RF chip linking tapes are first prepared, then several of these multiple rows of RF chip linking tapes are sequentially connected to form a long tape, and then the long tape is wound onto a chip chain reel to form an RF chip roll. Leads are connected to the innermost and / or outermost sides of the long tape.

[0017] According to the above-described scheme, the beneficial effects of this invention are that the operating range of the multi-row RF chip link strip in the chip removal process is much smaller than that of the traditional wafer operating range, which can simplify the chip bonding and packaging process and improve the corresponding processing efficiency. At the same time, this invention can reduce the servo dynamic range in the RF chip packaging equipment, reduce the cost of the bonding and packaging equipment, and eliminate the traditional dispensing process, which has excellent economic benefits. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a traditional radio frequency chip wafer;

[0019] Figure 2 This is a schematic diagram of the structure of the multi-column radio frequency chip link strip in this invention;

[0020] Figure 3 This is a schematic diagram showing the connection of multiple rows of radio frequency chips in the invention.

[0021] Figure 4 This is a schematic diagram of the structure of the radio frequency chip roll in this invention.

[0022] In the diagram, the labels for each item are as follows:

[0023] 1. Multi-row RF chip linker; 2. Chip area; 2-1. RF chip; 3. Wafer film; 4. Wafer steel tray; 5. Transparent tape; 6. Chip linker tray; 7. Lead-in tape. Detailed Implementation

[0024] The present invention will now be further described with reference to the accompanying drawings and embodiments:

[0025] like Figure 1 As shown, in a traditional radio frequency (RF) chip wafer, a wafer film 3 is disposed on a wafer steel 4 disk, and a chip region 2 is disposed in the center of the wafer film 3. Several RF chips 2-1 are arranged in an array within the chip region 2. The volume of the RF chip 2-1 is 0.4mm × 0.4mm × 0.1mm. Therefore, more than 100,000 RF chips are disposed on an 8-inch wafer, and more than 25 RF chips are disposed on a 12-inch wafer.

[0026] like Figures 1 to 4 As shown, in order to solve the difficulties in the traditional wafer structure processes such as wafer removal and dispensing, and to increase the tensile strength of RF chips, the present invention provides a multi-column RF chip linker, an RF chip roll composed of the multi-column RF chip linker, and a method for rolling the RF chip roll.

[0027] A multi-row RF chip link strip 1 is provided, which is formed by dicing an RF chip wafer. The width of the multi-row RF chip link strip is 15mm to 25mm. In a specific embodiment, the width of the multi-row RF chip link strip can be selected as 20mm. For example, an 8-inch wafer can be diced to form 10 multi-row RF chip link strips, or a 12-inch wafer can be diced to form 15 multi-row RF chip link strips.

[0028] Each multi-column RF chip link strip contains several columns of RF chips. Therefore, the multi-column RF chip link strip can realize the integrated arrangement of RF chips, reduce the size of the wafer, and reduce the range of servo movement during RF chip picking. In addition, since each multi-column RF chip link strip contains multiple columns of RF chips, the overall tensile strength of the link strip meets the requirements of the transmission chip.

[0029] Furthermore, this invention can also be used to fabricate a roll of radio frequency chips by connecting several multi-column radio frequency chip links. For example... Figure 3 , Figure 4As shown, the RF chip roll includes a chip chain reel 6 and several multi-column RF chip linking strips 1 wound on the chip chain reel 6. The several multi-column RF chip linking strips 1 are spliced ​​together in sequence to form a long strip.

[0030] To ensure the integrity of the entire chain, adjacent multi-column RF chip linking strips 1 are bonded together, and the length of the entire chain can be adjusted as needed. In this invention, adjacent multi-column RF chip linking strips 1 are bonded together with transparent tape 5.

[0031] In order to reduce the change in the mechanical properties of the connection between the RF chip 2-1 and the back film caused by the bending of the multi-row RF chip link 1 during the winding process, the winding inner diameter of the chip link reel in this invention is greater than 140mm, so that the bending curvature of the innermost winding multi-row RF chip link meets the relevant performance requirements of the RF chip.

[0032] To facilitate the installation of the rolled multi-column RF chip linker onto the RF chip packaging machine, in this invention, the outermost multi-column RF chip linker is connected to a lead-in strip, or the innermost multi-column RF chip linker is connected to a lead-in strip. Alternatively, the rolled multi-column RF chip linker may have corresponding lead-in strips on both the inner and outer sides.

[0033] This invention also provides a method for forming a roll of radio frequency (RF) chips, which is used to fabricate RF chip wafers into a rolled RF chip roll. The method specifically includes:

[0034] (1) Prepare multi-column radio frequency chip linker bands.

[0035] Determine the cutting width of the RF chip wafer and cut multiple rows of RF chip chains on the wafer film of the RF chip wafer.

[0036] (2) Several multi-column radio frequency chip link strips are connected in sequence to form a long strip.

[0037] The ends of the cut-off multiple rows of RF chip links are connected sequentially to form a long, complete chain.

[0038] (3) The long strip is wound onto the chip chain reel to form an RF chip roll.

[0039] Prepare a chip chain reel and wind the long, complete chain onto it. Before or during winding, install guide belts on the long, complete chain. Specifically, guide belts can be connected to the innermost and / or outermost sides of the long chain to form a chain with guide belts.

[0040] During the chip removal process of the radio frequency chip roll of the present invention:

[0041] During the bonding and packaging of RF chips, the multi-column RF chip connecting strip moves horizontally by one column by 15mm to 25mm (e.g., 20mm) to remove the RF chips one by one from the multi-column RF chip connecting strip and package them onto the RF antenna. After the removal and placement of one column of RF chips is completed, the multi-column RF chip connecting strip moves vertically forward by the size of one RF chip to complete the removal and placement of the RF chips in that column. This process is repeated until all RF chips are removed and placed.

[0042] This invention has the following advantages:

[0043] 1. Reduced the difficulty of the RF chip removal process.

[0044] The width of the multi-row RF chip linker is 15mm to 25mm. When RF chips are removed from the multi-row RF chip linker one by one, the operating range of the multi-row RF chip linker is smaller than the wafer movement range in traditional RF chip packaging equipment (200mm×200mm (8-inch wafer) or 300mm×300mm (12-inch wafer)). This simplifies the RF chip bonding and packaging process and makes it more efficient.

[0045] Meanwhile, this invention can reduce the servo dynamic range in RF chip packaging equipment, significantly reducing the cost of RF chip bonding and packaging equipment. Taking an 8-inch wafer as an example, the servo dynamic range can be reduced from the original lateral (chain width direction) 200mm to 15mm-25mm, and the original longitudinal (chain length direction) 200mm to 0.5mm.

[0046] 2. Say goodbye to dispensing machines and create conditions for new chip chain adhesive coating processes.

[0047] The width of the multi-row RF chip linker is 15mm to 25mm. It can apply adhesive to the chain roller of the multi-row RF chip linker, which improves the working efficiency of RF chip packaging, eliminates the need for expensive dispensing machines in traditional chip packaging machines, and significantly reduces the cost of chip bonding and packaging equipment.

[0048] 3. Increased the tensile strength of the chain during the RF chip pulling process.

[0049] The multi-column RF chip linker in this invention contains multiple columns of RF chips arranged side by side, and the width of the multi-column RF chip linker is 15mm to 25mm. This can improve the tensile strength of the linker during chip transmission and separation, and increase the automated chip transmission capability of the multi-column RF chip linker.

[0050] 4. Saves costs and increases economic benefits

[0051] The multi-column RF chip linker in this invention changes the structure and corresponding process flow of the RF chip packaging and bonding machine, reducing the cost of RF chip packaging equipment by about 70% and significantly reducing equipment depreciation costs. At the same time, the cost of packaging each RF chip is reduced by about 0.02 yuan, and the cost of producing 100 million RF tags is reduced by about 2 million yuan. This allows the investment cost of the chip linker packaging machine to be recovered in the same year, which is conducive to promoting the widespread application of RF tags.

Claims

1. A radio frequency chip-on-foil, characterized by, The device includes a chip chain reel on which several multi-column radio frequency chip linking tapes are wound. The multiple multi-column radio frequency chip linking tapes are sequentially spliced ​​together to form a long tape. Adjacent two multi-column radio frequency chip linking tapes are bonded together with transparent tape. The inner diameter of the chip chain reel is greater than 140mm. The multi-column RF chip link strip is formed by cutting RF chip wafers. The width of the multi-column RF chip link strip is 15mm to 25mm, and several columns of RF chips are arranged on it.

2. The radio frequency chip roll of claim 1, wherein, The outermost multi-column RF chip link strip is connected to a lead strip; And / or, the innermost multi-column RF chip link strip is connected to a lead strip.

3. The radio frequency chip roll according to claim 1, wherein the width of the multi-column radio frequency chip link strip is 20 mm.

4. The multi-column RF chip link strip according to claim 1 or 3, characterized in that, The radio frequency chip has a size of 0.4mm × 0.4mm × 0.1mm.

5. A method for rolling up an RF chip roll according to any one of claims 1-4, characterized in that, include: Fabrication of multi-column RF chip linkers; Several of the aforementioned multi-column RF chip link strips are sequentially connected to form a long strip; The long strip is wound onto the chip chain reel to form an RF chip roll.

6. The method for rolling up radio frequency chip rolls according to claim 5, characterized in that, Before winding the long strip onto the chip chain reel, a lead belt is connected to the innermost and / or outermost side of the long strip.

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