Processing fluid, processing fluid composition, and brittle material processing fluid composition

Abstract

A processing liquid comprising: component (A): a compound having a clouding point of 1% by mass aqueous solution of 20°C or higher and 50°C or lower, a copolymer site of ethylene oxide and an alkylene oxide other than ethylene oxide, and no ethynyl group; component (B): a compound having a clouding point of 1% by mass aqueous solution of more than 50°C and 80°C or lower, a copolymer site of ethylene oxide and an alkylene oxide other than ethylene oxide, and no ethynyl group; component (C): one or more selected from the group consisting of an acetylene diol having an HLB value of 4 or higher and 12 or lower and an alkylene oxide adduct of an acetylene diol having an HLB value of 4 or higher and 12 or lower; and component (D): water, contains component (A), component (B), and component (C) in specific amounts.

Description

Technical Field

[0001] This invention relates to processing fluids, compositions for processing fluids, and processing fluid compositions for brittle materials. Background Technology

[0002] In the manufacture of semiconductor products, it is important to machine silicon ingots, which are brittle materials, with good precision. From the point of view of machining accuracy and productivity, wire sawing is usually used in the machining of silicon ingots.

[0003] In addition, wire sawing can also be used in the processing of materials such as ceramics, quartz, sapphire, and glass.

[0004] Generally speaking, the processing methods using a wire saw can be categorized as follows: the free abrasive method, in which free abrasive is supplied to the sliding part between the wire and the workpiece while processing, and the fixed abrasive method, in which abrasive is pre-fixed on the surface of the wire.

[0005] In addition, in both types of wire sawing, machining fluid (coolant) is used to improve machining efficiency, suppress friction between the workpiece and the machining tool, reduce frictional heat generated during machining, extend tool life, and remove chips.

[0006] As processing fluids used in the aforementioned applications, they include: oil-based processing fluids with mineral oil, vegetable oil, synthetic oil, etc. as the main components; and water-based processing fluids that are formulated with compounds possessing surface-active properties to impart water solubility.

[0007] In recent years, from the perspective of operational safety and environmental issues, water-soluble processing fluids have been gradually used.

[0008] For example, Patent Document 1 discloses a water-soluble cutting fluid for silicon ingot slicing, characterized in that, as essential components, it contains a polyoxyalkylene adduct with a number average molecular weight of less than 500 and having a specific structure, and a mono- or binary aliphatic carboxylic acid or its salt having a carbon atom number (including carbon in the carbonyl group) of 4 to 10.

[0009] Patent document 2 discloses a water-soluble processing fluid composition for a fixed abrasive wire saw, characterized in that it is a water-soluble processing fluid composition for a fixed abrasive wire saw used for cutting rare earth magnets, and is made of diols, carboxylic acids, water-soluble and alkaline compounds and water in specific amounts (wherein the total of these components is 100 parts by weight).

[0010] Patent document 3 discloses a processing fluid for brittle materials, which contains, in specific amounts, one or more of the following: an ethylene oxide adduct selected from acetylenide glycol with an HLB value of 4 or higher and 12 or lower, and an ethylene oxide adduct with an HLB value of 4 or higher and 12 or lower; an ethylene oxide adduct with an HLB value of 6 or higher and an addition molar number of ethylene oxide in its molecular structure of 5 or higher, wherein the ethylene oxide adduct is a nonionic surfactant without an acetylenic group; and a carboxylic acid.

[0011] Existing technical documents

[0012] Patent documents

[0013] Patent Document 1: Japanese Patent Application Publication No. 2011-68884

[0014] Patent Document 2: Japanese Patent Application Publication No. 2003-82335

[0015] Patent Document 3: Japanese Patent Application Publication No. 2018-154762 Summary of the Invention

[0016] The problem that the invention aims to solve

[0017] Generally, the aforementioned two wire sawing methods utilize multi-wire sawing devices to cut multiple silicon wafers from a silicon ingot in a single operation. In a multi-wire sawing device, a wire is wound into each groove of two or more guide rollers engraved with multiple grooves at predetermined intervals, and each wire is held parallel at a predetermined tension. During the cutting process, the guide rollers rotate, and while processing fluid sprayed from nozzles adheres to the wire, the wire is propelled in one or both directions, pressing the silicon ingot against the fluid-coated wire for cutting.

[0018] The cutting fluid used in this wire sawing process is placed in a tank provided with the wire saw device. A pump on the wire saw device supplies the fluid from this tank to a nozzle in the cutting chamber, from which it is sprayed out. The fluid sprayed from the nozzle is then supplied to the cutting gap (the gap between the wire and the silicon ingot), and after being used for lubrication and other purposes, it returns to the aforementioned tank. In this way, the cutting fluid circulates within the wire saw device during the cutting of the silicon ingot.

[0019] During this cutting process, the high-speed rotation of the guide rollers, which accompanies the high wire speed, sometimes causes the processing fluid to scatter violently, resulting in foaming. Additionally, during this cutting process, the processing fluid sometimes flows into the tank located at the bottom of the wire saw unit, causing the processing fluid inside the tank to foam violently and overflow. This leads to the following problems: the fine cutting powder generated during this cutting process exacerbates the foaming of the processing fluid; and the wire saw and the cut wafers become severely contaminated by this cutting powder, increasing the burden on them for cleaning.

[0020] In addition, for example, in recent years, in the field of producing silicon wafers from the aforementioned silicon ingots, there has been a demand to further improve productivity. Based on reasons such as the ability to cut in a short time using free abrasives and the ability to use finer wire tools to improve yield, fixed abrasive methods have been gradually and widely used.

[0021] In this way, for processing fluids, in addition to the traditional requirement of adequate lubricity, suppressing foaming during use and improving the cleanliness of the shredded material contributes to more stable production and improved processing accuracy. Furthermore, as mentioned above, water-soluble processing fluids have been required in recent years.

[0022] Therefore, a better balance of lubricity, defoaming properties, and detergency is sought in processing fluids.

[0023] The present invention was made in view of the above-mentioned problems, and the subject of the present invention is to provide a processing fluid with excellent lubricity, defoaming and detergency.

[0024] means for solving problems

[0025] The inventors have discovered through in-depth research that a processing fluid containing water and specific components, with the content of each component meeting a specific range, can solve the aforementioned problems. The various embodiments of the present invention were made based on this insight. That is, according to various embodiments of the present invention, the following [1] to

[17] are provided.

[0026] [1] A processing fluid, comprising:

[0027] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0028] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0029] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0030] Ingredient (D): Water,

[0031] The content of component (A) is 0.010% by mass or more, based on 100% by mass of the total amount of the processing fluid.

[0032] The content of component (B), based on 100% by mass of the total amount of the processing fluid, is 0.005% by mass or more and 0.090% by mass or less, and

[0033] The content of component (C) is 0.006% by mass or more, based on 100% by mass of the total amount of the processing fluid.

[0034] [2] According to the processing fluid described in [1] above, the content of component (A) is less than 0.200% by mass based on 100% by mass of the total amount of processing fluid.

[0035] [3] According to the processing fluid described in [1] or [2] above, the content of component (C) is less than 0.100% by mass based on 100% by mass of the total amount of processing fluid.

[0036] [4] The processing fluid according to any one of [1] to [3] above, wherein component (A) is a compound having a turbidity point of 1% by mass aqueous solution of 20°C or higher and 50°C or lower, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0037] [5] The processing fluid according to any one of [1] to [4] above, wherein component (B) is a compound having a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0038] [6] The processing fluid according to any one of [1] to [5] above, wherein the ratio of the content of component (A) to the content of component (B) [(A) / (B)] is 1.00 or more by mass.

[0039] [7] The processing fluid according to any one of [1] to [6] above, wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [(A)+(B) / (C)] is 1.00 or more by mass.

[0040] [8] The processing fluid according to any one of [1] to [7] above, wherein the content of component (D) is 95.000% by mass or more and 99.979% by mass or less based on 100% by mass of the total amount of the processing fluid.

[0041] [9] The processing fluid according to any one of [1] to [8] above has a pH of 3.0 or higher and 9.0 or lower.

[0042]

[10] The processing fluid according to any one of [1] to [9] above is used when processing a workpiece containing brittle material using wire.

[0043]

[11] According to the processing fluid described in

[10] above, wherein the aforementioned wire is a fixed abrasive wire.

[0044]

[12] The processing fluid described in

[10] or

[11] above, wherein the aforementioned brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[0045]

[13] The method for manufacturing the processing fluid according to any one of [1] to

[12] above, wherein at least the following components are mixed:

[0046] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0047] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0048] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0049] Ingredient (D): Water,

[0050] The processing fluid is prepared by mixing components (A) at a concentration of 0.010% or more based on 100% of the total mass of the processing fluid, components (B) at a concentration of 0.005% or more and 0.090% or less based on 100% of the total mass of the processing fluid, and components (C) at a concentration of 0.006% or more based on 100% of the total mass of the processing fluid.

[0051]

[14] A processing fluid composition comprising:

[0052] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0053] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0054] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0055] Ingredient (D): Water,

[0056] The content of component (A) is 0.200% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0057] The content of component (B) is 0.100% by mass and less than 92.000% by mass, based on 100% by mass of the total amount of the processing fluid composition.

[0058] The content of component (C) is 0.120% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0059]

[15] The method for manufacturing the composition for processing fluids of brittle materials described in

[14] above, wherein at least the following components are mixed:

[0060] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0061] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0062] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0063] Ingredient (D): Water,

[0064] The processing fluid composition is obtained by mixing components (A) in a manner that is 0.200% by mass or more based on 100% by mass of the total amount of the processing fluid composition, components (B) in a manner that is 0.100% by mass or more and 92.000% by mass or less based on 100% by mass of the total amount of the processing fluid composition, and components (C) in a manner that is 0.120% by mass or more based on 100% by mass of the total amount of the processing fluid composition.

[0065]

[16] A brittle material processing fluid composition comprising an additive mixture and component (D): water, said additive mixture comprising components (A) to (C),

[0066] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0067] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0068] Component (C): Selected from one or more alkylene oxide adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower.

[0069] In the aforementioned additive mixture,

[0070] The content of component (A) is 20.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0071] The content of component (B), based on 100% by mass of the total amount of the aforementioned additive mixture, is 5.00% by mass or more and 53.50% by mass or less, and

[0072] The content of component (C) is 5.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0073]

[17] The method for manufacturing the brittle material processing fluid composition described in

[16] above, wherein at least an additive mixture comprising the following components (A) to (C) and component (D): water,

[0074] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0075] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0076] Component (C): Selected from one or more alkylene oxide adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower.

[0077] A brittle material processing fluid composition is obtained by mixing the aforementioned additive mixture in such a manner that the content of component (A) is 20.00% or more based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (B) is 5.00% or more and 53.50% or less based on 100% by mass of the total amount of the aforementioned additive mixture, and the content of component (C) is 5.00% or more based on 100% by mass of the total amount of the aforementioned additive mixture.

[0078] Invention Effects

[0079] According to the present invention, a processing fluid with excellent lubricity, defoaming properties and detergency can be provided. Detailed Implementation

[0080] [Processing fluid]

[0081] One embodiment of the present invention describes a processing fluid comprising:

[0082] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0083] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0084] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0085] Ingredient (D): Water,

[0086] The content of component (A) is 0.010% by mass or more, based on 100% by mass of the total amount of the processing fluid.

[0087] The content of component (B), based on 100% by mass of the total amount of the processing fluid, is 0.005% by mass or more and 0.090% by mass or less, and

[0088] The content of component (C) is 0.006% by mass or more, based on 100% by mass of the total amount of the processing fluid.

[0089] Processing fluids that meet all the aforementioned conditions exhibit an excellent balance of lubricity, defoaming properties, and detergency.

[0090] It should be noted that, unless otherwise specified, in this specification, "alkylene oxide (hereinafter also referred to as "AO") adducts" include not only compounds with a single alkylene oxide added, but also compounds with multiple alkylene oxides added, i.e., polyalkylene oxides. The same applies to "ethylene oxide (hereinafter also referred to as "EO") adducts" and "propylene oxide (hereinafter also referred to as "PO") adducts" below.

[0091] In addition, the “HLB value” used in this specification refers to the HLB (Hydrophilic-Lipophilic Balance) value calculated by the Griffin method.

[0092] It should be noted that, in this specification, the lower limit and upper limit values ​​that are periodically recorded for preferred numerical ranges (e.g., ranges of content, etc.) can be combined independently. For example, for this numerical range, based on the record of the lower limit value "preferably 10 or more, more preferably 20 or more, and even more preferably 30 or more" and the record of "preferably 90 or less, more preferably 80 or less, and even more preferably 60 or less", the "preferred lower limit value (10)" and the "even more preferred upper limit value (60)" can be combined to set the suitable range to "10 or more and 60 or less". Similarly, the "even more preferred lower limit value (30)" and the "preferential upper limit value (90)" can be combined to set the suitable range to "30 or more and 90 or less".

[0093] Similarly, based on the description "preferably 10 to 90, more preferably 20 to 80, and even more preferably 30 to 60", it can also be set to "10 to 60" or "30 to 90".

[0094] It should be noted that unless otherwise specified, when a preferred numerical range is abbreviated as "10-90", it means the range of 10 and above and 90 and below.

[0095] Furthermore, the numerical ranges that should be satisfied can also be combined with the preferred numerical ranges described in the stages. For example, if the numerical range that should be satisfied is 5 or more and 100 or less, the lower limit value "5" that should be satisfied can be combined with the aforementioned "further preferred upper limit value (60)" to set the suitable range as "5 or more and 60 or less". Similarly, the "preferred lower limit value (10)" can be combined with the upper limit value "100" that should be satisfied to set the suitable range as "10 or more and 100 or less". Regarding the combination of these numerical ranges that should be satisfied and the preferred numerical ranges, similarly to the combination of the aforementioned preferred numerical ranges, when the numerical range and preferred numerical range are abbreviated as "5 to 100" and "preferably 10 to 90", they can be combined in the same way.

[0096] The following is a description of the components contained in this processing fluid.

[0097] <Ingredients (A)>

[0098] Component (A) is a compound having a turbidity point of 20°C or higher and 50°C or lower in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and alkyl oxidases other than ethylene oxide, and not having an acetylene group. Preferably, it is a compound having a turbidity point of 20°C or higher and 50°C or lower in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0099] If the turbidity point of a 1% aqueous solution of component (A) is below 20°C, the solubility of component (A) in water decreases. On the other hand, a substance whose turbidity point of a 1% aqueous solution of component (A) exceeds 50°C but is below 80°C meets the criteria for component (B) described later. In the case where the aforementioned processing fluid does not contain component (A), the lubricity of the processing fluid decreases.

[0100] Therefore, from the viewpoint of obtaining a processing fluid with excellent lubricity, the turbidity point of a 1% by mass aqueous solution of component (A) is preferably 22°C or higher, more preferably 25°C or higher, further preferably 30°C or higher, even more preferably 35°C or higher, and preferably 49°C or lower, more preferably 48°C or lower, even more preferably 47°C or lower, and even more preferably 46°C or lower.

[0101] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one aspect of component (A), the turbidity point of a 1% by mass aqueous solution of component (A) is preferably 22°C or higher and 49°C or lower, more preferably 25°C or higher and 48°C or lower, further preferably 30°C or higher and 47°C or lower, and even more preferably 35°C or higher and 46°C or lower.

[0102] In addition, the turbidity point of a 1% aqueous solution of component (A) is a value measured using the method described in the examples described later.

[0103] The compound described as component (A) that comprises a copolymer of ethylene oxide and an alkylene oxide other than ethylene oxide and does not have an acetylene group may include, for example, one or more selected from copolymers of EO and AO other than EO or polyoxyethylene alkylene ethers.

[0104] The copolymer of EO and AO other than EO described in component (A) is a copolymer of EO and AO other than EO described later. The addition of EO and AO other than EO can be either random addition or block addition, or a mixture of random addition and block addition. Preferably, it is a copolymer of block addition.

[0105] As an ingredient (A), AO other than EO can be listed as, for example, epoxides with 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-epoxide, 2,3-epoxide, 1,3-epoxide, and tetrahydrofuran.

[0106] The copolymer of EO and AO other than EO described in component (A) is more preferably a copolymer of EO and PO, further preferably a block copolymer of EO and PO (also called a "block copolymer having polyethylene glycol units and polypropylene glycol units"), and even more preferably a triblock copolymer of EO and PO (also called a "triblock copolymer having polyethylene glycol units and polypropylene glycol units"). Furthermore, the triblock copolymer of EO and PO can be a triblock copolymer with EO as the terminal block and PO as the middle block (EO / PO / EO type), or a triblock copolymer with PO as the terminal block and EO as the middle block (so-called reverse type, PO / EO / PO type).

[0107] The polyoxyethylene alkylene ethers described as component (A) include EO of alcohols and AO adducts other than EO, preferably EO and PO adducts of alcohols.

[0108] Examples of such alcohols include aliphatic alcohols with 1 or more but 24 or fewer carbon atoms. From the viewpoint of balancing hydrophilicity and lipophilicity, the number of carbon atoms in such alcohols is preferably 1 to 14, more preferably 1 to 10, even more preferably 1 to 6, even more preferably 1 to 4, even more preferably 1 or 2, and even more preferably 1.

[0109] The aliphatic alcohol is preferably a primary or secondary alcohol, more preferably a primary alcohol. It can also be linear, branched, or cyclic, but linear is preferred.

[0110] Examples of aliphatic alcohols include, for instance, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, 2-methyl-2-butanol, pentanol, isopentanol, hexanol, 3-methyl-1-pentanol, heptanol, 2-heptanol, 3-heptanol, octanol, 2-ethylhexanol, nonanol, decanol, undecaneol, lauryl alcohol, tridecaneol, isotriadecaneol, myristol, pentadecaneol, palmitol, heptadecanol, stearol, isostearol, nonadecanol, eicosaneol, and other saturated aliphatic alcohols; octenol, decenol, dodecenol, tridecenol, tetradecenol, palmitol, oleenol, eicosenecanol, linolenic acid alcohol, and other unsaturated aliphatic alcohols; and ethylcyclohexanol, propylcyclohexanol, octylcyclohexanol, nonylcyclohexanol, adamantanol, and other cyclic aliphatic alcohols.

[0111] As a component (A), the aforementioned AO, excluding EO, in the polyoxyethylene alkylene alkyl ether can include, for example, alkylene oxides having 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-epoxybutane, 2,3-epoxybutane, 1,3-epoxybutane, and tetrahydrofuran. Among these, PO is preferred.

[0112] In addition, in the polyoxyethylene alkylene ether described in component (A), in the copolymerization site of the aforementioned EO and AO other than EO, the addition of EO to AO other than EO can be either random addition or block addition, or a mixture of random addition and block addition.

[0113] It should be noted that the aforementioned polyoxyethylene alkylene ethers can be synthesized by adding EO and AO to the aforementioned alcohols. The addition of EO and AO to the alcohols can be carried out using known methods, or in the absence of a catalyst or in the presence of a catalyst, under normal or high pressure in one or more stages.

[0114] Furthermore, in the copolymerization region of EO and AO other than EO described in component (A), the content of structural units derived from EO is preferably 15 mol% or more, more preferably 20 mol% or more, and even more preferably 25 mol% or more in the total amount of structural units constituting the aforementioned copolymerization region of 100 mol%, and is preferably 85 mol% or less, more preferably 80 mol% or less, and even more preferably 75 mol% or less.

[0115] Furthermore, from the viewpoint of improving lubricity, the mass-average molecular weight (Mw) of component (A) is preferably 500 or more, more preferably 1,000 or more, further preferably 1,500 or more, and even more preferably 2,000 or more. On the other hand, from the viewpoint of improving the abrasive's engagement with the workpiece, the mass-average molecular weight (Mw) of component (A) is preferably 10,000 or less, more preferably 9,000 or less, further preferably 8,000 or less, and even more preferably 6,000 or less.

[0116] In addition, the mass-average molecular weight (Mw) value was measured using the method described in the examples described later.

[0117] Component (A) can be used alone or in combination of two or more.

[0118] The content of component (A) is 0.010% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid. If the content is less than 0.010% by mass, the lubricity of the processing fluid is poor.

[0119] Therefore, from the viewpoint of improving the lubricity of the processing fluid, the content of component (A) is preferably 0.015% by mass or more, more preferably 0.020% by mass or more, further preferably 0.025% by mass or more, even more preferably 0.030% by mass or more, and even more preferably 0.035% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid.

[0120] On the other hand, from the viewpoint of improving the defoaming properties of the processing fluid, the content of component (A) is preferably 0.200% by mass or less, more preferably 0.100% by mass or less, further preferably 0.080% by mass or less, and even more preferably 0.075% by mass or less, based on 100% by mass of the total amount of the aforementioned processing fluid.

[0121] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one aspect of the aforementioned processing fluid, the content of component (A), based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 0.010% by mass or more and 0.200% by mass or less, more preferably 0.015% by mass or more and 0.200% by mass or less, further preferably 0.020% by mass or more and 0.200% by mass or less, even more preferably 0.025% by mass or more and 0.100% by mass or less, even more preferably 0.030% by mass or more and 0.080% by mass or less, and even more preferably 0.035% by mass or more and 0.075% by mass or less.

[0122] <Ingredient (B)>

[0123] Component (B) is a compound having a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and alkyl oxidases other than ethylene oxide, and not having an acetylene group. Preferably, it is a compound having a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0124] A substance whose turbidity point of a 1% by mass aqueous solution of component (B) is 50°C or lower and 20°C or higher conforms to the aforementioned component (A). When the processing fluid does not contain component (B), the cleaning properties of the processing fluid decrease. Therefore, from the viewpoint of obtaining a processing fluid with excellent cleaning properties, the turbidity point of a 1% by mass aqueous solution of component (B) is preferably 55°C or higher, more preferably 58°C or higher, and even more preferably 60°C or higher.

[0125] On the other hand, if the turbidity point of a 1% by mass aqueous solution of component (B) exceeds 80°C, the cleaning properties of the processing fluid decrease. Therefore, from the viewpoint of obtaining a processing fluid with excellent cleaning properties, the turbidity point of a 1% by mass aqueous solution of component (B) is preferably 75°C or less, more preferably 70°C or less, and even more preferably 65°C or less.

[0126] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as a component (B), the turbidity point of a 1% by mass aqueous solution of component (B) is preferably 55°C or higher and 75°C or lower, more preferably 58°C or higher and 70°C or lower, and even more preferably 60°C or higher and 65°C or lower.

[0127] In addition, the turbidity point of a 1% aqueous solution of component (B) was measured using the method described in the examples described later.

[0128] The compound described in component (B) above, which comprises a copolymer of ethylene oxide and an alkylene oxide other than ethylene oxide and does not have an acetylene group, can be exemplified by one or more selected from copolymers of EO and AO other than EO or polyoxyethylene alkylene ethers. Among these, copolymers of EO and AO other than EO are preferred.

[0129] In the copolymer of EO and AO other than EO described in component (B), the addition of EO and AO other than EO can be either random addition or block addition, or a mixture of random addition and block addition, preferably a copolymer of block addition.

[0130] As an AO other than EO as described in component (B) above, examples include epoxides with 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-epoxide, 2,3-epoxide, 1,3-epoxide, and tetrahydrofuran.

[0131] The copolymer of EO and AO other than EO as described in component (B) is more preferably a copolymer of EO and PO, even more preferably a block copolymer of EO and PO, even more preferably a triblock copolymer of EO and PO, and even more preferably a Pluronic type copolymer (EO-PO-EO type triblock copolymer) with ethylene oxide added to polypropylene glycol.

[0132] Furthermore, in the copolymer of EO and AO other than EO described in component (B), the content of structural units derived from EO is preferably 25 mol% or more, more preferably 30 mol% or more, further preferably 35 mol% or more, and even more preferably 40 mol% or more, in the total amount of structural units constituting the copolymer of 100 mol%, and is preferably 75 mol% or less, more preferably 70 mol% or less, further preferably 65 mol% or less, and even more preferably 60 mol% or less.

[0133] The polyoxyethylene alkylene ether described as component (B) is identical to that described for component (A), except for the difference in turbidity point, and its suitability is also the same.

[0134] Furthermore, from the viewpoint of improving lubricity, the mass-average molecular weight (Mw) of component (B) is preferably 500 or more, more preferably 1,000 or more, further preferably 1,500 or more, and even more preferably 2,000 or more. On the other hand, from the viewpoint of improving the abrasive's engagement with the workpiece, the mass-average molecular weight (Mw) of component (B) is preferably 10,000 or less, more preferably 9,000 or less, further preferably 8,000 or less, and even more preferably 6,000 or less.

[0135] In addition, the mass-average molecular weight (Mw) value was measured using the method described in the examples described later.

[0136] Component (B) can be used alone or in combination of two or more.

[0137] The content of component (B) is 0.005% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid. If the content is less than 0.005% by mass, the cleaning properties of the processing fluid are poor.

[0138] Therefore, from the viewpoint of improving the cleanliness of the processing fluid, the content of component (B) is preferably 0.010% by mass or more, more preferably 0.012% by mass or more, and even more preferably 0.015% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid.

[0139] On the other hand, the content of component (B) is 0.090% by mass or less, based on 100% by mass of the total amount of the aforementioned processing fluid. If this content exceeds 0.090% by mass, the lubricity of the processing fluid is poor.

[0140] Therefore, from the viewpoint of improving the lubricity of the processing fluid, the content of component (B) is preferably 0.080% by mass or less, more preferably 0.050% by mass or less, and even more preferably 0.030% by mass or less, based on 100% by mass of the total amount of the aforementioned processing fluid.

[0141] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one aspect of the aforementioned processing fluid, the content of component (B), based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 0.010% by mass or more and 0.080% by mass or less, more preferably 0.012% by mass or more and 0.050% by mass or less, and even more preferably 0.015% by mass or more and 0.030% by mass or less.

[0142] Furthermore, from the viewpoint of improving the lubricity of the processing fluid, in the aforementioned processing fluid, the ratio of the content of the aforementioned component (A) to the content of the aforementioned component (B) [(A) / (B)] by mass ratio is preferably 1.00 or more, more preferably 1.50 or more, and even more preferably 2.00 or more.

[0143] On the other hand, from the viewpoint of improving the cleanliness and processing accuracy of the processing fluid, in the aforementioned processing fluid, the ratio of the content of the aforementioned component (A) to the content of the aforementioned component (B) [(A) / (B)] by mass ratio is preferably 20.00 or less, more preferably 15.00 or less, and even more preferably 10.00 or less.

[0144] <Ingredient (C)>

[0145] Component (C) is one or more epoxide alkane adducts selected from acetylenediol with an HLB value of 4 or higher and 12 or lower and acetylenediol with an HLB value of 4 or higher and 12 or lower.

[0146] In the absence of component (C) in the aforementioned processing fluid, the defoaming and detergency properties of the processing fluid deteriorate.

[0147] Here, as mentioned above, the detergency of the processing fluid deteriorates even without component (B), but a processing fluid with good detergency cannot be obtained by containing only either component. That is, by containing both component (B) and component (C), a processing fluid with good detergency can be obtained.

[0148] Therefore, by including all of components (A), (B), and (C) in a manner that satisfies specific amounts, it is possible to obtain a processing fluid with excellent lubricity, defoaming properties, and detergency.

[0149] Furthermore, if the HLB value of component (C) is less than 4, then component (C) has poor solubility in water. Therefore, from the viewpoint of improving the solubility of component (C) in water, the HLB value of component (C) is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more.

[0150] On the other hand, if the HLB value of component (C) exceeds 12, the defoaming and detergency of the processing fluid deteriorates. Therefore, from the viewpoint of improving the defoaming and detergency of the processing fluid, the HLB value of component (C) is preferably 11 or less, more preferably 10 or less, and even more preferably 9 or less.

[0151] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there are no particular limitations on how they are combined. For example, as a component (C), the HLB value of component (C) is preferably 5 or more and 11 or less, more preferably 6 or more and 10 or less, and even more preferably 7 or more and 9 or less.

[0152] In addition, the HLB value of component (C) is calculated using the Griffin method as described above.

[0153] Examples of compounds that can be used as acetylenic diols include, for example, those represented by the general formula (1) below.

[0154] [Chemistry 1]

[0155]

[0156] In general formula (1), R 1 ~R 4 Each can be used independently to represent an alkyl group having 1 or more but less than 5 carbon atoms.

[0157] As R 1 ~R 4 Alkyl groups with 1 or more but less than 5 carbon atoms may be used. Specifically, examples include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl, and 2,2-dimethylpropyl.

[0158] Among these, as R 1 and R 3 Preferably, isobutyl or 3-methylbutyl. Additionally, as R... 2 and R 4 Preferably, it is methyl.

[0159] Furthermore, as the compound represented by general formula (1), it is preferred to have R 1 and R 3 The same structure or R 2 and R 4 Compounds with the same structure as each other, more preferably having R 1 and R 3 They are the same and R 2 and R 4Compounds with the same structure as each other.

[0160] Furthermore, as the aforementioned alkylene oxide adduct of ethynylene glycol, preferably it is an alkylene oxide adduct of the compound of general formula (1) with AO added to each of the hydroxyl groups of the compound shown in general formula (1), more preferably it is an alkylene oxide adduct of the compound of general formula (1) with EO and / or PO added, and even more preferably it is an alkylene oxide adduct of the compound of general formula (1) with EO added. It should be noted that the suitable manner of forming the alkylene oxide adduct of the ethynylene glycol is the same as that of the compound shown in general formula (1).

[0161] It should be noted that in the case of a structure containing a structure derived from EO (e.g., an ethylene oxy group or a poly(oxyethylene) structure) and a structure derived from PO (e.g., an propylene oxy group or a poly(oxypropylene) structure), the structures can be bonded to each other in a random manner or in a block manner, preferably in a block manner.

[0162] As component (C), examples include acetylenic diols represented by general formula (1), such as 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol, 5,8-dimethyl-6-dodecyne-5,8-diol, 2,4,7,9-tetramethyl-5-dodecyne-4,7-diol, 8-hexadecyne-7,10-diol, 7-tetradecyne-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol; and epoxide alkane adducts of acetylenic diols represented by general formula (1). Examples of epoxides include EO and / or PO.

[0163] Among these, the preferred selections are 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol, 5,8-dimethyl-6-dodecyne-5,8-diol, 2,4,7,9-tetramethyl-5-dodecyne-4,7-diol, 8-hexadecyne-7,10-diol, 7-tetradecyne-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, and 3,6-diethyl-4-diol. -Octyne-3,6-diol, 2,5-dimethyl-3-hexyn-2,5-diol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol, more preferably, epoxide adducts selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol, 5,8-dimethyl-6-dodecyn-5,8-diol, 2,4... 7,9-Tetramethyl-5-dodecyne-4,7-diol, 8-hexadecyne-7,10-diol, 7-tetradecyne-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and 3,6-dimethyl-4 One or more ethylene oxide adducts selected from octyne-3,6-diol, more preferably one or more selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol and 2,4,7,9-tetramethyl-5-decyn-4,7-diol, and even more preferably ethylene oxide adducts selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol.

[0164] It should be noted that ingredient (C) can be used alone or in combination with two or more ingredients.

[0165] The content of component (C) is 0.006% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid. If this content is less than 0.006% by mass, the cleaning properties of the processing fluid deteriorate.

[0166] From the viewpoint of obtaining excellent cleaning properties of the processing fluid, the content of component (C) is preferably 0.007% by mass or more, more preferably 0.008% by mass or more, and even more preferably 0.009% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid.

[0167] On the other hand, from the viewpoint of ensuring good solubility of component (C) in water, the content of component (C) is preferably 0.100% by mass or less, more preferably 0.070% by mass or less, further preferably 0.050% by mass or less, and even more preferably 0.030% by mass or less, based on 100% by mass of the total amount of the aforementioned processing liquid.

[0168] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one aspect of the aforementioned processing fluid, the content of component (C), based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 0.006% by mass or more and 0.100% by mass or less, more preferably 0.007% by mass or more and 0.070% by mass or less, further preferably 0.008% by mass or more and 0.050% by mass or less, and even more preferably 0.009% by mass or more and 0.030% by mass or less.

[0169] Furthermore, in the aforementioned processing fluid, the ratio of the total content of the aforementioned components (A) and (B) to the content of component (C) [(A)+(B) / (C)] by mass is preferably 1.00 or more, more preferably 1.20 or more, even more preferably 1.30 or more, and preferably 20.00 or less, more preferably 15.00 or less, even more preferably 12.00 or less.

[0170] <Ingredient (D)>

[0171] Water as component (D) is not particularly limited and can be purified water such as distilled water or ion-exchanged water (deionized water); tap water; industrial water, etc., preferably purified water, and more preferably ion-exchanged water (deionized water).

[0172] For example, from the viewpoints of improving the flame retardancy and safety of the aforementioned processing fluid, and from the viewpoints of achieving low viscosity and improving operability of the processing fluid, the content of component (D), based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 95.000% by mass or more, more preferably 97.500% by mass or more, even more preferably 99.500% by mass or more, and even more preferably 99.600% by mass or more. Furthermore, from the viewpoint of ensuring the amounts of components (A), (B), and (C) in the aforementioned processing fluid, it is 99.979% by mass or less, preferably 99.965% by mass or less, more preferably 99.950% by mass or less, even more preferably 99.945% by mass or less, and even more preferably 99.930% by mass or less.

[0173] In this specification, "additive mixture in processing fluid" refers to all components remaining after removing water (as component (D)) from the aforementioned processing fluid.

[0174] <Other Ingredients>

[0175] The aforementioned processing fluid may contain other components in addition to the aforementioned components (A) to (D) without hindering the purpose of the present invention.

[0176] Other components may include surfactants, pH adjusters, water retention improvers, defoamers, metal inerting agents, bactericides / preservatives, rust inhibitors, antioxidants, and other additives, in addition to the compounds that conform to components (A) to (C). These additives may be used individually or in combination of two or more. Furthermore, among these additives, it is preferable to select one or more of surfactants, pH adjusters, and water retention improvers other than components (A) to (C), more preferably one or more of water retention improvers and pH adjusters, and even more preferably a pH adjuster.

[0177] It should be noted that these additives can be used alone or in combination of two or more.

[0178] Examples of surfactants other than compounds that meet the criteria (A) to (C) include anionic surfactants, cationic surfactants, nonionic surfactants other than compounds that meet the criteria (A) to (C), and amphoteric surfactants.

[0179] Examples of anionic surfactants include alkylbenzene sulfonates and α-olefin sulfonates. Examples of cationic surfactants include quaternary ammonium salts such as alkyl trimethylammonium salts, dialkyl dimethylammonium salts, and alkyl dimethyl benzylammonium salts.

[0180] Examples of nonionic surfactants other than those conforming to components (A) to (C) include, for example, polyoxyethylene alkyl ethers; polyoxyalkylene alkyl ethers (wherein the polyoxyalkylene portion does not include a component derived from ethylene oxide); ethers such as polyoxyethylene alkylphenyl ethers; compounds having a turbidity point of less than 20°C or more than 80°C in a 1% by mass aqueous solution, containing a copolymer portion of ethylene oxide and alkylene oxides other than ethylene oxide, and not having an ethynyl group; ethynyl glycols with an HLB value less than 4 or more than 12; alkylene oxide adducts of ethynyl glycols with an HLB value less than 4 or more than 12; and amides such as fatty acid alkanolamides.

[0181] As amphoteric surfactants, alkyl betaines and other similar surfactants can be listed.

[0182] pH adjusters are primarily used to adjust the pH of processing fluids. Various acidic and alkaline components can be listed as pH adjusters; by adjusting the proportions of these components, the pH of the processing fluid can be appropriately adjusted.

[0183] It should be noted that the acid and base components can react with each other to form a salt.

[0184] Therefore, when using acidic and alkaline components as pH adjusters, and when the reactants of these acidic and alkaline components are present in the aforementioned processing fluid, as described above, the content of each acidic and alkaline component that contributes to the reaction can be calculated based on the content of the reactants. Alternatively, in this case, instead of the reactants, the acidic and alkaline components can be considered as present before the reaction.

[0185] Examples of acidic components used as pH adjusters include various fatty acids such as lauric acid, stearic acid, oleic acid, linoleic acid, linolenic acid, neodecanoic acid, isononanoic acid, decanoic acid, and isostearic acid; carboxylic acids such as acetic acid, malic acid, and citric acid; high molecular weight acids such as polyacrylic acid and their salts; and inorganic acids such as phosphoric acid. Among these, fatty acids are preferred, more preferably fatty acids with 12 or fewer carbon atoms such as neodecanoic acid, isononanoic acid, decanoic acid, and dodecanoic acid, and even more preferably one or more selected from neodecanoic acid, isononanoic acid, decanoic acid, and dodecanoic acid.

[0186] Examples of alkaline components used as pH adjusters include monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, tri-n-propanolamine, tri-n-butanolamine, triisobutanolamine, tri-tert-butanolamine, N-methylethanolamine, N-ethylethanolamine, N-butylethanolamine, N-cyclohexylethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, N-cyclohexyldiethanolamine, N,N-dimethylethanolamine, N,N-diethylethanolamine, and other alkanolamines; methylamine, dimethylamine, ethylamine, diethylamine, propylamine, dipropylamine, and other alkylamines; and ammonia. Among these, tertiary amines are preferred, and at least one selected from triethanolamine, triisopropanolamine, N-methyldiethanolamine, and N-cyclohexyldiethanolamine is more preferred.

[0187] Examples of water-retention improvers include ethylene glycol, propylene glycol, 1,4-butanediol, hexamethylene glycol, neopentyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, glycerol, their ester derivatives, their ether derivatives; polyethylene glycol, polypropylene glycol, etc.

[0188] Examples of defoamers include silicone oil, fluorosilicone oil, polyether polysiloxane, and fluoroalkyl ether.

[0189] Examples of metal inert agents include imidazoline, pyrimidine derivatives, thiadiazole, and benzotriazole.

[0190] As bactericides and preservatives, examples include, in addition to parabens, benzoic acid, salicylic acid, sorbic acid, dehydroacetic acid, p-toluenesulfonic acid and their salts, as well as phenoxyethanol.

[0191] Examples of rust inhibitors include alkylbenzene sulfonates, dinonylnaphthalene sulfonates, alkenyl succinates, and polyol esters.

[0192] Examples of antioxidants include phenolic antioxidants and amine antioxidants.

[0193] When the aforementioned processing fluid contains other components, the total content of the other components in the aforementioned processing fluid, based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 0.0001% by mass or more, more preferably 0.0002% by mass or more, even more preferably 0.0003% by mass or more, even more preferably 0.0004% by mass or more, and preferably 0.0800% by mass or less, more preferably 0.0500% by mass or less, even more preferably 0.0100% by mass or less, even more preferably 0.0050% by mass or less, and even more preferably 0.0010% by mass or less.

[0194] Furthermore, when the aforementioned processing fluid contains a pH adjuster as another component, the total content of the pH adjuster in the aforementioned processing fluid, based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 0.0001% by mass or more, more preferably 0.0002% by mass or more, even more preferably 0.0003% by mass or more, and preferably 0.0100% by mass or less, more preferably 0.0050% by mass or less, even more preferably 0.0010% by mass or less, and even more preferably 0.0008% by mass or less.

[0195] Furthermore, from the viewpoint of improving lubricity, defoaming properties, and detergency, the total content of components (A), (B), (C), and (D) in the aforementioned processing fluid, based on 100% by mass of the total amount of the aforementioned processing fluid, is preferably 99.9200% by mass or more, more preferably 99.9500% by mass or more, further preferably 99.9900% by mass or more, even more preferably 99.9950% by mass or more, even more preferably 99.9990% by mass or more, and preferably 100.0000% by mass or less, more preferably 99.9999% by mass or less, even more preferably 99.9998% by mass or less, even more preferably 99.9997% by mass or less, and even more preferably 99.9996% by mass or less.

[0196] Furthermore, when the aforementioned processing fluid is used for processing brittle materials, from the viewpoint of suppressing corrosion of the various wires, processing equipment, etc., subsequently described in the section on the uses of the processing fluid, the pH of the aforementioned processing fluid is preferably 3.0 or higher, more preferably 4.0 or higher, and even more preferably 5.0 or higher. On the other hand, from the viewpoint of suppressing the generation of large amounts of hydrogen gas from the shavings during the processing of materials such as silicon, the pH of the aforementioned processing fluid is preferably 9.0 or lower, more preferably 8.0 or lower, and even more preferably 7.0 or lower.

[0197] In addition, the pH value of the processing fluid was measured using the method described in the examples described later.

[0198] Furthermore, as described below, when the aforementioned processing fluid is used in applications where wire is used to process materials containing brittle materials, from the viewpoint of easily suppressing wire breakage during the cutting of brittle materials, the surface tension of the aforementioned processing fluid is preferably 35 mN / m or less, more preferably 34 mN / m or less, and even more preferably 33 mN / m or less.

[0199] On the other hand, the surface tension of the aforementioned processing fluid is preferably 1 mN / m or more, more preferably 5 mN / m or more, and even more preferably 10 mN / m or more.

[0200] In addition, the surface tension of the processing fluid was measured using the method described in the following examples.

[0201] [Method for manufacturing processing fluid]

[0202] In the aforementioned method for manufacturing the processing fluid, at least the following components are mixed:

[0203] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0204] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0205] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0206] Ingredient (D): Water,

[0207] The processing fluid is prepared by mixing components (A) at a concentration of 0.010% or more based on 100% of the total mass of the processing fluid, components (B) at a concentration of 0.005% or more and 0.090% or less based on 100% of the total mass of the processing fluid, and components (C) at a concentration of 0.006% or more based on 100% of the total mass of the processing fluid.

[0208] There is no particular limitation on the mixing order of components (A) to (D). For example, components (A), (B) and (C) can be mixed sequentially or simultaneously with water as component (D). Alternatively, components (A), (B) and (C) can be mixed in advance and then the mixture can be added to water as component (D).

[0209] In addition, in this manufacturing method, components (A) to (D) can be mixed, and other components can be mixed in as needed. In this case, there are no particular limitations on the mixing order or mixing method of the mixed components.

[0210] It should be noted that components (A), (B), (C), (D), and other components are identical to those listed above in the processing fluid section, and their suitability methods are also the same; therefore, detailed descriptions are omitted. Furthermore, the suitable mixing amounts and ratios of components (A), (B), (C), (D), and other components are also identical to the contents and ratios of the aforementioned processing fluids listed above in the processing fluid section; therefore, detailed descriptions are omitted.

[0211] [Applications of processing fluids]

[0212] The aforementioned processing fluid can be used appropriately when using the aforementioned wire saw, preferably a fixed abrasive wire saw, to process materials containing brittle materials such as silicon ingots. That is, the aforementioned processing fluid can be used appropriately when using wire to process materials containing brittle materials, and can be used more appropriately when using fixed abrasive wire to process materials containing brittle materials.

[0213] Examples of such brittle materials include crystalline silicon, sapphire, gallium nitride, silicon carbide, neodymium magnets, crystal, and glass. From the viewpoint of effectively utilizing the excellent cleaning properties of the aforementioned processing fluids, these fluids are more suitable for use when processing crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnets, crystal, or glass.

[0214] Processing methods for brittle materials

[0215] One embodiment of the present invention describes a method for processing brittle materials, which is a method of processing silicon ingots and other materials containing brittle materials using the aforementioned processing fluid.

[0216] Here, the aforementioned processing fluid is used by supplying it to the workpiece, thereby bringing it into contact with the workpiece. The processing fluid lubricates both the workpiece and the processing tools such as the wire saw. Furthermore, it is used for chip (cutting powder) removal, rust prevention of the workpiece, and cooling of both the tool and the workpiece.

[0217] Specifically, the processing of brittle materials using the aforementioned processing fluid can include various processes such as cutting, grinding, punching, lapping, drawing, stretching, and rolling. Among these, cutting and grinding are preferred, and cutting is even more preferred.

[0218] The aforementioned materials can be listed as brittle materials that are processed.

[0219] It should be noted that, as described above, the aforementioned processing fluid can be suitably used as a processing fluid in the cutting of silicon ingots.

[0220] More specifically, as described above, both free abrasive and fixed abrasive wire sawing methods utilize multi-wire sawing devices to cut multiple silicon wafers from a silicon ingot in a single operation. In a multi-wire sawing device, a wire is wound into each groove of two or more guide rollers engraved with multiple grooves at predetermined intervals, and each wire is held parallel with a predetermined tension. During cutting, the guide rollers rotate, and while processing fluid ejected from nozzles adheres to the wire, the wire is propelled in one or both directions, pressing the silicon ingot against the fluid-coated wire for cutting. Additionally, sometimes processing is performed while simultaneously supplying processing fluid to the workpiece, such as the silicon ingot, as needed.

[0221] The processing fluid used in the process is stored in tanks or the like and transported from there to the nozzles in the aforementioned processing chamber via piping. Additionally, the processing fluid used during cutting is recovered using a used processing fluid receiving tank or the like at the bottom of the cutting device. Furthermore, depending on the situation, it is sometimes recycled within the device.

[0222] Furthermore, the processing fluid described in one embodiment of the present invention has an excellent balance of lubricity, defoaming properties, and detergency, which contributes to high processing accuracy and productivity (increased yield).

[0223] Therefore, the processing fluid described in one embodiment of the present invention is more suitable for use in processing methods of such brittle materials, and is further suitable for use in processing methods of cutting silicon wafers from silicon ingots using fixed abrasive wires, and even more suitable for use in processing methods of cutting silicon wafers from silicon ingots using a multi-wire device employing fixed abrasive wire saws.

[0224] Furthermore, the aforementioned excellent effects are also achieved when the processing fluid, as described in one embodiment of the present invention, is used to cut silicon wafers from silicon ingots using wires with a finer wire diameter (single wire diameter) (preferably fixed abrasive wires). Therefore, it is more suitable for, for example, processing methods for cutting silicon wafers for solar cells from silicon ingots.

[0225] Here, the single wire diameter of the wire used in the processing of brittle materials can be appropriately selected according to its application. For example, it is preferably 55 μm or less, more preferably 54 μm or less, and even more preferably 53 μm or less. It is also preferably 30 μm or more, more preferably 35 μm or more, and even more preferably 38 μm or more.

[0226] [Processing equipment]

[0227] The brittle material processing apparatus described in one embodiment of the present invention is a processing apparatus that uses the processing fluid described in one embodiment of the present invention above. It is preferably a multi-wire cutting processing apparatus, more preferably a multi-wire cutting processing apparatus equipped with a fixed abrasive wire saw, and even more preferably a multi-wire cutting processing apparatus equipped with a fixed abrasive wire saw for cutting silicon ingots.

[0228] [Composition for Processing Fluids]

[0229] In addition, the processing fluid described in one embodiment of the present invention may be, for example, a concentrated solution obtained by reducing the amount of water in the processing fluid to a concentration of more than 20 times and less than 2,000 times, or a processing fluid obtained by diluting a composition with the same composition as the concentrated solution with water.

[0230] That is, when performing the aforementioned processing, the concentrated solution of the aforementioned processing fluid or the aforementioned processing fluid composition with the same composition as the concentrated solution (hereinafter also referred to as the "processing fluid composition") can be diluted with water to a ratio of more than 20 times and less than 2,000 times to be used as the aforementioned processing fluid.

[0231] For example, the aforementioned processing fluid can also be formulated into a processing fluid composition for use in a manner suitable for storage / transportation, etc.

[0232] Here, in this specification, "processing fluid composition" refers to substances that, as described above, are not limited to those concentrated by reducing the amount of water in the processing fluid, but also include compositions prepared by diluting with water to prepare a processing fluid. It should be noted that the composition prepared by diluting with water to prepare a processing fluid also includes substances that, even if they do not form the aforementioned processing fluid when diluted with water alone, are subsequently added to the composition in a manner that corresponds to the component ranges described above for the aforementioned processing fluid, and the amounts are adjusted accordingly, before the aforementioned processing is performed.

[0233] As one embodiment of the aforementioned processing fluid composition, the following processing fluid composition can be listed, comprising:

[0234] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0235] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0236] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0237] Ingredient (D): Water,

[0238] The content of component (A) is 0.200% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0239] The content of component (B) is 0.100% by mass and less than 92.000% by mass, based on 100% by mass of the total amount of the processing fluid composition.

[0240] The content of component (C) is 0.120% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0241] Furthermore, in the aforementioned processing fluid composition, other components may be further contained in addition to the aforementioned components (A) to (D) without hindering the purpose of the present invention.

[0242] In addition, in the aforementioned processing fluid composition, components (A), (B), (C), and (D), as well as other optional components, are the same as those described above in the aforementioned processing fluid section, and their suitability is also the same; therefore, their detailed descriptions are omitted.

[0243] Furthermore, in the aforementioned processing fluid composition, the suitable content range of components (A), (B), (C), and (D), as well as other components, is not particularly limited. When using the processing fluid composition diluted with water to a ratio of 20 times or more and 2,000 times or less, it is preferable to contain the components in a manner that satisfies the suitable content range of each component as described above in the aforementioned processing fluid column.

[0244] For example, the following embodiments can be cited as examples of the processing fluid composition described in one embodiment of the present invention.

[0245] [2-1]

[0246] A processing fluid composition comprising:

[0247] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0248] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0249] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0250] Ingredient (D): Water,

[0251] The content of component (A) is 0.200% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0252] The content of component (B) is 0.100% by mass and less than 92.000% by mass, based on 100% by mass of the total amount of the processing fluid composition.

[0253] The content of component (C) is 0.120% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

[0254] [2-2]

[0255] According to the processing fluid composition described above [2-1], the content of component (A) is preferably 1.000% by mass or more, more preferably 2.500% by mass or more, and even more preferably 5.000% by mass or more, based on 100% by mass of the total amount of the processing fluid composition. It is also preferably 91.780% by mass or less, more preferably 90.900% by mass or less, even more preferably 89.250% by mass or less, and even more preferably 86.500% by mass or less.

[0256] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one method of the processing fluid composition described above [2-1], the content of component (A) is preferably 0.200% by mass or more and 91.780% by mass or less, more preferably 1.000% by mass or more and 90.900% by mass or less, further preferably 2.500% by mass or more and 89.250% by mass or less, and even more preferably 5.000% by mass or more and 86.500% by mass or less, based on 100% by mass of the total amount of the aforementioned processing fluid composition.

[0257] [2-3]

[0258] According to the processing fluid composition described in [2-1] or [2-2] above, the content of component (B) is preferably 0.500% by mass or more, more preferably 1.250% by mass or more, and even more preferably 2.500% by mass or more, based on 100% by mass of the total amount of the processing fluid composition. It is also preferably 91.680% by mass or less, more preferably 90.400% by mass or less, even more preferably 88.000% by mass or less, and even more preferably 84.000% by mass or less.

[0259] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one method of the processing fluid composition described in [2-1] or [2-2] above, the content of component (B), based on 100% by mass of the total amount of the aforementioned processing fluid composition, is preferably 0.100% by mass or more and 91.680% by mass or less, more preferably 0.500% by mass or more and 90.400% by mass or less, further preferably 1.250% by mass or more and 88.000% by mass or less, and even more preferably 2.500% by mass or more and 84.000% by mass or less.

[0260] [2-4]

[0261] According to any one of [2-1] to [2-3] above, the content of component (C) is preferably 0.600% by mass or more, more preferably 1.500% by mass or more, and even more preferably 3.000% by mass or more, based on 100% by mass of the total amount of the processing fluid composition, and preferably 91.700% by mass or less, more preferably 90.500% by mass or less, even more preferably 88.250% by mass or less, and even more preferably 84.500% by mass or less.

[0262] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one embodiment of the processing fluid composition described in any one of [2-1] to [2-3] above, the content of component (C), based on 100% by mass of the total amount of the aforementioned processing fluid composition, is preferably 0.120% by mass or more and 91.700% by mass or less, more preferably 0.600% by mass or more and 90.500% by mass or less, further preferably 1.500% by mass or more and 88.250% by mass or less, and even more preferably 3.000% by mass or more and 84.500% by mass or less.

[0263] [2-5]

[0264] The composition for processing fluid according to any one of [2-1] to [2-4] above, wherein component (A) is a compound having a turbidity point of 1% by mass aqueous solution of 20°C or higher and 50°C or lower, comprising a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0265] [2-6]

[0266] The composition for processing fluid according to any one of [2-1] to [2-5] above, wherein component (B) is a compound having a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0267] [2-7]

[0268] The processing fluid composition according to any one of [2-1] to [2-6] above, wherein the ratio of the content of component (A) to the content of component (B) [(A) / (B)] by mass ratio is preferably 1.00 or more, more preferably 1.50 or more, further preferably 2.00 or more, and preferably 20.00 or less, more preferably 15.00 or less, further preferably 10.00 or less.

[0269] [2-8]

[0270] The processing fluid composition according to any one of [2-1] to [2-7] above, wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [(A)+(B) / (C)] by mass is preferably 1.00 or more, more preferably 1.20 or more, further preferably 1.30 or more, and preferably 20.00 or less, more preferably 15.00 or less, further preferably 12.00 or less.

[0271] [2-9]

[0272] According to any one of [2-1] to [2-8] above, the content of component (D) is preferably 8.000% by mass or more, more preferably 9.000% by mass or more, more preferably 10.000% by mass or more, and even more preferably 12.000% by mass or more, and preferably 99.580% by mass or less, more preferably 97.900% by mass or less, even more preferably 94.750% by mass or less, and even more preferably 89.500% by mass or less.

[0273] [2-10]

[0274] According to any one of [2-1] to [2-9] above, in the case where the aforementioned processing fluid composition further comprises other components, the total content of the other components in the aforementioned processing fluid composition, based on 100% by mass of the total amount of the processing fluid composition, is preferably 0.002% by mass or more, more preferably 0.004% by mass or more, further preferably 0.006% by mass or more, even more preferably 0.008% by mass or more, and preferably 40.000% by mass or less, more preferably 35.000% by mass or less, further preferably 30.000% by mass or less, even more preferably 27.000% by mass or less, and even more preferably 25.000% by mass or less.

[0275] [2-11]

[0276] According to any one of [2-1] to [2-10] above, in the case where the aforementioned processing fluid composition further contains a pH adjuster as another component, the total content of the pH adjuster in the aforementioned processing fluid composition, based on 100% by mass of the total amount of the aforementioned processing fluid composition, is preferably 0.002% by mass or more, more preferably 0.003% by mass or more, further preferably 0.004% by mass or more, and preferably 20.000% by mass or less, more preferably 10.000% by mass or less, further preferably 2.000% by mass or less, and even more preferably 1.600% by mass or less.

[0277] [2-12]

[0278] According to any one of [2-1] to [2-11] above, the total content of component (A), component (B), component (C) and component (D) in the aforementioned processing fluid composition is preferably 60.000% by mass or more, more preferably 65.000% by mass or more, further preferably 70.000% by mass or more, even more preferably 73.000% by mass or more, even more preferably 75.000% by mass or more, and preferably 100.000% by mass or less, more preferably 99.998% by mass or less, further preferably 99.996% by mass or less, even more preferably 99.994% by mass or less, and even more preferably 99.992% by mass or less.

[0279] [2-13]

[0280] The composition for processing fluid according to any one of [2-1] to [2-12] above, wherein the pH is preferably 3.0 or more, more preferably 4.0 or more, further preferably 5.0 or more, and preferably 9.0 or less, more preferably 8.5 or less, further preferably 8.0 or less.

[0281] [2-14]

[0282] The processing fluid composition according to any one of [2-1] to [2-13] above is used when processing a workpiece containing a brittle material using a wire.

[0283] [2-15]

[0284] According to the processing fluid composition described above [2-14], the aforementioned wire is a fixed abrasive wire.

[0285] [2-16]

[0286] The processing fluid composition according to the aforementioned [2-14] or [2-15], wherein the aforementioned brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[0287] [Method for manufacturing the composition for processing fluids]

[0288] The aforementioned processing fluid composition can be manufactured by, for example, the following manufacturing methods.

[0289] That is, in the method for manufacturing the processing fluid composition described in any one of [2-1] to [2-16] above, at least the following components are mixed:

[0290] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0291] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0292] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0293] Ingredient (D): Water,

[0294] The processing fluid composition is obtained by mixing components (A) in a manner that is 0.200% by mass or more based on 100% by mass of the total amount of the processing fluid composition, components (B) in a manner that is 0.100% by mass or more and 92.000% by mass or less based on 100% by mass of the total amount of the processing fluid composition, and components (C) in a manner that is 0.120% by mass or more based on 100% by mass of the total amount of the processing fluid composition.

[0295] There is no particular limitation on the mixing order of components (A) to (D). For example, components (A), (B) and (C) can be mixed sequentially or simultaneously with water as component (D). Alternatively, components (A), (B) and (C) can be mixed in advance and then the mixture can be added to water as component (D).

[0296] In addition, in this manufacturing method, components (A) to (D) can be mixed, and other components can be mixed in as needed. In this case, there are no particular limitations on the mixing order or mixing method of the mixed components.

[0297] It should be noted that components (A), (B), (C), (D), and other components are the same as those described above in the processing fluid section, and their suitability is also the same; therefore, detailed descriptions are omitted. Furthermore, the suitable mixing amounts and suitable mixing ratios of components (A), (B), (C), (D), and other components are the same as the contents and ratios of each component in the aforementioned processing fluid composition described above in sections [2-1] to [2-16]; therefore, detailed descriptions are omitted.

[0298] [Instructions for use of the processing fluid composition]

[0299] The aforementioned processing fluid composition, as described above, can be used primarily for preparing the aforementioned processing fluid by diluting it with water.

[0300] That is, as an embodiment of the present invention, a method of using the processing fluid composition can be exemplified by, for example, the following method of using the processing fluid composition, wherein the aforementioned processing fluid composition is diluted with water to prepare a processing fluid, the processing fluid comprising:

[0301] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0302] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0303] Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and

[0304] Ingredient (D): Water,

[0305] The processing fluid is prepared such that the content of component (A) is 0.010% by mass or more based on 100% by mass of the total amount of the processing fluid, the content of component (B) is 0.005% by mass or more and 0.090% by mass or less based on 100% by mass of the total amount of the processing fluid, and the content of component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the processing fluid.

[0306] The processing fluid is used for the purposes of the processing fluids described in the aforementioned processing fluid section and for processing methods of brittle materials.

[0307] Therefore, the processing fluid composition described in the embodiments [2-1] to [2-16] above can be used as the processing fluid described in one embodiment of the present invention above by further diluting it with water and adjusting the content of components (A) to (C) as needed.

[0308] As one embodiment of the processing fluid, the processing fluid described in the embodiments described above [1] to

[12] can be cited as an example. It is obtained by diluting the processing fluid described in the embodiments described above [2-1] to [2-16] with water using a composition and adjusting the content of components (A) to (C) as needed.

[0309] Regarding the dilution ratio when the aforementioned processing fluid composition is diluted with water as component (D), there is no particular limitation as long as the aforementioned processing fluid can be prepared. Based on the total amount (mass) of the aforementioned processing fluid composition, it is preferably 20 times or more, more preferably 100 times or more, further preferably 250 times or more, even more preferably 500 times or more, and preferably 2,000 times or less, more preferably 1,800 times or less, further preferably 1,500 times or less, and even more preferably 1,000 times or less.

[0310] On the other hand, as described above, for example, the processing fluid composition described in the embodiments [2-1] to [2-16] above can be a substance obtained in the form of a concentrated liquid obtained by reducing the amount of water (D) in the processing fluid described in one embodiment of the present invention above. As one embodiment of this processing fluid composition, examples include the processing fluid composition described in the embodiments [2-1] to [2-16] above, which is obtained by reducing the amount of component (D) in the processing fluid described in the embodiments [1] to

[12] above by distillation or other operations, and concentrating it to more than 20 times and less than 2,000 times.

[0311] The concentration ratio when reducing the amount of water (D) in the aforementioned processing fluid is not particularly limited. Based on the total amount (mass) of the aforementioned processing fluid, it is preferably 20 times or more, more preferably 100 times or more, further preferably 250 times or more, even more preferably 500 times or more, and preferably 2,000 times or less, more preferably 1,800 times or less, even more preferably 1,500 times or less, and even more preferably 1,000 times or less.

[0312] Furthermore, the uses of the processing fluid obtained by using the processing fluid composition described above [2-1] to [2-16], the processing method for brittle materials using the processing fluid obtained by using the processing fluid composition, and the processing apparatus are all the same as those described in the corresponding items in the processing fluid section of the above-mentioned embodiment of the present invention, and therefore, detailed descriptions are omitted.

[0313] [Processing fluid composition for brittle materials]

[0314] In addition, the following brittle material processing fluid compositions can be listed as examples of brittle material processing fluid compositions related to one embodiment of the present invention.

[0315] A processing fluid composition for brittle materials, comprising an additive mixture and component (D): water, wherein the additive mixture comprises components (A) to (C).

[0316] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0317] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0318] Component (C): Selected from one or more alkylene oxide adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower.

[0319] In the aforementioned additive mixture,

[0320] The content of component (A) is 20.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0321] The content of component (B), based on 100% by mass of the total amount of the aforementioned additive mixture, is 5.00% by mass or more and 53.50% by mass or less, and

[0322] The content of component (C) is 5.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0323] Furthermore, in the aforementioned brittle material processing fluid composition, other components may be further included in addition to the aforementioned components (A) to (D) without impairing the purpose of the present invention.

[0324] Furthermore, in this brittle material processing fluid composition, components (A), (B), (C), and (D), as well as other optional components, are the same as those described above in the aforementioned processing fluid section, and their suitable methods are also the same; therefore, their detailed descriptions are omitted.

[0325] As an example of a brittle material processing fluid composition related to one embodiment of the present invention, the following embodiments can be more specifically listed.

[0326] [3-1]

[0327] A processing fluid composition for brittle materials, comprising an additive mixture and component (D): water, wherein the additive mixture comprises components (A) to (C).

[0328] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0329] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0330] Component (C): Selected from one or more alkylene oxide adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower.

[0331] In the aforementioned additive mixture,

[0332] The content of component (A) is 20.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0333] The content of component (B), based on 100% by mass of the total amount of the aforementioned additive mixture, is 5.00% by mass or more and 53.50% by mass or less, and

[0334] The content of component (C) is 5.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0335] [3-2]

[0336] According to the brittle material processing fluid composition described above [3-1], the content of component (A) is preferably 24.00% by mass or more, more preferably 27.00% by mass or more, further preferably 30.00% by mass or more, even more preferably 40.00% by mass or more, and preferably 80.50% by mass or less, more preferably 79.50% by mass or less, and even more preferably 78.50% by mass or less.

[0337] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one method of the brittle material processing fluid composition described in [3-1] above, the content of component (A) is preferably 20.00% by mass or more and 80.50% by mass or less, more preferably 24.00% by mass or more and 80.50% by mass or less, further preferably 27.00% by mass or more and 80.50% by mass or less, even more preferably 30.00% by mass or more and 80.50% by mass or less, even more preferably 40.00% by mass or more and 79.50% by mass or less, and even more preferably 40.00% by mass or more and 78.50% by mass or less, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0338] [3-3]

[0339] According to the brittle material processing fluid composition described in [3-1] or [3-2] above, the content of component (B) is preferably 6.50% by mass or more, more preferably 8.00% by mass or more, and even more preferably 10.00% by mass or more, based on 100% by mass of the total amount of the aforementioned additive mixture, and preferably 50.00% by mass or less, more preferably 47.50% by mass or less, and even more preferably 45.00% by mass or less.

[0340] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one method of the brittle material processing fluid composition described in [3-1] or [3-2] above, the content of component (B) is preferably 6.50% by mass or more and 50.00% by mass or less, more preferably 8.00% by mass or more and 47.50% by mass or less, and even more preferably 10.00% by mass or more and 45.00% by mass or less, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0341] [3-4]

[0342] According to any one of the preceding [3-1] to [3-3] brittle material processing fluid compositions, the content of component (C) is preferably 6.00% by mass or more, more preferably 6.50% by mass or more, further preferably 7.00% by mass or more, and preferably 55.00% by mass or less, more preferably 50.00% by mass or less, further preferably 47.00% by mass or less, and even more preferably 42.00% by mass or less.

[0343] Furthermore, as mentioned above, the upper and lower limits of these numerical ranges can be combined independently. Therefore, there is no particular limitation on how they are combined. For example, as one method of brittle material processing fluid composition according to any one of [3-1] to [3-3] above, the content of component (C) is preferably 5.00% by mass or more and 55.00% by mass or less, more preferably 6.00% by mass or more and 50.00% by mass or less, further preferably 6.50% by mass or more and 47.00% by mass or less, and even more preferably 7.00% by mass or more and 42.00% by mass or less, based on 100% by mass of the total amount of the aforementioned additive mixture.

[0344] [3-5]

[0345] The brittle material processing fluid composition according to any one of [3-1] to [3-4] above, wherein component (A) is a compound having a turbidity point of 1% by mass aqueous solution of 20°C or higher and 50°C or lower, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0346] [3-6]

[0347] The brittle material processing fluid composition according to any one of [3-1] to [3-5] above, wherein component (B) is a compound having a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and not having an acetylene group.

[0348] [3-7]

[0349] According to any one of the preceding [3-1] to [3-6] brittle material processing fluid composition, the ratio of the content of component (A) to the content of component (B) [(A) / (B)] by mass is preferably 1.00 or more, more preferably 1.50 or more, further preferably 2.00 or more, and preferably 20.00 or less, more preferably 15.00 or less, further preferably 10.00 or less.

[0350] [3-8]

[0351] According to any one of the preceding [3-1] to [3-7] brittle material processing fluid composition, the ratio of the total content of component (A) and component (B) to the content of component (C) [(A)+(B) / (C)] by mass is preferably 1.00 or more, more preferably 1.20 or more, further preferably 1.30 or more, and preferably 20.00 or less, more preferably 15.00 or less, further preferably 12.00 or less.

[0352] [3-9]

[0353] According to any one of [3-1] to [3-8] above, in the aforementioned additive mixture, the total content of component (A), component (B) and component (C) is preferably 80.00% by mass or more, more preferably 85.00% by mass or more, further preferably 90.00% by mass or more, even more preferably 95.00% by mass or more, even more preferably 99.00% by mass or more, and is 100.00% by mass or less, preferably 99.90% by mass or less, more preferably 99.80% by mass or less, even more preferably 99.75% by mass or less, and even more preferably 99.70% by mass or less.

[0354] [3-10]

[0355] According to any one of the brittle material processing fluid compositions described in [3-1] to [3-9] above, wherein, when the brittle material processing fluid composition further comprises other components, the total content of the other components in the brittle material processing fluid composition is preferably 0.10% by mass or more, more preferably 0.20% by mass or more, further preferably 0.25% by mass or more, and even more preferably 0.30% by mass or more, and preferably 20.00% by mass or less, more preferably 15.00% by mass or less, further preferably 10.00% by mass or less, even more preferably 5.00% by mass or less, and even more preferably 1.00% by mass or less.

[0356] [3-11]

[0357] The brittle material processing fluid composition according to any one of [3-1] to [3-10] above preferably contains 8 or more parts by mass, more preferably 9 or more parts by mass, further preferably 10 or more parts by mass, even more preferably 11 or more parts by mass, even more preferably 12 or more parts by mass, and preferably 1,000,000 or less parts by mass, more preferably 500,000 or less parts by mass, even more preferably 250,000 or less parts by mass, and even more preferably 200,000 or less parts by mass, relative to 100 parts by mass of the aforementioned additive mixture.

[0358] [3-12]

[0359] The brittle material processing fluid composition according to any one of [3-1] to [3-11] above, wherein, relative to 100 parts by weight of the aforementioned additive mixture, preferably 1,000 parts by weight or more, more preferably 2,000 parts by weight or more, further preferably 5,000 parts by weight or more, even more preferably 10,000 parts by weight or more, even more preferably 20,000 parts by weight or more, even more preferably 25,000 parts by weight or more, and preferably 1,000,000 parts by weight or less, more preferably 500,000 parts by weight or less, even more preferably 250,000 parts by weight or less, and even more preferably 200,000 parts by weight or less, contains component (D).

[0360] [3-13]

[0361] The brittle material processing fluid composition according to any one of [3-1] to [3-11] above preferably contains 8 or more parts by mass, more preferably 9 or more parts by mass, further preferably 10 or more parts by mass, even more preferably 11 or more parts by mass, and even more preferably 12 or more parts by mass, relative to 100 parts by mass of the aforementioned additive mixture, and preferably contains 100,000 or less parts by mass, more preferably 50,000 or less parts by mass, further preferably 25,000 or less parts by mass, even more preferably 10,000 or less parts by mass, even more preferably 5,000 or less parts by mass, even more preferably 2,000 or less parts by mass, and even more preferably 1,000 or less parts by mass.

[0362] [3-14]

[0363] The brittle material processing fluid composition according to any one of [3-1] to [3-13] above, wherein the pH is preferably 3.0 or more, more preferably 4.0 or more, further preferably 5.0 or more, and preferably 9.0 or less, more preferably 8.0 or less, further preferably 7.0 or less.

[0364] [3-15]

[0365] The brittle material processing fluid composition according to any one of [3-1] to [3-14] is used when processing a workpiece containing a brittle material using wire.

[0366] [3-16]

[0367] According to the brittle material processing fluid composition described above [3-15], the aforementioned wire is a fixed abrasive wire.

[0368] [3-17]

[0369] According to the brittle material processing fluid composition described in [3-15] or [3-16] above, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[0370] [Method for manufacturing a processing fluid composition for brittle materials]

[0371] The aforementioned brittle material processing fluid composition can be manufactured by, for example, the following manufacturing methods.

[0372] That is, in the method for manufacturing the brittle material processing fluid composition described in any one of [3-1] to [3-17] above, at least an additive mixture and component (D): water are prepared, wherein the additive mixture comprises components (A) to (C).

[0373] Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group;

[0374] Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidases other than ethylene oxide, and without an acetylene group;

[0375] Component (C): Selected from one or more alkylene oxide adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower.

[0376] A brittle material processing fluid composition is obtained by mixing the aforementioned additive mixture in such a manner that the content of component (A) is 20.00% or more based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (B) is 5.00% or more and 53.50% or less based on 100% by mass of the total amount of the aforementioned additive mixture, and the content of component (C) is 5.00% or more based on 100% by mass of the total amount of the aforementioned additive mixture.

[0377] There is no particular limitation on the mixing order of components (A) to (D). For example, components (A), (B) and (C) can be mixed sequentially or simultaneously with water as component (D). Alternatively, components (A), (B) and (C) can be mixed in advance and then the mixture can be added to water as component (D).

[0378] In addition, in this manufacturing method, components (A) to (D) can be mixed, and other components can be mixed in as needed. In this case, there are no particular limitations on the mixing order or mixing method of the mixed components.

[0379] It should be noted that components (A), (B), (C), (D), and other components are the same as those described above in the processing fluid section, and their suitable methods are also the same; therefore, their detailed descriptions are omitted. Furthermore, the suitable mixing amounts and suitable mixing ratios of components (A), (B), (C), (D), and other components are also the same as the contents and content ratios described above in the aforementioned sections [3-1] to [3-17]; therefore, their detailed descriptions are omitted.

[0380] Furthermore, the uses of the brittle material processing fluid composition described in [3-1] to [3-17] above, the processing method of brittle materials using the brittle processing fluid composition, and the processing apparatus are all the same as those described in the corresponding items in the processing fluid section of the above-mentioned embodiment of the present invention. Therefore, detailed descriptions are omitted.

[0381] Example

[0382] The following examples illustrate one embodiment of the present invention in more detail, but the present invention is not limited to these examples at all.

[0383] It should be noted that the physical properties related to each component and processing fluid should be evaluated according to the following guidelines.

[0384] [Turbidity point of a 1% (w / w) aqueous solution]

[0385] Regarding the turbidity point of a 1% aqueous solution of components (A) and (B), 100 mL of a 1% aqueous solution of the component to be determined was poured into a 200 mL beaker. The aqueous solution was stirred with a magnetic stirrer (stirrer length: 30 mm) at a rotation speed of 400 rpm while the temperature of the aqueous solution was increased from 15 °C to the turbidity point at a rate of 5 °C / min. The liquid temperature at which the appearance of the aqueous solution became turbid was measured.

[0386] It should be noted that the “turbidity point” of the compounds shown in Tables 1 and 2 below refers to the “turbidity point of a 1% by mass aqueous solution of the compound”.

[0387] [HLB value]

[0388] The HLB value of component (C) is calculated using the Griffin method.

[0389] [Gross-average molecular weight]

[0390] The mass-average molecular weight (Mw) was determined using gel permeation chromatography (GPC). For GPC, two Tosoh TSKgel (registered trademark) SuperMultipore HZ-M columns were used, with tetrahydrofuran as the eluent. A refractive index detector was used for the determination, with polystyrene as the standard sample.

[0391] Surface tension

[0392] The surface tension of each processing fluid obtained in the examples and comparative examples was determined according to the platinum plate method described in JIS K 2241:2017.

[0393] pH value

[0394] The pH of each processing solution obtained in the examples and comparative examples was evaluated using a glass electrode hydrogen ion concentration indicator (model: HM-25R) manufactured by Toya DKK Corporation.

[0395] [Coefficient of friction of silicon (Si)]

[0396] Using the processing fluids obtained in the examples and comparative examples, a reciprocating kinetic friction test was conducted under the following test conditions to determine the coefficient of friction.

[0397] Reciprocating dynamic friction testing machine: ORIENTEC "F-2100"

[0398] Ball: 3 / 16 inch SUJ2

[0399] Test temperature: 50℃

[0400] Test board: Polycrystalline silicon (surface polished to a mirror finish)

[0401] Test plate temperature: 50℃

[0402] Sliding speed: 20mm / second

[0403] Sliding distance: 2cm

[0404] Number of round trips: 50

[0405] Load capacity: 200g

[0406] [Evaluation of defoaming properties]

[0407] The processing fluids obtained in the examples and comparative examples were evaluated according to the following steps.

[0408] Pour 90 mL of processing fluid into a 100 mL graduated cylinder, cap the cylinder, shake it vigorously up and down 10 times, and let it stand for 20 seconds before measuring the liquid level.

[0409] It should be noted that the liquid level is compared using the graduated cylinder in units of "mL" (per 0.5mL).

[0410] If foaming occurs at this point, the liquid level will increase, i.e., the value of "mL" will increase. Therefore, the smaller the value of the liquid level (mL), the better the defoaming effect. For example, if the liquid level becomes 93.5 mL due to foaming, the increase of 3.5 mL compared to the height of 90.0 mL before oscillation of the graduated cylinder is taken as the liquid level, and is shown in Tables 1 and 2 below.

[0411] [Evaluation of Purity]

[0412] The processing fluids obtained in the examples and comparative examples were evaluated according to the following steps.

[0413] (Evaluation of fouling on the barrel wall)

[0414] Pour 90 mL of processing fluid and 0.5 g of micro powder ("graphite powder", manufactured by Fujifilm and Koujun Pharmaceutical Co., Ltd., premium grade) into a 100 mL graduated cylinder. Cover the graduated cylinder and shake it vigorously up and down 10 times. Evaluate the condition of the dirt on the upper part of the inner wall of the graduated cylinder according to the following criteria.

[0415] • A: The fouling on the barrel wall caused by the micro powder is mild, and the background near the liquid surface can be observed through the lens.

[0416] •B: The fouling on the barrel wall caused by the micro powder is so severe that the background near the liquid surface cannot be observed through the lens.

[0417] [Examples 1-8 and Comparative Examples 1-8]

[0418] The components were mixed in the manner shown in Tables 1 and 2 below to prepare the processing fluids of Examples 1-8 and Comparative Examples 1-8. The processing fluids of each Example and Comparative Example were evaluated according to the aforementioned evaluation method. The results are shown in Tables 1 and 2 below.

[0419] It should be noted that the components shown in Tables 1 and 2 below represent the following compounds.

[0420] <Ingredients (A)>

[0421] Compound A1: A polyoxyalkylene alkyl ether formed by a random copolymer of ethylene oxide (EO) and propylene oxide (PO) with terminal methyl groups (terminal alkyl group), mass-average molecular weight (Mw) = 4,597, EO / PO ratio (molar ratio) = 42 / 58, turbidity point of 1% aqueous solution = 43°C.

[0422] Compound A2: Poly(propylene oxide)-poly(ethylene oxide)-poly(propylene oxide) block copolymer (weight-average molecular weight (Mw) = 4,261, EO / PO ratio (molar ratio) = 30 / 70, turbidity point of 1% aqueous solution = 38℃)

[0423] Compound A3: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (turbidity point of 1% aqueous solution = 23℃)

[0424] <Ingredient (B)>

[0425] Compound B1: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (weight-average molecular weight (Mw) = 5,654, EO / PO ratio (molar ratio) = 48 / 52, turbidity point of 1% aqueous solution = 63℃)

[0426] Compound B2: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) block copolymer (weight-average molecular weight (Mw) = 5,498, EO / PO ratio (molar ratio) = 52 / 48, turbidity point of 1% aqueous solution = 61℃)

[0427] <Ingredient (C)>

[0428] • Compound C1: EO adduct of 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol (EO adduct of ethynylene diol, HLB=8)

[0429] <Ingredient (D)>

[0430] · Ion-exchange water

[0431] <Other Ingredients>

[0432] Compound S1: EO adduct of 2,4,7,9-tetramethyl-5-decyn-4,7-diol (EO adduct of ethynylene glycol, HLB=13)

[0433] pH adjuster 1: Isononanoic acid

[0434] pH adjuster 2: Triisopropanolamine

[0435] [Table 1]

[0436] Table 1

[0437]

[0438] ※1: The total content of components in the processing fluid after removing ion-exchanged water (component (D)).

[0439] [Table 2]

[0440] Table 2

[0441]

[0442] ※1: The total content of components in the processing fluid after removing ion-exchanged water (component (D)).

[0443] As shown in Table 1, the processing fluids of Examples 1 to 8 contain components (A) to (D), and each contains components (A) to (C) in a specified amount. Therefore, the lubricity, defoaming and detergency of any processing fluid are excellent, and it can be confirmed that they are processing fluids with excellent balance of lubricity, defoaming and detergency.

[0444] On the other hand, as shown in Table 2, the processing fluids of Comparative Examples 1 to 8 do not contain any of component (A), component (B), or component (C) (Comparative Examples 1, 3, 6, and 7) or do not meet the condition of containing components (A) to (C) in the prescribed amounts (Comparative Examples 2, 4, 5, and 8). Therefore, it can be confirmed that any of their characteristics, such as lubricity, defoaming properties, or detergency, are poor.

[0445] Using the processing fluid described in Example 1, a multi-wire saw with a fixed abrasive method, and a fixed abrasive wire with a single wire diameter of 52 μm, the results of cutting silicon ingots confirmed that the processing fluid exhibits excellent defoaming and cleaning properties during processing. Furthermore, the cutting accuracy of the silicon ingots was confirmed to be good, and the wire breakage rate was less than 5%.

[0446] It should be noted that the aforementioned "cutting accuracy" is evaluated by measuring the thickness deviation (TTV) of the cut silicon wafer. In Example 1, the average TTV of the silicon wafer obtained by cutting from a single ingot was less than 15 μm, which is considered good. In contrast, in Comparative Example 1, the average TTV of the silicon wafer obtained by cutting from a single ingot exceeded 15 μm.

[0447] In addition, the aforementioned “wire breakage rate (unit: %)” is a value calculated by “number of wire breaks / number of ingots cut × 100”. For example, if 5 out of 100 silicon ingots are cut and the wire breaks during processing, the breakage rate is evaluated as 5%.

[0448] Industrial utilization

[0449] The processing fluid, as one embodiment of the present invention, exhibits an excellent balance of lubricity, defoaming properties, and detergency.

[0450] Due to its excellent lubricity, it is expected to improve machining efficiency when cutting brittle materials such as silicon ingots, suppress friction between the workpiece and the machining tool, reduce frictional heat generated during machining, and extend tool life. Furthermore, when using finer wires, superior machining accuracy can be achieved.

[0451] In addition, when processing materials such as those mentioned above, foaming of the processing fluid can be suppressed, preventing the processing fluid from overflowing from the tank receiving the processing fluid due to foaming, or adverse effects such as reduced processing accuracy caused by foaming.

[0452] Furthermore, due to its excellent cleaning properties, it can suppress contamination caused by shaving powder or other fine particles from the cutting machine or the workpiece during the cutting process, such as when cutting the aforementioned materials. As a result, it is easy to clean the machine and the workpiece.

[0453] As described above, the processing fluid of one embodiment of the present invention has an excellent balance of lubricity, defoaming properties and detergency, and therefore can help improve the productivity of products obtained by cutting and processing materials containing brittle materials such as silicon ingots.

[0454] Furthermore, as described above, the processing fluid of one embodiment of the present invention is suitable for use as a processing fluid in the cutting of brittle materials such as silicon ingots. Moreover, the processing fluid of one embodiment of the present invention exhibits an excellent balance of lubricity, defoaming properties, and detergency, and can suppress wire breakage, contributing to high processing accuracy and productivity (increasing yield). Therefore, it is more suitable as a coolant for processing in which silicon wafers are cut from silicon ingots using fixed abrasive wires.

Claims

1. Processing fluid, comprising: Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower, wherein the HLB value refers to the HLB value calculated by the Griffin method; and Ingredient (D): Water, The content of component (A) is 0.010% by mass and less than 0.200% by mass, based on 100% by mass of the total amount of the processing fluid. The content of component (B), based on 100% by mass of the total amount of the processing fluid, is 0.005% by mass or more and 0.090% by mass or less, and The content of component (C) is 0.006% by mass and less than 0.100% by mass, based on 100% by mass of the total amount of the processing fluid.

2. The processing fluid according to claim 1, wherein, Component (A) is a compound whose turbidity point is above 20°C and below 50°C in a 1% by mass aqueous solution, which contains the copolymerization site of ethylene oxide and propylene oxide, and does not have an acetylene group.

3. The processing fluid according to claim 1 or 2, wherein, The aforementioned component (A) is selected from one or more copolymers of ethylene oxide and epoxy alkane other than ethylene oxide and polyoxyethylene alkylene ethers.

4. The processing fluid according to claim 1 or 2, wherein, The epoxides other than ethylene oxide mentioned in component (A) are propylene oxide, oxobutane, 1,2-epoxide, 2,3-epoxide, 1,3-epoxide or tetrahydrofuran.

5. The processing fluid according to claim 3, wherein, The copolymer of ethylene oxide and alkyl oxidants other than ethylene oxide mentioned in component (A) is a copolymer of ethylene oxide and propylene oxide.

6. The processing fluid according to claim 5, wherein, The aforementioned copolymer of ethylene oxide and propylene oxide is a triblock copolymer with ethylene oxide as the terminal block and propylene oxide as the intermediate block, or a triblock copolymer with propylene oxide as the terminal block and ethylene oxide as the intermediate block.

7. The processing fluid according to claim 3, wherein, The polyoxyethylene alkylene ethers mentioned in component (A) are ethylene oxide alcohols and alkyl oxide adducts other than ethylene oxide.

8. The processing fluid according to claim 1 or 2, wherein, In the copolymerization of ethylene oxide and alkyl oxidases other than ethylene oxide described in component (A), the content of structural units derived from ethylene oxide is 15 mol% or more and 85 mol% or less in 100 mol% of the total number of structural units constituting the copolymerization site.

9. The processing fluid according to claim 1 or 2, wherein, The mass-average molecular weight of the aforementioned component (A) is 500 or more and 10,000 or less.

10. The processing fluid according to claim 1 or 2, wherein, The content of component (A) is less than 0.100% by mass, based on 100% by mass of the total amount of the processing fluid.

11. The processing fluid according to claim 1 or 2, wherein, The content of the aforementioned component (A) is 0.015% by mass or more, based on 100% by mass of the total amount of the aforementioned processing fluid.

12. The processing fluid according to claim 1 or 2, wherein, Component (B) is a compound with a turbidity point of more than 50°C and less than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and propylene oxide, and without an acetylene group.

13. The processing fluid according to claim 1 or 2, wherein, The aforementioned component (B) is selected from one or more copolymers of ethylene oxide and epoxy alkane other than ethylene oxide and polyoxyethylene alkylene ethers.

14. The processing fluid according to claim 1 or 2, wherein, The epoxides other than ethylene oxide mentioned in component (B) are propylene oxide, oxobutane, 1,2-epoxide, 2,3-epoxide, 1,3-epoxide, or tetrahydrofuran.

15. The processing fluid according to claim 13, wherein, The copolymer of ethylene oxide and alkyl oxidants other than ethylene oxide mentioned in component (B) is a copolymer of ethylene oxide and propylene oxide.

16. The processing fluid according to claim 15, wherein, The aforementioned copolymer of ethylene oxide and propylene oxide is a Prannoy type copolymer in which ethylene oxide is added to polypropylene glycol.

17. The processing fluid according to claim 13, wherein, In the copolymer of ethylene oxide and alkyl oxidants other than ethylene oxide described in component (B), the content of structural units derived from ethylene oxide is 25 mol% or more and 75 mol% or less in 100 mol% of the total amount of structural units constituting the copolymer.

18. The processing fluid according to claim 13, wherein, The polyoxyethylene alkylene ethers mentioned in component (B) are ethylene oxide alcohols and alkyl oxide adducts other than ethylene oxide.

19. The processing fluid according to claim 1 or 2, wherein, The mass-average molecular weight of the aforementioned component (B) is 500 or more and 10,000 or less.

20. The processing fluid according to claim 1 or 2, wherein, The ratio of the content of component (A) to the content of component (B) (A) / (B) is 1.00 or more by mass.

21. The processing fluid according to claim 1 or 2, wherein, The aforementioned acetylenic diol is a compound represented by the following general formula (1). In general formula (1), R 1 ~R 4 Each can be used independently to represent an alkyl group having 1 or more but less than 5 carbon atoms.

22. The processing fluid according to claim 21, wherein, The aforementioned epoxide alkane adduct of ethynylene glycol is an epoxide alkane adduct of a compound of general formula (1) with epoxide alkane added to each of the hydroxyl groups of the compound of general formula (1).

23. The processing fluid according to claim 1 or 2, wherein, The aforementioned component (C) is a compound of one or more alkylene oxides selected from 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol, 5,8-dimethyl-6-dodecyne-5,8-diol, 2,4,7,9-tetramethyl-5-dodecyne-4,7-diol, 8-hexadecyne-7,10-diol, 7-tetradecyne-6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyn-2,5-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, and 3,6-dimethyl-4-octyne-3,6-diol.

24. The processing fluid according to claim 1 or 2, wherein, The content of component (C) is less than 0.070% by mass, based on 100% by mass of the total amount of the processing fluid.

25. The processing fluid according to claim 1 or 2, wherein, The ratio of the total content of component (A) and component (B) to the content of component (C) [(A) + (B) / (C)] is 1.00 or more by mass.

26. The processing fluid according to claim 25, wherein, The ratio of the total content of component (A) and component (B) to the content of component (C) [(A) + (B) / (C)] is 20.00 or less by mass.

27. The processing fluid according to claim 1 or 2, wherein, Component (D) is selected from distilled water, ion-exchanged water, tap water and industrial water.

28. The processing fluid according to claim 1 or 2, wherein, The content of component (D) is 95.000% or more and 99.979% or less, based on 100% by mass of the total amount of the processing fluid.

29. The processing fluid according to claim 1 or 2, wherein, As other ingredients, it contains one or more of the following: surfactants, pH adjusters, water retention improvers, defoamers, metal inertizers, bactericides, preservatives, rust inhibitors, and antioxidants, other than the compounds that meet the criteria of ingredients (A) to (C).

30. The processing fluid according to claim 29, wherein, The surfactant, other than the compounds that meet the above-mentioned components (A) to (C), is selected from polyoxyethylene alkyl ethers; polyoxyethylene alkylene alkyl ethers; polyoxyethylene alkylphenyl ethers; compounds with a turbidity point of less than 20°C or more than 80°C in a 1% by mass aqueous solution, containing a copolymerization site of ethylene oxide and alkylene oxides other than ethylene oxide, and not having an acetylenic group; and acetylenic diols with an HLB value of less than 4 or more than 12. One or more of the following: epoxide alkane adducts of ethynylene glycol with an HLB value less than 4 or greater than 12; and fatty acid alkanolamides, wherein the polyoxyalkylene portion of the aforementioned polyoxyalkylene alkyl ethers does not include a composition derived from ethylene oxide.

31. The processing fluid according to claim 29, wherein, The acid used as the aforementioned pH adjuster is selected from one or more of neodecanoic acid, isononanoic acid, decanoic acid, and dodecanoic acid.

32. The processing fluid according to claim 29, wherein, The alkaline component used as the aforementioned pH adjuster is selected from at least one of triethanolamine, triisopropanolamine, N-methyldiethanolamine and N-cyclohexyldiethanolamine.

33. The processing fluid according to claim 29, wherein, In the aforementioned processing fluid, the total content of other components, based on 100% by mass of the total amount of the aforementioned processing fluid, is 0.0001% by mass or more and 0.0800% by mass or less.

34. The processing fluid according to claim 29, wherein, In the aforementioned processing fluid, the total content of the pH adjuster, based on 100% by mass of the total amount of the aforementioned processing fluid, is 0.0001% by mass or more and 0.0100% by mass or less.

35. The processing fluid according to claim 1 or 2, wherein, In the aforementioned processing fluid, the total content of components (A), (B), (C), and (D) is 99.9200% by mass and less than 100.0000% by mass, based on 100% by mass of the total amount of the aforementioned processing fluid.

36. The processing fluid according to claim 1 or 2, wherein the pH is above 3.0 and below 9.

0.

37. The processing fluid according to claim 1 or 2, wherein, The surface tension of the aforementioned processing fluid is above 1 mN / m and below 35 mN / m.

38. The processing fluid according to claim 1 or 2, used when processing a workpiece containing brittle material using wire.

39. The processing fluid according to claim 38, wherein, The wire is a fixed abrasive wire.

40. The processing fluid according to claim 38, wherein, The brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal, or glass.

41. Processing methods for brittle materials, wherein, Using the processing fluid according to any one of claims 1 to 37, a workpiece containing brittle material is processed using a wire.

42. The method for manufacturing the processing fluid according to any one of claims 1 to 40, wherein, At least the following ingredients should be mixed: Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and Ingredient (D): Water, The processing fluid is prepared by mixing components (A) with a content of 0.010% to 0.200% by mass based on 100% of the total mass of the processing fluid, components (B) with a content of 0.005% to 0.090% by mass based on 100% of the total mass of the processing fluid, and components (C) with a content of 0.006% to 0.100% by mass based on 100% of the total mass of the processing fluid.

43. A processing fluid composition for use in preparing the processing fluid according to any one of claims 1 to 40 by dilution with water, said processing fluid composition comprising: Component (A): A compound with a turbidity point of 1% by mass aqueous solution above 20°C and below 50°C, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (B): A compound with a turbidity point exceeding 50°C and below 80°C in a 1% by mass aqueous solution, containing copolymerization sites of ethylene oxide and alkyl oxidants other than ethylene oxide, and without an acetylene group; Component (C): Selected from one or more epoxide alkane adducts of ethynylene glycol with an HLB value of 4 or higher and 12 or lower; and Ingredient (D): Water, The content of component (A) is 0.200% by mass or more, based on 100% by mass of the total amount of the processing fluid composition. The content of component (B) is 0.100% by mass and 92.000% by mass, based on 100% by mass of the total composition for the processing fluid. The content of component (C) is 0.120% by mass or more, based on 100% by mass of the total amount of the processing fluid composition.

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