Headphone Module

Abstract

This invention relates to an earphone module equipped with speakers capable of generating high and low frequency bands respectively. The earphone module according to the invention has terminal components electrically connected to two coils. After the two coils are assembled by electrically connecting them to the terminal components, the terminal components are connected to an external input circuit through an exposed window in the housing, making operation easy, reducing defect rates, and improving mass production.

Description

Technical Field

[0001] This invention relates to an earphone module, and more particularly to an earphone module with dual speakers capable of playing high and low frequencies separately. Background Technology

[0002] With the development of information communication and mobile technology, headphones that come with various electronic devices (such as smartphones or mobile game consoles) that can enjoy audio content have become an essential accessory.

[0003] The headphones consist of a pair of headphone modules, each equipped with a speaker.

[0004] Existing loudspeakers consist of only a single diaphragm, but with the increasing use of headphones, dual-channel loudspeaker products using two diaphragms are being developed to receive richer audio.

[0005] In addition, the loudspeaker is equipped with a diaphragm for generating audio and an audio coil that vibrates attached to the diaphragm. The vibration of the audio coil is generated by interference with the magnetic field of the permanent magnet; therefore, an electrical signal for generating the magnetic field needs to be input into the audio coil. Thus, a circuit board for inputting the electrical signal to the audio coil is required. Furthermore, the two coil wires leading from the audio coil need to be electrically connected to the circuit board.

[0006] The headphone module is manufactured by stacking various components within a housing. One of the most challenging operations is electrically connecting the two leads from each coil, which are drawn from the audio coil, to the circuit board. This structure prevents the two leads from breaking during speaker operation, and the leads are electrically connected to the circuit board through a delicate soldering process.

[0007] However, the assembly process of the headphone module is very demanding because the coil wires may separate from the circuit board, which is the main reason for the reduced manufacturability. Furthermore, in headphone modules with two diaphragms, the increased number of stacked components and electrical connection steps further complicates the process, ultimately leading to a further decrease in manufacturability.

[0008] Existing technical documents

[0009] Patent documents

[0010] (Patent Document 1) Korean Patent Publication No. 10-2006-0041995 Summary of the Invention

[0011] This invention is proposed based on the following problem.

[0012] First, in a dual-channel headphone module with two diaphragms, there needs to be a structure that can stably perform electrical connection operations between the leads and the external input circuit for a short period of time.

[0013] Secondly, it needs to have a structure that can perform electrical connection operations between the leads and the input circuit after the basic assembly process of the dual-channel headphone module is completed.

[0014] According to a first aspect of the present invention, an earphone module includes: a first permanent magnet that generates a first magnetic field for playing a first audio signal in a high-frequency band; a first coil that generates a first magnetic flux interfering with the first magnetic field formed by the first permanent magnet based on an input first electrical signal, thereby vibrating with the interference; a first diaphragm that vibrates together with the first coil to generate the first audio signal in a high-frequency band; a second permanent magnet disposed outside the first permanent magnet and generating a second magnetic field for playing a second audio signal in a low-frequency band; a second coil that generates a second magnetic flux interfering with the second magnetic field formed by the second permanent magnet based on an input second electrical signal, thereby vibrating with the interference; a second diaphragm that vibrates together with the second coil to generate the second audio signal in a low-frequency band and is disposed behind the first diaphragm; and a support plate that supports the first permanent magnet and the second permanent magnet together and guides the magnetic flux generated in the first permanent magnet and the second permanent magnet by means of a magnet assembly. The housing has a receiving space for accommodating the first permanent magnet, the first coil, the first diaphragm, the second permanent magnet, the second coil, the second diaphragm, and the support plate. It has an audio output hole at the front corresponding to the direction of audio release and a mounting hole at the rear for mounting the first permanent magnet, the first coil, the first diaphragm, the second permanent magnet, the second coil, the second diaphragm, and the support plate within the receiving space. A cover covers the mounting holes of the housing. A pair of first terminal components are connected to leads on both sides of the first coil to input electrical signals to the first coil. A pair of second terminal components are connected to leads on both sides of the second coil to input electrical signals to the second coil. An exposure window is formed in the housing to expose the pair of first terminal components and the pair of second terminal components to the outside, allowing the pair of first terminal components and the pair of second terminal components to be electrically connected to an external input circuit.

[0015] The headphone module further includes: a first support ring for supporting the support plate on the housing and injection molding; a magnetic flux guide for guiding the magnetic flux of the first permanent magnet; a guide plate disposed on the outside of the magnetic flux guide and covering the rear surface of the second permanent magnet, and guiding the magnetic flux of the second permanent magnet; and a second support ring for supporting the guide plate on the housing and injection molding.

[0016] The pair of first terminal components are coupled to the first support ring, and the pair of second terminal components are coupled to the second support ring.

[0017] The pair of first terminal components are integrally joined to the first support ring by means of insert molding, and the pair of second terminal components are integrally joined to the second support ring by means of insert molding.

[0018] According to a second aspect of the present invention, an earphone module includes: a first permanent magnet that generates a first magnetic field for playing a first audio signal in a high-frequency band; a first coil that generates a first magnetic flux interfering with the first magnetic field formed by the first permanent magnet based on an input first electrical signal, thereby vibrating with the interference; a first diaphragm that vibrates together with the first coil to generate the first audio signal in a high-frequency band; a second permanent magnet disposed outside the first permanent magnet and generating a second magnetic field for playing a second audio signal in a low-frequency band; a second coil that generates a second magnetic flux interfering with the second magnetic field formed by the second permanent magnet based on an input second electrical signal, thereby vibrating with the interference; a second diaphragm that vibrates together with the second coil to generate the second audio signal in a low-frequency band, and is disposed behind the first diaphragm; and a support plate that supports the first permanent magnet and the second permanent magnet together, and is equipped with a magnet. The magnetic flux generated by the first permanent magnet and the second permanent magnet is guided; the housing has a receiving space for accommodating the first permanent magnet, the first coil, the first diaphragm, the second permanent magnet, the second coil, the second diaphragm and the support plate, and has an audio output hole at the front corresponding to the direction of audio release, and has a mounting hole at the rear for the first permanent magnet, the first coil, the first diaphragm, the second permanent magnet, the second coil, the second diaphragm and the support plate to be installed in the receiving space; a cover covers the mounting hole of the housing; and a pair of terminal components are respectively connected to the leads on both sides of the first coil and the second coil to input electrical signals to the first coil and the second coil, wherein an exposure window is formed in the housing for exposing the pair of terminal components to the outside so that the pair of terminal components can be electrically connected to an external input circuit.

[0019] The headphone module further includes: a magnetic flux guide for guiding the magnetic flux of the first permanent magnet; a guide plate disposed on the outside of the magnetic flux guide and covering the rear surface of the second permanent magnet, and guiding the magnetic flux of the second permanent magnet; and a second support ring for supporting the guide plate on the housing and injection molding.

[0020] The pair of terminal components are attached to the second support ring.

[0021] The pair of terminal components are integrally joined to the second support ring by means of insert molding.

[0022] According to the present invention, after the mechanical assembly of the headphone module is completed, the input circuit and the coil are electrically connected externally through an exposed window by means of spot welding or the like, thereby achieving the effect of easy operation, reduced defect rate and improved mass production. Attached Figure Description

[0023] Figure 1 This is an exploded perspective view of the headphone module according to a first embodiment of the present invention.

[0024] Figure 2 It is along Figure 1 A cross-sectional view of the headphone module taken along line II.

[0025] Figure 3 It is along Figure 1 A cross-sectional view of the headphone module taken along line II-II.

[0026] Figure 4 It is for applicable Figure 1 A cutaway view of the first support ring and the first terminal component of the headphone module.

[0027] Figure 5 It is for applicable Figure 1 A cutaway view of the second support ring and the second terminal component of the headphone module.

[0028] Figure 6 It is for applicable Figure 1 A perspective view of the combination of the first support ring and the first terminal component of the headphone module.

[0029] Figure 7 It is used to explain in Figure 1 The arrangement of the first terminal component and the second terminal component in the headphone module with the exposure window of the housing is shown in the figure.

[0030] Figure 8 It is for applicable Figure 1 A perspective view of the combination of the second support ring and the second terminal component of the headphone module.

[0031] Figure 9 This is an exploded perspective view of the headphone module according to a second embodiment of the present invention.

[0032] Figure 10 It is along Figure 9 A cross-sectional view of the headphone module taken along line II.

[0033] Figure 11 It is along Figure 9 A cross-sectional view of the headphone module taken along line II-II.

[0034] Figure 12 It is for applicable Figure 9 A cutaway view of the second support ring and terminal components of the headphone module.

[0035] Figure 13 It is for applicable Figure 9 A perspective view of the combination of the second support ring and the terminal component of the headphone module.

[0036] Figure 14 It is used to explain in Figure 9 The arrangement of the terminal components in the headphone module with the exposed window of the housing is shown in the figure.

[0037] Symbol Explanation

[0038] 200, 300: Headphone module

[0039] 211, 311: First permanent magnet

[0040] 212, 312: First coil

[0041] 213, 313: First vibrating plate

[0042] 214, 314: First fixing ring

[0043] 221, 321: Second permanent magnet

[0044] 222, 322: Second coil

[0045] 223, 323: Second vibrating plate

[0046] 224, 324: Second fixing ring

[0047] 232, 332: Guide plate

[0048] 233, 333: Support plate

[0049] 235, 335: Second support ring

[0050] 236a, 236b: First terminal components

[0051] 237a, 237b: Second terminal components

[0052] 336a, 336b: Terminal components

[0053] 241, 341: Shell

[0054] 241a, 341a: Exposure window Detailed Implementation

[0055] Preferred embodiments of the present invention will be described with reference to the accompanying drawings. For the sake of brevity, descriptions of repetitive configurations will be omitted or abbreviated as much as possible.

[0056] <First Embodiment>

[0057] Figure 1 This is an exploded perspective view of the headphone module 200 according to a first embodiment of the present invention. Figure 2 It is along Figure 1 A sectional view taken along line II. For reference, in the accompanying drawings and the following description, the direction of the output audio is defined as forward, and its opposite direction as backward.

[0058] The headphone module 200 according to this embodiment includes a first permanent magnet 211, a first coil 212, a first vibrating plate 213, a first fixing ring 214, a second permanent magnet 221, a second coil 222, a second vibrating plate 223, a second fixing ring 224, a magnetic flux guide 231, a guide plate 232, a support plate 233, a first support ring 234, a second support ring 235, first terminal components 236a and 236b, second terminal components 237a and 237b, a housing 241, and a cover 242.

[0059] The first permanent magnet 211 generates a first magnetic field for playing a first audio signal in a high-frequency band. The first permanent magnet 211 has a ring shape with a central perforation.

[0060] The first coil 212 has a solenoid shape and generates a first magnetic flux that interferes with the first magnetic field formed by the first permanent magnet 211 according to the input first electrical signal, thereby vibrating with the interference. The first coil 212 is arranged between the first permanent magnet 211 and the magnetic flux guide 231.

[0061] The first vibrating plate 213 vibrates along with the first coil 212, thereby generating a first audio frequency in the high-frequency band. When viewed from the rear onto a flat surface, the first vibrating plate 213 has a disc shape.

[0062] The first fixing ring 214 is provided to fix the edge of the first vibrating plate 213 to the support plate 233.

[0063] The second permanent magnet 221 generates a second magnetic field for playing a second audio signal in the low-frequency band and is disposed outside the first permanent magnet 211. This second permanent magnet 221 also has a ring-shaped central perforation in which the first permanent magnet 211 is arranged, spaced apart from its inner diameter. Furthermore, the space between the first permanent magnet 211 and the second permanent magnet 221 serves as a channel through which the low-frequency audio signal passes.

[0064] The second coil 222 generates a second magnetic flux that interferes with the second magnetic field formed by the second permanent magnet 221 based on the input second electrical signal, thereby oscillating with the interference. The second coil 222 is arranged between the first permanent magnet 211 and the second permanent magnet 221. In this embodiment, the second electrical signal and the first electrical signal are predetermined to be the same electrical signal. Of course, according to the implementation, the second electrical signal may be different from the first electrical signal.

[0065] The second diaphragm 223 vibrates along with the second coil 222, thereby generating a second audio frequency in the low-frequency band. When viewed from the rear onto the front plane, the second diaphragm 223 also has a disc shape.

[0066] The second retaining ring 224 is provided to fix the edge of the second vibrating plate 223 to the guide plate 232. Of course, since the guide plate 232 is tightly supported by the housing 241, the second vibrating plate 223 is ultimately supported by the housing 241 by the second retaining ring 224 and the guide plate 232, etc.

[0067] The magnetic flux guide 231, when viewed from the front, is roughly "T"-shaped and covers the rear surface of the first permanent magnet 211. Its forward-protruding portion is inserted into a hole located in the center of the first permanent magnet 211. A first damping hole d1, used to adjust the sound pressure on the rear side of the first vibrating plate 213, is formed in a through-hole in the center of the protruding portion, and a first damper D1 is provided at the rear end of the first damping hole d1. This magnetic flux guide 231 guides the first magnetic flux generated by the first permanent magnet 211.

[0068] The guide plate 232 is disposed on the outside of the magnetic flux guide 231 and covers the rear surface of the second permanent magnet 221, and guides the second magnetic flux generated by the second permanent magnet 221.

[0069] The support plate 233 simultaneously covers and supports the front surfaces of the first permanent magnet 211 and the second permanent magnet 221, and guides the first and second magnetic fluxes generated by the first and second permanent magnets 211 and 221. This support plate 233 has a centrally formed resonant hole 233a to create a space that allows the first coil 212 to vibrate. Two through holes 233b are formed symmetrically spaced apart on the outer side of the resonant hole 233a, allowing the audio signal generated by the second resonant plate 223 to pass through and be output forward. Therefore, as along... Figure 1 Section of line II-II Figure 3As shown in the cross-sectional view, the output path OW of the second audio signal generated by the second vibrating plate 223, which passes through the space between the first permanent magnet 211 and the second permanent magnet 221, through the through hole 233b, and then through the audio output hole OH of the housing 241, is almost a straight line. Therefore, the phase difference between the first and second audio signals can be minimized.

[0070] In addition, the aforementioned magnetic flux guide 231, guide plate 232, and support plate 233 serve to guide the magnetic flux of the first permanent magnet 211 and the second permanent magnet 221 and concentrate it into the first coil 212 and the second coil 222. For this purpose, they are all made of magnetic material.

[0071] exist Figure 4 The first support ring shown in the cutaway diagram is provided to support the support plate 233 against the housing 241. Figure 5 The second support ring 235 shown in the cutaway diagram is provided to support the guide plate 232 on the housing 241.

[0072] First terminal components 236a and 236b are provided in pairs and are electrically connected to two coil lines respectively led out from the first coil 212. For example... Figure 6 As shown, preferably, these first terminal components 236a and 236b are embedded in the first support ring 234. Therefore, the first support ring 234 is injection molded by embedding (inserting) the first terminal components 236a and 236b. The first terminal components 236a and 236b generally have a shape that is bent at the middle, and the front end a is electrically connected to the first coil 212, while the side end b is as follows... Figure 7 The same arrangement shown is exposed to the outside through the exposure window 241a of the housing 241.

[0073] Furthermore, second terminal components 237a and 237b are also provided in pairs and are electrically connected to the two coil lines leading out from the second coil 222, respectively. For example... Figure 8 As shown, preferably, these second terminal components 237a and 237b are also integrally formed with the second support ring 235 by insert molding. Similarly, the second terminal components 237a and 237b also generally have a shape that is bent at the middle, with the rear end c electrically connected to the second coil 222, and the side end d as shown. Figure 7 The arrangement shown is such that the components are exposed to the outside through the exposure window 241a of the housing 241. That is, the side ends b of the first terminal components 236a, 236b and the side ends d of the second terminal components 237a, 237b are spaced apart from each other but arranged adjacently, so that they are exposed to the outside together through the exposure window 241a.

[0074] The housing 241 has a receiving space for accommodating all the above-described components, and has an audio output port OH at the front for outputting the first and second audio frequencies generated by the first diaphragm 213 and the second diaphragm 223, and a mounting hole IH at the rear for mounting the above-described components into the receiving space. Furthermore, an exposure window 241a is formed on one side surface of the housing 241 for exposing the side ends b of the first terminal components 236a and 236b and the side ends d of the second terminal components 237a and 237b.

[0075] The cover 242 covers the mounting hole IH of the housing 241. A second damping hole d2 for adjusting the sound pressure formed behind the second vibrating plate 223 is also formed in the cover 242, and a second damper D2 is attached to the rear surface of the cover 242.

[0076] Once the basic configuration of the headphone module 200, having the basic structure described above, is assembled, an operation is performed to connect it to an external input circuit via the exposure window 241a. Here, the connection operation involves connecting the external input circuit to the side terminals b of the first terminal components 236a and 236b and the side terminals d of the second terminal components 237a and 237b. At this time, the first terminal components 236a and 236b are also electrically connected to each other with the second terminal components 237a and 237b. That is, when the external input circuit is electrically connected to the first terminal components 236a and 236b and the second terminal components 237a and 237b via the exposure window 241a, an electrical connection operation is also performed between the first terminal components 236a and 236b and the second terminal components 237a and 237b.

[0077] <Second Embodiment>

[0078] Figure 9 This is an exploded perspective view of the headphone module 300 according to a second embodiment of the present invention. Figure 10 It is along Figure 9 A sectional view taken along line II. Here, the definition of direction is the same as in the first embodiment.

[0079] The headphone module 300 according to this embodiment includes a first permanent magnet 311, a first coil 312, a first oscillating plate 313, a first fixing ring 314, a second permanent magnet 321, a second coil 322, a second oscillating plate 323, a second fixing ring 324, a magnetic flux guide 331, a guide plate 332, a support plate 333, a first support ring 334, a second support ring 335, terminal components 336a and 336b, a housing 341, and a cover 342.

[0080] The first permanent magnet 311 generates a first magnetic field for playing a first audio signal in a high-frequency band. The first permanent magnet 311 has a ring shape with a central perforation.

[0081] The first coil 312 has a solenoid shape and generates a first magnetic flux that interferes with the first magnetic field formed by the first permanent magnet 311 according to the input first electrical signal, thereby vibrating with the interference. The first coil 312 is arranged between the first permanent magnet 311 and the magnetic flux guide 331.

[0082] The first vibrating plate 313 vibrates along with the first coil 312, thereby generating a first audio frequency in the high-frequency band. When viewed from the rear onto the front plane, the first vibrating plate 313 has a disc shape.

[0083] The first fixing ring 314 is provided to fix the edge of the first vibrating plate 313 to the support plate 333.

[0084] The second permanent magnet 321 generates a second magnetic field for playing a second audio signal in the low-frequency band and is disposed outside the first permanent magnet 311. This second permanent magnet 321 also has a ring-shaped central perforation in which the first permanent magnet 311 is arranged, spaced apart from its inner diameter. Furthermore, the space between the first permanent magnet 311 and the second permanent magnet 321 serves as a channel through which the low-frequency audio signal passes.

[0085] The second coil 322 generates a second magnetic flux that interferes with the second magnetic field formed by the second permanent magnet 321 based on the input second electrical signal, and thus vibrates with the interference. The second coil 322 is arranged between the first permanent magnet 311 and the second permanent magnet 321. In this embodiment, the second electrical signal is the same as the first electrical signal.

[0086] The second diaphragm 323 vibrates along with the second coil 322, thereby generating a second audio frequency in the low-frequency band. When viewed from the rear onto the front plane, the second diaphragm 323 also has a disc shape.

[0087] The second retaining ring 324 is provided to fix the edge of the second vibrating plate 323 to the guide plate 332. Of course, since the guide plate 332 is tightly supported by the housing 341, the second vibrating plate 323 is ultimately supported by the housing 341 by the second retaining ring 324 and the guide plate 332, etc.

[0088] The magnetic flux guide 331, when viewed from the front, is roughly "T"-shaped and covers the rear surface of the first permanent magnet 311. Its forward-protruding portion is inserted into a hole located in the center of the first permanent magnet 311. A first damping hole d1, used to adjust the sound pressure on the rear side of the first vibrating plate 313, is formed in a through-hole in the center of the protruding portion, and a first damper D1 is provided at the rear end of the first damping hole d1. This magnetic flux guide 331 guides the first magnetic flux generated by the first permanent magnet 311.

[0089] The guide plate 332 is disposed on the outside of the magnetic flux guide 331 and covers the rear surface of the second permanent magnet 321, and guides the second magnetic flux generated by the second permanent magnet 321.

[0090] The support plate 333 simultaneously covers and supports the front surfaces of the first permanent magnet 311 and the second permanent magnet 321, and guides the first and second magnetic fluxes generated by the first and second permanent magnets 311 and 321. This support plate 333 has a centrally formed resonant hole 333a to create a space that allows the first coil 312 to vibrate. Two through holes 333b are formed symmetrically spaced apart on the outer side of the resonant hole 333a, allowing the audio signal generated by the second resonant plate 323 to pass through and be output forward. Therefore, as along... Figure 9 Section of line II-II Figure 11 As shown in the cross-sectional view, the output path OW of the second audio signal generated by the second vibrating plate 323, which passes through the space between the first permanent magnet 311 and the second permanent magnet 321, through the through hole 333b, and then through the audio output hole OH of the housing 341, is almost a straight line. Therefore, the phase difference between the first and second audio signals can be minimized.

[0091] In addition, the aforementioned magnetic flux guide 331, guide plate 332, and support plate 333 serve to guide the magnetic flux of the first permanent magnet 311 and the second permanent magnet 321 and concentrate it into the first coil 312 and the second coil 322. For this purpose, they are all made of magnetic material.

[0092] exist Figure 12 The second support ring 335 shown in the cutaway diagram is provided to support the guide plate 332 on the housing 341.

[0093] Terminal components 336a and 336b are provided in pairs and are electrically connected to two coil lines respectively led out from the first coil 312. For example... Figure 13 As shown, preferably, these terminal components 336a and 336b are embedded in the second support ring 335. For this purpose, the second support ring 335 is injection molded by embedding (inserting) the terminal components 336a and 336b. The terminal components 336a and 336b generally have a shape bent at the middle, with the front end e electrically connected to the first coil 312, the rear end f electrically connected to the second coil 322, and the side end g as shown... Figure 14 The same arrangement shown is exposed to the outside through the exposure window 341a of the housing 341.

[0094] The housing 341 has a receiving space for accommodating all the above-described components, and has an audio output port OH at the front for outputting a first audio signal and a second audio signal generated by the first vibrating plate 313 and the second vibrating plate 323, and a mounting hole IH at the rear for mounting the above-described components into the receiving space. Furthermore, an exposure window 341a is formed on one side surface of the housing 341 for exposing the side ends g of the terminal components 336a and 336b.

[0095] The cover 342 covers the mounting hole IH of the housing 341. A second damping hole d2 for adjusting the sound pressure formed behind the second vibrating plate 323 is also formed in the cover 342, and a second damper D2 is attached to the rear surface of the cover 342.

[0096] Once the basic configuration of the headphone module 300, having the basic structure described above, is assembled, an operation is performed to connect it to an external input circuit via the exposure window 341a. Here, the connection operation involves connecting the external input circuit to the side end g of the terminal components 336a and 336b.

[0097] As described above, although the present invention has been specifically described with reference to the embodiments in the accompanying drawings, the above embodiments are only examples of preferred embodiments of the present invention. Therefore, it should not be construed that the present invention is limited to the above embodiments, and the scope of the present invention should be understood as the claims and their equivalents.

Claims

1. An earphone module, comprising: A first permanent magnet generates a first magnetic field for playing a first audio signal in a high-frequency band. The first coil generates a first magnetic flux that interferes with the first magnetic field formed by the first permanent magnet according to the input first electrical signal, and thus vibrates with the interference; The first vibrating plate vibrates together with the first coil, thereby generating a first audio frequency in the high-frequency band; A second permanent magnet is disposed on the outside of the first permanent magnet and generates a second magnetic field for playing a second audio signal in the low-frequency band. The second coil generates a second magnetic flux that interferes with the second magnetic field formed by the second permanent magnet according to the input second electrical signal, and thus vibrates with the interference; The second diaphragm vibrates along with the second coil to generate a low-frequency second audio signal, and is positioned behind the first diaphragm. A support plate supports the first permanent magnet and the second permanent magnet together, and guides the magnetic flux generated in the first permanent magnet and the second permanent magnet by means of the magnet assembly; The housing has a receiving space for accommodating the first permanent magnet, the first coil, the first vibrating plate, the second permanent magnet, the second coil, the second vibrating plate, and the support plate. It has an audio output hole at the front corresponding to the direction of the released audio, and a mounting hole at the rear for the first permanent magnet, the first coil, the first vibrating plate, the second permanent magnet, the second coil, the second vibrating plate, and the support plate to be installed and accommodated in the receiving space. A cover that covers the mounting holes of the housing; A pair of first terminal components are connected to leads on both sides of the first coil to input an electrical signal into the first coil; and A pair of second terminal components are connected to leads on both sides of the second coil to input electrical signals to the second coil. The housing includes an exposure window for exposing the pair of first terminal components and the pair of second terminal components to the outside, enabling the pair of first terminal components and the pair of second terminal components to be electrically connected to an external input circuit. The headphone module further includes: The first support ring supports the support plate against the housing and is injection molded. A magnetic flux guide, which guides the magnetic flux of the first permanent magnet; A guide plate, disposed on the outside of the magnetic flux guide and covering the rear surface of the second permanent magnet, guides the magnetic flux of the second permanent magnet; and The second support ring supports the guide plate against the housing and is injection molded. The pair of first terminal components are coupled to the first support ring. The pair of second terminal components are coupled to the second support ring.

2. The headphone module as described in claim 1, wherein, The pair of first terminal components are integrally joined to the first support ring by means of insert molding. The pair of second terminal components are integrally joined to the second support ring by means of insert molding.

3. An earphone module, comprising: A first permanent magnet generates a first magnetic field for playing a first audio signal in a high-frequency band. The first coil generates a first magnetic flux that interferes with the first magnetic field formed by the first permanent magnet according to the input first electrical signal, and thus vibrates with the interference; The first vibrating plate vibrates together with the first coil, thereby generating a first audio frequency in the high-frequency band; A second permanent magnet is disposed on the outside of the first permanent magnet and generates a second magnetic field for playing a second audio signal in the low-frequency band. The second coil generates a second magnetic flux that interferes with the second magnetic field formed by the second permanent magnet according to the input second electrical signal, and thus vibrates with the interference; The second diaphragm vibrates along with the second coil to generate a low-frequency second audio signal, and is positioned behind the first diaphragm. A support plate supports the first permanent magnet and the second permanent magnet together, and guides the magnetic flux generated in the first permanent magnet and the second permanent magnet by means of the magnet assembly; The housing has a receiving space for accommodating the first permanent magnet, the first coil, the first vibrating plate, the second permanent magnet, the second coil, the second vibrating plate, and the support plate. It has an audio output hole at the front corresponding to the direction of the released audio, and a mounting hole at the rear for the first permanent magnet, the first coil, the first vibrating plate, the second permanent magnet, the second coil, the second vibrating plate, and the support plate to be installed and accommodated in the receiving space. A cover, covering the mounting hole of the housing; and A pair of terminal components are respectively connected to the leads on both sides of the first coil and the second coil to input electrical signals to the first coil and the second coil. The housing includes an exposure window for exposing the pair of terminal components to the outside, allowing the pair of terminal components to be electrically connected to an external input circuit. The headphone module also includes: A magnetic flux guide, which guides the magnetic flux of the first permanent magnet; A guide plate, disposed on the outside of the magnetic flux guide and covering the rear surface of the second permanent magnet, guides the magnetic flux of the second permanent magnet; and The second support ring supports the guide plate against the housing and is injection molded. The pair of terminal components are attached to the second support ring.

4. The headphone module as described in claim 3, wherein, The pair of terminal components are integrally joined to the second support ring by means of insert molding.

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