Method for detecting the ability to recede from a membrane

Abstract

The present application relates to the technical field of equipment detection, and particularly relates to a film stripping capacity detection method, the film stripping capacity detection method provided by the present application is used for detecting the film stripping capacity of a film stripping equipment, specific pattern information is acquired, the specific pattern information includes a plurality of specific patterns and a plurality of specification parameters corresponding to each specific pattern, a to-be-detected board is provided, the to-be-detected board is exposed according to the specific pattern information, so that the to-be-detected board forms a plurality of specific patterns, the to-be-detected board after exposure is electroplated, and the film stripping equipment strips the to-be-detected board after electroplating according to preset parameters, and reading of the to-be-detected board after film stripping is performed to obtain a film stripping impurity rate of each specific pattern on the to-be-detected board. The film stripping impurity rate is used to measure the film stripping capacity of the film stripping equipment for a plurality of specific patterns, so that the detection of the film stripping capacity of the film stripping equipment is clearer, more standardized and more comprehensive.

Description

[Technical Field]

[0001] This invention relates to the field of equipment testing technology, and in particular to a method for testing film removal capability. [Background Technology]

[0002] The manufacturing process of a circuit board requires the application and removal of a protective film to form the final circuit board. Incomplete removal of the protective film may result in the scrapping of the final circuit board.

[0003] The existing method for testing film removal capability is to measure the film removal point. However, the film removal equipment does not have a measurement index for the peeling capability of polymers covered with different closed patterns and fine lines of different specifications, which results in the usage index of the film removal point not matching the actual production requirements. [Summary of the Invention]

[0004] To address the problem that existing methods for testing the film removal capability of film removal equipment lack quantifiable indicators, leading to discrepancies between the performance indicators at the film removal point and actual production requirements, this invention provides a method for testing film removal capability.

[0005] The solution to the technical problem of this invention is to provide a method for detecting the film removal capability of a film removal device, comprising the following steps:

[0006] Obtain specific pattern information; the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern;

[0007] A test board is provided, and the test board is exposed according to specific pattern information to form a variety of specific patterns on the test board;

[0008] Electroplating is performed on the exposed test board, and the film stripping equipment removes the film from the electroplated test board according to preset parameters;

[0009] Readings are taken from the test plate after the film is removed to obtain the film removal incompleteness rate for each specific pattern on the test plate.

[0010] Preferably, the specific pattern includes dense areas of circles, rectangles, triangles, right angles, and open dense areas of straight lines; the specification parameters include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and line spacing of the dense lines.

[0011] Preferably, the parameter range of the specification parameters is 8 μm-50 μm.

[0012] Preferably, the provision of the test board specifically includes:

[0013] The board to be tested is pretreated and coated sequentially to apply a dry circuit film that is resistant to electroplating.

[0014] Preferably, the thickness of the dry film for the circuit is 29 μm and 25 μm.

[0015] Preferably, the step of exposing the test board according to specific pattern information to form multiple specific patterns on the test board specifically includes:

[0016] Obtain user demand information;

[0017] Based on the user's requirements information, select different specification parameters corresponding to each specific pattern from the specific pattern information;

[0018] The test board is exposed according to different specification parameters corresponding to each specific pattern, so that the test board forms a specific pattern corresponding to different specification parameters.

[0019] Preferably, the copper thickness of the plate to be tested after electroplating is 17 μm-23 μm.

[0020] Preferably, the step of taking readings on the test plate after delamination to obtain the delamination incompleteness rate for each specific pattern on the test plate specifically includes:

[0021] The number of patterns with incomplete delamination is counted for each specific pattern on the test plate after delamination.

[0022] The unremoved film rate corresponding to each specific pattern on the test plate is determined based on the number of patterns.

[0023] Preferably, the step of counting the number of patterns with incomplete delamination in each specific pattern on the test plate after delamination specifically includes:

[0024] By performing AOI scanning on the test board after film removal, the number of patterns with incomplete film removal in each specific pattern on the test board can be obtained.

[0025] Preferably, the unremoved film rate is less than or equal to 1% when it is considered acceptable.

[0026] Compared with the prior art, the film removal ability testing method provided by the present invention has the following advantages:

[0027] 1. A method for detecting the film removal capability of a film removal device according to an embodiment of the present invention includes the following steps: acquiring specific pattern information; the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern; providing a test board, exposing the test board according to the specific pattern information to form multiple specific patterns; electroplating the exposed test board, and having the film removal device remove the film from the electroplated test board according to preset parameters; and taking readings of the tested board after film removal to obtain the film removal incompleteness rate of each specific pattern on the test board. By exposing the test board to form multiple specific patterns, the film removal status during the production of formal products can be effectively reproduced; by performing film removal through the film removal device, the film removal incompleteness rate corresponding to each specific pattern on the test board can be obtained through readings, realizing the measurement of the film removal capability of the film removal device for multiple specific patterns by the film removal incompleteness rate, making the detection of the film removal capability of the film removal device clearer, more standardized, and more comprehensive. In addition, this film removal capability detection method is closer to actual production, has quantifiable detection indicators, and the operation process is simple and easy to standardize.

[0028] 2. In this embodiment of the invention, the specific patterns include circular, rectangular, triangular, right-angled dense areas of lines, and open dense areas of straight lines; the specifications include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and line spacing of the dense lines. By designing specific patterns including circular, rectangular, triangular, right-angled dense areas of lines, and open dense areas of straight lines, and by specifying the specification range of each specific pattern, the specific patterns can be made richer, more standardized, and more representative, thereby effectively reproducing the film peeling condition during the production of formal products.

[0029] 3. In this embodiment of the invention, the parameter range of the specifications is 8µm-50µm. By setting the parameter range of the specifications to 8µm-50µm, it can better meet the needs of users and facilitate better testing.

[0030] 4. In this embodiment of the invention, a test board is provided, specifically including: pre-processing and film application sequentially on the test board to apply an electroplating-resistant circuit dry film to the test board. By sequentially pre-processing and film application on the test board, a layer of electroplating-resistant circuit dry film can be applied to specific pattern areas on the test board, avoiding damage to specific patterns on the test board during subsequent electroplating.

[0031] 5. In the embodiment of the present invention, exposing the board to be detected according to the specific pattern information to form a plurality of specific patterns on the board to be detected specifically comprises: acquiring user demand information; selecting different specification parameters corresponding to each specific pattern from the specific pattern information according to the user demand information; and exposing the board to be detected according to the different specification parameters corresponding to each specific pattern, so that the specific patterns corresponding to the different specification parameters are formed on the board to be detected. Exposing the board to be detected according to the different specification parameters corresponding to each specific pattern selected based on the user demand information enables specific patterns of different specifications to be formed on the board to be detected, so that multiple sets of film stripping experiment results can be obtained through only one board to be detected, the utilization rate of the board to be detected is improved, and the detection accuracy is improved.

[0032] 6. In the embodiment of the present invention, reading the board to be detected after film stripping to obtain the unclean film stripping rate of each specific pattern on the board to be detected specifically comprises: counting the number of uncleanly stripped patterns in each specific pattern on the board to be detected after film stripping; and determining the unclean film stripping rate corresponding to each specific pattern on the board to be detected according to the number of patterns. By counting the number of all uncleanly stripped patterns in each specific pattern on the board to be detected after film stripping, the unclean film stripping rate of the film stripping equipment for each specific pattern on the board to be detected can be obtained, and the film stripping capability of the film stripping equipment for each specific pattern is measured by the unclean film stripping rate. The smaller the unclean film stripping rate is, the stronger the film stripping capability is.

[0033] 7. In the embodiment of the present invention, counting the number of uncleanly stripped patterns in each specific pattern on the board to be detected after film stripping specifically comprises: performing AOI scanning on the board to be detected after film stripping to obtain the number of uncleanly stripped patterns in each specific pattern on the board to be detected. The number of uncleanly stripped patterns in each specific pattern on the board to be detected can be counted through AOI scanning, thereby improving the counting efficiency and accuracy.

[0034] 8. In the embodiment of the present invention, it is qualified when the unclean film stripping rate is less than or equal to 1%. By setting the qualified unclean film stripping rate as less than or equal to 1%, the control of the unclean film stripping rate in actual production can be better matched, so that film stripping equipment meeting actual production requirements can be effectively screened out. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the accompanying drawings required for describing the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other accompanying drawings based on these accompanying drawings without creative exertion.

[0036] Figure 1 is a flow chart of steps of the film stripping capability detection method provided by the first embodiment of the present invention Figure 1 .

[0037] Figure 2 This is an example diagram of a rectangle representing a specific pattern in the film removal capability detection method provided in the first embodiment of the present invention.

[0038] Figure 3 This is an example of a circle as a specific pattern in the film removal capability testing method provided in the first embodiment of the present invention. Figure 1 .

[0039] Figure 4 This is an example of a circle as a specific pattern in the film removal capability testing method provided in the first embodiment of the present invention. Figure 2 .

[0040] Figure 5 These are example diagrams of specific patterns, such as dots, squares, and triangles, in the film removal capability detection method provided in the first embodiment of the present invention.

[0041] Figure 6 The following is a flowchart of the film removal ability testing method provided in the first embodiment of the present invention. Figure 2 .

[0042] Figure 7 This is a flowchart illustrating the specific steps of step S4 in the film removal capability testing method provided in the first embodiment of the present invention.

Detailed Implementation Methods

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0045] Please see Figure 1 The first embodiment of the present invention provides a method for detecting film removal capability, used to detect the film removal capability of film removal equipment, comprising the following steps:

[0046] S1: Obtain specific pattern information; the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern;

[0047] S2: Provide a test board, and expose the test board according to specific pattern information to form a variety of specific patterns on the test board;

[0048] S3: Electroplating is performed on the exposed test board, and the film stripping equipment removes the film from the electroplated test board according to preset parameters;

[0049] S4: Take readings on the test plate after decoating to obtain the decoating incompleteness rate of each specific pattern on the test plate.

[0050] Specifically, the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern. That is, each pattern is designed with multiple specification parameters. Moreover, the specific pattern information is designed based on the circuit pattern of existing circuit boards, thus better meeting the requirements of existing circuit boards. The board to be tested is a processing board that imitates a normal production board. This processing board is a board that has already been laminated. The processing board can be used to simulate the production process of a normal circuit board or to capture production parameters, etc.

[0051] Understandably, step S1 allows for the design of specific patterns tailored to the circuit patterns required by existing circuit boards, thereby obtaining specific pattern information. Step S2 exposes the provided test board, specifically the board with the applied film, transferring the specific patterns onto it. This results in multiple specific patterns, each with various sizes, effectively replicating the film removal process during production. Step S3 then electroplats the exposed test board, forming a circuit pattern identical to the specific pattern. To avoid the influence of the applied film, a film removal device is used to remove the film from the electroplated board. Step S4 then reads the stripped test board, obtaining the film removal incompleteness rate for each specific pattern. This allows for measuring the film removal equipment's ability to remove multiple specific patterns using the incompleteness rate, making the testing of the equipment's removal capability clearer, more standardized, and more comprehensive. In addition, this film removal capability testing method is closer to actual production, has quantifiable testing indicators, and the operation process is simple and easy to standardize.

[0052] It should be noted that each film removal machine has its optimal film removal parameters. Before film removal, these parameters can be preset for each machine. These preset parameters ensure the machine achieves the best film removal effect. Specifically, preset parameters may include spray pressure, temperature, line speed, etc., and should be set according to the actual film removal situation.

[0053] Please see Figures 2-5Furthermore, the specific pattern includes dense areas of circles, rectangles, triangles, right angles, and open dense areas of straight lines; the specification parameters include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and line spacing of the dense lines.

[0054] Understandably, the specific patterns designed may include: dense areas of circular, rectangular, triangular, and right-angled lines, as well as open dense areas of straight lines. Dotted patterns are also included. Specifications include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and spacing of the dense lines corresponding to the specific pattern. By designing specific patterns including dense areas of circular, rectangular, triangular, and right-angled lines, as well as open dense areas of straight lines, and by specifying the specification range for each specific graphic, the specific patterns can be made richer, more standardized, and more representative, thereby effectively reproducing the film peeling condition during the production of official products.

[0055] It should be noted that, since specific patterns and their corresponding different specifications include line width and line spacing parameters that increase proportionally, the same specific pattern can be laid out on the test board after exposure and electroplating according to the specific pattern and its corresponding different specifications. This allows the specific pattern and its different specifications to be presented intuitively on the test board, making it easier to view and count the unremoved film rate corresponding to each specific pattern.

[0056] Furthermore, the parameter range of the specifications is 8µm-50µm.

[0057] Specifically, by setting the specification parameters to a range of 8µm-50µm, it can better meet the needs of users and the existing actual production capabilities.

[0058] More specifically, in this embodiment, the diameter of the circle is 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, or 80 μm.

[0059] The rectangular side lengths are available in 50µm, 55µm, 60µm, 65µm, 70µm, 75µm, and 80µm.

[0060] The line width / spacing specifications for dense lines are 8µm / 8µm, 10µm / 10µm, 12µm / 12µm, 15µm / 15µm, 18µm / 18µm, 21µm / 21µm, and 25µm / 25µm.

[0061] It should be noted that the specifications of specific patterns are designed based on current technological limitations and the increasing demand for fine lines in the market, and closely follow the design requirements of normal products, thus making them more targeted and representative.

[0062] It is particularly important to note that the line specifications, i.e., line width / spacing, are preferably below 25µm, and for circles and rectangles, below 70µm. Specific patterns within these specifications better reflect actual production conditions, thus better simulating real-world film removal processes.

[0063] Please see Figure 6 Furthermore, the provision of the test board specifically includes:

[0064] S201: Perform pretreatment and film application on the board to be tested in sequence, so that a circuit dry film that is resistant to electroplating is applied to the board to be tested.

[0065] Specifically, through step S201, the board to be tested can be pre-treated and coated sequentially, thereby applying a layer of electroplating-resistant dry film to the specific pattern area on the board to be tested, avoiding damage to the specific pattern on the board to be tested during subsequent electroplating.

[0066] Specifically, pretreatment can involve surface cleaning and dirt removal on the board to be tested, as well as grinding to address issues of surface cleanliness and roughness. Simultaneously, oxidation is removed, increasing the roughness of the copper surface to facilitate film adhesion. Film lamination involves applying an electroplating-resistant dry circuit film to the pretreated board using a hot-pressing process, facilitating subsequent exposure production.

[0067] Furthermore, the thickness of the dry film of the circuit is 29 μm and 25 μm.

[0068] Understandably, after the above pretreatment and film application, the thickness of the circuit dry film on the surface of the board to be tested is 29 μm and 25 μm. Therefore, this embodiment can specifically target the stripping of circuit dry films with a thickness of 29 μm and 25 μm under a specific pattern and obtain the stripping incomplete rate after stripping, which is more targeted.

[0069] Please see Figure 6 Furthermore, the test board is exposed according to specific pattern information to form various specific patterns on the test board, specifically including:

[0070] S202: Obtain user requirement information;

[0071] S203: Select different specification parameters corresponding to each specific pattern from the specific pattern information based on the user requirement information;

[0072] S204: Expose the test board according to the different specification parameters corresponding to each specific pattern, so that the test board forms a specific pattern corresponding to different specification parameters.

[0073] Understandably, the specific pattern in this embodiment needs to closely match the design of the existing circuit board's circuit pattern. Therefore, in step S202, user requirement information can be obtained. This user requirement information is the circuit pattern information that the user needs to produce during normal production. Thus, in step S203, different specification parameters corresponding to each specific pattern can be selected from the specific pattern information based on the user requirement information. Alternatively, if there is no specific pattern among the relevant specific patterns that corresponds to the user requirement information, the specific pattern and different specification parameters can be designed directly based on the user requirement information. That is, the specific pattern corresponding to the user requirement information and the different specification parameters corresponding to each selected specific pattern are selected. Then, in step S204, the board to be tested is exposed according to each selected specific pattern and its corresponding different specification parameters, enabling the formation of the selected specific patterns of different specifications on the board to be tested. This allows multiple sets of film removal test results to be obtained from a single board to be tested. Each set of film removal test results corresponds to the film removal test results of the film removal equipment for different specifications of a specific pattern, thereby improving the utilization rate of the board to be tested and improving the accuracy of the test. In addition, by designing specific patterns and different specifications based directly on user needs, targeted design can be achieved, which can effectively solve the problem of obtaining the unremoved film rate for common or rare patterns encountered in user data.

[0074] Furthermore, the copper thickness of the plated board to be tested after electroplating is 17 μm-23 μm.

[0075] Understandably, in this embodiment, the copper thickness of the board to be tested after electroplating is generally 17 μm-23 μm. When the copper thickness is flush with the thickness of the circuit dry film, or the height difference between the two is smaller, the circuit dry film is less likely to be peeled off. Therefore, this application performs film removal when the copper thickness is 17 μm-23 μm and the circuit dry film thickness is 29 μm and 25 μm, thereby achieving a low film removal incompleteness rate for boards to be tested that are difficult to remove.

[0076] It should be noted that after exposure and before electroplating, development is required. Therefore, the overall processing of the board to be tested is as follows: pretreatment → film application → exposure → development → electroplating → "film removal" → flash etching.

[0077] Specifically, development involves immersing the exposed test board in a developing solution, which dissolves the photosensitive material that was not exposed to light, revealing the circuit pattern on the test board. Electroplating involves electroplating a copper layer onto the circuit pattern on the developed test board to increase its conductivity and form circuit connections. "Removal," as in this embodiment, typically involves using a removal device with chemicals and a horizontal spray line. The chemicals react with the dry film of the circuit, causing it to rupture, expand, and detach from the board surface, thus peeling the formed circuit pattern dry film off the test board. Flash etching involves performing a metal surface treatment on the metal of the circuit pattern to remove the oxide layer and improve solderability.

[0078] Please see Figure 7 Furthermore, step S4 specifically includes:

[0079] S 41: Count the number of patterns with incomplete delamination in each specific pattern on the test plate after delamination;

[0080] S 42: Determine the unremoved film rate corresponding to each specific pattern on the test plate based on the number of patterns.

[0081] Understandably, each specific pattern on the test board can be divided into a group, and each specific pattern can be counted separately to obtain the number of patterns with incomplete delamination in each specific pattern. By counting the number of all incomplete delamination patterns in each specific pattern on the test board after delamination, the delamination rate of the delamination equipment on each specific pattern on the test board can be known. The delamination rate measures the delamination equipment's ability to delaminate each specific pattern; the smaller the delamination rate, the stronger its delamination ability.

[0082] Specifically, the reading refers to taking the total number of patterns for each specific pattern on a test plate as the denominator and the number of patterns with incomplete delamination as the numerator, and using the ratio of the numerator to the denominator as the "number". This "number" is the ratio of the number of patterns with incomplete delamination to the total number of patterns for each specific pattern, i.e., the delamination incomplete rate.

[0083] Optionally, to improve the accuracy of the statistics, multiple test plates can be used to perform the same operation, so that the same specific pattern is formed on the multiple test plates and the same delamination equipment is used for delamination. Finally, the average rate of delamination incompleteness of each specific pattern on all test plates is calculated, and this average rate is used as the final delamination incompleteness rate of this type of delamination equipment.

[0084] Further, step S 41 specifically includes:

[0085] S 411: By performing AOI scanning on the test board after film removal, the number of patterns with incomplete film removal in each specific pattern on the test board can be obtained.

[0086] Understandably, AOI scanning can automatically count the number of patterns with incomplete delamination in each specific pattern on the board to be inspected, thereby improving statistical efficiency and accuracy.

[0087] It should be noted that the number of patterns with incomplete delamination in each specific pattern on the test board can also be manually counted. This example does not impose any restrictions on this; the number should be determined based on the specific statistical results.

[0088] Furthermore, the unremoved film rate is considered acceptable if it is less than or equal to 1%.

[0089] Understandably, by setting the film removal incomplete rate to less than or equal to 1%, the control of the film removal incomplete rate during actual production can be more closely approximated, thereby effectively screening out film removal equipment that meets actual production needs.

[0090] Compared with the prior art, the film removal ability testing method provided by the present invention has the following advantages:

[0091] 1. A method for detecting the film removal capability of a film removal device according to an embodiment of the present invention includes the following steps: acquiring specific pattern information; the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern; providing a test board, exposing the test board according to the specific pattern information to form multiple specific patterns; electroplating the exposed test board, and having the film removal device remove the film from the electroplated test board according to preset parameters; and taking readings of the tested board after film removal to obtain the film removal incompleteness rate of each specific pattern on the test board. By exposing the test board to form multiple specific patterns, the film removal status during the production of formal products can be effectively reproduced; by performing film removal through the film removal device, the film removal incompleteness rate corresponding to each specific pattern on the test board can be obtained through readings, realizing the measurement of the film removal capability of the film removal device for multiple specific patterns by the film removal incompleteness rate, making the detection of the film removal capability of the film removal device clearer, more standardized, and more comprehensive. In addition, this film removal capability detection method is closer to actual production, has quantifiable detection indicators, and the operation process is simple and easy to standardize.

[0092] 2. In this embodiment of the invention, the specific patterns include circular, rectangular, triangular, right-angled dense areas of lines, and open dense areas of straight lines; the specifications include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and line spacing of the dense lines. By designing specific patterns including circular, rectangular, triangular, right-angled dense areas of lines, and open dense areas of straight lines, and by specifying the specification range of each specific pattern, the specific patterns can be made richer, more standardized, and more representative, thereby effectively reproducing the film peeling condition during the production of formal products.

[0093] 3. In this embodiment of the invention, the parameter range is 8µm-50µm. By setting the parameter range to 8µm-50µm, it better meets the user's needs and facilitates better testing.

[0094] 4. In this embodiment of the invention, a test board is provided, specifically including: pre-processing and film application sequentially on the test board to apply an electroplating-resistant circuit dry film to the test board. By sequentially pre-processing and film application on the test board, a layer of electroplating-resistant circuit dry film can be applied to specific pattern areas on the test board, avoiding damage to specific patterns on the test board during subsequent electroplating.

[0095] 5. In this embodiment of the invention, the test plate is exposed according to specific pattern information to form multiple specific patterns. Specifically, this includes: obtaining user requirement information; selecting different specification parameters corresponding to each specific pattern from the specific pattern information according to the user requirement information; and exposing the test plate according to the different specification parameters corresponding to each specific pattern to form specific patterns corresponding to different specification parameters. Exposing the test plate according to the different specification parameters corresponding to each specific pattern selected according to the user requirement information enables the formation of specific patterns of different specifications on the test plate. Therefore, multiple sets of film removal test results can be obtained from a single test plate, improving the utilization rate of the test plate and the accuracy of the detection.

[0096] 6. In this embodiment of the invention, readings are taken on the test board after film removal to obtain the film removal incompleteness rate for each specific pattern on the test board. Specifically, this includes: counting the number of patterns with incomplete film removal in each specific pattern on the test board after film removal; and determining the film removal incompleteness rate corresponding to each specific pattern on the test board based on the number of patterns. By counting the number of all incomplete patterns in each specific pattern on the test board after film removal, the film removal incompleteness rate of the film removal equipment for each specific pattern on the test board can be determined. The film removal incompleteness rate measures the film removal equipment's ability to remove film for each specific pattern; the smaller the film removal incompleteness rate, the stronger its film removal ability.

[0097] 7. In this embodiment of the invention, the method for counting the number of patterns with incomplete delamination in each specific pattern on the test board after delamination specifically includes: performing AOI scanning on the test board after delamination to obtain the number of patterns with incomplete delamination in each specific pattern on the test board. AOI scanning can be used to count the number of patterns with incomplete delamination in each specific pattern on the test board, thereby improving statistical efficiency and accuracy.

[0098] 8. In the embodiments of the present invention, a film residue rate of less than or equal to 1% is regarded as qualified. By setting the film residue rate to be less than or equal to 1%, the control of the film residue rate in actual production can be more closely matched, thereby effectively screening out film stripping equipment that meets the requirements of actual production.

[0099] The method for detecting film stripping capability disclosed in the embodiments of the present invention is introduced in detail above. Specific examples are used herein to describe the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; meanwhile, for those skilled in the art, changes will be made to the specific implementation and application scope in accordance with the idea of the present invention. In conclusion, the content of this specification should not be construed as a limitation to the present invention. Any modification, equivalent replacement and improvement made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for detecting the film-retraction capability of a film-retraction device, the method comprising: Includes the following steps: ​ Obtain specific pattern information; the specific pattern information includes multiple specific patterns and multiple specification parameters corresponding to each specific pattern; A test board is provided, and the test board is exposed according to specific pattern information to form a variety of specific patterns on the test board; Electroplating is performed on the exposed test board, and the film stripping equipment removes the film from the electroplated test board according to preset parameters; Readings are taken from the test plate after the film is removed to obtain the film removal incompleteness rate for each specific pattern on the test plate.

2. The method of claim 1, wherein: The specific patterns include dense areas of circles, rectangles, triangles, right angles, and open dense areas of straight lines; the specifications include the diameter of the circle, the side length of the rectangle, the angle of the triangle, and the line width and line spacing of the dense lines.

3. The method of claim 2, wherein: The parameter range of the specifications is 8µm-50µm.

4. The method of claim 1, wherein: The provision of the test board specifically includes: The board to be tested is pretreated and coated sequentially to apply a dry circuit film that is resistant to electroplating.

5. The method of claim 4, wherein: The thickness of the dry film for the circuit is 29 μm and 25 μm.

6. The method for testing film removal ability as described in claim 1, characterized in that: The test board is exposed according to specific pattern information, so that the test board forms a variety of specific patterns, including: Obtain user demand information; Based on the user's requirements information, select different specification parameters corresponding to each specific pattern from the specific pattern information; The test board is exposed according to different specification parameters corresponding to each specific pattern, so that the test board forms a specific pattern corresponding to different specification parameters.

7. The method for testing film removal ability as described in claim 1, characterized in that: The copper thickness of the board under test after electroplating is 17 μm-23 μm.

8. The method for testing film removal ability as described in claim 1, characterized in that: The step of taking readings on the test plate after delamination to obtain the delamination incompleteness rate for each specific pattern on the test plate specifically includes: The number of patterns with incomplete delamination is counted for each specific pattern on the test plate after delamination. The unremoved film rate corresponding to each specific pattern on the test plate is determined based on the number of patterns.

9. The method for detecting film removal ability as described in claim 8, characterized in that: The method of counting the number of patterns with incomplete delamination in each specific pattern on the test plate after delamination specifically includes: By performing A OI scanning on the test board after film removal, the number of patterns with incomplete film removal in each specific pattern on the test board can be obtained.

10. The method for detecting film removal ability as described in claim 1, characterized in that: The film removal incompleteness rate is less than or equal to 1% when it is qualified.

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