An assembly for exposing internal wiring pad contacts and a method of manufacturing the same

Abstract

The present application relates to the technical field of electronic circuit, especially relates to a kind of components for realizing internal circuit PAD contact point exposure, comprising: plastic piece, plastic piece hole for accommodating internal circuit, internal circuit connecting piece with conductive performance;The plastic piece hole is located in the plastic piece, and penetrates the plastic piece;The internal circuit connecting piece is located at the top of the plastic piece hole, and is fixedly connected with the internal circuit, and the upper surface of the internal circuit connecting piece with conductive performance is PAD contact point.The present application relates to a kind of components for realizing internal circuit PAD contact point exposure, which designs internal circuit connecting piece connected with internal circuit, internal circuit connecting piece is solidified colloid or other solidified metal compound with conductive performance, and the corresponding connecting piece accommodating area is designed on the plastic piece, which greatly simplifies the structure, so as to realize PAD contact point exposure connection.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit technology, and in particular to a component that exposes the internal circuit PAD contact points and a method for manufacturing the same. Background Technology

[0002] The most common PADs in current electronic circuits are PADs on PCB boards or metal sheet PADs.

[0003] When internal wiring of a product or structure needs to be connected to the outside of the product structure, metallization (an additional chemical plating process) is required on a plastic surface to achieve the connection.

[0004] Therefore, there is an urgent need for a component with a simple structure that can expose the internal circuit PAD contact points and its manufacturing method. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of existing technologies and to provide a component that exposes the internal circuit PAD contact points, comprising:

[0006] Plastic parts, plastic holes for accommodating internal wiring, and internal wiring connectors with conductive properties;

[0007] The hole in the plastic part is located inside the plastic part and extends through the plastic part;

[0008] The internal circuit connector is located at the top of the hole in the plastic part and is fixedly connected to the internal circuit. The upper surface of the internal circuit connector, which has conductive properties, is a PAD contact point.

[0009] Furthermore, the hole in the plastic part is divided into a lower half and an upper half;

[0010] The diameter of the hole in the lower half of the plastic part is greater than or equal to the outer diameter of the internal circuit.

[0011] The upper part of the plastic hole extends to both sides to form a connector receiving area, which is used to accommodate the internal circuit connector.

[0012] Furthermore, the connector receiving area is cylindrical, and the inner wall of the connector receiving area transitions to the upper surface of the plastic part with a first chamfer;

[0013] The internal circuit connector includes a connecting spring and a small rivet. The tail of the connecting spring is soldered to the internal circuit, and the tail of the small rivet is inserted into the connecting spring.

[0014] Furthermore, the connecting spring is cylindrical, and a second chamfer is provided at the top edge of the connecting spring, the second chamfer forming a guide surface when the small rivet is inserted into the connecting spring;

[0015] The outer diameter of the connecting spring is the same as the inner diameter of the connector receiving area, and the connecting spring is snapped into place within the connector receiving area.

[0016] Furthermore, the tail of the small rivet is provided with several protrusions or bosses. When the tail of the small rivet is placed in the connecting spring, the protrusions or bosses apply pressure to the connecting spring, that is, the connecting spring and the connecting member receiving area are clamped together under pressure.

[0017] Furthermore, the beveled head of the small rivet engages with the first chamfer to lock in place, so that the upper surface of the head of the small rivet and the upper surface of the plastic part are on the same horizontal plane, forming a conductive circuit between the small rivet, the connecting spring, and the internal circuit, and forming a PAD contact point on the upper surface of the head of the small rivet.

[0018] Furthermore, the internal circuit connector is a cured metal compound including silver paste. The cured metal compound is placed in the connector receiving area and cured to cover the head of the internal circuit. A conductive circuit is formed between the cured metal compound and the internal circuit, and a PAD contact point is formed on the upper surface of the cured metal compound.

[0019] Furthermore, the upper surface of the cured metal compound is ground smooth so that the upper surface of the cured metal compound and the upper surface of the plastic part are at the same level.

[0020] Furthermore, the internal circuit connector is a conductive curable colloid. The curable colloid is placed in the connector receiving area and cures to wrap around the head of the internal circuit. A conductive circuit is formed between the curable colloid and the internal circuit, and a PAD contact point is formed on the upper surface of the curable colloid.

[0021] The present invention also provides a method for manufacturing a component that exposes the internal circuit PAD contact points, comprising:

[0022] Step S1: Open the hole in the plastic part and pass the internal circuit through the hole to the upper surface of the plastic part;

[0023] Step S2: Solder the end of the internal circuit to the tail of the connecting spring;

[0024] Step S3: Insert the entire internal wiring connector into the connector receiving area and insert the tail of the small rivet into the connecting spring;

[0025] Step S4: Make the upper surface of the small rivet and the upper surface of the plastic part at the same level. At this time, the upper surface of the small rivet forms a PAD contact point, and the manufacturing is completed.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. The present invention discloses an assembly for exposing the PAD contact points of internal circuitry. The assembly is designed with an internal circuitry connector that connects to the internal circuitry. The internal circuitry connector is a cured colloid or other cured metal compound with conductive properties. A corresponding connector receiving area is designed on the plastic part, which greatly simplifies the structure and achieves the goal of exposing the PAD contact points.

[0028] 2. The present invention provides a component for exposing the PAD contact points of the internal circuitry. The component is designed with a small rivet, a connecting spring, and an internal circuitry assembly. The three components form a conductive circuit. The structure is simple. During the pressing process, the small rivet opens the connecting spring through the protrusion or boss, so that the connecting spring and the hole in the plastic part are tightly fitted. The upper surface of the small rivet is the exposed PAD contact point of the internal circuitry. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0030] In the attached diagram:

[0031] Figure 1 This is a schematic diagram of the welding of the connecting spring of a component that exposes the PAD contact points of the internal circuitry according to the present invention.

[0032] Figure 2 This is a schematic diagram of a component according to the present invention that exposes the PAD contact points of internal circuits, with the connecting spring piece placed in the connector receiving area.

[0033] Figure 3 This is a schematic diagram of the small rivet installation of a component for exposing the internal circuit PAD contact points according to the present invention.

[0034] Figure 4 This is a schematic diagram of the structure of an embodiment 1 of the present invention that exposes the PAD contact points of the internal circuitry;

[0035] Figure 5 This is a schematic diagram of an embodiment 2 of the present invention for an internal circuit PAD contact point exposed, wherein (a) is a top view of (b).

[0036] Figure Labels

[0037] 1: Plastic parts;

[0038] 2: Internal wiring;

[0039] 3: Holes in plastic parts;

[0040] 31: Connector receiving area;

[0041] 311: First chamfer;

[0042] 4: Internal wiring connectors;

[0043] 41: Connecting spring; 42: Small rivet;

[0044] 411: Second chamfer;

[0045] 43: Solidified metal compounds;

[0046] 5: Welding points. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0048] Example 1

[0049] Please see Figure 1-4 The technical solution provided in this embodiment for exposing the internal circuit PAD contact points of a component includes the following:

[0050] Plastic part 1, plastic hole for accommodating internal circuit 2, internal circuit connector 4 with conductive properties;

[0051] The hole 3 is located inside the plastic part 1 and penetrates through the plastic part 1;

[0052] The internal circuit connector 4 is located at the top of the hole 3 in the plastic part and is fixedly connected to the internal circuit 2. The upper surface of the internal circuit connector 4, which has conductive properties, is a PAD contact point.

[0053] In practice, the internal wiring can also be other wiring, including metal conductors or core wires of miniature coaxial cables.

[0054] Specifically, the hole 3 in the plastic part is divided into a lower half and an upper half;

[0055] The diameter of the lower part of the plastic hole 3 is greater than or equal to the outer diameter of the internal circuit 2;

[0056] The upper part of the plastic hole 3 extends to both sides to form a connector receiving area 31, which is used to accommodate the internal circuit connector 4.

[0057] In practice, the specific shape of the connector receiving area 31 can be designed as needed according to the shape of the internal circuit connector 4.

[0058] Specifically, the connector receiving area 31 is cylindrical, and the inner wall of the connector receiving area 31 transitions to the upper surface of the plastic part 1 with a first chamfer 311.

[0059] In practice, the first chamfer 311 helps to guide the connecting spring 41 when it is inserted into the connector receiving area 31.

[0060] The internal circuit connector 4 includes a connecting spring 41 and a small rivet 42. The tail of the connecting spring 41 is soldered to the internal circuit 2, and the tail of the small rivet 42 is inserted into the connecting spring 41.

[0061] Specifically, the connecting spring 41 is cylindrical, and a second chamfer 411 is provided at the top edge of the connecting spring 41. The second chamfer 411 forms a guide surface when the small rivet 42 is inserted into the connecting spring 41.

[0062] The outer diameter of the connecting spring 41 is the same as the inner diameter of the connector receiving area 31, and the connecting spring 41 is clamped in the connector receiving area 31.

[0063] In practice, the outer diameter of the connector receiving area 31 is larger than the inner diameter of the plastic hole 3. Therefore, when the connecting spring 41 is placed in the connector receiving area 31, the bottom of the connecting spring 41 will abut against the bottom surface of the connector receiving area 31, that is, against the top surface of the lower half of the plastic hole 3, which plays a role in fixing and preventing downward movement.

[0064] Specifically, the tail of the small rivet 42 is provided with several protrusions or bosses. When the tail of the small rivet 42 is placed in the connecting spring 41, the protrusions or bosses apply pressure to the connecting spring 41, that is, the connecting spring 41 and the connecting member receiving area 31 are clamped together under pressure.

[0065] In specific implementation, a groove can also be provided on the inner wall of the connecting spring 41, and the protrusion can also be designed as a groove. The groove and the groove cooperate to apply pressure to the connecting spring 41, so that the connecting spring 41 and the connector receiving area 31 are clamped and connected under pressure.

[0066] Specifically, the beveled head of the small rivet 42 engages with the first chamfer 311 to lock together, so that the upper surface of the head of the small rivet 42 is in the same horizontal plane as the upper surface of the plastic part 1. A conductive circuit is formed between the small rivet 42, the connecting spring 41 and the internal circuit 2, and a PAD contact point is formed on the upper surface of the head of the small rivet 42.

[0067] Example 2

[0068] Specifically, based on Example 1, such as Figure 5 As shown, the internal circuit connector 4 can also be a cured metal compound 43 including silver paste. The cured metal compound 43 is placed in the connector receiving area 31 and cured to wrap the head of the internal circuit 2. A conductive circuit is formed between the cured metal compound 43 and the internal circuit 2. A PAD contact point is formed on the upper surface of the cured metal compound 43.

[0069] Specifically, the upper surface of the cured metal compound 43 is ground smooth so that the upper surface of the cured metal compound 43 is at the same level as the upper surface of the plastic part 1.

[0070] Example 3

[0071] Specifically, based on embodiment 2, the internal circuit connector 4 can also be configured as a conductive curable colloid. The curable colloid is placed in the connector receiving area 31 and cures and wraps around the head of the internal circuit 2. A conductive circuit is formed between the curable colloid and the internal circuit 2, and a PAD contact point is formed on the upper surface of the curable colloid.

[0072] In specific implementations, other conductive solidified materials are also within the scope of protection of this invention.

[0073] Example 4

[0074] The present invention also provides a method for manufacturing a component based on Embodiment 1 that exposes the internal circuit PAD contact points, comprising:

[0075] Step S1: Make a plastic hole 3 inside the plastic part 1, and pass the internal circuit 2 through the plastic hole 3 to the upper surface of the plastic part 1;

[0076] Step S2: Solder the end of the internal circuit 2 to the tail of the connecting spring 41;

[0077] Step S3: Insert the internal wiring connector 4 into the connector receiving area 31 as a whole;

[0078] Step S4: Insert the tail of the small rivet 42 into the connecting spring 41 so that the upper surface of the small rivet 42 is at the same level as the upper surface of the plastic part 1. At this time, the upper surface of the small rivet 42 forms a PAD contact point, and the manufacturing is completed.

[0079] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An assembly for exposing an internal wiring pad contact, comprising: include: Plastic parts, plastic holes for accommodating internal wiring, and internal wiring connectors with conductive properties; The hole in the plastic part is located inside the plastic part and extends through the plastic part; The internal circuit connector is located at the top of the hole in the plastic part and is fixedly connected to the internal circuit. The upper surface of the internal circuit connector, which has conductive properties, is a PAD contact point. The hole in the plastic part is divided into a lower half and an upper half; The diameter of the hole in the lower half of the plastic part is greater than or equal to the outer diameter of the internal circuit. The upper part of the plastic hole extends to both sides to form a connector receiving area, which is used to accommodate the internal circuit connector; The connector receiving area is cylindrical, and the inner wall of the connector receiving area transitions to the upper surface of the plastic part with a first chamfer. The internal circuit connector includes a connecting spring and a small rivet. The tail of the connecting spring is soldered to the internal circuit, and the tail of the small rivet is inserted into the connecting spring. The beveled head of the small rivet engages with the first chamfer to lock in place, so that the upper surface of the head of the small rivet and the upper surface of the plastic part are on the same horizontal plane. A conductive circuit is formed between the small rivet, the connecting spring, and the internal circuit. A PAD contact point is formed on the upper surface of the head of the small rivet.

2. The component for exposing the internal circuit PAD contact points according to claim 1, characterized in that: The connecting spring is cylindrical, and a second chamfer is provided at the top edge of the connecting spring. The second chamfer forms a guide surface when the small rivet is inserted into the connecting spring. The outer diameter of the connecting spring is the same as the inner diameter of the connector receiving area, and the connecting spring is snapped into place within the connector receiving area.

3. The component for exposing the internal circuit PAD contact points according to claim 2, characterized in that: The tail of the small rivet is provided with several protrusions or bosses. When the tail of the small rivet is placed in the connecting spring, the protrusions or bosses apply pressure to the connecting spring, that is, the connecting spring and the connector receiving area are clamped together under pressure.

4. A method for manufacturing a component for exposing internal circuit PAD contact points as described in any one of claims 1-3, characterized in that, include: Step S1: Open the hole in the plastic part and pass the internal circuit through the hole to the upper surface of the plastic part; Step S2: Solder the end of the internal circuit to the tail of the connecting spring; Step S3: Insert the entire internal wiring connector into the connector receiving area; Step S4: Insert the tail of the small rivet into the connecting spring so that the upper surface of the small rivet is at the same level as the upper surface of the plastic part. At this time, the upper surface of the small rivet forms a PAD contact point, and the manufacturing is completed.

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