A compatible wafer clamping and handling device and method

Abstract

The application discloses a compatible wafer clamping and carrying device, which comprises an end finger and an end arm, the end finger is fixed in the end arm, the end arm comprises a fixing assembly and a moving assembly, the fixing assembly is fixed in the end arm, the moving assembly is slidably arranged in the fixing assembly, and a wafer fastener is arranged in the moving assembly; when the wafer size in the end finger is different, the moving assembly moves to different positions of the moving assembly to clamp wafers of different sizes. The application aims to provide a compatible wafer clamping and carrying device and method, which can clamp and carry wafers of multiple sizes, has strong compatibility and is convenient to adjust.

Description

Technical Field

[0001] This invention relates to the technical field of wafer handling, and more particularly to a compatible wafer clamping and handling device and method. Background Technology

[0002] As is well known, integrated circuit wafers are extremely thin, brittle, and easily contaminated. How to apply the appropriate clamping force to the wafer without damaging its surface material is the primary problem that wafer handling robots must solve in wafer processing. Currently, cleanroom robots in the semiconductor industry mainly handle conventional wafers using two main methods: mechanical clamping and suction clamping. Mechanical clamping primarily uses grippers to directly apply mechanical force to the wafer. Depending on the clamping method, there are various forms of mechanical clamping, such as three-jaw types, grippers with grooves to accommodate thin wafer edges, left-right opening types, and front-back opening types. These are mainly used in handling applications where contact between the front and back of the wafer is not allowed and where contamination requirements are high. Adsorption clamping can be divided into vacuum adsorption, Bernoulli adsorption, electrostatic adsorption, and intermolecular force adsorption, depending on the adsorption force generated. Among them, the most widely used vacuum adsorption mainly involves expelling the air between the chuck and the wafer, creating a pressure difference in the space between the two to stably hold the wafer against the chuck. It is mainly used in handling applications where the front and back of the wafer can be contacted and the requirements for contamination are not high.

[0003] With the rapid development of high-end integrated circuit wafer manufacturing, there is an increasing number of process equipment capable of handling wafers of various sizes and specifications. This necessitates that wafer handling robots possess the ability to handle wafers of multiple sizes and specifications, specifically, that the end effector of the wafer handling robot can be compatible with the clamping of wafers of various sizes. Currently, the industry mainly uses adsorption-type clamping end effectors for handling multi-size wafers where contact with both sides of the wafer is possible and contamination requirements are not high. However, for multi-size wafers where contact with both sides is not allowed and contamination requirements are high, different sizes of wafers have different diameters and corresponding carrier sizes. Currently, using mechanical clamping methods, one end effector can only correspond to one size of wafer. When changing the wafer clamping and handling requirements from one size to another, it is only possible to replace the hardware of the corresponding wafer end effector. This not only causes inconvenience for on-site assembly and debugging but also provides a poor user experience, highlighting the problem of not being able to automatically switch hardware to be compatible with the clamping and handling of different multi-size wafers. Summary of the Invention

[0004] This invention aims to at least partially solve one of the problems in related technologies. Therefore, the object of this invention is to provide a compatible wafer clamping and handling device and method capable of clamping and handling wafers of various sizes, with strong compatibility and convenient adjustment.

[0005] To achieve the above objectives, this application adopts the following technical solution: a compatible wafer clamping and handling device, comprising: a terminal finger and a terminal arm, wherein the terminal finger is fixed in the terminal arm;

[0006] The end effector includes a fixed component and a movable component. The fixed component is fixed in the end effector, and the movable component is slidably disposed in the fixed component. The movable component is provided with a wafer fastener. When the wafers in the end effector are of different sizes, the movable component moves to different positions to clamp wafers of different sizes.

[0007] Furthermore, a wafer stop is provided on the side of the distal finger away from the distal arm;

[0008] The wafer fastener includes a clamping cylinder and a roller fixed to the end of the clamping cylinder;

[0009] When the clamping cylinder extends, the rollers and wafer stops abut against both ends of the wafer to clamp it; when the clamping cylinder retracts, the rollers maintain a gap with the wafer to release it.

[0010] Furthermore, the distance between the roller and the end finger is less than the thickness of the wafer.

[0011] Furthermore, the wafer fastener also includes a clamping photoelectric baffle and a clamping photoelectric switch, wherein the clamping photoelectric baffle is fixedly connected to the output end of the clamping cylinder, and the clamping photoelectric switch is located on the side of the clamping cylinder;

[0012] When the clamping cylinder extends, the clamping photoelectric switch and the clamping photoelectric baffle are misaligned; when the clamping cylinder retracts, the clamping photoelectric switch and the clamping photoelectric baffle coincide.

[0013] Furthermore, the clamping photoelectric switch includes a clamping receiver and a clamping transmitter, which are respectively fixed in the moving assembly, and the line connecting the clamping receiver and the clamping transmitter is perpendicular to the extension and retraction direction of the clamping cylinder.

[0014] One end of the clamping photoelectric baffle is fixed to the output end of the clamping cylinder, and the other end extends between the clamping receiving end and the receiving transmitting end.

[0015] Furthermore, the output end of the clamping cylinder is connected to the roller via a cylinder shaft connector. One end of the roller is fixedly connected to the cylinder shaft connector, and the other end extends toward the end finger and is rotatably connected to the roller.

[0016] Furthermore, the moving component includes a moving housing, and the fixing component includes a fixing housing. An adjusting cylinder and a guide rail are disposed inside the fixing housing. The output end of the adjusting cylinder is connected to the moving housing. The moving housing is located in the guide rail. The adjusting cylinder can drive the moving housing to slide along the guide rail. The extension direction of the guide rail is parallel to the line connecting the distal finger and the distal arm.

[0017] Furthermore, the bottom of the moving component is provided with an adjustable photoelectric baffle, and the fixed component is provided with an adjustable photoelectric switch. When the moving component moves along the slide rail to a position close to the end finger, it causes the adjustable photoelectric baffle to block the adjustable photoelectric switch; when the moving component moves along the slide rail to a position away from the end finger, it causes the adjustable photoelectric baffle to avoid the adjustable photoelectric switch.

[0018] Furthermore, the distal finger is provided with a wafer support block, which includes a wafer stop block, a middle support block, and a rear support block; the wafer stop block is located on the side of the distal finger away from the distal arm, the rear support block is located on the side of the distal finger closer to the distal arm, and the middle support block is located between the wafer stop block and the rear support block.

[0019] A compatible wafer clamping and handling method, characterized in that it is based on a compatible wafer clamping and handling device as described above, comprising:

[0020] Based on the wafer size, determine the position of the moving component relative to the fixed component, so that the distance between the wafer fastener and the end finger in the moving component is adapted to the wafer size;

[0021] When the wafer is placed on the end finger, the wafer fastener clamps the edge of the wafer.

[0022] Compared with the prior art, the technical solution provided in this application has the following advantages: The wafer clamping and handling device of this application includes a terminal finger and a terminal arm, with the terminal finger fixed in the terminal arm. The terminal arm includes a fixed component and a movable component. The fixed component is fixed in the terminal arm, and the movable component is slidably disposed in the fixed component. A wafer fastener is disposed in the movable component. When the wafers in the terminal finger have different sizes, the movable component moves to different positions to clamp wafers of different sizes. This application determines the position of the movable component relative to the fixed component based on the wafer size, so that the distance between the wafer fastener and the terminal finger in the movable component is adapted to the wafer size. When the wafer is placed on the terminal finger, the wafer fastener clamps the edge of the wafer. This application can achieve clamping and handling of wafers of various sizes, has strong compatibility, and can be widely applied to the handling of wafers of different sizes from 2 to 12 inches. It is easy to adjust and has a wide range of applicable industries, including the IC industry and other semiconductor industries such as LED. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Appendix Figure 1 This is an axial view of the wafer clamping and handling device of the present invention;

[0026] Appendix Figure 2 This is a partial view of the wafer clamping and handling device of the present invention;

[0027] Appendix Figure 3 This is an exploded view of the wafer clamping and handling device of the present invention;

[0028] Appendix Figure 4 This is an axial view of the wafer fastener in this invention;

[0029] Appendix Figure 5 This is a front-axis side view of the 12-inch wafer clamping device of the present invention;

[0030] Appendix Figure 6 This is a side view of the 12-inch wafer clamped in this invention.

[0031] Appendix Figure 7This is a front-axis side view of the present invention clamping an 8-inch wafer;

[0032] Appendix Figure 8 This is a side view of the 8-inch wafer clamped in this invention.

[0033] Reference numerals: 1. End arm; 2. End finger; 3. Wafer stop; 4. Middle support block; 5. Rear support block; 6. Fixing component; 7. Moving component; 8. Fixing housing; 9. Decorative cover; 10. Guide rail; 11. Adjusting cylinder; 12. Adjusting photoelectric switch; 13. Moving housing; 14. Cylinder shaft connector; 15. Adjusting photoelectric baffle; 16. Wafer fastener; 17. Cover plate; 18. Clamping cylinder; 19. Clamping photoelectric baffle; 20. Clamping photoelectric switch; 21. Switch fixing plate; 22. Moving connector; 23. Roller; 24. Roller; 25. 12-inch wafer; 26. 8-inch wafer. Detailed Implementation

[0034] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0035] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0036] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0037] Example 1

[0038] Please see Figures 1-8 This application provides a compatible wafer clamping and handling device, comprising: a terminal finger 2 and a terminal arm 1, wherein the terminal finger 2 is fixed in the terminal arm 1;

[0039] The end arm 1 includes a fixed component 6 and a movable component 7. The fixed component 6 is fixed in the end arm 1, and the movable component 7 is slidably disposed in the fixed component 6. The movable component 7 is provided with a wafer fastener 16. When the wafer size in the end finger 2 is different, the movable component 7 moves to different positions to achieve clamping of wafers of different sizes.

[0040] This application determines the position of the moving component 7 relative to the fixed component 6 based on the wafer size, such that the distance between the wafer fastener 16 and the end finger 2 in the moving component 7 is adapted to the wafer size; when the wafer is placed on the end finger 2, the wafer fastener 16 clamps the edge of the wafer. This application can realize the clamping and handling of wafers of various sizes, has strong compatibility, and can be widely used in the handling of wafers of different sizes from 2 to 12 inches. It is easy to adjust and has a wide range of applicable industries, including the IC industry and other semiconductor industries such as LED.

[0041] Example 2

[0042] Please see Figures 1-8 This application provides a compatible wafer clamping and handling device, comprising: a terminal finger 2 and a terminal arm 1, wherein the terminal finger 2 is fixed in the terminal arm 1;

[0043] The end arm 1 includes a fixed component 6 and a movable component 7. The fixed component 6 is fixed in the end arm 1, and the movable component 7 is slidably disposed in the fixed component 6. The movable component 7 is provided with a wafer fastener 16. When the wafer size in the end finger 2 is different, the movable component 7 moves to different positions to achieve clamping of wafers of different sizes.

[0044] Furthermore, in this application, a wafer stop 3 is provided on the side of the distal finger 2 away from the distal arm 1; when the wafer is placed in the distal finger 2, the wafer stop 3 abuts against the edge of the wafer.

[0045] The wafer fastener 16 includes a clamping cylinder 18 and a roller 24 fixed to the end of the clamping cylinder 18; the extension and retraction direction of the clamping cylinder 18 is parallel to the plane where the wafer is located. When the clamping cylinder 18 extends, the roller 24 and the wafer stop 3 respectively abut against both ends of the wafer to clamp the wafer; when the clamping cylinder 18 retracts, the roller 24 maintains a gap with the wafer to release the wafer. In this application, the wafer fastener 16 and the wafer stop 3 respectively clamp the two ends of the wafer's edge, thereby realizing the clamping and releasing of the wafer.

[0046] In this application, the distance between the roller 24 and the end finger 2 is less than the thickness of the wafer. When the wafer is placed on the end finger 2, the clamping cylinder 18 extends and retracts, causing the roller 24 to move towards or away from the wafer. The roller 24 abuts against the edge of the wafer and will not move beyond the upper or lower surface of the wafer to the center of the wafer.

[0047] Furthermore, the wafer fastener 16 in this application also includes a clamping photoelectric baffle 15 and a clamping photoelectric switch 20. The clamping photoelectric baffle 15 is fixedly connected to the output end of the clamping cylinder 18, and the clamping photoelectric switch 20 is located on the side of the clamping cylinder 18. When the clamping cylinder 18 extends, the clamping photoelectric switch 20 and the clamping photoelectric baffle 15 are misaligned. When the clamping cylinder 18 retracts, the clamping photoelectric switch 20 and the clamping photoelectric baffle 15 overlap.

[0048] Specifically, the clamping photoelectric switch 20 includes a clamping receiving end and a clamping transmitting end. The clamping receiving end and the clamping transmitting end are respectively fixed in the moving assembly 7 by the switch fixing plate 21, and the line connecting the clamping receiving end and the clamping transmitting end is perpendicular to the extension and retraction direction of the clamping cylinder 18. One end of the clamping photoelectric baffle 15 is fixed to the output end of the clamping cylinder 18, and the other end extends between the clamping receiving end and the receiving and transmitting end.

[0049] Specifically, in this application, the movable component 7 includes a movable housing 13, and a wafer fastener 16 is fixed in the movable housing 13 by screws. A cylinder is fixed in the movable housing 13, and the clamping receiver and the receiving / transmitting end are fixed in the movable housing 13 by screws. One end of the clamping photoelectric baffle 15 is fixed to the output end of the cylinder by screws, and the other end extends between the clamping receiver and the receiving / transmitting end. The output end of the clamping cylinder 18 is connected to a roller 23 through a cylinder shaft connector 14. The roller 23 extends toward the distal finger 2, and the other end of the roller 23 is provided with a rotatable roller 24. That is, the roller 24 can rotate relative to the roller 23, and the direction of rotation is parallel to the plane where the wafer is located in the distal finger 2.

[0050] When the clamping cylinder 18 extends, the roller 24 extends along with the output end of the clamping cylinder 18, and the roller 24 and the wafer stop block 3 on the end finger 2 respectively abut against the front and rear ends of the wafer to achieve wafer clamping; at this time, the clamping photoelectric stop 15 and the clamping photoelectric stop 15 are misaligned, that is, the clamping receiver can receive the signal emitted by the clamping transmitter.

[0051] When the clamping cylinder 18 retracts, the roller 24 retracts along with the output end of the clamping cylinder 18, maintaining a gap between the roller 24 and the wafer, thus releasing the wafer. At this time, the clamping photoelectric switch 20 and the clamping photoelectric baffle 15 coincide, meaning the clamping receiver cannot receive the signal emitted by the clamping transmitter. This application can determine whether the wafer is in a clamped or released state based on the signal from the clamping receiver.

[0052] Furthermore, in this application, the fixing component 6 includes a fixing housing 8, inside which an adjusting cylinder 11 and a guide rail 10 are provided. The output end of the adjusting cylinder 11 is connected to the moving housing 13 through a movable connector 22. The moving housing 13 is located in the guide rail 10, and the adjusting cylinder 11 can drive the moving housing 13 to slide along the guide rail 10.

[0053] The extension direction of the guide rail 10 is parallel to the line connecting the distal finger 2 and the distal arm 1. When the wafer size is small, such as Figure 7 and 8 As shown, the wafer is 8 inches in size. At this time, the adjusting cylinder 11 drives the moving housing 13 to move towards the end finger 2, so that the distance between the moving component 7 and the wafer stop 3 is small. If the clamping cylinder 18 is in the retracted state, the distance between the roller 24 and the wafer stop 3 is greater than the wafer diameter. If the clamping cylinder 18 is in the extended state, the distance between the roller 24 and the wafer stop 3 is equal to the wafer diameter.

[0054] A decorative cover 9 is provided at the position where the top of the fixed housing 8 is misaligned with the movable housing 13, and a cover plate 17 is provided on the top of the movable housing 13.

[0055] When the wafer size is large, such as Figure 5 and 6 As shown, the wafer is 12 inches in size. At this time, the adjusting cylinder 11 drives the moving housing 13 to move away from the end finger 2, so that the distance between the moving component 7 and the wafer stop 3 is larger. If the clamping cylinder 18 is in the retracted state, the distance between the roller 24 and the wafer stop 3 is greater than the wafer diameter. If the clamping cylinder 18 is in the extended state, the distance between the roller 24 and the wafer stop 3 is equal to the wafer diameter.

[0056] In this application, the adjusting cylinder 11 and the guide rail 10 can also be other combinations that can achieve this function, such as lead screw and guide rail 10, electric cylinder and linear bearing, which will not be listed here.

[0057] In this application, the bottom of the movable component 7 is provided with an adjustable photoelectric baffle 15, and the fixed component 6 is provided with an adjustable photoelectric switch 12 corresponding to the position of the adjustable photoelectric baffle 15. Here, the position correspondence means that if the adjustable photoelectric baffle 15 is located on the bottom left side of the movable housing 13, then the adjustable photoelectric switch 12 is located on the top left side of the fixed housing 8.

[0058] Specifically, the adjustable photoelectric switch 12 includes an adjustable transmitter and an adjustable receiver. When the moving component 7 moves along the slide rail to a position close to the distal finger 2, it causes the adjustable photoelectric baffle 15 to be positioned between the adjustable transmitter and the adjustable receiver. At this time, the adjustable receiver cannot receive the signal emitted by the adjustable transmitter. When the moving component 7 moves along the slide rail to a position away from the distal finger 2, it causes the adjustable photoelectric baffle 15 to be positioned outside the adjustable transmitter and the adjustable receiver. At this time, the adjustable receiver can receive the signal emitted by the adjustable transmitter. This application can determine the sliding position of the moving component 7 relative to the fixed component 6 based on the received signal from the adjustable receiver. For example, it can determine whether the moving component 7 is located at an 8-inch wafer position or a 12-inch wafer position.

[0059] In this application, the distal finger 2 is provided with a wafer support block, which includes a wafer stop block 3, a middle support block 4, and a rear support block 5. The wafer stop block 3 is located on the side of the distal finger 2 away from the distal arm 1, the rear support block 5 is located on the side of the distal finger 2 closer to the distal arm 1, and the middle support block 4 is located between the wafer stop block 3 and the rear support block 5. Regardless of the wafer size, the front end of the wafer always abuts against the wafer stop block 3, such as... Figure 5 and 6 As shown, when the wafer is 8 inches, it is positioned on the middle support block 4, maintaining a distance from the rear support block 5. Figure 7 and 8 As shown, when the wafer is 12 inches, the center of the wafer is located on the middle support block 4, and the rear end of the wafer is located on the rear support block 5. The wafer is clamped by the clamping cylinder 18 driving the roller 24 to move to the position where it abuts against the rear end of the wafer, and the wafer edge is clamped by the wafer stop block 3 and the roller 24.

[0060] This application provides a compatible wafer clamping and handling method, comprising: determining the position of a moving component 7 relative to a fixed component 6 according to the size of the wafer, such that the distance between the wafer fastener 16 in the moving component 7 and the end finger 2 is adapted to the size of the wafer; when the wafer is placed on the end finger 2, the wafer fastener 16 clamps the edge of the wafer.

[0061] Specifically, when a 12-inch wafer 25 needs to be clamped and moved, the moving component 7 remains stationary relative to the fixed component 6. At this time, the moving component 7 is located at a position far from the wafer stop 3. The adjustment receiver can receive the signal emitted by the adjustment transmitter, indicating that the moving component 7 is fixed and has not moved. The clamping cylinder 18 extends, driving the roller 24 towards the end finger 2 until the roller 24 abuts against the rear edge of the wafer. At this time, the clamping receiver can receive the signal emitted by the clamping transmitter, indicating that the 12-inch wafer 25 is in a clamped state. The clamping cylinder 18 retracts, driving the roller 24 away from the end finger 2 until the roller 24 maintains a certain distance from the wafer. At this time, the clamping receiver can no longer receive the signal emitted by the clamping transmitter, indicating that the 12-inch wafer 25 is in a released state.

[0062] When it is necessary to clamp and move the 8-inch wafer 26, the adjusting cylinder 11 drives the moving component 7 to move along the slide rail towards the end finger 2; at this time, the moving component 7 is located close to the wafer stop 3. At this time, the adjusting receiver cannot receive the signal emitted by the adjusting transmitter, indicating that the moving component 7 has moved forward. The clamping cylinder 18 extends, driving the roller 24 towards the end finger 2 until the roller 24 abuts against the rear edge of the wafer. At this time, the clamping receiver can receive the signal emitted by the clamping transmitter, indicating that the 8-inch wafer 26 is in a clamped state. The clamping cylinder 18 retracts, driving the roller 24 away from the end finger 2 until the roller 24 maintains a certain distance from the wafer. At this time, the clamping receiver cannot receive the signal emitted by the clamping transmitter, indicating that the 8-inch wafer 26 is in a released state.

[0063] The wafers transferred in this application are not limited to wafers used in silicon-based semiconductors and compound semiconductors, but can also be wafers from other industries that are made of materials such as sapphire and quartz and have a shape similar to wafers.

[0064] In this application, the wafer block 3 has the function of being used by wafers of various sizes and specifications. Its shape and structure are not limited to those shown in the attached drawings. It can also be a spiral tower type or other forms that can achieve the sharing of wafers of different sizes and specifications in terms of height.

[0065] The form and structure of the wafer fastener 16 in this application are not limited to those shown in the accompanying drawings, and may also be other structural forms with the same wafer clamping function.

[0066] The wafer clamping and handling device described in this application is not limited to the integrated circuit industry, but can also be applied to other semiconductor industries, such as flat panel displays, LEDs, and solar cells.

[0067] The wafer clamping and handling device of this application is not limited to combinations of 8-inch and 12-inch wafers; it can also handle wafers of other sizes from 2 to 8 inches and their combinations. Furthermore, the increased number of compatible wafers achieved based on the design theory of this invention is also included.

[0068] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A compatible wafer clamping and handling device, characterized in that, include: The device comprises an end finger (2) and an end arm (1), wherein the end finger (2) is fixed in the end arm (1); the end arm (1) includes a fixing component (6) and a moving component (7), wherein the fixing component (6) is fixed in the end arm (1), and the moving component (7) is slidably disposed in the fixing component (6), and a wafer fastener (16) is disposed in the moving component (7); when the wafer size in the end finger (2) is different, the moving component (7) moves to different positions of the moving component (7) to achieve clamping of wafers of different sizes, wherein a wafer stop block (3) is disposed on the side of the end finger (2) away from the end arm (1); the wafer fastener (16) includes a clamping cylinder (18) and a roller (24) fixed to the end of the clamping cylinder (18); when the clamping cylinder (18) extends, the roller (24) and the wafer stop block (3) respectively The roller (24) abuts against both ends of the wafer to clamp the wafer; when the clamping cylinder (18) retracts, the roller (24) maintains a gap with the wafer to release the wafer; the moving component (7) includes a moving housing (13), and the fixing component (6) includes a fixing housing (8). The fixing housing (8) is provided with an adjusting cylinder (11) and a guide rail (10). The output end of the adjusting cylinder (11) is connected to the moving housing (13). The moving housing (13) is placed on the guide rail (10). The extension direction of the guide rail (10) is parallel to the line connecting the end finger (2) and the end arm (1). The adjusting cylinder (11) can drive the moving housing (13) to slide along the guide rail (10) toward the wafer stop (3) and carry the wafer fastener (16) to extend and retract to adjust the initial distance between the roller (24) and the wafer stop (3).

2. The compatible wafer clamping and handling device according to claim 1, characterized in that, The distance between the roller (24) and the end finger (2) is less than the thickness of the wafer.

3. The compatible wafer clamping and handling device according to claim 1, characterized in that, The wafer fastener (16) also includes a clamping photoelectric baffle (19) and a clamping photoelectric switch (20). The clamping photoelectric baffle (19) is fixedly connected to the output end of the clamping cylinder (18), and the clamping photoelectric switch (20) is located on the side of the clamping cylinder (18). When the clamping cylinder (18) extends, the clamping photoelectric switch (20) and the clamping photoelectric baffle (19) are misaligned. When the clamping cylinder (18) retracts, the clamping photoelectric switch (20) and the clamping photoelectric baffle (19) overlap.

4. A compatible wafer clamping and handling device according to claim 3, characterized in that, The clamping photoelectric switch (20) includes a clamping receiving end and a clamping transmitting end, which are respectively fixed in the moving component (7), and the line connecting the clamping receiving end and the clamping transmitting end is perpendicular to the extension and retraction direction of the clamping cylinder (18); one end of the clamping photoelectric baffle (19) is fixed to the output end of the clamping cylinder (18), and the other end extends between the clamping receiving end and the receiving and transmitting end.

5. A compatible wafer clamping and handling device according to claim 1, characterized in that, The output end of the clamping cylinder (18) is connected to the roller (23) through the cylinder shaft connector (14). One end of the roller (23) is fixedly connected to the cylinder shaft connector (14), and the other end extends toward the end finger (2) and is rotatably connected to the roller (24).

6. A compatible wafer clamping and handling device according to claim 1, characterized in that, The bottom of the moving component (7) is provided with an adjustable photoelectric baffle (15), and the fixed component (6) is provided with an adjustable photoelectric switch (12). When the moving component (7) moves along the slide rail to a position close to the end finger (2), it causes the adjustable photoelectric baffle (15) to block the adjustable photoelectric switch (12); when the moving component (7) moves along the slide rail to a position away from the end finger (2), it causes the adjustable photoelectric baffle (15) to avoid the adjustable photoelectric switch (12).

7. A compatible wafer clamping and handling device according to claim 1, characterized in that, The distal finger (2) is provided with a wafer support block, which includes a wafer stop block (3), a middle support block (4) and a rear support block (5); the wafer stop block (3) is located on the side of the distal finger (2) away from the distal arm (1), the rear support block (5) is located on the side of the distal finger (2) close to the distal arm (1), and the middle support block (4) is located between the wafer stop block (3) and the rear support block (5).

8. A compatible wafer clamping and handling method, characterized in that, The device is based on any one of claims 1-7 and includes: determining the position of the moving component (7) relative to the fixed component (6) according to the size of the wafer, such that the distance between the wafer fastener (16) and the end finger (2) in the moving component (7) is adapted to the size of the wafer; when the wafer is placed on the end finger (2), the wafer fastener (16) clamps the edge of the wafer.

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