Light-emitting module and display device

Abstract

The application relates to the technical field of display, and discloses a light-emitting module and a display device, the light-emitting module comprising: a circuit board substrate; a plurality of pad units, each pad unit comprising a plurality of pads, each pad comprising a connecting portion, and each pad unit comprising a plurality of connecting portion groups, each connecting portion group comprising two connecting portions, and the two connecting portions in each connecting portion group being located at two adjacent pads respectively; a protective layer comprising a plurality of hollow portions, each hollow portion exposing a corresponding connecting portion group; a plurality of light-emitting chips, the positive electrode and the negative electrode of each light-emitting chip being electrically connected to different connecting portions in a corresponding connecting portion group respectively; a plurality of driving chips, at least two pad units being electrically connected to different driving chips; and the shapes of the connecting portions in at least two pad units electrically connected to different driving chips being different. The application effectively solves the problem that the driving chip to which an abnormal light-emitting chip belongs cannot be quickly identified and positioned in the prior art.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a light-emitting module and a display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) and Mini LED (Mini Light Emitting Diode) technologies miniaturize and matrix traditional light-emitting diodes to address and drive each pixel, reducing individual pixels and pixel pitch to the micrometer level. Displays fabricated using this technology offer advantages such as high brightness, wide color gamut, high resolution, energy saving, and fast response. This technology also enables local dimming design for direct-lit backlights, allowing for the partitioning of LED modules into multiple dimming zones. Each dimming zone includes multiple LED chips; for example, each zone may contain 3×3 or 6×6 LED chips. This local dimming achieves a high dynamic range screen effect, resulting in a more detailed image, and also provides a high-brightness surface light source, enhancing module brightness.

[0003] The basic structure of Micro LED and Mini LED panels involves mounting LED chips onto a wired substrate. A driver chip controls the LED chips via circuitry on the substrate to achieve surface light sources and local dimming effects. Current Micro LED and Mini LED panels contain a large number of LED chips, typically using different driver chips to drive LED chips in different zones. When an LED chip malfunctions, it is difficult to quickly identify and locate the driver chip to which the malfunctioning LED chip belongs. Summary of the Invention

[0004] In view of this, the present invention provides a light-emitting module and a display device, which effectively solves the problem in the prior art that it is impossible to quickly identify and locate the driver chip to which an abnormal light-emitting chip belongs.

[0005] This invention provides a light-emitting module, comprising: a circuit board substrate; multiple pad units located on one side of the circuit board substrate, each pad unit including multiple pads, each pad including a connection portion, and each pad unit further including multiple connection portion groups, each connection portion group including two connection portions, wherein the two connection portions in the same connection portion group are respectively located on two adjacent pads; a protective layer located on the side of the pad units away from the circuit board substrate, the protective layer including multiple cutout portions, the cutout portions corresponding to the connection portion groups, the cutout portions exposing their corresponding connection portion groups; multiple light-emitting chips, each light-emitting chip corresponding to a connection portion group, each light-emitting chip having a positive electrode and a negative electrode, the positive electrode and the negative electrode being electrically connected to different connection portions in their corresponding connection portion groups; and multiple driver chips, at least two pad units being electrically connected to different driver chips; the shapes of the connection portions in at least two pad units electrically connected to different driver chips are different.

[0006] Based on the same idea, the present invention also provides a display device, including the light-emitting module provided by the present invention.

[0007] Compared with the prior art, the light-emitting module and display device provided by the present invention achieve at least the following beneficial effects:

[0008] The light-emitting module provided by this invention features pad units on a circuit board substrate. Each pad unit constitutes a package module. Simply calling the module allows for the placement of each light-emitting chip to its target position, reducing the number of times circuit design software calls are needed, lowering the requirements for computer hardware configuration, and reducing costs. Furthermore, at least two pad units electrically connected to different driver chips have different shapes in their connection groups. When a light-emitting chip malfunctions in the light-emitting module, the damaged chip can be removed, exposing the connection group electrically connected to it. By observing the shape of the connection group, it is possible to quickly identify which driver chip controls the light-emitting chip.

[0009] Of course, any product implementing this invention need not necessarily achieve all of the technical effects described above at the same time.

[0010] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0011] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0012] Figure 1 This is a planar schematic diagram of a light-emitting module provided by the present invention;

[0013] Figure 2 yes Figure 1 A cross-sectional view of the light-emitting module along A-A';

[0014] Figure 3 yes Figure 1 A planar schematic diagram of the light-emitting module without a light-emitting chip;

[0015] Figure 4 yes Figure 3 An enlarged schematic diagram of section B in the middle;

[0016] Figure 5 yes Figure 3 An enlarged schematic diagram of section C in the middle;

[0017] Figure 6 yes Figure 1 A partial planar schematic diagram of a pad unit in the light-emitting module;

[0018] Figure 7 yes Figure 6 An enlarged schematic diagram of section D in the middle;

[0019] Figure 8 yes Figure 1 A partial planar schematic diagram of a first pad unit in the light-emitting module;

[0020] Figure 9 yes Figure 8 An enlarged schematic diagram of section E in the middle;

[0021] Figure 10 yes Figure 1 A partial planar schematic diagram of a second pad unit in the light-emitting module;

[0022] Figure 11 yes Figure 10 An enlarged schematic diagram of section F in the middle;

[0023] Figure 12 yes Figure 1 A partial structural diagram of another second pad unit in the light-emitting module;

[0024] Figure 13 This is a schematic diagram of the planar structure of a display device provided by the present invention. Detailed Implementation

[0025] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0026] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0027] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0028] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0030] Figure 1 This is a planar schematic diagram of a light-emitting module provided by the present invention. Figure 2 yes Figure 1 A cross-sectional view of the light-emitting module along line A-A'. Figure 3 yes Figure 1 A planar schematic diagram of the light-emitting module without a light-emitting chip. Figure 4 yes Figure 3 An enlarged schematic diagram of section B in the middle. Figure 5 yes Figure 3 An enlarged schematic diagram of section C, for reference. Figures 1-5 This embodiment provides a light-emitting module, which includes:

[0031] Circuit board substrate 10;

[0032] Multiple pad units 20 are located on one side of the circuit board substrate 10. Each pad unit 20 includes multiple pads 21, each pad 21 includes a connection portion 211. The pad unit 20 also includes multiple connection portion groups 210, each connection portion group 210 including two connection portions 211. In the same connection portion group 210, the two connection portions 211 are located on two adjacent pads 21.

[0033] The protective layer 30 is located on the side of the pad unit 20 away from the circuit board substrate 10. The protective layer 30 includes a plurality of cutouts 31, which correspond to the connection group 210 and expose the corresponding connection group 210.

[0034] Multiple light-emitting chips 40 are provided, and each light-emitting chip 40 corresponds to a connection group 210. Each light-emitting chip 40 has a positive electrode 41 and a negative electrode 42. The positive electrode 41 and the negative electrode 42 are electrically connected to different connection portions 211 in the corresponding connection group 210.

[0035] Multiple driver chips 50, and at least two pad units 20 are electrically connected to different driver chips 50;

[0036] The shapes of the connecting portions 211 in the connecting portion group 210 of at least two pad units 20 electrically connected to different driver chips 50 are different.

[0037] Specifically, the light-emitting module provided in this embodiment includes a circuit board substrate 10. Optionally, the circuit board substrate 10 includes a substrate and a circuit structure integrated on the substrate, wherein the substrate is a PCB substrate.

[0038] The light-emitting module also includes pad units 20, a protective layer 30, and multiple light-emitting chips 40 disposed on the circuit board substrate 10. Each pad unit 20 includes multiple pads 21, which are insulated from each other. Each pad 21 includes a connection portion 211. The pad unit 20 also includes multiple connection portion groups 210, each group comprising two connection portions 211. The two connection portions 211 in the same connection portion group 210 are located on adjacent pads 21, meaning that connection portions 211 of adjacent pads 21 form a connection portion group 210. The protective layer 30 is located on the side of the pad unit 20 away from the circuit board substrate 10, covering the pads 21 and providing sealing protection. The protective layer 30 is made of an insulating material, ensuring that the pads 21 remain insulated from each other when the protective layer 30 covers them. The cutout portion 31 in the protective layer 30 corresponds to the connecting portion group 210, exposing the corresponding connecting portion group 210. The light-emitting chip 40 corresponds one-to-one with the connecting portion group 210. The light-emitting chip 40 has a positive electrode 41 and a negative electrode 42. Because the cutout portion 31 exposes the connecting portion group 210, the positive electrode 41 and negative electrode 42 in the light-emitting chip 40 can be electrically connected to different connecting portions 211 in their corresponding connecting portion groups 210, thereby enabling the positive electrode 41 and negative electrode 42 in the light-emitting chip 40 to be electrically connected to different pads 21.

[0039] In existing technologies, the design efficiency of light-emitting modules is relatively low. This is because the numerous light-emitting chips in the light-emitting module need to be positioned and placed one by one, which requires the computer to make more adjustments. This results in high requirements for the computer hardware configuration used in the corresponding design, leading to increased costs.

[0040] In the light-emitting module provided in this embodiment, pad units 20 are set on the circuit board substrate 10. Each pad unit 20 constitutes a packaging module. Only by calling the module can each light-emitting chip 40 be placed in the target position, which helps to reduce the number of times the circuit design software is called, reduces the configuration requirements of computer hardware equipment, and reduces costs.

[0041] The light-emitting module also includes multiple driver chips 50 disposed on the circuit board substrate 10. The driver chips 50 can be electrically connected to the pads 21 through the circuit structure in the circuit board substrate 10, thereby enabling the driver chips 50 to transmit signals to the light-emitting chips 40. At least two pad units 20 are electrically connected to different driver chips 50, that is, there are two different pad units 20 that are electrically connected to different driver chips 50 respectively. Correspondingly, the light-emitting chips 40 electrically connected to the pads 21 in the two different pad units 20 are controlled by different driver chips 50.

[0042] In the existing technology, because there are a large number of light-emitting chips in the light-emitting module, when a light-emitting chip malfunctions, it is impossible to quickly identify which driver chip controls the malfunctioning light-emitting chip.

[0043] In the light-emitting module provided in this embodiment, the shapes of the connecting portions 211 in the connecting portion groups 210 of at least two pad units 20 electrically connected to different driver chips 50 are different, that is, the shapes of the connecting portions 211 in the connecting portion groups 210 of pad units 20 electrically connected to different driver chips 50 are different. For example, driver chip 50a is electrically connected to pad 21 in pad unit 20a, and driver chip 50b is electrically connected to pad 21 in pad unit 20b. The shapes of the connecting portions 211 in the connecting portion groups 210 of pad unit 20a and pad unit 20b are different. When a light-emitting chip 40 malfunctions in the light-emitting module, the damaged light-emitting chip 40 can be removed, thereby exposing the connecting portion groups 210 electrically connected to the light-emitting chip 40. By observing the shape of the connecting portions 211 in the connecting portion groups 210, it is possible to quickly identify and locate which driver chip 50 controls the light-emitting chip 40.

[0044] It should be noted that the shape of the connecting portion 211 in the connecting portion group 210 refers to the shape formed by two connecting portions 211 in the connecting portion group 210. For example, the fact that the connecting portions 211 in two connecting portion groups 210 have the same shape means that the shape formed by two connecting portions 211 in one connecting portion group 210 is the same as the shape formed by two connecting portions 211 in another connecting portion group 210, and does not mean that the shapes of each connecting portion 211 (i.e., all four connecting portions 211) in the two connecting portion groups 210 are the same. In this invention, the relevant descriptive methods also apply.

[0045] Optionally, the material of the pad 21 is a metal material. For example, the material of the pad 21 may be copper, so that the shape of the connection portion 211 in the connection portion assembly 210 can be easily observed by visual inspection.

[0046] It should be noted that the light-emitting module provided by this invention can be used as a backlight module in a display device to provide a display light source for the display panel in the display device. When used as a backlight for the display panel, it not only enables local dimming technology but also helps to reduce the module size while improving the display effect. This embodiment does not specifically limit the usage of the light-emitting module; in specific implementation, it can be selected and set according to actual needs.

[0047] It should be further noted that the light-emitting module in this embodiment may also include other structures. The figures in this embodiment only illustrate the structures related to the technical solution of this embodiment. In specific implementation, the structure of the light-emitting module includes, but is not limited to, these structures. It may also include, for example, signal traces in the light-emitting module. For details, please refer to the structure of the light-emitting module in related technologies for understanding. This embodiment will not elaborate on this aspect here.

[0048] Optionally, the light-emitting chip 40 is a Mini LED chip or a Micro LED chip.

[0049] Specifically, when a Mini LED chip is selected as the light-emitting chip 40 of the light-emitting module in this embodiment of the invention, the Mini LED chips can be arrayed on the circuit board substrate 10 to make the light-emitting module a direct-lit backlight. Mini LED chips, also known as sub-millimeter light-emitting diodes, refer to LEDs with a chip size between approximately 50 micrometers and 200 micrometers. Using Mini LED chips to form the light-emitting chip 40 provided in this embodiment of the invention results in high yield, irregular shape cutting characteristics, and the ability to form a highly curved backlight when combined with a flexible substrate, offering better color rendering. When applied to display devices, it can provide more refined HDR (High Dynamic Range) partitioning for the display panel. This invention can also select a Micro LED chip as the light source for the light-emitting module in this invention. Micro LED chips are LED chips with a chip size of less than 50 micrometers, capable of achieving displays with pixel particles of 0.05 millimeters or smaller. Micro LED chips have very low power consumption, good material stability, and no image retention.

[0050] Continue to refer to Figures 1-5 In some alternative embodiments, the connection portion 211 in the connection portion group 210 of the pad unit 20 electrically connected to the same driver chip 50 has the same shape.

[0051] Specifically, in the pad unit 20 electrically connected to the same driver chip 50, the shapes of the connecting portions 211 in each connecting portion group 210 are the same. That is, in the pad unit 20 electrically connected to the same driver chip 50, the shapes of the connecting portions 211 in each connecting portion group 210 are arranged in the same way. At the same time, the shapes of the connecting portions 211 in the connecting portion group 210 of the pad unit 20 electrically connected to different driver chips 50 are different. This allows for quick identification and positioning of the driver chip 50 electrically connected to it by observing the shape of the connecting portion 211 in the connecting portion group 210, while also simplifying the design of the pad unit 20 and reducing production costs.

[0052] It should be noted that the driver chip 50 can correspond one-to-one with the pad unit 20, and one driver chip 50 can also correspond to multiple pad units 20. This invention does not make specific limitations in this regard and can be set according to actual production needs.

[0053] Continue to refer to Figures 1-5 In some alternative embodiments, the pad unit 20 includes a first pad 213 and a second pad 214, the first pad 213 and the second pad 214 extending along a first direction X and arranged along a second direction Y, wherein the first direction X and the second direction Y intersect.

[0054] The pad unit 20 also includes at least two pad groups 215 located between the first pad 213 and the second pad 214, the pad groups 215 being arranged along a first direction X, and the pad groups 215 including at least two third pads 216 being arranged along a second direction Y.

[0055] Along the second direction Y, the connection portion 211 in the first pad 213 is located on the side of the first pad 213 near the pad group 215, and the connection portion 211 in the second pad 214 is located on the side of the second pad 214 near the pad group 215.

[0056] Along the second direction Y, the connection portion 211 of the third pad 216 is located on both sides of the third pad 216.

[0057] Specifically, the pad unit 20 includes a first pad 213, a second pad 214, and at least two pad groups 215. The first pad 213 and the second pad 214 extend along a first direction X and are arranged along a second direction Y. The pad groups 215 are located between the first pad 213 and the second pad 214 and are arranged along the first direction X. The pad groups 215 include at least two third pads 216 arranged along the second direction Y. The first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular. That is, a pad unit 20 includes at least six pads 21.

[0058] Along the second direction Y, the connection portion 211 in the first pad 213 is located on the side of the first pad 213 near the pad group 215, and the connection portion 211 in the second pad 214 is located on the side of the second pad 214 near the pad group 215. Along the second direction Y, the connection portion 211 of the third pad 216 is located on both sides of the third pad 216. Thus, the connection portion 211 in the first pad 213 and the connection portion 211 of the adjacent third pad 216 are correspondingly arranged to form a connection portion group 210, and the connection portion 211 in the second pad 214 and the connection portion 211 of the adjacent third pad 216 are correspondingly arranged. A connection group 210 is formed. The connection portion 211 of the third pad 216 in the same pad group 215 and the connection portion 211 of the adjacent third pad 216 form a connection group 210. This allows a larger number of connection groups 210 to be formed in the pad unit 20 by reducing the number of pads 21, thereby enabling the connection of a larger number of light-emitting chips 40. Thus, when the size of the light-emitting module remains unchanged, the number of pads 21 can be reduced when connecting the same number of light-emitting chips 40, which helps to reduce the number of connection design steps between the pads 21 and the connecting lines and improves design efficiency.

[0059] For example, when the pad unit 20 includes six pads 21, six connection groups 210 can be formed, thereby connecting six light-emitting chips 40. Of course, it is understood that in other embodiments of the present invention, the number of pads 21 in the pad unit 20 can be changed by changing the number of pad groups 215 in the pad unit 20 and the number of third pads 216 in a pad group 215. The number of pads 21 in the pad unit 20 can be set according to actual production needs, and the present invention does not specifically limit it in this regard.

[0060] Figure 6 yes Figure 1 A partial planar schematic diagram of a pad unit in the aforementioned light-emitting module. Figure 7 yes Figure 6 An enlarged schematic diagram of section D in the middle, for reference. Figure 1 , Figure 2 , Figure 6 and Figure 7 In some alternative embodiments, the pad 21 includes a body portion 217 and a connecting portion 211 connected together. The body portion 217 includes a groove 2171, which is recessed toward a direction away from the adjacent pad 21.

[0061] In the same pad 21, the connection portion 211 corresponds to the groove 2171, and the connection portion 211 is at least partially located in the corresponding groove 2171.

[0062] Specifically, the pad 21 includes a main body portion 217 and a connecting portion 211 connected together. A groove 2171 is provided on the side of the main body portion 217 connected to the connecting portion 211, and the connecting portion 211 is at least partially disposed within the groove 2171. This effectively reduces the problem of increased length of the pad 21 in the second direction Y caused by the connection portion 211, thereby helping to reduce the problem of increased length of the pad unit 20 in the second direction Y caused by the connection portion 211, and thus helping to alleviate the problem caused by changes in the design dimensions of the pad unit 20 due to the connection portion 211.

[0063] refer to Figure 1 , Figure 2 , Figure 6 and Figure 7 In some alternative embodiments, the connection portion 211 includes a first sub-portion 2111, which is connected to the main body portion 217 within the same pad 21.

[0064] The connecting part group 210 includes a first connecting part 211a and a second connecting part 211b;

[0065] In at least one pad unit 20, the second connection portion 211b includes at least one protrusion 2112, which is connected to the first sub-portion 2111, and the protrusion 2112 is located on the side of the first sub-portion 2111 away from the main body portion 217.

[0066] Specifically, the connection portion 211 in the pad 21 includes a first sub-part 2111, and the first sub-part 2111 is connected to the main body portion 217. In at least one pad unit 20, the second connection portion 211b further includes a protrusion 2112, which is located on the side of the first sub-part 2111 away from the main body portion 217. That is, the second connection portion 211b has a protrusion 2112 on the side of the first sub-part 2111 away from the main body portion 217. In other words, the protrusion 2112 in the second connection portion 211b protrudes towards the first connection portion 211a adjacent to it in the same connection portion group 210. The number, shape, and size of the protrusions 2112 in the second connection portion 211b can be differentiated according to requirements. The number, shape, and size of the protrusions 2112 in 1b can be changed to achieve multiple shapes of the second connecting portion 211b, which is conducive to achieving the diversity of shapes of the second connecting portion 211b in the connecting portion group 210. That is, the number, shape, and size of the protrusions 2112 in the second connecting portion 211b of the pad unit 20 electrically connected to different driver chips 50 can be at least different, which is conducive to achieving the diversity of shapes of the connecting portion 211 in the connecting portion group 210, and thus conducive to achieving the shape variation setting of the connecting portion 211 in the connecting portion group 210 of the pad unit 20 electrically connected to different driver chips 50.

[0067] Meanwhile, the first sub-part 2111 in the second connecting part 211b protrudes along the second direction Y and toward a direction away from the first sub-part 2111 to form a protrusion 2112. The design of the protrusion 2112 is simple. The protrusion 2112 in the second connecting part 211b can be made of the same material and in the same process as the first sub-part 2111, and the manufacturing method is simple.

[0068] Figure 8 yes Figure 1 A partial planar schematic diagram of a first pad unit in the light-emitting module. Figure 9 yes Figure 8 An enlarged schematic diagram of part E in the middle, for reference. Figure 1 , Figure 2 , Figure 8 and Figure 9 Similarly, in at least one pad unit 20, the first connecting portion 211a includes at least one protrusion 2112, which is connected to the first sub-portion 2111. The protrusion 2112 is located on the side of the first sub-portion 2111 away from the main body 217. That is, the protrusion 2112 is provided on the side of the first sub-portion 2111 away from the main body 217 in the first connecting portion 211a. In other words, the protrusion 2112 in the first connecting portion 211a protrudes toward the second connecting portion 211b adjacent to it in the same connecting portion group 210. The number, shape, and size of the protrusions 2112 in the first connecting portion 211a can be differentiated according to requirements. By changing the number, shape, and size of the protrusions 2112 in the first connecting part 211a, various shapes of the first connecting part 211a can be achieved. This facilitates the diversity of shapes of the first connecting part 211a in the connecting part group 210. That is, the number, shape, and size of the protrusions 2112 in the first connecting part 211a of the pad unit 20 electrically connected to different driver chips 50 can be at least different. This facilitates the diversity of shapes of the connecting parts 211 in the connecting part group 210, and thus facilitates the shape variation setting of the connecting parts 211 in the connecting part group 210 of the pad unit 20 electrically connected to different driver chips 50.

[0069] Meanwhile, the first sub-part 2111 in the first connecting part 211a can protrude along the second direction Y and in a direction away from the first sub-part 2111 to form a protrusion 2112. The design of the protrusion 2112 is simple. The protrusion 2112 in the first connecting part 211a can be made of the same material and in the same process as the first sub-part 2111, and the manufacturing method is simple.

[0070] It should be noted that, Figure 7 The example shows at least one pad unit 20, in which the second connection portion 211b of the connection portion assembly 210 includes a protrusion 2112. Figure 9The example illustrates at least one pad unit 20, in which a first connection portion 211a in a connection assembly 210 includes three protrusions 2112. The protrusions 2112 extend along a second direction Y and are semi-elliptical in shape. Figure 9 The three protrusions 2112 have the same shape and size. In other embodiments of the present invention, the number of protrusions 2112 in the first connecting part 211a and / or the second connecting part 211b can be other values, and the protrusions 2112 can also adopt other shapes. The shapes of each protrusion 2112 can be the same or different, i.e., optional. In other embodiments of the present invention, the diversity of the shape of the connecting part 211 in the connecting part group 210 can be achieved by changing at least one of the number, shape and size of the protrusions 2112 in the first connecting part 211a and / or the second connecting part 211b. The present invention will not elaborate on them one by one, and they can be set according to specific production needs.

[0071] Continue to refer to Figure 1 , Figure 2 , Figure 8 and Figure 9 In some alternative embodiments, pad unit 20 includes first pad unit 20c;

[0072] In the first pad unit 20c, only the first connection portion 211a includes at least one protrusion 2112.

[0073] Specifically, the pad unit 20 includes a first pad unit 20c. In the first pad unit 20c, only the first connection portion 211a includes at least one protrusion 2112. That is, the shape of the first connection portion 211a is distinguished from the connection portions 211 in other pad units 20 by providing a protrusion 2112 in the first connection portion 211a. Specifically, the first connection portion 211a can have multiple shapes by changing at least one of the number, shape, and size of the protrusion 2112 in the first connection portion 211a. This is beneficial to achieve the diversity of the shape of the first connection portion 211a in the connection portion group 210. That is, the number, shape, and size of the protrusion 2112 in the first connection portion 211a of the pad unit 20 electrically connected to different driver chips 50 can be at least different. This is beneficial to achieve the diversity of the shape of the connection portion 211 in the connection portion group 210. This is beneficial to achieve the shape variation setting of the connection portion 211 in the connection portion group 210 of the pad unit 20 electrically connected to different driver chips 50. Meanwhile, in the first pad unit 20c, only the first connection portion 211a includes at least one protrusion 2112, thereby effectively reducing the risk of short circuit between the first connection portion 211a and the second connection portion 211b in the first pad unit 20c while setting the protrusion 2112.

[0074] Continue to refer to Figure 1 , Figure 2 , Figure 8 and Figure 9 In some alternative embodiments, in the first pad unit 20c, the distance between two first sub-parts 2111 in the same connection group 210 along the second direction Y is R;

[0075] The height of the protrusion 2112 in the first connecting part 211a along the second direction Y is r1;

[0076] Where r1 < R.

[0077] Specifically, in the first pad unit 20c, only the first connection portion 211a includes a protrusion 2112, so that the height of the protrusion 2112 in the first connection portion 211a along the second direction Y is less than the distance between the two first sub-parts 2111 in the same connection portion group 210 along the second direction Y, thereby insulating the first connection portion 211a and the second connection portion 211b in the first pad unit 20c from each other and preventing short circuits from occurring between the first connection portion 211a and the second connection portion 211b in the first pad unit 20c.

[0078] Figure 10 yes Figure 1 A partial planar schematic diagram of a second pad unit in the aforementioned light-emitting module. Figure 11 yes Figure 10 An enlarged schematic diagram of section F in the middle, for reference. Figure 1 , Figure 2 , Figure 10 and Figure 11 In some alternative embodiments, pad unit 20 includes a second pad unit 20d;

[0079] In the second pad unit 20d, both the first connecting portion 211a and the second connecting portion 211b include at least one protrusion 2112.

[0080] Specifically, in the second pad unit 20d, both the first connecting portion 211a and the second connecting portion 211b are provided with protrusions 2112. This allows them to be distinguished from the connecting portions 211 in other pad units 20 by providing protrusions 2112 in both the first and second connecting portions 211a. Specifically, the first connecting portion 211a can have multiple shapes by changing at least one of the number, shape, and size of the protrusions 2112, thus facilitating the diversity of shapes for the first connecting portions 211a in the connecting portion group 210. Similarly, the second connecting portion 211b can have multiple shapes by changing at least one of the number, shape, and size of the protrusions 2112, thus facilitating the diversity of shapes for the second connecting portions 211b in the connecting portion group 210. In the pad unit 20 that is electrically connected to different driver chips 50, the number, shape and size of the protrusions 2112 in the first connection portion 211a can be at least different, or the number, shape and size of the protrusions 2112 in the second connection portion 211b can be at least different, or the number, shape and size of the protrusions 2112 in the first connection portion 211a can be at least different, and at the same time, the number, shape and size of the protrusions 2112 in the second connection portion 211b can also be at least different. This further helps to enrich the diversity of the shape of the connection portion 211 in the connection portion group 210, thereby facilitating the realization of the shape variation setting of the connection portion 211 in the connection portion group 210 of the pad unit 20 that is electrically connected to different driver chips 50.

[0081] It should be noted that, Figure 11 The example shows that when both the first connecting part 211a and the second connecting part 211b in the connecting part group 210 are provided with protrusions 2112, the first connecting part 211a has two protrusions 2112 and the second connecting part 211b has one protrusion 2112. The protrusions 2112 in the first connecting part 211a and the protrusions 2112 in the second connecting part 211b have the same shape and the same size. In other embodiments of the present invention, when both the first connecting portion 211a and the second connecting portion 211b in the connecting portion group 210 are provided with protrusions 2112, the number of protrusions 2112 in the first connecting portion 211a and the number of protrusions 2112 in the second connecting portion 211b can be other values, and the shapes of the protrusions 2112 in the first connecting portion 211a and the protrusions 2112 in the second connecting portion 211b can be different, and their sizes can also be different. These can be set according to actual design requirements, and the present invention will not elaborate on them here.

[0082] Continue to refer to Figure 1 , Figure 2 , Figure 10 and Figure 11In some alternative embodiments, in the second pad unit 20d, the protrusions 2112 in the first connecting portion 211a and the protrusions 2112 in the second connecting portion 211b are arranged alternately along the first direction X.

[0083] Specifically, in the second pad unit 20d, both the first connection portion 211a and the second connection portion 211b are provided with protrusions 2112. Thus, in the second pad unit 20d, the protrusions 2112 in the first connection portion 211a and the protrusions 2112 in the second connection portion 211b are staggered along the first direction X, that is, along the second direction Y, the protrusions 2112 in the first connection portion 211a and the protrusions 2112 in the second connection portion 211b do not overlap, thereby effectively reducing the risk of short circuits between the protrusions 2112 in the first connection portion 211a and the protrusions 2112 in the second connection portion 211b.

[0084] It should be noted that, Figure 10 and Figure 11 The example illustrates an arrangement of the protrusions 2112 in the first connecting portion 211a and the second connecting portion 211b in the second pad unit 20d. In other embodiments of the invention, the protrusions 2112 in the first connecting portion 211a and the second connecting portion 211b in the second pad unit 20d can also be arranged in other ways. For example, see [reference]. Figure 12 , Figure 12 yes Figure 1 A partial structural diagram of another second pad unit in the light-emitting module is shown. Of course, the protrusions 2112 in the first connecting part 211a and the second connecting part 211b in the second pad unit 20d can also be arranged in other ways according to actual needs. This invention will not elaborate on them here.

[0085] Continue to refer to Figure 1 , Figure 2 , Figure 10 and Figure 11 In some alternative embodiments, in the second pad unit 20d, the distance between the two first sub-parts 2111 in the same connection group 210 along the second direction Y is R;

[0086] The height of the protrusion 2112 in the first connecting part 211a along the second direction Y is r1, and the height of the protrusion 2112 in the second connecting part 211b along the second direction Y is r2;

[0087] Where r1+r2<R.

[0088] Specifically, in the second pad unit 20d, both the first connecting portion 211a and the second connecting portion 211b include a protrusion 2112. Thus, the sum of the height of the protrusion 2112 in the first connecting portion 211a along the second direction Y and the height of the protrusion 2112 in the second connecting portion 211b along the second direction Y is less than the distance between the two first sub-parts 2111 in the same connecting portion group 210 along the second direction Y. As a result, the first connecting portion 211a and the second connecting portion 211b in the first pad unit 20c are insulated from each other, thus preventing a short circuit between the first connecting portion 211a and the second connecting portion 211b in the first pad unit 20c.

[0089] This embodiment provides a display device, including the light-emitting module as described above.

[0090] Please refer to Figure 13 , Figure 13 This is a schematic diagram of the planar structure of a display device provided by the present invention. Figure 13 The provided display device 1000 includes a light-emitting module 100, wherein the light-emitting module is the light-emitting module 100 provided in any of the above embodiments of the present invention. Optionally, the display device 1000 can be a liquid crystal display device. In this case, the light-emitting module 100 of this embodiment can be used as a direct-lit backlight. This embodiment does not specifically limit the type of display device 1000. In specific implementation, it can be set according to actual needs. Figure 13 This embodiment uses a mobile phone as an example to illustrate the display device 1000. It is understood that the display device provided in this embodiment can be any other display device with display function, such as a computer, television, or vehicle-mounted display device; this invention does not impose specific limitations on this. The display device provided in this embodiment has the beneficial effects of the light-emitting module provided in this embodiment. For details, please refer to the specific descriptions of the light-emitting module in the above embodiments; these will not be repeated here.

[0091] As can be seen from the above embodiments, the light-emitting module and display device provided by the present invention achieve at least the following beneficial effects:

[0092] The light-emitting module provided by this invention features pad units on a circuit board substrate. Each pad unit constitutes a package module. Simply calling the module allows for the placement of each light-emitting chip to its target position, reducing the number of times circuit design software calls are needed, lowering the requirements for computer hardware configuration, and reducing costs. Furthermore, the shapes of the connecting portions in the connection groups of at least two pad units electrically connected to different driver chips are different. When a light-emitting chip malfunctions in the light-emitting module, the damaged chip can be removed, exposing the connection group electrically connected to that chip. By observing the shape of the connecting portions in this connection group, it is possible to quickly identify and locate which driver chip controls the light-emitting chip.

[0093] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A light-emitting module, characterized in that, include: Circuit board substrate; Multiple pad units are located on one side of the circuit board substrate. Each pad unit includes multiple pads, each pad includes a connection portion, and each pad unit also includes multiple connection portion groups. Each connection portion group includes two connection portions, and in the same connection portion group, the two connection portions are located on the opposite side of two adjacent pads. A protective layer is located on the side of the pad unit away from the circuit board substrate. The protective layer includes a plurality of cutouts, which correspond to the connection group and expose the corresponding connection group. Multiple light-emitting chips are provided, each corresponding to a connection group. Each light-emitting chip has a positive electrode and a negative electrode, and the positive electrode and the negative electrode are electrically connected to different connection parts in the corresponding connection group. Multiple driver chips, with at least two of the pad units electrically connected to different driver chips respectively; The shapes of the connection portions in the connection groups of at least two pad units electrically connected to different driver chips are different.

2. The light-emitting module according to claim 1, characterized in that, The connection portions in the connection portion group of the pad unit electrically connected to the same driver chip have the same shape.

3. The light-emitting module according to claim 1, characterized in that, The pad unit includes a first pad and a second pad, the first pad and the second pad extending along a first direction and arranged along a second direction, wherein the first direction and the second direction intersect. The pad unit further includes at least two pad groups located between the first pad and the second pad, the pad groups being arranged along the first direction, and the pad groups including at least two third pads being arranged along the second direction; Along the second direction, the connecting portion in the first pad is located on the side of the first pad closer to the pad group, and the connecting portion in the second pad is located on the side of the second pad closer to the pad group; Along the second direction, the connection portion of the third pad is located on opposite sides of the third pad.

4. The light-emitting module according to claim 3, characterized in that, The pad includes a connected body portion and a connecting portion, the body portion including a groove recessed in a direction away from the adjacent pad; In the same pad, the connection portion corresponds to the groove, and the connection portion is at least partially located within the corresponding groove.

5. The light-emitting module according to claim 4, characterized in that, The connecting portion includes a first sub-portion, which is connected to the main body portion within the same pad. The connecting part group includes a first connecting part and a second connecting part; In at least one of the pad units, the first connection portion and / or the second connection portion includes at least one protrusion, the protrusion being connected to the first sub-part and located on the side of the first sub-part away from the main body portion.

6. The light-emitting module according to claim 5, characterized in that, The pad unit includes a first pad unit; In the first pad unit, only the first connection portion includes at least one of the protrusions.

7. The light-emitting module according to claim 6, characterized in that, In the first pad unit, the distance between two first sub-parts in the same connection group along the second direction is R; The height of the protrusion in the first connecting portion along the second direction is r1; Where r1 < R.

8. The light-emitting module according to claim 5, characterized in that, The pad unit includes a second pad unit; In the second pad unit, both the first connecting portion and the second connecting portion include at least one of the protrusions.

9. The light-emitting module according to claim 8, characterized in that, In the second pad unit, the protrusions in the first connection portion and the protrusions in the second connection portion are arranged alternately along the first direction.

10. The light-emitting module according to claim 8, characterized in that, In the second pad unit, the distance between two first sub-parts in the same connection group along the second direction is R; The height of the protrusion in the first connecting portion along the second direction is r1, and the height of the protrusion in the second connecting portion along the second direction is r2; Where r1+r2<R.

11. A display device, characterized in that, Includes the light-emitting module as described in any one of claims 1-10.

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