Thermally conductive insulating shell and electronic device

Abstract

This application provides a thermally conductive insulating shell (100) and an electronic device, relating to the field of heat dissipation technology. The heat dissipation component (110) in the thermally conductive insulating shell (100) is made of a thermally conductive insulating material composed of fiber material and thermally conductive filler in a predetermined ratio. Because this thermally conductive insulating material includes fiber material, its structural strength and toughness are improved, allowing it to be repeatedly bent without damage. Furthermore, the thermally conductive filler filling the pores in the fiber material not only enhances the thermal conductivity of the insulating material but also improves its pressure resistance. This allows the thermally conductive insulating material to be bent into the shape of a component with a heat dissipation component, resulting in high structural stability and a simple manufacturing process, thus reducing the cost of the electronic device.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a thermally conductive insulating shell and an electronic device. Background Technology

[0002] As electronic devices trend towards miniaturization, the integration of components within them is increasing. These components generate significant heat during operation. If this heat cannot be dissipated promptly, the internal temperature of the electronic device will rise, affecting its normal operation and potentially posing an explosion hazard. Currently, one of the best methods to improve the heat dissipation capacity of electronic devices is to enhance the thermal conductivity of the thermally conductive insulating materials placed inside. Highly thermally conductive insulating materials can quickly transfer heat from the inside of the electronic device to the outside.

[0003] Among existing thermally conductive insulating materials, the most widely used is polyimide (PI) film, which consists of PI material and thermally conductive filler. In its manufacturing process, the thermally conductive filler is added to the PI material through physical blending to obtain the PI film thermally conductive insulating material. However, this type of thermally conductive insulating material suffers from drawbacks such as weak structural strength, poor structural toughness, and low puncture resistance, preventing it from being bent and thus limiting its application to flat surfaces in electronic devices. However, most components in electronic devices exist in a three-dimensional form; simply laying the thermally conductive insulating material flat on top of these components results in poor heat dissipation. Summary of the Invention

[0004] To address the aforementioned issues, embodiments of this application provide a thermally conductive insulating shell and an electronic device. The shell utilizes a bendable thermally conductive insulating material, which is bent into a predetermined shape and nested onto components. This effectively transfers heat from the components to the outside, significantly improving the heat dissipation of the electronic device.

[0005] Therefore, the following technical solutions are adopted in the embodiments of this application:

[0006] In a first aspect, this application provides a thermally conductive insulating shell, comprising: a heat dissipation assembly for being nested on a component to transfer heat from the component to the outside; wherein the heat dissipation assembly is a three-dimensional structure formed by a thermally conductive insulating material into a predetermined shape, the thermally conductive insulating material comprising a fiber material and a thermally conductive filler, the fiber material comprising at least two types of fibers, and the thermally conductive filler filling the pores in a matrix composed of the fiber material.

[0007] In this embodiment, a thermally conductive insulating material composed of fiber material and thermally conductive filler in a predetermined ratio is selected. Because this thermally conductive insulating material includes fiber material, its structural strength and toughness are improved, allowing it to be repeatedly bent without damage. Furthermore, filling the pores in the fiber material with thermally conductive filler not only enhances its thermal conductivity but also improves its voltage resistance, enabling it to be bent into the shape of a component with heat dissipation elements and then nested onto the component for better heat dissipation in electronic devices. Compared to the PI film thermally conductive insulating material used in the prior art, the thermally conductive insulating material protected in this application, obtained by bending the thermally conductive insulating material into a predetermined shape, has higher structural stability and a simpler manufacturing process, reducing the cost of electronic devices.

[0008] In one embodiment, the thermally conductive filler is a non-conductive material.

[0009] In this embodiment, by selecting thermally conductive fillers that are not conductive, the heat dissipation components are also non-conductive, thus avoiding short circuits inside the electronic device caused by the conductivity of the heat dissipation components.

[0010] In one embodiment, the heat dissipation assembly is provided with at least one fixing structure for coupling with a fixing structure on the component.

[0011] In this embodiment, one or more fixing structures are provided on the heat dissipation component. By coupling with the fixing structure on the component, the heat dissipation component can be fixed to the component, thus preventing the thermally conductive insulating shell from falling off the component.

[0012] In one embodiment, it further includes: at least one shielding component disposed on the outer surface of the heat dissipation component for shielding electrical signals emitted by the component.

[0013] In this embodiment, for components that emit radiation signals, one or more shielding components can be provided on the outer surface of the heat dissipation assembly, so that the heat dissipation assembly is nested on the component, which can shield the radiation signals emitted by the component and prevent the radiation signals emitted by the component from affecting the normal operation of other components.

[0014] In one embodiment, the at least one shielding component is joined to the outer surface of the heat dissipation component by one or more of the following methods: physical contact, pressure pressing, adhesive bonding, PLD coating, CVD coating, and fixing with a fixing component.

[0015] In this embodiment, by superimposing the shielding component and the heat dissipation component to construct a layered composite material, the shielding function is increased without increasing the volume of the thermally conductive insulating shell.

[0016] In one embodiment, the shielding component is one or more of the following: graphene sheet, metal coating, metal sheet, mesh structure made of interwoven metal wires, mesh structure made of interwoven carbon fibers, and sheet made of bonded metal powder.

[0017] In one embodiment, each shielding component is provided with at least one fixing structure for coupling with a fixing structure on the component.

[0018] In this embodiment, if the shielding component has a certain strength, one or more fixing structures can be set on the shielding component. By coupling with the fixing structure on the component, the thermally conductive insulating shell can be fixed to the component, thus preventing the thermally conductive insulating shell from falling off the component.

[0019] In one embodiment, the component further includes an adhesive disposed on the outer surface of the heat dissipation assembly for fixing the heat dissipation assembly to the component.

[0020] In this embodiment, by applying an adhesive between the component and the heat dissipation assembly, the heat dissipation assembly can be fixed to the component, preventing it from falling off. Compared to setting a fixing structure on the heat dissipation assembly or shielding assembly, this solution is simpler to implement and less expensive.

[0021] Secondly, this application provides an electronic device, comprising: at least one component, and at least one thermally conductive insulating shell, each of which may be implemented according to the first aspect, wherein the at least one thermally conductive insulating shell is respectively nested on the at least one component. The electronic device may be an adapter, a power module, an inverter, a lithium battery, etc., and the component refers to a heat-generating device in the electronic device. If the electronic device is a battery module, the aforementioned component may be a battery cell, a transformer in a battery control module, a resistor, etc.; if the electronic device is an adapter, the aforementioned component may be a frequency converter, a transformer, etc., or even the entire circuit board in the adapter. Attached Figure Description

[0022] The accompanying drawings used in the description of the embodiments or prior art are briefly introduced below.

[0023] Figure 1 This is a schematic diagram of the structure of a thermally conductive insulating shell provided in the embodiments of this application;

[0024] Figure 2 This is a flowchart illustrating the manufacturing process of the thermally conductive and insulating material provided in the embodiments of this application.

[0025] Figure 3(a) shows a cuboid-shaped thermally conductive insulating material provided in an embodiment of this application;

[0026] Figure 3(b) shows the thermally conductive and insulating material after cutting off the excess portion provided in the embodiment of this application;

[0027] Figure 3(c) is a schematic diagram of the shape of the thermally conductive insulating material bent into a heat dissipation component according to the embodiment of this application;

[0028] Figure 4(a) is a schematic diagram of the shielding component provided in the embodiment of this application being attached to the heat dissipation component by spraying.

[0029] Figure 4(b) is a schematic diagram of the shielding component provided in the embodiment of this application being attached to the heat dissipation component by physical contact or pressure pressing.

[0030] Figure 4(c) is a schematic diagram of the shielding component provided in the embodiment of this application being attached to the heat dissipation component by means of adhesive;

[0031] Figure 4(d) is a schematic diagram of the shielding component provided in the embodiment of this application being directly pasted on the heat dissipation component. Detailed Implementation

[0032] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0033] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0036] Existing PI film thermally conductive and insulating materials suffer from drawbacks such as weak structural strength, poor structural toughness, and low puncture resistance, limiting their application to a flat, layered manner on top of components. For heat dissipation of three-dimensional components, multiple PI films with the same shape as each side of the component need to be cut, then spliced ​​and fixed together to form a three-dimensional heat dissipation structure resembling the component's shape, which can then be nested onto the component. However, the existing manufacturing process for three-dimensional heat dissipation structures is complex, increasing the cost of electronic devices, and the stability of such structures, formed by splicing multiple materials, is relatively poor.

[0037] Figure 1 This is a schematic diagram of the structure of a thermally conductive insulating shell provided in an embodiment of this application. Figure 1 As shown, the thermally conductive insulating shell 100 includes a heat dissipation assembly 110 and a shielding assembly 120. The specific structure and interconnections of each component are as follows:

[0038] The heat dissipation component 110 is formed by bending a thermally conductive insulating material, which is composed of fiber material and thermally conductive filler in a predetermined ratio. The fiber material generally serves as the matrix material, allowing the thermally conductive insulating material to be molded into a predetermined shape and to encapsulate the thermally conductive filler. In this application, the thermally conductive insulating material with fiber material as the matrix exhibits significantly improved structural strength and toughness, enabling it to withstand repeated bending without damage.

[0039] In this embodiment, the fiber material can be selected from various materials such as aramid fiber, polyester fiber, kraft paper fiber, polyphenylene sulfide (PPS) fiber, polyethylene fiber, and cellulose. Among them, aramid fiber has high strength and toughness, which can better improve the structural strength and toughness of thermally conductive and insulating materials, but its price is relatively expensive. Compared with aramid fiber, polyester fiber, kraft paper fiber, PPS fiber, polyethylene fiber, cellulose fiber, etc., although their structural strength and toughness are lower, are cheaper, which can reduce the cost of thermally conductive and insulating materials.

[0040] Therefore, the fiber material of this application can use two types of fibers: one type is aramid fiber, and the other type is one or more fiber materials such as polyester fiber, kraft paper fiber, PPS fiber, polyethylene fiber, and cellulose. By mixing these two types of fibers, the cost of the thermally conductive insulating material can be appropriately reduced while ensuring its strength and flexibility, thus allowing the conductive insulating material to possess the advantages of multiple types of fibers. The first type of fiber is not limited to aramid fiber; it only needs to improve the structural strength and structural toughness of the thermally conductive insulating material.

[0041] In this application, the weight percentages of the first type of fiber and the second type of fiber relative to the total fiber material can be any value, determined specifically according to the application scenario of the thermally conductive and insulating material. If the cost requirement for the thermally conductive and insulating material is relatively high, the second type of fiber can account for a larger proportion; if the structural strength and structural toughness requirements for the thermally conductive and insulating material are relatively high, the first type of fiber can account for a larger proportion.

[0042] Thermally conductive fillers, when mixed into fibrous materials, can impart strong thermal conductivity to thermally conductive insulating materials. In this application, the thermally conductive fillers can be selected from materials with high thermal conductivity but no electrical conductivity, such as boron nitride (BN), alumina (Al2O3), and magnesium hydroxide (Mg(OH)2). This not only improves the thermal conductivity of the insulating material but also prevents the thermally conductive filler from becoming conductive, which could lead to short circuits within the electronic equipment. Optionally, the thermally conductive insulating material composed of insulating thermally conductive fillers must not only provide insulation but also meet 3kV AC withstand voltage requirements to comply with safety regulations.

[0043] Preferably, a small amount of thermally conductive fillers with excellent thermal conductivity, such as graphite or graphene, can also be added. Since the amount of such thermally conductive fillers added is relatively small, it does not affect the insulation performance of the thermally conductive insulating material.

[0044] In the process of manufacturing thermally conductive and insulating materials, this application generally employs a "paper-making process," but it is not limited to this single process and other processes can also be used; this application does not impose any limitations on this. The specific process of manufacturing thermally conductive and insulating materials using the paper-making process can be combined with, for example... Figure 2 As shown, specifically:

[0045] Step S201: Mix the fiber material and water in a set ratio to obtain an aqueous solution of the fiber material.

[0046] Fiber materials generally exist in a solid, filamentous form, intertwined and inseparable. Therefore, a large amount of water is needed to dilute the fiber materials, allowing them to separate and distribute evenly in the water. Optionally, the fiber materials and water can be mixed at a ratio of one gram of fiber material to one kilogram of water, allowing the fiber materials to fully decompose in the water and distribute evenly, facilitating subsequent reshaping.

[0047] For water containing fibrous materials, centrifugation, stirring, or other methods can be used to decompose the fibrous materials in the water, resulting in an aqueous solution. If the fibrous material is thermoplastic, it is relatively difficult to decompose at room temperature. In this case, the aqueous solution containing the fibrous material can be heated to facilitate its decomposition in the water. Optionally, the heating temperature generally depends on the type of fibrous material. If the fibrous material has a high melting and boiling point, the heating temperature will increase accordingly; if the fibrous material has a low melting and boiling point, the heating temperature will decrease accordingly.

[0048] Step S202: Filter the water in the aqueous solution of the fiber material to obtain the fiber material with the water removed.

[0049] After obtaining the aqueous solution of the fiber material, the solution can be poured onto a filter screen to filter out the water, allowing the fiber material to spread evenly on the screen. The fiber material, after solid-liquid separation, forms a paper-like shape on the filter screen with pores, allowing for subsequent filling with thermally conductive filler.

[0050] After solid-liquid separation, the fiber material remaining on the filter screen still contains a large amount of moisture, which will affect the subsequent filling of thermally conductive fillers. Therefore, it is necessary to remove the moisture from the fiber material. Exemplary methods for removing moisture from the fiber material include natural air drying, baking, etc., and this application does not limit the method.

[0051] Step S203: Fill the pores of the moisture-removed fiber material with thermally conductive filler to obtain a thermally conductive insulating material.

[0052] After removing the moisture from the fiber material, the fiber material is peeled off the filter screen and then placed into thermally conductive filler powder. The thermally conductive filler can be fully filled into the pores of the fiber material through ultrasonic vibration, pressure extrusion, etc. Finally, the fiber material filled with thermally conductive filler is cut to obtain a thermally conductive insulating material of a set shape.

[0053] In this application, in thermally conductive insulating materials, if the thermally conductive filler accounts for a larger proportion of the total weight of the thermally conductive insulating material, the amount of fiber material in the thermally conductive insulating material will be smaller. Although this can improve the thermal conductivity of the thermally conductive insulating material, it will reduce the structural strength and toughness of the thermally conductive insulating material. Similarly, if the fiber material accounts for a larger proportion of the total weight of the thermally conductive insulating material, the amount of thermally conductive filler in the thermally conductive insulating material will be smaller. Although this can improve the structural strength and toughness of the thermally conductive insulating material, it will reduce the thermal conductivity. Therefore, this application, through experimental verification, selects a fiber material accounting for 20%-95% of the total weight of the thermally conductive insulating material and a thermally conductive filler accounting for 5%-80% of the total weight of the thermally conductive insulating material, thereby obtaining a thermally conductive insulating material with optimal thermal conductivity, structural strength, and structural toughness.

[0054] In this embodiment, by mixing fiber material and thermally conductive filler in a certain proportion, the resulting conductor insulation material, due to the presence of fiber material, can improve the structural strength and toughness of the thermally conductive insulation material. Furthermore, due to the presence of thermally conductive filler, which fills the pores of the fiber material, it can not only improve the thermal conductivity of the thermally conductive insulation material but also improve its withstand voltage rating. This allows the thermally conductive insulation material to be bent into the shape of a component with heat dissipation components and wrapped around the outer surface of an electronic device, thereby better dissipating heat for the electronic device.

[0055] In this application, if the fiber material is made of a material with poor adhesion, such as cellulose, the resulting thermally conductive insulating material will experience problems such as surface cracking and material detachment when bent, which will seriously affect the product quality. Therefore, a polymer can be added to the thermally conductive insulating material to improve its adhesion and avoid surface cracking and material detachment. For example, the thermally conductive insulating material also includes a polymer as an adhesive between the fiber material and the thermally conductive material, allowing for better bonding between fiber materials, between fiber materials and thermally conductive fillers, and between thermally conductive fillers. The main component of the polymer is a polymer, which can be one or more combinations of materials such as epoxy resin, polyvinyl chloride, polyethylene, and natural rubber; this application does not limit this to a specific type.

[0056] In this application, the added polymer accounts for 0%-10% of the total weight of the thermally conductive insulating material. While adding more polymer increases the adhesiveness of the thermally conductive insulating material, it also reduces its thermal conductivity, structural strength, and structural toughness. Therefore, this application experimentally verified that selecting a polymer content of 0%-10% of the total weight of the thermally conductive insulating material yields the optimal performance in terms of adhesiveness, thermal conductivity, structural strength, and structural toughness.

[0057] In this embodiment of the application, during the process of making thermally conductive insulating material from fiber material and thermally conductive filler, a polymer can be added to better bond the fiber material to the fiber material, the fiber material to the thermally conductive filler, and the thermally conductive filler to the filler, so that the thermally conductive insulating material will not have problems such as cracking on the outer surface or falling off during bending.

[0058] In this application, the thermally conductive insulating material can be processed by cutting, bending, and other techniques to create the heat dissipation assembly 110. For example, referring to Figure 3(a), a cuboid-shaped thermally conductive insulating material is first selected. Since the heat dissipation assembly 110 is to be nested on the outer surface of a component, the surface of the largest side of the selected thermally conductive insulating material must be at least larger than the surface of the component so that it can be bent and nested onto the component.

[0059] Referring to Figure 3(b), the thermally conductive insulating material shown in Figure 3(a) is cut to remove unwanted portions, so that excess material does not interfere with bending the thermally conductive insulating material into the desired shape. The cutting method for the thermally conductive insulating material can be machine cutting, manual cutting with tools, etc., and this application does not limit the method. Optionally, during machine cutting, shallow creases are pressed into the areas that need to be bent to facilitate subsequent bending.

[0060] Referring to Figure 3(c), the cut thermally conductive insulating material shown in Figure 3(b) is bent, with the edges on both sides of the material turned upwards so that the two sides form a predetermined angle with the middle part of the material. When the two sides of the material are bent upwards at the predetermined angle, the bend is generally rounded to avoid excessive bending, which could lead to cracking on the outer surface of the thermally conductive insulating material or internal material detachment. Of course, if the thermally conductive insulating material has high structural strength and toughness, the bending angle can be right angle.

[0061] In this application, one or more fixing structures can be provided on the heat dissipation assembly 110, so that the heat dissipation assembly 110 is nested on the component. The fixing structure on the heat dissipation assembly 110 can be coupled with the fixing structure on the component to fix the thermally conductive insulating shell 100 on the component and prevent the thermally conductive insulating shell 100 from falling off the component.

[0062] The fixing structure on the heat dissipation assembly 110 can be multiple through holes, which can be nested on the protrusions on the component to achieve a fixing effect; alternatively, it can be aligned with the through holes in the component and fixed to the shielding assembly 120 on the component using screws, clips, or other components. The fixing structure on the heat dissipation assembly 110 can also be a groove portion, which can couple with the protrusions on the component to achieve a fixing effect. The fixing structure on the heat dissipation assembly 110 can also be a protrusion portion, which can couple with the groove portion on the component to achieve a fixing effect. Other shapes of the fixing structure on the heat dissipation assembly 110 are not limited herein.

[0063] In this application, a thermally conductive insulating material composed of fiber material and thermally conductive filler in a predetermined ratio is selected. Because this thermally conductive insulating material includes fiber material, its structural strength and toughness are improved, allowing it to be repeatedly bent without damage. Furthermore, filling the pores of the fiber material with thermally conductive filler not only enhances its thermal conductivity but also improves its voltage resistance. This allows the thermally conductive insulating material to be bent into the shape of a component with a heat dissipation assembly, which can then be nested onto the component for better heat dissipation in electronic devices. Compared to the PI film thermally conductive insulating material used in the prior art, the heat dissipation effect of the heat dissipation assembly made from the thermally conductive insulating material protected in this application is nearly doubled. Moreover, this heat dissipation assembly, obtained by bending the thermally conductive insulating material into a predetermined shape, has high structural stability and a simple manufacturing process, reducing the cost of electronic devices.

[0064] The shielding components (120-1, 120-2) are used to shield the radiation signals emitted by a component, preventing the radiation signals emitted by the component from affecting the normal operation of other components. The shielding components (120-1, 120-2) are made of materials capable of shielding electromagnetic waves, such as metals, graphene, etc., which are not limited herein. The structure of the shielding components (120-1, 120-2) can be one or more of the following: graphene sheets, metal coatings, metal foils, a mesh structure made of interwoven metal wires, a sheet made of bonded metal powder, etc., which are also not limited herein.

[0065] The thermally conductive insulating material selected in this application is generally in the form of paper, and its thickness is generally between a few millimeters and several hundred millimeters to avoid excessive thickness that would hinder heat dissipation and further encroach on the already limited space inside electronic equipment. Optionally, for safety regulations, the thickness of the thermally conductive insulating material is generally between 200 micrometers and 450 micrometers.

[0066] In this application, the shielding components (120-1, 120-2) and the heat dissipation component 110 can be joined by one or more methods, such as physical contact, adhesive bonding, or fixing with a fixing component. For example, as shown in Figure 4(a), if the shielding component 120 is made of graphene, metal powder, or other powders, graphene can be sprayed onto the outer surface of the heat dissipation component 110 to form a thin film that adheres to the heat dissipation component 110. As shown in Figure 4(b), if the shielding component 120 is made of a metal material, it can be bonded to the outer surface of the heat dissipation component 110 through physical contact or pressure pressing, thereby fixing the shielding component 120 to the heat dissipation component 110. As shown in Figure 4(c), if the shielding component 120 is made of a metal material, it can also be bonded to the outer surface of the heat dissipation component 110 using an adhesive, thereby fixing the shielding component 120 to the heat dissipation component 110. As shown in Figure 4(d), if the material of the shielding component 120 is graphene, metal powder, or other powders, it can be mixed with the adhesive before being pasted onto the outer surface of the heat dissipation component 110, thereby fixing the shielding component 120 onto the heat dissipation component 110.

[0067] For example, if the fiber material in the thermally conductive insulating material constituting the heat dissipation component 110 is aramid fiber or cellulose, the shielding component 120 and the heat dissipation component 110 can be bonded to the outer surface of the heat dissipation component 110 by physical contact or pressure pressing as shown in FIG. 4(b), thereby fixing the shielding component 120 to the heat dissipation component 110. If the fiber material in the thermally conductive insulating material constituting the heat dissipation component 110 is kraft paper fiber, the shielding component 120 and the heat dissipation component 110 can be bonded to the outer surface of the heat dissipation component 110 by using an adhesive as shown in FIG. 4(c), thereby fixing the shielding component 120 to the heat dissipation component 110. For other fiber materials, the following can be used: Figures 4(a)-4(d) Any combination method between them, as well as other bonding methods, such as pulsed laser deposition (PLD) coating, chemical vapor deposition (CVD) coating, etc., are not limited in this application.

[0068] In this application, if the shielding component 120 is a structure with a certain strength, such as a graphene sheet or a metal sheet, one or more fixing structures can be provided on the shielding component 120. This allows the fixing structures on the shielding component 120 to couple with the fixing structures on the component after the thermally conductive insulating shell 100 is nested on the component, thus fixing the thermally conductive insulating shell 100 to the component and preventing it from detaching. The fixing structures on the shielding component 120 serve the same function as the fixing structures on the heat dissipation component 110 described above. Therefore, the fixing method and shape of the fixing structures on the shielding component 120 and the fixing structures on the component are completely identical to those on the heat dissipation component 110 described above, and will not be repeated here.

[0069] Furthermore, in the thermally conductive insulating shell protected by this application, an adhesive can be coated on the inner outer surface of the heat dissipation component, allowing the thermally conductive insulating shell to be nested on the component and fixed to it by the adhesive. Compared to setting a fixing structure on the heat dissipation component 110 or the shielding component 120, this method is not only simpler to implement but also lower in cost. For example, the thermally conductive insulating shell can also be fixed to the component by welding, pressure pressing, etc., which are not limited to this application.

[0070] In this embodiment of the application, by setting one or more shielding components on a heat dissipation component made of thermally conductive and insulating material, and by nesting the heat dissipation component on a component of a corresponding shape, the radiation signal emitted by the component can be shielded, thereby preventing the radiation signal emitted by the component from affecting the normal operation of other components.

[0071] This application also provides an electronic device, which includes at least one component and at least one such component. Figure 1 - As shown in Figure 4 and the corresponding protection scheme described above, each thermally conductive insulating shell is nested on a component of a corresponding shape. Since the electronic device includes this thermally conductive insulating shell, it possesses all or at least some of the advantages of this shell. The electronic device can be an adapter, power module, inverter, lithium battery, etc., and the component refers to a heat-generating device within the electronic device. If the electronic device is a battery module, the aforementioned components can be battery cells, transformers in the battery control module, resistors, etc. If the electronic device is an adapter, the aforementioned components can be frequency converters, transformers, etc., or even the entire circuit board in the adapter; and so on.

[0072] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions in the embodiments of this application.

Claims

1. A thermally conductive insulating shell, characterized in that, include: A heat dissipation assembly (110) is used to be nested on a component to transfer heat from the component to the outside; wherein, the heat dissipation assembly is a three-dimensional structure made of thermally conductive and insulating material with a predetermined shape, the predetermined shape being the shape of the component. The thermally conductive insulating material includes fiber material, thermally conductive filler and polymer. The fiber material includes at least two types of fibers. The thermally conductive filler fills the pores in the matrix composed of the fiber material. The polymer fills the spaces between the fiber materials, between the fiber materials and the thermally conductive filler, and between the thermally conductive filler and the thermally conductive filler.

2. The thermally conductive insulating shell according to claim 1, characterized in that, The thermally conductive filler is a non-conductive material.

3. The thermally conductive insulating shell according to claim 1 or 2, characterized in that, The heat dissipation assembly is provided with at least one fixing structure for coupling with the fixing structure on the component.

4. The thermally conductive insulating shell according to any one of claims 1-3, characterized in that, Also includes: At least one shielding component (120) is disposed on the outer surface of the heat dissipation component for shielding the electrical signals emitted by the component.

5. The thermally conductive insulating shell according to claim 4, characterized in that, The at least one shielding component is joined to the outer surface of the heat dissipation component by one or more of the following methods: physical contact, pressure pressing, adhesive bonding, and fixing of the component.

6. The thermally conductive insulating shell according to claim 4 or 5, characterized in that, The shielding component is one or more of the following: graphene sheet, metal coating, metal sheet, mesh structure made of interwoven metal wires, mesh structure made of interwoven carbon fibers, and sheet made of bonded metal powder.

7. The thermally conductive insulating shell according to any one of claims 4-6, characterized in that, Each shielding component has at least one fixing structure for coupling with the fixing structure on the component.

8. The thermally conductive insulating shell according to any one of claims 1-7, characterized in that, Also includes: An adhesive is applied to the outer surface of the heat dissipation component to fix the heat dissipation component to the component.

9. An electronic device, characterized in that, include: At least one component, At least one thermally conductive insulating shell as described in any one of claims 1-8, wherein the at least one thermally conductive insulating shell is nested on the at least one component.

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