Heat dissipation device and heat dissipation system having the same

Abstract

The application provides a heat dissipation device and a heat dissipation system with the same. The heat dissipation device is used for dissipating heat of a processor. The heat dissipation device comprises a heat dissipation main body arranged on the processor, the heat dissipation main body having a containing cavity, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being communicated with the containing cavity, and the containing cavity being used for containing a first cooling medium; and a heat dissipation structure comprising a heat dissipation part and a heat transfer part connected with each other, at least part of the heat transfer part being located in the containing cavity, so as to transfer heat in the first cooling medium to the heat dissipation part, and at least part of the heat dissipation part being located outside the containing cavity; and the heat dissipation part has a storage cavity used for storing a second cooling medium. The application effectively solves the problem of poor heat dissipation reliability of a data center in the prior art.

Description

Technical Field

[0001] This invention relates to the field of data center technology, and more specifically, to a heat dissipation device and a heat dissipation system having the same. Background Technology

[0002] Currently, with the increasing power consumption of data centers, conventional air cooling methods in server rooms can no longer meet the heat dissipation requirements of CPUs. Some data centers have begun to add liquid cooling methods to provide localized heat dissipation for CPUs. Liquid cooling methods are mainly divided into cold plate liquid cooling and immersion liquid cooling. For cold plate liquid cooling, a heat dissipation plate is usually deployed on the server CPU. Non-conductive fluorinated liquid is used to carry away the heat generated by the CPU during operation and transfer it to the server room. The heat in the server room is then carried away by air cooling methods (precision air conditioning or in-row air conditioning) to ensure the operational stability of the data center.

[0003] However, when the cold plate cooling system malfunctions, the heatsink on the CPU will prevent heat transfer from the CPU, causing the CPU to heat up much faster. In some cases, the CPU may even be damaged before the staff has a chance to perform maintenance, which seriously affects the operational stability of the data center. Summary of the Invention

[0004] The main objective of this invention is to provide a heat dissipation device and a heat dissipation system having the same, so as to solve the problem of poor heat dissipation reliability in data centers in the prior art.

[0005] To achieve the above objectives, according to one aspect of the present invention, a heat dissipation device is provided for dissipating heat from a processor. The heat dissipation device includes: a heat dissipation body disposed on the processor, the heat dissipation body having a receiving cavity, an inlet and an outlet, both the inlet and the outlet communicating with the receiving cavity, the receiving cavity for receiving a first cooling medium; a heat dissipation structure including a heat dissipation section and a heat transfer section connected to each other, at least a portion of the heat transfer section being located within the receiving cavity for transferring heat from the first cooling medium to the heat dissipation section, and at least a portion of the heat dissipation section being located outside the receiving cavity; wherein the heat dissipation section has a storage cavity for storing a second cooling medium.

[0006] Furthermore, the heat transfer section includes a heat transfer body and a heat absorption structure disposed on the heat transfer body. The heat absorption structure is located inside the receiving cavity, and the heat transfer body is connected to the heat dissipation section.

[0007] Furthermore, the heat transfer body is columnar, the heat absorption structure is plate-shaped, and the extension direction of the heat absorption structure is set at an angle to the bottom wall of the receiving cavity; wherein, there is one heat absorption structure; or, there are multiple heat absorption structures, which are spaced apart along the extension direction of the heat transfer body.

[0008] Furthermore, the heat dissipation body has a mounting hole communicating with the receiving cavity, the heat dissipation part is a hollow structure, the inner cavity of the hollow structure is a storage cavity, one end of the hollow structure extends into the receiving cavity through the mounting hole and is connected to the heat transfer body, the heat dissipation device also includes: a fan, the fan is installed on the heat dissipation body and located on one side of the heat dissipation structure, the fan is used to blow airflow to the heat dissipation part.

[0009] Furthermore, the hollow structure has a windward section and a leeward section, with the windward section located close to the fan and the leeward section located away from the fan; wherein, along the airflow direction L, the size L1 of the windward section gradually increases and the size L2 of the leeward section gradually decreases.

[0010] Furthermore, the heat dissipation body is plate-shaped, with both the liquid inlet and outlet located on one side of the heat dissipation body; there is one heat dissipation structure; or there are multiple heat dissipation structures, which are spaced apart along the length and / or width of the heat dissipation body.

[0011] Furthermore, when there are multiple heat dissipation structures, the multiple heat dissipation structures are spaced apart along the width direction of the heat dissipation body; or, the multiple heat dissipation structures are spaced apart along the length and width directions of the heat dissipation body; wherein, the liquid inlet extends along the width direction of the heat dissipation body, and the distance between two adjacent heat dissipation structures gradually decreases.

[0012] Furthermore, the heat dissipation device also includes: a cooling device connected to an inlet via a pipeline for introducing a first cooling medium into the receiving cavity; a control valve disposed on the pipeline for controlling at least one of the flow rate, flow velocity, and delivery pressure of the first cooling medium within the pipeline; a first detection device for detecting the temperature of the processor; a control module connected to the first detection device, the control valve, and the fan, the control module adjusting the operating parameters of the control valve according to the detection value of the first detection device; and / or, the control module adjusting at least one of the speed and direction of the fan according to the detection value of the first detection device; and / or, a thermally conductive structure is provided between the heat dissipation body and the processor; wherein at least a portion of the thermally conductive structure is made of thermally conductive silicone.

[0013] According to another aspect of the present invention, a heat dissipation system is provided, which includes an air conditioning unit and a plurality of heat dissipation devices. The air conditioning unit is installed in a computer room, and the plurality of heat dissipation devices are installed one-to-one with a plurality of processors in a data center in the computer room; wherein the heat dissipation devices are the aforementioned heat dissipation devices.

[0014] Furthermore, the heat dissipation system also includes: a second detection device for detecting the temperature inside the computer room; the control module of the heat dissipation device is connected to both the air conditioning unit and the second detection device to control at least one of the air supply volume, air supply speed, and air supply temperature of the air conditioning unit according to the detection value of the second detection device; wherein, when the detection value of the first detection device of the heat dissipation device is greater than or equal to a first preset value and the detection value of the second detection device is greater than or equal to a second preset value, the control module controls the opening of the control valve of the heat dissipation device.

[0015] According to the technical solution of this invention, a heat dissipation device is used to dissipate heat from a processor. The heat dissipation body of the heat dissipation device is disposed on the processor and has a receiving cavity, a liquid inlet, and a liquid outlet. Both the liquid inlet and the liquid outlet are connected to the receiving cavity, which is used to receive a first cooling medium. The heat dissipation structure includes a heat dissipation section and a heat transfer section connected to each other. At least a portion of the heat transfer section is located inside the receiving cavity to transfer heat from the first cooling medium to the heat dissipation section, and at least a portion of the heat dissipation section is located outside the receiving cavity to transfer heat to the outside. The heat dissipation section has a storage cavity for storing a second cooling medium. In this way, when the heat dissipation device is operating normally, the first cooling medium in the heat dissipation body can not only continuously remove the heat generated by the processor, but also remove the heat of the second cooling medium located in the heat dissipation section through the heat transfer section, so as to ensure that the second cooling medium has a low temperature. When the heat dissipation device fails, the first cooling medium located in the containment cavity continuously absorbs the heat generated by the processor and continues to heat up. The second cooling medium in the heat dissipation section begins to absorb the heat of the first cooling medium through the heat transfer section and transfer it to the outside, so as to avoid the temperature of the first cooling medium being too high, which would cause the processor to be unable to dissipate heat in time, thereby causing the data center to overheat and be damaged. This realizes the emergency redundant heat dissipation of the heat dissipation device, thereby solving the problem of poor heat dissipation reliability in the existing technology of data centers and extending the service life of data centers. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0017] Figure 1 A partial cross-sectional schematic diagram of an embodiment of the heat dissipation device according to the present invention is shown;

[0018] Figure 2 It shows Figure 1 A schematic diagram of the overall structure of the heat dissipation device in the middle;

[0019] Figure 3 It shows Figure 1 A top view of the heat dissipation section of the heat dissipation device in the heat dissipation structure;

[0020] Figure 4 It shows Figure 1 A schematic diagram of the internal structure of the heat dissipation body of the heat dissipation device in the diagram;

[0021] Figure 5 A schematic diagram of the overall structure of an embodiment of the heat dissipation system according to the present invention is shown.

[0022] The above figures include the following reference numerals:

[0023] 1. Air conditioning unit; 2. Data center; 3. Processor; 10. Heat dissipation unit; 11. Receiving cavity; 12. Liquid inlet; 13. Liquid outlet; 20. Heat dissipation structure; 21. Heat dissipation section; 211. Air intake section; 212. Air leeward section; 22. Heat transfer section; 221. Heat transfer body; 222. Heat absorption structure; 30. Fan; 40. Heat conduction structure; 50. Control module; 60. Piping. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0026] In this invention, unless otherwise stated, directional terms such as "up" and "down" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0027] To address the problem of poor heat dissipation reliability in existing data centers, this application provides a heat dissipation device and a heat dissipation system having the same.

[0028] like Figures 1 to 4As shown, the heat dissipation device is used to dissipate heat from the processor 3. The heat dissipation device includes a heat dissipation body 10 and a heat dissipation structure 20. The heat dissipation body 10 is disposed on the processor 3 and has a receiving cavity 11, a liquid inlet 12, and a liquid outlet 13. Both the liquid inlet 12 and the liquid outlet 13 are connected to the receiving cavity 11, which is used to receive a first cooling medium. The heat dissipation structure 20 includes a heat dissipation section 21 and a heat transfer section 22 connected to each other. At least a portion of the heat transfer section 22 is located inside the receiving cavity 11 to transfer heat from the first cooling medium to the heat dissipation section 21, and at least a portion of the heat dissipation section 21 is located outside the receiving cavity 11. The heat dissipation section 21 has a storage cavity for storing a second cooling medium.

[0029] Using the technical solution of this embodiment, the heat dissipation device is used to dissipate heat from the processor 3. The heat dissipation body 10 of the heat dissipation device is disposed on the processor 3. The heat dissipation body 10 has a receiving cavity 11, a liquid inlet 12, and a liquid outlet 13. Both the liquid inlet 12 and the liquid outlet 13 are connected to the receiving cavity 11. The receiving cavity 11 is used to receive a first cooling medium. The heat dissipation structure 20 includes a heat dissipation section 21 and a heat transfer section 22 connected to each other. At least a portion of the heat transfer section 22 is located inside the receiving cavity 11 to transfer heat from the first cooling medium to the heat dissipation section 21. At least a portion of the heat dissipation section 21 is located outside the receiving cavity 11 to transfer heat to the outside. The heat dissipation section 21 has a storage cavity for storing a second cooling medium. In this way, when the heat dissipation device is operating normally, the first cooling medium in the heat dissipation body 10 can not only continuously remove the heat generated by the processor 3, but also remove the heat of the second cooling medium located in the heat dissipation part 21 through the heat transfer part 22, so as to ensure that the second cooling medium has a low temperature. When the heat dissipation device fails, the first cooling medium located in the receiving cavity 11 continuously absorbs the heat generated by the processor 3 and continues to rise in temperature. The second cooling medium in the heat dissipation part 21 begins to absorb the heat of the first cooling medium through the heat transfer part 22 and transfer it to the outside, so as to avoid the temperature of the first cooling medium being too high, which would cause the processor 3 to be unable to dissipate heat in time, thereby causing the data center 2 to overheat and be damaged. This realizes the emergency redundant heat dissipation of the heat dissipation device, thereby solving the problem of poor heat dissipation reliability of the data center in the prior art and extending the service life of the data center 2.

[0030] like Figure 1As shown, the heat transfer section 22 includes a heat transfer body 221 and a heat absorption structure 222 disposed on the heat transfer body 221. The heat absorption structure 222 is located within the receiving cavity 11, and the heat transfer body 221 is connected to the heat dissipation section 21. Thus, by connecting the heat transfer body 221 to the heat dissipation section 21, heat transfer between the first cooling medium and the heat dissipation section 21 can be achieved, thereby realizing the heat transfer function of the heat transfer section 22. Simultaneously, the heat absorption structure 222 can increase the heat absorption rate of the heat transfer section 22, ensuring that the heat in the first cooling medium can be transferred to the heat dissipation section 21 in a timely and rapid manner and dissipated through the heat dissipation section 21, thereby improving the heat dissipation reliability of the heat dissipation structure 20.

[0031] Optionally, the heat transfer body 221 is columnar, and the heat absorption structure 222 is plate-shaped, with the extension direction of the heat absorption structure 222 forming an angle with the bottom wall of the receiving cavity 11; wherein, there is one heat absorption structure 222; or, there are multiple heat absorption structures 222, which are spaced apart along the extension direction of the heat transfer body 221. In this way, because the plate-shaped heat absorption structure 222 forms an angle with the bottom wall of the receiving cavity 11, the heat absorption structure 222 can guide the flow direction of the first cooling medium, ensuring that the first cooling medium can fully contact the bottom wall of the receiving cavity 11, thereby quickly and timely absorbing the heat generated by the processor 3, thus improving the heat dissipation reliability of the heat dissipation device. At the same time, the above arrangement allows for greater flexibility and variety in the number of heat absorption structures 222 to adapt to different working conditions and usage requirements, and also improves the processing flexibility of the operators.

[0032] In this embodiment, the extension direction of the heat-absorbing structure 222 is set at a 30° angle to the bottom wall of the receiving cavity 11. In this way, the above-mentioned arrangement guides the flow direction of the first cooling medium through the heat-absorbing structure 222, while avoiding excessively violent collisions between the first cooling medium and the heat-absorbing structure 222, which would affect the flow of the first cooling medium in the receiving cavity 11, thereby improving the uniformity of the distribution of the first cooling medium in the receiving cavity 11.

[0033] It should be noted that the angle between the extension direction of the heat-absorbing structure 222 and the bottom wall of the receiving cavity 11 is not limited to this value and can be adjusted according to the working conditions and usage requirements. Optionally, the angle between the extension direction of the heat-absorbing structure 222 and the bottom wall of the receiving cavity 11 is 20°, 25°, 35°, 40°, or 45°.

[0034] In this embodiment, there are four heat-absorbing structures 222, which are spaced apart along the extension direction of the heat transfer body 221. This arrangement increases the contact area between the heat transfer section 22 and the first cooling medium, thereby improving the heat transfer rate of the heat transfer section 22.

[0035] It should be noted that the number of heat-absorbing structures 222 is not limited to this and can be adjusted according to operating conditions and usage requirements. Optionally, the heat-absorbing structures 222 can be one, two, three, five, six, seven, or more.

[0036] Specifically, the heat-absorbing structure 222 adopts a biomimetic fish scale structure based on CFD simulation. While increasing the heat exchange area of ​​a single heat-absorbing structure 222, it can reduce the flow resistance of the first cooling medium, thereby further improving the uniformity of the distribution of the first cooling medium in the accommodating cavity 11.

[0037] like Figure 1 and Figure 2 As shown, the heat dissipation body 10 has a mounting hole communicating with the receiving cavity 11. The heat dissipation part 21 is a hollow structure, and the inner cavity of the hollow structure is a storage cavity. One end of the hollow structure extends into the receiving cavity through the mounting hole and is connected to the heat transfer body 221. The heat dissipation device also includes a fan 30, which is mounted on the heat dissipation body 10 and located on one side of the heat dissipation structure 20. The fan 30 is used to blow airflow onto the heat dissipation part 21. In this way, the above configuration, on the one hand, uses the fan 30 to perform air cooling on the heat dissipation part 21 to further improve the heat dissipation speed of the heat dissipation part 21, thereby improving the heat dissipation reliability of the heat dissipation device; on the other hand, the heat dissipation structure 20 can be assembled onto the heat dissipation body 10 through the mounting hole, thereby reducing the assembly difficulty for workers.

[0038] In this embodiment, the hollow structure is columnar.

[0039] like Figure 3 As shown, the hollow structure has a windward portion 211 and a leeward portion 212. The windward portion 211 is located close to the fan 30, and the leeward portion 212 is located away from the fan 30. Along the airflow direction L, the size L1 of the windward portion 211 gradually increases, while the size L2 of the leeward portion 212 gradually decreases. This arrangement of the windward portion 211 and the leeward portion 212 reduces turbulence between the airflow on both sides of the hollow structure, thereby reducing airflow losses, increasing airflow velocity, and ultimately improving the heat dissipation performance of the heat dissipation unit 21.

[0040] In this embodiment, the size L1 of the windward portion 211 is the width of the windward portion 211, and the size L2 of the leeward portion 212 is the width of the leeward portion 212.

[0041] In this embodiment, the length of the windward portion 211 is less than the length of the leeward portion 212, so that the airflow splitting angle is greater than the airflow converging angle, thereby further reducing the process loss of airflow and increasing the airflow velocity.

[0042] Optionally, the heat dissipation body 10 is plate-shaped, with the liquid inlet 12 and liquid outlet 13 both located on one side of the heat dissipation body 10. There may be one heat dissipation structure 20; alternatively, there may be multiple heat dissipation structures 20, spaced apart along the length and / or width of the heat dissipation body 10. This arrangement of the liquid inlet 12 and liquid outlet 13 ensures that the first cooling medium can flow through a sufficiently large receiving cavity 11, thereby improving the uniformity of the distribution of the first cooling medium within the receiving cavity 11. Simultaneously, this arrangement allows for greater flexibility and variety in the number and arrangement of the heat dissipation structures 20, adapting to different working conditions and usage requirements, and also improving the processing flexibility of the operators.

[0043] In this embodiment, since both the inlet 12 and the outlet 13 are located on one side of the heat dissipation body 10, the first cooling medium entering the cavity 11 through the inlet 12 needs to continuously collide with the cavity wall of the cavity 11 and change its flow direction before it can flow out of the cavity 11 through the outlet 13, thereby improving the uniformity of the distribution of the first cooling medium.

[0044] Optionally, when there are multiple heat dissipation structures 20, the multiple heat dissipation structures 20 are spaced apart along the width direction of the heat dissipation body 10; or, the multiple heat dissipation structures 20 are spaced apart along the length and width directions of the heat dissipation body 10. The liquid inlet 12 extends along the width direction of the heat dissipation body 10, and the distance between two adjacent heat dissipation structures 20 gradually decreases. Thus, the first cooling medium flowing out through the liquid inlet 12 will flow towards the side of the receiving cavity 11 away from the liquid inlet 12, resulting in a heat exchange "dead zone" within the receiving cavity 11. Because the distance between two adjacent heat dissipation structures 20 gradually decreases, the collision between the first cooling medium and the heat transfer parts 22 of each heat dissipation structure 20 away from the liquid inlet 12 becomes more intense, increasing the difficulty for the first cooling medium to flow towards the receiving cavity 11 away from the liquid inlet 12, thereby improving the uniformity of the distribution of the first cooling medium within the receiving cavity 11 and avoiding the occurrence of a heat exchange "dead zone".

[0045] In this embodiment, there are 63 heat dissipation structures 20, which are spaced apart along the length and width of the heat dissipation body 10.

[0046] It should be noted that the number of heat dissipation structures 20 is not limited to this and can be adjusted according to operating conditions and usage requirements. Optionally, the heat dissipation structure 20 may be one, two, three, four, five, six, or more.

[0047] In other embodiments not shown in the accompanying drawings, multiple heat dissipation structures are spaced apart along the width direction of the heat dissipation body.

[0048] Optionally, the heat dissipation device further includes a cooling device, a control valve, a first detection device, and a control module 50. The cooling device is connected to the liquid inlet 12 via a pipe 60 for introducing a first cooling medium into the receiving cavity 11. The control valve is installed on the pipe 60 to control at least one of the flow rate, flow velocity, and delivery pressure of the first cooling medium within the pipe 60. The first detection device is used to detect the temperature of the processor 3. The control module 50 is connected to the first detection device, the control valve, and the fan 30. The control module 50 adjusts the operating parameters of the control valve according to the detection value of the first detection device; and / or, the control module 50 adjusts at least one of the speed and direction of the fan 30 according to the detection value of the first detection device; and / or, a thermally conductive structure 40 is provided between the heat dissipation body 10 and the processor 3. At least a portion of the thermally conductive structure 40 is made of thermally conductive silicone. In this way, the heat dissipation device can automatically adjust the flow rate of the first cooling medium and the speed of the fan 30 within the heat dissipation body 10 according to the actual operating temperature of the processor 3. This improves the intelligence of the heat dissipation device and avoids excessive heat dissipation performance leading to energy waste, thus reducing the operating cost and improving its environmental friendliness. Simultaneously, by setting up the heat conduction structure 40, the heat transfer speed between the processor 3 and the heat dissipation body 10 can be increased, thereby improving the heat dissipation reliability of the device.

[0049] like Figure 5 As shown, this application also provides a heat dissipation system, which includes an air conditioning unit 1 and multiple heat dissipation devices. The air conditioning unit 1 is installed in the computer room, and the multiple heat dissipation devices are installed one-to-one with the multiple processors 3 of the data center 2 in the computer room. The heat dissipation devices are those described above. In this way, the heat dissipation devices can locally dissipate heat from the processors 3 that generate a lot of heat, and the heat is transferred to the computer room and cooled as a whole through the air conditioning unit 1. The combined effect of the two ensures the stable and safe operation of the data center 2 to the greatest extent. Simultaneously, even if a heat dissipation device fails, the heat dissipation structure 20 on the heat dissipation device can still dissipate heat from the first cooling medium inside the heat dissipation body 10 in a timely manner, thereby improving the heat dissipation reliability of the data center 2.

[0050] Optionally, the heat dissipation system also includes a second detection device for detecting the temperature inside the computer room. The control module 50 of the heat dissipation device is connected to both the air conditioning unit 1 and the second detection device to control at least one of the air volume, air speed, and air temperature of the air conditioning unit 1 based on the detection value of the second detection device. Specifically, when the detection value of the first detection device is greater than or equal to a first preset value, and the detection value of the second detection device is greater than or equal to a second preset value, the control module 50 controls the opening of the control valve of the heat dissipation device. In this way, the above configuration allows the heat dissipation system to automatically adjust the operating status of the air conditioning unit 1 and the heat dissipation device according to the air temperature and the temperature of the processor 3 in the computer room. This improves the intelligence of the heat dissipation system and reduces the power consumption during operation, thus lowering the operating cost and improving its environmental friendliness.

[0051] In this embodiment, when the detection value of the first detection device of the heat dissipation device is less than the first preset value and the detection value of the second detection device is less than the second preset value, the control module 50 determines that the operating power of the air conditioning device 1 can meet the heat dissipation requirements of the processor 3, and at this time only the air conditioning device 1 is started.

[0052] In this embodiment, when the detection value of the first detection device of the heat dissipation device is greater than or equal to the first preset value and the detection value of the second detection device is less than the second preset value, since the heat generated by the processor 3 cannot cause the temperature in the computer room to rise above the second preset value, the control module 50 still determines that the operating power of the air conditioning device 1 can meet the heat dissipation requirements of the processor 3, and only the air conditioning device 1 is started at this time.

[0053] In this embodiment, when the detection value of the first detection device of the heat dissipation device is greater than or equal to the first preset value and the detection value of the second detection device is greater than or equal to the second preset value, the control module 50 determines that the operating power of the air conditioning device 1 cannot meet the heat dissipation requirements of the processor 3. At this time, the control module 50 controls the control valve to start, and the heat dissipation device begins to perform local water cooling on the processor 3.

[0054] In this embodiment, when the detection value of the first detection device of the heat dissipation device is greater than or equal to the third preset value and the detection value of the second detection device is greater than or equal to the second preset value, the control module 50 determines that the heat dissipation device has failed. At this time, the control module 50 controls the fan 30 to start so as to perform air cooling on the heat dissipation structure 20 through the fan 30 to ensure the heat dissipation reliability of the heat dissipation device.

[0055] Optionally, the first preset value is greater than or equal to 50°C and less than or equal to 70°C.

[0056] Optionally, the second preset value is greater than or equal to 28°C and less than or equal to 32°C.

[0057] Optionally, the third preset value is greater than 70°C and less than or equal to 85°C.

[0058] It should be noted that when the detection value of the first detection device is less than the third preset value but greater than or equal to the first preset value, the fan 30 can also be started to improve the heat dissipation performance of the heat dissipation device.

[0059] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0060] A heat dissipation device is used to dissipate heat from the processor. The heat dissipation body of the device is mounted on the processor and has a receiving cavity, a liquid inlet, and a liquid outlet. Both the liquid inlet and the liquid outlet are connected to the receiving cavity, which is used to contain a first cooling medium. The heat dissipation structure includes a heat dissipation section and a heat transfer section connected to each other. At least a portion of the heat transfer section is located inside the receiving cavity to transfer heat from the first cooling medium to the heat dissipation section, and at least a portion of the heat dissipation section is located outside the receiving cavity to transfer heat to the outside. The heat dissipation section has a storage cavity for storing a second cooling medium. In this way, when the heat dissipation device is operating normally, the first cooling medium in the heat dissipation body can not only continuously remove the heat generated by the processor, but also remove the heat of the second cooling medium located in the heat dissipation section through the heat transfer section, so as to ensure that the second cooling medium has a low temperature. When the heat dissipation device fails, the first cooling medium located in the containment cavity continuously absorbs the heat generated by the processor and continues to heat up. The second cooling medium in the heat dissipation section begins to absorb the heat of the first cooling medium through the heat transfer section and transfer it to the outside, so as to avoid the temperature of the first cooling medium being too high, which would cause the processor to be unable to dissipate heat in time, thereby causing the data center to overheat and be damaged. This realizes the emergency redundant heat dissipation of the heat dissipation device, thereby solving the problem of poor heat dissipation reliability in the existing technology of data centers and extending the service life of data centers.

[0061] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

[0062] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0063] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipation device for dissipating heat from a processor (3), characterized in that, The heat dissipation device includes: A heat dissipation body (10) is disposed on the processor (3). The heat dissipation body (10) has a receiving cavity (11), a liquid inlet (12) and a liquid outlet (13). The liquid inlet (12) and the liquid outlet (13) are both connected to the receiving cavity (11). The receiving cavity (11) is used to receive the first cooling medium. The heat dissipation structure (20) includes a heat dissipation part (21) and a heat transfer part (22) connected to each other. At least a portion of the heat transfer part (22) is located inside the receiving cavity (11) for transferring heat in the first cooling medium to the heat dissipation part (21). At least a portion of the heat dissipation part (21) is located outside the receiving cavity (11). The heat dissipation section (21) has a storage cavity for storing a second cooling medium. When the heat dissipation device is operating normally, the first cooling medium in the heat dissipation body (10) absorbs the heat generated by the processor (3) and absorbs the heat of the second cooling medium located in the heat dissipation section (21) through the heat transfer section (22). When the heat dissipation device fails, the first cooling medium located in the receiving cavity (11) continuously absorbs the heat generated by the processor (3) and continues to heat up. The second cooling medium in the heat dissipation section (21) begins to absorb the heat of the first cooling medium through the heat transfer section (22) and transfer it to the outside. The heat transfer part (22) includes a heat transfer body (221) and a heat absorption structure (222) disposed on the heat transfer body (221). The heat absorption structure (222) is located in the receiving cavity (11). The heat transfer body (221) is connected to the heat dissipation part (21). The heat transfer body (221) is columnar, and the heat absorption structure (222) is plate-shaped. The extension direction of the heat absorption structure (222) is set at an angle to the bottom wall of the receiving cavity (11). There is one heat absorption structure (222); or there are multiple heat absorption structures (222), and multiple heat absorption structures (222) are spaced apart along the extension direction of the heat transfer body (221). The heat dissipation body (10) has a mounting hole communicating with the receiving cavity (11), the heat dissipation part (21) is a hollow structure, the inner cavity of the hollow structure is the storage cavity, one end of the hollow structure extends into the receiving cavity through the mounting hole and is connected to the heat transfer body (221), and the heat dissipation device further includes: A fan (30) is disposed on the heat dissipation body (10) and located on one side of the heat dissipation structure (20). The fan (30) is used to blow airflow to the heat dissipation part (21). The hollow structure has a windward portion (211) and a leeward portion (212). The windward portion (211) is located close to the fan (30), and the leeward portion (212) is located away from the fan (30). Along the flow direction L of the airflow, the size L1 of the windward portion (211) gradually increases, and the size L2 of the leeward portion (212) gradually decreases.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation body (10) is plate-shaped, and the liquid inlet (12) and the liquid outlet (13) are both located on one side of the heat dissipation body (10); wherein, there is one heat dissipation structure (20); or, there are multiple heat dissipation structures (20), and the multiple heat dissipation structures (20) are spaced apart along the length direction and / or width direction of the heat dissipation body (10).

3. The heat dissipation device according to claim 2, characterized in that, When there are multiple heat dissipation structures (20), Multiple heat dissipation structures (20) are spaced apart along the width direction of the heat dissipation body (10); or, Multiple heat dissipation structures (20) are spaced apart along the length and width directions of the heat dissipation body (10); The liquid inlet (12) extends along the width direction of the heat dissipation body (10), and the distance between two adjacent heat dissipation structures (20) gradually decreases.

4. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes: A refrigeration device, which is connected to the liquid inlet (12) via a pipe (60) for inputting the first cooling medium into the receiving cavity (11); A control valve is provided on the pipeline (60) for controlling at least one of the flow rate, velocity and delivery pressure of the first cooling medium in the pipeline (60); A first detection device is used to detect the temperature of the processor (3); Control module (50), which is connected to the first detection device, the control valve, and the fan (30), adjusts the operating parameters of the control valve according to the detection value of the first detection device; and / or, adjusts at least one of the speed and direction of the fan (30) according to the detection value of the first detection device; and / or, A heat-conducting structure (40) is provided between the heat dissipation body (10) and the processor (3); wherein at least a portion of the heat-conducting structure (40) is made of thermally conductive silicone.

5. A heat dissipation system, characterized in that, The heat dissipation system includes an air conditioning unit (1) and multiple heat dissipation devices. The air conditioning unit (1) is installed in the computer room, and the multiple heat dissipation devices are installed one-to-one with the multiple processors (3) of the data center (2) in the computer room. The heat dissipation device is the heat dissipation device according to any one of claims 1 to 4.

6. The heat dissipation system according to claim 5, characterized in that, The heat dissipation system also includes: A second detection device is used to detect the temperature inside the computer room; The control module (50) of the heat dissipation device is connected to both the air conditioning device (1) and the second detection device to control at least one of the air supply volume, air supply speed and air supply temperature of the air conditioning device (1) according to the detection value of the second detection device. When the detection value of the first detection device of the heat dissipation device is greater than or equal to the first preset value and the detection value of the second detection device is greater than or equal to the second preset value, the control module (50) controls the opening of the control valve of the heat dissipation device.

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