用于ESD性能评估的TLP仿真激励模型

By using the TLP simulation excitation model, the problem of inaccurate test results for devices with different impedances was solved. By using the attenuation module to fit the impedance, a standard waveform was generated and fitted to the test waveform, thus achieving accurate evaluation of ESD performance.

CN117092464BActive Publication Date: 2026-07-17HANG ZHOU NANO CORE CHIP ELECTRONIC TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HANG ZHOU NANO CORE CHIP ELECTRONIC TECH CO LTD
Filing Date
2023-08-25
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies cannot accurately evaluate the ESD performance test results of devices under test with different impedances, resulting in low accuracy of test results.

Method used

The TLP simulation excitation model is adopted, including an excitation module, an attenuation module, a test module, and a probe module. The impedance of the TLP test instrument is fitted by the attenuation module to generate a standard waveform. The waveform is then fitted under test voltage and current to output the test waveform.

Benefits of technology

It achieves accurate simulation of devices under test with different impedances, and the simulation results are more accurate. It can evaluate the maximum human body model level that chip pins can withstand and the characteristics of ESD protection devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117092464B_ABST
    Figure CN117092464B_ABST
Patent Text Reader

Abstract

本申请涉及一种用于ESD性能评估的TLP仿真激励模型,包括:包括激励模块、衰减模块、测试模块及探针模块;激励模块,用于生成TLP测试的标准波形;衰减模块,设置在激励模块和测试模块之间,用于拟合TLP测试机台的阻抗;测试模块,设置在衰减模块与探针模块之间,用于提供测试电压和测试电流;探针模块的输出端与待测器件相连接,用于在测试电压和测试电流下,对标准波形进行拟合,输出测试波形;通过本申请,解决了相关技术中存在无法精确评估具有不同阻抗的待测器件的测试结果的问题,实现了附加内阻和随负载变化的仿真,使得不同阻抗的待测器件接入时,测试波形会产生相应变化,使得仿真结果更为精确。
Need to check novelty before this filing date? Find Prior Art