Height adjustment system for laser cutting and laser cutting system

Abstract

The application relates to the technical field of laser cutting, and discloses a height adjusting system for laser cutting and a laser cutting system. The height adjusting system comprises a frequency selection loop module connected with a laser cutting head and an integrated oscillator module respectively, measures the capacitance between the laser cutting head and a workpiece, and generates a signal with a capacitance information frequency; the integrated oscillator module generates and outputs a sinusoidal oscillation signal or a square wave signal according to the signal with the capacitance information frequency; and a signal processing module connected with the integrated oscillator module reads the frequency value of the sinusoidal oscillation signal or the square wave signal, calculates the capacitance of the laser cutting head according to the frequency value to determine the height position information of the laser cutting head, and sends the height position information to the laser cutting system. Compared with a traditional measurement circuit of discrete components, the application adopts an integrated oscillator module with high integration to reduce the use of discrete components, reduce the influence of parasitic capacitance in the height adjusting system circuit, and improve the measurement accuracy and stability of the height adjusting system.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and more particularly to a height adjustment system and a laser cutting system for laser cutting. Background Technology

[0002] Height adjustment systems can detect the distance between the laser cutting head and the workpiece in real time, and are therefore widely used in the laser cutting field. However, when current height adjustment systems detect the distance between the laser cutting head and the workpiece, the parasitic capacitance in the measurement circuit of capacitive laser height adjustment systems is easily affected by factors such as board temperature and circuit current. This not only affects the stability of the oscillation circuit, but also reduces the measurement accuracy and precision, leading to errors in laser cutting.

[0003] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to provide a height adjustment system and a laser cutting system for laser cutting, aiming to solve the technical problem that the measurement accuracy and precision are reduced due to factors such as parasitic capacitance in the measurement circuit of existing capacitive laser height adjustment systems, thereby reducing the accuracy of laser cutting.

[0005] To achieve the above objectives, the present invention provides a height adjustment system for laser cutting, comprising: a frequency selection circuit module, an integrated oscillator module, and a signal processing module; wherein,

[0006] The frequency selection circuit module is connected to the laser cutting head and the integrated oscillator module respectively, and is used to measure the capacitance between the laser cutting head and the workpiece, and generate a signal with capacitance information frequency to the integrated oscillator module;

[0007] The integrated oscillator module is used to generate and output a sinusoidal oscillation signal or a square wave signal based on the signal with the capacitance information frequency.

[0008] The signal processing module is connected to the integrated oscillator module and is used to read the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module, calculate the capacitance of the laser cutting head based on the frequency value, and determine the height position information of the laser cutting head based on the capacitance.

[0009] The signal processing module is also used to send the height position information to the laser cutting system to adjust the height of the laser cutting head.

[0010] In some embodiments, the integrated oscillator module includes a monolithic integrated oscillator, which includes a differential pair oscillation circuit, a bias circuit, and an amplifier circuit.

[0011] In some embodiments, the monolithic integrated oscillator is model E1648.

[0012] In some embodiments, the frequency selection circuit module includes an LC device and an input capacitor; wherein,

[0013] The LC device is connected in parallel to the first and second pins of the integrated oscillator module;

[0014] The first end of the input capacitor is connected to the first pin of the integrated oscillator module, and the second end of the input capacitor is grounded.

[0015] In some embodiments, the LC device includes a first inductor and a first capacitor, and the input capacitor is a sensor capacitor; wherein,

[0016] The first end of the first inductor is connected to the first pin of the integrated oscillator module, and the second end of the first inductor is connected to the second pin of the integrated oscillator module;

[0017] The first terminal of the first capacitor is connected to the first pin of the integrated oscillator module, and the second terminal of the first capacitor is connected to the second pin of the integrated oscillator module.

[0018] The first end of the sensor capacitor is connected to the first pin of the integrated oscillator module, and the second end of the sensor capacitor is grounded.

[0019] In some embodiments, the height adjustment system for laser cutting further includes a waveform selection module; wherein,

[0020] The waveform selection module is connected to the third pin of the integrated oscillator module and is used to adjust the output waveform of the integrated oscillator module.

[0021] In some embodiments, the waveform selection module includes a second capacitor and a first resistor; wherein,

[0022] The first terminal of the second capacitor is connected to the third pin of the integrated oscillator module, and the second terminal of the second capacitor is grounded.

[0023] The first end of the first resistor is connected to the third pin of the integrated oscillator module, and the second end of the first resistor is grounded.

[0024] In some embodiments, the height adjustment system for laser cutting further includes an output impedance control module; wherein,

[0025] The output impedance control module is connected to the integrated oscillator module and the signal processing module, respectively.

[0026] In some embodiments, the output impedance control module includes: a second resistor; wherein,

[0027] The first end of the second resistor is connected to the output pin of the integrated oscillator module, and the second end of the second resistor is connected to the input terminal of the signal processing module.

[0028] Furthermore, to achieve the above objectives, the present invention also proposes a laser cutting system, comprising: a control system, a laser cutting head, and a height adjustment system for laser cutting as described above; wherein,

[0029] The control system is communicatively connected to the height adjustment system for laser cutting, and is used to receive height position information transmitted by the height adjustment system and adjust the height of the laser cutting head according to the height position information.

[0030] This invention provides a height adjustment system for laser cutting, comprising: a frequency selective circuit module, an integrated oscillator module, and a signal processing module; wherein, the frequency selective circuit module is connected to both the laser cutting head and the integrated oscillator module, and is used to measure the capacitance between the laser cutting head and the workpiece, and generate a signal with capacitance information frequency to the integrated oscillator module; the integrated oscillator module is used to generate and output a sinusoidal oscillation signal or a square wave signal based on the signal with capacitance information frequency; the signal processing module is connected to the integrated oscillator module, and is used to read the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module, calculate the capacitance of the laser cutting head based on the frequency value, and determine the height position information of the laser cutting head based on the capacitance; the signal processing module is also used to send the height position information to the laser cutting system to adjust the height of the laser cutting head. Compared to traditional capacitance measurement circuits composed of discrete components, this invention designs a height adjustment system based on an integrated oscillator. It employs a highly integrated oscillator module, reducing the use of discrete components and effectively minimizing the impact of inter-electrode and inter-junction capacitances on the oscillation circuit. This significantly reduces parasitic capacitance in the height adjustment system circuit, lowering its influence and improving the overall measurement accuracy and stability. Furthermore, it is easily implemented in engineering, thus solving the technical problem of reduced measurement accuracy and precision caused by parasitic capacitance and other factors in existing capacitive laser height adjustment systems, thereby reducing the accuracy of laser cutting. Attached Figure Description

[0031] Figure 1 A schematic diagram illustrating the principle of a parallel plate capacitor formed by a laser probe and a sheet metal workpiece.

[0032] Figure 2 A schematic diagram of a capacitive three-point LC oscillation frequency modulation circuit and its parasitic capacitance parameter distribution;

[0033] Figure 3 This is due to the parasitic effect of mutual capacitance on the PCB board.

[0034] Figure 4 This is a schematic diagram of the circuit structure of a height adjustment system for laser cutting according to an embodiment of the present invention.

[0035] Figure labeling: 100 - Frequency selection circuit module; 200 - Integrated oscillator module; 300 - Signal processing module; U - Monolithic integrated oscillator; 101 - LC device; 102 - Input capacitor; L1 - First inductor; C1 - First capacitor; Cx - Sensor capacitor; BIAS - First pin; TANK - Second pin; 400 - Waveform selection module; AGC - Third pin; C2 - Second capacitor; R1 - First resistor; 500 - Output impedance control module; R2 - Second resistor; OUT - Output pin.

[0036] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0039] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0040] The height adjustment system can detect the distance between the laser cutting head and the workpiece in real time, and is therefore widely used in the laser cutting field. When the height adjustment system detects a change in the distance between the laser cutting head and the workpiece, it feeds this information back to the laser cutting system. Based on this information, the laser cutting system adjusts the height of the laser cutting head in real time through the height adjustment system to keep the distance between the laser focus and the sheet metal workpiece dynamically constant, ensuring a constant power density at the cutting edge, thus effectively guaranteeing the quality of laser cutting.

[0041] The principle of the height adjustment system in a laser cutting system: It reflects the change in distance between the laser cutting head and the workpiece by detecting the magnitude of the capacitance. Figure 1 A schematic diagram illustrating the principle of a parallel plate capacitor formed by a laser cutting head and a sheet metal workpiece, as shown below. Figure 1 As shown, the laser nozzle and the sheet metal workpiece form a parallel plate capacitor, and the relationship of the parallel plate capacitor is as follows:

[0042]

[0043] Where Cx represents the capacitance between the plates; ε represents the dielectric constant of the dielectric between the plates, ε = ε₀ε₀ r ε0 is the vacuum permittivity ε0 = 8.85 x 10 -12 f / m, ε r The dielectric constant of air ε r =1.0f / m; S is the effective area of ​​the two plates; h is the height between the plates.

[0044] For example, in a three-dimensional laser cutting system, when the outer diameter of the cutting head is approximately 10 mm and the height of the laser cutting head varies within the range of 1 to 10 mm, the capacitance Cx in the above-mentioned parallel plate capacitance formula varies within the range of approximately 0.07 to 0.7 pF. Therefore, the distance between the laser nozzle and the sheet metal workpiece can be derived by detecting the capacitance Cx.

[0045] In laser height adjustment systems, capacitive sensors are commonly used to detect capacitance. For capacitive sensors, frequency modulation circuits are often employed, reflecting changes in capacitance through the frequency. For example, an LC oscillator-type frequency modulation circuit is used, such as a three-point LC oscillation frequency modulation circuit. Figure 2 As shown, the formula for measuring frequency f is:

[0046]

[0047] Where L1 represents the inductance of the fixed inductor; C represents the inherent capacitance of the oscillating circuit, such as... Figure 2 As shown Cp represents the equivalent capacitance of the parasitic capacitance of the oscillation circuit; Cx represents the capacitance detected by the sensor.

[0048] According to the formula for frequency f, ideally, the change in frequency f is only affected by the capacitance Cx. In reality, frequency f is easily affected by both the capacitance Cx and the parasitic capacitance Cp. Since the sensor capacitance Cx is relatively small, varying from approximately 0.07 to 0.7 pF, the parasitic capacitance Cp in the discrete component-based three-point LC oscillator circuit, on the order of pF, has a significant impact on the accuracy of the measurement.

[0049] Specifically, parasitic capacitance Cp includes the inter-electrode capacitance, inter-junction capacitance, self-capacitance, and mutual capacitance of transistor Q1. Among these, inter-junction capacitance is inherent to the PN junctions within the transistor and cannot be eliminated during semiconductor manufacturing; it can only be minimized. Inter-electrode capacitance is mainly influenced by factors such as transistor size, electrode spacing, and pads. For example... Figure 2 As shown, C be C bc C ce This is the equivalent capacitance of inter-electrode capacitance and inter-junction capacitance, on the order of pF. Self-capacitance or mutual capacitance is formed due to the presence of many discrete components, such as between their parallel traces, between traces and copper pours, or between pads and copper pours. Figure 3 This is a schematic diagram of the parasitic effect of mutual capacitance on a PCB board, as shown below. Figure 3 As shown, when there is a pressure difference between two adjacent copper sheets, a pressure difference is formed. Figure 3 The electric field shown forms a mutual capacitance, the magnitude of which is determined by the PCB trace thickness w, PCB trace length l, trace spacing d, and the dielectric constant ε of the PCB substrate. r Conclusion:

[0050]

[0051] In traditional capacitive laser height adjustment systems, the parasitic capacitance Cp is highly susceptible to changes caused by factors such as board temperature and circuit current. This not only affects the stability of the oscillation circuit but also reduces measurement accuracy. Therefore, minimizing the impact of parasitic capacitance is crucial for sensors detecting minute capacitances.

[0052] In view of the above problems, embodiments of the present invention propose a height adjustment system and a laser cutting system for laser cutting.

[0053] This invention provides a height adjustment system for laser cutting, referring to... Figure 4 , Figure 4 This is a schematic diagram of the circuit structure of a height adjustment system for laser cutting according to an embodiment of the present invention.

[0054] like Figure 4 As shown, the height adjustment system for laser cutting includes: a frequency selection circuit module 100, an integrated oscillator module 200, and a signal processing module 300; wherein,

[0055] The frequency selection circuit module 100 is connected to the laser cutting head and the integrated oscillator module 200 respectively, and is used to measure the capacitance between the laser cutting head and the workpiece, and generate a signal with capacitance information frequency to the integrated oscillator module 200.

[0056] The integrated oscillator module 200 is used to generate and output a sinusoidal oscillation signal or a square wave signal according to the signal with the capacitance information frequency.

[0057] The signal processing module 300 is connected to the integrated oscillator module 200 and is used to read the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module 200, calculate the capacitance of the laser cutting head based on the frequency value, and determine the height position information of the laser cutting head based on the capacitance.

[0058] The signal processing module 300 is also used to send the height position information to the laser cutting system to adjust the height of the laser cutting head.

[0059] It should be noted that this embodiment uses a height adjustment system for laser cutting as an example for illustration. The height adjustment system in this embodiment is used to reduce the parasitic capacitance effect of capacitive height adjustment systems and improve measurement accuracy. This height adjustment system can also be used in other fields, and this embodiment does not limit its application.

[0060] In one embodiment, the frequency selective circuit module 100 is used to measure the capacitance between the laser cutting head and the workpiece, and generate a signal with capacitance information frequency to the integrated oscillator module 200. Exemplarily, the frequency selective circuit module 100 includes, but is not limited to, a fixed inductor, a fixed capacitor, and a sensor capacitor. The fixed inductor and fixed capacitor are connected in parallel to the integrated oscillator module 200, and the sensor capacitor is directly connected to the integrated oscillator module 200. The signal with capacitance information frequency is generated based on the fixed inductor, fixed capacitor, and sensor capacitor and sent to the integrated oscillator module 200.

[0061] In one embodiment, the integrated oscillator module 200 generates and outputs a sinusoidal oscillation signal or a square wave signal based on the signal with the capacitance information frequency. Specifically, the integrated oscillator module 200 includes, but is not limited to, a differential pair oscillation circuit, a bias circuit, and an amplifier circuit. The integrated oscillator module 200 can generate and output a sinusoidal oscillation signal, and can also output other waveforms such as square waves through different settings; this embodiment does not limit this.

[0062] It is understandable that, compared to a single-transistor oscillation circuit, the integrated oscillator module 200 differential oscillation in this embodiment has advantages such as good oscillation voltage amplitude stability, high frequency stability, and low nonlinear distortion.

[0063] In one embodiment, the signal processing module 300 reads the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module 200, calculates the capacitance of the laser cutting head based on the frequency value, and determines the height position information of the laser cutting head based on the capacitance.

[0064] For example, the signal processing module 300 reads the frequency value f of the oscillation circuit, i.e., the integrated oscillator module 200, and calculates the capacitance of the laser cutting head, i.e., the capacitance of the sensor capacitor, based on the frequency value f. Figure 1 As shown, the laser nozzle and the sheet metal workpiece form a parallel plate capacitor, and the relationship of the parallel plate capacitor is as follows:

[0065]

[0066] Where Cx represents the capacitance between the plates, i.e., the capacitance of the sensor; ε represents the dielectric constant of the medium between the plates, ε = ε₀ε₀. r ε0 is the vacuum permittivity ε0 = 8.85 x 10 -12 f / m, ε r The dielectric constant of air ε r =1.0f / m; S is the effective area of ​​the two plates; h is the height between the plates.

[0067] Specifically, the height position h of the laser cutting head is calculated based on the above-mentioned parallel plate capacitance relationship and the capacitance of the sensor capacitor.

[0068] In one embodiment, the signal processing module 300 sends the height position information to the laser cutting system to adjust the height of the laser cutting head. It should be noted that the signal processing module 300 continuously monitors the changing trend of the output signal of the integrated oscillator module 200. When the laser cutting head contacts the workpiece, the signal processing module 300 communicates with the laser cutting system and sends the height position information of the laser cutting head to the control system of the laser cutting system. The laser cutting system controls the laser cutting head to move to different heights. By adjusting the height of the laser cutting head in real time, the distance between the laser focus and the sheet metal workpiece remains dynamically constant, ensuring a constant power density at the cutting edge, thereby effectively ensuring the quality of laser cutting.

[0069] The height adjustment system for laser cutting in this embodiment includes: a frequency selection circuit module 100, an integrated oscillator module 200, and a signal processing module 300. The frequency selection circuit module 100 is connected to both the laser cutting head and the integrated oscillator module 200, and is used to measure the capacitance between the laser cutting head and the workpiece, and generate a signal with capacitance information frequency to the integrated oscillator module 200. The integrated oscillator module 200 is used to generate and output a sinusoidal oscillation signal or a square wave signal based on the signal with capacitance information frequency. The signal processing module 300 is connected to the integrated oscillator module 200, and is used to read the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module 200, calculate the capacitance of the laser cutting head based on the frequency value, and determine the height position information of the laser cutting head based on the capacitance. The signal processing module 300 is also used to send the height position information to the laser cutting system to adjust the height of the laser cutting head. Compared to traditional capacitance measurement circuits composed of discrete components, this embodiment designs a height adjustment system based on an integrated oscillator. It employs a highly integrated oscillator module, reducing the use of discrete components and effectively minimizing the impact of inter-electrode and inter-junction capacitances on the oscillation circuit. This significantly reduces parasitic capacitance in the height adjustment system circuit, lowering its influence and improving the overall measurement accuracy and stability. Furthermore, it is easily implemented in engineering, thus solving the technical problem of reduced measurement accuracy and precision caused by parasitic capacitance and other factors in existing capacitive laser height adjustment system measurement circuits, thereby reducing the accuracy of laser cutting.

[0070] In some embodiments, reference Figure 4 The integrated oscillator module 200 includes a monolithic integrated oscillator U, which includes a differential pair oscillation circuit, a bias circuit, and an amplifier circuit.

[0071] For example, the integrated oscillator module 200 includes, but is not limited to, a differential pair oscillation circuit, a bias circuit, and an amplifier circuit. Differential oscillation has advantages such as good stability of oscillation voltage amplitude, high frequency stability, and low nonlinear distortion. The integrated oscillator module 200 can generate and output a sinusoidal oscillation signal, and can also output other waveforms such as square waves through different settings.

[0072] It should be noted that, compared to traditional capacitance measurement circuits composed of discrete components, such as single-transistor oscillator circuits, this embodiment is based on a monolithic integrated oscillator U design. This reduces PCB trace length, the number of pads, and the copper area, thereby reducing self-capacitance and mutual capacitance. Using a highly integrated monolithic oscillator U reduces the use of discrete components and effectively reduces the impact of inter-electrode and inter-junction capacitances of discrete components on the oscillation circuit. This embodiment significantly reduces parasitic capacitance in the measurement circuit, improves the resistance of the capacitive frequency modulation measurement circuit to environmental factors such as temperature and circuit current, reduces the impact of parasitic capacitance on the micro-capacitive height adjustment system, and effectively improves measurement accuracy and stability.

[0073] In some embodiments, reference Figure 4 The model of the monolithic integrated oscillator U is E1648.

[0074] Specifically, the model of the monolithic integrated oscillator U can be E1648. The E1648 monolithic integrated oscillator U mainly consists of a differential pair oscillation circuit, a bias circuit, and an amplifier circuit. It can generate a sinusoidal oscillation signal output, and under different settings, it can also generate a square wave output.

[0075] It is understandable that, compared with a single-tube mutually inductance coupled oscillator circuit, the differential pair oscillator circuit in this embodiment has the advantages of good output oscillation voltage amplitude stability, high frequency stability, good waveform, and low nonlinear distortion.

[0076] For example, the core circuit (not shown) of the E1648 type monolithic integrated oscillator U may include a constant current source and a first transistor and a second transistor, forming a complete positive feedback circuit: Assuming that at a certain instant, the voltage polarity of the circuit thermal noise Ui applied to the base of the second transistor is positive, after differential amplification by the first and second transistors, the collector potential of the first transistor rises in phase with the circuit thermal noise Ui and is applied to the base of the second transistor, forming positive feedback. The differential output characteristics of the first and second transistors are hyperbolic tangent characteristics, and the oscillation voltage at startup operates at the maximum transconductance of the differential amplifier input characteristic, easily satisfying the amplitude condition and starting oscillation.

[0077] It should be noted that the monolithic integrated oscillator U can also be other types of oscillators, and this embodiment does not limit this.

[0078] In some embodiments, reference Figure 4 The frequency selection circuit module 100 includes an LC device 101 and an input capacitor 102; wherein,

[0079] The LC device 101 is connected in parallel to the first pin BIAS and the second pin TANK of the integrated oscillator module 200.

[0080] The first end of the input capacitor 102 is connected to the first pin BIAS of the integrated oscillator module 200, and the second end of the input capacitor 102 is grounded.

[0081] For example, the frequency selection loop module 100 includes an LC device 101 and an input capacitor 102. The LC device 101 is connected in parallel to the integrated oscillator module 200, and the input capacitor 102 is directly connected to the integrated oscillator module 200. The LC device 101 is used to generate and increase the inherent frequency of the system.

[0082] In some embodiments, reference Figure 4 The LC device 101 includes a first inductor L1 and a first capacitor C1, and the input capacitor 102 is a sensor capacitor Cx; wherein,

[0083] The first end of the first inductor L1 is connected to the first pin BIAS of the integrated oscillator module 200, and the second end of the first inductor L1 is connected to the second pin TANK of the integrated oscillator module 200.

[0084] The first end of the first capacitor C1 is connected to the first pin BIAS of the integrated oscillator module 200, and the second end of the first capacitor C1 is connected to the second pin TANK of the integrated oscillator module 200.

[0085] The first end of the sensor capacitor Cx is connected to the first pin BIAS of the integrated oscillator module 200, and the second end of the sensor capacitor Cx is grounded.

[0086] Specifically, the LC device 101 includes a first inductor L1 and a first capacitor C1, the input capacitor 102 is a sensor capacitor Cx, and the frequency selection circuit module 100 includes a fixed inductor (i.e., the first inductor L1), a fixed capacitor (i.e., the first capacitor C1), and a sensor capacitor Cx. For example... Figure 4 As shown, the first inductor L1 and the first capacitor C1 are connected in parallel to pin 10 (BIAS, i.e., the first pin) and pin 11 (TANK, i.e., the second pin) of the E1648 monolithic integrated oscillator U. The sensor capacitor Cx is directly connected to pin 10 (BIAS, i.e., the first pin) of the E1648 monolithic integrated oscillator U. The first inductor L1 and the first capacitor C1 are used to generate and increase the system's inherent frequency. The measured frequency f of the increased system frequency is:

[0087]

[0088] The signal processing module 300 reads the frequency value f and calculates the capacitance.

[0089] In some embodiments, reference Figure 4The height adjustment system for laser cutting further includes a waveform selection module 400; wherein,

[0090] The waveform selection module 400 is connected to the third pin AGC of the integrated oscillator module 200 and is used to adjust the output waveform of the integrated oscillator module 200.

[0091] For example, the waveform selection module 400 includes, but is not limited to, capacitors and resistors. Through different RC combinations, it controls the output waveform of the integrated oscillator module 200. The output can be configured in parallel as a sine wave or a square wave, etc. Specifically, when a capacitor and a resistor are connected in parallel to the integrated oscillator module 200, the integrated oscillator module 200 outputs a sine wave.

[0092] In some embodiments, reference Figure 4 The waveform selection module 400 includes a second capacitor C2 and a first resistor R1; wherein,

[0093] The first terminal of the second capacitor C2 is connected to the third pin AGC of the integrated oscillator module 200, and the second terminal of the second capacitor C2 is grounded.

[0094] The first end of the first resistor R1 is connected to the third pin AGC of the integrated oscillator module 200, and the second end of the first resistor R1 is grounded.

[0095] For example, the waveform selection module 400 includes a second capacitor C2 and a first resistor R1, and the output waveform of the E1648 monolithic integrated oscillator U can be controlled by pin 5 (i.e., the third pin) of the E1648 monolithic integrated oscillator U.

[0096] Specifically, by using different RC configurations for the second capacitor C2 and the first resistor R1, the parallel output can be configured to produce a sine wave or a square wave, etc. When pin 5 (AGC) of the E1648 monolithic integrated oscillator U is connected to VEE via an RC connection... Figure 1 When the ground terminal GND is connected, pin 3 OUT (output terminal) of the E1648 monolithic integrated oscillator U can output a sine wave.

[0097] In some embodiments, reference Figure 4 The height adjustment system for laser cutting also includes an output impedance control module 500; wherein,

[0098] The output impedance control module 500 is connected to the integrated oscillator module 200 and the signal processing module 300, respectively.

[0099] For example, the height adjustment system for laser cutting also includes an output impedance control module 500. The output impedance control module 500 is directly connected to the integrated oscillator module 200 for control. When the output waveform of the integrated oscillator module 200 needs to be transmitted over a long distance, impedance matching is performed through the output impedance control module 500, thereby effectively preventing the output waveform amplitude from attenuating or distorting to varying degrees as the transmission distance changes, thus improving signal quality.

[0100] In some embodiments, reference Figure 4 The output impedance control module 500 includes: a second resistor R2; wherein,

[0101] The first end of the second resistor R2 is connected to the output pin OUT of the integrated oscillator module 200, and the second end of the second resistor R2 is connected to the input terminal of the signal processing module 300.

[0102] Specifically, the output impedance control module 500 includes a second resistor R2. This second resistor R2 is connected in series with pin 3 (OUT) of the E1648 monolithic integrated oscillator U. Impedance matching is achieved through the second resistor R2, effectively preventing varying degrees of attenuation or distortion of the output waveform amplitude due to changes in transmission distance, thus improving signal quality. It should be noted that the output impedance control module 500 can also utilize other components; this embodiment does not impose any limitations on this.

[0103] Furthermore, embodiments of the present invention also propose a laser cutting system, which includes: a control system, a laser cutting head, and a height adjustment system for laser cutting as described in the above embodiments; wherein,

[0104] The control system is communicatively connected to the height adjustment system for laser cutting, and is used to receive height position information transmitted by the height adjustment system and adjust the height of the laser cutting head according to the height position information.

[0105] It should be noted that the laser cutting system includes, but is not limited to, a control system, a laser cutting head, and a height adjustment system for laser cutting as described in the above embodiments.

[0106] Specifically, the control system receives height position information transmitted by the height adjustment system and adjusts the height of the laser cutting head according to the height position information. For example, the control system controls the driver and motor to slowly lower the laser cutting head until it contacts the workpiece. The height adjustment system continuously monitors the changing trend of the output signal of the capacitance signal sensor (e.g., sensor capacitance Cx). When the laser cutting head contacts the workpiece, the height adjustment system sends a contact signal to the control system, and the control system controls the laser cutting head to move away from the workpiece. As the laser cutting head moves to different heights, the height adjustment system monitors the capacitance value at the corresponding height to calculate the height position information and sends the height position information to the control system. The control system receives the height position information and adjusts the distance between the laser cutting head and the workpiece.

[0107] In addition, for technical details not described in detail in this embodiment of the laser cutting system, please refer to the height adjustment system for laser cutting as described above provided in any embodiment of the present invention, which will not be repeated here.

[0108] It should be understood that the above are merely illustrative examples and do not constitute any limitation on the technical solutions of the present invention. In specific applications, those skilled in the art can make settings as needed, and the present invention does not impose any restrictions on this.

[0109] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this invention. In practical applications, those skilled in the art can select some or all of the workflow to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0110] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0111] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0112] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0113] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A height adjustment system for laser cutting, characterized in that, The height adjustment system for laser cutting includes: a frequency selective circuit module, an integrated oscillator module, and a signal processing module; wherein, The frequency selection circuit module is connected to both the laser cutting head and the integrated oscillator module. It measures the capacitance between the laser cutting head and the workpiece and generates a signal with capacitance information frequency to the integrated oscillator module. The frequency selection circuit module includes an LC device and an input capacitor. The LC device is connected in parallel to the first and second pins of the integrated oscillator module. The first end of the input capacitor is connected to the first pin of the integrated oscillator module, and the second end of the input capacitor is grounded. The integrated oscillator module is used to generate and output a sinusoidal oscillation signal or a square wave signal based on the signal with the capacitance information frequency; the integrated oscillator module includes: a monolithic integrated oscillator, which includes a differential pair oscillation circuit, a bias circuit, and an amplifier circuit; The signal processing module is connected to the integrated oscillator module and is used to read the frequency value of the sinusoidal oscillation signal or square wave signal output by the integrated oscillator module, calculate the capacitance of the laser cutting head based on the frequency value, and determine the height position information of the laser cutting head based on the capacitance. The signal processing module is also used to send the height position information to the laser cutting system to adjust the height of the laser cutting head; The model of the monolithic integrated oscillator is E1648; The height adjustment system for laser cutting further includes a waveform selection module; wherein the waveform selection module is connected to the third pin of the integrated oscillator module and is used to adjust the output waveform of the integrated oscillator module; the waveform selection module includes a second capacitor and a first resistor; wherein the first end of the second capacitor is connected to the third pin of the integrated oscillator module and the second end of the second capacitor is grounded; the first end of the first resistor is connected to the third pin of the integrated oscillator module and the second end of the first resistor is grounded; The height adjustment system for laser cutting further includes an output impedance control module; wherein the output impedance control module is connected to the integrated oscillator module and the signal processing module respectively; the output impedance control module includes a second resistor; wherein the first end of the second resistor is connected to the output pin of the integrated oscillator module, and the second end of the second resistor is connected to the input end of the signal processing module.

2. The height adjustment system for laser cutting as described in claim 1, characterized in that, The LC device includes a first inductor and a first capacitor, and the input capacitor is a sensor capacitor; wherein... The first end of the first inductor is connected to the first pin of the integrated oscillator module, and the second end of the first inductor is connected to the second pin of the integrated oscillator module; The first terminal of the first capacitor is connected to the first pin of the integrated oscillator module, and the second terminal of the first capacitor is connected to the second pin of the integrated oscillator module. The first end of the sensor capacitor is connected to the first pin of the integrated oscillator module, and the second end of the sensor capacitor is grounded.

3. A laser cutting system, characterized in that, The laser cutting system includes: a control system, a laser cutting head, and a height adjustment system for laser cutting as described in claim 1 or 2; wherein, The control system is communicatively connected to the height adjustment system for laser cutting, and is used to receive height position information transmitted by the height adjustment system and adjust the height of the laser cutting head according to the height position information.

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