A high-gain filtering circular patch antenna based on dielectric integrated suspended line

Abstract

This invention discloses a high-gain filtered circular patch antenna based on a dielectric integrated suspension line, comprising: a first circuit board, a second circuit frame, a third circuit board, a fourth circuit frame, and a fifth circuit board stacked sequentially; a first circular patch is disposed on the surface of the first circuit board; a second circular patch and an annular patch are disposed on the surface of the third circuit board; a microstrip line extends at one end to the second circular patch and at the other end to the outer edge of the third circuit board; the outer edge of the annular patch is connected to the inner edge of the third circuit board via a first connecting stub, and a plurality of second connecting stubs are connected to the inner edge of the semi-circular ring of the annular patch; a metallized through-hole is formed at the end of the second connecting stubs away from the edge of the annular patch. This invention, based on a dielectric integrated suspension line structure, achieves filtering performance by changing the mode of the circular radiating patch, thus solving the problem that existing filtered antenna designs require additional circuitry and have poor out-of-band suppression performance.

Description

Technical Field

[0001] This invention belongs to the field of filtered antenna technology, specifically relating to a high-gain filtered circular patch antenna based on a dielectric integrated suspension line. Background Technology

[0002] With the development of wireless communication systems, radio frequency front-end circuits are moving towards integration, high performance, and self-packaging. In order to improve the overall performance of the radio frequency front-end, the concept and design of a filter antenna have been proposed, which integrates the functions of the two into a passive device to achieve both filtering and radiation functions.

[0003] Filtered antennas, as a new type of integrated antenna component, are gradually emerging. They combine antennas and filters, reducing assembly steps, lowering system complexity, and improving circuit performance. A filtered antenna is an antenna with filtering parameters that integrates the antenna and filter unit. Upon receiving a wireless signal, it directly filters the signal to reduce interference and improve the signal-to-noise ratio. Therefore, filtered antennas not only have transmitting and receiving functions but also filter out signals from other frequency bands, improving communication quality. The dielectric integrated suspension line (SISL) structure used in filtered antenna design is based on multilayer board manufacturing technology, consisting of a five-layer stacked structure. Two of the dielectric substrate layers are partially cut away to form a hollow cavity structure. When these multilayer boards are sequentially laminated together, they form the air cavity structure required for the suspension line circuit. However, existing filtered antenna designs often achieve a filtering effect by adding additional circuitry to generate a radiation null point. This increases the antenna's size, hindering miniaturization, and results in poor out-of-band suppression performance. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, this invention provides a high-gain filtered circular patch antenna based on a dielectric integrated suspension line. The technical problem to be solved by this invention is achieved through the following technical solution:

[0005] A high-gain filtered circular patch antenna based on dielectric integrated suspension wire includes: a first circuit board, a second circuit frame, a third circuit board, a fourth circuit frame, and a fifth circuit board stacked sequentially.

[0006] A first circular patch is provided on the surface of the first dielectric substrate of the first circuit board facing away from the second circuit frame;

[0007] The third dielectric substrate of the third circuit board has a second circular patch on the surface facing the second circuit frame, and the second circular patch is connected to the microstrip line; the third dielectric substrate of the third circuit board has an annular patch on the surface facing away from the second circuit frame.

[0008] The microstrip line extends at one end to the second circular patch and at the other end to the outer edge of the third circuit board, with gaps between its two sides and the second circular patch.

[0009] The outer edge of the annular patch is connected to the inner edge of the third circuit board via a first connecting short line, and the inner edge of the semi-circular ring of the annular patch is connected with a plurality of second connecting short lines.

[0010] The end of the second connecting stub away from the edge of the annular patch has a metallized through hole; the metallized through hole connects the third dielectric substrate and the second circular patch.

[0011] In one embodiment of the present invention, the plurality of second connecting stubs are evenly distributed.

[0012] In one embodiment of the present invention, the first circuit board includes: a first dielectric substrate and a first upper metal frame and a first lower metal frame respectively disposed on two surfaces of the first dielectric substrate.

[0013] In one embodiment of the present invention, a first opening is provided on one outer edge of the first dielectric substrate, the first upper metal frame and the first lower metal frame.

[0014] In one embodiment of the present invention, the second circuit frame includes: a second dielectric substrate frame and a second upper metal frame and a second lower metal frame respectively covering two surfaces of the second dielectric substrate frame.

[0015] In one embodiment of the present invention, a second opening is provided on the outer edge of the second upper metal frame, the second dielectric substrate and the second lower metal frame at a position corresponding to the first opening;

[0016] A second lower opening is provided on the inner edge of the second lower metal frame. The second lower opening and the second opening are located on the same side, and the second lower opening passes through the inner edge and communicates with the second opening.

[0017] In one embodiment of the present invention, the third circuit board includes: the third dielectric substrate and a third upper metal frame and a third lower metal frame respectively disposed on two surfaces of the third dielectric substrate.

[0018] In one embodiment of the present invention, the fourth circuit frame includes: a fourth dielectric substrate frame and a fourth upper metal frame and a fourth lower metal frame respectively disposed on two surfaces of the fourth dielectric substrate frame.

[0019] In one embodiment of the present invention, the fifth circuit board includes: a fifth dielectric substrate and a fifth upper metal layer and a fifth lower metal layer respectively covering two surfaces of the fifth dielectric substrate.

[0020] In one embodiment of the present invention, the microstrip line and the first connecting stub are vertically aligned;

[0021] The microstrip line is located at the third upper metal frame, corresponding to the position of the second opening.

[0022] The beneficial effects of this invention are:

[0023] This invention utilizes a substrate-integrated suspension line structure to implement a filter antenna. This self-encapsulating structure effectively shields against external electromagnetic interference. Furthermore, the invention features a simple structure, eliminating the need for additional filtering circuitry. Through circular patches and rings, it not only broadens the operating bandwidth but also generates four radiation null points on both sides of the operating frequency band, significantly improving the out-of-band suppression of the filter antenna, reducing its size, lowering design complexity, and simplifying the design process by reducing the number of parameters.

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a high-gain filtered circular patch antenna based on a dielectric integrated suspension line, provided in an embodiment of the present invention.

[0026] Figure 2 A schematic cross-sectional view of a high-gain filtered circular patch antenna based on a dielectric integrated suspension line, provided for an embodiment of the present invention;

[0027] Figure 3a This is a schematic diagram of the structure of the first circuit board provided in an embodiment of the present invention;

[0028] Figure 3b This is a schematic diagram of the structure of the second circuit block provided in an embodiment of the present invention;

[0029] Figure 3c This is a schematic diagram of the structure of the third circuit board provided in an embodiment of the present invention;

[0030] Figure 3d This is a schematic diagram of the structure of the fourth circuit block provided in an embodiment of the present invention;

[0031] Figure 3e This is a schematic diagram of the structure of the fifth circuit board provided in an embodiment of the present invention;

[0032] Figure 4The S-parameter-frequency result diagram of a high-gain filtered circular patch antenna based on a dielectric integrated suspension line is provided for an embodiment of the present invention.

[0033] Figure 5 A gain-frequency result diagram of a simulation of a high-gain filtered circular patch antenna based on a dielectric integrated suspension line, provided for an embodiment of the present invention;

[0034] Figure 6 The present invention provides a simulation of the normalized E-plane and H-plane radiation patterns of a high-gain filtered circular patch antenna based on a dielectric integrated suspension line at three resonant frequencies, as provided in an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-First circuit board; 11-First upper metal frame; 12-First lower metal frame; 13-First dielectric substrate; 14-First opening; 111-First circular patch; 112-Metalized mounting via; 113-Metalized shielding via; 2-Second circuit frame; 21-Second upper metal frame; 22-Second lower metal frame; 23-Second dielectric substrate frame; 24-Second opening; 221-Second lower opening; 3-Third circuit board; 31-Third upper metal frame; 32-First... 3-Lower metal frame; 33-Third dielectric substrate; 311-Second circular patch; 312-Microstrip line; 313-Gap; 321-Circular patch; 322-First connecting stub; 323-Second connecting stub; 331-Metallized via; 4-Fourth circuit frame; 41-Fourth upper metal frame; 42-Fourth lower metal frame; 43-Fourth dielectric substrate frame; 5-Fifth circuit board; 51-Fifth upper metal layer; 52-Fifth lower metal layer; 53-Fifth dielectric substrate. Detailed Implementation

[0037] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0038] like Figure 1 , Figure 2 and Figures 3a-3e As shown, a high-gain filtered circular patch antenna based on a dielectric integrated suspension line includes: a first circuit board 1, a second circuit frame 2, a third circuit board 3, a fourth circuit frame 4, and a fifth circuit board 5 stacked sequentially. In this embodiment, the antenna is composed of five circuit boards, which are assembled together using screws. Figure 2 As shown, the first circuit board 1, the second circuit frame 2, the third circuit board 3, the fourth circuit frame 4, and the fifth circuit board 5 are arranged sequentially from top to bottom.

[0039] A first circular patch 111 is provided on the surface of the first dielectric substrate 13 of the first circuit board 1 facing away from the second circuit frame 2. A second circular patch 311 is provided on the surface of the third dielectric substrate 33 of the third circuit board 3 facing the second circuit frame 2, and the second circular patch 311 is connected to the microstrip line 312; an annular patch 321 is provided on the surface of the third dielectric substrate 33 of the third circuit board 3 facing away from the second circuit frame 2.

[0040] One end of the microstrip line 312 extends to the second circular patch 311, and the other end extends to the outer edge of the third circuit board 3, with gaps 313 between the two sides of the microstrip line 312 and the second circular patch 311. The outer edge of the annular patch 321 is connected to the inner edge of the third circuit board 3 via a first connecting stub 322, and a plurality of second connecting stubs 323 are connected to the inner edge of the semi-circular ring of the annular patch 321. A metallized through-hole 331 is formed at the end of the second connecting stub 323 away from the edge of the annular patch 321; the metallized through-hole 331 penetrates the third dielectric substrate 33 and connects the second circular patch 311.

[0041] In this embodiment, the introduction of the first circular patch 111 increases the gain of the filter antenna, increases the impedance bandwidth, and generates a radiation null at the upper edge of the operating frequency band. A cavity structure is formed between the second circuit block 2 and the fourth circuit block 4. In the third circuit board 3, a microstrip line 312 is used to excite the second circular patch 311. Two gaps 313 are present at the connection between the microstrip line 312 and the second circular patch 311, serving to achieve impedance matching of the antenna. When the second circular patch 311 is excited, a resonant point is generated, and the operating mode within the operating frequency band is TM. 11 The circular patch 321 is connected to the inner edge of the metal layer of the third circuit board 3 via a first connecting stub 322. Simultaneously, multiple second connecting stubs 323 connect the inner edge of the semi-circular ring of the circular patch 321. A metallized through-hole 331 is provided at the end of each second connecting stub 323 to connect to a second circular patch 311. The diameter of the second circular patch 311 is equal to the minimum diameter of the circular patch 321. After connection, the filter antenna gains a resonant point. At low frequencies, the operating mode of the second circular patch 311 is determined by TM. 11 Change to TM 21 This pattern generates a radiation null at the lower edge of the operating frequency band, and two additional radiation nulls on both sides of the operating frequency band, further expanding the out-of-band suppression range and enhancing filtering performance. The metal layers distributed on the fifth circuit board 5 enclose the entire filter antenna, suppressing the antenna's back radiation.

[0042] The filter antenna in this embodiment has a simple structure and does not require additional filtering circuits. By using circular patches and rings, it not only widens the operating bandwidth but also generates four radiation nulls on both sides of the operating frequency band, which greatly improves the out-of-band suppression effect of the filter antenna, reduces the size of the antenna, and reduces the design complexity. At the same time, it has fewer parameters, simplifying the design process.

[0043] Furthermore, such as Figure 3a As shown, the first circuit board 1 includes a first dielectric substrate 13 and a first upper metal frame 11 and a first lower metal frame 12 respectively disposed on two surfaces of the first dielectric substrate 13. The first upper metal frame 11 and the first lower metal frame 12 cover the edges of the first dielectric substrate 13. A first opening 14 is formed on a corresponding outer edge of the first dielectric substrate 13, the first upper metal frame 11, and the first lower metal frame 12. The first opening 14 does not penetrate the inner edge of the metal frame.

[0044] like Figure 3b As shown, the second circuit frame 2 includes a second dielectric substrate frame 23 and a second upper metal frame 21 and a second lower metal frame 22 respectively covering the two surfaces of the second dielectric substrate frame 23. A second opening 24 is formed on the outer edges of the second upper metal frame 21, the second dielectric substrate, and the second lower metal frame 22 at a position corresponding to the first opening 14; the second opening 24 does not penetrate the inner edge of the metal frame. The second opening 24 and the first opening 14 have the same size and are vertically aligned. A second lower opening 221 is formed on the inner edge of the second lower metal frame 22. The second lower opening 221 and the second opening 24 are located on the same side, and the second lower opening 221 penetrates the inner edge and communicates with the second opening 24.

[0045] Furthermore, such as Figure 3c As shown, multiple second connecting stubs 323 are evenly distributed, with one second connecting stub 323 spaced at 25° intervals. The second connecting stubs 323 are located on a semicircular ring that is not connected to the first connecting stub 322. Figure 3e As shown, the fifth circuit board 5 includes a fifth dielectric substrate 53 and a fifth upper metal layer 51 and a fifth lower metal layer 52 respectively covering the two surfaces of the fifth dielectric substrate 53. The fifth upper metal layer 51 and the fifth lower metal layer 52 enclose the entire filter antenna, suppressing the antenna's back radiation.

[0046] The microstrip line 312 is vertically aligned with the first connecting stub 322; the microstrip line 312 is located in the middle of the third upper metal frame 31, which corresponds to the second opening 24.

[0047] like Figure 3cAs shown, the third circuit board 3 includes: a third dielectric substrate 33 and a third upper metal frame 31 and a third lower metal frame 32 respectively disposed on two surfaces of the third dielectric substrate 33. The third upper metal frame 31 and the third lower metal frame 32 cover the edges of the third dielectric substrate 33. Figure 3d As shown, the fourth circuit frame 4 includes: a fourth dielectric substrate frame 43 and a fourth upper metal frame 41 and a fourth lower metal frame 42 respectively disposed on two surfaces of the fourth dielectric substrate frame 43.

[0048] In this embodiment, the thickness of the first dielectric substrate 13 is 0.8 mm, the thickness of the second dielectric substrate is 2 mm, the thickness of the third dielectric substrate 33 is 0.25 mm, the thickness of the fourth dielectric substrate is 2 mm, and the thickness of the fifth dielectric substrate 53 is 0.8 mm. All dielectric substrates have a dielectric constant of 2.2, are square, and have a side length of 90 mm * 90 mm. The first opening 14 is located at the middle of its side and is a rectangular opening with a length of 15 mm, a width of 5 mm, and a height of 0.8 mm. The second opening 24 is located at the middle of its side and is a rectangular opening with a length of 15 mm, a width of 5 mm, and a height of 2 mm. The cavities between the second circuit frame 2 and the fourth circuit frame 4 are rectangular cavities 24 and 44 with a length of 80 mm, a width of 72 mm, and a height of 2 mm. Nine metallized through-holes 331 with a radius of 0.3 mm connect the ends of the second circular patch 311 and the second connecting stub 323.

[0049] like Figures 3a-3e As shown, multiple metallized mounting through holes 112 are correspondingly arranged vertically on the metal frames of the first circuit board 1, the second circuit frame 2, the third circuit board 3, the fourth circuit frame 4, and the frame of the fifth circuit board 5. The radius of the metallized mounting through holes 112 is 1.1 mm. The multiple metallized mounting through holes 112 are distributed circumferentially along the frame to facilitate antenna assembly. Multiple metallized shielding through holes 113 are correspondingly arranged vertically on the metal frames of the first circuit board 1, the second circuit frame 2, the third circuit board 3, the fourth circuit frame 4 near the inner edge, and on the corresponding position of the fifth circuit board 5. The radius of the metallized shielding through holes 113 is 0.2 mm. The multiple metallized shielding through holes 113 are distributed circumferentially along the frame to form a closed metal wall, effectively blocking external electromagnetic interference. The first circular patch 111 has a radius of 20.4 mm. The distance from the edge of the first circular patch 111 to the left and right sides of the inner edge of the first upper metal frame 11 is 25.8 mm, and the distance from the bottom edge is 11.6 mm. The introduction of the first circular patch 111 increases the gain of the filter antenna, increases the impedance bandwidth, and generates a radiation null at the upper edge of the operating frequency band. The second lower opening 221 has a length of 5 mm and a width of 4 mm.

[0050] like Figure 3c As shown, the microstrip line 312 excites the second circular patch 311. The microstrip line 312 consists of two sub-microstrip lines 312, one 4mm long and 1mm wide, and the other 2mm long and 0.2mm wide. At the connection between the microstrip line 312 and the second circular patch 311, there are two gaps 313, each 4.2mm long and 0.6mm wide, which serve to achieve impedance matching of the antenna. When the second circular patch 311, with a radius of 24.8mm, is excited, a resonant point is generated, and the operating mode within the operating frequency band is TM. 11 The mode. A circular patch 321 with a radius of 25.6 mm and a width of 0.6 mm is connected to the third lower metal frame 32 via a first connecting stub 322 with a length of 7.6 mm and a width of 1.3 mm. Simultaneously, on the upper half of the circular patch 321, a second connecting stub 323 with a length of 4.5 mm and a width of 0.6 mm is distributed at 25° intervals, for a total of 9 stubs. A metallized through-hole 331 is provided at the end of the second connecting stub 323 to connect to the first circular patch 111. After connection, the filter antenna adds a resonant point. At low frequencies, the operating mode of the second circular patch 311 is determined by TM. 11 Change to TM 21 This mode generates a radiation null at the lower edge of the operating frequency band, and two additional radiation nulls on both sides of the operating frequency band, further expanding the out-of-band suppression range and enhancing the filtering performance.

[0051] Figure 6 These are the normalized radiation patterns of the E-plane and H-plane at three resonant frequencies of the antenna simulation of this invention; where (a) is the 2.97GHz E-plane and H-plane radiation pattern, (b) is the 3.2GHz E-plane and H-plane radiation pattern, and (c) is the 3.3GHz E-plane and H-plane radiation pattern.

[0052] Simulation experiments were conducted using HFSS software to further illustrate the results of this invention.

[0053] See Figure 4 The figure shows the S-parameter simulation results of the present invention. The operating frequency band of the filter antenna is 2.92-3.34GHz, and the impedance bandwidth (|S11|<-10) is 13.4%.

[0054] See Figure 5 As shown, the peak gain of the filter antenna is 9.68 dBi, and the gain is flat within the operating frequency band. The high-frequency out-of-band rejection exceeds 21 dB, the low-frequency out-of-band rejection exceeds 17 dB, and it has 4 radiation nulls on both sides of the passband, exhibiting excellent filtering characteristics.

[0055] See Figure 6 As shown, the radiation mode of the filtered antenna is very stable within the operating frequency band, and the main polarization of the E / H plane is more than 25dB higher than the corresponding cross-polarization.

[0056] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0058] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0059] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0061] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line, characterized in that, include: The first circuit board (1), the second circuit frame (2), the third circuit board (3), the fourth circuit frame (4), and the fifth circuit board (5) are stacked in sequence; A first circular patch (111) is provided on the surface of the first dielectric substrate (13) of the first circuit board (1) facing away from the second circuit frame (2); The third dielectric substrate (33) of the third circuit board (3) has a second circular patch (311) on the surface facing the second circuit frame (2), and the second circular patch (311) is connected to the microstrip line (312); the third dielectric substrate (33) of the third circuit board (3) has an annular patch (321) on the surface facing away from the second circuit frame (2). The microstrip line (312) extends at one end to the second circular patch (311) and at the other end to the outer edge of the third circuit board (3), and there is a gap (313) between the two sides and the second circular patch (311); The outer edge of the circular patch (321) is connected to the inner edge of the third circuit board (3) through a first connecting stub (322), and the inner edge of the semi-circular ring of the circular patch (321) is connected with a plurality of second connecting stubs (323). The second connecting stub (323) has a metallized through hole (331) at its end away from the edge of the annular patch (321); the metallized through hole (331) connects the third dielectric substrate (33) and the second circular patch (311).

2. The high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 1, characterized in that, The plurality of second connecting stubs (323) are evenly distributed.

3. The high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 1, characterized in that, The first circuit board (1) includes: the first dielectric substrate (13) and a first upper metal frame (11) and a first lower metal frame (12) respectively disposed on two surfaces of the first dielectric substrate (13).

4. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 3, characterized in that, A first opening (14) is provided on one of the corresponding outer edges of the first dielectric substrate (13), the first upper metal frame (11) and the first lower metal frame (12).

5. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 4, characterized in that, The second circuit frame (2) includes: a second dielectric substrate frame (23) and a second upper metal frame (21) and a second lower metal frame (22) respectively covering the two surfaces of the second dielectric substrate frame (23).

6. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 5, characterized in that, A second opening (24) is provided on the outer edge of the second upper metal frame (21), the second dielectric substrate and the second lower metal frame (22) at a position corresponding to the first opening (14); A second lower opening (221) is provided on the inner edge of the second lower metal frame (22). The second lower opening (221) and the second opening (24) are located on the same side, and the second lower opening (221) passes through the inner edge and communicates with the second opening (24).

7. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 1, characterized in that, The third circuit board (3) includes: the third dielectric substrate (33) and a third upper metal frame (31) and a third lower metal frame (32) respectively disposed on two surfaces of the third dielectric substrate (33).

8. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 1, characterized in that, The fourth circuit frame (4) includes: a fourth dielectric substrate frame (43) and a fourth upper metal frame (41) and a fourth lower metal frame (42) respectively disposed on two surfaces of the fourth dielectric substrate frame (43).

9. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 1, characterized in that, The fifth circuit board (5) includes: a fifth dielectric substrate (53) and a fifth upper metal layer (51) and a fifth lower metal layer (52) respectively covering the two surfaces of the fifth dielectric substrate (53).

10. A high-gain filtered circular patch antenna based on a dielectric integrated suspension line according to claim 6, characterized in that, The microstrip line (312) is vertically aligned with the first connecting stub (322); The microstrip line (312) is located at the third upper metal frame (31) corresponding to the second opening (24).

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