Dual-band antenna module

Abstract

The present application provides a dual-band antenna module, which includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer and a second feeding pin. The conductive metal layer is disposed on a top of the first insulating substrate. The plurality of grounding supports are configured to support the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer is disposed on a top of the second insulating substrate. The bottom metal layer is disposed on a bottom of the second insulating substrate. Thus, the first antenna structure is configured to transmit or receive a first-band signal, the second antenna structure is configured to transmit or receive a second-band signal, and the first-band signal transmitted or received by the first antenna structure is smaller than the second-band signal transmitted or received by the second antenna structure.

Description

Technical Field

[0001] This invention relates to an antenna module, and more particularly to a dual-band antenna module. Background Technology

[0002] Stacked antennas are constructed by stacking antenna structures on a circuit board. However, the antenna substrate of a stacked antenna may become too heavy due to the stacking requirements. Summary of the Invention

[0003] The problem that this invention aims to solve is to provide a dual-band antenna module that addresses the shortcomings of the prior art.

[0004] To address the aforementioned problems, one technical approach employed by this invention is to provide a dual-band antenna module, comprising a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, multiple ground supports, and a first feed pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feed pin. The conductive metal layer is disposed on a top of the first insulating substrate. The multiple ground supports are configured to support the first insulating substrate and are separate from the conductive metal layer. The first feed pin passes through the first insulating substrate and is separate from the conductive metal layer. The second insulating substrate is disposed above the first insulating substrate. The top metal layer is disposed on a top of the second insulating substrate. The bottom metal layer is disposed on a bottom of the second insulating substrate and is separate from the conductive metal layer. The second feed pin passes through the second insulating substrate and the first insulating substrate and is separate from the top metal layer, the bottom metal layer, and the conductive metal layer. The first antenna structure is configured to transmit or receive a first frequency band signal, and the second antenna structure is configured to transmit or receive a second frequency band signal, wherein the first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure.

[0005] To address the aforementioned problems, another technical approach employed by this invention is to provide a dual-band antenna module, comprising a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, multiple grounding supports, and a first feed pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, a second feed pin, an auxiliary conductive element, and a coupling metal layer. The conductive metal layer is disposed on a top end of the first insulating substrate. The multiple grounding supports are configured to support the first insulating substrate and are separated from the conductive metal layer. The first feed pin passes through the first insulating substrate and is separated from the conductive metal layer. The first insulating substrate is disposed above the second insulating substrate. A top metal layer is disposed on a top end of the second insulating substrate, and a bottom metal layer is disposed on a bottom end of the second insulating substrate and contacts the conductive metal layer. A coupling metal layer is disposed on one side end of the second insulating substrate and is separate from the top and bottom metal layers. An auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. A second feed pin is disposed on a bottom end of the first insulating substrate and is electrically connected to the coupling metal layer through the auxiliary conductive element. The first antenna structure is configured to transmit or receive a first frequency band signal, and the second antenna structure is configured to transmit or receive a first frequency band signal. The first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure.

[0006] To address the aforementioned problems, another technical means employed in this invention is to provide a dual-band antenna module, comprising a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, multiple grounding supports, and two first feed pins. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, a second feed pin, two auxiliary conductive elements, and two coupling metal layers. The conductive metal layer is disposed on a top end of the first insulating substrate; the multiple grounding supports are configured to support the first insulating substrate and are separated from the conductive metal layer; and the two first feed pins are disposed on a bottom end of the first insulating substrate and are separated from the conductive metal layer. The first insulating substrate is disposed above the second insulating substrate. A top metal layer is disposed on one top end of the second insulating substrate, and a bottom metal layer is disposed on one bottom end of the second insulating substrate and contacts the conductive metal layer. Two coupling metal layers are respectively disposed on two sides of the second insulating substrate and are separate from the top and bottom metal layers. Each auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. A second feed pin is disposed on the bottom end of the first insulating substrate and is electrically connected to the two coupling metal layers through the two auxiliary conductive elements. The first antenna structure is configured to transmit or receive a first frequency band signal, and the second antenna structure is configured to transmit or receive a first frequency band signal. The first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure.

[0007] One of the beneficial effects of the present invention is that the dual-band antenna module provided by the present invention can simultaneously provide high-frequency mode and low-frequency mode through the technical solutions of "multiple ground supports being configured to support the first insulating substrate and being separated from each other from the conductive metal layer" and "the first frequency band signal transmitted or received by the first antenna structure being less than the second frequency band signal transmitted or received by the second antenna structure".

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a three-dimensional schematic diagram of the dual-band antenna module according to the first embodiment of the present invention.

[0010] Figure 2 for Figure 1 A schematic diagram of the cross section line II-II.

[0011] Figure 3This is a top view of the dual-band antenna module according to the first embodiment of the present invention.

[0012] Figure 4 This is a three-dimensional schematic diagram of a dual-band antenna module according to a second embodiment of the present invention.

[0013] Figure 5 This is a side view of the dual-band antenna module according to the second embodiment of the present invention.

[0014] Figure 6 This is a top view of the dual-band antenna module according to the second embodiment of the present invention.

[0015] Figure 7 The graph shows the reflection loss (S11) of the dual-band antenna module in the low-frequency and high-frequency bands in the second embodiment of this invention.

[0016] Figure 8 The graph shows the axial ratio (AR) of the dual-band antenna module in the low-frequency and high-frequency bands of the second embodiment of this invention.

[0017] Figure 9 The graph shows the gain of the dual-band antenna module in the low-frequency and high-frequency bands in the second embodiment of this invention.

[0018] Figure 10 This is a three-dimensional schematic diagram of a dual-band antenna module according to a third embodiment of the present invention.

[0019] Figure 11 for Figure 10 A cross-sectional diagram of the XI-XI section line.

[0020] Figure 12 This is a top view of the dual-band antenna module according to the third embodiment of the present invention.

[0021] Figure 13 This is a three-dimensional schematic diagram of a dual-band antenna module according to the fourth embodiment of the present invention.

[0022] Figure 14 This is a top view of the dual-band antenna module according to the fourth embodiment of the present invention.

[0023] Figure 15 This is a bottom view of the dual-band antenna module according to the fourth embodiment of the present invention.

[0024] Figure 16 This is a three-dimensional schematic diagram of a dual-band antenna module according to the fifth embodiment of the present invention.

[0025] Figure 17 This is a top view of the dual-band antenna module according to the fifth embodiment of the present invention.

[0026] Figure 18 This is a bottom view of the dual-band antenna module according to the fifth embodiment of the present invention.

[0027] Figure 19 This is a three-dimensional schematic diagram of a dual-band antenna module according to the sixth embodiment of the present invention.

[0028] Figure 20 This is a top view of the dual-band antenna module according to the sixth embodiment of the present invention.

[0029] Figure 21 This is a bottom view of the dual-band antenna module according to the sixth embodiment of the present invention. Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the "dual-band antenna module" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.

[0031] [First Embodiment]

[0032] See Figures 1 to 3As shown, the first embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). The first antenna structure 1 includes a first insulating substrate 10, a conductive metal layer 11 (or an antenna radiator or an electrode surface), a plurality of grounding supports 12, and a first feed pin 13 (or a first antenna signal feed pin). The second antenna structure 2 includes a second insulating substrate 20, a top metal layer 21 (or a top antenna radiator or a top electrode surface), a bottom metal layer 22 (or a bottom antenna radiator or a bottom electrode surface), and a second feed pin 23 (or a second antenna signal feed pin). Accordingly, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0033] Furthermore, in coordination Figures 1 to 3 As shown, a conductive metal layer 11 is disposed on a top end of a first insulating substrate 10. A plurality of grounding supports 12 are configured to support the first insulating substrate 10 and are separate from the conductive metal layer 11. A first feed pin 13 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11. Furthermore, a second insulating substrate 20 is disposed above the first insulating substrate 10. A top metal layer 21 is disposed on a top end of the second insulating substrate 20, and a bottom metal layer 22 is disposed on a bottom end of the second insulating substrate 20 and is separate from the conductive metal layer 11. A second feed pin 23 passes through the second insulating substrate 20 and the first insulating substrate 10 and is separate from the top metal layer 21, the bottom metal layer 22, and the conductive metal layer 11. It is worth noting that the plurality of grounding supports 12 can be configured to provide a frequency reduction (downsampling) effect.

[0034] For example, coordination Figure 1 and Figure 2As shown, the thickness H1 of the first insulating substrate 10 of the first antenna structure 1 (e.g., a thickness between 0.4 mm and 2 mm) is between 1 / 3 and 1 / 10 of the thickness H2 of the second insulating substrate 20 of the second antenna structure 2, and the dielectric constant of the first insulating substrate 10 of the first antenna structure 1 (e.g., any antenna carrier substrate that can be used to carry an antenna) is less than the dielectric constant of the second insulating substrate 20 of the second antenna structure 2 (e.g., any antenna carrier substrate that can be used to carry an antenna). Furthermore, when the dual-band antenna module M is disposed on a circuit board P, the first feed pin 13, the second feed pin 23, and the plurality of ground supports 12 are electrically connected to the circuit board P. Furthermore, a plurality of grounding supports 12 are disposed between the first insulating substrate 10 and the circuit board P. The first insulating substrate 10 can be suspended (or elevated) above the circuit board P by the support of the plurality of grounding supports 12, so that the first insulating substrate 10 and the circuit board P are separated from each other by a predetermined distance. Similarly, the second insulating substrate 20 can be suspended (or elevated) above the first insulating substrate 10 by the support of the second feed pin 23, so that the second insulating substrate 20 and the first insulating substrate 10 are separated from each other by a predetermined distance. However, the examples described above are merely one possible embodiment and are not intended to limit the present invention.

[0035] For example, coordination Figure 1 and Figure 2 As shown, the second feed pin 23 includes a first conductive portion 231, a second conductive portion 232, and a third conductive portion 233. The first conductive portion 231 penetrates the second insulating substrate 20 and is separate from the top metal layer 21 and the bottom metal layer 22. The second conductive portion 232 is disposed below the first insulating substrate 10 and is separate from the conductive metal layer 11. The third conductive portion 233 penetrates the first insulating substrate 10 and is electrically connected between the first conductive portion 231 and the second conductive portion 232. It is worth noting that the second insulating substrate 20 can be suspended (or elevated) above the first insulating substrate 10 by the support of the first conductive portion 231 of the second feed pin 23, so that the second insulating substrate 20 and the first insulating substrate 10 are separated by a predetermined distance. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0036] For example, coordination Figure 1 and Figure 3As shown, the first antenna structure 1 includes a plurality of matching components C (e.g., inductors or capacitors) disposed on the top of the first insulating substrate 10, and each matching component C is electrically connected between the conductive metal layer 11 and a corresponding ground support 12 to achieve matching of the antenna center frequency (it is worth noting that the matching component C can be configured to provide a frequency reduction effect). Furthermore, the plurality of ground supports 12 are electrically in contact with a plurality of auxiliary conductive layers 121 disposed on the top of the first insulating substrate 10, and each ground support 12 can be electrically connected to a corresponding matching component C through the auxiliary conductive layers 121. In addition, the conductive metal layer 11 has a plurality of conductive extensions 110 corresponding to the plurality of ground supports 12, and the conductive metal layer 11 can be electrically connected to the plurality of matching components C through the plurality of conductive extensions 110. It is worth noting that the top of the first insulating substrate 10 has a plurality of unoccupied regions 1000, each unoccupied region 1000 being formed between the conductive metal layer 11 and a corresponding auxiliary conductive layer 121, and each conductive extension 110 of the conductive metal layer 11 being disposed between two adjacent unoccupied regions 1000. Furthermore, a top exposed portion 120 of each grounding support 12 protrudes from the top of the first insulating substrate 10, the first feed pin 13 has a first exposed portion 130 protruding from the top of the first insulating substrate 10, and the second feed pin 23 has a second exposed portion 230 protruding from the top of the second insulating substrate 20. However, the examples described above are merely one possible embodiment and are not intended to limit the present invention.

[0037] [Second Embodiment]

[0038] See Figures 4 to 9 As shown, a second embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). Herein, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the above examples are merely one possible embodiment and are not intended to limit the present invention.

[0039] It is worth noting that, firstly, as Figure 7 As shown, this is a graph illustrating the reflection loss (S11) of the dual-band antenna module M in the low-frequency and high-frequency bands according to the second embodiment of the present invention. Therefore, the dual-band antenna module M can provide low reflection loss in both the low-frequency band (low operating frequency, e.g., 1195MHz) and the high-frequency band (high operating frequency, e.g., 1585MHz). Furthermore, as... Figure 8 As shown, this is a graph illustrating the axial ratio (AR) of the dual-band antenna module M in the low-frequency and high-frequency bands according to the second embodiment of the present invention. Therefore, the dual-band antenna module M can provide a low axial ratio in both the low-frequency and high-frequency bands. Furthermore, as... Figure 9 As shown, this is a graph illustrating the gain of the dual-band antenna module M in the low-frequency and high-frequency bands according to the second embodiment of the present invention. Therefore, the dual-band antenna module M can provide high gain in both the low-frequency and high-frequency bands. However, the example given above is only one feasible embodiment and is not intended to limit the invention.

[0040] Depend on Figures 4 to 6 respectively with Figures 1 to 3 A comparison reveals that the most significant difference between the second embodiment and the first embodiment of the present invention lies in the following: In the second embodiment, the first antenna structure 1 includes another first feed pin 13 that is separate from the first feed pin 13, and this other first feed pin 13 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11. Furthermore, the second antenna structure 2 includes another second feed pin 23 that is separate from the second feed pin 23, and this other second feed pin 23 passes through the second insulating substrate 20 and the first insulating substrate 10 and is separate from the top metal layer 21, the bottom metal layer 22, and the conductive metal layer 11.

[0041] Furthermore, in coordination Figures 4 to 6As shown, when the dual-band antenna module M is mounted on a circuit board P, two first feed pins 13, two second feed pins 23, and multiple ground supports 12 are electrically connected to the circuit board P. Additionally, the second insulating substrate 20 can be suspended (or elevated) above the first insulating substrate 10 by the support of the two second feed pins 23, so that the second insulating substrate 20 and the first insulating substrate 10 are separated by a predetermined distance. Furthermore, each second feed pin 23 penetrates both the second insulating substrate 20 and the first insulating substrate 10, and the bottom of each second feed pin 23 is exposed from the bottom end of the first insulating substrate 10. Moreover, each first feed pin 13 has a first exposed portion 130 exposed from the top end of the first insulating substrate 10, and each second feed pin 23 has a second exposed portion 230 exposed from the top end of the second insulating substrate 20. However, the above example is merely one possible embodiment and is not intended to limit the invention.

[0042] [Third Embodiment]

[0043] See Figures 10 to 12 As shown, the third embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). The first antenna structure 1 includes a first insulating substrate 10, a conductive metal layer 11, multiple grounding supports 12, and a first feed pin 13. The second antenna structure 2 includes a second insulating substrate 20, a top metal layer 21, a bottom metal layer 22, a second feed pin 23, an auxiliary conductive element 24, and a coupling metal layer 25. Accordingly, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0044] Furthermore, in coordination Figures 10 to 12As shown, a conductive metal layer 11 is disposed on one top end of the first insulating substrate 10. A plurality of grounding supports 12 are configured to support the first insulating substrate 10 and are separate from the conductive metal layer 11. A first feed pin 13 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11. Furthermore, a second insulating substrate 20 is disposed above the second insulating substrate 20. A top metal layer 21 is disposed on one top end of the second insulating substrate 20. A bottom metal layer 22 is disposed on one bottom end of the second insulating substrate 20 and contacts the conductive metal layer 11. A coupling metal layer 25 is disposed on one side end of the second insulating substrate 20 and is separate from the top metal layer 21 and the bottom metal layer 22. An auxiliary conductive element 24 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11. A second feed pin 23 is disposed on one bottom end of the first insulating substrate 10 and is electrically connected to the coupling metal layer 25 via the auxiliary conductive element 24.

[0045] For example, coordination Figure 10 and Figure 11 As shown, the thickness H1 of the first insulating substrate 10 of the first antenna structure 1 (e.g., a thickness between 0.4 mm and 2 mm) is between 1 / 3 and 1 / 10 of the thickness H2 of the second insulating substrate 20 of the second antenna structure 2, and the dielectric constant of the first insulating substrate 10 of the first antenna structure 1 (e.g., any antenna carrier substrate that can be used to carry an antenna) is less than the dielectric constant of the second insulating substrate 20 of the second antenna structure 2 (e.g., any antenna carrier substrate that can be used to carry an antenna). Furthermore, when the dual-band antenna module M is disposed on a circuit board P, the first feed pin 13, the second feed pin 23, and a plurality of ground supports 12 are electrically connected to the circuit board P. In addition, a plurality of ground supports 12 are disposed between the first insulating substrate 10 and the circuit board P, and the first insulating substrate 10 is suspended (or elevated) above the circuit board P by the support of the plurality of ground supports 12, so that the first insulating substrate 10 and the circuit board P are separated by a predetermined distance. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0046] For example, coordination Figure 10 and Figure 11As shown, the coupling metal layer 25 (e.g., a U-shaped coupling metal layer 25) can extend from the top end of the second insulating substrate 20 to the bottom end of the second insulating substrate 20 to electrically contact the auxiliary conductive member 24. Furthermore, the auxiliary conductive member 24 has a top conductive portion 241, a bottom conductive portion 242, and a through conductive portion 243. The top conductive portion 241 is disposed on the top end of the first insulating substrate 10 to electrically contact the coupling metal layer 25, the bottom conductive portion 242 is disposed on the bottom end of the first insulating substrate 10 to electrically contact the second feed pin 23, and the through conductive portion 243 penetrates the first insulating substrate 10 and is electrically connected between the top conductive portion 241 and the bottom conductive portion 242. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0047] For example, coordination Figure 10 and Figure 12 As shown, the first antenna structure 1 includes a plurality of matching components C (e.g., inductors or capacitors) disposed on the top of the first insulating substrate 10, and each matching component C is electrically connected between the conductive metal layer 11 and a corresponding ground support 12 to achieve matching of the antenna center frequency (it is worth noting that the matching component C can be configured to provide a frequency reduction effect). Furthermore, the plurality of ground supports 12 are electrically in contact with a plurality of auxiliary conductive layers 121 disposed on the top of the first insulating substrate 10, and each ground support 12 can be electrically connected to a corresponding matching component C through the auxiliary conductive layers 121. In addition, the conductive metal layer 11 has a plurality of conductive extensions 110 corresponding to the plurality of ground supports 12, and the conductive metal layer 11 can be electrically connected to the plurality of matching components C through the plurality of conductive extensions 110. It is worth noting that the top of the first insulating substrate 10 has a plurality of unoccupied regions 1000, each unoccupied region 1000 being formed between the conductive metal layer 11 and a corresponding auxiliary conductive layer 121, and each conductive extension 110 of the conductive metal layer 11 being disposed between two adjacent unoccupied regions 1000. Furthermore, a top exposed portion 120 of each grounding support 12 protrudes from the top of the first insulating substrate 10, and the first feed pin 13 has a first exposed portion 130 protruding from the top of the first insulating substrate 10. However, the examples described above are merely one possible embodiment and are not intended to limit the present invention.

[0048] [Fourth Embodiment]

[0049] See Figures 13 to 15As shown, a fourth embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). Herein, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0050] Depend on Figures 13 to 15 respectively with Figures 10 to 12 A comparison reveals that the most significant difference between the fourth embodiment and the third embodiment of the present invention lies in the following: In the fourth embodiment, the first antenna structure 1 includes another first feed pin 13 that is separate from the first feed pin 13, and this other first feed pin 13 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11. Furthermore, the second antenna structure 2 includes another auxiliary conductive element 24 that is separate from the auxiliary conductive element 24 and another coupling metal layer 25 that is separate from the coupling metal layer 25. The other auxiliary conductive element 24 passes through the first insulating substrate 10 and is separate from the conductive metal layer 11, and the other coupling metal layer 25 is disposed on the other side of the second insulating substrate 20 and is separate from the top metal layer 21 and the bottom metal layer 22.

[0051] Furthermore, in coordination Figures 13 to 15As shown, when the dual-band antenna module M is mounted on a circuit board (not shown), two first feed pins 13, a second feed pin 23, and multiple ground supports 12 are electrically connected to the circuit board (not shown). Additionally, two coupling metal layers 25 (e.g., U-shaped coupling metal layers 25) can extend from the top end of the second insulating substrate 20 to the bottom end of the second insulating substrate 20 to electrically contact two auxiliary conductive elements 24, respectively. Furthermore, each auxiliary conductive element 24 has a top conductive portion 241, a bottom conductive portion 242, and a through conductive portion 243. The top conductive portion 241 is disposed on the top of the first insulating substrate 10 to electrically contact the corresponding coupling metal layer 25, and the bottom conductive portion 242 is disposed on the bottom of the first insulating substrate 10 to be electrically connected to the second feed pin 23 through a matching circuit N (e.g., a 90-degree phase difference network including multiple inductors and / or capacitors, and the 90-degree phase difference network may also be disposed on a circuit board). The through conductive portion 243 penetrates the first insulating substrate 10 and is electrically connected between the top conductive portion 241 and the bottom conductive portion 242. Furthermore, each first feed pin 13 has a first exposed portion 130 exposed from the top of the first insulating substrate 10. However, the above examples are merely one possible embodiment and are not intended to limit the invention.

[0052] [Fifth Embodiment]

[0053] See Figures 16 to 18 As shown, a fifth embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). Herein, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0054] Depend on Figures 16 to 18 respectively with Figures 13 to 15A comparison reveals that the most significant difference between the fifth and fourth embodiments of the present invention lies in the following: In the fifth embodiment, the first feed pin 13 has two first exposed portions 130, two conductive extension portions 131, and a conductive pin portion 132. The two first exposed portions 130 extend from the top of the first insulating substrate 10, the two conductive extension portions 131 are disposed on the bottom of the first insulating substrate 10 and electrically connected to the two first exposed portions 130, and the conductive pin portion 132 is electrically connected to the two conductive extension portions 131 via another matching circuit N (e.g., a 90-degree phase difference network including multiple inductors and / or capacitors, and the 90-degree phase difference network can also be disposed on a circuit board).

[0055] [Sixth Embodiment]

[0056] See Figures 19 to 21 As shown, the sixth embodiment of the present invention provides a dual-band antenna module M, which includes a first antenna structure 1 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna) and a second antenna structure 2 (e.g., a linearly polarized antenna, a left-hand circularly polarized antenna, or a right-hand circularly polarized antenna). The first antenna structure 1 includes a first insulating substrate 10, a conductive metal layer 11, multiple grounding supports 12, and two first feed pins 13. The second antenna structure 2 includes a second insulating substrate 20, a top metal layer 21, a bottom metal layer 22, a second feed pin 23, two auxiliary conductive elements 24, and two coupling metal layers 25. Accordingly, the first antenna structure 1 can be configured to transmit or receive a first frequency band signal (e.g., a frequency band signal between 1163MHz and 1229MHz), and the second antenna structure 2 can be configured to transmit or receive a second frequency band signal (e.g., a frequency band signal between 1557MHz and 1607MHz). The first frequency band signal transmitted or received by the first antenna structure 1 (the low-frequency mode provided by the first antenna structure 1) is less than the second frequency band signal transmitted or received by the second antenna structure 2 (the high-frequency mode provided by the second antenna structure 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0057] Furthermore, in coordination Figures 19 to 21As shown, a conductive metal layer 11 is disposed on a top end of a first insulating substrate 10. A plurality of grounding supports 12 are configured to support the first insulating substrate 10 and are separate from the conductive metal layer 11. Two first feed pins 13 are disposed on a bottom end of the first insulating substrate 10 and are separate from the conductive metal layer 11. Furthermore, a second insulating substrate 20 is disposed above the second insulating substrate 20. A top metal layer 21 is disposed on a top end of the second insulating substrate 20, and a bottom metal layer 22 is disposed on a bottom end of the second insulating substrate 20 and contacts the conductive metal layer 11. Two coupling metal layers 25 are respectively disposed on two side ends of the second insulating substrate 20 and are separate from the top metal layer 21 and the bottom metal layer 22. Each auxiliary conductive element 24 penetrates the first insulating substrate 10 and is separate from the conductive metal layer 11. A second feed pin 23 is disposed on the bottom end of the first insulating substrate 10 and is electrically connected to the two coupling metal layers 25 via the two auxiliary conductive elements 24.

[0058] For example, coordination Figure 19 and Figure 20 As shown, the thickness H1 of the first insulating substrate 10 of the first antenna structure 1 (e.g., a thickness between 0.4 mm and 2 mm) is between 1 / 3 and 1 / 10 of the thickness H2 of the second insulating substrate 20 of the second antenna structure 2, and the dielectric constant of the first insulating substrate 10 of the first antenna structure 1 (e.g., any antenna carrier substrate that can be used to carry an antenna) is less than the dielectric constant of the second insulating substrate 20 of the second antenna structure 2 (e.g., any antenna carrier substrate that can be used to carry an antenna). Furthermore, when the dual-band antenna module M is disposed on a circuit board (not shown), two first feed pins 13, a second feed pin 23, and a plurality of ground supports 12 are electrically connected to the circuit board (not shown). In addition, the plurality of ground supports 12 are disposed between the first insulating substrate 10 and the circuit board (not shown), and the first insulating substrate 10 is suspended (or elevated) above the circuit board P by the support of the plurality of ground supports 12, such that the first insulating substrate 10 and the circuit board P are separated by a predetermined distance. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0059] For example, coordination Figure 19 and Figure 20As shown, two coupling metal layers 25 (e.g., U-shaped coupling metal layers 25) can extend from the top end of the second insulating substrate 20 to the bottom end of the second insulating substrate 20 to electrically contact the two auxiliary conductive elements 24, respectively. Furthermore, each auxiliary conductive element 24 has a top conductive portion 241, a bottom conductive portion 242, and a through conductive portion 243. The top conductive portion 241 is disposed on the top end of the first insulating substrate 10 to electrically contact the corresponding coupling metal layer 25, the bottom conductive portion 242 is disposed on the bottom end of the first insulating substrate 10 to electrically contact the second feed pin 23, and the through conductive portion 243 penetrates the first insulating substrate 10 and is electrically connected between the top conductive portion 241 and the bottom conductive portion 242. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0060] For example, coordination Figure 19 and Figure 21 As shown, the first antenna structure 1 includes a plurality of matching components C (e.g., inductors or capacitors) disposed on the bottom end of the first insulating substrate 10, and each matching component C is electrically connected between a conductive metal layer 11 and a corresponding ground support 12 to achieve matching of the antenna center frequency (it is worth noting that the matching component C can be configured to provide a frequency reduction effect). Additionally, the plurality of ground supports 12 are electrically in contact with a plurality of auxiliary conductive layers 121 disposed on the bottom end of the first insulating substrate 10, and each ground support 12 is electrically connected to a corresponding matching component C through the auxiliary conductive layers 121. Furthermore, the conductive metal layer 11 is electrically connected to the plurality of matching components C through a plurality of penetrating conductors B, and the plurality of penetrating conductors B penetrate the first insulating substrate 10 and extend to electrically contact the plurality of matching components C. It is worth noting that each ground support 12 does not protrude from the top end of the first insulating substrate 10, and the two first feed pins 13 do not protrude from the top end of the first insulating substrate 10. Furthermore, since multiple matching components C are disposed on the bottom end of the first insulating substrate 10, the horizontal areas of the first antenna structure 1 and the second antenna structure 2 can be non-approximate, thereby effectively reducing the overall size of the first antenna structure 1. However, the above-described example is merely one feasible embodiment and is not intended to limit the present invention.

[0061] [Beneficial Effects of the Examples]

[0062] One of the beneficial effects of the present invention is that the dual-band antenna module M provided by the present invention can provide both high-frequency and low-frequency modes simultaneously through the technical solutions of "multiple grounding supports 12 being configured to support the first insulating substrate 10 and being separated from the conductive metal layer 11" and "the first frequency band signal transmitted or received by the first antenna structure 1 being less than the second frequency band signal transmitted or received by the second antenna structure 2".

[0063] It is worth noting that the dual-band antenna module M provided by the present invention can form a linearly polarized antenna or a circularly polarized antenna by modifying the electrode surface. Alternatively, the dual-band antenna module M can generate a circularly polarized antenna via a 90-degree phase difference network or a matching component, and this phase difference network can be disposed on the ground layer of the first insulating substrate 10 (low dielectric constant substrate) or the circuit substrate P. Therefore, the dual-band antenna module M provided by the present invention has a wider bandwidth, lighter weight, better gain, and better isolation.

[0064] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A dual-band antenna module, characterized in that, The dual-band antenna module includes: A first antenna structure, the first antenna structure including a first insulating substrate, a conductive metal layer, a plurality of ground supports, and a first feed pin; and A second antenna structure, the second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer and a second feed pin; The conductive metal layer is disposed on one top end of the first insulating substrate, and a plurality of grounding supports are configured to support the first insulating substrate and are separated from the conductive metal layer. The first feed pin passes through the first insulating substrate and is separated from the conductive metal layer. Wherein, the second insulating substrate is disposed above the first insulating substrate, the top metal layer is disposed on a top end of the second insulating substrate, the bottom metal layer is disposed on a bottom end of the second insulating substrate and is separate from the conductive metal layer, and the second feed pin passes through the second insulating substrate and the first insulating substrate and is separate from the top metal layer, the bottom metal layer and the conductive metal layer; Wherein, the first antenna structure is configured to transmit or receive a first frequency band signal, the second antenna structure is configured to transmit or receive a second frequency band signal, and the first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure. The first antenna structure includes a plurality of matching components disposed on the top of the first insulating substrate, and each matching component is electrically connected between the conductive metal layer and the corresponding grounding support.

2. The dual-band antenna module according to claim 1, characterized in that, in, The thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the first feed pin, the second feed pin, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate. The first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The second insulating substrate is suspended above the first insulating substrate by the support of the second feed pin, so that the second insulating substrate and the first insulating substrate are separated from each other by a predetermined distance. The second feed pin includes a first conductive portion, a second conductive portion, and a third conductive portion. The first conductive portion penetrates the second insulating substrate and is separate from the top metal layer and the bottom metal layer. The second conductive portion is disposed below the first insulating substrate and is separate from the conductive metal layer. The third conductive portion penetrates the first insulating substrate and is electrically connected between the first conductive portion and the second conductive portion. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the top of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer has multiple conductive extensions corresponding to multiple grounding supports, and the conductive metal layer is electrically connected to multiple matching components through the multiple conductive extensions. The first insulating substrate has a plurality of unoccupied areas on its top end, each unoccupied area being formed between the conductive metal layer and a corresponding auxiliary conductive layer, and each conductive extension of the conductive metal layer being disposed between two adjacent unoccupied areas. In each of the grounding supports, a top exposed portion protrudes from the top of the first insulating substrate, the first feed pin has a first exposed portion protruding from the top of the first insulating substrate, and the second feed pin has a second exposed portion protruding from the top of the second insulating substrate.

3. The dual-band antenna module according to claim 1, characterized in that, in, The first antenna structure includes another first feed pin that is separate from the first feed pin, and the other first feed pin passes through the first insulating substrate and is separate from the conductive metal layer. The second antenna structure includes another second feed pin that is separate from the second feed pin, and the other second feed pin passes through the second insulating substrate and the first insulating substrate and is separate from the top metal layer, the bottom metal layer and the conductive metal layer. Wherein, the thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the two first feed pins, the two second feed pins, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate. The first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The second insulating substrate is suspended above the first insulating substrate by the support of two second feed pins, so that the second insulating substrate and the first insulating substrate are separated from each other by a predetermined distance. Each of the second feed pins penetrates the second insulating substrate and the first insulating substrate, and the bottom of each of the second feed pins is exposed from the bottom of the first insulating substrate. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the top of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer has multiple conductive extensions corresponding to multiple grounding supports, and the conductive metal layer is electrically connected to multiple matching components through the multiple conductive extensions. The first insulating substrate has a plurality of unoccupied areas on its top end, each unoccupied area being formed between the conductive metal layer and a corresponding auxiliary conductive layer, and each conductive extension of the conductive metal layer being disposed between two adjacent unoccupied areas. In this embodiment, a top exposed portion of each of the grounding supports protrudes from the top of the first insulating substrate, each of the first feed pins has a first exposed portion protruding from the top of the first insulating substrate, and each of the second feed pins has a second exposed portion protruding from the top of the second insulating substrate.

4. A dual-band antenna module, characterized in that, The dual-band antenna module includes: A first antenna structure, the first antenna structure including a first insulating substrate, a conductive metal layer, a plurality of ground supports, and a first feed pin; and A second antenna structure, the second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, a second feed pin, an auxiliary conductive component and a coupling metal layer; The conductive metal layer is disposed on one top end of the first insulating substrate, and a plurality of grounding supports are configured to support the first insulating substrate and are separated from the conductive metal layer. The first feed pin passes through the first insulating substrate and is separated from the conductive metal layer. The second insulating substrate is disposed above the first insulating substrate. The top metal layer is disposed on a top end of the second insulating substrate. The bottom metal layer is disposed on a bottom end of the second insulating substrate and contacts the conductive metal layer. The coupling metal layer is disposed on a side end of the second insulating substrate and is separate from the top and bottom metal layers. The auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. The second feed pin is disposed on a bottom end of the first insulating substrate and is electrically connected to the coupling metal layer through the auxiliary conductive element. Wherein, the first antenna structure is configured to transmit or receive a first frequency band signal, the second antenna structure is configured to transmit or receive a second frequency band signal, and the first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure; The first antenna structure includes a plurality of matching components disposed on the top of the first insulating substrate, and each matching component is electrically connected between the conductive metal layer and the corresponding grounding support.

5. The dual-band antenna module according to claim 4, characterized in that, in, The thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the first feed pin, the second feed pin, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate, and the first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The coupling metal layer extends from the top end of the second insulating substrate to the bottom end of the second insulating substrate to electrically contact the auxiliary conductive element; The auxiliary conductive component has a top conductive portion, a bottom conductive portion, and a through conductive portion. The top conductive portion is disposed on the top of the first insulating substrate to electrically contact the coupling metal layer. The bottom conductive portion is disposed on the bottom of the first insulating substrate to electrically contact the second feed pin. The through conductive portion penetrates the first insulating substrate and is electrically connected between the top conductive portion and the bottom conductive portion. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the top of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer has multiple conductive extensions corresponding to multiple grounding supports, and the conductive metal layer is electrically connected to multiple matching components through the multiple conductive extensions. The first insulating substrate has a plurality of unoccupied areas on its top end, each unoccupied area being formed between the conductive metal layer and a corresponding auxiliary conductive layer, and each conductive extension of the conductive metal layer being disposed between two adjacent unoccupied areas. In this embodiment, a top exposed portion of each of the grounding supports protrudes from the top of the first insulating substrate, and the first feed pin has a first exposed portion protruding from the top of the first insulating substrate.

6. The dual-band antenna module according to claim 4, characterized in that, in, The first antenna structure includes another first feed pin that is separate from the first feed pin, and the other first feed pin passes through the first insulating substrate and is separate from the conductive metal layer. The second antenna structure includes another auxiliary conductive element that is separate from the auxiliary conductive element and another coupling metal layer that is separate from the coupling metal layer. The other auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. The other coupling metal layer is disposed on the other side of the second insulating substrate and is separate from the top metal layer and the bottom metal layer. Wherein, the thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the two first feed pins, the second feed pins, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate, and the first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The two coupling metal layers extend from the top end of the second insulating substrate to the bottom end of the second insulating substrate to electrically contact the two auxiliary conductive elements respectively. Each of the auxiliary conductive components has a top conductive portion, a bottom conductive portion, and a through conductive portion. The top conductive portion is disposed on the top of the first insulating substrate to electrically contact the corresponding coupling metal layer. The bottom conductive portion is disposed on the bottom of the first insulating substrate to be electrically connected to the second feed pin through a matching circuit. The through conductive portion penetrates the first insulating substrate and is electrically connected between the top conductive portion and the bottom conductive portion. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the top of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer has multiple conductive extensions corresponding to multiple grounding supports, and the conductive metal layer is electrically connected to multiple matching components through the multiple conductive extensions. The first insulating substrate has a plurality of unoccupied areas on its top end, each unoccupied area being formed between the conductive metal layer and a corresponding auxiliary conductive layer, and each conductive extension of the conductive metal layer being disposed between two adjacent unoccupied areas. In this embodiment, a top exposed portion of each of the grounding supports protrudes from the top of the first insulating substrate, and each of the first feed pins has a first exposed portion protruding from the top of the first insulating substrate.

7. The dual-band antenna module according to claim 4, characterized in that, in, The second antenna structure includes another auxiliary conductive element that is separate from the auxiliary conductive element and another coupling metal layer that is separate from the coupling metal layer. The other auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. The other coupling metal layer is disposed on the other side of the second insulating substrate and is separate from the top metal layer and the bottom metal layer. Wherein, the thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the first feed pin, the second feed pin, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate, and the first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The two coupling metal layers extend from the top end of the second insulating substrate to the bottom end of the second insulating substrate to electrically contact the two auxiliary conductive elements respectively. Each of the auxiliary conductive components has a top conductive portion, a bottom conductive portion, and a through conductive portion. The top conductive portion is disposed on the top of the first insulating substrate to electrically contact the corresponding coupling metal layer. The bottom conductive portion is disposed on the bottom of the first insulating substrate to be electrically connected to the second feed pin through a matching circuit. The through conductive portion penetrates the first insulating substrate and is electrically connected between the top conductive portion and the bottom conductive portion. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the top of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer has multiple conductive extensions corresponding to multiple grounding supports, and the conductive metal layer is electrically connected to multiple matching components through the multiple conductive extensions. The first insulating substrate has a plurality of unoccupied areas on its top end, each unoccupied area being formed between the conductive metal layer and a corresponding auxiliary conductive layer, and each conductive extension of the conductive metal layer being disposed between two adjacent unoccupied areas. In this embodiment, a top exposed portion of each of the grounding supports protrudes from the top of the first insulating substrate, and the first feed pin has two first exposed portions protruding from the top of the first insulating substrate, two conductive extension portions disposed on the bottom end of the first insulating substrate and electrically connected to the two first exposed portions respectively, and a conductive pin portion electrically connected to the two conductive extension portions via another matching circuit.

8. A dual-band antenna module, characterized in that, The dual-band antenna module includes: A first antenna structure, comprising a first insulating substrate, a conductive metal layer, a plurality of ground supports, and two first feed pins; and The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, a second feed pin, two auxiliary conductive components, and two coupling metal layers. The conductive metal layer is disposed on a top end of the first insulating substrate, a plurality of grounding supports are configured to support the first insulating substrate and are separated from the conductive metal layer, and two first feed pins are disposed on a bottom end of the first insulating substrate and are separated from the conductive metal layer. The second insulating substrate is disposed above the first insulating substrate. The top metal layer is disposed on one top of the second insulating substrate. The bottom metal layer is disposed on one bottom of the second insulating substrate and contacts the conductive metal layer. The two coupling metal layers are respectively disposed on two side ends of the second insulating substrate and are separate from the top metal layer and the bottom metal layer. Each auxiliary conductive element penetrates the first insulating substrate and is separate from the conductive metal layer. The second feed pin is disposed on the bottom end of the first insulating substrate and is electrically connected to the two coupling metal layers respectively through the two auxiliary conductive elements. Wherein, the first antenna structure is configured to transmit or receive a first frequency band signal, the second antenna structure is configured to transmit or receive a second frequency band signal, and the first frequency band signal transmitted or received by the first antenna structure is less than the second frequency band signal transmitted or received by the second antenna structure; The first antenna structure includes a plurality of matching components disposed on the bottom end of the first insulating substrate, and each matching component is electrically connected between the conductive metal layer and the corresponding grounding support.

9. The dual-band antenna module according to claim 8, characterized in that, in, The thickness of the first insulating substrate of the first antenna structure is between 1 / 3 and 1 / 10 of the thickness of the second insulating substrate of the second antenna structure, and the dielectric constant of the first insulating substrate of the first antenna structure is less than the dielectric constant of the second insulating substrate of the second antenna structure. When the dual-band antenna module is mounted on a circuit board, the two first feed pins, the second feed pins, and the plurality of grounding supports are electrically connected to the circuit board. The plurality of grounding supports are disposed between the first insulating substrate and the circuit substrate, and the first insulating substrate is suspended above the circuit substrate by the support of the plurality of grounding supports, so that the first insulating substrate and the circuit substrate are separated from each other by a predetermined distance. The two coupling metal layers extend from the top end of the second insulating substrate to the bottom end of the second insulating substrate to electrically contact the two auxiliary conductive elements respectively. Each of the auxiliary conductive components has a top conductive portion, a bottom conductive portion, and a through conductive portion. The top conductive portion is disposed on the top of the first insulating substrate to electrically contact the corresponding coupling metal layer. The bottom conductive portion is disposed on the bottom of the first insulating substrate to electrically contact the second feed pin. The through conductive portion penetrates the first insulating substrate and is electrically connected between the top conductive portion and the bottom conductive portion. The plurality of grounding supports are electrically contacted with the plurality of auxiliary conductive layers disposed on the bottom end of the first insulating substrate, and each grounding support is electrically connected to the corresponding matching component through the auxiliary conductive layer. The conductive metal layer is electrically connected to the matching components through a plurality of through conductors, and the plurality of through conductors penetrate the first insulating substrate and extend to electrically contact the matching components. Each of the grounding supports is not exposed from the top of the first insulating substrate, and neither of the two first feed pins is exposed from the top of the first insulating substrate.

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