A chip gripping apparatus

Abstract

The application provides a chip clamping device, and relates to the chip clamping field.The chip clamping device comprises a clamping assembly for a chip, and the clamping assembly comprises a driving part and a clamping part.The clamping part is arranged at the bottom of the driving part, and the driving part can drive the clamping part to clamp the chip when the chip needs to be clamped.The application has the effect of high applicability of the clamping device.

Description

Technical Field

[0001] This application relates to the field of chip clamping, and in particular to a chip clamping device. Background Technology

[0002] Modern printed circuit boards, especially those with complex functions, contain numerous chips of varying shapes and sizes. With the continuous development of society and the increasing number of electronic devices, chips are being mass-produced, requiring constant transportation throughout the production line.

[0003] Currently, one type of chip clamping device in related technologies is described in reference to... Figure 1 It includes a suction nozzle 7 and a suction platform 8. The suction platform 8 is fixed to the bottom of the suction nozzle 7. A suction hole 71 is formed through the suction nozzle 7, and a through hole 81 is formed through the suction platform 8, with the suction hole 71 and the through hole 81 communicating with each other. When gripping a chip, the chip is brought into contact with the bottom of the suction platform 8, and then a negative pressure is applied into the suction hole 71, thereby adsorbing the chip onto the suction platform 8 to complete the gripping of the chip.

[0004] However, if the chip's surface is irregular, the suction stage and the chip cannot be completely closed, resulting in continuous air leakage, making it impossible to grip the chip and thus reducing its applicability. Summary of the Invention

[0005] To address the issue of being unable to grip the chip when its surface is irregular, this application provides a chip gripping device.

[0006] This application provides a chip gripping device, which adopts the following technical solution: A chip gripping device includes a chip gripping assembly, the gripping assembly comprising a driving part and a gripping part, the gripping part being disposed at the bottom of the driving part, wherein when it is necessary to grip the chip, the driving part can drive the gripping part to grip the chip.

[0007] By adopting the above technical solution, the driving unit can drive the gripping unit to grip chips on irregular planes, thereby improving the applicability of the gripping device.

[0008] Optionally, the driving part includes: a suction nozzle body, the suction nozzle body being made of silicone, the suction nozzle body having an inner cavity inside, the top of the suction nozzle body having a communicating hole communicating with the inner cavity, and the clamping part being disposed at the bottom of the suction nozzle body.

[0009] By adopting the above technical solution, negative pressure is input into the inner cavity through the connecting hole, and the inner cavity will contract; at the same time, the gripping part will contract in conjunction, thereby gripping the chip.

[0010] Optionally, the gripping part includes two suction mouthpieces, which are fixed to the bottom of the suction mouthpiece body.

[0011] By adopting the above technical solution, when the inner cavity contracts, the two suction nozzles and grippers will contract in tandem to grip the chip.

[0012] Optionally, the clamping assembly includes: an opening and closing part, two sets of pushing parts, and two sets of clamping parts. The opening and closing part includes: a fixing block, a rubber block, a moving plate, and a connecting rope. The fixing block has a cavity inside, and the top of the fixing block has an inlet hole communicating with the cavity. The rubber block is disposed in the cavity and abuts against the inner wall of the cavity. The moving plate is fixed to the bottom of the rubber block. The pushing part is disposed at the bottom of the fixing block and connected to the clamping part. One end of the connecting rope is fixed to the moving plate, and the other end is connected to the pushing part.

[0013] By adopting the above technical solution, the chip is placed between two sets of clamping parts, and then negative pressure is input into the cavity through the inlet hole to pull the moving plate upward. During the movement of the moving plate, the moving plate will pull the connecting rope, so that the connecting rope can pull and push the clamping parts to clamp the chip. Since it is not made of silicone material, it is not too soft, so the stability of chip clamping is better.

[0014] Optionally, the pushing part includes: a receiving plate, a fixing rod, a screw, and a coil spring. The receiving plate is fixed to the side wall of the fixing block. The side wall of the receiving plate has a receiving hole. The fixing rod is rotatably installed in the receiving hole. The coil spring is sleeved on the fixing rod, with one end fixed to the fixing rod and the other end fixed to the inner wall of the receiving hole. One end of the screw is fixed to the fixing rod and the other end is connected to the clamping part. The end of the connecting rope away from the moving plate passes through the receiving hole and is wound around the fixing rod.

[0015] By adopting the above technical solution, during the upward movement of the moving plate, the connecting rope will pull the fixed rod to rotate, and the rotation of the fixed rod will drive the screw to rotate; the rotation of the screw will drive the pushing part to push the clamping part to clamp the chip; at the same time, the coil spring will store force, and when positive pressure is input into the cavity through the through hole, the moving plate will move downward, and the coil spring will release its elasticity to drive the fixed rod to reverse, so that the screw can drive the pushing part to retract the clamping part, thereby releasing the chip.

[0016] Optionally, the clamping part includes: a push plate, which is slidably connected to the bottom of the fixing block, and the push plate has a threaded hole, and the screw is threadedly connected to the threaded hole.

[0017] By adopting the above technical solution, when the fixed rod drives the screw to rotate, the rotation of the screw will drive the push plate to clamp the chip, thereby facilitating the transportation of the chip.

[0018] Optionally, the clamping part further includes a clamping plate and a compression spring, wherein the clamping plate is slidably connected to the bottom of the fixing block, and the compression spring is fixed between the clamping plate and the push plate.

[0019] By adopting the above technical solution, if the negative pressure input into the cavity is too large, that is, if the moving plate moves upward too far, the pushing plate will compress the compression spring, thereby converting the excessive thrust into the deformation of the compression spring, so as to replace the pushing plate directly contacting the chip and squeezing the chip, thereby protecting the chip and making it less likely to be damaged.

[0020] Optionally, the clamping part further includes a protective pad, which is fixed to the side of the clamping plate opposite to the compression spring.

[0021] By adopting the above technical solution, the protective pad can prevent the clamping plate from directly contacting the chip, thereby protecting the chip.

[0022] Optionally, the two clamping plates are provided with anti-fall components.

[0023] By adopting the above technical solution, the anti-drop component can prevent the chip from falling during the chip clamping process.

[0024] Optionally, the anti-fall assembly includes: a hose, a sliding plate, a connecting spring, a stop plate, and a pushing spring. The bottom wall of the clamping plate has a mounting hole. The sliding plate is slidably connected to the mounting hole. The connecting spring is fixed between the sliding plate and the bottom of the mounting hole. The side wall of the sliding plate has a placement hole. The stop plate is disposed in the placement hole and has a guide surface. The pushing spring is fixed between the bottom of the placement hole and the stop plate. The hose communicates with the mounting hole.

[0025] By adopting the above technical solution, positive pressure can be input into the mounting hole through the hose to increase the air pressure in the mounting hole, thereby pushing the lower slide plate out of the mounting hole; after the lower slide plate extends out of the mounting hole, the baffle plate will automatically extend out of the mounting hole by pushing the elastic force of the spring, thereby blocking the chip.

[0026] In summary, this application includes at least one of the following beneficial effects: 1. The driving unit can drive the gripping unit to grip chips on irregular planes, thereby improving the applicability of the gripping device.

[0027] 2. Place the chip between the two clamping parts, and then input negative pressure into the cavity through the inlet hole to pull the moving plate upward. During the movement of the moving plate, the moving plate will pull the connecting rope, so that the connecting rope can pull and push the clamping parts to clamp the chip. Since it is not made of silicone material, it is not too soft, so the stability of clamping the chip is better.

[0028] 3. Positive pressure can be introduced into the mounting hole through a hose to increase the air pressure inside the mounting hole, thereby pushing the lower slide plate out of the mounting hole; after the lower slide plate extends out of the mounting hole, the baffle plate will automatically extend out of the mounting hole by pushing the elastic force of the spring, thereby blocking the chip. Attached Figure Description

[0029] Figure 1 This is a structural diagram of the related technology; Figure 2 This is a schematic perspective view of Embodiment 1 of this application; Figure 3 yes Figure 2 A schematic cross-sectional view; Figure 4 This is a schematic perspective view of the chip being gripped by the gripping part in Embodiment 1; Figure 5 This is a schematic perspective view of Embodiment 2 of this application; Figure 6 yes Figure 5 A schematic cross-sectional view; Figure 7 yes Figure 6 A schematic enlarged view of part A.

[0030] In the diagram: 1. Drive unit; 11. Nozzle body; 111. Inner cavity; 112. Connecting hole; 2. Clamping unit; 21. Nozzle gripper; 3. Opening and closing unit; 31. Fixing block; 311. Cavity; 312. Through hole; 32. Rubber block; 33. Moving plate; 34. Connecting rope; 4. Pushing unit; 41. Receiving plate; 411. Accommodating hole; 42. Fixing rod; 43. Screw; 44. Coil spring; 5. Clamping unit; 51. Pushing plate; 511. Threaded hole; 52. Clamping plate; 521. Placement hole; 53. Compression spring; 54. Protective pad; 6. Anti-fall assembly; 61. Hose; 62. Lower sliding plate; 621. Placement hole; 63. Connecting spring; 64. Baffle plate; 641. Guide surface; 65. Pushing spring; 7. Nozzle; 71. Suction hole; 8. Suction platform; 81. Through hole. Detailed Implementation

[0031] This application provides a chip clamping device.

[0032] Example 1: See Figure 2 and Figure 3 A chip gripping device generally includes a gripping assembly for gripping chips, the gripping assembly including a driving part 1 and a gripping part 2. The driving part 1 includes a suction nozzle body 11. In this embodiment, the suction nozzle body 11 is made of silicone material. An inner cavity 111 is formed inside the suction nozzle body 11, and a connecting hole 112 is formed on the top wall of the suction nozzle body 11, and the connecting hole 112 communicates with the inner cavity 111.

[0033] See 3 and Figure 4 The gripping part 2 includes two suction claws 21, which are disposed at the bottom of the suction body 11 and are integrally formed with the suction body 11. When it is necessary to grip and transport the chip, the chip is placed between the two suction claws 21, and then negative pressure is input into the inner cavity 111 through the connecting hole 112, causing the inner cavity 111 to contract; at the same time, the two suction claws 21 will contract in conjunction, thereby gripping the chip. This allows for the transport of the chip and can also grip chips with irregular planes, thus improving the applicability of the gripping device. After the transport is completed, positive pressure is input into the inner cavity 111 through the connecting hole 112, and the inner cavity 111 will expand and restore its deformation; at the same time, the two suction nozzles 21 open, so that the chip can be released.

[0034] The working principle of Embodiment 1 is as follows: When it is necessary to clamp and transport the chip, the chip is placed between the two suction nozzles 21, and then negative pressure is input into the inner cavity 111 through the connecting hole 112, and the inner cavity 111 will contract; at the same time, the two suction nozzles 21 will contract in conjunction, thereby clamping the chip, which can transport the chip, and can still clamp the chip with irregular planes, thereby improving the applicability of the clamping device.

[0035] Example 2: See Figure 5 , Figure 6 and Figure 7 The difference between this embodiment and Embodiment 1 is that the clamping assembly includes: an opening and closing part 3, two sets of pushing parts 4 and two sets of clamping parts 5.

[0036] See Figure 6 and Figure 7 The opening and closing part 3 includes: a fixed block 31, a rubber block 32, a movable plate 33, and a connecting rope 34. The fixed block 31 has a cavity 311 inside, and an inlet hole 312 is formed on the top wall of the fixed block 31, which communicates with the cavity 311. The rubber block 32 is disposed in the cavity 311 and abuts against the inner side wall of the cavity 311. The movable plate 33 is fixed to the bottom of the rubber block 32, and the rubber block 32 can improve the sealing between the movable plates 33.

[0037] See Figure 7 Two sets of pushing parts 4 are disposed at the bottom of the fixed block 31 and connected to the clamping parts 5, with each set of pushing parts 4 corresponding to one set of clamping parts 5. One end of the connecting rope 34 is fixed to the bottom wall of the moving plate 33, and the other end is connected to the pushing part 4. When it is necessary to clamp and transport the chip, the chip is placed between the two sets of clamping parts 5, and then negative pressure is input into the cavity 311 through the inlet hole 312 to pull the moving plate 33 to move upward. During the movement of the moving plate 33, the moving plate 33 will pull the connecting rope 34, so that the connecting rope 34 can pull and push the clamping parts 5 to clamp the chip. Since it is not made of silicone material, it is not too soft, so the stability of chip clamping is better.

[0038] See Figure 7 The pushing part 4 includes a receiving plate 41, a fixing rod 42, a screw 43, and a coil spring 44. The receiving plate 41 is fixed to the side wall of the fixing block 31, and the bottom of the receiving plate 41 is lower than the fixing block 31. A receiving hole 411 is provided on the side of the receiving plate 41 near the fixing block 31. The fixing rod 42 is rotatably installed in the receiving hole 411 and is horizontally arranged. The coil spring 44 is sleeved on the fixing rod 42, with one end fixed to the fixing rod 42 and the other end fixed to the inner wall of the receiving hole 411. After the coil spring 44 has completed its energy storage and is released, it can drive the fixing rod 42 to rotate automatically.

[0039] See Figure 7 One end of the screw 43 is fixed to the fixed rod 42, and the other end is connected to the corresponding clamping part 5. The end of the connecting rope 34 away from the moving plate 33 passes through the receiving hole 411 and is wound around the fixed rod 42. As the moving plate 33 moves upward, the connecting rope 34 pulls the fixed rod 42 to rotate, and the rotation of the fixed rod 42 drives the screw 43 to rotate; the rotation of the screw 43 drives the pushing part 4 to push the clamping part 5 to clamp the chip; at the same time, the coil spring 44 stores force, and when positive pressure is input into the cavity 311 through the through hole 312, the moving plate 33 will move downward, and the coil spring 44 will release its elasticity to drive the fixed rod 42 to reverse, so that the screw 43 can drive the pushing part 4 to retract the clamping part 5, thereby releasing the chip.

[0040] See Figure 7 The clamping part 5 includes a push plate 51, which is slidably connected to the bottom of the fixing block 31 and slides horizontally. A threaded hole 511 is provided on the side of the push plate 51 near the receiving plate 41. The end of the screw 43 away from the fixing rod 42 is threaded into the threaded hole 511. When the fixing rod 42 drives the screw 43 to rotate, the rotation of the screw 43 will drive the push plate 51 to clamp the chip, thereby facilitating the transport of the chip.

[0041] See Figure 7The clamping part 5 also includes a clamping plate 52, a compression spring 53, and a protective pad 54. The clamping plate 52 is slidably connected to the bottom of the fixing block 31 and slides horizontally. The clamping plate 52 is located on the side of the push plate 51 away from the receiving plate 41. One end of the compression spring 53 is fixed to the clamping plate 52, and the other end is fixed to the push plate 51. When the screw 43 rotates, the push plate 51 pushes the clamping part 5 to clamp the chip, thereby facilitating the transport of the chip. With the setting of the compression spring 53, if the negative pressure input into the cavity 311 is too large, that is, when the moving plate 33 moves upward too far, the push plate 51 will compress the compression spring 53, thereby converting the excessive thrust into the deformation of the compression spring 53, so as to replace the push plate 51 directly contacting the chip and squeezing the chip, thereby protecting the chip and making it less likely to be damaged.

[0042] See Figure 7 The protective pad 54 is fixed to the side of the clamping plate 52 away from the compression spring 53. In this embodiment, the clamping plate 52 is made of rubber. The protective pad 54 prevents the clamping plate 52 from directly contacting the chip, thereby protecting the chip.

[0043] See Figure 7 Furthermore, both clamping plates 52 are equipped with anti-fall components 6, which include: a flexible hose 61, a sliding plate 62, a connecting spring 63, a stop plate 64, and a pushing spring 65. The bottom wall of the clamping plate 52 has a mounting hole 521. The flexible hose 61 communicates with the interior of the mounting hole 521. The sliding plate 62 is slidably connected within the mounting hole 521 and slides vertically. One end of the connecting spring 63 is fixed to the bottom of the mounting hole 521, and the other end is fixed to the sliding plate 62. The connecting spring 63 is used to reset the sliding plate 62.

[0044] See Figure 7 The side wall of the sliding plate 62 has a placement hole 621, and the abutment plate 64 is disposed in the placement hole 621 and slides horizontally. One end of the push spring 65 is fixed to the bottom of the placement hole 621, and the other end is fixed to the abutment plate 64. The push spring 65 is used to push the abutment plate 64 out of the placement hole 621. The top wall of the abutment plate 64 away from the push spring 65 is provided with a guide surface 641. The end of the guide surface 641 away from the push spring 65 is inclined downward. When the abutment plate 64 extends out of the placement hole 621, the end of the guide surface 641 near the push spring 65 is lower than the opening of the placement hole 621.

[0045] While negative pressure is input into the air, positive pressure can be input into the mounting hole 521 through the hose 61 to increase the air pressure in the mounting hole 521, thereby pushing the sliding plate 62 out of the mounting hole 521; after the sliding plate 62 extends out of the mounting hole 521, the baffle plate 64 will automatically extend out of the mounting hole 621 by pushing the elastic force of the spring 65, thereby blocking the chip. When it is necessary to remove the chip, simply stop the positive pressure input. At this time, the sliding plate 62 can be reset by connecting the spring 63. Meanwhile, the baffle plate 64 is automatically retracted into the placement hole 621 through the guide surface 641.

[0046] The working principle of Embodiment 2 is as follows: When it is necessary to clamp and transport the chip, the chip is placed between the two sets of clamping parts 5, and then negative pressure is input into the cavity 311 through the inlet hole 312 to pull the moving plate 33 to move upward; during the movement of the moving plate 33, the moving plate 33 will pull the connecting rope 34, so that the connecting rope 34 can pull and push the clamping part 5 to clamp the chip. Since it is not made of silicone material, it is not too soft, so the stability of chip clamping is better.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A chip gripping device, characterized in that, include: A chip clamping assembly includes: an opening and closing part (3), two sets of pushing parts (4) and two sets of clamping parts (5). The opening and closing part (3) includes: a fixing block (31), a rubber block (32), a moving plate (33) and a connecting rope (34). The fixing block (31) has a cavity (311) inside and an inlet hole (312) communicating with the cavity (311) on the top of the fixing block (31). The rubber block (32) is disposed in the cavity (311) and abuts against the inner wall of the cavity (311). The moving plate (33) is fixed to the bottom of the rubber block (32). The pushing part (4) is disposed at the bottom of the fixing block (31) and connected to the clamping part (5). One end of the connecting rope (34) is fixed to the moving plate (33) and the other end is connected to the pushing part (4). The pushing part (4) includes: a receiving plate (41), a fixing rod (42), a screw (43) and a coil spring (44). The receiving plate (41) is fixed on the side wall of the fixing block (31). The side wall of the receiving plate (41) is provided with a receiving hole (411). The fixing rod (42) is rotatably installed in the receiving hole (411). The coil spring (44) is sleeved on the fixing rod (42) and one end is fixed to the fixing rod (42) and the other end is fixed to the inner wall of the receiving hole (411). One end of the screw (43) is fixed to the fixing rod (42) and the other end is connected to the clamping part (5). One end of the connecting rope (34) away from the moving plate (33) passes through the receiving hole (411) and is wound around the fixing rod (42). The clamping part (5) includes: a push plate (51), which is slidably connected to the bottom of the fixing block (31), and a threaded hole (511) is provided on the push plate (51), and the screw (43) is threadedly connected to the threaded hole (511); The clamping part (5) further includes a clamping plate (52) and a compression spring (53). The clamping plate (52) is slidably connected to the bottom of the fixing block (31), and the compression spring (53) is fixed between the clamping plate (52) and the push plate (51).

2. The chip gripping device according to claim 1, characterized in that, The clamping part (5) further includes a protective pad (54), which is fixed to the side of the clamping plate (52) away from the compression spring (53).

3. The chip gripping device according to claim 2, characterized in that, The two clamping plates (52) are provided with anti-fall components (6).

4. The chip gripping device according to claim 3, characterized in that, The anti-fall component (6) includes: a hose (61), a sliding plate (62), a connecting spring (63), a stop plate (64), and a pushing spring (65). The bottom wall of the clamping plate (52) is provided with a mounting hole (521). The sliding plate (62) is slidably connected in the mounting hole (521). The connecting spring (63) is fixed between the sliding plate (62) and the bottom of the mounting hole (521). The side wall of the sliding plate (62) is provided with a placement hole (621). The stop plate (64) is disposed in the placement hole (621) and a guide surface (641) is provided on the stop plate (64). The pushing spring (65) is fixed between the bottom of the placement hole (621) and the stop plate (64). The hose (61) is connected to the mounting hole (521).

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