Hot melt mechanism, device, temperature control method, and storage medium

Abstract

The embodiment of the application provides a hot melting mechanism, a device, a temperature control method and a storage medium, and belongs to the technical field of product processing. The hot melting mechanism comprises a base, and a hot melting head assembly arranged on the base. The hot melting head assembly comprises a heating unit, a heating copper block unit and a temperature sensing head unit. The heating copper block unit is provided with a mounting groove and a hot melting protrusion. The heating unit is arranged on the mounting groove, and the temperature sensing head unit is arranged on the hot melting protrusion. The heating unit is used for connecting an external power supply to heat the heating copper block unit. The heating copper block unit is used for hot melting of a cell film of a to-be-melted cell. According to the embodiment of the application, the cell can be assembled and filmed safely, at low cost and with high efficiency.

Description

Technical Field

[0001] This application relates to the field of product processing technology, and in particular to a hot-melt mechanism, device, temperature control method and storage medium. Background Technology

[0002] In the lithium battery manufacturing process, a Mylar film is wrapped around the outside of the cell to protect it from scratches. The Mylar film is then fixed to the top cover of the cell by a heat-sealing connection. The welding effect and the adhesion of the film affect the fixing strength of the coating, making the coating process particularly important for cell assembly.

[0003] In the cell assembly and coating process, heating wires are typically installed on the heat sealing head, and the Mylar film is heat-melted and coated using these heating wires, with multiple heat-melting processes occurring through a single heat sealing head. However, in actual processing, the heating wires may burn out due to frequent heating, affecting the cell processing progress, slowing down the process, and reducing efficiency. Furthermore, frequent replacement of the heating wires also increases processing costs. Therefore, how to safely and cost-effectively assemble and coat battery cells has become a problem that needs to be solved. Summary of the Invention

[0004] The main objective of this application is to provide a hot-melt mechanism, device, temperature control method, and storage medium that can safely, cost-effectively, and efficiently assemble and coat battery cells.

[0005] To achieve the above objectives, a first aspect of this application provides a heat-melting mechanism, comprising:

[0006] Base;

[0007] A hot melt head assembly is disposed on the base. The hot melt head assembly includes a heating unit, a heating copper block unit, and a temperature sensing head unit. The heating copper block unit is provided with a mounting groove and a hot melt protrusion. The heating unit is disposed on the mounting groove, and the temperature sensing head unit is disposed on the hot melt protrusion. The heating unit is used to connect to an external power source to heat the heating copper block unit. The heating copper block unit is used to hot melt the cell coating of the cell to be melted.

[0008] In some embodiments, the base includes a frame, a fixed plate, a movable plate, and a lifting cylinder. The fixed plate is disposed on the frame, and the movable plate and the lifting cylinder are disposed on the fixed plate. The lifting cylinder is used to drive the movable plate to move.

[0009] In some embodiments, the heating copper block unit includes a first copper block and a second copper block, the first copper block and the second copper block abutting against each other, the heating copper block unit is disposed on the movable plate, the first copper block is provided with the mounting groove, and the second copper block is provided with the hot melt protrusion.

[0010] In some embodiments, the heating copper block unit includes a first copper block and a second copper block, the first copper block and the second copper block abutting against each other, the heating copper block unit is disposed on the movable plate, the first copper block is provided with the mounting groove, and the second copper block is provided with the hot melt protrusion.

[0011] In some embodiments, the placement assembly further includes a sensor disposed on the first placement plate, the sensor being configured to send a feedback signal when it senses that the cell under test is carried on the second placement plate.

[0012] In some embodiments, the temperature sensing head unit includes a first temperature sensing head and a second temperature sensing head, the first temperature sensing head and the second temperature sensing head are respectively disposed on the side of the hot melt protrusion, and the first temperature sensing head and the second temperature sensing head are used to obtain the real-time temperature of the hot melt head assembly.

[0013] In some embodiments, the movable plate is provided with an airflow duct, and at least one air outlet is provided below the airflow duct, the air outlet being used to blow air along the hot-melt protrusion.

[0014] In some embodiments, a synthetic stone for heat insulation is provided between the movable plate and the heating copper block unit, and heat insulation cotton is provided on the fixed plate to insulate against the heat generated by the hot melting mechanism.

[0015] A second aspect of this application provides a hot-melting apparatus, including the hot-melting mechanism as described in the first aspect, and further comprising:

[0016] The turntable mechanism includes a turntable body, a driver, and multiple mounting brackets. The turntable body has multiple slots, and the mounting brackets are correspondingly arranged with the slots. The hot-melt mechanism is mounted on the mounting brackets. The driver is used to drive the turntable body to rotate circumferentially so that the slots correspond to the hot-melt mechanism.

[0017] In some embodiments, the hot-melting mechanism includes a first hot-melting mechanism, a second hot-melting mechanism, and a third hot-melting mechanism. The first hot-melting mechanism is used to hot-melt the upper surface of the battery cell to be melted, the second hot-melting mechanism is used to hot-melt the side surface of the battery cell to be melted, and the third hot-melting mechanism is used to hot-melt the lower surface of the battery cell to be melted.

[0018] In some embodiments, the hot-melting mechanism includes a first hot-melting mechanism, a second hot-melting mechanism, and a third hot-melting mechanism. The first hot-melting mechanism is used to hot-melt the upper surface of the battery cell to be melted, the second hot-melting mechanism is used to hot-melt the side surface of the battery cell to be melted, and the third hot-melting mechanism is used to hot-melt the lower surface of the battery cell to be melted.

[0019] In some embodiments, the first hot-melt mechanism, the second hot-melt mechanism, and the third hot-melt mechanism are configured in one of the following ways:

[0020] The first hot-melt mechanism is mounted on the first mounting frame, the second hot-melt mechanism is mounted on the second mounting frame, and the third hot-melt mechanism is mounted on the third mounting frame;

[0021] or,

[0022] The first hot-melt mechanism and the third hot-melt mechanism are symmetrically mounted on the first mounting frame, and the second hot-melt mechanism is mounted on the second mounting frame.

[0023] A third aspect of this application provides a temperature control method applied to the hot-melting apparatus described in the second aspect, the method comprising:

[0024] Within a preset time period, the real-time temperature sent by the temperature sensing head unit is acquired, and the acquisition time of the real-time temperature by the temperature sensing head unit within the time period is recorded.

[0025] A temperature line graph is generated by plotting a preset curve template based on the real-time temperature and the acquisition time.

[0026] The temperature line graph is monitored in real time to obtain monitoring results;

[0027] The working status of the heating unit in the hot melt mechanism is controlled based on the monitoring results.

[0028] In some embodiments, before acquiring the real-time temperature sent by the temperature sensing unit and the time of acquiring the real-time temperature, the method further includes:

[0029] A temperature control signal is sent to the hot melt device so that the hot melt head assembly in the hot melt mechanism is heated to a preset target temperature according to the temperature control signal.

[0030] In some embodiments, the real-time monitoring of the temperature line graph to obtain monitoring results includes:

[0031] Set a controlled temperature range on the temperature line graph;

[0032] The temperature line graph is monitored in real time, and the collection time when the real-time temperature is outside the controlled temperature range is recorded to obtain the monitoring results.

[0033] A fourth aspect of this application provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the temperature control method as described in any one of the embodiments of the third aspect of this application.

[0034] The hot-melting mechanism, device, temperature control method, and storage medium proposed in this application have the following beneficial effects: The hot-melting head assembly is mounted on a base and includes a heating unit, a heating copper block unit, and a temperature sensing head unit. The heating copper block unit replaces the heating wire in the prior art, thus avoiding the problem of the heating wire easily breaking and reducing development costs. The heating copper block unit is provided with a mounting groove and a hot-melting protrusion. The heating unit is mounted on the mounting groove, and the temperature sensing head unit is mounted on the hot-melting protrusion, thereby fixing the heating unit and the temperature sensing head unit. The heating unit is used to connect to an external power source to heat the heating copper block unit, thereby achieving temperature regulation of the hot-melting head assembly. The heating copper block unit is used to hot-melt the cell coating of the cell to be melted, improving the safety of the hot-melting mechanism, avoiding the problem of the heating wire breaking, and improving the efficiency of cell processing. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of the hot-melt mechanism provided in the embodiments of this application;

[0036] Figure 2 This is a schematic diagram of the structure of a hot-melt mechanism provided in another embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the structure of the hot-melt device provided in the embodiments of this application;

[0038] Figure 4 This is a schematic diagram of the third hot-melt mechanism provided in the embodiments of this application;

[0039] Figure 5 This is a flowchart illustrating the specific method of the temperature control method provided in the embodiments of this application;

[0040] Figure 6 This is a flowchart illustrating a specific method of a temperature control method provided in another embodiment of this application;

[0041] Figure 7 yes Figure 5 The detailed flowchart of step S103;

[0042] Figure 8This is a schematic diagram of the hardware structure of the computer device provided in the embodiments of this application. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0044] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0046] The temperature control method provided in this application can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, or smartwatch, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms; the software can be an application that implements the above method, but is not limited to the above forms.

[0047] The embodiments of this application can be used in numerous general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer computer devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0048] In the lithium battery manufacturing process, a Mylar film is wrapped around the outside of the cell to protect it from scratches. The Mylar film is then fixed to the top cover of the cell by a heat-sealing connection. The welding effect and the adhesion of the film affect the fixing strength of the coating, making the coating process particularly important for cell assembly.

[0049] In the cell assembly and coating process, heating wires are typically installed on the heat sealing head, and the Mylar film is heat-melted and coated using these heating wires, with multiple heat-melting processes occurring through a single heat sealing head. However, in actual processing, the heating wires may burn out due to frequent heating, affecting the cell processing progress, slowing down the process, and reducing efficiency. Furthermore, frequent replacement of the heating wires also increases processing costs. Therefore, how to safely and cost-effectively assemble and coat battery cells has become a problem that needs to be solved.

[0050] To address the aforementioned issues, this embodiment proposes a hot-melt mechanism, device, temperature control method, and storage medium, offering the following advantages: The hot-melt head assembly is mounted on a base and includes a heating unit, a heating copper block unit, and a temperature sensing head unit. The heating copper block unit replaces the heating wire in existing technologies, thus avoiding the problem of the heating wire easily breaking and reducing development costs. The heating copper block unit is provided with a mounting groove and a hot-melt protrusion. The heating unit is mounted on the mounting groove, and the temperature sensing head unit is mounted on the hot-melt protrusion, thereby fixing the heating unit and the temperature sensing head unit. The heating unit is used to connect to an external power source to heat the heating copper block unit, thereby regulating the temperature of the hot-melt head assembly. The heating copper block unit is used to hot-melt the cell coating of the cell to be melted, improving the safety of the hot-melt mechanism, avoiding the problem of the heating wire breaking, and improving the efficiency of cell processing.

[0051] Please refer to Figure 1, Figure 1 This is a schematic diagram of the hot-melt mechanism provided in the embodiments of this application.

[0052] In some embodiments, the hot-melt mechanism 200 includes a base; a hot-melt head assembly disposed on the base, the hot-melt head assembly including a heating unit 100, a heating copper block unit, and a temperature sensing head unit, the heating copper block unit being provided with a mounting groove 230 and a hot-melt protrusion 240, the heating unit being disposed on the mounting groove, and the temperature sensing head unit being disposed on the hot-melt protrusion, the heating unit being used to connect to an external power source to heat the heating copper block unit, the heating copper block unit being used to hot-melt the cell coating of the cell to be melted, thereby replacing the heating wire technical solution in the prior art, avoiding a series of problems caused by the heating wire breaking, such as increased costs due to frequent replacement of the heating wire, and prolonging the cell processing process, etc.

[0053] It should be noted that the heating unit in this embodiment can be a quartz heating tube, a stainless steel heating tube, a composite tube heater, etc., and this embodiment does not impose any specific limitations.

[0054] In some embodiments, the base includes a frame 410, a fixed plate 420, a movable plate 430, and a lifting cylinder 440. The fixed plate 420 is mounted on the frame 410, thereby providing a stable support platform for the hot-melting mechanism. The movable plate 430 and the lifting cylinder 440 are mounted on the fixed plate 420, which supports and fixes the movable plate 430 and the lifting cylinder 440, ensuring that the battery cell will not move or shake during processing, thus guaranteeing the stability and accuracy of processing. The lifting cylinder 440 is used to drive the movable plate 430 to move, thereby further driving the movement of the heating copper block unit and improving processing accuracy.

[0055] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a hot-melt mechanism provided in another embodiment of this application.

[0056] In some embodiments, the heating copper block unit includes a first copper block 210 and a second copper block 220, which abut against each other. The heating copper block unit is disposed on the movable plate 430. The first copper block 210 is provided with a mounting groove, and the second copper block 220 is provided with a heat-melting protrusion, thereby achieving uniform heating, reducing the temperature gradient, avoiding local overheating, and because copper has a high thermal conductivity, the heating copper block can conduct heat to the object to be heated more quickly, improving the heating speed and efficiency.

[0057] Understandably, compared to heating wires, heating copper blocks typically offer better corrosion and wear resistance, maintaining stable heating performance for longer periods. This helps extend the equipment's lifespan and reduces maintenance and replacement costs. Furthermore, since the heating copper block is generally a single, integral structure with no exposed wires or resistance wires, it improves equipment safety to some extent, reducing potential safety hazards caused by poor wiring connections or short circuits.

[0058] In some embodiments, the temperature sensing head unit includes a first temperature sensing head 310 and a second temperature sensing head 320, which are respectively disposed on the side of the hot melt protrusion. The first temperature sensing head 310 and the second temperature sensing head 320 are used to acquire the real-time temperature of the hot melt head assembly, thereby enabling real-time monitoring and control of the temperature inside the hot melt head. This improves the accuracy and stability of the temperature, ensuring that the temperature remains within a preset range during processing, and enhances the safety of the hot melt head assembly.

[0059] It should be noted that the cooperation of the first temperature sensor 310 and the second temperature sensor 320 in this embodiment can detect a wider range of temperature changes, avoiding temperature runaway caused by the failure of one temperature sensor. Furthermore, by monitoring the temperature at multiple locations in real time, a better understanding of the temperature distribution inside the heat exchanger can be achieved, allowing for corresponding optimized control.

[0060] In some embodiments, the movable plate 430 is provided with an airflow duct, and at least one air outlet is provided below the airflow duct. The air outlet is used to blow air along the hot-melt protrusion, thereby accelerating the cooling of the heated copper block unit.

[0061] In some embodiments, a synthetic stone 450 for heat insulation is provided between the movable plate 430 and the heating copper block unit, and heat insulation cotton is provided on the fixed plate 420. The heat insulation cotton is used to isolate the heat generated by the heat melting mechanism, thereby preventing the heat generated by the heat melting mechanism from damaging other mechanical equipment or battery cell products and improving the safety of the heat melting mechanism.

[0062] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the hot-melt device provided in the embodiments of this application.

[0063] In some embodiments, the hot-melt device includes, for example, Figure 1The hot-melting mechanism shown also includes a turntable mechanism, which includes a turntable body 500, a driver 600, and multiple mounting brackets 700. The turntable body 500 has multiple slots 510, and the mounting brackets are set to correspond to the slots. The hot-melting mechanism is mounted on the mounting brackets to fix the hot-melting mechanism and ensure that the battery cell will not move or shake during processing. The driver 600 is used to drive the turntable body 500 to rotate circumferentially so that the slots correspond to the hot-melting mechanism, ensuring that the hot-melting mechanism corresponds to the battery cell to be melted, and realizing the hot-melting of the battery cell to be melted.

[0064] It should be noted that the number of mounting brackets and slots in this embodiment can be adjusted according to the user's needs, for example, five, six, seven, etc. In this embodiment, the turntable body 500 moves the battery cells to be melted to each hot melting mechanism, thereby improving the processing efficiency of the battery cells to be melted and enabling the processing of multiple battery cells to be melted at the same time.

[0065] Understandably, each slot of the hot melt device is also equipped with a cell clamp 520 to fix the cell to be melted, preventing the cell from moving during the hot melt process. Furthermore, the clamping range of the cell clamp 520 can be adjusted to accommodate cells of various sizes, thus broadening the application scenarios of the hot melt device.

[0066] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the third hot-melt mechanism provided in the embodiments of this application.

[0067] In some embodiments, the hot-melt mechanism includes a first hot-melt mechanism 810, a second hot-melt mechanism 820, and a third hot-melt mechanism 830. The first hot-melt mechanism 810 is used to hot-melt the upper surface of the battery cell to be melted, the second hot-melt mechanism 820 is used to hot-melt the side surface of the battery cell to be melted, and the third hot-melt mechanism 830 is used to hot-melt the lower surface of the battery cell to be melted, thereby achieving all-round hot-melting of the battery cell to be melted, achieving hot-melt fixation of the battery cell coating and the cover plate sidewall, and improving the hot-melt efficiency of the battery cell to be melted.

[0068] It should be noted that the number of temperature sensing head units provided in the first heat fusion mechanism 810, the second heat fusion mechanism 820, and the third heat fusion mechanism 830 can be adjusted. For example, the number of temperature sensing head units in the first heat fusion mechanism 810 and the third heat fusion mechanism 830 can be set to three, and the number of temperature sensing head units in the second heat fusion mechanism 820 can be set to two; the number of temperature sensing head units in the first heat fusion mechanism 810, the second heat fusion mechanism 820, and the third heat fusion mechanism 830 can each be set to two, etc. This embodiment does not impose specific limitations.

[0069] It is worth noting that the number of temperature sensing head units in the second heat-melting mechanism 820 is at least two, and the number of temperature sensing head units is an even number, such as two, four, six, etc. The temperature sensing head units of the second heat-melting mechanism 820 are symmetrically arranged on both sides of the battery cell to be melted, so as to heat-melt the sides of the battery cell to be melted.

[0070] In some embodiments, the first hot-melt mechanism 810, the second hot-melt mechanism 820, and the third hot-melt mechanism 830 are configured in one of the following ways:

[0071] The first hot-melt mechanism 810 is mounted on the first mounting frame, the second hot-melt mechanism 820 is mounted on the second mounting frame, and the third hot-melt mechanism 830 is mounted on the third mounting frame;

[0072] or,

[0073] The first hot-melt mechanism 810 and the third hot-melt mechanism 830 are symmetrically mounted on the first mounting frame, and the second hot-melt mechanism 820 is mounted on the second mounting frame.

[0074] It is understandable that when the first hot-melt mechanism 810 is mounted on the first mounting frame, the second hot-melt mechanism 820 is mounted on the second mounting frame, and the third hot-melt mechanism 830 is mounted on the third mounting frame, it means that the first hot-melt mechanism 810, the second hot-melt mechanism 820, and the third hot-melt mechanism 830 are all set separately. When the first hot-melt mechanism 810 and the third hot-melt mechanism 830 are symmetrically mounted on the first mounting frame, and the second hot-melt mechanism 820 is mounted on the second mounting frame, it means that the first hot-melt mechanism 810 and the third hot-melt mechanism 830 are symmetrically arranged vertically to achieve hot-melt of the upper and lower surfaces of the battery cell to be fused. The second hot-melt mechanism 820 is set separately from the first mounting frame to achieve hot-melt of the side surface of the battery cell to be fused.

[0075] Please refer to Figure 5 , Figure 5 This is a flowchart of a specific method of the temperature control method provided in the embodiments of this application. It is applied, but not limited to, to the hot melt device described above. In some embodiments, the temperature control method includes, but is not limited to, steps S101 to S104.

[0076] Step S101: Within a preset time period, acquire the real-time temperature sent by the temperature sensing head unit, and record the acquisition time of the real-time temperature by the temperature sensing head unit within the time period.

[0077] In some embodiments, within a preset time period, the real-time temperatures transmitted by the first and second temperature sensors in the temperature sensing head unit are acquired, and the acquisition time of the real-time temperature collected by the temperature sensing head unit within the time period is recorded, thereby enabling the heating status of the heating copper block unit to be obtained and realizing real-time monitoring of the heating status of the heating copper block unit.

[0078] It should be noted that the preset time period can be set by the user according to their needs, such as within five minutes, within ten minutes, within twenty minutes, etc. This embodiment can also set multiple time periods to obtain the real-time temperature sent by the temperature sensing head unit at different event periods, thereby realizing the testing of the temperature of the thermal fusion head assembly at different stages. This embodiment does not impose specific limitations.

[0079] It is worth noting that the first and second temperature sensors are connected to different solid-state relays to prevent temperature control failure when a single temperature sensor malfunctions, thereby improving the accuracy and stability of temperature control.

[0080] Step S102: Draw a temperature line graph by plotting a preset curve template based on the real-time temperature and the acquisition time.

[0081] In some embodiments, multiple sets of temperature-time coordinates are generated based on the real-time temperature and the acquisition time, and these multiple sets of temperature-time coordinates are plotted on a preset curve template to generate a temperature line graph. This allows for a more intuitive observation of the temperature changes of the heat-melting mechanism, facilitating subsequent increases or decreases in the temperature of the heat-melting mechanism and enabling visualization of the temperature at each stage.

[0082] Step S103: Monitor the temperature line graph in real time and obtain the monitoring results;

[0083] In some embodiments, the temperature reflection graph is monitored in real time to monitor the temperature changes of the hot-melting mechanism at each stage, and the monitoring results are obtained, thereby improving the safety of the hot-melting mechanism and the hot-melting device and realizing multiple protections for the hot-melting mechanism and the hot-melting device.

[0084] Step S104: Control the working status of the heating unit in the hot melt mechanism according to the monitoring results.

[0085] In some embodiments, the working state of the heating unit in the hot-melt mechanism is controlled according to the monitoring results. For example, when the monitoring result is that the real-time temperature is too low, the conductivity of the heating unit needs to be increased to increase the heating temperature of the heating copper block unit; when the monitoring result is that the real-time temperature is too high, the conductivity of the heating unit needs to be reduced to reduce the heating temperature of the heating copper block unit, thereby achieving multiple temperature protections for the hot-melt mechanism, avoiding excessively high or low temperatures, and improving the production quality of the battery cell.

[0086] Please refer to Figure 6 , Figure 6 This is a flowchart of a specific method of a temperature control method provided in another embodiment of this application, including but not limited to step S201.

[0087] Step S201: Send a temperature control signal to the hot melt device so that the hot melt head assembly in the hot melt mechanism is heated to the preset target temperature according to the temperature control signal.

[0088] In some embodiments, before obtaining the real-time temperature sent by the temperature sensing head unit, it is also necessary to send a temperature control signal to the hot-melt device so that the hot-melt head assembly in the hot-melt mechanism is heated to a preset target temperature according to the temperature control signal, so as to achieve the hot-melt of the cell coating of the cell to be melted.

[0089] Please refer to Figure 7 , Figure 7 This is a flowchart illustrating step S103 provided in an embodiment of this application. In some embodiments, step S103 includes, but is not limited to, steps S301 and S302.

[0090] Step S301: Set the control temperature range on the temperature line graph;

[0091] Step S302: Monitor the temperature line graph in real time and record the collection time when the real-time temperature is outside the controlled temperature range to obtain the monitoring results.

[0092] In some embodiments, during real-time monitoring of the temperature line graph, firstly, a controlled temperature range is set on the temperature line graph, which includes the maximum and minimum values ​​of the controlled temperature. Then, the temperature line graph is monitored in real time to check whether the temperature value is within the controlled temperature range, and the collection time when the real-time temperature is outside the controlled temperature range is recorded, i.e., the time when the temperature is abnormal, such as when the real-time temperature is less than the minimum value of the controlled temperature range or greater than the maximum value of the controlled temperature range. The monitoring results are obtained, thereby realizing the monitoring and recording of different abnormal situations, realizing real-time monitoring of the temperature at each stage, and enabling precise control of the temperature changes of the hot melt mechanism.

[0093] This application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, which, when executed by the processor, is used by the processor to perform the temperature control method described in the above embodiments of this application.

[0094] Reference Figure 8 , Figure 8 This is a schematic diagram of the hardware structure of the computer device provided in the embodiments of this application.

[0095] The following is combined with Figure 8 The hardware structure of the computer device is described in detail. The computer device includes: a processor 910, a memory 920, an input / output interface 930, a communication interface 940, and a bus 950.

[0096] The processor 910 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0097] The memory 920 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 920 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 920 and called and executed by the processor 910 using the temperature control method of the embodiments of this application.

[0098] The input / output interface 930 is used to implement information input and output;

[0099] The communication interface 940 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.); and the bus 950 is used to transmit information between the various components of the device (such as processor 910, memory 920, input / output interface 930 and communication interface 940).

[0100] The processor 910, memory 920, input / output interface 930 and communication interface 940 are connected to each other within the device via bus 950.

[0101] This application also provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the temperature control method as described in the above embodiments of this application.

[0102] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0103] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0104] It will be understood by those skilled in the art that Figures 1 to 7 The technical solutions shown do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0105] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0106] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0107] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0108] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0109] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0110] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0111] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0112] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0113] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A hot-melt mechanism, characterized in that, include: The base includes a frame, a fixed plate, a movable plate, and a lifting cylinder. The fixed plate is disposed on the frame, and the movable plate and the lifting cylinder are disposed on the fixed plate. The lifting cylinder is used to drive the movable plate to move. A hot melt head assembly is disposed on the base. The hot melt head assembly includes a heating unit, a heating copper block unit, and a temperature sensing head unit. The heating copper block unit is provided with a mounting groove and a hot melt protrusion. The heating unit is disposed on the mounting groove, and the temperature sensing head unit is disposed on the hot melt protrusion. The heating unit is used to connect to an external power source to heat the heating copper block unit. The heating copper block unit is used to hot melt the cell coating of the cell to be melted. The heating copper block unit includes a first copper block and a second copper block, which abut against each other. On the movable plate, the first copper block is provided with the mounting groove, and the second copper block is provided with the hot-melt protrusion. Specifically, the heating unit adjusts its working state according to the monitoring result of the temperature sensing head unit. When the monitoring result indicates that the real-time temperature is too low, the heating unit increases the conductivity to increase the heating temperature of the heating copper block unit. When the monitoring result indicates that the real-time temperature is too high, the heating unit decreases the conductivity to decrease the heating temperature of the heating copper block unit. This achieves multiple temperature protections for the hot-melt mechanism, avoiding excessively high or low temperatures and improving the production quality of the battery cell.

2. The hot-melt mechanism according to claim 1, characterized in that, The temperature sensing head unit includes a first temperature sensing head and a second temperature sensing head, which are respectively disposed on the side of the hot melt protrusion. The first temperature sensing head and the second temperature sensing head are used to obtain the real-time temperature of the hot melt head assembly.

3. The hot-melt mechanism according to claim 1, characterized in that, The movable plate is provided with an airflow pipe, and at least one air outlet is provided below the airflow pipe. The air outlet is used to blow air along the hot melt protrusion.

4. The hot-melt mechanism according to claim 1, characterized in that, A synthetic stone for heat insulation is provided between the movable plate and the heating copper block unit, and heat insulation cotton is provided on the fixed plate to insulate against the heat generated by the hot melting mechanism.

5. A hot-melt device, characterized in that, Including the hot-melt mechanism as described in any one of claims 1-4, further comprising: The turntable mechanism includes a turntable body, a driver, and multiple mounting brackets. The turntable body has multiple slots, and the mounting brackets are correspondingly arranged with the slots. The hot-melt mechanism is mounted on the mounting brackets. The driver is used to drive the turntable body to rotate circumferentially so that the slots correspond to the hot-melt mechanism.

6. The hot-melt apparatus according to claim 5, characterized in that, The hot-melting mechanism includes a first hot-melting mechanism, a second hot-melting mechanism, and a third hot-melting mechanism. The first hot-melting mechanism is used to hot-melt the upper surface of the battery cell to be melted, the second hot-melting mechanism is used to hot-melt the side surface of the battery cell to be melted, and the third hot-melting mechanism is used to hot-melt the lower surface of the battery cell to be melted.

7. The hot-melt apparatus according to claim 6, characterized in that, The first hot-melt mechanism, the second hot-melt mechanism, and the third hot-melt mechanism can be configured in one of the following ways: The first hot-melt mechanism is mounted on the first mounting frame, the second hot-melt mechanism is mounted on the second mounting frame, and the third hot-melt mechanism is mounted on the third mounting frame; or, The first hot-melt mechanism and the third hot-melt mechanism are symmetrically mounted on the first mounting frame, and the second hot-melt mechanism is mounted on the second mounting frame.

8. A temperature control method for a hot-melting apparatus according to any one of claims 5-7, characterized in that, The method includes: Within a preset time period, the real-time temperature sent by the temperature sensing head unit is acquired, and the acquisition time of the real-time temperature by the temperature sensing head unit within the time period is recorded. A temperature line graph is generated by plotting a preset curve template based on the real-time temperature and the acquisition time. The temperature line graph is monitored in real time to obtain monitoring results; The working state of the heating unit in the hot-melt mechanism is controlled according to the monitoring results; the heating unit adjusts its working state according to the monitoring results of the temperature sensing head unit. When the monitoring result indicates that the real-time temperature is too low, the heating unit increases the conductivity to increase the heating temperature of the heating copper block unit; when the monitoring result indicates that the real-time temperature is too high, the heating unit decreases the conductivity to reduce the heating temperature of the heating copper block unit, thereby realizing multiple temperature protections of the hot-melt mechanism, avoiding excessively high or low temperatures, and improving the production quality of the battery cell.

9. The temperature control method according to claim 8, characterized in that, Before acquiring the real-time temperature sent by the temperature sensing unit and the time of acquiring the real-time temperature, the method further includes: A temperature control signal is sent to the hot melt device so that the hot melt head assembly in the hot melt mechanism is heated to a preset target temperature according to the temperature control signal.

10. The temperature control method according to claim 8, characterized in that, The real-time monitoring of the temperature line graph to obtain monitoring results includes: Set a controlled temperature range on the temperature line graph; The temperature line graph is monitored in real time, and the collection time when the real-time temperature is outside the controlled temperature range is recorded to obtain the monitoring results.

11. A storage medium, characterized in that, The storage medium is a computer-readable storage medium storing a computer program, which, when executed by a computer, is used by the computer to perform the temperature control method as described in any one of claims 8 to 10.

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