Vibration device, angular velocity sensor, electronic device, and moving body

Abstract

Vibration device, angular velocity sensor, electronic device, and moving body. Provided are a vibration device in which variation in vibration characteristics is reduced, an angular velocity sensor provided with the vibration device and in which reduction in detection accuracy is reduced, an electronic device provided with the vibration device, and a moving body. The vibration device is characterized by including a vibration element having a plurality of terminals, a base having a plurality of electric connection terminals, and a relay substrate having a wiring portion that electrically connects the plurality of electric connection terminals and the plurality of terminals, the vibration element being supported to the base, the relay substrate having a base fixing portion fixed to the base, a vibration element placement portion on which the vibration element is placed, and at least one beam portion that links the base fixing portion and the vibration element placement portion, the at least one beam portion having a first portion extending in a first direction and a second portion extending in a second direction intersecting the first direction.

Description

[0001] This invention patent application is a divisional application of the invention patent application entitled "Vibration Device, Angular Velocity Sensor, Electronic Device and Moving Body", filed on March 5, 2018, with application number "201810178563.8". Technical Field

[0002] This invention relates to vibration devices, angular velocity sensors, electronic devices, and moving bodies. Background Technology

[0003] Previously, a physical quantity detection device was known that used vibrating elements such as piezoelectric oscillators or MEMS (Micro ElectroMechanical Systems) oscillators to detect physical quantities such as angular velocity and acceleration.

[0004] As an example of such a physical detection device, Patent Document 1 discloses an angular velocity sensor comprising: an angular velocity detection element made of silicon or crystal; a package made of ceramic; and a fixing frame that holds the angular velocity detection element relative to the package. Furthermore, the fixing frame has a torsion spring and a balancer. In the angular velocity sensor described in Patent Document 1, the torsion spring and balancer reduce the leakage of vibration of the angular velocity detection element to the outside. Furthermore, according to the angular velocity sensor described in Patent Document 1, by using a metal material such as a stainless steel alloy or an iron-nickel-cobalt alloy to construct the fixing frame, the movement of the angular velocity detection element in the thickness direction is suppressed.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2014-089049

[0008] However, according to the angular velocity sensor described in Patent Document 1, in the structure of the fixed frame supporting the angular velocity detection element, thermal stress generated by the encapsulation or stress generated by the encapsulation being impacted are transmitted to the angular velocity detection element. As a result, there is a problem: the vibration characteristics change, and the zero-point voltage of the output signal changes. Summary of the Invention

[0009] The object of the present invention is to provide a vibration device that reduces variations in vibration characteristics, an angular velocity sensor having said vibration device that reduces the reduction in detection accuracy, an electronic device having said vibration device, and a mobile body.

[0010] Methods for solving problems

[0011] The aforementioned objective is intended to solve at least a portion of the aforementioned problems, and can be achieved in the following manner.

[0012] The vibration device of this application example includes: a vibration element having a plurality of terminals; a base having a plurality of electrical connection terminals; and a relay substrate having a wiring portion for electrically connecting the plurality of electrical connection terminals to the plurality of terminals, supporting the vibration element on the base. The relay substrate has: a base fixing portion fixed to the base; a vibration element mounting portion on which the vibration element is mounted; and at least one beam portion connecting the base fixing portion and the vibration element mounting portion, the at least one beam portion having a first portion extending in a first direction and a second portion extending in a second direction intersecting the first direction.

[0013] According to this vibration device, since it has a relay substrate having intersecting first and second portions, the beam portion can absorb or suppress deformation of the substrate caused by external forces (such as thermal stress or impact). Therefore, in the event of deformation of the substrate, deformation of the vibration element mounting portion can be reduced, and thus the holding state of the vibration element mounted on the vibration element does not change significantly or can be reduced. Consequently, variations in the vibration characteristics of the vibration element mounted on the vibration element mounting portion can be reduced.

[0014] According to the vibration device of this application example, it is preferred that the relay substrate comprises an insulating material.

[0015] This reduces the generation of thermal stress between the wiring unit and the substrate, as well as between the wiring unit and the vibrating element. Furthermore, it facilitates easy insulation between the multiple wiring sections within the wiring section.

[0016] According to the vibration device of this application example, it is preferred that the substrate is an electronic component including a circuit for driving the vibration element.

[0017] Even with such a structure, the relay substrate can absorb or suppress the force on the electronic components caused by the deformation of the substrate due to external forces, thereby reducing the variation in the vibration characteristics of the vibrating element placed on the mounting portion.

[0018] According to the vibration device of this application example, preferably, the substrate includes: an electronic component including circuitry for driving the vibration element; and a stress-relieving portion disposed between the electronic component and the relay substrate, having a wiring layer for electrically connecting the electronic component and the wiring portion.

[0019] Therefore, the stress-relieving part can absorb the external force on the electronic components and further reduce the transmission of the external force to the vibrating element.

[0020] According to the vibration device of this application example, it is preferred that, when viewed from above, the relay substrate consists of the base fixing portion and the beam portion forming a first frame surrounding the vibration element mounting portion.

[0021] Therefore, the stress transmission path caused by the deformation of the encapsulation substrate due to external forces can be lengthened. Thus, even if the substrate deforms due to external forces, the first frame can more effectively absorb or suppress the deformation. Consequently, since the deformation of the vibration element can be reduced more effectively, the variation in the vibration characteristics of the vibration element mounted on the vibration element mounting section can be further reduced.

[0022] According to the vibration device of this application example, it is preferred that the relay substrate has a second frame, which, when viewed from above, is located between the first frame and the vibration element mounting portion.

[0023] This lengthens the stress transmission path caused by deformation of the encapsulation substrate due to external forces. Therefore, even if the substrate deforms due to external forces, the first and second frames can more effectively absorb or suppress the deformation. Consequently, variations in the vibration characteristics of the vibration element mounted on the vibration element mounting section can be reduced more effectively.

[0024] According to the vibration device of this application example, it is preferred that the relay substrate has a plurality of first portions and a plurality of second portions, the first portions and the second portions being interconnected.

[0025] This extends the stress transmission path caused by the deformation of the packaging substrate due to external forces, thus more effectively reducing the variation in the vibration characteristics of the vibration element placed on the vibration element mounting section.

[0026] According to the vibration device of this application example, it is preferable that the wiring section has shielded wiring that is electrically connected to a fixed potential.

[0027] This reduces the capacitance between the vibrating element and, for example, the wiring layer formed in the substrate and electronic components (IC chips). Therefore, it enables the development of vibrating devices with improved signal-to-noise ratios and higher accuracy in detecting angular velocities.

[0028] The angular velocity sensor in this application example has the vibration device of this application example.

[0029] Such angular velocity sensors, due to their vibration characteristics being reduced by the presence of vibration devices, exhibit excellent reliability.

[0030] The electronic device in this application example has the vibration device of this application example.

[0031] Such electronic devices, due to their vibration devices which reduce variations in vibration characteristics, can exhibit excellent reliability.

[0032] The moving body in this application example has the vibration device of this application example.

[0033] Based on such a moving body, since it has a vibration device that reduces the variation of vibration characteristics, it can achieve excellent reliability. Attached Figure Description

[0034] Figure 1 This is a perspective view showing the vibration device according to the first embodiment.

[0035] Figure 2 yes Figure 1 The cross-sectional view of the vibrating device shown.

[0036] Figure 3 It is shown Figure 1 A top view of the IC chip of the vibration device shown.

[0037] Figure 4 This is a top view showing the vibrating element.

[0038] Figure 5 This is a top view of the relay substrate.

[0039] Figure 6 yes Figure 5 The top view (perspective view) of the relay substrate shown.

[0040] Figure 7 yes Figure 5 A top view of the main body of the relay substrate shown.

[0041] Figure 8 It is a graph showing the stress of the mounting portion of each shape of the relay substrate.

[0042] Figure 9 This is a cross-sectional view showing the vibration device according to the second embodiment.

[0043] Figure 10 This is a cross-sectional view showing the vibration device according to the third embodiment.

[0044] Figure 11 This is a cross-sectional view showing the stress relief layer.

[0045] Figure 12 This is a top view of the relay substrate of the vibration device according to the fourth embodiment.

[0046] Figure 13 yes Figure 12 The top view (perspective view) of the relay substrate shown.

[0047] Figure 14 yes Figure 13 A top view of the main body of the relay substrate shown.

[0048] Figure 15 This is a top view of the relay substrate of the vibration device according to the fifth embodiment.

[0049] Figure 16 yes Figure 15 The top view (perspective view) of the relay substrate shown.

[0050] Figure 17 yes Figure 15 A top view of the main body of the relay substrate shown.

[0051] Figure 18 It is shown Figure 17 A top view of a modified example of the main body of the relay substrate shown.

[0052] Figure 19 It is shown Figure 17 A top view of a modified example of the main body of the relay substrate shown.

[0053] Figure 20 This is a perspective view of the main body of the relay substrate of the vibration device in the first reference example.

[0054] Figure 21 This is a top view of the main body of the relay substrate of the vibration device in the second reference example.

[0055] Figure 22 It is shown Figure 21 A top view of a modified example of the main body of the relay substrate shown.

[0056] Figure 23 This is a top view of the vibration element of the vibration device according to the sixth embodiment.

[0057] Figure 24 This is a cross-sectional view of the vibration device according to the seventh embodiment.

[0058] Figure 25 yes Figure 24 The top view of the vibrating element shown.

[0059] Figure 26 yes Figure 24 The top view (perspective view) of the vibrating element shown.

[0060] Figure 27 It is shown Figure 24 Figures showing other examples of vibrating elements.

[0061] Figure 28 This is a top view of the vibration element of the vibration device according to the eighth embodiment.

[0062] Figure 29 This is a top view of the vibration device according to the ninth embodiment.

[0063] Figure 30 yes Figure 29 Other examples of relay substrates shown.

[0064] Figure 31 This is a cross-sectional view showing the vibration device according to the tenth embodiment.

[0065] Figure 32 This is a cross-sectional view showing a module equipped with a vibrating device.

[0066] Figure 33 This is a perspective view showing the structure of a mobile (or laptop) personal computer using an electronic device that incorporates this application example.

[0067] Figure 34 This is a perspective view showing the structure of a mobile phone (including PHS) of an electronic device to which this application example is applied.

[0068] Figure 35 This is a perspective view showing the structure of a digital still camera in an electronic device to which this application example is applied.

[0069] Figure 36 This is a perspective view of a car, which is a moving body to which this application example is applied.

[0070] Label Explanation

[0071] 1: Vibration device; 1A: Vibration device; 1B: Vibration device; 1G: Vibration device; 1H: Vibration device; 1Ha: Vibration device; 1I: Vibration device; 2: Package; 3: Vibration element; 3a: Vibration element; 4: IC chip; 4G: IC chip; 5: Relay substrate; 5C: Relay substrate; 5D: Relay substrate; 5E: Relay substrate; 5F: Relay substrate; 5Fa: Relay substrate; 5H: Relay substrate; 5Ha: Relay substrate; 5Hb: Relay substrate; 5Hc: Relay substrate; 6: Vibration element; 6a: Vibration element; 6b: Vibration element; 7: Vibration element; 8: Stress relief layer; 10: Module; 11: Adhesive; 15: Mounting substrate; 17: Substrate; 21: Base component; 2 2: Cover; 23: Connecting component; 25: Terminal; 27: External connection terminal; 30: Vibrator; 37: Electrode part; 41: Terminal; 42: Terminal; 43: Passivation film; 50: Main body part; 50C: Main body part; 50D: Main body part; 50Da: Main body part; 50Db: Main body part; 50E: Main body part; 50F: Main body part; 50Fa: Main body part; 51: Mounting part; 52a: Fixing part; 52b: Fixing part; 53a: Beam part; 53b: Beam part; 54: Second frame; 55a: Beam part; 55b: Beam part; 55c: Beam part; 55d: Beam part; 56a: Beam part; 56b: Beam part; 57: Wiring part; 57C: Wiring part; 57D: Wiring part; 60: Vibrator; 61: Base ; 65: Support portion; 67: Electrode portion; 70: Vibration element; 81: First insulating layer; 82: First wiring layer; 83: Second insulating layer; 84: Second wiring layer; 151: Part; 152a: Part; 152b: Part; 153a: Part; 153b: Part; 157: Terminal; 170: Connecting component; 171: Part; 172a: Part; 172b: Part; 173a: Part; 173b: Part; 211: Recess; 241: Lower surface layer; 242: Middle surface layer; 243: Upper surface layer; 261: Terminal; 262: Terminal; 263: Terminal; 264: Terminal; 265: Terminal; 266: Terminal; 311: Base; 312: Detection vibrating arm; 313: Detection Vibration arm; 314: Connecting arm; 315: Connecting arm; 316: Driving vibration arm; 317: Driving vibration arm; 318: Driving vibration arm; 319: Driving vibration arm; 321: Support part; 322: Support part; 323: Beam part; 324: Beam part; 325: Beam part; 326: Beam part; 381: Terminal; 382: Terminal; 383: Terminal; 384: Terminal; 385: Terminal; 386: Terminal; 530: First frame; 531: First part; 532: Second part; 541: Frame part; 542: Part; 551: First part; 552: Second part; 561: Terminal; 562: Terminal; 563: Terminal; 564: Terminal; 565: Terminal; 566: Terminal;570a: Beam section; 570b: Beam section; 571: Wiring; 571C: Wiring; 571D: Wiring; 571a: Beam section; 571b: Beam section; 572: Wiring; 572C: Wiring; 572D: Wiring; 572a: Beam section; 572b: Beam section; 573: Wiring; 573C: Wiring; 573D: Wiring; 574: Wiring; 574C: Wiring; 574D: Wiring; 575: Wiring; 575C: Wiring; 575D: Wiring; 581: Terminal; 581a: Part; 582a: Part; 581b: Part; 582b: Part; 582: Terminal; 583: Terminal; 584: Terminal; 585: Terminal; 586: Terminal; 62 1: Drive vibrating arm; 622: Drive vibrating arm; 631: Detection vibrating arm; 632: Detection vibrating arm; 641: Adjustment vibrating arm; 642: Adjustment vibrating arm; 651: Part; 652: Part; 653: Part; 661: Connecting part; 662: Connecting part; 663: Connecting part; 664: Connecting part; 681: Terminal; 682: Terminal; 683: Terminal; 684: Terminal; 685: Terminal; 686: Terminal; 700: Vibration element; 710: Vibrating body; 720: Electrode part; 721: Electrode pattern part; 722: Electrode pattern part; 730: Vibrating body; 740: Electrode part; 741: Electrode pattern part; 742: Electrode pattern part; 750: Vibration Body; 751: Base; 752: Vibrating arm; 753: Vibrating arm; 760: Electrode part; 761: Terminal; 762: Terminal; 841: Terminal; 842: Shielded wiring; 1008: Display unit; 1100: Personal computer; 1102: Keyboard; 1104: Main body; 1106: Display unit; 1200: Mobile phone; 1202: Operation button; 1204: Earpiece; 1206: Microphone; 1208: Display unit; 1300: Digital still camera; 1302: Housing; 1304: Light receiving unit; 1306: Shutter button; 1308: Memory; 1310: Display unit; 1500: Automobile; 1501: Vehicle body; 1502: Vehicle body attitude control Device; 1503: Wheel; 2000: Display unit; 5411: Part; 5412: Part; 5610: First part; 5620: Second part; 7211: Electrode; 7212: Terminal; 7213: Wiring; 7221: Electrode; 7222: Terminal; 7223: Wiring; 7411: Electrode; 7412: Terminal; 7413: Wiring; 7421: Electrode; 7422: Terminal; 7423: Wiring; 7511: First base; 7512: Connecting part; 7513: Second base; B1: Conductive wire; C: Arrow; D: Arrow; E: Arrow; F: Arrow; a: Central axis; a1: Line segment; a2: Line segment; a3: Central axis; ω: Angular velocity. Detailed Implementation

[0072] The vibration device, angular velocity sensor, electronic device, and moving body of the present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. Furthermore, some parts are appropriately enlarged or reduced in the figures to make the described parts identifiable.

[0073] 1. Vibrating devices

[0074] First, the vibration device in this application example will be described.

[0075] <First Implementation Method>

[0076] Figure 1 This is a perspective view showing the vibration device according to the first embodiment. Figure 2 yes Figure 1 The cross-sectional view of the vibrating device shown. Figure 3 It is shown Figure 1 A top view of the IC chip of the vibration device shown. Additionally, Figure 2 The upper side of the middle is called "upper". Figure 2 The lower side of the middle is called "lower". Furthermore, in Figures 1 to 3 For ease of explanation, the X-axis, Y-axis, and Z-axis are illustrated as three mutually orthogonal axes, with the end of the arrow representing each axis designated as "+" and the base as "-". Furthermore, the direction parallel to the X-axis is called the "X-axis direction", the direction parallel to the Y-axis is called the "Y-axis direction", and the direction parallel to the Z-axis is called the "Z-axis direction". The +Z-axis direction side is also called "up", and the -Z-axis direction side is also called "down". In this embodiment, the X-axis, Y-axis, and Z-axis correspond to the electrical axis, mechanical axis, and optical axis, which are the crystallization axes of the crystal, respectively. Additionally, in... Figure 1 The illustration of cover 22 is omitted in the text.

[0077] Figure 1 and Figure 2 The vibration device 1 shown is an angular velocity sensor for detecting angular velocity about the Z-axis. The vibration device 1 has: a package 2; a vibration element 3, which is housed within the package 2; an IC chip 4 (electronic component), which is disposed within the package 2; and a relay substrate 5, which supports the vibration element 3 on the package 2.

[0078] <Packaging>

[0079] The package 2 has: a box-shaped base component 21 having a recess for receiving the vibrating element 3; and a plate-shaped cover 22, which is engaged with the base component 21 by means of a connecting component 23 in such a way as to block the opening of the recess 211 of the base component 21. The space inside the package 2 can be in a depressurized (vacuum) state or can be sealed with inert gases such as nitrogen, helium, and argon.

[0080] The recess 211 of the base member 21 has: a lower layer surface 241 located on the bottom side; an upper layer surface 243 located on the opening side; and a middle layer surface 242 located between the lower layer surface 241 and the upper layer surface 243. There is no particular limitation on the constituent material of the base member 21, and various ceramics such as alumina or various glass materials can be used, for example. In addition, there is no particular limitation on the constituent material of the cover 22, but preferably, it is a member having a linear expansion coefficient approximate to that of the constituent material of the base member 21, for example. For example, when the constituent material of the base member 21 is ceramic, as the constituent material of the cover 22, an alloy such as Kovar is preferred. In addition, the bonding member 23 is formed by a seam ring, low-melting glass, an adhesive, or the like.

[0081] As Figure 3 shows, a plurality of terminals 261, 262, 263, 264, 265, 266 (electric connection terminals) electrically connected to the relay substrate 5 are provided on the upper layer surface 243. In addition, a plurality of terminals 25 electrically connected to the IC chip 4 are provided on the middle layer surface 242. Further, as Figure 2 shows, a plurality of external connection terminals 27 are formed on the back surface of the base member 21. The plurality of terminals 261, 262, 263, 264, 265, 266, the plurality of terminals 25, and the plurality of external connection terminals 27 are connected by means of unillustrated internal wiring or through holes formed in the base member 21 to form circuit wiring. These connection terminals are not particularly limited as long as they have conductivity, but are formed of, for example, a metal coating formed by laminating each coating of Ni (nickel), Au (gold), Ag (silver), Cu (copper) or the like on a metallized layer (base layer) of Cr (chromium), W (tungsten) or the like.

[0082] In addition, in the present embodiment, the outer shape of the base member 21 in a top view and the outer shape of the recess 211 in a top view are respectively rectangular, but they are not limited to the shapes shown in the drawings, and may be any shapes. In addition, the cover 22 is a quadrilateral flat plate shape in a top view, and the shape of the cover 22 is not limited to the shape shown in the drawing, and may be any shape.

[0083] <IC chip (electronic component)>

[0084] As Figure 2 shows, the IC chip 4 is fixed to the lower layer surface 241 of the base member 21 by means of the adhesive 11. As Figure 3 shows, the IC chip 4 has a plurality of terminals 41, and each of the terminals 41 is electrically connected to each of the aforementioned terminals 25 by means of a conductive wire B1. The IC chip 4 includes: a drive circuit for driving the vibration element 3 to vibrate; and a detection circuit for detecting the detection vibration generated by the vibration element 3 when the angular velocity ω is applied.

[0085] <Vibration element>

[0086] Figure 4 This is a top view showing the vibrating element.

[0087] Figure 4 The vibration element 3 (vibrating plate) shown is a sensor element for detecting the angular velocity ω about the Z-axis. The vibration element 3 has: a vibrating body 30; and an electrode portion 37 formed on the surface of the vibrating body 30.

[0088] (Vibrating body)

[0089] The vibrator 30 is formed into a plate shape having a width in the XY plane defined by the Y-axis (mechanical axis) and X-axis (electric axis), which serve as the crystallization axes of the crystal substrate, and a thickness in the Z-axis (optical axis) direction. That is, the vibrator 30 is constructed from a Z-cut crystal plate. Furthermore, the Z-axis does not necessarily need to be aligned with the thickness direction of the vibrator 30; from the perspective of reducing temperature-induced frequency variations near room temperature, it can be slightly tilted relative to the thickness direction. Specifically, the Z-cut crystal plate includes a crystal plate with a cut angle such that the surface orthogonal to the Z-axis is rotated within a range of 0 to 10 degrees about at least one of the X-axis and Y-axis as the main surface. Furthermore, the material of the vibrator 30 is not limited to crystal; piezoelectric materials other than crystal, such as lithium tantalate or lithium niobate, can also be used. Additionally, the vibrator 30 can also be a non-piezoelectric material such as silicon; in this case, piezoelectric elements can be appropriately provided on the vibrator 30.

[0090] The vibrating body 30 includes: a base 311; a pair of detection vibrating arms 312 and 313 extending from the base 311 to both sides in the Y-axis direction; a pair of connecting arms 314 and 315 extending from the base 311 to both sides in the X-axis direction; a pair of driving vibrating arms 316 and 317 extending from the ends of the connecting arms 314 to both sides in the Y-axis direction; and a pair of driving vibrating arms 318 and 319 extending from the ends of the connecting arms 315 to both sides in the Y-axis direction. Furthermore, the vibrating body 30 includes: a pair of support portions 321 and 322 supporting the base 31; a pair of beam portions 323 and 324 connecting the support portions 321 to the base 311; and a pair of beam portions 325 and 326 connecting the support portion 322 to the base 311.

[0091] Furthermore, in the illustration, the width (length in the X-axis direction) of the end portions of the detection vibration arms 312, 313, and drive vibration arms 316, 317, 318, and 319 is wider than that of the base 311, but this is not a limitation. For example, the width of the end portions of the detection vibration arms 312, 313, and drive vibration arms 316, 317, 318, and 319 can also be fixed. Alternatively, a pair of bottomed grooves extending in the Y-axis direction and open on the upper and lower surfaces of the detection vibration arms 312, 313, and drive vibration arms 316, 317, 318, and 319 can be formed respectively.

[0092] (Electrode section)

[0093] The electrode section 37 has an electrode pattern (not shown) disposed on the surface of the vibrator 30 and a plurality of terminals 381, 382, ​​383, 384, 385, and 386.

[0094] Although not illustrated, the electrode pattern includes: drive signal electrodes and drive ground electrodes disposed on drive vibration arms 316, 317, 318, and 319; and detection signal electrodes and detection ground electrodes disposed on detection vibration arms 312 and 313.

[0095] The lower surface of the support portion 321 is provided with: a terminal 381 (drive signal terminal) electrically connected to a drive signal electrode (not shown); a terminal 383 (detection signal terminal) electrically connected to a detection signal electrode (not shown); and a terminal 385 (detection ground terminal) having a reference potential relative to the detection signal electrode (not shown). Furthermore, the lower surface of the support portion 322 is provided with: a terminal 382 (drive ground terminal) electrically connected to a drive ground electrode (not shown); a terminal 384 (detection signal terminal) electrically connected to a detection signal electrode (not shown); and a terminal 386 (detection ground terminal) having a reference potential relative to the detection signal electrode (not shown).

[0096] The constituent material of such electrode part 37 is not particularly limited as long as it is conductive, but it can be composed of a metal coating formed by stacking various coatings such as Ni (nickel), Au (gold), Ag (silver), Cu (copper) on a metallization layer (base layer) such as Cr (chromium) or W (tungsten).

[0097] In such a vibrating element 3, if a drive signal is input to terminal 381 (drive signal terminal) without applying an angular velocity ω to the vibrating element 3, thereby generating an electric field between the drive signal electrode and the drive ground electrode, then each drive vibrating arm 316, 317, 318, and 319 will move towards... Figure 4 The buckling vibration (driven vibration) occurs in the direction indicated by arrow C. At this time, due to the driving vibration arms 316, 317 and 318, 319... Figure 4 The vibration is symmetrical from top to bottom, therefore, the base 311 and the detection vibration arms 312 and 313 hardly vibrate.

[0098] Under this driven vibration state, if an angular velocity ω about the central axis a (center of gravity) along the Z-axis is applied to the vibrating element 3, then the detected vibration (vibration in the detection mode) is excited. Specifically, Figure 4The Coriolis force, in the direction indicated by the middle arrow D, acts on the driving vibrating arms 316, 317, 318, and 319 and the connecting arms 314 and 315, exciting new vibrations. Subsequently, the vibrations excited by the detection vibrating arms 312 and 313 are also excited. Figure 4 The vibration is detected in the direction indicated by the middle arrow E to eliminate the vibration of the connecting arms 314 and 315. Then, the charge generated in the vibrating arms 312 and 313 due to the vibration is taken from the detection signal electrode as a detection signal, and the angular velocity ω is calculated based on the detection signal.

[0099] <Relay substrate>

[0100] Figure 5 This is a top view of the relay substrate. Figure 6 yes Figure 5 The top view (perspective view) of the relay substrate shown. Figure 7 yes Figure 5 A top view of the main body of the relay substrate shown.

[0101] like Figure 5 and Figure 6 As shown, the relay substrate 5 has: a flat body portion 50; and a wiring portion 57 formed on the surface of the body portion 50.

[0102] (Main Body)

[0103] like Figure 7 As shown, the main body 50 includes: a mounting portion 51 (vibration element mounting portion) located in the center of the relay substrate 5, which has a rectangular shape when viewed from above; fixing portions 52a and 52b (base fixing portions) which have a generally rectangular shape when viewed from above and are located on opposite sides of the mounting portion 51 when viewed from above; and two elongated beam portions 53a and 53b that connect the fixing portions 52a and 52b to each other and connect the fixing portions 52a and 52b to the mounting portion 51.

[0104] The fixing part 52a is separated from the mounting part 51 and is located relative to the mounting part 51. Figure 7 On the left side, the fixing part 52b is separated from the mounting part 51 and is located relative to the mounting part 51. Figure 7 Right side of the middle.

[0105] Beam portions 53a and 53b are located on opposite sides of the mounting portion 51. Beam portion 53a is located on the side opposite to the mounting portion 51. Figure 7 On the upper middle side, beam 53b is located in the mounting section 51. Figure 7 Lower middle side.

[0106] The beam portions 53a and 53b each have: a first portion 531 extending along the Y-axis direction (first direction); and a second portion 532 extending from the middle of the first portion 531 toward the X-axis direction (second direction) orthogonal to the first portion 531. One end of the first portion 531 is connected to the fixing portion 52a, and the other end of the first portion 531 is connected to the fixing portion 52b. One end of the second portion 532 is connected to the central portion of the first portion 531, and the other end of the second portion 532 is connected to the mounting portion 51. Furthermore, the relationship between the width (length along the Y-axis direction) and the length (length along the Z-axis direction) of the second portion 532 is not limited to that shown in the figure.

[0107] Furthermore, in this embodiment, the line segment a1 connecting the center line of the second part 532 of beam 53a and the center line of the second part 532 of beam 53b is aligned with the center line along the short side direction of the mounting part 51.

[0108] When viewed from above, the main body 50 is composed of fixing parts 52a and 52b, the first part 531 of beam part 53a, and the first part 531 of beam part 53b, forming a first frame 530 in an annular shape surrounding the mounting part 51.

[0109] Furthermore, it is preferable that the main body 50 of the relay substrate 5 is made of an insulating material. That is, the relay substrate 5 includes an insulating material. This reduces the generation of thermal stress between the relay substrate 50 and the base member 21 and between the relay substrate 50 and the vibrating element 3. Specifically, the material used to construct the main body 50 is not particularly limited, but it is preferable to use insulating materials such as crystal, silicon, or ceramic. In particular, it is preferable to use the same material as the vibrating body 30 as the material used to construct the main body 50. This reduces the difference in thermal expansion between the vibrating element 3 and the relay substrate 5, and also reduces the thermal stress associated with this difference in thermal expansion. In this embodiment, as described above, the vibrating body 30 is made of crystal. Therefore, it is preferable to use crystal as the material used to construct the main body 50.

[0110] (Wiring section)

[0111] like Figure 5 or Figure 6 As shown, the wiring section 57 includes: a plurality of terminals 581, 582, 583, 584, 585, and 586, which are disposed on the upper surface of the mounting section 51; terminals 561, 562, 563, 564, 565, and 566, which are disposed on the lower surface of the fixing section 52a or the fixing section 52b; and a plurality of wirings 571, 572, 573, 574, and 575.

[0112] Figure 5Terminals 581, 582, 583, 584, 585, and 586 shown are used for electrical connection with the aforementioned vibration element 3, and are positioned at positions corresponding to terminals 381, 382, ​​383, 384, 385, and 386 of the vibration element 3 (see reference). Figure 4 and Figure 5 Terminals 581, 583, and 585 are located on the -Y axis side of the mounting section 51, and terminals 582, 584, and 586 are located on the +Y axis side of the mounting section 51.

[0113] Figure 6 The terminals 561, 562, 563, 564, 565, and 566 shown are respectively used for electrical connection with the plurality of terminals 261, 262, 263, 264, 265, and 266 of the aforementioned base component 21, and are disposed at positions corresponding to the plurality of terminals 261, 262, 263, 264, 265, and 266 of the base component 21 (see reference). Figure 3 and Figure 5 Terminals 561, 562, and 564 are disposed on the lower surface of the fixing part 52b, and terminals 563, 565, and 566 are disposed on the lower surface of the fixing part 52a.

[0114] Wiring 571 is provided on the upper surface of the mounting portion 51 and the upper surface of the beam portion 53a, electrically connecting terminal 581 and terminal 561. Wiring 572 is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53a, and the upper surface of the fixing portion 52b, electrically connecting terminal 582 and terminal 562. Wiring 573 is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53b, and the upper surface of the fixing portion 52a, electrically connecting terminal 583 and terminal 563. Wiring 574 is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53b, and the upper surface of the fixing portion 52b, electrically connecting terminal 585 and terminal 565. In addition, wiring 575 is provided on the upper and lower surfaces of the mounting portion 51, the upper and lower surfaces of the beam portions 53a and 53b, and the upper surface of the fixing portion 52a, to electrically connect terminals 585 and 586 to terminals 565 and 566.

[0115] Furthermore, wiring 575 is provided over the entire area of ​​the lower surface of the mounting portion 51. The portion of wiring 575 located on the lower surface of the mounting portion 51 functions as a shielding wiring, which electrically shields against signal interference caused by parasitic capacitance. This shielding wiring is at a fixed potential and is grounded in this embodiment. Here, fixed potential refers to grounding potential or a potential fixed to a fixed potential.

[0116] The material used to construct such wiring section 57 is not particularly limited as long as it is conductive, but it can be composed of a metal coating formed by stacking various coatings such as Ni (nickel), Au (gold), Ag (silver), Cu (copper) on a metallization layer (base layer) such as Cr (chromium) or W (tungsten).

[0117] In the relay substrate 5 described above, the aforementioned terminals 561, 562, 563, 564, 565, and 566 are bonded and fixed to the terminals 261, 262, 263, 264, 265, and 266 of the corresponding base component 21 by means of, for example, a conductive adhesive (see reference). Figure 2 , Figure 3 and Figure 6 Thus, the relay board 5 is fixed to the base component 21 (see reference). Figure 2 In addition, such as Figure 2 As shown, the mounting portion 51 is located above the recess 211 and does not contact the base component 21. Furthermore, in the relay substrate 5, the aforementioned terminals 581, 582, 583, 584, 585, and 586 are bonded and fixed to the corresponding terminals 381, 382, ​​383, 384, 385, and 386 of the corresponding vibration element 3 (see reference 5). Figure 2 , Figure 4 and Figure 5 Therefore, as Figure 2 As shown, the vibrating element 3 is placed on the mounting portion 51. In this way, the relay board 5 connects the base component 21 and the vibrating element 3, and electrically connects the terminals 261, 262, 263, 264, 265, 266 provided on the base component 21 with the terminals 381, 382, ​​383, 384, 385, 386 of the vibrating element 3.

[0118] Furthermore, as described above, the beam portions 53a and 53b of the relay substrate 5 support the mounting portion 51 on the fixing portions 52a and 52b. These beam portions 53a and 53b support the mounting portion 51 on the fixing portions 52a and 52b, preventing the mounting portion 51 from swaying when an angular velocity ω is applied to the vibrating element 3 on the mounting portion 51. Therefore, it is preferable, for example, that the resonant frequencies of the second portion 532 of the beam portion 53a and the second portion 532 of the beam portion 53b are respectively 10 kHz relative to the resonant frequency of the vibrating body 30. Z The above-mentioned high frequencies. Therefore, it is possible to prevent or reduce the oscillation of the mounting part 51 when an angular velocity ω is applied to the vibrating element 3.

[0119] Furthermore, as described above, the wiring section 57 has shielded wiring that is electrically connected to a fixed potential. Specifically, as described above, the wiring section 57 has wiring 575 that is grounded and covers the entire area of ​​the lower surface of the mounting section 51. This reduces the capacitance between the electrode section 37 of the vibration element 3 and the wiring layer (not shown) or IC chip 4 having terminals 261, 262, 263, 264, 265, 266 formed on the base member 21. Therefore, the S / N ratio of the vibration device 1 is improved, enabling higher precision detection of angular velocity ω. Furthermore, when the IC chip 4 is a digital output, since the frequency band is MHz... Z The magnitude is so large that shielded wiring is particularly effective in wiring section 57.

[0120] Furthermore, as described above, terminals 581, 582, 583, 584, 585, and 586 provided on the mounting portion 51 are positioned corresponding to terminals 381, 382, ​​383, 384, 385, and 386 of the vibrating element 3. In this way, by matching the vibrating element 3 to set and change the pattern of the wiring portion 57 of the relay board 5, various types of vibrating elements 3 can be connected (mounted) on the same package 2. Therefore, if the holding position or pattern of the vibrating element 3 changes due to design changes in the mounting portion 51, etc., it is not necessary to change the package 2 according to the change, thus preventing a decrease in productivity associated with the change.

[0121] Furthermore, the paths of wiring 571, 572, 573, 574, and 575, the configuration of terminals 581, 582, 583, 584, 585, and 586, and the configuration of terminals 561, 562, 563, 564, 565, and 566 are not limited to the forms shown in the diagram.

[0122] The structure of the vibrating device 1 has been described above.

[0123] As described above, the vibration device 1 includes: a vibration element 3 having multiple terminals 381, 382, ​​383, 384, 385, and 386; a base member 21 (base) having multiple terminals 261, 262, 263, 264, 265, and 266 (electrical connection terminals); and a relay board 5 having a wiring section 57 that electrically connects the multiple terminals 261, 262, 263, 264, 265, and 266 to the multiple (corresponding) terminals 381, 382, ​​383, 384, 385, and 386, and supports the vibration element 3 on the base member 21. Furthermore, the relay substrate 5 includes: fixing portions 52a and 52b (base fixing portions) which are fixed to the base member 21; a mounting portion 51 (vibration element mounting portion) on which the vibrator 30 is mounted; and at least one, in this embodiment, two beam portions 53a and 53b, which connect the fixing portions 52a and 52b to the mounting portion 51. The two beam portions 53a and 53b each have: a first portion 531 extending in the Y-axis direction (first direction); and a second portion 532 extending in the X-axis direction (second direction) which intersects (in this embodiment, is orthogonal) the Y-axis direction.

[0124] According to such a vibration device 1, since it includes a relay substrate 5, which comprises beams 53a and 53b having intersecting first portions 531 and second portions 532, the transmission path of stress generated by deformation of the base member 21 due to external forces (e.g., collisions) to the mounting portion 51 can be lengthened. Therefore, the beams 53a and 53b can absorb or suppress this stress. Consequently, since the deformation of the mounting portion 51 accompanying the stress can be reduced, the holding state of the vibration element 3 does not change significantly. Therefore, a vibration device 1 that reduces the variation in the vibration characteristics of the vibration element 3 caused by external forces, and is highly stable and robust to the external environment can be provided. Therefore, in the vibration device 1 as an angular velocity sensor, since the difference between the driving frequency (the resonant frequency of the driving vibration arms 316, 317, 318, 319) and the detection frequency (the resonant frequency of the detection vibration arms 312, 313) does not change, the difference between the driving frequency and the detection frequency, i.e., the detuning frequency, is not easily changed. Therefore, based on the vibration device 1, the variation of the zero-point voltage can be reduced, and a low-noise angular velocity sensor can be realized.

[0125] Furthermore, as described above, the relay substrate 5 is connected to the base member 21 using a conductive adhesive (or bumps). For example, when temperature is applied during this connection, thermal stress is generated due to the difference in the coefficients of linear expansion between the relay substrate 5 and the base member 21. However, according to the beam portions 53a and 53b of the relay substrate 5, deformation of the mounting portion 51 caused by this thermal stress can be absorbed or suppressed. For example, according to the relay substrate 5, even deformation on the order of a few nanometers does not occur in the mounting portion 51. Therefore, even when external forces such as impacts are applied, as well as temperature, deformation of the mounting portion 51 can be reduced, and thus, the holding state of the vibration element 3 does not change significantly. Therefore, according to the vibration device 1, an angular velocity sensor with excellent temperature characteristics can be realized.

[0126] Furthermore, as described above, the relay substrate 5 has two beam portions 53a and 53b. When viewed from above, the relay substrate 5 comprises fixing portions 52a and 52b, the first portion 531 of beam portion 53a, and the first portion 531 of beam portion 53b, forming a first frame 530 surrounding the mounting portion 51 (vibration element mounting portion). Therefore, since the stress transmission path caused by deformation of the base member 21 due to external forces can be lengthened, even if the base member 21 deforms due to external forces, the first frame 530 can more effectively absorb or suppress its deformation. Thus, since deformation of the mounting portion 51 can be reduced more effectively, variations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51 can be further reduced.

[0127] Furthermore, as described above, the relay substrate 5 has an opening between the first frame 530 and the mounting portion 51, and the first frame 530 and the mounting portion 51 are connected by the second portion 532 of the beam portion 53a and the second portion 532 of the beam portion 53b. Also, as described above, in this embodiment, the line segment a1 of the centerline connecting the second portion 532 of the beam portion 53b coincides with the centerline along the short side direction of the mounting portion 51. This particularly helps to suppress deformation in the long side direction of the mounting portion 51. Furthermore, it allows for an increase in the area of ​​the mounting portion 51 on which the vibration element 3 is mounted.

[0128] In this embodiment, line segment a1 coincides with the center line along the short side direction of the mounting portion 51, but it may also coincide with, for example, the center line along the long side direction of the mounting portion 51. In this case, deformation in the short side direction of the mounting portion 51 can be particularly suppressed.

[0129] (Stress relief effect of relay substrate)

[0130] Figure 8 It is a graph showing the stress of the mounting portion of each shape of the relay substrate.

[0131] Figure 8The "rectangle" shown on the horizontal axis refers to a flat relay substrate (hereinafter referred to as "relay substrate X") that is rectangular in shape when viewed from above and has a uniform thickness without holes or slots, etc., and "5" refers to relay substrate 5 in this embodiment. In addition, "5C" refers to relay substrate 5C in the fourth embodiment described later, "5D" refers to relay substrate 5D in the fifth embodiment described later, "5E" refers to relay substrate 5E in the first reference example described later, and "5F" refers to relay substrate 5F in the second reference example described later.

[0132] also, Figure 8 This represents the stress generated in the mounting area of ​​the vibrating element 3 when an angular velocity ω about the central axis a (detection axis) is applied. Furthermore, Figure 8 The stress shown is a value normalized with the relay substrate X (rectangular) as 1.

[0133] like Figure 8 As shown, compared with the relay substrate X, the relay substrate 5 generates less stress in the mounting area (mounting part 51) of the vibration element 3, specifically, the stress is more than 90% smaller.

[0134] Thus, according to the vibration device 1 equipped with the relay substrate 5, even if the base component 21 deforms due to external forces, the beams 53a and 53b can absorb or suppress the deformation. Therefore, the mounting portion 51 does not deform or can reduce deformation. Therefore, it is possible to prevent changes in the characteristics of the vibration element 3 mounted on the mounting portion 51.

[0135] The above description uses the example of using the vibration device 1 of the present invention as an angular velocity sensor. That is, the angular velocity sensor includes the vibration device 1. With such an angular velocity sensor, since the vibration device 1 is provided, the variation of vibration characteristics is reduced, thus excellent reliability can be achieved.

[0136] <Second Implementation Method>

[0137] The second embodiment will now be described.

[0138] Figure 9 This is a cross-sectional view showing the vibration device according to the second embodiment.

[0139] This embodiment mainly involves providing a relay substrate on the IC chip; otherwise, it is the same as the embodiment described above. Furthermore, in the following description, the second embodiment will be explained primarily focusing on its differences from the embodiment described above; similar matters will be omitted from the description.

[0140] exist Figure 9 In the vibration device 1A shown, a relay substrate 5 is mounted on the IC chip 4 (electronic component) by means of, for example, a conductive adhesive.

[0141] IC chip 4 is provided with multiple terminals 42 that are electrically connected to multiple terminals 561, 562, 563, 564, 565, and 566 of relay substrate 5. The multiple terminals 42 are arranged at positions corresponding to the multiple terminals 561, 562, 563, 564, 565, and 566 of relay substrate 5.

[0142] Thus, in the vibration device 1A, the "substrate" connected to the relay substrate 5 is an IC chip 4 (electronic component) that includes the circuitry for driving the vibration element 3. Even with this structure, if the base component 21 or the IC chip 4 deforms due to external forces, the beams 53a and 53b can absorb or suppress the deformation, thus preventing or reducing deformation of the mounting portion 51. Therefore, variations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51 can be reduced. Furthermore, the IC chip 4 can be electrically connected to the relay substrate 5 without the use of wire bonding, for example. Moreover, the relay substrate 5 and the vibration element 3 are positioned directly above the IC chip 4. Therefore, the height of the vibration device 1A can be reduced.

[0143] Furthermore, as described in the first embodiment, the wiring 575 provided on the back side of the main body 50 in the wiring portion 57 of the relay substrate 5 functions as a shielding wiring (see reference). Figure 6 Therefore, as in this embodiment, when the vibration element 3 is disposed on the IC chip 4 via the relay substrate 5, the capacitance between the vibration element 3 and the IC chip 4 can be reduced using the shielded wiring (wiring 575). Thus, it is particularly effective to prevent signal interference of the vibration element 3 via parasitic capacitance from the IC chip 4.

[0144] According to the second embodiment described above, the variation in vibration characteristics can also be reduced.

[0145] <Third Implementation Method>

[0146] The third embodiment will now be described.

[0147] Figure 10 This is a cross-sectional view showing the vibration device according to the third embodiment. Figure 11 This is a cross-sectional view showing the stress relief layer.

[0148] This embodiment mainly involves providing a relay substrate on the stress relief layer; otherwise, it is the same as the embodiment described above. Furthermore, in the following description, the third embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0149] exist Figure 10The vibration device 1B shown includes a stress-relieving layer 8, which is disposed on the IC chip 4 (electronic component). Furthermore, the relay substrate 5 is mounted on the stress-relieving layer 8 using, for example, a conductive adhesive.

[0150] like Figure 11 As shown, the stress-relief layer 8 is located between the IC chip 4 and the relay substrate 5, and is disposed on the upper surface of the IC chip 4. By providing this stress-relief layer 8, the impact received by the package 2 is mitigated, and the impact is less likely to be transmitted to the relay substrate 5. In addition, the stress caused by the difference in thermal expansion between the IC chip 4 and the relay substrate 5 is mitigated, the relay substrate 5 is less likely to bend, and the variation of the vibration characteristics of the vibration element 3 can be further reduced. As a result, the angular velocity ω can be detected with high precision.

[0151] Here, as Figure 11 As shown, a passivation film 43 is provided on the bottom layer of the IC chip 4. Although not shown, this passivation film 43 is disposed on the wiring layer, which is formed on the active surface of the IC chip 4, and protects the wiring layer. A stress-relieving layer 8 is disposed on the upper surface of such an IC chip 4 (specifically on the passivation film 43).

[0152] The stress-mitigation layer 8 comprises: a first insulating layer 81 stacked together; a first wiring layer 82 disposed on the first insulating layer 81; a second insulating layer 83 disposed on the first insulating layer 81 and the first wiring layer 82; and a second wiring layer 84 disposed on the second insulating layer 83. The first insulating layer 81 and the second insulating layer 83 are each elastic. Therefore, the aforementioned impact mitigation can be achieved. The materials constituting the first insulating layer 81 and the second insulating layer 83 are not particularly limited, but can include, for example, polyimide, silicone-modified polyimide resin, epoxy resin, silicone-modified epoxy resin, acrylic resin, phenolic resin, silicone resin, modified polyimide resin, benzocyclobutene, polybenzoxazole, and other resin materials. Thus, a first insulating layer 81 and a second insulating layer 83 with sufficient elasticity can be formed, enabling the aforementioned effects to be performed more reliably.

[0153] Furthermore, the second wiring layer 84 has a plurality of terminals 841 arranged corresponding to the terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5. The terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5 are bonded and fixed to each terminal 841 using, for example, a conductive adhesive. Furthermore, the first wiring layer 82 electrically connects the plurality of terminals 841 of the second wiring layer 84 to the plurality of terminals 42 of the IC chip 4. Thus, the relay substrate 5 and the IC chip 4 are electrically connected via the stress-relieving layer 8. In this way, the first and second wiring layers 82 and 84 of the stress-relieving layer 8 function as wiring (reconfiguration wiring) for electrically connecting the relay substrate 5 and the IC chip 4. Therefore, for example, the terminals 42 of the IC chip 4 can be freely configured without considering the positions of the terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5. Therefore, the design freedom of the vibration device 1B is increased.

[0154] Furthermore, the second wiring layer 84, in addition to having terminals 841, also has shielded wiring 842. The shielded wiring 842 is extended onto the second insulating layer 83 without obstructing the configuration of the terminals 841. Furthermore, the shielded wiring 842 is grounded, for example. This shielded wiring 842 functions as a shielding layer to reduce the capacitance between the electrode portion 37 of the vibrating element 3 and the IC chip 4. Therefore, by configuring the shielded wiring 842, a vibrating device 1B with an improved S / N ratio and the ability to detect angular velocity ω with higher accuracy is achieved. Furthermore, even when temperature characteristics exist in the noise, this noise condition can be reduced; therefore, a vibrating device 1B with excellent temperature characteristics can be achieved.

[0155] As explained above, in this embodiment, the "substrate" connected to the relay substrate 5 is the IC chip 4 and the stress-relief layer 8. That is, the "substrate" comprises: the IC chip 4 (electronic component) including circuitry for driving the vibration element 3; and the stress-relief layer 8 (stress-relief portion) disposed between the IC chip 4 and the relay substrate 5, having wiring layers (in this embodiment, a first wiring layer 82 and a second wiring layer 84) electrically connecting the IC chip 4 and the wiring portion 57 of the relay substrate 5. Thus, the stress-relief layer 8 can absorb external forces acting on the IC chip 4, and further reduce the transmission of these external forces to the vibration element 3.

[0156] Even according to the third embodiment described above, variations in vibration characteristics can be reduced.

[0157] <Fourth Implementation Method>

[0158] The fourth embodiment will now be described.

[0159] Figure 12This is a top view showing the relay substrate of the vibration device according to the fourth embodiment. Figure 13 yes Figure 12 The top view (perspective view) of the relay substrate shown. Figure 14 yes Figure 13 A top view of the main body of the relay substrate shown.

[0160] This embodiment is the same as the embodiment described above, except for the structure of the relay substrate. Furthermore, in the following description, the fourth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0161] <Relay substrate>

[0162] like Figure 12 and Figure 13 As shown, the relay substrate 5C has a main body 50C and a wiring part 57C.

[0163] (Main Body)

[0164] like Figure 14 As shown, the main body 50C has a first frame 530 in a ring shape when viewed from above, and a second frame 54 in a ring shape located inside the first frame 530 and surrounding the mounting portion 51.

[0165] When viewed from above, the second frame 54 (beam portion) is located between the first frame 530 and the mounting portion 51, and is separate from the first frame 530 and the mounting portion 51.

[0166] The second frame 54 has: a frame portion 541, which forms a rectangular frame shape; and a portion 542 (fifth portion) connecting the frame portion 541 to the mounting portion 51. The frame portion 541 has: two portions 5411 (third portion) extending along the Y-axis direction; and two portions 5412 (fourth portion) connected to both ends of the portions 5411 and extending along the X-axis direction. The portions 5411 are connected to the second portion 532 of the beam portions 53a, 53b, and the portions 5412 are connected to the portions 542 (fifth portion).

[0167] Furthermore, the two portions 542 (the fifth portion) are located on opposite sides of the mounting portion 51, and the line segment a2 connecting the center lines of the two portions 542 is aligned with the center line along the long side of the mounting portion 51. Additionally, line segments a1 and a2 intersect, and in this embodiment, they are orthogonal.

[0168] (Wiring section)

[0169] like Figure 12 or Figure 13As shown, wiring 571C is provided on the upper surface of the mounting portion 51 and the upper surface of the beam portion 53a. Wiring 572C is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53a, and the upper surface of the fixing portion 52b. Wiring 573C is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53b, and the upper surface of the fixing portion 52a. Wiring 574C is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 53b, and the upper surface of the fixing portion 52b. Furthermore, wiring 575C is provided on the upper surface of the mounting portion 51, the upper and lower surfaces of the beam portions 53a and 53b, and the upper surface of the fixing portion 52a. Furthermore, wiring 575C is provided in the entire area of ​​the lower surface of the mounting portion 51.

[0170] Furthermore, the second frame 54 of the relay substrate 5C, together with the beams 53a and 53b, supports the mounting portion 51 on the fixing portions 52a and 52b to prevent the mounting portion 51 from swaying when an angular velocity ω is applied to the vibrating element 3. Preferably, for example, the resonant frequency of the second frame 54 is 10 kHz relative to the resonant frequency of the vibrating body 30. Z The above-mentioned high frequencies. Therefore, it is possible to prevent or reduce the oscillation of the mounting part 51 when an angular velocity ω is applied to the vibrating element 3.

[0171] As explained above, the relay substrate 5C in this embodiment has a second frame 54, which, when viewed from above, is located between the first frame 530 and the mounting portion 51 (vibration element mounting portion). This lengthens the stress transmission path caused by deformation of the package 2 due to external forces, allowing the first frame 530 and the second frame 54 to absorb or suppress the stress generated by this deformation. Consequently, since deformation of the mounting portion 51 can be reduced more effectively, variations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51 can be reduced more effectively.

[0172] Furthermore, as described above, the relay substrate 5C has an opening between the first frame 530 and the second frame 54, and the first frame 530 and the second frame 54 are connected by the second portion 532 of the beam portion 53a and the second portion 532 of the beam portion 53b. Also, an opening is provided between the second frame 54 and the mounting portion 51, and the second frame 54 and the mounting portion 51 are connected by two portions 542 (fifth portions) of the second frame 54. Furthermore, as described above, in this embodiment, line segment a1 coincides with the centerline along the short side direction of the mounting portion 51, and line segment a2 coincides with the centerline along the long side direction of the mounting portion 51; line segments a1 and a2 intersect (orthogonal in this embodiment). Therefore, deformation in the long side direction and deformation in the short side direction of the relay substrate 5 are less likely to be transmitted to the mounting portion 51. Thus, a more accurate and highly stable angular velocity sensor can be achieved.

[0173] Furthermore, in the illustration, line segment a1 aligns with the centerline along the short side of the mounting portion 51, and line segment a2 aligns with the centerline along the long side of the mounting portion 51, but this can also be reversed. That is, line segment a1 can be aligned with the centerline along the long side of the mounting portion 51, and line segment a2 can be aligned with the centerline along the short side of the mounting portion 51. Additionally, for example, in a top view, a frame can be provided between the second frame 54 and the mounting portion 51. That is, the relay substrate 5C can also have three or more frames surrounding the mounting portion 51 in a top view. This further lengthens the stress transmission path caused by deformation of the package 2 due to external forces.

[0174] In addition, such as Figure 8 As shown, according to the relay substrate 5C, compared with the relay substrate X, the stress generated in the mounting area (mounting portion 51) of the vibration element 3 can be reduced, specifically, by more than 90%. Furthermore, according to the relay substrate 5C, compared with the relay substrate 5 of the first embodiment, the stress generated in the mounting portion 51 can be reduced.

[0175] According to the fourth embodiment described above, it is also possible to reduce the variation in vibration characteristics.

[0176] <Fifth Implementation Method>

[0177] The fifth embodiment will now be described.

[0178] Figure 15 This is a top view showing the relay substrate of the vibration device according to the fifth embodiment. Figure 16 yes Figure 15 The top view (perspective view) of the relay substrate shown. Figure 17 yes Figure 15 A top view of the main body of the relay substrate shown.

[0179] This embodiment is the same as the embodiments described above, except for the structure of the relay substrate. Furthermore, in the following description, the fifth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0180] <Relay substrate>

[0181] like Figure 15 and Figure 16 As shown, the relay substrate 5D has a main body 50D and a wiring part 57D.

[0182] (Main Body)

[0183] like Figure 17As shown, the main body 50D has multiple beams 55a, 55b, 55c, and 55d. When viewed from above, the beams 55a, 55b, 55c, and 55d form a meandering shape.

[0184] Beams 55a and 55b connect the fixing part 52a to the mounting part 51, respectively. Furthermore, beams 55c and 55d connect the fixing part 52b to the mounting part 51, respectively.

[0185] Beams 55a, 55b, 55c, and 55d each have three first portions 551 extending along the Y-axis and two second portions 552 extending along the X-axis and longer than the first portions 551.

[0186] In each beam portion 55a, 55b, the first portion 551 and the second portion 552 are alternately connected, and have portions that are close to and separate from each other in the X-axis direction. In addition, one end of the beam portion 55a and the beam portion 55b are connected to the two ends of the fixing portion 52a in the +Y-axis direction, and the other end is connected to the two ends of the mounting portion 51 in the -Y-axis direction.

[0187] Similarly, in each beam portion 55c and 55d, the first portion 551 and the second portion 552 are alternately connected, having portions that are close to and separate from each other in the X-axis direction. Furthermore, one end of the beam portion 55c and the beam portion 55d is connected to both ends of the fixing portion 52b in the -Y-axis direction, and the other end is connected to both ends of the mounting portion 51 in the +Y-axis direction.

[0188] (Wiring section)

[0189] like Figure 15 or Figure 16 As shown, wiring 571D is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 55c, and the upper surface of the fixing portion 52b. Wiring 572D is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 55d, and the upper surface of the fixing portion 52b. Wiring 573D is provided on the upper surface of the mounting portion 51, the upper surface of the beam portion 55a, and the upper surface of the fixing portion 52a. Wiring 574D is provided on the upper surface of the mounting portion 51, the upper surfaces of the beam portions 55a and 55b, and the upper surface of the fixing portion 52a. Wiring 575D is provided on the upper and lower surfaces of the mounting portion 51, the upper and lower surfaces of the beam portions 55a and 55b, and the upper surface of the fixing portion 52a. Furthermore, wiring 575D is provided in the entire area of ​​the lower surface of the mounting portion 51.

[0190] In addition, in this embodiment, terminals 581, 583, and 585 are located on the -X axis side of the mounting portion 51, and terminals 582, 584, and 586 are located on the +X axis side of the mounting portion 51.

[0191] Furthermore, preferably, the resonant frequencies of beams 55a, 55b, 55c, and 55d are 10 kHz relative to the resonant frequency of the vibrating body 30. Z The above-mentioned high frequencies. Therefore, it is possible to prevent or reduce the oscillation of the mounting part 51 when an angular velocity ω is applied to the vibrating element 3.

[0192] As explained above, the relay substrate 5D has multiple (three in this embodiment) first portions 551 and multiple (two in this embodiment) second portions 552, with the first portions 551 and second portions 552 alternately connected. This lengthens the stress transmission path caused by deformation of the package 2 due to external forces. Therefore, since deformation of the mounting portion 51 can be reduced more effectively, variations in the vibration characteristics of the vibrating element 3 mounted on the mounting portion 51 can be reduced. Furthermore, by connecting the multiple beam portions 55a, 55b, 55c, and 55d of the relay substrate 5D to the corners of the mounting portion 51, twisting of the mounting portion 51 can be particularly reduced.

[0193] Furthermore, since the relay substrate 5D has multiple beams 55a, 55b, 55c, and 55d, the paths of the drive-type wirings 571D and 572D can be separated from those of the detection-type wirings 573D, 574D, and 575D. Therefore, signal interference from the drive-type wirings 571D and 572D to the detection-type wirings 573D, 574D, and 575D can be reduced, enabling more accurate transmission of detection signals to the IC chip 4. In addition, the design of the wirings 571D, 572D, 573D, 574D, and 575D offers a high degree of freedom. This is particularly effective when mounting angular velocity sensor elements with a large number of terminals, such as the vibration element 3, on the mounting section 51.

[0194] In addition, the aforementioned wiring 571D, 572D, 573D, 574D, and 575D can also be pulled out together from one of the desired beams 55a, 55b, 55c, and 55d.

[0195] In addition, such as Figure 8 As shown, according to the relay substrate 5D, compared with the relay substrate X, the stress generated in the mounting area (mounting part 51) of the vibration element 3 can be reduced, specifically, it can be reduced by more than 90%.

[0196] (Variation Example 1)

[0197] Figure 18 It is shown Figure 17 A top view of a modified example of the main body of the relay substrate shown.

[0198] like Figure 18As shown, one end of beam portions 55a and 55b of the main body 50Da is connected to the central portion of the fixing portion 52a on the +Y axis direction side, and the other end is connected to the central portion of the mounting portion 51 on the -Y axis direction side. Similarly, one end of beam portions 55c and 55d is connected to the central portion of the fixing portion 52b on the -Y axis direction side, and the other end is connected to the central portion of the mounting portion 51 on the +Y axis direction side. Even with this structure, the transmission path of stress to the mounting portion 51 caused by deformation of the package 2 due to external force can be lengthened, thereby reducing variations in the vibration characteristics of the vibrating element 3.

[0199] (Variation Example 2)

[0200] Figure 19 It is shown Figure 17 A top view of a modified example of the main body of the relay substrate shown.

[0201] like Figure 19 As shown, the main body 50Db has two beam portions 56a and 56b. Beam portion 56a connects the fixing portion 52a to the mounting portion 51, and beam portion 56b connects the fixing portion 52b to the mounting portion 51. Furthermore, beam portion 56a forms a shape in which the beam portions 55a and 55b of the aforementioned main body 50Da are integrated. Specifically, beam portions 56a and 56b each have four first portions 5610 extending along the Y-axis direction and two second portions 5620 extending along the X-axis direction with a length longer than the first portions 5610. Even with such a structure, the main body 50Db can lengthen the path of stress transmission to the mounting portion 51 caused by deformation of the package 2 due to external force, thereby reducing variations in the vibration characteristics of the vibrating element 3.

[0202] According to the fifth embodiment described above, it is also possible to reduce the variation in vibration characteristics.

[0203] <First Reference Example>

[0204] The first reference example will now be explained.

[0205] Figure 20 This is a perspective view of the main body of the relay substrate of the vibration device in the first reference example.

[0206] This reference example is the same as the embodiment described above, except for the structure of the relay substrate. Furthermore, in the following description, the first reference example will be described focusing on its differences from the embodiment described above; similar matters will be omitted from the description.

[0207] Figure 20The main body 50E of the relay substrate 5E shown has: a beam portion 570a that connects the fixing portion 52a to the mounting portion 51; and a beam portion 570b that connects the fixing portion 52b to the mounting portion 51. In other words, in this embodiment, the main body 50E does not have an opening (through hole) and is formed into a flat plate that is rectangular in plan view, and has two thin-walled portions (beam portions 570a and 570b) that are thinner than the other portions formed along the X-axis direction on the +Y-axis side and the -Y-axis side.

[0208] Thus, since the relay substrate 5E has beam portions 570a and 570b that are thin-walled sections, there are areas of low rigidity between the fixing portions 52a and 52b and the mounting portion 51. Therefore, the influence of external forces can be less easily transmitted to the mounting portion 51. Therefore, according to the relay substrate 5E, as Figure 8 As shown, compared with a relay substrate X of uniform thickness, the stress generated in the mounting area (mounting part 51) of the vibration element 3 can be reduced.

[0209] Alternatively, in photolithography, after the wiring patterns of beams 570a and 570b are fabricated, the beams 570a and 570b can be removed from the etching solution before penetrating the main body 50E by shortening the etching time.

[0210] It is also effective to install such beams 570a and 570b on the relay substrates 5, 5C, and 5D of the aforementioned embodiments.

[0211] <Second Reference Example>

[0212] The second reference example will now be explained.

[0213] Figure 21 This is a top view of the main body of the relay substrate of the vibration device in the second reference example.

[0214] This reference example is the same as the embodiment described above, except for the structure of the relay substrate. Furthermore, in the following description, the second reference example will be explained primarily for its differences from the embodiment described above; similar matters will be omitted from the description.

[0215] Figure 21 The main body 50F of the relay substrate 5F shown has: three beam portions 571a, which are partially disposed between the fixing portion 52a and the mounting portion 51; and three beam portions 571b, which are partially disposed between the fixing portion 52b and the mounting portion 51. These beam portions 571a and 571b are also thin-walled portions, similar to the beam portions 570a and 570b in the aforementioned first reference example. That is, in Figure 21In the main body 50F shown, three beams 571a, which are thin-walled parts, are arranged along the X-axis direction on the -Y-axis side, and three beams 571b, which are thin-walled parts, are arranged along the X-axis direction on the +Y-axis side.

[0216] In other words, there are two portions 581a between the fixing portion 52a and the mounting portion 51 of the main body portion 50F, with the same thickness as the fixing portion 52a and the mounting portion 51. Similarly, there are two portions 581b between the fixing portion 52b and the mounting portion 51 of the main body portion 50F, with the same thickness as the fixing portion 52b and the mounting portion 51.

[0217] Even according to such a relay substrate 5F, such as Figure 8 As shown, compared with a relay substrate X of uniform thickness, the stress generated in the mounting area (mounting part 51) of the vibration element 3 can also be reduced.

[0218] Alternatively, in the main body 50F, the beam portion 571a can be continuous rather than thin-walled. That is, the fixing portion 52a and the mounting portion 51 can be connected via portion 581a. Similarly, the beam portion 571b can be continuous rather than thin-walled. That is, the fixing portion 52b and the mounting portion 51 can also be connected via portion 581b. In this case, portions 581a and 581b function as beam portions.

[0219] (Modified Example)

[0220] Figure 22 It is shown Figure 21 A top view of a modified example of the main body of the relay substrate shown.

[0221] exist Figure 22 In the main body 50Fa shown, two beams 572a, which are thin-walled parts, are arranged along the X-axis direction on the -Y-axis side, and two beams 572b, which are thin-walled parts, are arranged along the X-axis direction on the +Y-axis side.

[0222] In other words, a portion 582a with the same thickness as the fixing portion 52a and the mounting portion 51 is provided between the fixing portion 52a and the mounting portion 51 of the main body portion 50Fa. Similarly, a portion 582b with the same thickness as the fixing portion 52b and the mounting portion 51 is provided between the fixing portion 52b and the mounting portion 51 of the main body portion 50Fa.

[0223] Even with a relay substrate 5Fa having such a main body 50Fa, compared to a relay substrate X with the same uniform thickness, the stress generated in the mounting area (mounting part 51) of the vibration element 3 can be reduced.

[0224] As mentioned above, thin-walled sections can also be provided locally.

[0225] <Sixth Implementation Method>

[0226] The sixth embodiment will now be described.

[0227] Figure 23 This is a top view of the vibration element of the vibration device according to the sixth embodiment.

[0228] This embodiment is the same as the embodiments described above, except for the structure of the relay substrate. Furthermore, in the following description, the sixth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0229] <Vibrating Element>

[0230] Figure 23 The vibration element 6 (vibrating plate) shown is a sensor element for detecting the angular velocity ω about the Y-axis. The vibration element 6 has: a vibrating body 60; and an electrode portion 67 formed on the surface of the vibrating body 60.

[0231] (Vibrating body)

[0232] Similar to the vibrator 30 in the first embodiment, Figure 23 The vibrating element 6 shown has a vibrating body 60 formed in the following plate shape: it has a width in the XY plane defined by the Y-axis (mechanical axis) and X-axis (electric axis) which are the crystal axes of the crystal substrate, and a thickness in the Z-axis (optical axis) direction.

[0233] The vibrator 60 has: a base 61; a pair of drive vibrating arms 621 and 622; a pair of detection vibrating arms 631 and 632; a pair of adjustment vibrating arms 641 and 642; a support 65; and four connecting parts 661, 662, 663 and 664, which are integrally formed.

[0234] Drive vibration arms 621 and 622 are arranged along the X-axis direction and extend from the base 61 toward the -Y-axis direction. Detection vibration arms 631 and 632 are arranged along the X-axis direction and extend from the base 61 toward the +Y-axis direction. Adjustment vibration arms 641 and 642 are arranged along the X-axis direction, spaced apart from the aforementioned pair of detection vibration arms 631 and 632, and extend from the base 61 toward the +Y-axis direction. The support portion 65 has: an elongated portion 651, which is disposed relative to the base 61 on the -Y-axis side and extends along the X-axis direction; and two portions 652 and 653, which extend from both ends of portion 651 along the +Y-axis direction. Connecting portions 661, 662, 663, and 664 connect the base 61 and the support portion 65, and have multiple bent or curved portions along the way.

[0235] Additionally, in the illustration, the width (length in the X-axis direction) of the end portions of the drive vibration arms 621, 622, the detection vibration arms 631, 632, and the adjustment vibration arms 641, 642 is increased, but not limited to this. For example, the widths of the drive vibration arms 621, 622, the detection vibration arms 631, 632, and the adjustment vibration arms 641, 642 can also be fixed. Furthermore, a pair of bottomed grooves extending in the Y-axis direction and open on their upper and lower surfaces can also be formed in the drive vibration arms 621, 622, the detection vibration arms 631, 632, and the adjustment vibration arms 641, 642.

[0236] (Electrode section)

[0237] The electrode section 67 has an electrode pattern (not shown) disposed on the surface of the vibrator 30 and a plurality of terminals 681, 682, 683, 684, 685, and 686.

[0238] Although not shown in the figure, the electrode pattern includes: a drive signal electrode and a drive ground electrode disposed on the drive vibration arms 621 and 622; a detection signal electrode and a detection ground electrode disposed on the detection vibration arms 631 and 632; and an adjustment electrode for adjusting the output of the detection signal electrode disposed on the adjustment vibration arms 641 and 642.

[0239] Terminal 681 (drive ground terminal) is disposed on the lower surface of portion 651 of support portion 65. Terminal 682 (drive ground terminal) is disposed on the lower surface of portion 651 of support portion 65. Terminal 683 (detection signal terminal) is disposed on the lower surface of portion 652 of support portion 65, and terminal 684 (detection signal terminal) is disposed on the lower surface of portion 653 of support portion 65. Terminal 685 (detection ground terminal) is disposed on the lower surface of portion 652 of support portion 65, and terminal 686 (detection ground terminal) is disposed on the lower surface of portion 653 of support portion 65.

[0240] The material used to construct the electrode portion 67 is not particularly limited as long as it is conductive. Specifically, the material described in the electrode portion 37 of the vibration element 3 in the first embodiment can be used.

[0241] In such a vibrating element 6, if an electric field is generated between the driving signal electrode and the driving ground electrode by inputting a driving signal to the driving signal electrode without applying an angular velocity ω to the vibrating element 6, then the driving vibrating arms 621 and 622 will be driven as follows: Figure 23 Arrow F in the figure indicates buckling vibrations (driving vibrations) that occur in opposite directions along the X-axis.

[0242] Under this driven vibration state, if an angular velocity ω about the central axis a3 along the Y-axis is applied to the vibrating element 6, then a Coriolis force acts on the driving vibrating arms 621 and 622, causing the driving vibrating arms 621 and 622 to buckle in opposite directions along the Z-axis. Subsequently, the vibration arms 631 and 632 are detected as follows... Figure 23 Arrow G indicates buckling vibrations (detected vibrations) occurring in opposite directions along the Z-axis. Based on these detected vibrations, the charge generated in the detection vibration arms 631 and 632 is extracted from the detection signal electrodes as a detection signal, and the angular velocity ω is calculated from this detection signal.

[0243] Here, the adjusting vibrating arms 641 and 642 buckle in opposite directions along the X-axis direction, independent of the presence or absence of detection vibration, in accordance with the driving vibration of the driving vibrating arms 621 and 622. Furthermore, the charge generated between the detection signal electrode, the detection ground electrode, and the adjusting electrode due to the buckling vibration of the adjusting vibrating arms 641 and 642 overlaps with the detection signal. Therefore, the detection signal can be adjusted so that, for example, the detection signal is zero when no angular velocity ω is applied.

[0244] Even when using such a vibration element 6, since the vibration element 6 has the relay substrate (e.g., relay substrate 5) of this application example, deformation of the package 2 is less likely to be transmitted to the vibration element 3, thus reducing variations in vibration characteristics. Furthermore, although not shown, when using the vibration element 6, the terminals of, for example, the relay substrate 5 can be configured to correspond to the terminals 681, 682, 683, 684, 685, and 686 of the vibration element 6. In this way, the vibration element 6 can be connected (mounted) to the package 2 simply by matching the pattern of, for example, the wiring portion of the relay substrate 5 to the vibration element 6. Therefore, it is possible to prevent a decrease in productivity associated with pattern changes.

[0245] According to the sixth embodiment described above, the variation in vibration characteristics can also be reduced.

[0246] <Seventh Implementation Method>

[0247] The seventh embodiment will now be described.

[0248] Figure 24 This is a cross-sectional view showing the vibration device according to the seventh embodiment. Figure 25 yes Figure 24 The top view of the vibrating element shown. Figure 26 yes Figure 24 The top view (perspective view) of the vibrating element shown.

[0249] In this embodiment, the vibration device of this application example is used as an oscillator. In the following description, the seventh embodiment will be described focusing on the differences from the above embodiments, and descriptions of the same matters will be omitted.

[0250] Figure 24 The vibration device 1G shown is an oscillator, which includes a package 2, an interposer substrate 5, a vibration element 700 and an IC chip 4G (electronic component).

[0251] <IC chip (electronic component)>

[0252] Figure 24 The IC chip 4G shown has an oscillation circuit for controlling the driving of the vibration element 700. When the vibration element 700 is driven by the IC chip 4G, a signal of a predetermined frequency can be extracted.

[0253] <vibration element>

[0254] Figure 25 and Figure 26 The vibration element 700 shown includes: a vibrating body 710 (piezoelectric substrate) formed into a plate shape with a rectangular top view shape; and an electrode portion 720 formed on the surface of the vibrating body 710.

[0255] (vibrating body)

[0256] The vibrating body 710 is mainly a quartz substrate that undergoes thickness shear vibration. In this embodiment, the vibrating body 710 is an AT-cut quartz substrate. AT-cut refers to cutting to obtain a main surface (a main surface including the X axis and the Z' axis) obtained by rotating the plane (Y plane) including the X axis and Z axis, which are the crystal axes of quartz, counterclockwise about 35 degrees 15 minutes from the Z axis around the X axis. In addition, the long side direction of the vibrating body 710 coincides with the X axis, which is the crystal axis of quartz.

[0257] The electrode portion 720 has a pair of electrode pattern portions 721 and 722. The electrode pattern portion 721 includes: an electrode 7211 (excitation electrode) formed on the upper surface of the vibrating body 710; a terminal 7212 formed on the lower surface of the vibrating body 710; and a wiring 7213 that electrically connects the electrode 7211 and the terminal 7212. The electrode pattern portion 722 includes: an electrode 7221 (excitation electrode) formed on the lower surface of the vibrating body 710; a terminal 7222 formed on the upper surface of the vibrating body 710; and a wiring 7223 that electrically connects the electrode 7221 and the terminal 7222. In addition, the electrodes 7211 and 7221 have substantially the same shape as each other with the vibrating body 710 interposed therebetween, and overlap when viewed from the thickness direction of the vibrating body 710.

[0258] According to such a vibrating element 700, if an alternating voltage is applied between electrodes 7211 and 7221, the vibrating body 710 vibrates in the Y-axis direction at a specified frequency.

[0259] In such a vibration device 1G, since the vibration device 1G has a relay substrate (e.g., relay substrate 5) as in this application example, deformation of the package 2 is not easily transmitted to the vibration element 700, and the vibration element 700 remains unchanged. Therefore, variations in vibration characteristics can be reduced. As a result, since the oscillation frequency does not change, a high-precision oscillation frequency with excellent C / N (carrier-to-noise ratio) can be provided.

[0260] Furthermore, although not shown, when using the vibration element 700, the terminals provided on the relay substrate 5 can be configured to correspond to the terminals 7212 and 7222 of the vibration element 700. In this way, by simply matching the vibration element 700 to the pattern of the wiring portion 57 of the relay substrate 5, for example, the pattern can be changed, and the vibration element 700 can be connected (mounted) to the package 2.

[0261] (Other examples of vibrating elements)

[0262] Figure 27 It is shown Figure 24 Figures showing other examples of vibrating elements.

[0263] like Figure 27 As shown, the vibration element 70 includes: a vibrating body 730; and an electrode portion 740 disposed on the vibrating body 730. Such a vibration element 70 is suitable for situations where the vibration device 1G, as an oscillator, is an Oven Controlled Crystal Oscillator (OCXO) with a temperature control element (not shown) for controlling the temperature of the vibration element 70.

[0264] The vibrator 730 is a vibrator obtained by etching, machining, or other processes to shape the SC-cut crystal substrate into a roughly circular top-view shape. By using a vibrator 730 that shapes the SC-cut crystal substrate into a circle, a vibrating element 70 with particularly small frequency jumps and resistance rises caused by stray vibrations and particularly stable temperature characteristics is obtained. Furthermore, the top-view shape of the vibrator 730 is not limited to a circle; it can be a non-linear shape such as an ellipse or oblong, or a linear shape such as a triangle or rectangle.

[0265] Electrode portion 740 has a pair of electrode pattern portions 741 and 742. Electrode pattern portion 741 has: an electrode 7411 (excitation electrode) formed on the upper surface of vibrator 730; a terminal 7412 formed on the upper surface of vibrator 730; and a wiring 7413 that electrically connects electrode 7411 and terminal 7412. Electrode pattern portion 742 has: an electrode 7421 (excitation electrode) formed on the lower surface of vibrator 730; a terminal 7422 formed on the lower surface of vibrator 730; and a wiring 7423 that electrically connects electrode 7421 and terminal 7422. Furthermore, electrodes 7411 and 7421 are substantially the same shape as each other across vibrator 730 and overlap when viewed from the thickness direction of vibrator 730.

[0266] In the vibration device 1G equipped with such a vibration element 70, since the vibration device 1G has the relay substrate (e.g., relay substrate 5) of this application example, deformation of the package 2 is not easily transmitted to the vibration element 70, and the holding state of the vibration element 70 remains unchanged. Therefore, variations in vibration characteristics can be reduced. As a result, since the oscillation frequency does not change, a high-precision oscillation frequency with excellent C / N (carrier-to-noise ratio) can be provided.

[0267] Furthermore, although not shown, when using the vibration element 70, the terminals provided on the relay substrate 5 can be configured to correspond to the terminals 7412 and 7422 of the vibration element 70. In this way, by simply matching the pattern of the wiring portion of the relay substrate 5 to the vibration element 70, the vibration element 70 can be connected (mounted) to the package 2.

[0268] In addition, the vibration device 1G can also be applied to, for example, a temperature-compensated crystal oscillator (TCXO). Furthermore, the vibration element of the vibration device 1G is not limited to the aforementioned vibration element 700 using an AT-cut crystal substrate or the vibration element 70 using an SC-cut crystal substrate, but can also be, for example, a vibration element using a BT-cut crystal oscillating plate.

[0269] According to the seventh embodiment described above, the variation in vibration characteristics can also be reduced.

[0270] <Eighth Implementation Method>

[0271] The eighth embodiment will now be described.

[0272] Figure 28 This is a top view showing the vibration element of the vibration device according to the eighth embodiment.

[0273] In this embodiment, the structure of the relay substrate is the same as that of the embodiments described above. Furthermore, in the following description, the eighth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0274] Figure 28 The vibrating element 7 (vibrating plate) shown has: a vibrating body 750; and an electrode portion 760 formed on the surface of the vibrating body 750.

[0275] (Vibrating body)

[0276] The vibrator 750 is made of Z-cut crystal plate. The vibrator 750 has: a base 751; and a pair of vibrating arms 752, 753, which extend from the base 751.

[0277] The base 751 includes: a first base 7511 from which vibrating arms 752 and 753 extend; a second base 7513 disposed on the side opposite to the vibrating arms 752 and 753 relative to the first base 7511; and a connecting portion 7512 connecting the first base 7511 and the second base 7513. The connecting portion 7512 is located between the first base 7511 and the second base 7513, and its width (length in the X-axis direction) is smaller than that of the first base 7511. This reduces the length of the base 751 in the Y-axis direction and decreases vibration leakage. Furthermore, the vibrating arms 752 and 753 extend from the base 751 toward the Y-axis in an X-axis direction and are parallel to each other.

[0278] Furthermore, in the illustration, the width (length in the X-axis direction) of the end portion of the vibrating arms 752 and 753 is wider than that of the base end portion, but is not limited thereto. In addition, a pair of bottomed grooves are formed on the vibrating arms 752 and 753, which are open on their upper and lower surfaces and extend in the Y-axis direction, but these grooves may not be formed.

[0279] (Electrode section)

[0280] The electrode section 760 has: an electrode pattern (not shown) disposed on the surface of the vibrator 750; and a plurality of terminals 761, 762.

[0281] Although not shown in the figure, the electrode pattern includes a first driving electrode and a second driving electrode disposed on the vibrating arms 752 and 753. In addition, terminals 761 and 762 are disposed on the lower surface of the second base 7513.

[0282] According to such a vibrating element 7, if an alternating voltage is applied between the first driving electrode and the second driving electrode, the vibrating arms 752 and 753 vibrate in the in-plane direction (XY plane direction) at a predetermined frequency in a manner of repeatedly approaching and separating from each other.

[0283] According to the eighth embodiment described above, the variation in vibration characteristics can also be reduced.

[0284] <Ninth Implementation Method>

[0285] The ninth embodiment will now be described.

[0286] Figure 29 This is a top view showing the vibration device according to the ninth embodiment.

[0287] This embodiment mainly has multiple vibration elements, and is otherwise the same as the embodiment described above. Furthermore, in the following description, the ninth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0288] Figure 29 The vibration device 1H shown is a triaxial angular velocity sensor, which can independently detect the angular velocity ωx around the X-axis, the angular velocity ωy around the Y-axis, and the angular velocity ωz around the Z-axis.

[0289] The vibration device 1H includes three vibration elements 3a, 6a, and 6b, and a relay substrate 5H, wherein the three vibration elements 3a, 6a, and 6b are mounted together on the relay substrate 5H. Furthermore, in this embodiment, the relay substrate 5H is mounted on the IC chip 4.

[0290] Vibration element 3a has the same structure as vibration element 3 in the first embodiment described above, and it detects angular velocity ωz. On the other hand, vibration elements 6a and 6b each have the same structure as vibration element 6 in the sixth embodiment described above. However, vibration elements 6a and 6b are configured differently to detect angular velocities about the X-axis and Y-axis respectively; vibration element 6a detects angular velocity ωy, and vibration element 6b detects angular velocity ωx.

[0291] These three vibrating elements 3a, 6a, and 6b are mounted together on a mounting portion 51 of a relay substrate 5H (the vibrating element in this application example). Therefore, although not shown, the relay substrate 5H has multiple terminals corresponding to the multiple terminals of the three vibrating elements 3a, 6a, and 6b.

[0292] By arranging three vibrating elements 3a, 6a, and 6b together on a relay substrate 5H, such a vibrating device 1H can be miniaturized.

[0293] (Modified Example)

[0294] Figure 30 yes Figure 29Other examples of relay substrates shown.

[0295] like Figure 30 As shown, in the vibration device 1Ha, relay substrates 5Ha, 5Hb, and 5Hc are provided for each vibration element 3a, 6a, and 6b. That is, vibration element 3a is mounted on relay substrate 5Ha, vibration element 6a is mounted on relay substrate 5Hb, and vibration element 6b is mounted on relay substrate 5Hc. In this case, in each relay substrate 5Ha, 5Hb, and 5Hc, the wiring (not shown) pulled from the mounting portion 51 to the IC chip 4 is divided for each vibration element 3a, 6a, and 6b. Therefore, as described above... Figure 29 Compared to the case where multiple vibrating elements 3a, 6a, and 6b are wired out from a relay substrate 5H as shown in the vibrating device 1H, the design freedom of the wiring portions (not shown) of each relay substrate 5Ha, 5Hb, and 5Hc is increased.

[0296] According to the ninth embodiment described above, the variation in vibration characteristics can also be reduced.

[0297] <Tenth Implementation Method>

[0298] The tenth embodiment will now be described.

[0299] Figure 31 This is a cross-sectional view showing the vibration device according to the tenth embodiment.

[0300] This embodiment is the same as the embodiment described above, except that it includes two relay substrates. Furthermore, in the following description, the tenth embodiment will be described focusing on its differences from the embodiments described above; similar matters will be omitted from the description.

[0301] like Figure 31 As shown, the vibrating device 1I has a substrate 17 (relay substrate) disposed above the vibrating element 3. The substrate 17 is located between the cover 22 and the vibrating element 3, and is separate from both the cover 22 and the vibrating element 3. Furthermore, when viewed from above, the substrate 17 is rectangular and overlaps with the vibrating element 3 in such a way that it includes the vibrating element 3. In this embodiment, the substrate 17 is connected to the fixing portions 52a and 52b of the relay substrate 5 by a connecting member 170 formed of, for example, an adhesive.

[0302] The material used to construct the substrate 17 is not particularly limited, but it is preferable to use an insulating material such as crystal, silicon, or ceramic. In particular, it is preferable to use the same material as the vibrator 30 and the main body 50 of the relay substrate 5 as the material used to construct the substrate 17. This reduces the difference in thermal expansion between the substrate 17, the vibrating element 3, and the relay substrate 5, and reduces the thermal stress associated with this difference in thermal expansion. In this embodiment, as described above, the vibrator 30 and the main body 50 are made of crystal. Therefore, it is preferable to use crystal as the material used to construct the substrate 17.

[0303] By providing such a substrate 17, it is possible to reduce the possibility that the characteristics of the vibrating element 3 may be affected by changes in parasitic capacitance between the vibrating element 3 and the cover 22 due to deformation of the cover 22 caused by external force applied to the package 2. In addition, according to such a substrate 17, the parasitic capacitance (distribution of electric field lines) around the vibrating element 3 does not change.

[0304] Furthermore, it is preferable that the substrate 17 has the same structure as the relay substrate 5. That is, it is preferable that the substrate 17 has: a portion 171 corresponding to the mounting portion 51; two portions 172a and 172b corresponding to the fixing portions 52a and 52b; and portions 173a and 173b corresponding to the beam portions 53a and 53b. This reduces the displacement between the mounting portion 51 of the relay substrate 5 and the portion 171 of the substrate 17, thus further reducing changes in the vibration characteristics of the vibration element 3. Therefore, according to the vibration device 1I, a more robust angular velocity sensor relative to external forces can be realized.

[0305] Furthermore, in this embodiment, the substrate 17 differs from the relay substrate 5 in that it does not have an electrode portion, but the electrode portion may still be formed on the surface of the substrate 17. Therefore, the vibration element 3 can be excited by the electric field generated between the electrode portion 37 of the relay substrate 5 and the electrode portion (not shown) of the substrate 17.

[0306] Furthermore, the substrate 17 can also be a flat plate without holes or slots. In the illustration, the substrate 17 is connected to the fixing portions 52a and 52b of the relay substrate 5, but the substrate 17 can also be connected to the mounting portion 51 of the relay substrate 5. In this case, even if the substrate 17 is a flat plate without holes or slots, the displacement between the mounting portion 51 of the relay substrate 5 and the substrate 17 can be minimized, thus more effectively reducing changes in the vibration characteristics of the vibrating element 3.

[0307] According to the tenth embodiment described above, the variation in vibration characteristics can also be reduced.

[0308] 2. Modules equipped with vibration devices

[0309] The modules of the vibration device that are used in this application example will be described below.

[0310] Figure 32 This is a cross-sectional view showing a module equipped with a vibrating device.

[0311] like Figure 32 As shown, module 10 includes: a vibration device (e.g., vibration device 1) according to this application example; and a mounting substrate 15 on which the vibration device is mounted. The vibration device 1 is mounted on the mounting substrate 15 by means of an external connection terminal 27 provided on its lower surface (back side) and by means of, for example, a conductive adhesive, to a terminal 157 provided on the mounting substrate 15. In addition, the mounting substrate 15 is not particularly limited, and a printed wiring board with circuits formed thereon may also be used.

[0312] Furthermore, in this embodiment, the mounting substrate 15 has the same structure as the relay substrate 5. That is, the mounting substrate 15 has: a portion 151 corresponding to the mounting portion 51; two portions 152a and 152b corresponding to the fixing portions 52a and 52b; and portions 153a and 153b corresponding to the beam portions 53a and 53b. The vibrating device 1 is mounted on the portion 151 of the mounting substrate 15. This reduces the displacement of the portion 151 of the mounting substrate 15 caused by external forces (including thermal stress). Therefore, the influence of external forces on the vibrating device 1 can be reduced more effectively, thereby enabling the realization of a module 10 equipped with a robust angular velocity sensor.

[0313] 3. Electronic devices

[0314] The following describes an electronic device incorporating the vibration device of this application example.

[0315] Figure 33 This is a perspective view showing the structure of a mobile (or laptop) personal computer using an electronic device that incorporates this application example.

[0316] In this figure, the personal computer 1100 consists of a main body 1104 with a keyboard 1102 and a display unit 1106 with a display unit 1008. The display unit 1106 is supported by a hinge structure and can rotate relative to the main body 1104. The personal computer 1100 incorporates a vibration device (e.g., vibration device 1) according to this application example.

[0317] Figure 34 This is a perspective view showing the structure of a mobile phone (including PHS) of an electronic device to which this application example is applied.

[0318] In this figure, the mobile phone 1200 includes an antenna (not shown), multiple operation buttons 1202, an earpiece 1204, and a microphone 1206. A display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. The mobile phone 1200 incorporates a vibration device (e.g., vibration device 1) according to this application example.

[0319] Figure 35 This is a perspective view showing the structure of a digital camera in an electronic device that uses this application example.

[0320] A display unit 2000 is provided on the back of the housing (main body) 1302 of the digital camera 1300. This display unit displays the image signal from the CCD (charge-coupled device), and functions as a viewfinder to display the subject as an electronic image. Furthermore, a light-receiving unit 1304, including an optical lens (camera optics system) and a CCD, is provided on the front side (inside the figure) of the housing 1302. When the photographer confirms the image of the subject displayed on the display unit 2000 and presses the shutter button 1306, the image signal from the CCD at that moment is transferred / stored in the memory 1308. This digital camera 1300 incorporates a vibration device (e.g., vibration device 1) as described in this application example.

[0321] Such an electronic device has the vibration device (e.g., vibration device 1) of this application example. Therefore, it can achieve the effect of the vibration device of this application example as described above, and can exhibit excellent characteristics.

[0322] In addition, the electronic device in this application example is used in addition to being applied to Figure 33 Personal computers in China Figure 34 Mobile phones and Figure 35 Besides digital still cameras, it can also be applied to devices such as smartphones, tablet computers, watches (including smartwatches), inkjet printers, laptop computers, televisions, wearable terminals such as HMDs (head-mounted displays), cameras, video recorders, car navigation systems, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, video game devices, word processors, workstations, video phones, anti-theft television monitors, electronic binoculars, POS (electronic payment machine) terminals, medical devices (e.g., electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasound diagnostic devices, electronic endoscopes), fish detectors, various measuring devices, mobile terminal base station equipment, measuring instruments (e.g., measuring instruments for vehicles, aircraft, and ships), flight simulators, and network servers.

[0323] 4. Moving bodies

[0324] The moving body of the vibrating device in this application example will now be described.

[0325] Figure 36 This is a perspective view of a car, a moving object using this application example.

[0326] In this figure, the car 1500 has a body 1501 and four wheels 1503, configured to rotate the wheels 1503 using a power source (engine) (not shown) provided on the body 1501.

[0327] The vehicle 1500 incorporates a vibration device (e.g., vibration device 1) according to this application example. The vibration device (e.g., vibration device 1) can detect the attitude and direction of movement of the vehicle body 1501. The detection signal from the vibration device (e.g., vibration device 1) is provided to a vehicle attitude control device 1502, which can detect the attitude of the vehicle body 1501 based on the signal and control the suspension stiffness or the brakes of each wheel 1503 based on the detection result.

[0328] Furthermore, the moving body equipped with the vibration device (e.g., vibration device 1) in this application example is not limited to automobiles, but can also be applied to other vehicles such as motorcycles, railways, airplanes, ships, spacecraft, bipedal walking robots, or radio-controlled helicopters.

[0329] As an example of such a moving body, the automobile 1500 has the vibration device (e.g., vibration device 1) of this application example. Therefore, it can achieve the effects of the aforementioned vibration device of this application example and can exhibit excellent characteristics.

[0330] The vibration device, angular velocity sensor, electronic device, and moving body of the present invention have been described above with reference to the accompanying drawings and illustrations. However, the present invention is not limited thereto, and the structure of each part can be replaced with any structure having the same function. Furthermore, other arbitrary structures can be added to the present invention. In addition, the various embodiments can be appropriately combined.

Claims

1. A vibration device, characterized in that, When we define the three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis, The vibration device includes: A vibrating element comprising a base and a support; and The relay base plate supports the vibration element. The relay substrate includes: Vibration element mounting portion, wherein the support portion is fixed to the vibration element mounting portion; and The first fixing part and the second fixing part are fixed to the fixed part, and when viewed from the Z-axis direction along the Z-axis, they sandwich the vibration element mounting part in the middle and are arranged in the Y-axis direction along the Y-axis. as well as A pair of first parts, which connect the first fixing part and the second fixing part, sandwich the vibrating element mounting part in the middle when viewed from above, and extend in the Y-axis direction. The vibrating element mounting portion is connected to the pair of first portions via a pair of second portions arranged along the X-axis. When viewed from above, the mounting portions of the support portion and the vibration element mounting portion are positioned on the left and right sides relative to the line segment connecting the pair of second portions.

2. The vibration device according to claim 1, characterized in that, The support portion includes a first support portion and a second support portion. The mounting portion includes a first mounting portion for mounting the first support portion to the vibration element mounting portion and a second mounting portion for mounting the second support portion to the vibration element mounting portion. The first mounting part is positioned on the left side relative to the line segment when viewed from above. The second mounting part is positioned on the right side relative to the line segment when viewed from above.

3. The vibration device according to claim 2, characterized in that, The vibrating element includes a first beam connecting the base and the first support and a second beam connecting the base and the second support.

4. The vibration device according to claim 3, characterized in that, The vibrating element includes multiple terminals. The fixed part includes multiple electrical connection terminals. The relay substrate includes a wiring section that electrically connects the plurality of electrical connection terminals and the plurality of terminals.

5. The vibration device according to claim 4, characterized in that, The width of the second part along the Y-axis is smaller than the width of the vibration element mounting part along the Y-axis.

6. The vibration device according to claim 5, characterized in that, When viewed from above, the relay substrate consists of the first fixing part, the second fixing part, and the pair of first parts forming a first frame surrounding the vibration element mounting part.

7. The vibration device according to claim 6, characterized in that, The relay substrate includes a second frame, which, when viewed from above, is disposed between the first frame and the vibration element mounting portion.

8. The vibration device according to claim 7, characterized in that, The relay substrate includes a pair of third portions arranged in the Y-axis direction. One of the pair of third parts connects the outer edge of the Y-axis side of the vibration element mounting portion to the second frame. The other of the three third parts connects the outer edge of the Y-axis + side of the vibration element mounting part to the second frame. One of the two second parts connects the frame portion on the X-axis side of the second frame to one of the two first parts. The other of the pair of second parts connects the frame portion on the + side of the X-axis of the second frame to the other of the pair of first parts.

9. The vibration device according to claim 8, characterized in that, The relay substrate is made of an insulating material.

10. The vibration device according to claim 9, characterized in that, The insulating material is a piezoelectric material or silicon.

11. A vibration device, characterized in that, When we define the three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis, The vibration device includes: A vibrating element comprising a base and a support; and The relay base plate supports the vibration element. The relay substrate includes: A vibration element mounting portion, wherein the support portion is fixed to the vibration element mounting portion; The first fixing part and the second fixing part are fixed to the fixed part, and when viewed from the Z-axis direction along the Z-axis, they sandwich the vibration element mounting part in the middle and are arranged in the Y-axis direction along the Y-axis. The first meandering beam connects the first fixing part and the vibration element mounting part; as well as The second meandering beam connects the second fixing part and the vibration element mounting part. When viewed from above, the support portion and the mounting portion of the vibration element are positioned on the left and right sides relative to the center of the vibration element mounting portion.

12. The vibration device according to claim 11, characterized in that, The first meandering beam portion includes: A pair of first beams, which extend in the X-axis direction along the X-axis; The second beam connects one end of one of the pair of first beams to one end of the other of the pair of first beams and extends in the Y-axis direction. The third beam portion connects the other end of one of the pair of first beam portions to the first fixing portion and extends in the Y-axis direction; as well as The fourth beam, which connects the other end of the other of the pair of first beams to the vibrating element mounting portion, extends in the Y-axis direction. The second meandering beam portion includes: A pair of fifth beams, which extend in the X-axis direction along the X-axis; The sixth beam connects one end of one of the pair of fifth beams to one end of the other of the pair of fifth beams and extends in the Y-axis direction. The seventh beam, which connects the other end of one of the pair of fifth beams to the second fixing part, extends in the Y-axis direction; and The eighth beam, which connects the other end of the other of the pair of fifth beams and the vibration element mounting portion, extends in the Y-axis direction.

13. The vibration device according to claim 11, characterized in that, The first meandering beam portion includes: A pair of ninth beams, which extend in the X-axis direction along the X-axis; The 10th beam connects one end of one of the pair of 9th beams to one end of the other of the pair of 9th beams and extends in the Y-axis direction. The 11th beam connects one end of one of the pair of 9th beams to the other end of the pair of 9th beams and extends in the Y-axis direction. The 12th beam, which connects the central portion of one of the pair of 9th beams and the 1st fixing portion, extends in the Y-axis direction; and The 13th beam, which connects the central portion of the other of the pair of 9th beams and the vibrating element mounting portion, extends in the Y-axis direction. The second meandering beam portion includes: A pair of 14th beams, which extend in the X-axis direction along the X-axis; The 15th beam connects one end of one of the pair of 14th beams to one end of the other of the pair of 14th beams and extends in the Y-axis direction. The 16th beam connects one end of one of the pair of 14 beams to the other end of the pair of 14 beams, and extends in the Y-axis direction; The 17th beam, which connects the central portion of one of the pair of 14th beams and the 2nd fixing portion, extends in the Y-axis direction; and The 18th beam, which connects the central portion of the other of the pair of 14th beams and the vibrating element mounting portion, extends in the Y-axis direction.

14. The vibration device according to claim 13, characterized in that, The support portion includes a first support portion and a second support portion. The mounting portion includes a first mounting portion for mounting the first support portion to the vibration element mounting portion and a second mounting portion for mounting the second support portion to the vibration element mounting portion. The first mounting part is positioned on the left side relative to the center of the vibration element mounting part when viewed from above. The second mounting portion is positioned on the right side relative to the center of the vibration element mounting portion when viewed from above.

15. The vibration device according to claim 14, characterized in that, The vibrating element includes a 19th beam connecting the base and the first support and a 20th beam connecting the base and the second support.

16. The vibration device according to claim 15, characterized in that, The vibrating element includes multiple terminals. The fixed part includes multiple electrical connection terminals. The relay substrate includes a wiring section that electrically connects the plurality of electrical connection terminals and the plurality of terminals.

17. A vibrating device, characterized in that, When we define the three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis, The vibration device includes: A vibrating element comprising a base and a support; and The relay base plate supports the vibration element. The relay substrate includes: A vibration element mounting portion, wherein the support portion is fixed to the vibration element mounting portion; The first fixing part and the second fixing part are fixed to the fixed part, and when viewed from the Z-axis direction along the Z-axis, the vibrating element mounting part is sandwiched in the middle and arranged in the Y-axis direction along the Y-axis. A first thin-walled portion, which connects the first fixing portion and the vibrating element mounting portion, and is thinner than the thickness of the first fixing portion and the vibrating element mounting portion; and The second thin-walled portion connects the second fixing portion and the vibrating element mounting portion, and is thinner than the thickness of the second fixing portion and the vibrating element mounting portion. When viewed from above, the support portion and the mounting portion of the vibration element are positioned on the left and right sides relative to the center of the vibration element mounting portion.

18. The vibration device according to claim 17, characterized in that, The relay substrate includes: The first thick-walled portion connects the first fixing portion and the vibrating element mounting portion, and is thicker than the first thin-walled portion; and The second thick-walled portion connects the second fixing portion and the vibrating element mounting portion, and is thicker than the second thin-walled portion. When viewed from above, the first thin-walled portion is disposed on both sides of the first thick-walled portion along the X-axis direction, and the second thin-walled portion is disposed on both sides of the second thick-walled portion along the X-axis direction.

19. The vibration device according to claim 18, characterized in that, The support portion includes a first support portion and a second support portion. The mounting portion includes a first mounting portion for mounting the first support portion to the vibration element mounting portion and a second mounting portion for mounting the second support portion to the vibration element mounting portion. The first mounting part is positioned on the left side relative to the center of the vibration element mounting part when viewed from above. The second mounting portion is positioned on the right side relative to the center of the vibration element mounting portion when viewed from above.

20. The vibration device according to claim 19, characterized in that, The vibrating element includes a 21st beam connecting the base and the first support and a 22nd beam connecting the base and the second support.

21. The vibration device according to claim 20, characterized in that, The vibrating element includes multiple terminals. The fixed part includes multiple electrical connection terminals. The relay substrate includes a wiring section that electrically connects the plurality of electrical connection terminals and the plurality of terminals.

22. A vibration device, characterized in that, When we define the three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis, The vibration device includes: A vibrating element comprising a base and a support; and The relay base plate supports the vibration element. The vibrating element comprises: The first pair of vibrating arms are arranged along the X-axis direction and extend from the negative edge of the Y-axis of the base toward the negative direction of the Y-axis, with the X-axis direction along the X-axis. The second pair of vibrating arms are arranged along the X-axis direction and extend from the edge of the base on the positive side of the Y-axis in the positive direction of the Y-axis, with the X-axis direction along the X-axis. The first connecting part extends in the Y-axis direction along the Y-axis, with one end connected to the negative edge of the X-axis of the support part, and the other end connected to the base part. The second connecting part extends in the Y-axis direction, with one end connected to the edge of the support part on the positive side of the X-axis, and the other end connected to the base part; The third connecting part extends in the Y-axis direction, with one end connected to the negative edge of the X-axis of the base and the other end connected to the support part. as well as The fourth connecting part extends in the Y-axis direction, with one end connected to the edge of the base on the positive side of the X-axis, and the other end connected to the support part. When viewed from above along the Z-axis, the third connecting portion is disposed between the first pair of vibrating arms and the first connecting portion, and the fourth connecting portion is disposed between the first pair of vibrating arms and the second connecting portion. The first connecting part and the second connecting part are mounted on the relay base plate.

23. The vibration device according to claim 22, characterized in that, The relay substrate includes: Vibration element mounting portion, wherein the support portion is fixed to the vibration element mounting portion; and The fixing part is fixed to the fixed part.

24. The vibration device according to claim 23, characterized in that, The relay substrate is contained in a frame surrounding the vibrating element mounting portion when viewed from above. The fixing part is disposed on the frame.

25. The vibration device according to claim 24, characterized in that, The support portion includes multiple terminals. The fixed part includes multiple electrical connection terminals. The relay substrate includes a wiring section that electrically connects the plurality of electrical connection terminals and the plurality of terminals.

26. The vibration device according to claim 25, characterized in that, The first pair of vibrating arms is a pair of driving vibrating arms. The second pair of vibrating arms is a pair of vibrating arms for detecting angular velocity.

27. An angular velocity sensor, characterized in that, The angular velocity sensor includes the vibration device as described in any one of claims 1 to 26 and the circuit connected to the vibration device.

28. An electronic device, characterized in that, The electronic device comprises the vibration device according to any one of claims 1 to 26.

29. A mobile body, characterized in that, The moving body has a vibration device as described in any one of claims 1 to 26.

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