Far-field voice module and display device
Patent Information
- Application Number
- CN202211313451.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-25
- Publication Date
- 2026-10-13
- Estimated Expiration
- 2042-10-25
AI Technical Summary
[0002]在相关技术中,例如电视机等电子设备在设有多种功能模块时,各种功能模块分散布置于设备的不同位置;每种功能模块均需采用相应的安装结构进行安装固定,导致安装结构数量较多而安装步骤繁复
[0019]本申请实施例通过将多种功能模块集成于远场语音模组的线路板上,利用该线路板上的空间对上述多种功能模块的线路进行布局、利用麦克风模块在线路板上的电子装配工艺环节一并实现对上述多种功能模块的电子装配,并由远场语音模组的模组壳体对上述线路板和多种功能模块进行盖合保护、无需额外增加封装壳体结构,相反可以取消各种功能模块原所配置的封装壳体结构和安装结构,进而节约结构成本和安装成本,提高安装效率。
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Figure CN117119339B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic equipment technology, specifically to a far-field voice module and display device. Background Technology
[0002] In related technologies, such as television sets and other electronic devices, when multiple functional modules are provided, these modules are distributed in different locations on the device. Each functional module requires a corresponding installation structure for installation and fixation, resulting in a large number of installation structures and complicated installation steps. Summary of the Invention
[0003] This application provides a far-field voice module and display device, which can reduce the internal installation structure of electronic devices.
[0004] On one hand, this application provides a far-field voice module, including: a module housing having an inner cavity and a sound guiding channel, the sound guiding channel having an outer opening end and an inner opening end, the outer opening end being disposed on the outer surface of the module housing, and the inner opening end being disposed within the inner cavity; and a hardware circuit disposed within the inner cavity, the hardware circuit including a circuit board and various functional modules disposed on the circuit board; the various functional modules including a microphone module, the inner opening end of the sound guiding channel facing the sound inlet of the microphone module.
[0005] In some embodiments, the acoustic cavity includes a first acoustic cavity segment and a second acoustic cavity segment connected in sequence, wherein the first acoustic cavity segment and the second acoustic cavity segment are perpendicular to each other or inclined at an angle.
[0006] In some embodiments, the outer opening end is located at one end of the first sound-guiding cavity segment away from the second sound-guiding cavity segment; along the direction from the outer opening end toward the second sound-guiding cavity segment, the sound-guiding cross section of the first sound-guiding cavity segment decreases.
[0007] In some embodiments, the number of acoustic cavities and the number of microphone modules are equal, and they are configured in a one-to-one correspondence.
[0008] In some embodiments, the far-field voice module further includes a flexible adhesive member, which is at least bonded between the inner cavity surface of the module housing and the back side region of the area on the circuit board where the microphone module is located; the flexible adhesive member has a first sound passage hole, the circuit board has a second sound passage hole, and the inner opening end, the first sound passage hole, the second sound passage hole and the sound inlet hole of the microphone module are connected in sequence.
[0009] In some embodiments, a connecting boss is provided on the inner cavity surface of the module housing, the circuit board is disposed on the connecting boss, and the flexible adhesive is bonded between the connecting boss and the circuit board.
[0010] In some embodiments, one of the connecting boss and the circuit board is provided with a positioning protrusion, and the other is provided with a positioning recess, wherein the positioning protrusion and the positioning recess are configured for insertion positioning.
[0011] In some embodiments, the multiple functional modules further include a switch module configured to control the switching of the microphone module; the switch module includes a switch device and a transmission control component, the switch device is disposed on the circuit board, the transmission control component has a transmission part and a control part, the transmission part is connected and driven to the switch device, and the control part extends to the outside of the module housing.
[0012] In some embodiments, the module housing is provided with a connection through hole and a limiting protrusion. The transmission control member passes through the connection through hole, and the limiting protrusion is disposed around the connection through hole on the inner cavity surface of the module housing. The area on the circuit board where the switching device is disposed or the back side area of the area is pressed onto the limiting protrusion.
[0013] In some embodiments, the limiting protrusion includes a plurality of limiting protrusion sub-parts, which are arranged sequentially at intervals around the connecting through hole.
[0014] In some embodiments, a flange portion is provided between the two ends of the transmission control member along its extension direction, and the flange portion is movably held between the inner cavity surface of the circuit board and the module housing with the transmission control member.
[0015] In some embodiments, a lateral limiting portion is provided on the inner cavity surface of the module housing, and the transmission control member can drive the switching device to switch the switching state along a first direction. The transmission portion and the lateral limiting portion are located on opposite sides of the transmission control member along a second direction, and the first direction and the second direction are perpendicular to each other.
[0016] In some embodiments, the circuit board has an arrangement side and a back side arranged opposite to each other along its thickness direction, the various functional modules are disposed on the arrangement side of the circuit board, and the back side of the circuit board is disposed on the inner cavity surface of the module housing.
[0017] In some embodiments, the plurality of functional modules further include at least one of a Bluetooth module, a WiFi module, an infrared communication module, a mechanical control module, a switch module, an indicator light module, and a light sensor module.
[0018] On the other hand, this application provides a display device including the far-field voice module provided in any of the above embodiments, wherein the outer opening end of the sound guiding cavity is connected to the outside of the display device.
[0019] This application embodiment integrates multiple functional modules onto the circuit board of the far-field voice module. The space on the circuit board is used to lay out the circuits of the above-mentioned functional modules. The electronic assembly of the above-mentioned functional modules is achieved in the electronic assembly process of the microphone module on the circuit board. The module housing of the far-field voice module covers and protects the circuit board and the above-mentioned functional modules. There is no need to add an additional encapsulation housing structure. On the contrary, the original encapsulation housing structure and mounting structure of various functional modules can be eliminated, thereby saving structural and installation costs and improving installation efficiency. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is an exploded view of the far-field voice module provided in some embodiments of this application;
[0022] Figure 2 This is an isometric structural diagram of the module housing of a far-field voice module provided in some embodiments of this application;
[0023] Figure 3 This is a cross-sectional structural diagram of the module housing of a far-field voice module provided in some embodiments of this application;
[0024] Figure 4 This is a partial cross-sectional view of a far-field voice module provided in some embodiments of this application.
[0025] Explanation of key component symbols:
[0026] 1-Far-field voice module, 10-Module housing, 11-Inner cavity, 12-Sound guide channel, 121-First sound guide segment, 122-Second sound guide segment, 12a-Outer opening end, 12b-Inner opening end, 13-Connecting boss, 131-Positioning protrusion, 14-Connecting through hole, 15-Limiting protrusion, 151-Limiting protrusion sub-part, 16-Lateral limiting part, 17-Protruding column, 18-Supporting rib, 20-Hardware circuit, 21-Circuit board, 21 1-Second sound passage hole, 212-Positioning recess, 21a-Arrangement side, 21b-Back side, 22-Functional module, 22a-Microphone module, 22b-Switch module, 22c-Indicator light module, 22d-Mechanical control module, 221-Switch device, 222-Transmission control component, 2221-Transmission part, 2222-Control part, 2223-Flange part, 30-Flexible adhesive part, 31-First sound passage hole, 40-Light guide plate, 41-Silicone printing position. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0029] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.
[0030] The use of "applies to" or "configured to" in this application implies open and inclusive language, which does not exclude the applicability to or configuration to devices performing additional tasks or steps. Additionally, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values may in practice be based on additional conditions or values beyond those stated.
[0031] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.
[0032] In related technologies, electronic devices such as televisions often require multiple functional modules, including Bluetooth, WiFi, and infrared communication modules. Due to structural limitations or functional needs, these modules are distributed across different locations within the electronic device. Each module requires a corresponding mounting structure for installation and fixation, potentially involving various structural forms such as threaded fastening, snap-fit connections, and riveting. This results in a large variety and number of mounting structures and complex installation steps, requiring installers to spend considerable time on installation and fixation, leading to low installation efficiency.
[0033] This application provides a far-field voice module 1, which includes a module housing 10 and hardware circuitry 20, reducing the internal installation structure of electronic devices. Here, the far-field voice module 1 can be applied to various electronic devices such as televisions and Customer Premise Equipment (CPE), meeting the far-field voice function requirements of the corresponding electronic devices.
[0034] like Figures 1-4As shown, the module housing 10 has an inner cavity 11 and a sound guiding channel 12. The sound guiding channel 12 has an outer opening end 12a and an inner opening end 12b. The outer opening end 12a is located on the outer surface of the module housing 10, and the inner opening end 12b is located inside the inner cavity 11. Here, the outer opening end 12a of the sound guiding channel 12 can be connected to the outside of the device where the far-field voice module 1 is located, so that the voice signal emitted by the far / near field sound source can be transmitted to the inner cavity 11 of the module housing 10 through the sound guiding channel 12, thereby recognizing and responding to the voice signal.
[0035] The hardware circuit 20 is disposed in the inner cavity 11, including a circuit board 21 and various functional modules 22 disposed on the circuit board 21. Here, the various functional modules 22 include a microphone module 22a, with the inner opening end 12b of the sound guide cavity 12 facing the sound inlet of the microphone module 22a. In this way, the voice signal can be transmitted to the microphone module 22a through the sound guide cavity 12, and the microphone module 22a converts it into an electrical signal for recognition and response, thereby realizing far-field voice function.
[0036] Compared with related technologies, the embodiments of this application integrate multiple functional modules 22 onto the circuit board 21 of the far-field voice module 1. The circuits of the multiple functional modules 22 are laid out using the space on the circuit board 21. The electronic assembly of the multiple functional modules 22 is achieved in the same process as the electronic assembly of the microphone module 22a on the circuit board 21. The module housing 10 of the far-field voice module 1 covers and protects the circuit board 21 and the multiple functional modules 22. There is no need to add an additional encapsulation housing structure. On the contrary, the original encapsulation housing structure and mounting structure of the various functional modules 22 can be eliminated, thereby saving structural costs and installation costs and improving installation efficiency.
[0037] The structure of the sound guide cavity 12 can be determined according to actual needs, and can be of types such as straight cavity or curved cavity. This application embodiment does not limit this. In some embodiments, the sound guide cavity 12 may include a first sound guide cavity segment 121 and a second sound guide cavity segment 122 connected in sequence, the first sound guide cavity segment 121 and the second sound guide cavity segment 122 being perpendicular to each other or inclined at an angle. In this way, the propagation direction of the voice signal along the first sound guide cavity segment 121 and the second sound guide cavity segment 122 is different, increasing the flexibility of the position setting of the microphone module 22a and the external opening end 12a, and reducing the design difficulty.
[0038] In some examples, the outer opening 12a may be located at the end of the first acoustic cavity segment 121 away from the second acoustic cavity segment 122, so that the end of the first acoustic cavity segment 121 away from the second acoustic cavity segment 122 can face the outside of the module housing 10, allowing voice signals outside the module housing 10 to enter the first acoustic cavity segment 121 through the outer opening 12a. For example, the inner opening 12b may be located at the end of the second acoustic cavity segment 122 away from the first acoustic cavity segment 121, allowing voice signals to be transmitted to the microphone module 22a via the second acoustic cavity segment 122.
[0039] Based on the aforementioned acoustic cavity 12 configuration, the far-field voice module 1 can be mounted on one side of a display device, such as a television. The length direction of the far-field voice module 1 can be parallel to the side of the display device, the width direction of the far-field voice module 1 can be parallel to the thickness direction of the display device, and the thickness direction of the far-field voice module 1 can be parallel to the vertical side of the side of the display device. The outer opening end 12a of the far-field voice module 1 can be opened forward along the display direction of the display device and face the user located in front of the display device. Furthermore, the far-field voice module 1 protrudes beyond the display area of the display device along its thickness direction. Here, the thickness direction of the display device is the direction connecting the display side and the back side 21b of the display device.
[0040] For example, the far-field voice module 1 can be disposed on the long side of the display device. Accordingly, the length direction of the far-field voice module 1 can be parallel to the long side of the display device, the width direction of the far-field voice module 1 can be parallel to the thickness direction of the display device, and the thickness direction of the far-field voice module 1 can be parallel to the wide side of the display device, while the outer opening end 12a of the far-field voice module 1 faces the front of the display device. Alternatively, the far-field voice module 1 can be disposed on the wide side of the display device. Accordingly, the length direction of the far-field voice module 1 can be parallel to the wide side of the display device, the width direction of the far-field voice module 1 can be parallel to the thickness direction of the display device, and the thickness direction of the far-field voice module 1 can be parallel to the long side of the display device, while the outer opening end 12a of the far-field voice module 1 still faces the front of the display device.
[0041] In this way, when the far-field voice module 1 adopts a thin design and has a small thickness, the size of the far-field voice module 1 protruding outside the display area of the display device can be equal to the thickness of the far-field voice module 1, avoiding a small outward protrusion of the far-field voice module 1, thus making the display device have a more compact and smooth shape; and the outer opening end 12a of the far-field voice module 1 always faces the front of the display device, so that the outer opening end 12a can directly receive the voice signal located in front of the display device, thereby ensuring the accuracy, response sensitivity and response precision of the far-field voice module in recognizing the sound source located in front of the display device, and achieving better far-field voice control function effect.
[0042] For example, along the direction from the outer opening end 12a towards the second sound-guiding cavity section 122, the sound-guiding cross-section of the first sound-guiding cavity section 121 can decrease in size; here, the sound-guiding cross-section of the first sound-guiding cavity section 121 is a cross-section through which a voice signal can pass. Thus, the sound-guiding cross-sectional area at the end of the first sound-guiding cavity section 121 near the outer opening end 12a is larger, increasing the contact area between the first sound-guiding cavity section 121 and the environment outside the module housing 10, making it more difficult for voice signals from external sound sources to enter the first sound-guiding cavity section 121, thereby increasing the amount of voice signal that the first sound-guiding cavity section 121 can receive and its ability to receive voice signals; while the sound-guiding cross-sectional area at the end of the first sound-guiding cavity section 121 near the second sound-guiding cavity section 122 is smaller, allowing the voice signal to gradually concentrate and become more densely distributed as it propagates along the first sound-guiding cavity section 121, reducing the attenuation of the voice signal during propagation, thereby increasing the accuracy, sensitivity, and precision of voice signal recognition.
[0043] The correspondence between the sound guide channels 12 and the microphone modules 22a can be determined according to actual needs, and this application embodiment does not limit this. In some embodiments, the number of sound guide channels 12 and microphone modules 22a is equal, and they are set in a one-to-one correspondence, with each sound guide channel 12 transmitting a voice signal to a corresponding microphone module 22a. In other embodiments, the number of sound guide channels 12 may be less than the number of microphone modules 22a, and one sound guide channel 12 may be set to correspond with multiple microphone modules 22a, and the sound guide channel 12 can transmit voice signals to multiple microphone modules 22a simultaneously. In still other embodiments, the number of sound guide channels 12 may be greater than the number of microphone modules 22a, and one microphone module 22a may be set to correspond with multiple sound guide channels 12, and the microphone module 22a can receive voice signals from multiple sound guide channels 12.
[0044] In some embodiments, the far-field voice module 1 may further include a flexible adhesive member 30, which is at least bonded between the inner cavity surface of the module housing 10 and the back side region of the area on the circuit board 21 where the microphone module 22a is located. It is understood that other areas on the circuit board 21 besides the aforementioned area can also be bonded and fixed to the inner cavity surface of the module housing 10 using the flexible adhesive member 30. The flexible adhesive member 30 has a first sound passage hole 31, and the circuit board 21 has a second sound passage hole 211. The inner opening end 12b, the first sound passage hole 31, the second sound passage hole 211, and the sound inlet hole of the microphone module 22a are sequentially connected; here, the second sound passage hole 211 can connect the area on the circuit board 21 where the microphone module 22a is located and the back side region of that area. The type of flexible adhesive member 30 can be determined according to actual needs, and adhesives such as double-sided tape and foam adhesive can be used; this embodiment does not limit this.
[0045] In this way, the flexible adhesive 30 can be used to initially bond and fix the circuit board 21 and the module housing 10. By utilizing the flexible deformation characteristics and adhesive force of the flexible adhesive 30, the flexible adhesive 30 can be tightly bonded between the inner cavity surfaces of the circuit board 21 and the module housing 10, avoiding any gaps between the flexible adhesive 30 and the circuit board 21, and between the flexible adhesive 30 and the inner cavity surfaces of the module housing 10. This increases the airtightness of the connection between the sound guide cavity 12, the flexible adhesive 30 and the circuit board 21 / microphone module 22a, ensuring that all or most of the voice signals can be accurately transmitted to the microphone module 22a, eliminating or reducing signal leakage loss.
[0046] In some examples, a connecting boss 13 may be provided on the inner cavity surface of the module housing 10, the circuit board 21 is disposed on the connecting boss 13, and the flexible adhesive 30 is bonded between the connecting boss 13 and the circuit board 21. This allows the mating area between the inner cavity surface of the module housing 10 and the circuit board 21 to be controlled within the range of the connecting boss 13, thereby increasing the mating accuracy between the inner cavity surface of the module housing 10 and the circuit board 21. This ensures that the flexible adhesive 30 is tightly bonded between the connecting boss 13 and the circuit board 21, correspondingly increasing the airtightness of the connection between the sound guide cavity 12, the flexible adhesive 30, and the circuit board 21 / microphone module 22a. Furthermore, based on the design of the connecting boss 13, the precision surface area on the module housing 10 can be reduced, thereby lowering manufacturing costs.
[0047] For example, one of the connecting boss 13 and the circuit board 21 may be provided with a positioning protrusion 131, while the other may be provided with a positioning recess 212, the positioning protrusion 131 and the positioning recess 212 being configured for insertion positioning. In some examples, the connecting boss 13 may be provided with a positioning protrusion 131, while the circuit board 21 may be provided with a positioning recess 212; in other examples, the connecting boss 13 may be provided with a positioning recess 212, while the circuit board 21 may be provided with a positioning protrusion 131. When the circuit board 21 is bonded to the connecting boss 13 using the flexible adhesive 30, the operator's view is obstructed by the circuit board 21, making it impossible to directly observe whether the flexible adhesive 30 and the connecting boss 13 are accurately aligned. Using the above positioning structure, the operator can perform insertion and positioning through the positioning protrusion 131 and positioning recess 212 even when direct observation is not possible, so as to ensure that the flexible adhesive 30 and the connecting boss 13 are accurately aligned, reducing installation difficulty and improving installation accuracy.
[0048] The type of the positioning protrusion 131 can be determined according to actual needs, and can be such as a positioning protrusion or a positioning dot, etc., which is not limited in this embodiment. The type of the positioning recess 212 can be determined according to actual needs, and can be such as a positioning groove or a positioning through hole, etc., which is not limited in this embodiment.
[0049] In some embodiments, a protruding post 17 may be provided on the inner cavity surface of the module housing 10; the protruding post 17 has a threaded hole and is used to support the circuit board 21. A screw can pass through the corresponding through hole on the circuit board 21 and be threaded into the threaded hole to lock the circuit board 21. In some examples, a support rib 18, such as a cross rib, may be provided on the inner cavity surface of the module housing 10. The support rib 18 and the protruding post 17 are spaced apart; the support rib 18 can support and tighten the circuit board 21 to prevent the circuit board 21 from loosening and shaking. For example, the connecting boss 13, the protruding post 17 and the cross rib can be arranged sequentially and spaced apart along the width direction of the module housing 10 to further increase the stability of the circuit board 21 after installation and locking.
[0050] In some embodiments, the multiple functional modules 22 may further include a switch module 22b, which is configured to control the switching of the microphone module 22a. Based on the switch module 22b, the microphone module 22a can be turned on or off. Here, the switch module 22b includes a switch device 221 and a transmission control component 222. The switch device 221 is disposed on the circuit board 21 and can employ various miniature components with switching functions; the transmission control component 222 has a transmission part 2221 and a control part 2222, the transmission part 2221 and the switch device 221 are connected and transmitted, and the control part 2222 extends outside the module housing 10. Thus, the user can directly control the control part 2222, and the control part 2222 transmits the control force to the switch device 221 through the transmission part 2221, causing the switch device 221 to switch on and off. By utilizing the control section 2222 of the transmission control component 222, the switch module 22b can have a larger operating area; the user can control the switch section 2222 without directly controlling the switch device 221, thereby increasing the user's control convenience and accuracy. The type of switch device 221 can be determined according to actual needs, and can be such as a toggle switch or a push-button switch, etc., which is not limited in this embodiment.
[0051] In some examples, the module housing 10 may be provided with a connection through hole 14 and a limiting protrusion 15. The connection through hole 14 connects the outer surface and the inner cavity surface of the module housing 10, and the transmission control member 222 passes through the connection through hole 14, allowing the control member 2222 to extend outside the module housing 10. The limiting protrusion 15 is disposed around the connection through hole 14 on the inner cavity surface of the module housing 10, and the area on the circuit board 21 where the switching device 221 is located, or the back area of that area, is pressed onto the limiting protrusion 15. In this way, a gap area is formed between the area on the circuit board 21 where the switching device 221 is located, or the back area of that area, and the inner cavity surface of the module housing 10. This gap area provides a considerable amount of movement space for the transmission control member 222, increasing the movement sensitivity and transmission accuracy of the transmission control member 222 under control force, and preventing the transmission control member 222 from being hindered in movement or jamming.
[0052] The structure of the limiting protrusion 15 can be determined according to actual needs, and this application embodiment does not limit it. For example, the limiting protrusion 15 includes a plurality of limiting protrusion sub-parts 151, which are arranged sequentially at intervals around the connecting through hole 14. As another example, the limiting protrusion 15 can be an annular structure, and the annular structure is arranged around the connecting through hole 14.
[0053] In some examples, a flange 2223 is provided between the two ends of the transmission control component 222 along its extension direction. The flange 2223 can be held between the inner cavity surfaces of the circuit board 21 and the module housing 10 as the transmission control component 222 moves. On the one hand, by providing the flange 2223 in the gap area between the inner cavity surfaces of the circuit board 21 and the module housing 10, the movement space of the transmission control component 222 during transmission control can be limited to the movement space of the flange 2223 in the aforementioned gap area, that is, the fitting gap between the flange 2223 and the aforementioned gap area. Furthermore, the movement space of the transmission control component 222 can be adjusted by adjusting the size of the flange 2223, avoiding motion interference and transmission failure due to insufficient movement space, or tilting and lateral deviation of the transmission control component 222 and transmission failure due to excessive movement space, thereby improving the accuracy and smoothness of user operation and the sensitivity of the switch module 22b. On the other hand, the flange 2223 can increase the contact area between the transmission control component 222 and the inner cavity surface of the circuit board 21 / module housing 10, avoiding stress concentration and large pre-pressure, improving the accuracy and smoothness of operation for the user, as well as the sensitivity of the switch module 22b.
[0054] In some examples, a lateral limiting portion 16 is provided on the inner cavity surface of the module housing 10. The transmission control member 222 can drive the switching device 221 to switch the switching state along the first direction, while the transmission part 2221 and the lateral limiting portion 16 are located on opposite sides of the transmission control member 222 along the second direction, and the first direction and the second direction are perpendicular to each other. In this way, the transmission control member 222 is connected to the switching device 221 on one side along the second direction through the transmission part 2221, while it is limited by the lateral limiting portion 16 on the other side. This allows the transmission control member 222 to be reliably connected to the switching device 221, preventing the transmission control member 222 from shaking along the second direction and affecting the stability and accuracy of operation. As a result, the transmission control member 222 can move stably along the first direction to switch the switching state of the switching device 221.
[0055] Multiple functional modules 22 can be disposed on the same side of the circuit board 21, or disposed on opposite sides of the circuit board 21, and this embodiment does not limit this. In some embodiments, the circuit board 21 has an arrangement side 21a and a back side 21b disposed opposite to each other along its thickness direction. The multiple functional modules 22 are disposed on the arrangement side 21a of the circuit board 21, and the back side 21b of the circuit board 21 is disposed on the inner cavity surface of the module housing 10. In this way, multiple functional modules 22 can be centrally disposed on the same side of the circuit board 21, which can reduce the manufacturing difficulty and cost of the circuit board 21, and reduce the installation difficulty of the circuit board 21 on the inner cavity surface of the module housing 10.
[0056] In some embodiments, the acoustic cavity 12 and the hardware circuit 20 can be arranged sequentially along the thickness direction of the far-field voice module 1, achieving a better layout of the acoustic cavity 12 and the hardware circuit 20 without increasing or significantly increasing the thickness of the far-field voice module 1, and giving the far-field voice module 1 a thinner structure. In some examples, the acoustic cavity 12, the circuit board 21, and the microphone module 22a can be stacked sequentially along the thickness direction of the far-field voice module 1, improving the speech recognition function of the far-field voice module 1 and achieving a thinner design effect for the far-field voice module 1.
[0057] In addition to the microphone module 22a, different types of functional modules 22 can be selected according to actual needs, and this application embodiment does not limit this. In some embodiments, the multiple functional modules 22 may also include at least one of the interactive functional modules 22 such as Bluetooth module, WiFi module, infrared communication module, mechanical control module 22d, switch module 22b, indicator light module 22c, and light sensor module. The Bluetooth module, WiFi module, and infrared communication module can realize data communication between the far-field voice module 1 or the electronic device it is located in and external devices, and belong to the communication interactive functional module 22; the mechanical control module 22d and the switch module 22b can be triggered by the user through mechanical operation, thereby inputting control commands to the far-field voice module 1 or the electronic device it is located in, while the light sensor module can obtain the user's touch commands through non-contact sensing, and belongs to the control interactive functional module 22, and its type can be various control buttons / switches; the indicator light module 22c can display the status to the outside world and belongs to the status interactive functional module 22.
[0058] In some embodiments, when the multi-functional module 22 includes an indicator light module 22c, a light-transmitting area may be provided on the module housing 10. Correspondingly, the indicator light module 22c may be positioned directly opposite the light-transmitting area so that the indicator light emitted by the indicator light module 22c can pass through the light-transmitting area and be displayed externally. In some examples, a light guide sheet 40 may be provided on the inner cavity surface of the module housing 10. The light guide sheet 40 may be entirely blackened, and a silkscreen printing position 41 may be formed at the position directly opposite the indicator light module. This allows the indicator light emitted by the indicator light module 22c to propagate more concentratedly along the silkscreen printing position 41 and the light-transmitting area on the module housing 10, achieving a better lighting indication effect. Furthermore, by adjusting the depth of the silkscreen printing, the brightness of the indicator light can be adjusted to a range comfortable for human eyes.
[0059] The material of the module housing 10 can be determined according to actual needs, and this application embodiment does not limit it. In some embodiments, the module housing 10 can be made of blackish-gray semi-transparent plastic, which can meet the requirements of infrared communication module for infrared light transmittance and light sensing module for visible light transmittance.
[0060] This application also provides a display device, which includes the far-field voice module 1 provided in any of the above embodiments, with the outer opening 12a of the sound guide cavity 12 connected to the outside of the display device. The type of display device can be determined according to actual needs, and can be such as a television set or a monitor, etc., and this application does not limit it.
[0061] The far-field voice module and display device provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A far-field voice module, characterized in that, include: The module housing has an inner cavity and a sound guiding channel. The sound guiding channel has an outer opening end and an inner opening end. The outer opening end is disposed on the outer surface of the module housing, and the inner opening end is disposed inside the inner cavity. A hardware circuit is disposed in the inner cavity. The hardware circuit includes a circuit board and various functional modules disposed on the circuit board. The various functional modules include a microphone module, and the inner opening end of the sound guide cavity faces the sound inlet of the microphone module. The sound guide cavity includes a first sound guide cavity segment and a second sound guide cavity segment connected in sequence. The first sound guide cavity segment and the second sound guide cavity segment are perpendicular to each other or inclined at an angle. The sound guide cavity, the circuit board and the hardware circuit are stacked in sequence along the thickness direction of the far-field voice module. The far-field voice module is adapted to be disposed on one side of the display device. The length direction of the far-field voice module is parallel to the side of the display device, the width direction of the far-field voice module is parallel to the thickness direction of the display device, and the thickness direction of the far-field voice module is parallel to the vertical side of the side of the display device. The outer opening end is opened forward along the display direction of the display device and faces the user located in front of the display device, and the far-field voice module protrudes outside the display area of the display device along the thickness direction of the far-field voice module.
2. The far-field voice module according to claim 1, characterized in that, The outer opening end is located at the end of the first sound-guiding cavity segment away from the second sound-guiding cavity segment; along the direction from the outer opening end towards the second sound-guiding cavity segment, the sound-guiding cross section of the first sound-guiding cavity segment decreases.
3. The far-field voice module according to claim 1, characterized in that, The number of acoustic cavities and microphone modules are equal, and they are configured in a one-to-one correspondence.
4. The far-field voice module according to claim 1, characterized in that, The far-field voice module further includes a flexible adhesive component, which is at least bonded between the inner cavity surface of the module housing and the back side area of the circuit board where the microphone module is located; the flexible adhesive component has a first sound passage hole, and the circuit board has a second sound passage hole, and the inner opening end, the first sound passage hole, the second sound passage hole and the sound inlet hole of the microphone module are connected in sequence.
5. The far-field voice module according to claim 4, characterized in that, The inner cavity surface of the module housing is provided with a connecting boss, the circuit board is disposed on the connecting boss, and the flexible adhesive is bonded between the connecting boss and the circuit board.
6. The far-field voice module according to claim 5, characterized in that, One of the connecting boss and the circuit board is provided with a positioning protrusion, and the other is provided with a positioning recess. The positioning protrusion and the positioning recess are configured for insertion positioning.
7. The far-field voice module according to claim 1, characterized in that, The multiple functional modules also include a switch module, which is configured to control the microphone module to switch on or off. The switch module includes a switch device and a transmission control component. The switch device is disposed on the circuit board, and the transmission control component has a transmission part and a control part. The transmission part is connected and driven to the switch device, and the control part extends to the outside of the module housing.
8. The far-field voice module according to claim 7, characterized in that, The module housing is provided with a connection through hole and a limiting protrusion. The transmission control component passes through the connection through hole. The limiting protrusion is disposed around the connection through hole on the inner cavity surface of the module housing. The area on the circuit board where the switching device is located or the back side area of the area is pressed onto the limiting protrusion.
9. The far-field voice module according to claim 8, characterized in that, The limiting protrusion includes multiple limiting protrusion sub-parts, which are arranged sequentially and at intervals around the connecting through hole.
10. The far-field voice module according to claim 7, characterized in that, The transmission control component has a flange between its two ends along its extension direction. The flange can be held between the inner cavity surfaces of the circuit board and the module housing in a movable manner with the transmission control component.
11. The far-field voice module according to claim 7, characterized in that, The inner cavity surface of the module housing is provided with a lateral limiting part. The transmission control component can drive the switching device to switch the switching state along the first direction. The transmission part and the lateral limiting part are located on opposite sides of the transmission control component along the second direction. The first direction and the second direction are perpendicular to each other.
12. The far-field voice module according to claim 1, characterized in that, The circuit board has an arrangement side and a back side arranged opposite to each other along its thickness direction. The various functional modules are arranged on the arrangement side of the circuit board, and the back side of the circuit board is arranged on the inner cavity surface of the module housing.
13. The far-field voice module according to claim 1, characterized in that, The various functional modules also include at least one of the following: Bluetooth module, WiFi module, infrared communication module, mechanical control module, switch module, indicator light module, and light sensor module.
14. A display device, characterized in that, The far-field voice module includes any one of claims 1-13, wherein the outer opening end of the sound guiding cavity is connected to the outside of the display device.
Citation Information
Patent Citations
Far-field voice integrated circuit and intelligent device capable of performing man-machine interaction
CN114710866A
Display device
CN216751936U
Electronic apparatus having microphone
US20160014488A1