Test apparatus for semiconductor packages

Abstract

A test device for testing a semiconductor package of a package on package (POP) type according to the present application, wherein a vacuum pickup has a vacuum hole communicating with an insulating pad hole, is configured to include a main body portion of a silicon or rubber material and a socket contact portion and a package contact portion formed of any one of a polyimide film, an engineering plastic or a synthetic resin, and the vacuum pickup is coupled to an upper socket by being adhered to a mounting groove formed in a lower portion of the upper socket with an adhesive tape from the socket contact portion of the vacuum pickup.

Description

Technical Field

[0001] This invention relates to a testing apparatus for semiconductor packages, and more specifically, to a testing apparatus for semiconductor packages used to detect whether a stacked package type (POP) semiconductor package, which is composed of a lower semiconductor package and an upper semiconductor package stacked on top of each other, is functioning properly. Background Technology

[0002] Semiconductor packages (packages) are formed by high-density integration of microcircuits, and undergo a testing process during manufacturing to ensure the proper functioning of each circuit. The testing process is used to select qualified and unqualified products by verifying the proper operation of the semiconductor package.

[0003] In semiconductor packaging testing, a test apparatus is used to electrically connect the terminals of the semiconductor package to a tester that applies test signals. The test apparatus has various structures depending on the type of semiconductor package being tested.

[0004] Recently, with the increasing use of stacked package (POP) semiconductor packages that minimize component size and enable rapid signal transmission, the demand for test equipment for testing such semiconductor packages has also continued to grow.

[0005] like Figure 1 The illustration shows a conventional test apparatus 100 for testing semiconductor packages in a stacked package configuration, comprising: a lower socket 40 and an upper socket 60 for transmitting signals; a pusher 50 mounted on the upper socket; and a vacuum pickup 70 integrally fastened to the upper socket 60 for adsorbing the lower package 10. The lower socket 40 is disposed on the tester 30 for electrical connection to the lower semiconductor package 10 (hereinafter referred to as the "lower package"), and the upper semiconductor package 20 (hereinafter referred to as the "upper package") is mounted on the upper part of the upper socket for electrical connection to the upper socket 60.

[0006] In such a testing apparatus, after the pusher 50 descends and picks up the lower package 10, which is the object of the test for the vacuum pickup 70, the lower package 10 is placed on the upper part of the lower socket 40. Then, the pusher 50 presses the upper socket 60 to press the lower package 10. As a result, the second conductive part 61 of the upper socket 60 is connected to the upper terminal 12 of the lower package 10. Therefore, the tester 30, the lower socket 40, the lower package 10, the upper socket 60, and the upper package 20 are electrically connected and an electrical test is performed.

[0007] In existing conventional semiconductor package testing equipment, after the picker picks up the semiconductor package to be tested and places it on the test socket, the picker moves to pick up other semiconductor packages. Electrical testing is performed by having a pusher pressurize the semiconductor packages on the test socket. That is, in existing conventional semiconductor package testing equipment, the vacuum picker and pusher operate separately; the vacuum picker only performs the pick and place function, and therefore only holds the semiconductor package for a very short time.

[0008] In contrast, in test apparatuses for testing semiconductor packages with stacked package configurations, the vacuum pickup and pusher are integrated. The vacuum pickup, combined with the pusher, performs the functions of picking, placing, and pushing the semiconductor package being tested. Therefore, the vacuum pickup has a structure that is in contact with the semiconductor package for a long time. Especially in reliability testing, the vacuum pickup maintains contact with the lower package for 1 to 2 weeks.

[0009] In a test apparatus for testing semiconductor packages with stacked package configurations, the vacuum pickup 70 is fabricated using silicon to protect the semiconductor package and improve vacuum adsorption performance. However, due to the properties of silicon, a phenomenon known as "sticky" occurs where the lower package adheres to the vacuum pickup. Conventional methods, such as applying antistatic coatings or specific coatings to the surface of the vacuum pickup closely attached to the semiconductor package, have failed to improve this sticky phenomenon.

[0010] like Figure 2 As shown in (a), recently, a contact portion 720 as an anti-sticking component has been formed on the underside of the main body portion 710 of the vacuum pickup 70, which is attached to the lower package 10. The contact portion 720 is formed of any one of polyimide film, engineering plastic or synthetic resin. The contact portion 720 formed as an anti-sticking component is attached to the main body portion 710 to prevent sticking.

[0011] However, in test apparatuses used to test semiconductor packages in which the vacuum pickup 70 is connected to the lower package for an extended period of time, as well as... Figure 2As shown in (b), due to vacuum pressure, the main body 710 of the vacuum pickup 70 is in a compressed state for a long time. Therefore, in the main body made of silicon, as shown by arrow A, silicone oil gushes out and flows down along the inner and outer sides of the main body 710. The flowing silicone oil flows into the space between the vacuum pickup and the lower package, thereby accumulating silicone oil between the contact portion 720 of the vacuum pickup 70 and the lower package 10 (S exemplarily represents silicone oil accumulation). Therefore, there is a problem that the vacuum pickup 70 and the lower package 10 still stick together.

[0012] Therefore, as Figure 3 As shown in (a), recently, a package contact portion 730 with a width greater than that of the main body portion 710 has been configured so that the main body portion 710 is attached to the upper central portion of the package contact portion 730. On the outer edge portion of the upper surface of the package contact portion 730 where the main body portion 710 is not attached, a space is provided to accommodate silicone oil that flows out from the inner and outer sides of the main body portion 710. This, to a certain extent, prevents the vacuum pickup 70 and the lower package 10 from sticking together.

[0013] However, in order to maintain the adsorption force of the lower encapsulation 10, the main body 710 of the vacuum pickup 70 needs to have an appropriate degree of elasticity (t1), such as Figure 3 As shown in (b), during repeated use over a long period of time, the thickness of the main body 710 of the vacuum pickup 70 shrinks from "t1" to "t2". As the adsorption force of the vacuum pickup 70 weakens, the contact between the vacuum pickup 70 and the lower package 10 becomes unstable, resulting in the problem that the vacuum pickup 70 cannot properly pick up the lower package 10.

[0014] Furthermore, in existing test apparatuses for testing semiconductor packages with stacked package configurations, the vacuum pickup 70 is integrally fixed to the upper socket 60. Therefore, even if either the upper socket 60 or the vacuum pickup 70 malfunctions, both the upper socket and the vacuum pickup need to be replaced, leading to increased replacement costs.

[0015] Existing technical documents

[0016] Patent documents

[0017] (Patent Document 1) Patent Publication No. 2015-0106848 (September 22, 2015)

[0018] (Patent Document 2) Patent Publication No. 10-1555965 (September 25, 2015) Summary of the Invention

[0019] Technical problems to be solved

[0020] The present invention, based on the above description, aims to provide a testing apparatus for semiconductor packaging, capable of performing precision testing on semiconductor packages in a high-speed, stacked packaging configuration.

[0021] Furthermore, the purpose of this invention is to provide a testing device for semiconductor packaging that can alleviate the reduction of the elastic range of the vacuum pickup even under long-term repeated use, thereby extending the life of the vacuum pickup, and can also easily separate the lower package while the vacuum pickup stably adsorbs it.

[0022] Problem Solving Methods

[0023] To address the aforementioned objective, a semiconductor package testing apparatus according to the present invention, as a testing apparatus for a stacked package (POP) semiconductor package, includes a lower socket, an upper socket, and a vacuum pickup. The lower socket is mounted on a tester and connected to a lower package placed on the upper side. The upper socket is mounted on a pusher and carries an upper package, connected to the lower package placed on the lower side. The vacuum pickup is coupled to the upper socket and is capable of adsorbing the lower package. The upper socket has an insulating pad hole and a mounting groove surrounding the insulating pad hole. The vacuum pickup has a vacuum hole communicating with the insulating pad hole. It is configured to include a main body made of silicon or rubber and a socket contact portion and a package contact portion formed of any one of polyimide film, engineering plastic, or synthetic resin. The vacuum pickup can be coupled to the upper socket by attaching the socket contact portion to the mounting groove with adhesive tape.

[0024] The adhesive tape has a width smaller than the width of the mounting groove, and the socket contact portion may have the same width as the mounting groove.

[0025] The adhesive tape can be attached to the central portion of the mounting groove.

[0026] A first tape receiving groove may be formed in the central portion of the mounting groove, the first tape receiving groove accommodating a portion of the thickness of the adhesive tape.

[0027] A second tape receiving groove may be formed in the upper central portion of the socket contact, the second tape receiving groove accommodating a portion of the thickness of the adhesive tape.

[0028] The depth of the mounting groove can be greater than the thickness of the adhesive tape plus the socket contact portion.

[0029] The area of ​​the encapsulation contact portion can be more than 5% of the upper area of ​​the lower encapsulation.

[0030] Invention Effects

[0031] According to a semiconductor packaging testing apparatus of the present invention, a socket contact portion and a package contact portion are formed in the upper and lower parts of the main body of the vacuum pickup with an anti-stick material. The socket contact portion and the package contact portion are formed to be larger than the width of the main body, which blocks the movement of the lower package from the adhesive tape or oil flowing from the main body to the lower package. This can prevent the lower package from sticking to most of the vacuum pickup, thus stabilizing the adsorption of the lower package while also making it easy to separate.

[0032] Furthermore, according to the semiconductor packaging testing apparatus of the present invention, a socket contact portion of rigid material is formed on the main body of silicon or rubber, which can alleviate the shrinkage of the main body caused by repeated use of the vacuum pickup, so that the vacuum pickup can stably adsorb the lower package without picking errors, thus extending the life of the vacuum pickup.

[0033] Furthermore, in the semiconductor packaging testing apparatus according to the present invention, the vacuum pickup can be easily separated from or combined with the upper socket, thus increasing the convenience of replacement. If either the upper socket or the vacuum pickup malfunctions, only the malfunctioning part can be replaced, thus reducing replacement costs. Attached Figure Description

[0034] Figure 1 This diagram outlines a test setup for existing stacked semiconductor packaging designs.

[0035] Figure 2 This diagram illustrates the sticky phenomenon that occurs when silicon gushes out of a vacuum pickup in an existing testing setup.

[0036] Figure 3 This diagram illustrates a pickup error that occurs when the main body of the vacuum pickup, which serves as an elastic zone, contracts in an existing testing setup.

[0037] Figure 4 The test apparatus for a semiconductor package of the stacked package form of the present invention is shown in schematic.

[0038] Figure 5 The function of the test apparatus for illustrating the stacked packaging configuration of the semiconductor package according to the present invention.

[0039] Figure 6 The structure of the upper socket according to an embodiment of the present invention is shown, (a) is the upper view and (b) is the lower view.

[0040] Figure 7 The structure of a vacuum pickup according to an embodiment of the present invention is shown, (a) is a cross-sectional view and (b) is a perspective view.

[0041] Figure 8and Figure 9 This diagram illustrates the connection between the upper socket and the vacuum pickup according to an embodiment of the present invention.

[0042] Figure 10 The diagram illustrating the connection between the upper socket and the vacuum pickup according to another embodiment of the present invention is a partially enlarged view.

[0043] Explanation of reference numerals in the attached figures

[0044] 10: Bottom package 20: Top package

[0045] 30: Tester 40: Lower socket

[0046] 50: Thruster 60: Upper socket

[0047] 62: Insulating pad 63: Insulating pad hole

[0048] 64: Mounting slot; 70, 700: Vacuum pickup unit

[0049] 81: Adhesive tape; 100, 200: Testing equipment for semiconductor packaging.

[0050] 641, 742: With receiving groove 710: Main body

[0051] 711, 731, 741: Vacuum vias; 730: Encapsulation contact.

[0052] 740: Socket contact part Detailed Implementation

[0053] The testing apparatus for semiconductor packaging according to the present invention will now be described in detail with reference to the accompanying drawings.

[0054] This invention can be modified in various ways and can have multiple embodiments. For specific embodiments, they are illustrated in the accompanying drawings and described in detail in the description.

[0055] However, this is not intended to limit the invention to a specific implementation, but should be understood to include all modifications, equivalents and substitutes that fall within the scope of the ideas and techniques of the invention.

[0056] When a constituent element is referred to as "connected" or "linked" to other constituent elements, it should be understood that it can be directly connected or linked to the other constituent elements, but there may also be other constituent elements in between. Conversely, when a constituent element is referred to as "directly connected" or "directly linked" to other constituent elements, it should be understood that there are no other constituent elements in between.

[0057] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Unless otherwise expressly indicated, singular expressions include plural expressions.

[0058] In this specification, terms such as “comprising” or “having” should be understood as indicating the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, and do not preclude the existence or additional possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0059] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements are not limited to the terms used. The terms are used only for the purpose of distinguishing one constituent element from another.

[0060] Furthermore, the constituent elements of the embodiments described with reference to the accompanying drawings are not limited to the corresponding embodiments. They can be applied to other embodiments within the scope of maintaining the technical concept of the present invention. Moreover, it should be understood that even if further description is omitted, multiple embodiments can be re-embodied as an integrated embodiment.

[0061] Furthermore, in the description with reference to the accompanying drawings, the same or related reference numerals are assigned to the same constituent elements regardless of the reference numerals, and repeated descriptions thereof are omitted. In describing the present invention, detailed descriptions of prior art will be omitted when it is determined that such detailed descriptions may unnecessarily obscure the essence of the invention.

[0062] Figure 4 This schematically illustrates a test apparatus for a semiconductor package of the stacked package configuration of the present invention. Figure 5 The function of the test apparatus for illustrating the stacked packaging configuration of the semiconductor package according to the present invention. However, Figure 4 and Figure 5 The illustrations are simplified to illustrate the structure and function of the test apparatus for the stacked package type semiconductor package. For the connection configuration of the upper socket and vacuum pickup of this invention, please refer to... Figure 8 and Figure 9 .

[0063] and Figure 6 The structure of the upper socket according to an embodiment of the present invention is shown, (a) is the upper view, and (b) is the lower view. Figure 7 The structure of a vacuum pickup according to an embodiment of the present invention is shown, (a) is a cross-sectional view, and (b) is a perspective view. Figure 8 and Figure 9 This diagram illustrates the connection between the upper socket and the vacuum pickup according to an embodiment of the present invention.

[0064] like Figure 4 As shown, the test apparatus 200 for stacked package semiconductor packages is used to test the stacked package type (POP) semiconductor package of the lower package 10 by using the upper package 20 which has been pre-selected as a qualified product. The tester 30 that generates test signals and the stacked package type (POP) semiconductor package can be electrically connected.

[0065] The semiconductor package testing apparatus 200 includes: a lower socket 40 mounted on the tester 30; a socket housing 111 and a guide housing 120 on which the lower socket 40 is mounted; a pusher 50 mounted on an upper socket 60 and capable of moving by a moving force from a drive unit (not shown); an upper socket 60 coupled to the pusher 50; and a vacuum pickup 700 mounted on the upper socket 60 to be able to pick up the lower package 10.

[0066] The lower socket 40 is mounted on the tester 30, enabling the tester 30 to form an electrical connection with the lower package 10 located on the upper side. The lower socket 40 is disposed within the socket housing 111 and is configured to include a first conductive part 41 and an insulating part 42.

[0067] The first conductive part 41 can be in the form of conductive particles arranged in an elastic insulating material, or it can be in the form of a spring needle with a built-in spring.

[0068] The thruster 50 can be moved by a moving force from a drive unit (not shown) to approach or move away from the lower socket 40. The thruster 50 has an inner chamber 52 for accommodating the upper package 20 and a vacuum channel 51 for transmitting vacuum pressure. The vacuum channel 51 is connected to an external vacuum pressure generator (not shown) and transmits the vacuum pressure generated by the vacuum pressure generator to the vacuum pickup 700.

[0069] The upper socket 60 is integrated into one side of the pusher 50 to seal the chamber 52. The upper socket 60 is equipped with an upper package 20 (which can be a pre-selected qualified product package) placed in the chamber 52, and is electrically connected to the lower package 10 placed below during testing. Figure 6 As shown, the upper socket 60 includes an insulating pad 62 covering the cavity 52 and a plurality of second conductive parts 61 supported by the insulating pad 62.

[0070] The insulating pad 62 can be formed of either an elastic or non-elastic insulating material. When the upper socket 60 is connected to the lower package 10, the non-elastic insulating pad 62 facilitates pressure on the lower package 10 towards the lower socket 40. If the non-elastic insulating pad 62 stably presses against the lower package 10, the lower terminal 11 of the lower package 10 can be stably connected to the first conductive portion 41 of the lower socket 40. Polyimide, engineering plastics, or various other non-elastic insulating materials can be used as such a non-elastic insulating material. In contrast, the insulating pad 62 can be constructed of an elastic insulating material, such as a heat-resistant polymer with a cross-linked structure, for example, silicone rubber.

[0071] The second conductive portion 61 is formed in such a way that it penetrates the insulating pad 62 along the thickness direction and is supported by the insulating pad 62. The second conductive portion 61 may be formed in a form that contains a plurality of conductive particles within an elastic insulating material, and the elastic insulating material constituting the second conductive portion 61 may be the same material as the elastic insulating material of the insulating pad 62.

[0072] An insulating pad hole 63 is provided in the central portion of the insulating pad 62. The insulating pad hole 63 is configured to communicate with the vacuum channel 51 of the chamber 52, thereby enabling the transmission of vacuum pressure in the chamber 52.

[0073] Below the upper socket 60 is a mounting groove 64 for mounting the vacuum pickup 700 (wherein, below the upper socket refers to the portion facing the lower package 10, and above the upper socket refers to the portion facing the upper package 20). The mounting groove 64 is formed in the form of a groove surrounding the insulating pad hole 63.

[0074] As described below, the vacuum pickup 700 is installed by attaching it to the mounting groove 64 formed below the upper socket 60 using adhesive tape 81. Vacuum pressure or release pressure is transmitted to the vacuum pickup 700 through the operation of the vacuum pressure generating device, via the vacuum channel 51, chamber 52, and insulating pad hole 63. While maintaining a vacuum state, the vacuum pickup 700 descends and picks up the lower package 10, which is the object to be tested. If the pusher 50 pressurizes the upper socket 60, the vacuum pickup 700 is compressed while simultaneously pressurizing the lower package 10 or releasing the vacuum state, allowing the lower package 10, after testing, to be positioned on the loading device (not shown).

[0075] Figure 7The figures show a cross-sectional view and a perspective view of the structure of a vacuum pickup according to an embodiment of the present invention. As shown, the vacuum pickup 700 according to an embodiment of the present invention has vacuum holes 711, 731, and 741 communicating with the insulating pad hole 63 of the upper socket 60, and is configured to include a main body 710 made of silicone or rubber and a socket contact 740 and an encapsulation contact 730 formed of any one of polyimide film, engineering plastic or synthetic resin.

[0076] The main body 710 constitutes the main body of the vacuum pickup 700, and is formed in the central part of a cylindrical or frustum-shaped section with a through-hole 711. Vacuum pressure or release pressure provided by the operation of the vacuum pressure generating device is transmitted to the first vacuum hole 711 through the vacuum channel 51 of the actuator, the chamber 52, and the insulating pad hole 63. This main body 710 is made of rubber or silicone to improve vacuum adsorption performance. Furthermore, in this specification, the upper part of the main body 710 refers to the portion facing the upper socket 60, and the lower part of the main body 710 refers to the portion facing the lower package 10.

[0077] The encapsulation contact portion 730 is attached to the lower part of the main body portion 710. The encapsulation contact portion 730, as the part that contacts the lower encapsulation 10, is formed in the central part of the circular plate with a second vacuum hole 731 that is formed through and connected to the first vacuum hole 711 of the main body portion 710.

[0078] The encapsulation contact 730 has a wider width than the main body 710. The lower part of the main body 710 is joined to the upper part of the encapsulation contact 730 in such a way that the outer edge of the upper part of the encapsulation contact 730 is exposed. Therefore, the encapsulation contact 730 is shaped to cover the lower part of the main body 710, such that the diameter of the second vacuum hole 731 of the encapsulation contact 730 is smaller than the diameter of the first vacuum hole 711 of the main body 710.

[0079] Preferably, in order to more stably pick up the lower package 10, the contact area of ​​the package contact portion 730 that contacts the lower package 10 is more than 5% of the upper surface area of ​​the lower package 10. Here, the upper surface of the lower package 10 refers to the portion facing the upper socket 60.

[0080] Furthermore, if the thickness t4 of the encapsulation contact portion 730 becomes thicker, it will increase the overall load of the vacuum pickup 700 and may cause damage to the lower encapsulation 10. Therefore, the thickness t4 of the encapsulation contact portion is preferably formed to be about 5% to 10% of the overall thickness t of the vacuum pickup 700.

[0081] The encapsulation contact 730 can be formed of a rigid, non-stick material such as polyimide film, engineering plastic, or synthetic resin. Therefore, the portion of the vacuum pickup 700 that is in close contact with the lower encapsulation is formed of a non-stick material, which can prevent the lower encapsulation from sticking to the vacuum pickup 700 to a certain extent.

[0082] Furthermore, according to an embodiment of the present invention, the encapsulation contact 730 has an upper outer edge portion of the encapsulation contact 730 that is not combined with the main body 710 of the vacuum pickup 700. Silicone oil or the like that flowing from the main body 710 of silicone or rubber material stays on the upper outer edge portion of the encapsulation contact 730, thereby moving the silicone oil between the encapsulation contact 730 and the lower encapsulation 10, thereby preventing most of the lower encapsulation 10 from sticking to the vacuum pickup 700 and thus making it easy to separate the lower encapsulation 10.

[0083] The socket contact portion 740 is attached to the upper part of the main body portion 710. The socket contact portion 740 serves as a mounting groove 64 inserted into the upper socket 60, and the portion attached to the upper socket 60 is formed in the center of the circular plate with a third vacuum hole 741 that is formed through and connected to the first vacuum hole 711 of the main body portion 710.

[0084] The socket contact portion 740 has a width larger than that of the main body portion 710, and is configured such that the upper surface of the main body portion 710 is attached to the lower surface of the socket contact portion 740. Therefore, the socket contact portion 740 is configured to cover the upper surface of the main body portion 710, and the diameter of the third vacuum hole 741 of the socket contact portion 740 is formed such that it is smaller than or equal to the diameter of the first vacuum hole 711 of the main body portion 710. Figure 7 An example is shown where the diameter of the third vacuum hole 741 of the socket contact portion 740 is less than or equal to the diameter of the first vacuum hole 711 of the main body portion 710.

[0085] The socket contact portion 740 can be formed of a rigid non-stick material such as polyimide film, engineering plastic, or synthetic resin.

[0086] A socket contact portion 740 made of rigid material is formed on the main body 710 made of silicone or rubber. This can alleviate the shrinkage of the main body 710 caused by repeated use of the vacuum pickup 700, thereby allowing the vacuum pickup 700 to stably pick up the lower package 10 without picking errors, thus extending the lifespan of the vacuum pickup 700. Therefore, preferably, the thickness t3 of the socket contact portion is at least 3% of the overall thickness t of the vacuum pickup 700.

[0087] The vacuum pickup 700 thus constructed is attached to the mounting groove 64 of the upper socket 60 by means of adhesive tape 81 such as double-sided tape. Figure 8As shown, after attaching adhesive tape 81 to the mounting groove 64 of the vacuum pickup 700 beforehand, the socket contact portion 740 of the vacuum pickup 700 is inserted into the mounting groove 64, so that the socket contact portion 740 is attached to the adhesive tape 81, thereby connecting the vacuum pickup 700 to the upper socket 60.

[0088] To observe this more closely, such as Figure 9 As shown in the figure, the adhesive tape 81 has a width w2 that is smaller than the width w1 of the mounting groove 64, and is attached to the central portion of the mounting groove 64. The socket contact portion 740 of the vacuum pickup 700 has the same width as the width w1 of the mounting groove 64, and is attached to the upper socket 60 by the adhesive tape 81 within the mounting groove 64.

[0089] The mounting groove 64 formed below the upper socket 60 has a depth sufficient to accommodate the adhesive tape 81 and the socket contact portion 740 of the vacuum pickup. The depth t1 of the mounting groove 64 can be formed to be deeper than the sum of the thickness t2 of the adhesive tape 81 and the thickness t3 of the socket contact portion 740. In this way, if the depth of the mounting groove 64 is formed to be deeper, the vacuum pickup 700 can be more securely mounted to the upper socket 60.

[0090] Since the adhesive tape 81 also contains viscous oil components, when the vacuum pickup 700 is used repeatedly, the adhesive tape 81 may be pushed to the edge of the mounting groove 64. If the viscous oil components that flow out from the adhesive tape 81 that has been pushed to the edge flow down the upper side of the lower package 10 along the vacuum pickup 700, the lower package 10 may become sticky and stick to the vacuum pickup 700.

[0091] Therefore, in one embodiment of the present invention, an adhesive tape 81 having a width w2 smaller than the width w1 of the mounting groove 64 is attached to the central portion of the mounting groove 64, such that the socket contact portion 740 having the same width as the width w1 of the mounting groove 64 is covered by the narrow adhesive tape 81. As a result, the viscous oil component flowing out from the adhesive tape 81 cannot detach from the top of the socket contact portion 740, thereby reliably preventing the lower package 10 from sticking to the vacuum pickup 700 due to the viscous oil component of the adhesive tape 81.

[0092] Figure 10 The diagram illustrating the connection between the upper socket and the vacuum pickup according to another embodiment of the present invention is a partially enlarged view.

[0093] When the vacuum pickup 700 is used repeatedly, the adhesive tape 81 may be pushed out of the center of the mounting groove 64. To prevent this from happening, such as Figure 10 As shown in (a), a groove is cut out in the center of the mounting groove 64 of the upper socket 60 and a first receiving groove 641 is provided, or as shown in (a). Figure 10As shown in (b), a groove can be cut out in the upper central part of the socket contact portion 740 and a second receiving groove 742 can be provided.

[0094] The first receiving groove 641 or the second receiving groove 742 is formed to accommodate a portion of the thickness t2 of the adhesive tape 81. The adhesive tape 81 is firmly attached to the first receiving groove 641 or the second receiving groove 742, and will not be pushed outward from the center of the mounting groove 64 during repeated use of the vacuum pickup 700. A portion of the viscous oil component that flows out from the adhesive tape 81 is contained in the first receiving groove 641 or the second receiving groove 742, which can reduce oil outflow and more reliably prevent the viscous oil component dissolved from the adhesive tape 81 from moving to the lower part of the vacuum pickup 700.

[0095] Furthermore, although not shown in the accompanying drawings, a first tape receiving groove 641 is provided in the central part of the mounting groove 64 of the upper socket 60, and a second tape receiving groove 742 is provided on the upper part of the socket contact portion 740 facing the first tape receiving groove 641, so that the adhesive tape 81 can also be provided in the first tape receiving groove 641 and the second tape receiving groove 742.

[0096] Thus, in the test apparatus 200 according to an embodiment of the present invention, the vacuum pickup 700 is attached to the mounting groove 64 of the upper socket 60 by means of adhesive tape 81 such as double-sided tape. Therefore, the vacuum pickup 700 can be easily attached to the upper socket 60, thereby increasing the convenience of attachment. If either the upper socket 60 or the vacuum pickup 700 malfunctions, only the malfunctioning part can be replaced, which has the effect of reducing replacement costs.

[0097] Then, the function of the test apparatus for the stacked package form of the semiconductor package according to an embodiment of the present invention is observed. Figure 5 The function of a test device used to illustrate the stacked packaging form of semiconductor packages.

[0098] like Figure 5 As shown in (a), the pusher 50 moves by the drive unit, and after the vacuum pickup 700 descends and picks up the lower package 10, the vacuum pickup 700 transports the picked-up lower package 10 onto the lower socket 40 and makes the lower terminal 11 of the lower package 10 contact the first conductive part 41 of the lower socket 40.

[0099] After that, as Figure 5As shown in (b), when the pusher 50 moves towards the lower socket 40, the vacuum pickup 700 is compressed, simultaneously pressurizing the lower package 10. Therefore, the lower terminal 11 of the lower package 10 connects with the first conductive part 41 of the lower socket 40. Through the movement of the pusher 50, the second conductive part 61 of the upper socket 60 connects to the upper terminal 12 of the lower package 10. At this time, the pressure applied by the pusher 50 is transmitted to the lower package 10 through the upper socket 60, thereby forming an electrical connection between the tester 30, the lower socket 40, the lower package 10, the upper socket 60, and the upper package 20. In this state, the test signal generated by the tester 30 is transmitted to the lower package 10 and the upper package 20. Therefore, electrical tests can be performed to determine whether the lower package 10 is functioning properly and whether it is well-matched with the upper package 20.

[0100] After the test is completed, the vacuum pickup 700 rises, and the lower package 10 adsorbed on the vacuum pickup 700 is easily unloaded from the lower socket 40 without sticking, according to the movement of the pusher 50, and operates in a manner that moves to the loading device (not shown). Thus, according to an embodiment of the semiconductor package testing apparatus of the present invention, even when testing semiconductor packages in a stacked package configuration, the lower package does not stick to the vacuum pickup, so the lower package after testing can be easily positioned on the loading device, and the overall testing process can be effectively performed.

[0101] The above description, relating to preferred embodiments used to illustrate the principles of the invention, illustrates and explains the invention. However, the invention is not limited to the configuration and function described and illustrated above. Those skilled in the art will readily understand that various changes and modifications can be made to the invention without departing from the spirit and scope of the appended claims.

Claims

1. A testing apparatus for semiconductor packaging, as a testing apparatus for a stacked semiconductor package, comprising a lower socket, an upper socket, a vacuum pickup, and adhesive tape, wherein the lower socket is mounted on a tester and connected to a lower package placed on the upper side; the upper socket is mounted on a pusher and mounts an upper package, connected to the lower package placed on the lower side; the vacuum pickup is coupled to the upper socket and is capable of adsorbing the lower package; the adhesive tape is located between the vacuum pickup and the upper socket, characterized in that... The upper socket has an insulating pad hole on its lower surface and a mounting groove spaced apart from and surrounding the insulating pad hole. The vacuum pickup has a vacuum port communicating with the insulating pad hole, and is configured to include a main body made of silicone or rubber, a socket contact portion connected to the portion of the main body facing the upper socket, and an encapsulation contact portion connected to the portion of the main body facing the lower encapsulation. The socket contact portion is at least partially located within the mounting groove and is attached to the underside of the mounting groove by the adhesive tape, such that the vacuum pickup is engaged with the upper socket. The socket contact portion and the encapsulation contact portion are formed of any one of the following materials: polyimide film, engineering plastic, or synthetic resin.

2. The semiconductor packaging testing apparatus according to claim 1, characterized in that, The adhesive tape has a width smaller than the width of the mounting groove, and the socket contact portion has the same width as the mounting groove.

3. The semiconductor packaging testing apparatus according to claim 1, characterized in that, The adhesive tape is attached to the central portion of the mounting groove.

4. The semiconductor packaging testing apparatus according to claim 1, characterized in that, A first tape receiving groove is formed in the central portion of the mounting groove, the first tape receiving groove accommodating a portion of the thickness of the adhesive tape.

5. The semiconductor packaging testing apparatus according to claim 1, characterized in that, A second tape receiving groove is formed on the upper central portion of the socket contact, the second tape receiving groove accommodating a portion of the thickness of the adhesive tape.

6. The semiconductor packaging testing apparatus according to claim 1, characterized in that, The depth of the mounting groove is greater than the thickness of the adhesive tape plus the socket contact portion.

7. The testing apparatus for semiconductor packaging according to claim 1, characterized in that, The area of ​​the encapsulation contact portion is more than 5% of the area of ​​the upper part of the lower encapsulation.

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