一种沾锡装置

By designing a tin-dipping device with clamping and cutting mechanisms, the problem of unstable clamping of copper wires during the tin-dipping process was solved, achieving consistency in tin-dipping height and position, and improving tin-dipping quality and stability.

CN117123878BActive Publication Date: 2026-07-17ANHUI JIEXUN OPTOELECTRONICS TECH
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ANHUI JIEXUN OPTOELECTRONICS TECH
Filing Date
2023-08-31
Publication Date
2026-07-17

Smart Images

  • Figure CN117123878B_ABST
    Figure CN117123878B_ABST
Patent Text Reader

Abstract

本发明公开了一种沾锡装置，包括工作台；安装在工作台上的夹紧机构，所述夹紧机构由移动机构带动进行竖直方向的移动，所述夹紧机构包括对称设置的夹紧杆，所述夹紧杆由旋转机构带动其进行轴向转动，所述夹紧杆由伸缩机构带动其在水平方向进行移动；设置在夹紧机构上方的限位块，所述限位块与夹紧机构通过伸缩杆连接，所述限位块上设有限位孔，所述限位块下端设有水平滑槽，所述水平滑槽内安装有移动块，所述移动块与伸缩杆上端固定；安装在工作台上的支撑台，所述支撑台上安装有用于切断待沾锡材料的切割机构，所述切割机构下方安装有接料箱；设置在夹紧机构下方的锡槽。该沾锡装置可以提高工件沾锡的一致性以及夹持的稳定性。
Need to check novelty before this filing date? Find Prior Art