Electronic component accommodating package and electronic device

Abstract

The signal line has a first section, a second section, and a third section from the coaxial line side. The width of the signal conductor in the second section is constant, is below the width of the signal conductor in the first section, and is wider than the width of the signal conductor in the central portion of the third section. In the second section, the interval between the signal conductor and the first ground conductor is constant, is narrower than the interval in the first section, and is wider than the interval in the central portion of the third section. The second section is a section in which, from the position overlapping the front end portion of the pin terminal, a length of 1 / 3 to 3 / 2 times the distance H between the signal conductor and the second ground conductor is present on the side opposite the coaxial line when viewed in a direction perpendicular to the first surface.

Description

Technical Field

[0001] This disclosure relates to packages for housing electronic components and electronic devices. Background Technology

[0002] Japanese Patent Application Publication No. 2007-123950 discloses a high-frequency signal converter having a coaxial line located in a wall and a planar substrate connected to the coaxial line on the side of the wall. Summary of the Invention

[0003] -The problem the invention aims to solve-

[0004] The electronic component housing package disclosed herein includes:

[0005] A substrate having walls and a receiving portion surrounded by said walls;

[0006] Coaxial lines, located in the wall; and

[0007] The signal line is located on the side of the wall and connected to the coaxial line.

[0008] The coaxial line has pin terminals protruding from the wall.

[0009] The signal line includes: an insulating plate having a first side and a second side located on the opposite side of the first side; a signal conductor located on the first side and connected to the pin terminal; a first ground conductor sandwiching the signal conductor and located on the first side; and a second ground conductor located on the second side.

[0010] The signal line has a first section, a second section, and a third section starting from the coaxial line side.

[0011] The width of the signal conductor in the second interval is constant, being less than the width of the signal conductor in the first interval but wider than the width of the signal conductor at the center of the third interval.

[0012] In the second interval, the spacing between the signal conductor and the first ground conductor is constant, narrower than the spacing in the first interval, and wider than the spacing at the center of the third interval.

[0013] The second interval is defined as follows: when viewed from a direction perpendicular to the first surface, at the position where the front ends of the pin terminals overlap, on the side opposite to the coaxial line, it has a length of 1 / 3 to 3 / 2 times the distance H between the signal conductor and the second ground conductor.

[0014] The electronic device involved in this disclosure has the following features:

[0015] The aforementioned package for housing electronic components; and

[0016] Electronic components are housed in a package for housing said electronic components. Attached Figure Description

[0017] Figure 1A This is a cross-sectional view showing the electronic component housing package and electronic device according to the embodiments of this disclosure.

[0018] Figure 1B This is a top view showing the electronic component housing package and electronic device according to the embodiments of this disclosure.

[0019] Figure 2 This is a cross-sectional perspective view showing a portion of the transmission path of the package for accommodating electronic components in an embodiment.

[0020] Figure 3 This is a top view showing the transmission path of the implementation method.

[0021] Figure 4A It is a graph showing the reflection characteristics of the transmission paths of the implementation method and Comparative Examples 1 to 3.

[0022] Figure 4B It is a graph showing the transmission characteristics of the transmission paths of the embodiments and Comparative Examples 1 to 3.

[0023] Figure 5A This is a top view showing the transmission path of Comparative Example 1.

[0024] Figure 5B This is a top view showing the transmission path of Comparative Example 2.

[0025] Figure 5C This is a top view showing the transmission path of Comparative Example 3.

[0026] Figure 6A This is a top view of the first example of a transmission path in an implementation that changes the length of the second interval.

[0027] Figure 6B This is a top view of a second example of a transmission path in an implementation that changes the length of the second interval.

[0028] Figure 7A This is a graph representing the reflection characteristics of shortening the transmission path in the second interval.

[0029] Figure 7B This is a graph showing the transmission characteristics of shortening the transmission path in the second interval.

[0030] Figure 8A This is a graph representing the reflection characteristics of the transmission path in the second interval of growth.

[0031] Figure 8B This is a graph representing the transmission characteristics of the transmission path in the second increasing interval.

[0032] Figure 9A This is a top view of a modified example 1 of the implementation method, showing the transmission path.

[0033] Figure 9B This is a graph showing the reflection characteristics of a variation of the transmission path in the implementation method, Example 1.

[0034] Figure 9C This is a graph showing the transmission characteristics of a variation of the transmission path in the embodiment 1.

[0035] Figure 10A This is a cross-sectional perspective view of a modified example 2 showing the transmission path of the implementation method.

[0036] Figure 10B This is a graph showing the reflection characteristics of a variation of the transmission path in the implementation method, Example 2.

[0037] Figure 10C This is a graph showing the transmission characteristics of a modified example 2 of the implementation method's transmission path. Detailed Implementation

[0038] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0039] Figure 1A This is a cross-sectional view showing the electronic component housing package and electronic device according to the embodiments of this disclosure. Figure 1B This is a top view showing the electronic component housing package and electronic device according to the embodiments of this disclosure. Figure 1A express Figure 1B The cross-section at the arrow AA line. Figure 1B This indicates that the structure of cover 5 has been omitted.

[0040] The electronic device 100 disclosed herein includes: an electronic component housing package 1 and an electronic component 6 housed in a receiving portion 3 of the electronic component housing package 1. The electronic component 6 is a component that performs either high-frequency signal input or output, such as a semiconductor laser component that converts a high-frequency electrical signal into an optical signal. Alternatively, the electronic component 6 may be an LN (LiNbO3) component that modulates laser light passing through an optical waveguide with a high-frequency electrical signal. There is no particular limitation as to whether the electronic component 6 performs either high-frequency signal input or output.

[0041] The electronic component housing package 1 includes: a base 4 having a wall 2 and a receiving portion 3 surrounded by the wall 2; a coaxial line 10 located on the wall 2; a signal line 20 located on the side of the wall 2; and a cover 5 blocking the opening of the receiving portion 3. The base 4 may be made of metal. The signal line 20 is located inside the wall 2 (on the side of the receiving portion 3), but it may also be located outside the wall 2. Hereinafter, the structure combining the coaxial line 10 and the signal line 20 will be referred to as the "transmission path".

[0042] Figure 2 This is a cross-sectional perspective view showing a portion of the transmission path of the package for accommodating electronic components in an embodiment. Figure 3 This is a top view showing the transmission path of the implementation method.

[0043] Coaxial line 10 Figure 2 The device shown includes: an inner conductor 11 serving as a core wire; a dielectric 12 surrounding the inner conductor 11; a cylindrical outer conductor 13 covering the radially outer side of the inner conductor 11; and pin terminals 11a connected to the inner conductor 11 and protruding from the dielectric 12. The pin terminals 11a extend along the central axis of the inner conductor 11. The dielectric 12 seals between the inner conductor 11 and the outer conductor 13.

[0044] The coaxial line 10 is located in the wall 2 (specifically, the through hole 2h in the wall 2) and transmits high-frequency signals between the inner and outer sides of the receiving portion 3. The pin terminal 11a protrudes from the wall 2 to a more inward side than the wall 2 (towards the receiving portion 3).

[0045] like Figure 2 as well as Figure 3 As shown, the signal line 20 includes: a plate-shaped insulating plate 21 having a first surface S1 and a second surface S2; a signal conductor 22 located on the first surface S1 and connected to the pin terminal 11a; a first ground conductor 23 sandwiching the signal conductor 22 and located on the first surface S1; and a second ground conductor 24 located on the second surface S2. The first surface S1 is located on the opposite side of the second surface S2. The insulating plate 21 is a dielectric material, but it can also be ceramic. The signal line 20 can also be referred to as a coplanar line with a back conductor.

[0046] Signal conductor 22, first ground conductor 23, and second ground conductor 24 are film conductors. The second ground conductor 24 is opposite to signal conductor 22 and first ground conductor 23 and extends on the second surface S2.

[0047] The signal line 20 also has a plurality of via conductors 25 connecting the first ground conductor 23 and the second ground conductor 24. Each via conductor 25 extends from the first surface S1 to the second surface S2 of the insulating plate 21. Figure 2In the diagram, the upper end of the via conductor 25 is indicated by a dashed line, but the via conductor 25 extends from the first surface S1 to the second surface S2 in a direction perpendicular to the first surface S1.

[0048] The width and thickness of the signal conductor 22, the spacing between the signal conductor 22 and the first ground conductor 23, the distance between the signal conductor 22 and the second ground conductor 24, and the spacing of the plurality of via conductors 25 are set according to the frequency of the transmitted signal and the relative permittivity of the insulating plate 21 to match the specified impedance. The signal frequency is assumed to be in the 80 GHz band or higher. The distance H between the signal conductor 22 and the second ground conductor 24 is less than 1 / 4 of the effective wavelength of the high-frequency signal, and the spacing of the plurality of via conductors 25 is less than 1 / 2 of the effective wavelength of the high-frequency signal.

[0049] On the other hand, since the periphery of the connection portion of the coaxial line 10 in the signal line 20 is a part where the transmission mode of high-frequency signals changes, the size and shape of the signal conductor 22 in this part, as well as the size and shape of the space between the signal conductor 22 and the first ground conductor 23, are different from other parts of the signal line 20.

[0050] like Figure 3 As shown, signal line 20 has a first interval U1, a second interval U2 and a third interval U3 along the direction of signal conductor 22, starting from the coaxial line 10 side.

[0051] The first interval U1 is the interval from the end of the signal line 20 on the wall 2 side to the position where the front end of the pin terminal 11a overlaps when viewed from a direction perpendicular to the first surface S1. The second interval U2 is the interval with a length of H / 3 to 3H / 2 from the position where the front end of the pin terminal 11a overlaps when viewed from a direction perpendicular to the first surface S1 on the side opposite to the coaxial line 10. The third interval U3 is the interval from the end of the second interval U2 on the side opposite to the coaxial line 10 to the end of the signal line 20 on the side opposite to the coaxial line 10. The aforementioned length H is the distance between the signal conductor 22 and the second ground conductor 24. The term "front end" of the pin terminal 11a not only refers to the exact front end of the pin terminal 11a, but also means a portion with a small width from the front end towards the root side. This small width can be a length to the extent that the influence on the transmission characteristics of high-frequency signals can be ignored, for example, a length equivalent to less than 1 / 16 of the effective wavelength λ of the high-frequency signal.

[0052] Within the main range of the third section U3, the width wa3 of the signal conductor 22 is constant, and the spacing wb3 between the signal conductor 22 and the first ground conductor 23 is constant. However, in the portion near the end of the signal line 20, the shape and size of the signal conductor 22 and the first ground conductor 23 may differ from the central portion U3c of the third section U3 for connection to other transmission paths. Furthermore, in the third section U3, the portion of the signal conductor 22 and the first ground conductor 23 adjacent to the second section U2 may be fitted with angles or rounded corners. In other words, although the beginning and end portions of the third section U3 are not constant, the width wa3 of the signal conductor 22 and the spacing wb3 between the signal conductor 22 and the first ground conductor 23 are constant in the central portion U3c of the third section U3.

[0053] In the first interval U1, the width wa1 of the signal conductor 22 is greater than the width wa3 of the central part U3c in the third interval U3, and the distance wb1 between the signal conductor 22 and the first ground conductor 23 is greater than the distance wb3 in the third interval U3.

[0054] In the first interval U1, the left and right sides ha1 and hb1 of the signal conductor 22 may include portions parallel to the length direction of the signal conductor 22. The length direction of the signal conductor 22 refers to the direction along the centerline passing through the center of the width of the signal conductor 22. Furthermore, in the first interval U1, the two sides hc1 and hd1 on the inner side of the first ground conductor 23 (the side closest to the signal conductor 22) may include portions parallel to the length direction of the signal conductor 22.

[0055] In the second interval U2, the width wa2 of the signal conductor 22 is constant, less than the width wa1 of the first interval U1, and greater than the width wa3 of the third interval U3. Furthermore, in the second interval U2, the distance wb2 between the signal conductor 22 and the first ground conductor 23 is constant, smaller than the aforementioned distance wb1 in the first interval U1, and larger than the aforementioned distance wb3 in the central portion U3c of the third interval U3.

[0056] In the second interval U2, the left and right sides ha2 and hb2 of the signal conductor 22 are parallel to the length direction of the signal conductor 22. The length direction of the signal conductor 22 refers to the direction along the center line passing through the center of the width of the signal conductor 22. In addition, in the second interval U2, the two sides hc2 and hd2 of the inner side of the first grounding conductor 23 (the side closest to the signal conductor 22) are parallel to the length direction of the signal conductor 22.

[0057] The width wa2 of the signal conductor 22 in the second section U2 is smaller than the diameter w0 of the pin terminal 11a. The width wa1 of the signal conductor 22 in the first section U1 can be smaller than the diameter w0 of the pin terminal 11a, or it can be the same as the width wa2 of the second section U2.

[0058] Pin terminal 11a is connected to signal conductor 22 in the first interval U1 primarily via conductive bonding material e.

[0059] <High-frequency characteristics>

[0060] Figure 4A This is a graph showing the reflection characteristics of the transmission paths of the implementation methods and comparative examples 1 to 3. Figure 4B It is a graph showing the transmission characteristics of the transmission paths of the embodiments and Comparative Examples 1 to 3. Figures 5A to 5C These are top views showing the transmission paths 81 to 83 of Comparative Examples 1 to 3, respectively.

[0061] like Figure 4A , 4B As shown in the characteristic curve of the embodiment, the simulation results show that the transmission path of the electronic component housing package 1 according to this embodiment has good frequency characteristics with low reflection loss and insertion loss in a higher frequency domain such as 80 GHz, that is, low reflection coefficient and high transmission coefficient.

[0062] In the plate-shaped signal line 20 (a coplanar line with a back conductor), the width of the signal conductor 22 and the spacing between the signal conductor 22 and the first ground conductor 23 are constrained according to frequency characteristic requirements, except in sections near the beginning or end. Furthermore, in the first section U1 connected to the pin terminal 11a, the shape and size of the signal conductor 22, as well as the shape and size of the spacing between the signal conductor 22 and the first ground conductor 23, are constrained to meet frequency characteristic and strength requirements. That is, it is designed such that the width of the signal conductor 22 in the first section U1 is larger than the width of the central portion U3c of the third section U3, and the spacing between the signal conductor 22 and the first ground conductor 23 in the first section U1 is larger than the spacing between the central portion U3c of the third section U3.

[0063] Figures 5A to 5C In the comparative example transmission paths 81-83, the signal conductor 22 in the first interval U1 and the third interval U3, and the interval between the signal conductor 22 and the first ground conductor 23, have the same characteristics as... Figure 3 The same shape and size are used in the implementation method. Furthermore, in the second interval U2, from... Figure 3 The implementation changes the shape and size of the signal conductor 22 and the space between the signal conductor 22 and the first ground conductor 23.

[0064] Figure 5A The transmission path 81 is as follows: the signal conductor 22 and the first ground conductor 23 of the second interval U2 are tapered, and the signal conductor 22 and the first ground conductor 23 of the first interval U1 are connected to the signal conductor 22 and the first ground conductor 23 of the third interval U3 without steps.

[0065] Figure 5B The transmission path 82 is an example where the width of the signal conductor 22 is wider only at the portion approximately connected to the pin terminal 11a, and the spacing between the signal conductor 22 and the first ground conductor 23 narrows in a stepped manner. In Comparative Example 2, the shape and size of the side of the first ground conductor 23 opposite to the signal conductor 22 are similar to... Figure 3 The implementation method is the same.

[0066] Figure 5C The transmission path 83 is an example as follows: from the first interval U1 to the second interval U2, the width of the signal conductor 22 is set to be wider, just like the portion connected to the pin terminal 11a; the spacing between the signal conductor 22 and the first ground conductor 23 also extends to the second interval U2, and is set to be wider, just like the first interval U1. In Comparative Example 3, the shape and size of the signal conductor 22 are similar to... Figure 3 The implementation method is the same.

[0067] Compared to the transmission paths 81 to 83 of Comparative Examples 1 to 3, the transmission path of the electronic component housing package 1 in the embodiment differs in the shape and size of the signal conductor 22 in the second interval U2, as well as the shape and size of the space between the signal conductor 22 and the first ground conductor 23.

[0068] like Figure 4A as well as Figure 4B The simulation results show that the transmission path of the electronic component housing package 1 of the embodiment has significantly better frequency characteristics in a higher frequency domain such as 80 GHz compared to the transmission paths 81 to 83 of Comparative Examples 1 to 3.

[0069] <Length of interval U2 in section 2>

[0070] Figure 6A This is a top view of the first example showing the change in the length of the second interval U2. Figure 6B This is a top view of the second example of a transmission path in an implementation that changes the length of the second interval. Figure 7A This is a graph showing the reflection characteristics when the second interval is shortened. Figure 7B This is a graph showing the transmission characteristics of shortening the transmission path in the second interval. Figure 8A This is a graph showing the reflection characteristics when the second interval of growth is reached. Figure 8B This is a graph representing the transmission characteristics of the transmission path in the second increasing interval.

[0071] like Figure 6A as well as Figure 6B As shown, if the length of the second interval U2 is different, the frequency characteristics of the transmission path will also be different. Figure 7A , Figure 7B , Figure 8A as well as Figure 8B This represents the frequency characteristics of the transmission path when the length of the second interval U2 is set to (1 / 3)×H, (3 / 8)×H, (1 / 2)×H, (3 / 4)×H, 1×H, (5 / 4)×H, and (3 / 2)×H. The length H is the distance between the signal conductor 22 and the second grounding conductor 24.

[0072] like Figure 7A , Figure 7B , Figure 8A as well as Figure 8B As shown, good frequency characteristics are obtained when the length of U2 in the second interval is (1 / 3)×H to (3 / 2)×H. Furthermore, even better frequency characteristics are obtained when the length of U2 in the second interval is (1 / 2)×H to 1×H.

[0073] (Variation Example 1)

[0074] Figure 9A This is a top view of a modified example 1 showing the transmission path of the implementation method. Figure 9B This is a graph showing the reflection characteristics of a variation of the transmission path in the implementation method, Example 1. Figure 9C This is a graph showing the transmission characteristics of Modified Example 1 of the implementation method's transmission path. The signal line 20A of Modified Example 1 is as follows... Figure 9A As shown, at one end of the third interval U3 (on the side near the second interval U2), there are stepped portions 221a and 221b where the width of the signal conductor 22 narrows in a stepped manner. Furthermore, in the modified example 1, the signal line 20A has stepped portions 231a and 231b on the inner side of the first ground conductor 23 (on the side near the signal conductor 22), which narrows the gap between the signal conductor 22 and the first ground conductor 23 in a stepped manner.

[0075] In the signal line 20A of the modified example 1, the second interval U2 does not include the step portions 221a, 221b, 231a, 231b, and has a length of (1 / 3)×H to (3 / 2)×H.

[0076] like Figure 9B as well as Figure 9C As shown, even though the signal line 20A has stepped portions 221a, 221b, 231a, 231b in the third interval U3 and has a length of (1 / 3)×H to (3 / 2)×H in the second interval U2, it also has good frequency characteristics as described above.

[0077] <Variation Example 2>

[0078] Figure 10A This is a cross-sectional perspective view of a modified example 2 showing the transmission path of the implementation method. Figure 10B This is a graph showing the reflection characteristics of a variation of the transmission path in the implementation method, Example 2. Figure 10C This is a graph showing the transmission characteristics of a modified example 2 of the transmission path of the embodiment. Modification 2 is an example in which the diameters of the internal conductor 11B and the pin terminal 11Ba of the coaxial line 10 are changed. Figure 10A An example is as follows: Set pin terminal 11Ba to be connected to... Figure 3 The pin terminals 11a of the embodiment have the same diameter, and the internal conductor 11B is set to be larger than that of the pin terminals 11a. Figure 3 In this embodiment, the inner conductor 11 is thinner. That is, the diameter of the pin terminal 11Ba is larger than the diameter of the inner conductor 11. This structure is referred to as variant example 2a. Furthermore, both the pin terminal 11Ba and the inner conductor 11B are set to be thinner than... Figure 3 The pin terminal 11a and the internal conductor 11 of the embodiment are referred to as modified example 2b. In addition, in modified examples 2a and 2b, as the diameter of the internal conductor 11B is changed, the diameter of the dielectric 12 or the relative permittivity is adjusted so that the impedance in the coaxial line 10 does not become mismatched.

[0079] like Figure 10B as well as Figure 10C As shown, even in Modification 2b, where the diameters of the pin terminal 11Ba and the inner conductor 11B are set to be smaller, good frequency characteristics are obtained in the high-frequency domain such as 80 GHz. Furthermore, as in Modification 2a, by setting the diameter of the pin terminal 11Ba to be larger than the diameter of the inner conductor 11B, good frequency characteristics are obtained in the high-frequency domain such as 80 GHz compared to... Figure 3 The implementation method and variation 2b can obtain better frequency characteristics.

[0080] As described above, according to the electronic component housing package 1 of this embodiment, the signal line 20 has a first section U1, a second section U2, and a third section U3 from the coaxial line 10 side. The width wa2 of the signal conductor 22 in the second section U2 is constant, which is less than the width wa1 of the signal conductor 22 in the first section U1 and wider than the width wa3 of the signal conductor 22 in the third section U3. Furthermore, the spacing wb2 between the signal conductor 22 and the first ground conductor 23 in the second section U2 is constant, which is narrower than the spacing wb1 in the first section U1 and wider than the spacing wb3 in the central portion U3c of the third section U3. Moreover, when viewed from a direction perpendicular to the first surface S1 of the insulating plate 21, the second section U2 has a length of (1 / 3)×H to (3 / 2)×H from the position where the front end of the pin terminal 11a of the coaxial line 10 overlaps on the side opposite to the coaxial line 10. Based on this structure, good frequency characteristics with low reflection coefficient and high transmission coefficient can be achieved in higher frequency domains such as 80 GHz.

[0081] Furthermore, in the electronic component housing package 1 according to this embodiment, the width of the signal conductor 22 in the second interval U2 is narrower than the width (diameter w0) of the pin terminal 11a. With this structure, better frequency characteristics can be achieved in higher frequency domains such as 80 GHz.

[0082] Furthermore, in the electronic component housing package 1 according to this embodiment, the sides ha2 and hb2 of the signal conductor 22 in the second interval U2 are parallel to the length direction of the signal conductor 22. In addition, the sides hc2 and hd2 of the first ground conductor 23 closest to the signal conductor 22 are parallel to the length direction of the signal conductor 22. With this structure, better frequency characteristics can be achieved in higher frequency domains such as 80 GHz. Alternatively, the signal conductor 22 can also be a curved structure; in this case, the sides of the signal conductor 22 in the second interval U2 and the side of the first ground conductor 23 closest to the signal conductor 22 can be curved in the same way as the signal conductor 22.

[0083] Furthermore, in the electronic component housing package 1 according to Modified Example 2a, the diameter of the lead terminal 11Ba of the coaxial line 10 is larger than the diameter of the internal conductor 11B. With this structure, better frequency characteristics can be achieved in higher frequency domains such as 80 GHz.

[0084] Furthermore, the electronic device 100 according to this embodiment can achieve good frequency characteristics in a higher frequency range such as 80 GHz by using the electronic component housing package 1.

[0085] The embodiments of this disclosure have been described above. However, the electronic component housing package and electronic device of this disclosure are not limited to the above embodiments, and appropriate modifications can be made without departing from the spirit of the invention.

[0086] Industrial availability

[0087] This instruction can be used for packages that house electronic components and electronic devices.

[0088] Symbol Explanation

[0089] 1. Package for housing electronic components

[0090] 2. Wall

[0091] 3. Reception Section

[0092] 4. Matrix

[0093] 5. Cover

[0094] 6 Electronic components

[0095] 10 coaxial lines

[0096] 11, 11B Internal conductors

[0097] 12 Dielectric

[0098] 13 External conductor

[0099] 11a, 11Ba pin terminals

[0100] w0 pin terminal diameter

[0101] 20 signal lines

[0102] 21 Insulation Board

[0103] S1 Page 1

[0104] S2 Page 2

[0105] 22 Signal conductor

[0106] 23 First grounding conductor

[0107] 24 Second grounding conductor

[0108] 25. Via conductor

[0109] e Bonding material

[0110] U1, first interval

[0111] U2, second interval

[0112] U3, Section 3

[0113] The widths of signal conductors wa1, wa2, and wa3

[0114] The spacing between signal conductors wb1, wb2, and wb3 and the first grounding conductor.

[0115] hal, hb1, hc1, hd1, ha2, hb2, hc2, hd2 edges

[0116] 100 Electronic devices.

Claims

1. A package for housing electronic components, comprising: A substrate having walls and a receiving portion surrounded by said walls; Coaxial lines, located in the wall; and The signal line is located on the side of the wall and connected to the coaxial line. The coaxial line has pin terminals protruding from the wall. The signal line includes: an insulating plate having a first side and a second side located opposite the first side; a signal conductor located on the first side and connected to the pin terminal; a first ground conductor sandwiching the signal conductor and located on the first side; and a second ground conductor located on the second side. The signal line has a first section, a second section, and a third section starting from the coaxial line side. The width of the signal conductor in the second interval is constant, being less than the width of the signal conductor in the first interval but wider than the width of the signal conductor at the center of the third interval. In the second interval, the spacing between the signal conductor and the first ground conductor is constant, narrower than the spacing in the first interval, and wider than the spacing at the center of the third interval. The second interval is defined as follows: when viewed from a direction perpendicular to the first surface, at the position where the front ends of the pin terminals overlap, on the side opposite to the coaxial line, it has a length of 1 / 3 to 3 / 2 times the distance H between the signal conductor and the second ground conductor.

2. The package for housing electronic components according to claim 1, wherein, The width of the signal conductor in the second interval is narrower than the width of the pin terminal.

3. The package for housing electronic components according to claim 1, wherein, The sides of the signal conductor in the second interval are parallel to the length direction of the signal conductor. The side of the first grounding conductor in the second interval that is close to the signal conductor is parallel to the length direction of the signal conductor.

4. The package for housing electronic components according to claim 2, wherein, The sides of the signal conductor in the second interval are parallel to the length direction of the signal conductor. The side of the first grounding conductor in the second interval that is close to the signal conductor is parallel to the length direction of the signal conductor.

5. The package for housing electronic components according to any one of claims 1 to 4, wherein, The coaxial line further includes: an inner conductor connected to the pin terminals; and a dielectric surrounding the inner conductor. The diameter of the pin terminal is larger than the diameter of the internal conductor.

6. An electronic device comprising: The package for housing electronic components as described in any one of claims 1 to 5; and Electronic components are housed in the housing.

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