Aging test system for thermal interface material, test method, and electronic component inspection apparatus provided with the system

Abstract

The application relates to an aging test system and method of a thermal interface material and an electronic component detection device with the system, wherein a controller controls a movable carrier to approach a high-temperature generating device and makes the thermal interface material on the movable carrier contact the high-temperature generating device; the controller controls a temperature sensor to measure the temperature of the thermal interface material; and the controller compares output temperature data of the high-temperature generating device with measured temperature data sensed by the temperature sensor. According to the application, the thermal conduction performance of the thermal interface material is obtained by making the thermal interface material contact the high-temperature generating device and measuring the temperature state of the thermal interface material after the contact, so that the good or bad and the performance aging state of the thermal interface material can be judged in real time, and the thermal interface material can be selected or replaced as a reference basis.

Claims

1. An electronic component testing device with thermal interface material aging testing function, comprising: A pressure probe, which includes the thermal interface material; A high-temperature generating device that outputs a controlled steady-state temperature or instantaneous temperature change as output temperature data; At least one temperature sensor is disposed on the pressure probe, and the at least one temperature sensor is controlled to detect temperature as measurement temperature data; Test socket, used to house the electronic component under test; and The controller is electrically connected to the pressure probe, the high-temperature generating device, the at least one temperature sensor, and the test socket; Specifically, the controller controls the pressure probe to approach the high-temperature generating device and bring the thermal interface material into contact with the high-temperature generating device; the controller controls the at least one temperature sensor to sense the temperature of the thermal interface material; and the controller compares the output temperature data of the high-temperature generating device with the measured temperature data sensed by the at least one temperature sensor.

2. The electronic component testing equipment according to claim 1, wherein, The controller controls the high-temperature generating device to output a first steady-state temperature, and the output temperature data includes the first steady-state temperature; the at least one temperature sensor senses the temperature of the thermal interface material as a second steady-state temperature, and the measured temperature data includes the second steady-state temperature; the controller compares the first steady-state temperature with the second steady-state temperature, and when the difference between the first steady-state temperature and the second steady-state temperature is greater than or equal to 5°C, the controller outputs a warning signal.

3. The electronic component testing equipment according to claim 1, wherein, When the thermal interface material comes into contact with the high-temperature generating device, the controller controls the high-temperature generating device to generate instantaneous temperature changes within a time period. The output temperature data includes the instantaneous temperature changes generated by the high-temperature generating device within the time period. The measured temperature data includes the measured temperature changes sensed by the at least one temperature sensor within the time period.

4. The electronic component testing equipment according to claim 3, wherein, When the thermal interface material comes into contact with the high-temperature generating device, the controller controls the input current surge to the high-temperature generating device, causing the high-temperature generating device to generate the instantaneous temperature change during the time period.

5. The electronic component testing equipment according to claim 1 further includes a transfer shuttle, the high temperature generating device being disposed on the transfer shuttle, the transfer shuttle being electrically connected to the controller and controlled to move between or away from the pressure probe and the test socket.

6. The electronic component testing equipment according to claim 1, wherein, The high-temperature generating device is located on one side of the test base, and the pressure probe is moved in a controlled manner to selectively contact the high-temperature generating device or the test base.

7. An aging test method for thermal interface materials, comprising the following steps: (A) The controller controls the pressure probe to approach the high temperature generating device and makes the heat interface material on the pressure probe contact the high temperature generating device; the high temperature generating device is controlled to output steady-state temperature or instantaneous temperature change as output temperature data. (B) The controller controls at least one temperature sensor on the pressure probe to sense the temperature of the thermal interface material and output the measured temperature data; as well as (C) The controller compares the output temperature data of the high-temperature generating device with the measured temperature data sensed by the at least one temperature sensor.

8. The aging test method for thermal interface materials according to claim 7, wherein, In step (A), the controller controls the high-temperature generating device to output a first steady-state temperature, and the output temperature data includes the first steady-state temperature; in step (B), the at least one temperature sensor senses the temperature of the thermal interface material as a second steady-state temperature, and the measured temperature data includes the second steady-state temperature; in step (C), the controller compares the first steady-state temperature with the second steady-state temperature, and when the difference between the first steady-state temperature and the second steady-state temperature is greater than or equal to 5°C, the controller outputs a warning signal.

9. The aging test method for thermal interface materials according to claim 7, wherein, In step (A), after the thermal interface material comes into contact with the high-temperature generating device, the controller controls the high-temperature generating device to generate the instantaneous temperature change within a time period, and the output temperature data includes the instantaneous temperature change generated by the high-temperature generating device within the time period; in step (B), the controller controls the at least one temperature sensor to sense the temperature of the thermal interface material within the time period and outputs the measured temperature change as the measured temperature data.

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