Traceability information generation method and apparatus, electronic device, and storage medium

Abstract

The application provides a trace information generation method and device, electronic equipment and a storage medium. The trace information generation method comprises the following steps: acquiring material information of a material loaded into a patch device; for two continuous material loadings performed on the patch device after the patch device is started, acquiring a first time of the first material loading, and acquiring a second time of the second material loading; acquiring circuit board information of a circuit board, and acquiring an identification time at which the patch device identifies the circuit board, wherein the patch device identifies the circuit board after the material is attached to the circuit board; binding the circuit board information of the circuit board corresponding to the first time and the identification time located between the first time and the second time with the material information of the material loaded into the patch device before the second time, and generating trace information corresponding to the second time. The present scheme can improve the efficiency of information tracing of the material.

Description

Technical Field

[0001] This application relates to the field of information generation technology, and in particular to a method, apparatus, electronic device and storage medium for generating traceability information. Background Technology

[0002] A printed circuit board assembly (PCBA) is a component obtained by mounting materials such as resistors, integrated circuits, capacitors, and / or transformers on a printed circuit board (PCB).

[0003] In the process of mass production of PCBA components, a large amount of material is usually loaded onto the pick-and-place machine, and then the machine is started to mount the material onto the PCB that has entered the machine. After the pick-and-place machine is started, additional material is usually loaded until the machine is shut down, at which point the production of a single batch of PCBA components is completed. After the production of a single batch of PCBA components is completed, if defective PCBA components are found in the batch, all materials used in the production of that batch of PCBA components must be investigated to trace the information of the materials used in the defective PCBA components.

[0004] However, a single batch of PCBA components typically contains a large number of PCBA components, requiring frequent replenishment of materials after the pick-and-place machine is started. This means that a large quantity of materials are used in the production of a single batch of PCBA components, making it troublesome and time-consuming to check all the materials used in the production of a single batch of PCBA components. As a result, the efficiency of material information traceability is low. Summary of the Invention

[0005] In view of this, the traceability information generation method, apparatus, electronic device and storage medium provided in this application can improve the efficiency of information traceability for materials.

[0006] According to a first aspect of the embodiments of this application, a traceability information generation method is provided, comprising: acquiring material information of materials loaded into a surface mount device; acquiring a first time of the first material loading and a second time of the second material loading for two consecutive material loadings performed on the surface mount device after its startup; acquiring circuit board information of a circuit board and acquiring the identification time of the surface mount device identifying the circuit board, wherein the surface mount device identifies the circuit board after mounting the material onto the circuit board; binding the circuit board information of circuit boards with identification times corresponding to the first time and the circuit board information of circuit boards with identification times between the first time and the second time with the material information of materials loaded into the surface mount device before the second time, thereby generating traceability information corresponding to the second time.

[0007] According to a second aspect of the embodiments of this application, a traceability information generation apparatus is provided, comprising: a first acquisition unit, configured to acquire material information of materials loaded into a surface mount device; a second acquisition unit, configured to acquire a first time of the first material loading and a second time of the second material loading for two consecutive material loadings performed on the surface mount device after its startup; a third acquisition unit, configured to acquire circuit board information of a circuit board and acquire the identification time of the surface mount device identifying the circuit board, wherein the surface mount device identifies the circuit board after mounting the material onto the circuit board; and a generation unit, configured to bind the circuit board information of circuit boards whose identification time is the first time and whose identification time is between the first time and the second time with the material information of materials loaded into the surface mount device before the second time, thereby generating traceability information corresponding to the second time.

[0008] According to a third aspect of the present application, an electronic device is provided, including: a processor, a memory, a communication interface, and a bus, wherein the processor, the memory, and the communication interface communicate with each other through the bus; the memory is used to store at least one executable instruction, which causes the processor to perform an operation corresponding to the traceability information generation method described in the first aspect above.

[0009] According to a fourth aspect of the embodiments of this application, a computer-readable storage medium is provided, wherein computer instructions are stored on the computer-readable storage medium, and when executed by a processor, the computer instructions cause the processor to perform the traceability information generation method as described in the first aspect above.

[0010] According to a fifth aspect of the present application, a computer program product is provided, which is tangibly stored on a computer-readable medium and includes computer-executable instructions that, when executed, cause at least one processor to perform the traceability information generation method as described in the first aspect above.

[0011] As can be seen from the above technical solution, the circuit boards with identification times corresponding to the first time and the second time are equipped with materials loaded before the second time. Therefore, the circuit board information of the circuit boards with identification times corresponding to the first time and the second time is bound with the material information of the materials loaded into the placement equipment before the second time to obtain traceability information corresponding to the second time. When a defect is found in the materials mounted on the circuit board assembly, it is necessary to check whether the materials in the same batch also have defects. After determining the circuit board information of the circuit board in the circuit board assembly, traceability information including the circuit board information can be determined. Then, based on the traceability information, materials that may have defects can be traced. That is, the material information included in the traceability information indicates materials that may have defects, without the need to check materials loaded into the placement equipment after the time corresponding to the traceability information. This allows for rapid traceability of materials that may have defects, improving the efficiency of material information traceability. Attached Figure Description

[0012] Figure 1 This is a flowchart of a traceability information generation method according to an embodiment of this application;

[0013] Figure 2 This is a schematic diagram of a traceability information generation apparatus according to an embodiment of this application;

[0014] Figure 3 This is a schematic diagram of an electronic device according to an embodiment of this application.

[0015] List of reference numerals in the attached diagram:

[0016] 101: Obtain material information of materials loaded into the placement equipment.

[0017] 102: For two consecutive material loading operations performed on the placement equipment after startup, obtain the first time of the first material loading and the second time of the second material loading.

[0018] 103: Obtain the circuit board information and the identification time of the surface mount device in recognizing the circuit board.

[0019] 104: Bind the circuit board information corresponding to the first identification time and the circuit board information corresponding to the identification time between the first and second times to the material information of the materials loaded into the placement equipment before the second time, and generate traceability information corresponding to the second time.

[0020] 100: Traceability information generation method; 200: Traceability information generation device; 201: First acquisition unit

[0021] 202: Second acquisition unit; 203: Third acquisition unit; 204: Generation unit

[0022] 300: Electronic device; 302: Processor; 304: Communication interface

[0023] 306: Memory; 308: Bus; 310: Program Detailed Implementation

[0024] As mentioned earlier, in the mass production of PCBA components, a large quantity of materials is typically loaded onto a pick-and-place machine. The machine is then started to mount the materials onto the PCBs that have entered the machine. After the machine starts, additional materials are usually added until it is shut down, completing the production of a single batch of PCBA components. If defective PCBA components are subsequently found in this batch, all materials used in the production process must be investigated to trace the information of the materials used in the defective components. However, the large quantity of materials used in producing a single batch of PCBA components makes investigating all materials used in the production process cumbersome and time-consuming, resulting in low efficiency in material traceability.

[0025] In this embodiment, by acquiring the time when materials are loaded into the surface mount device and the time when the surface mount device identifies the circuit board, the material information of materials that may be loaded onto a certain circuit board is bound to the circuit board information of that circuit board based on the material loading time and the circuit board identification time, traceability information is obtained. When a defect is found in the materials mounted on the circuit board assembly (including the circuit board and the materials mounted on the circuit board), it is necessary to check whether the materials in the same batch also have defects. Based on the traceability information, the batch of materials that may have defects can be identified, narrowing the scope of material investigation, thereby improving the efficiency of material information traceability.

[0026] The traceability information generation method, apparatus, electronic device, and storage medium provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0027] Traceability Information Generation Method

[0028] Figure 1 This is a flowchart of a traceability information generation method according to an embodiment of this application. Figure 1 As shown, the method for generating traceability information includes the following steps:

[0029] Step 101: Obtain material information of the materials loaded into the placement equipment.

[0030] Surface mount technology (SMT) equipment is used to mount materials onto circuit boards. For example, multiple SMT machines form a production line, and the multiple SMT machines on the same production line operate independently of each other. The materials are electronic components such as resistors, chips, capacitors, or transformers.

[0031] Before starting the placement equipment, operators can use a barcode scanner to scan multiple sets of materials one by one. After scanning each set, the operator can then load it into the placement equipment. Each set includes multiple materials of the same model; therefore, scanning each set provides the material information for each individual material within that set. Materials can be held in a material tray, and a single tray can hold multiple materials of the same model.

[0032] The material information may include the material's model code, model name, code, production line code of the placement equipment to which the material is mounted, code of the placement equipment to which the material is mounted, code of the barcode scanner used to scan the group of materials to which the material is mounted, and / or code of the personnel who scan the group of materials to which the material is mounted, etc. This application embodiment does not limit this.

[0033] Then the placement equipment can be started. At this time, the circuit boards to be placed will enter the placement equipment in sequence. The placement equipment will place the materials on the incoming circuit boards. That is, for each circuit board entering the placement equipment, the placement equipment will place part of the materials already loaded in the placement equipment onto the circuit board, to obtain a circuit board assembly including the circuit board and the materials placed on the circuit board, so as to complete the production of the circuit board assembly. Then the circuit board assembly is transported out of the placement equipment.

[0034] After the placement equipment is started, as the circuit board assembly production process proceeds, the materials loaded into the placement equipment before the equipment is started are gradually consumed. When the remaining quantity of a certain type of material in the placement equipment is low, a barcode scanner will be used to scan a group of materials including that type of material, and that group of materials will be loaded into the placement equipment.

[0035] Step 102: For the two consecutive material loading operations performed on the placement equipment after the placement equipment is started, obtain the first time of the first material loading and the second time of the second material loading.

[0036] After the surface mount technology (SMT) equipment starts up, as the SMT assembly process continues, the materials loaded into the equipment are gradually consumed, requiring multiple loadings. For two consecutive material loadings, the first loading time and the second loading time can be obtained. Since materials are loaded in pallets on the SMT equipment, each pallet has a barcode or QR code corresponding to the material information of the material it contains. By scanning the barcode or QR code on the pallet with a barcode scanner, the material information of the material can be obtained. The loading time is the time when the material information is obtained, i.e., the time when the barcode or QR code on the pallet containing that material is scanned.

[0037] Step 103: Obtain the circuit board information and the identification time of the chip mounting device in recognizing the circuit board.

[0038] In one possible implementation, after the placement equipment mounts materials onto the circuit board, it identifies the circuit board. Specifically, for each circuit board, after mounting materials to obtain a circuit board assembly, as the assembly is transported outside the placement equipment, a camera included in the equipment captures an image of the assembly. The circuit board information can then be identified from the captured image. The identification time is the time it takes to acquire the circuit board information; for example, the time it takes for the camera to capture an image of the circuit board assembly can be used as the identification time of the circuit board within that assembly.

[0039] The circuit board information includes the circuit board's model name, model code, code, model name of the circuit board assembly corresponding to the circuit board, model code of the circuit board assembly corresponding to the circuit board, code of the circuit board assembly corresponding to the circuit board, work order code of the work order corresponding to the circuit board, code of the production line of the placement equipment into which the circuit board enters, code of the placement equipment into which the circuit board enters, and / or code of the camera that took the picture of the circuit board.

[0040] Step 104: Bind the circuit board information of the circuit board with the corresponding identification time as the first time and the circuit board with the corresponding identification time between the first time and the second time with the material information of the material loaded into the placement equipment before the second time to generate traceability information corresponding to the second time.

[0041] The circuit board information of the circuit board whose identification time is between the first time and the second time, as well as the circuit board information of the circuit board whose identification time is at the first time, are bound to the material information of the materials loaded into the placement equipment before the second time to generate traceability information corresponding to the second time. The traceability information can be stored in the form of arrays or text, and the traceability information corresponding to different times can be stored in different arrays or different files, etc., which is not limited in this embodiment.

[0042] Furthermore, there is no restriction on the execution order of steps 101 to 103. For example, they can be executed sequentially in the order of steps 101, 102, and 103, or in the order of steps 102, 103, and 101, or in parallel.

[0043] In this embodiment, the circuit boards with identification times corresponding to the first time and the second time are mounted with materials loaded before the second time. Therefore, the circuit board information of the circuit boards with identification times corresponding to the first time and the second time is bound with the material information of the materials loaded into the placement equipment before the second time to obtain traceability information corresponding to the second time. When a defect is found in the materials mounted on the circuit board assembly, it is necessary to check whether the materials in the same batch also have defects. After determining the circuit board information of the circuit board in the circuit board assembly, traceability information including the circuit board information can be determined. Then, based on the traceability information, materials that may have defects can be traced. That is, the material information included in the traceability information indicates materials that may have defects, without having to check the materials loaded into the placement equipment after the time corresponding to the traceability information. This allows for rapid traceability of materials that may have defects, improving the efficiency of material information traceability.

[0044] Furthermore, during the actual operation of the placement equipment, materials loaded into the placement equipment first are not necessarily used preferentially. Therefore, materials loaded into the placement equipment at the first time and before the first time can be placed onto circuit boards identified between the first time and the second time. Thus, the circuit board information corresponding to the identification time of the first time and the identification time between the first time and the second time is bound with the material information of materials loaded into the placement equipment before the second time to generate traceability information corresponding to the second time. This ensures that the material placed on the circuit board indicated by the circuit board information in the traceability information is the material indicated by a certain material information in the traceability information. This ensures that the traceability information can be used to comprehensively investigate potentially defective batches of materials and ensure the accuracy of material tracking.

[0045] In one possible implementation, the traceability information generation method further includes: determining the start time of the placement equipment; determining the third time after the placement equipment starts to load materials into the placement equipment for the first time; binding the circuit board information of the circuit board whose identification time is between the start time and the third time with the material information of the materials loaded into the placement equipment before the third time to generate traceability information corresponding to the third time.

[0046] Before starting the placement machine, materials are pre-loaded into it to ensure that circuit board assembly production can begin immediately after startup, i.e., the loaded materials are placed onto the circuit boards. After the placement machine starts, as the pre-loaded materials are consumed, materials need to be replenished to ensure continuous production. The time of the first material loading after the placement machine starts is designated as the third time. The circuit board information of circuit boards whose identification time falls between the startup time and the third time is bound to the material information of materials loaded into the placement machine before the third time, generating traceability information corresponding to the third time. The traceability information corresponding to the third time can be stored in a different array or a different file than other traceability information.

[0047] In this embodiment, since the placement equipment does not mount materials onto the circuit board or identify the circuit board before starting, and pre-loads materials into the placement equipment before starting, the first loading time after the placement equipment starts is the third time. Therefore, the circuit board with the identification time between the start time and the third time has pre-loaded materials mounted on it. Thus, the circuit board information of the circuit board with the identification time between the start time and the third time can be bound with the material information of the materials loaded into the placement equipment before the third time to generate traceability information corresponding to the third time. Based on this traceability information, the materials mounted on the circuit board identified before the third time can be traced, thereby ensuring that the circuit boards identified at different times all have corresponding traceability information, ensuring the comprehensiveness and reliability of material information traceability.

[0048] In one possible implementation, during the process of acquiring the circuit board information of the circuit board, the identification result of the surface mount device identifying the circuit board group can be acquired; based on the identification information included in the identification result, the identification information of each circuit board in the circuit board group can be acquired; based on the identification information of each circuit board in the circuit board group, the circuit board information of each circuit board in the circuit board group can be acquired.

[0049] A circuit board group consists of multiple circuit boards of the same model. The multiple circuit boards in the same circuit board group are spliced ​​together end to end. When the chip mounting equipment identifies the circuit boards, the identification result includes the identification information of at least one circuit board in the circuit board group. The identification information can be a unique identifier such as a code.

[0050] When identifying each circuit board group, the circuit board group is photographed by a camera, and then the photographed result is used for image recognition to identify the identification information of at least one circuit board in the circuit board group. Then, based on the identification information of the identified circuit boards in the circuit board group, the identification information of each circuit board in the circuit board group is determined in the first database.

[0051] For example, if the first database includes the identification information of each circuit board in multiple circuit board groups, and the identification information of the circuit boards in the same circuit board group is in the same data table or array storage unit, then after obtaining the identification information of the identified circuit boards in a circuit board group, the storage unit where the identification information of the circuit boards in the circuit board group is located can be determined in the first database, and the identification information stored in the storage unit can be obtained to obtain the identification information of each circuit board in the circuit board group.

[0052] For each circuit board group, the placement equipment can either place the material onto each circuit board in the circuit board group before identifying the circuit board group, or identify the circuit board group before placing the material onto each circuit board in the circuit board group, etc. The embodiments of this application do not limit this.

[0053] After obtaining the identification information of each circuit board in a circuit board group, the circuit board information of each circuit board in the circuit board group can be obtained from multiple second databases based on the identification information of each circuit board in the circuit board group and the installation location information of the camera that took pictures of the circuit board group.

[0054] For example, the multiple second databases can be a database for storing circuit board model names, a database for storing work order information, and a database for storing camera information. After obtaining the identification information of each circuit board in a circuit board group, for each circuit board identification information, the model name of the circuit board can be obtained from the database for storing circuit board names, and the work order code of the corresponding work order can be obtained from the database for storing work order information. Furthermore, based on the camera information that identifies the circuit board group to which the circuit board belongs, the code of the production line of the placement equipment that the circuit board enters can be obtained from the database for storing camera information. Thus, circuit board information including the model name of the circuit board, the work order code of the corresponding work order, and the code of the production line of the placement equipment that the circuit board enters can be obtained.

[0055] In this embodiment of the application, a scheme is adopted to obtain the circuit board information of each circuit board in the circuit board group based on the identification result of the chip mounting equipment identifying the circuit board group. Since the identification result includes the identification information of at least one circuit board in the circuit board group, even if the chip mounting equipment only performs identification on the circuit board group once and does not identify some circuit boards in the circuit board group, it is still possible to obtain the circuit board information of each circuit board in the circuit board group. This reduces the possibility of not obtaining the circuit board information of the board with the mounted material, thereby reducing the possibility of not being able to trace the material information through traceability information and improving the comprehensiveness of traceability information.

[0056] The placement equipment may include one camera or multiple cameras; this application embodiment does not limit this. When the placement equipment includes multiple cameras, the multiple cameras simultaneously photograph the circuit boards in the same circuit board group, reducing the possibility that the identification information of each circuit board in the group will not be captured. The identification information of the circuit boards may be printed on the front or the back of the circuit boards. Preferably, some cameras can be used to photograph the front of the circuit boards in the group, and others can be used to photograph the back of the circuit boards, further reducing the possibility that the identification information of each circuit board in the group will not be captured. For example, the placement equipment includes four cameras, two of which are used to photograph the front of the circuit boards in the group, and the other two are used to photograph the back of the circuit boards in the group.

[0057] If the same circuit board identification information is obtained from different cameras, deduplication can be performed. For example, during the process of acquiring circuit board information, the identification results of the chip mounting equipment identifying the circuit board group can be obtained, and each identification information included in the identification results can be processed as follows:

[0058] S1. Determine whether the identification information is stored in the third database. If yes, proceed to step S2; otherwise, proceed to step S3.

[0059] The third database is initially an empty database.

[0060] S2, End the current processing.

[0061] If the identification information has already been stored in the third database, it means that the circuit board information of the circuit board indicated by the identification information has been obtained and there is no need to obtain it again. The current process ends for the identification information.

[0062] S3. Obtain the identification information of each circuit board in the circuit board group, and based on the identification information of each circuit board in the circuit board group, obtain the circuit board information of each circuit board in the circuit board group, and store the identification information of each circuit board in the circuit board group into the third database.

[0063] If the identification information is not stored in the third database, it means that the circuit board information of the circuit board indicated by the identification information, as well as other circuit boards located in the same circuit board group as the circuit board indicated by the identification information, has not yet been obtained. Therefore, the identification information of each circuit board in the circuit board group containing the circuit board indicated by the identification information can be obtained, and the circuit board information of each circuit board in the circuit board group can be obtained based on the identification information of each circuit board in the circuit board group. After obtaining the circuit board information of each circuit board in the circuit board group, the identification information of each circuit board in the circuit board group is stored in the third database.

[0064] In one possible implementation, when obtaining the identification time of the patch device for identifying the circuit board, a fourth time for the patch device to identify the circuit board group to which the circuit board belongs can be obtained, and then the fourth time is determined as the identification time of each circuit board in the circuit board group.

[0065] The camera in the surface mount equipment captures images of multiple circuit boards in a circuit board assembly. It identifies the identification information of one or more circuit boards from the captured images. Based on the identified identification information of these circuit boards, the identification information of each individual circuit board in the assembly can be obtained. Furthermore, based on the identification information of each individual circuit board in the assembly, the circuit board information of each individual circuit board can be obtained. The circuit board identification time is the time required to acquire the identification information of the circuit board. Since the time required to identify the identification information from the captured images is relatively short, the time required to capture the images of the circuit board assembly can be determined as the identification time of each individual circuit board in that assembly.

[0066] In this embodiment, the time when the placement equipment identifies the circuit board group is determined as the identification time of each circuit board in the circuit board group. Each circuit board in the same circuit board group corresponds to the same identification time. Since the placement equipment also reserves materials to ensure the normal operation of the placement equipment when replenishing materials, for circuit board groups that are in the material placement process when replenishing materials to the placement equipment, each circuit board in the circuit board group will be placed with the reserved materials. Therefore, determining the identification time of each circuit board in the same circuit board group as the identification time of the circuit board group will not cause errors in the traceability information, but can reduce the difficulty of obtaining the circuit board identification time and ensure that the traceability information can be obtained normally.

[0067] In one possible implementation, when obtaining the circuit board information of a circuit board, the identification information of an unidentified circuit board can be determined based on the identification information of the identified circuit boards, thereby obtaining the circuit board information of the unidentified circuit boards.

[0068] According to the order in which the placement equipment identifies multiple circuit board groups, the second circuit board group is the preceding circuit board group of the first circuit board group. The first circuit board group has at least some circuit boards that have been identified by the placement equipment, and the identification information of each circuit board in the second circuit board group has not been identified by the placement equipment.

[0069] The number of second circuit board groups can be one or more. When there is only one second circuit board group, the second circuit board group is the preceding circuit board group of the first circuit board group, according to the order in which the surface mount device identifies the multiple circuit board groups. When there are multiple second circuit board groups, the multiple second circuit board groups are N consecutive circuit board groups, where N is a positive integer greater than or equal to 2, and the last circuit board group in the sequence is the preceding circuit board group of the first circuit board group.

[0070] The first database can be used to store information about circuit board groups. This information includes the identification information of each circuit board in the group, the order in which the circuit boards are fed into the placement equipment for material processing, and the order of the circuit board group information stored in the first database. Based on the order of the circuit board group information stored in the first database and the identification information of the identified circuit board groups, the first and second circuit board groups can be determined. Since the identification information of the circuit boards in the first circuit board group has been obtained, the identification information of the circuit boards in the second circuit board group can be obtained based on the identification information of the circuit boards in the first circuit board group and the information stored in the first database. Therefore, based on the identification information of the circuit boards in the second circuit board group, the circuit board information of the circuit boards in the second circuit board group can be determined.

[0071] In this embodiment, a scheme is adopted to determine the second circuit board group based on the first circuit board group, and then obtain the circuit board information of the circuit boards in the second circuit board group. Thus, even if the placement equipment does not identify any circuit board in the circuit board group, it is still possible to obtain the circuit board information of each circuit board in the circuit board group, reducing the possibility of losing the circuit board information of the board board of the placed material. This can reduce the possibility of not being able to trace the material information through traceability information and improve the comprehensiveness of traceability information.

[0072] In one possible implementation, since generating traceability information requires the identification time of the circuit boards, for the second circuit board group that the placement equipment has not identified, the time for the placement equipment to identify the first circuit board group is determined as the identification time of each circuit board in the second circuit board group.

[0073] In this embodiment of the application, for a second circuit board group that is not recognized by the placement equipment, the first circuit board group that has been recognized by the placement equipment after the second circuit board group is determined, and then the recognition time of the first circuit board group is determined as the recognition time of each circuit board in the second circuit board group, ensuring that each circuit board has a corresponding recognition time. Then, traceability information can be generated according to the recognition time of the circuit board, so that each circuit board has corresponding traceability information and ensuring the comprehensiveness of the traceability information.

[0074] In one possible implementation, during the process of acquiring material information of materials loaded into the patch device, the material tray identifier set on the material tray is identified to obtain material tray identifier information, and then the material information of the materials contained in the material tray is determined based on the material tray identifier information.

[0075] Material trays are used to load materials into the placement equipment. Multiple materials of the same model can be placed in the same material tray, meaning that a group of materials can be placed in the same material tray, while different groups of materials can be placed in different material trays.

[0076] When loading materials into the placement equipment, it is done by installing a material tray inside the equipment. The material tray is printed with a QR code or barcode corresponding to the material tray identification information. The material tray identification information can be the code, model code, and / or type name of the material contained in the tray, etc., which is not limited in this embodiment. The material tray setting facilitates the acquisition of material information and the loading of materials.

[0077] In this embodiment, since the material tray contains multiple materials of the same type, the material tray identification information is associated with the material information of the materials contained in the tray. After obtaining the material tray identification information by scanning a barcode, the material information associated with the material tray identification information can be determined, and this material information is the material information of the materials contained in the tray. By obtaining the material tray identification information and then obtaining the material information based on the material tray identification information, the material information of the materials loaded into the placement equipment can be easily obtained, ensuring that the efficiency of loading materials into the placement equipment is not affected while ensuring that the material information can be obtained.

[0078] It should be noted that the traceability information generation method in this application embodiment can be implemented by a main control program, which can be implemented using programming languages ​​such as Python, and the main control program is implemented on its dedicated server or controller.

[0079] Traceability Information Generation Device

[0080] Corresponding to the above method embodiments, Figure 2 A schematic diagram of a traceability information generation apparatus according to an embodiment of this application is shown.

[0081] like Figure 2 As shown, the traceability information generation device 200 includes:

[0082] The first acquisition unit 201 is used to acquire material information of the materials loaded into the patch device;

[0083] The second acquisition unit 202 is used to acquire the first time of the first material loading and the second time of the second material loading for two consecutive material loadings performed on the placement equipment after the placement equipment is started.

[0084] The third acquisition unit 203 is used to acquire the circuit board information of the circuit board and the recognition time of the chip mounting equipment to identify the circuit board, wherein the chip mounting equipment identifies the circuit board after mounting the material onto the circuit board.

[0085] The generation unit 204 is used to bind the circuit board information of the circuit board with the corresponding identification time being the first time and the corresponding identification time being between the first time and the second time with the material information of the material loaded into the placement equipment before the second time, so as to generate traceability information corresponding to the second time.

[0086] In this embodiment of the application, the acquisition unit 201 can be used to execute step 101 in the aforementioned method embodiment, the identification unit 202 can be used to execute step 102 in the aforementioned method embodiment, the conversion unit 203 can be used to execute step 103 in the aforementioned method embodiment, and the sending unit 204 can be used to execute step 104 in the aforementioned method embodiment.

[0087] It should be noted that the information interaction and execution process between the various units in the above-mentioned traceability information generation device are based on the same concept as the aforementioned traceability information generation method embodiment. For details, please refer to the description in the aforementioned traceability information generation method embodiment, and it will not be repeated here.

[0088] electronic devices

[0089] Figure 3 This is a schematic diagram of an electronic device provided in an embodiment of this application. The specific embodiments of this application do not limit the specific implementation of the electronic device. See also... Figure 3The electronic device 300 provided in this application embodiment includes: a processor 302, a communications interface 304, a memory 306, and a bus 308. Wherein:

[0090] The processor 302, communication interface 304, and memory 306 communicate with each other via bus 308.

[0091] Communication interface 304 is used to communicate with other electronic devices or servers.

[0092] The processor 302 is used to execute program 310, specifically to perform the relevant steps in the above-described traceability information generation method embodiment.

[0093] Specifically, program 310 may include program code that includes computer operation instructions.

[0094] Processor 302 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application. The smart device may include one or more processors of the same type, such as one or more CPUs; or it may include processors of different types, such as one or more CPUs and one or more ASICs.

[0095] Memory 306 is used to store program 310. Memory 306 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0096] Specifically, program 310 can be used to cause processor 302 to execute the traceability information generation method in any of the foregoing embodiments.

[0097] The specific implementation of each step in procedure 310 can be found in the corresponding steps and units described in the above-described traceability information generation method embodiments, and will not be repeated here. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the devices and modules described above can be referred to the corresponding process descriptions in the aforementioned method embodiments, and will not be repeated here.

[0098] In the electronic device of this embodiment, the circuit boards with identification times corresponding to the first time and the second time are mounted with materials loaded before the second time. Therefore, the circuit board information of the circuit boards with identification times corresponding to the first time and the second time is bound with the material information of the materials loaded into the placement equipment before the second time to obtain traceability information corresponding to the second time. When a defect is found in the materials mounted on the circuit board assembly, it is necessary to check whether the materials in the same batch also have defects. After determining the circuit board information of the circuit board in the circuit board assembly, traceability information including the circuit board information can be determined. Then, based on the traceability information, materials that may have defects can be traced. That is, the material information included in the traceability information indicates materials that may have defects, without having to check the materials loaded into the placement equipment after the time corresponding to the traceability information. This allows for rapid traceability of materials that may have defects, improving the efficiency of material information traceability.

[0099] Computer-readable storage media

[0100] This application also provides a computer-readable storage medium storing instructions for causing a machine to perform the traceability information generation method as described herein. Specifically, a system or apparatus equipped with a storage medium storing software program code that implements the functions of any of the embodiments described above, and enabling the computer (or CPU or MPU) of the system or apparatus to read and execute the program code stored in the storage medium.

[0101] In this case, the program code read from the storage medium can itself implement the function of any of the above embodiments, and therefore the program code and the storage medium storing the program code constitute part of this application.

[0102] Examples of storage media used to provide program code include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), magnetic tapes, non-volatile memory cards, and ROMs. Alternatively, program code can be downloaded from a server computer via a communication network.

[0103] Furthermore, it should be clear that not only can the program code read by the computer be executed, but also the operating system or other components operating on the computer can be instructed based on the program code to perform some or all of the actual operations, thereby realizing the function of any of the embodiments described above.

[0104] Furthermore, it is understood that the program code read from the storage medium is written to the memory set in the expansion board inserted into the computer or to the memory set in the expansion module connected to the computer. Then, based on the instructions of the program code, the CPU or other components installed on the expansion board or expansion module execute some and all of the actual operations, thereby realizing the function of any of the above embodiments.

[0105] Computer program products

[0106] This application also provides a computer program product, which is tangibly stored on a computer-readable medium and includes computer-executable instructions. When executed, these computer-executable instructions cause at least one processor to perform the traceability information generation methods provided in the above embodiments. It should be understood that the solutions in this embodiment have the corresponding technical effects in the above method embodiments, which will not be repeated here.

[0107] It should be noted that not all steps and modules in the above process and device structure diagrams are mandatory; some steps or modules can be omitted as needed. The execution order of each step is not fixed and can be adjusted as required. The system structure described in the above embodiments can be a physical structure or a logical structure. That is, some modules may be implemented by the same physical entity, or some modules may be implemented by multiple physical entities, or they may be jointly implemented by certain components in multiple independent devices.

[0108] In this patent application, nouns and pronouns relating to people are not limited to specific genders.

[0109] In the above embodiments, the hardware modules can be implemented mechanically or electrically. For example, a hardware module may include permanent dedicated circuitry or logic (such as a dedicated processor, FPGA, or ASIC) to perform the corresponding operations. The hardware module may also include programmable logic or circuitry (such as a general-purpose processor or other programmable processor), which can be temporarily configured by software to perform the corresponding operations. The specific implementation method (mechanical, dedicated permanent circuitry, or temporarily configured circuitry) can be determined based on cost and time considerations.

[0110] The present application has been shown and described in detail above with reference to the accompanying drawings and preferred embodiments. However, the present application is not limited to these disclosed embodiments. Based on the above multiple embodiments, those skilled in the art will know that more embodiments of the present application can be obtained by combining the code review methods in the different embodiments above. These embodiments are also within the protection scope of the present application.

Claims

1. A method for generating traceability information (100), comprising: Obtain material information of the materials loaded into the placement equipment; For two consecutive material loadings performed on the placement equipment after the placement equipment is started, the first time of the first material loading and the second time of the second material loading are obtained. Obtain circuit board information of the circuit board and obtain the identification time of the placement equipment in identifying the circuit board, wherein the placement equipment identifies the circuit board after placing the material onto the circuit board; The circuit board information corresponding to the identification time of the first time and the circuit board information corresponding to the identification time between the first time and the second time are bound with the material information of the material loaded into the placement equipment before the second time to generate traceability information corresponding to the second time. The material loaded into the placement equipment before the second time includes the material loaded into the placement equipment before the first time.

2. The method according to claim 1, further comprising: Determine the start-up time of the placement equipment; The third time after the placement equipment is started is determined to be the time when the first material loading is performed on the placement equipment; The circuit board information of the circuit board whose corresponding identification time is between the start time and the third time is bound with the material information of the material loaded into the placement equipment before the third time to generate traceability information corresponding to the third time.

3. The method according to claim 1 or 2, wherein, The process of obtaining the circuit board information includes: The identification result of the patch device identifying the circuit board group is obtained, wherein the identification result includes the identification information of at least one circuit board in the circuit board group; Based on the identification information included in the identification results, the identification information of each circuit board in the circuit board group is obtained; Based on the identification information of each circuit board in the circuit board group, obtain the circuit board information of each circuit board in the circuit board group.

4. The method according to claim 3, wherein, The process of obtaining the identification time of the patch device for identifying the circuit board includes: The fourth time when the placement device identifies the circuit board assembly is obtained; The fourth time is determined as the identification time of each circuit board in the circuit board group.

5. The method according to claim 3, wherein obtaining the circuit board information of the circuit board further includes: A first circuit board group and a second circuit board group are determined, wherein, according to the order in which the surface mount device identifies multiple circuit board groups, the second circuit board group is the preceding circuit board group of the first circuit board group, the first circuit board group is a circuit board group in which at least some circuit boards are identified by the surface mount device, and the identification information of each circuit board in the second circuit board group is not identified by the surface mount device. Based on the identification information of the circuit boards in the first circuit board group, obtain the circuit board information of the circuit boards in the second circuit board group.

6. The method according to claim 5, further comprising: The time it takes for the surface mount device to identify the first circuit board group is determined as the identification time for each circuit board in the second circuit board group.

7. The method according to claim 1, wherein, The process of obtaining material information for materials loaded into the patch assembly equipment includes: The material tray identifier set on the material tray is identified to obtain the material tray identifier information. The material tray is used to load the material it contains into the patch device, and the same material tray contains multiple materials of the same type. Based on the material tray identification information, determine the material information of the material contained in the material tray.

8. A traceability information generation device (200), comprising: The first acquisition unit (201) is used to acquire material information of the material loaded into the placement equipment; The second acquisition unit (202) is used to acquire the first time of the first material loading and the second time of the second material loading for two consecutive material loadings performed on the placement equipment after the placement equipment is started. The third acquisition unit (203) is used to acquire the circuit board information of the circuit board and acquire the recognition time of the placement equipment to identify the circuit board, wherein the placement equipment identifies the circuit board after placing the material onto the circuit board; The generation unit (204) is used to bind the circuit board information of the circuit board with the identification time corresponding to the first time and the circuit board with the identification time between the first time and the second time with the material information of the material loaded into the placement equipment before the second time, and generate traceability information corresponding to the second time. The material loaded into the placement equipment before the second time includes the material loaded into the placement equipment before the first time.

9. An electronic device (300), comprising: The processor (302), communication interface (304), memory (306), and bus (308) communicate with each other through the bus (308). The memory (306) is used to store at least one executable instruction that causes the processor (302) to perform an operation corresponding to any of the methods described in claims 1-7.

10. A computer-readable storage medium storing computer instructions that, when executed by a processor, cause the processor to perform the method of any one of claims 1-7.

11. A computer program product tangibly stored on a computer-readable medium and comprising computer-executable instructions that, when executed, cause at least one processor to perform the method according to any one of claims 1-7.

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