Display substrate, display panel and display device

Abstract

The application provides a display substrate, a display panel and a display device. The display substrate comprises a substrate, an inorganic layer, a plurality of planarization layers and a plurality of metal layers. The inorganic layer is arranged on one side surface of the substrate. The plurality of planarization layers are arranged on the side surface of the inorganic layer away from the substrate. One metal layer is arranged between two adjacent planarization layers. The width of the upper planarization layer along the first direction perpendicular to the thickness direction of the display substrate is greater than the width of the lower planarization layer along the first direction. The upper planarization layer is located on the side of the lower planarization layer away from the substrate. The display substrate can reduce metal residues, thereby avoiding the problem of display abnormalities caused by the short circuit of the display substrate due to metal residues.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display substrate, a display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display devices are a type of self-emissive display panel. Due to their advantages such as thinness, high brightness, wide viewing angle, high response speed, and wide operating temperature range, OLED display panels are increasingly being used in various high-performance display fields.

[0003] In existing technologies, flexible OLED display panels may experience short circuits, leading to display abnormalities. Summary of the Invention

[0004] The display substrate, display panel, and display device provided in this application are intended to solve the problem of display abnormalities in existing display panels.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display substrate, comprising:

[0006] Substrate;

[0007] An inorganic layer is disposed on one side surface of the substrate;

[0008] Multiple planarization layers are stacked on the side of the inorganic layer facing away from the substrate;

[0009] A multilayer metal layer; wherein, a metal layer is disposed between two adjacent planarization layers;

[0010] In the two adjacent planarization layers, the width of the upper planarization layer along a first direction perpendicular to the thickness direction of the display substrate is greater than the width of the lower planarization layer along the first direction; the upper planarization layer is located on the side of the lower planarization layer that is away from the substrate.

[0011] In the two adjacent planarization layers, the upper planarization layer includes a first stacked portion and a first wrapping portion. The first stacked portion is stacked with the lower planarization layer along the thickness direction. One end of the first wrapping portion is connected to the first stacked portion, and the other end extends to the side of the lower planarization layer and the surface of the inorganic layer.

[0012] The inorganic layer has at least one first groove on its surface, and the first wrapping part is embedded in the at least one first groove and fits against the groove wall of the first groove.

[0013] Preferably, the portion of the first wrapping part embedded in the first groove fits against the entire wall of the first groove.

[0014] It further includes: a pixel defining layer disposed on the side surface of the plurality of planarization layers facing away from the substrate; and the width of the pixel defining layer along the first direction is greater than the width of the planarization layer adjacent to the pixel defining layer along the first direction.

[0015] The pixel defining layer includes a second stacked portion and a second wrapping portion. The second stacked portion is stacked with the plurality of planarization layers along the thickness direction. One end of the second wrapping portion is connected to the second stacked portion, and the other end extends to the side of the plurality of planarization layers and the surface of the inorganic layer.

[0016] The inorganic layer has at least one second groove on its surface, and the second wrapping portion is embedded in the second groove and fits against the groove wall of the second groove.

[0017] Preferably, the portion of the second wrapping part that is embedded in the second groove fits against the entire wall of the second groove;

[0018] Preferably, the angle between the sidewall of the second groove on the side opposite to the plurality of planarization layers and the bottom wall of the second groove is less than 80°;

[0019] Preferably, one sidewall of the second groove is in contact with the sidewall of the plurality of planarization layers, and the width of the second groove along the first direction is greater than the width of the first enclosing portion of the planarization layer adjacent to the pixel defining layer along the first direction; or

[0020] The second groove is spaced apart from the sides of the plurality of planarization layers, and the straight-line distance between the sidewall of the second groove away from the plurality of planarization layers and the sides of the plurality of planarization layers is greater than the width of the first wrapping portion adjacent to the pixel defining layer along the first direction.

[0021] Wherein, the second wrapping part is inclined toward the side of the plurality of planarization layers, and the angle between the side surface of the second wrapping part away from the side of the plurality of planarization layers and the inorganic layer is less than 80°;

[0022] The plurality of planarization layers include a first planarization layer, a second planarization layer, and a third planarization layer stacked sequentially with the inorganic layer; the multilayer metal layers include a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, and a fifth metal layer; wherein the first metal layer and the second metal layer are disposed between the substrate and the inorganic layer, the third metal layer is disposed between the inorganic layer and the first planarization layer, the fourth metal layer is disposed between the first planarization layer and the second planarization layer, and the fifth metal layer is disposed between the second planarization layer and the third planarization layer.

[0023] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a display panel, including the display substrate mentioned above.

[0024] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a display device, including the display panel mentioned above.

[0025] The beneficial effects of this application are as follows: Unlike the prior art, this application provides a display substrate, a display panel, and a display device. The display substrate includes a substrate, an inorganic layer, multiple planarization layers, and multiple metal layers. The inorganic layer is disposed on one surface of the substrate; multiple planarization layers are stacked on the side of the inorganic layer facing away from the substrate; and a metal layer is disposed between two adjacent planarization layers; wherein, in two adjacent planarization layers, the width of the upper planarization layer along a first direction perpendicular to the thickness direction of the display substrate is greater than the width of the lower planarization layer along the first direction; the upper planarization layer is located on the side of the lower planarization layer facing away from the substrate. By implementing the above settings, step-like discontinuities can be prevented at the edges of adjacent planarization layers. This prevents photoresist from accumulating at the edges of the planarization layers during subsequent manufacturing processes. Consequently, if the photoresist is thicker at the step than at other locations, the metal at the corresponding location may not be exposed after exposure, development, and etching, resulting in metal residue. Furthermore, it also prevents short circuits in the display substrate caused by metal residue, which could lead to display abnormalities. Attached Figure Description

[0026] Figure 1a This is a schematic diagram of the structure of a display substrate provided in one embodiment of this application;

[0027] Figure 1b for Figure 1a The diagram shows the structure of the planarization layer in the display substrate.

[0028] Figure 2a This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application;

[0029] Figure 2b for Figure 2a The diagram shows a schematic representation of the structure of the first groove in the display substrate.

[0030] Figure 3a This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application;

[0031] Figure 3b for Figure 3a The diagram shows a schematic representation of the structure of the second groove in the display substrate.

[0032] Figure 4 This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application;

[0033] Figure 5 This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application;

[0034] Figure 6 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0035] Figure 7 A simplified structural diagram of a display device provided in an embodiment of this application;

[0036] Explanation of icon numbers:

[0037] 100 - Display panel; 10 - Display substrate; 1 - Substrate; 2 - Inorganic layer; 3 - Planarization layer; 4 - Pixel defining layer; 21 - First groove; 22 - Second groove; 31 - Upper planarization layer; 32 - Lower planarization layer; 311 - First layer stack; 312 - First wrapping portion; 411 - Second layer stack; 412 - Second wrapping portion; 301 - First planarization layer; 302 - Second planarization layer; 303 - Third planarization layer; 401 - First metal layer; 402 - Second metal layer; 403 - Third metal layer; 404 - Fourth metal layer; 405 - Fifth metal layer. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] In related technologies, a five-layer metal solution has emerged to improve the optical display effect of flexible OLED display substrates; that is, adding a metal layer and a planarization layer to the conventional film structure. However, with the addition of the film layer, the film thickness also increases, causing difficulties in the photolithography process during exposure and development. This makes it easy for photoresist to accumulate at the steps between adjacent planarization layers, resulting in metal residue at the photoresist accumulation site. This metal residue can cause short circuits in adjacent signal lines, affecting the yield of the display substrate.

[0042] Based on this, embodiments of this application provide a display substrate, a display panel, and a display device. The display substrate can reduce metal residue, thereby avoiding the problem of short circuits caused by metal residue, which could lead to abnormal display.

[0043] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] See Figure 1a and Figure 1b , Figure 1a This is a schematic diagram of the structure of a display substrate provided in one embodiment of this application; Figure 1b for Figure 1a The diagram shows a schematic of the planarization layer in the display substrate. This embodiment provides a display substrate 10, which can be a flexible display substrate used to display images during operation. In this embodiment, as... Figure 1a As shown, the display substrate 10 includes a substrate 1, an inorganic layer 2, multiple planarization layers 3, and multiple metal layers (not shown).

[0045] The substrate 1 can be a flexible material, such as PI (Polyimide). The structure and function of the substrate 1 are the same as or similar to those in the prior art, and can be found in the prior art for details, which will not be repeated here. The inorganic layer 2 is disposed on one side surface of the substrate 1 to protect the substrate 1 and prevent the laser from damaging the substrate 1 during the cutting process of the display substrate motherboard, such as by burning.

[0046] Multiple planarization layers 3 are stacked on the surface of the inorganic layer 2 facing away from the substrate 1, and a metal layer (not shown) is disposed between two adjacent planarization layers 3. Hereinafter, the planarization layer 3 on the side furthest from the substrate 1 among two adjacent planarization layers 3 is defined as the upper planarization layer, and the planarization layer 3 closer to the substrate 1 is defined as the lower planarization layer; that is, the upper planarization layer is located on the side of the lower planarization layer facing away from the substrate 1. In a specific embodiment, among two adjacent planarization layers 3, the width of the upper planarization layer along the first direction X perpendicular to the thickness direction Y of the display substrate 10 is greater than the width of the lower planarization layer along the first direction X. Combined with... Figure 1a Taking the two adjacent planarization layers 3 closest to the inorganic layer 2 as an example, the width 'a' of the upper planarization layer 31 along the first direction X is greater than the width 'b' of the lower planarization layer 32 along the first direction X. Those skilled in the art will understand that... Figure 1a In the structure shown, the outermost planarization layer 3 and the middle planarization layer 3 (i.e., the planarization layer corresponding to label 31) are another pair of adjacent planarization layers 3. Among the two adjacent planarization layers 3, the outermost planarization layer 3 serves as the upper planarization layer, and the middle planarization layer 3 serves as the lower planarization layer. The width of the outermost planarization layer 3 along the first direction X is greater than the width of the middle planarization layer 3 along the first direction X. In the following embodiments of this application, the structure and function of the upper and lower planarization layers are described using the two adjacent planarization layers 3 closest to the inorganic layer 2 as examples.

[0047] In some embodiments, the plurality of planarization layers 3 are preferably organic layers. Specifically, the planarization layers may be organic photoresist layers.

[0048] The above configuration prevents the formation of step-like discontinuities at the edges of adjacent planarization layers 3 along the first direction X. This prevents photoresist, such as photoresist, from accumulating at the edges of the planarization layer 3 (where the original step was located) during subsequent manufacturing processes. This avoids the situation where the photoresist is thicker at the step than at other locations, preventing the metal at the corresponding location from being exposed after exposure, development, and etching, thus preventing the metal at the corresponding location from being patterned and resulting in metal residue. Furthermore, it can also prevent short circuits in the display substrate 10 caused by metal residue, which could lead to display abnormalities in the display substrate 10.

[0049] In this embodiment, as Figure 1b As shown, in two adjacent planarization layers 3, along the thickness direction Y, the orthographic projection of the lower planarization layer 32 on the substrate 1 lies within the orthographic projection of the upper planarization layer 31 on the substrate 1. Specifically, the upper planarization layer 31 includes a first stack portion 311 and a first wrapping portion 312; wherein, the first stack portion 311 is stacked with the lower planarization layer 32 along the thickness direction Y. The portion of the upper planarization layer 31 covering the side of the lower planarization layer 32 forms the first wrapping portion 312; the first wrapping portion 312 has two opposing ends, the first end of the first wrapping portion 312 is connected to the first stack portion 311, and the end face of the first end of the first wrapping portion 312 is flush with the side surface of the first stack portion 311 facing away from the substrate 1; the second end of the first wrapping portion 312 extends to the side of the lower planarization layer 32 and the surface of the inorganic layer 2; that is, the first wrapping portion 312 covers the side of the lower planarization layer 32 and contacts the side surface of the inorganic layer 2 facing away from the substrate 1.

[0050] In other words, in two adjacent planarization layers 3, the first stack portion 311 of the upper planarization layer 31 completely covers the side of the lower planarization layer 32 facing away from the substrate 1 along the thickness direction Y; while the first encapsulation portion 312 of the upper planarization layer 31 completely covers the side of the lower planarization layer 32 along the first direction X, and is tightly attached to the inorganic layer 2 to completely encapsulate the lower planarization layer 32. This prevents a step-like discontinuity from forming at the edge along the first direction X between the two adjacent upper and lower planarization layers 3, thereby preventing photoresist from accumulating at the edge of the planarization layer 3 during subsequent manufacturing processes and avoiding the formation of metal residues.

[0051] See Figure 2a and Figure 2b , Figure 2a This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application; Figure 2b for Figure 2aThe diagram shows a schematic representation of the structure of the first groove in the display substrate. In this embodiment, the inorganic layer 2 may further have at least one first groove 21, which is formed on the side surface of the inorganic layer 2 facing the planarization layer 3. Along the thickness direction Y, the orthographic projection of the first groove 21 on the substrate 1 is outside the orthographic projection of the lower planarization layer 32 on the substrate 1, and inside the orthographic projection of the upper planarization layer 31 on the substrate 1. The portion of the first wrapping portion 312 of the upper planarization layer 31 near its second end is embedded in the first groove 21; and the embedded portion is in contact with the groove wall of the first groove 21. Preferably, the portion of the first wrapping portion 312 embedded in the first groove 21 is in contact with the entire groove wall of the first groove 21.

[0052] Specifically, such as Figure 2b As shown, the first groove 21 has a bottom wall and inner and outer side walls disposed opposite to each other; wherein, the angle α between the outer side wall away from the lower planarization layer 32 and the bottom wall is less than 90°. (Combined with...) Figure 2a Along the first direction X, the surface of the first wrapping portion 312 away from the lower planarization layer 32 is flush with the outer wall of the first groove 21. The portion of the first wrapping portion 312 embedded in the first groove 21 is completely fitted with the bottom wall, inner side wall, and outer side wall of the first groove 21; this increases the adhesion between the first wrapping portion 312 and the inorganic layer 2, preventing the formation of gaps between the upper planarization layer 31 and the inorganic layer 2 due to detachment, which could cause photoresist to accumulate in the gaps and lead to metal residue. In other embodiments, the cross-section of the first groove 21 along the first direction X may also be rectangular; that is, the inner and outer side walls of the first groove 21 are both perpendicular to the bottom wall.

[0053] See Figure 3a and Figure 3b , Figure 3a This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application; Figure 3b for Figure 3a The diagram shows a schematic representation of the structure of the second recess in the display substrate. Figure 3a As shown, in this embodiment, the display substrate 10 further includes a pixel defining layer 4; the pixel defining layer 4 is disposed on the side surface of the plurality of planarization layers 3 facing away from the substrate 1; and the width c of the pixel defining layer 4 along the first direction X is greater than the width d of the planarization layer 3 adjacent to the pixel defining layer 4 along the first direction X. Specifically, along the thickness direction Y, the pixel defining layer 4 is disposed on the side surface of the planarization layer 3 that is furthest from the substrate 1 among the plurality of planarization layers 3 facing away from the substrate 1. Further, in this embodiment, along the thickness direction Y, the orthographic projection of the planarization layer 3 adjacent to the pixel defining layer 4 on the substrate 1 is located within the orthographic projection of the pixel defining layer 4 on the substrate 1. Specifically, the pixel defining layer 4 includes a second stack portion 411 and a second encapsulation portion 412; and the planarization layer 3 adjacent to the pixel defining layer 4 includes a first stack portion 311 and a first encapsulation portion 312.

[0054] The second stacked portion 411 is stacked with multiple planarization layers 3 along the thickness direction Y, and is located on the side surface of the first stacked portion 311 of the planarization layer 3 adjacent to the pixel defining layer 4 that is away from the substrate 1. The portion of the pixel defining layer 4 covering the side surface of the adjacent planarization layer 3 forms a second wrapping portion 412. The second wrapping portion 412 has two opposing ends. The first end of the second wrapping portion 412 is connected to the second stacked portion 411, and the end face of the first end of the second wrapping portion 412 is flush with the side surface of the second stacked portion 411 that is away from the substrate 1. The second end of the second wrapping portion 412 extends to the side surface of the multiple planarization layers 3 and the surface of the inorganic layer 2. That is, the second wrapping portion 412 covers the side surface of the multiple planarization layers 3 and contacts the side surface of the inorganic layer 2 that is away from the substrate 1.

[0055] In other words, the second layer stack 411 of the pixel defining layer 4 completely covers the side of the adjacent first layer stack 311 facing away from the substrate 1 along the thickness direction Y; while the second wrapping portion 412 of the pixel defining layer 4 completely covers the sides of the plurality of planarization layers 3 along the first direction X, and is disposed in close contact with the inorganic layer 2 to completely wrap the plurality of planarization layers 3. In this way, a step-like discontinuity is not formed between the pixel defining layer 4 and the plurality of planarization layers 3 at the edge along the first direction X, thereby preventing photoresist from accumulating at the edge when the anode layer is subsequently coated on the display substrate 10, thus avoiding the formation of metal residue.

[0056] Combination Figure 3b In this embodiment, the inorganic layer 2 may further have at least one second groove 22, which is formed on one side surface of the inorganic layer 2 facing the plurality of planarization layers 3. Along the thickness direction Y, the orthographic projection of the second groove 22 on the substrate 1 lies outside the orthographic projection of the planarization layer 3 adjacent to the pixel defining layer 4 on the substrate 1, and within the orthographic projection of the pixel defining layer 4 on the substrate 1. The portion of the second wrapping portion 412 of the pixel defining layer 4 near its second end is embedded in the second groove 22; and the embedded portion is in contact with the groove wall of the second groove 22. Preferably, the portion of the second wrapping portion 412 embedded in the second groove 22 is in contact with the entire groove wall of the second groove 22.

[0057] Specifically, such as Figure 3b As shown, the second groove 22 has a bottom wall and inner and outer side walls disposed opposite to each other; wherein, the side wall of the second groove 22 closest to the plurality of planarization layers 3 is the inner side wall, which is in contact with the side surface of the plurality of planarization layers 3; the side wall of the second groove 22 opposite to the plurality of planarization layers 3 is the outer side wall, and the angle β between the outer side wall and the bottom wall is less than 80°. Figure 3aThe portion of the second wrapping part 412 embedded in the second groove 22 is completely fitted with the bottom wall, inner sidewall, and outer sidewall of the second groove 22 to increase the adhesion between the second wrapping part 412 and the inorganic layer 2. This prevents the formation of a gap between the pixel limiting layer 4 and the inorganic layer 2 due to detachment, which could cause photoresist to accumulate in the gap and lead to metal residue. In other embodiments, the cross-section of the second groove 22 along the first direction X may also be rectangular; that is, the inner sidewall and outer sidewall of the second groove 22 are both perpendicular to the bottom wall.

[0058] Continue reading Figure 3a The second wrapping portion 412 is inclined toward the side of the plurality of planarization layers 3, and the angle β between the side surface of the second wrapping portion 412 away from the side of the plurality of planarization layers 3 and the inorganic layer 2 is smaller than the angle θ between the side surface of the first wrapping portion 312 adjacent to the second wrapping portion 412 and the inorganic layer 2. Thus, by reducing the angle β between the side surface of the second wrapping portion 412 away from the side of the plurality of planarization layers 3 and the inorganic layer 2, the risk of photoresist accumulation at the interface between the pixel defining layer 4 and the inorganic layer 2 during subsequent coating of the anode layer on the display substrate 10 is reduced, thereby avoiding the formation of metal residue. In this embodiment, the angle between the side surface of the second wrapping portion 412 away from the side of the plurality of planarization layers 3 and the inorganic layer 2 is preferably less than 80°.

[0059] Combination Figure 3b In this embodiment, the width e of the second groove 22 along the first direction X is greater than the width f of the first wrapping portion 312 adjacent to the pixel defining layer 4 along the first direction X; and along the first direction X, the side surface of the second wrapping portion 412 away from the plurality of planarization layers 3 is flush with the outer wall of the second groove 22, so that the width g of the second wrapping portion 412 along the first direction X gradually increases in the direction close to the second groove 22. In this way, the angle β between the side surface of the second wrapping portion 412 away from the plurality of planarization layers 3 and the inorganic layer 2 is smaller than the angle θ between the side surface of the first wrapping portion 312 adjacent to the second wrapping portion 412 and the inorganic layer 2.

[0060] Of course, in some embodiments, the second groove 22 may also be spaced apart from the sides of the plurality of planarization layers 3. In these embodiments, the second groove 22 is spaced apart from the sides of the plurality of planarization layers 3 near the inner sidewalls of the plurality of planarization layers 3; and the straight-line distance between the second groove 22 and the outer sidewalls of the plurality of planarization layers 3 and the sides of the plurality of planarization layers 3 is greater than the width f of the first wrapping portion 312 adjacent to the pixel defining layer 4 along the first direction X. Along the first direction X, the side surface of the second wrapping portion 412 away from the plurality of planarization layers 3 is flush with the outer sidewall of the second groove 22, so that the width g of the second wrapping portion 412 along the first direction X gradually increases in the direction close to the second groove 22. The width e of the second groove 22 is not limited, as long as the angle β between the side surface of the second wrapping portion 412 away from the plurality of planarization layers 3 and the inorganic layer 2 is less than the angle θ between the side surface of the first wrapping portion 312 adjacent to the second wrapping portion 412 near the second wrapping portion 412 and the inorganic layer 2.

[0061] Those skilled in the art will understand that in some embodiments, the upper planarization layer 31 of two adjacent planarization layers 3 may also consist only of the first layer stack 311. For example... Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application. In a specific embodiment, in two adjacent planarization layers 3, the side surface of the upper planarization layer 31 along the first direction X is flush with the side surface of the lower planarization layer 32 along the first direction X, so that the side surfaces of the multiple planarization layers 3 are all in the same plane. This prevents a step-like difference from forming at the edge along the first direction X between any two adjacent planarization layers 3, thereby preventing photoresist from accumulating at the edge of the planarization layer 3 and avoiding the formation of metal residue. It should be noted that the first direction X in "side surface along the first direction X" involved in this application specifically refers to... Figure 4 The arrow indicating the first direction X points to a single direction. Of course, in other embodiments, the first direction X may refer to... Figure 4 The direction indicated by the arrow can also be the opposite direction.

[0062] Furthermore, the pixel defining layer 4 may also consist only of the second layer stack 411. In this embodiment, the side surface of the pixel defining layer 4 along the first direction X is flush with the side surface of the plurality of planarization layers 3 along the first direction X, so that the pixel defining layer 4 and the plurality of planarization layers 3 do not form a step-like discontinuity at the edge along the first direction X. This prevents photoresist from accumulating at the edge when the anode layer is subsequently coated on the display substrate 10, thereby avoiding the formation of metal residue.

[0063] See Figure 5 , Figure 5This is a schematic diagram of the structure of a display substrate provided in another embodiment of this application. In this embodiment, the multiple planarization layers 3 may include a first planarization layer 301, a second planarization layer 302, and a third planarization layer 303 sequentially stacked with the inorganic layer 2; and the multilayer metal layers include a first metal layer 401, a second metal layer 402, a third metal layer 403, a fourth metal layer 404, and a fifth metal layer 405. Compared with the prior art, which typically uses a four-layer metal layer scheme, the five-layer metal layer stacking scheme adds a planarization layer, thereby increasing the overall thickness of the planarization layer. If the boundaries of the planarization layers are stacked together, the risk of metal residue from exposure etching is further increased. This embodiment avoids short circuit problems caused by metal residue by optimizing the design of the boundaries of adjacent planarization layers, thus preventing display abnormalities.

[0064] Specifically, a first metal layer 401 and a second metal layer 402 are disposed between the substrate 1 and the inorganic layer 2; the first metal layer 401 serves as the source / drain layer, and the second metal layer 402 serves as the capacitor layer. A third metal layer 403 is disposed between the inorganic layer 2 and the first planarization layer 301, and a fourth metal layer 404 is disposed between the first planarization layer 301 and the second planarization layer 302; the third metal layer 403 and the fourth metal layer 404 serve as signal transmission layers. The specific structures and functions of the source / drain layer, capacitor layer, and signal transmission layer are the same as or similar to those in the prior art, and will not be repeated here. A fifth metal layer 405 is disposed between the second planarization layer 302 and the third planarization layer 303; a portion of the fifth metal layer 405 serves as a signal transmission line for transmitting signals; the other portion of the fifth metal layer 405 serves as a power line when powered by an external power source to reduce impedance.

[0065] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application. In this embodiment, a display panel 100 is also provided, which may be an OLED screen for displaying images. The display panel 100 includes the display substrate 10 provided in any of the above embodiments. The specific structure and function of the display substrate 10 can be found in the relevant descriptions above, and will not be repeated here.

[0066] See Figure 7 , Figure 7This is a simplified structural diagram of a display device provided according to an embodiment of this application. This application provides a display device including the display panel 100 described above. The specific structure and function of the display panel 100 can be found in the aforementioned descriptions and will not be repeated here. The display device can be a product or component with display functionality, such as a mobile phone, tablet computer, laptop computer, or television. The display device also includes a motherboard, control circuitry, etc., whose structures are the same as or similar to those of existing display devices; specific details can be found in the prior art and will not be repeated here.

[0067] This application provides a display substrate, a display panel, and a display device. The display substrate 10 includes a substrate 1, an inorganic layer 2, and a plurality of planarization layers 3. The inorganic layer 2 is disposed on one side surface of the substrate 1; the plurality of planarization layers 3 are stacked on the side surface of the inorganic layer 2 facing away from the substrate 1; and a metal layer is disposed between two adjacent planarization layers 3; wherein, in two adjacent planarization layers 3, the width a of the upper planarization layer 31 along a first direction X perpendicular to the thickness direction Y of the display substrate 10 is greater than the width b of the lower planarization layer 32 along the first direction X; the upper planarization layer 31 is located on the side of the lower planarization layer 32 facing away from the substrate 1. With the above settings, a step-like discontinuity will not be formed at the edge of the two adjacent planarization layers 3. In the subsequent manufacturing process, this can prevent the photoresist from accumulating at the edge of the planarization layer 3. This avoids the situation where the photoresist is thicker at the step than at other locations, and the metal at the corresponding location cannot be exposed after exposure, development and etching, resulting in the metal at the corresponding location not being patterned and thus causing metal residue. Furthermore, it can also avoid the problem of short circuit of the display substrate 10 caused by metal residue, which would lead to display abnormalities of the display substrate 10.

[0068] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalent elements of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0069] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display substrate, characterized in that, include: Substrate; An inorganic layer is disposed on one side surface of the substrate; Multiple planarization layers are stacked on the side of the inorganic layer facing away from the substrate; A multilayer metal layer; wherein, a metal layer is disposed between two adjacent planarization layers; In the two adjacent planarization layers, the width of the upper planarization layer along a first direction perpendicular to the thickness direction of the display substrate is greater than the width of the lower planarization layer along the first direction; the upper planarization layer is located on the side of the lower planarization layer that is away from the substrate. In two adjacent planarization layers, the upper planarization layer includes a first stacked portion and a first wrapping portion. The first stacked portion is stacked with the lower planarization layer along the thickness direction. One end of the first wrapping portion is connected to the first stacked portion, and the other end extends to the side of the lower planarization layer and the surface of the inorganic layer.

2. The display substrate according to claim 1, characterized in that, The surface of the inorganic layer has at least one first groove, and the first wrapping portion is embedded in the at least one first groove and fits against the groove wall of the first groove.

3. The display substrate according to claim 2, characterized in that, The portion of the first wrapping part that is embedded in the first groove fits against the entire wall of the first groove.

4. The display substrate according to any one of claims 1-3, characterized in that, Also includes: A pixel defining layer is disposed on the side surface of the plurality of planarization layers facing away from the substrate; Furthermore, the width of the pixel defining layer along the first direction is greater than the width of the planarization layer adjacent to the pixel defining layer along the first direction.

5. The display substrate according to claim 4, characterized in that, The pixel defining layer includes a second stacked portion and a second wrapping portion. The second stacked portion is stacked with the plurality of planarization layers along the thickness direction. One end of the second wrapping portion is connected to the second stacked portion, and the other end extends to the side of the plurality of planarization layers and the surface of the inorganic layer.

6. The display substrate according to claim 5, characterized in that, The surface of the inorganic layer has at least one second groove, and the second wrapping portion is embedded in the second groove and fits against the groove wall of the second groove.

7. The display substrate according to claim 6, characterized in that, The portion of the second wrapping part that is embedded in the second groove fits against the entire wall of the second groove.

8. The display substrate according to claim 6, characterized in that, The angle between the sidewall of the second groove on the side opposite to the plurality of planarization layers and the bottom wall of the second groove is less than 80°.

9. The display substrate according to claim 6, characterized in that, One sidewall of the second groove is in contact with the sidewall of the plurality of planarization layers, and the width of the second groove along the first direction is greater than the width of the first enclosing portion of the planarization layer adjacent to the pixel defining layer along the first direction; or The second groove is spaced apart from the sides of the plurality of planarization layers, and the straight-line distance between the sidewall of the second groove away from the plurality of planarization layers and the sides of the plurality of planarization layers is greater than the width of the first wrapping portion adjacent to the pixel defining layer along the first direction.

10. The display substrate according to claim 6, characterized in that, The second wrapping portion is inclined toward the side of the plurality of planarization layers, and the angle between the side surface of the second wrapping portion away from the side of the plurality of planarization layers and the inorganic layer is less than 80°.

11. The display substrate according to any one of claims 1-3, characterized in that, The plurality of planarization layers include a first planarization layer, a second planarization layer, and a third planarization layer stacked sequentially with the inorganic layer; the multilayer metal layers include a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, and a fifth metal layer; wherein the first metal layer and the second metal layer are disposed between the substrate and the inorganic layer, the third metal layer is disposed between the inorganic layer and the first planarization layer, the fourth metal layer is disposed between the first planarization layer and the second planarization layer, and the fifth metal layer is disposed between the second planarization layer and the third planarization layer.

12. A display panel, characterized in that, Includes the display substrate as described in any one of claims 1-11.

13. A display device, characterized in that, Includes the display panel as described in claim 12.

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