Miniaturized microwave assembly hermetic structure

Abstract

The application provides a kind of miniaturized microwave assembly airtight structure, including shell, sealing assembly and microwave assembly, the sealing assembly is arranged on the shell, the outer wall of the shell is symmetrically opened with two L-shaped through slot, the inner wall of the L-shaped through slot is attached with fixed plate, the upper surface of the fixed plate is linearly arrayed with L-shaped connecting plate, the L-shaped connecting plate is arranged on the sealing assembly, the inner side bottom wall of the L-shaped through slot is linearly arrayed with thread groove, the upper surface of the fixed plate is linearly arrayed with circular through hole, and the inner wall of the circular through hole is attached with bolt;The fixed plate is fixed on the shell by bolt, the sealing assembly is pulled tightly by the fixed plate through L-shaped connecting plate and the shell, and then welded by laser seal welding, to improve the air tightness of the microwave assembly, avoid the air hole produced by threaded connection, reduce a large number of welding seams, and reduce the corresponding workload and production cost.

Description

Technical Field

[0001] This invention relates to the field of microwave component hermetic structure technology, and particularly to a miniaturized microwave component hermetic structure. Background Technology

[0002] Microwave components are products assembled using various microwave components and other parts. They are connected to external circuits using coaxial, waveguide, or other transmission lines, and are also interconnected using high- and low-frequency connectors and encapsulated in a housing structure. The airtightness of the encapsulation structure is closely related to the microwave transmission performance. If the encapsulation structure is not airtight, water vapor will condense inside the encapsulation structure under high and low temperature environments, contaminating the bare chip inside the microwave component and affecting the microwave transmission performance.

[0003] A search revealed CN110035626A, a miniaturized microwave component's hermetic structure, comprising a housing and a cover plate. The housing and cover plate are connected by screws to form a chamber. The cover plate is embedded in the chamber, sealing it. A welding groove is provided at the opening of the screw hole corresponding to the screw, and a screw hole hermetic component is embedded in the welding groove to seal the screw hole. By using the screw hole hermetic component to seal the opening of the screw hole, an hermetic seal is achieved at the threaded contact surface between the screw and the housing or cover plate. This allows the entire microwave component to be hermeticly sealed using a single-layer cover plate, with a thin overall thickness. The smaller size enables the miniaturization of the hermetic structure. At the same time, planar welds are formed at each hermetic location, which is conducive to achieving hermetic packaging of microwave components using mature packaging technology. The packaging effect is good, ensuring excellent waveguide transmission performance. Although planar welds are required at each hermetic location to ensure the hermetic packaging of microwave components when screws are used to tightly fix the shell and cover plate, this threaded connection will generate a large number of pores and welds, increasing the workload and production cost. Therefore, a miniaturized hermetic structure for microwave components is proposed. Summary of the Invention

[0004] In view of this, the present invention aims to provide a miniaturized microwave component hermetic structure to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial alternative.

[0005] The technical solution of this invention is implemented as follows: A miniaturized microwave component hermetic structure includes a housing, a sealing component, and a microwave component. The sealing component is disposed on the housing. Two L-shaped through grooves are symmetrically formed on the outer wall of the housing. A fixing plate is attached to the inner wall of the L-shaped through groove. L-shaped connecting plates are linearly arranged on the upper surface of the fixing plate. The L-shaped connecting plates are disposed on the sealing component. Threaded grooves are linearly arranged on the inner bottom wall of the L-shaped through groove. Circular through holes are linearly arranged on the upper surface of the fixing plate. Bolts are attached to the inner wall of the circular through holes. The outer wall of the bolts is threadedly connected to the inner wall of the threaded grooves.

[0006] In some embodiments, the sealing assembly includes a first low-frequency component, a second low-frequency component, and a third low-frequency component. The upper surface of the second low-frequency component is disposed on the lower surface of the first low-frequency component, and the upper surface of the third low-frequency component is disposed on the lower surface of the second low-frequency component. The first low-frequency component is made of ferrite, the second low-frequency component is made of carbon fiber, and the third low-frequency component is made of mineral wool.

[0007] In some embodiments, the first low-frequency component is laser-sealed to the housing.

[0008] In some embodiments, the microwave component includes a waveguide structure, an external radio frequency connector, and a chip. The waveguide structure is disposed on the inner bottom wall of the housing, the external radio frequency connector is soldered to the inner bottom wall of the housing, and the chip is disposed on the external radio frequency connector. The opening direction of the waveguide structure is in the same normal direction as the microwave signal transmission direction of the external radio frequency connector.

[0009] In some embodiments, a rubber sealing ring is embedded in the lower surface of the first low-frequency component, and the lower surface of the rubber sealing ring is in contact with the upper surface of the housing.

[0010] In some embodiments, a limiting groove is formed on the lower surface of the L-shaped through groove, and a limiting plate is attached to the inner wall of the limiting groove. The limiting plate and the fixing plate are integrally formed.

[0011] The embodiments of the present invention have the following advantages due to the adoption of the above technical solutions:

[0012] This invention uses bolts to fix the fixing plate to the housing. After the fixing plate is pulled to the sealing component and tightly fitted to the housing by the L-shaped connecting plate, it is welded by laser sealing, which improves the airtightness of the microwave component, avoids the generation of air holes in the threaded connection, reduces a large number of welding seams, and reduces the corresponding workload and production costs.

[0013] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a structural diagram of the present invention;

[0016] Figure 2 This is a side view of the structure of the present invention;

[0017] Figure 3 For the present invention Figure 2 AA side section structural diagram;

[0018] Figure 4 For the present invention Figure 3 Enlarged structural diagram of region B;

[0019] Figure 5 For the present invention Figure 3 Enlarged structural diagram of region C.

[0020] Reference numerals: 1. Housing; 2. Sealing assembly; 3. Microwave assembly; 4. L-shaped connecting plate; 5. Fixing plate; 6. L-shaped through groove; 7. Limiting through groove; 8. Limiting plate; 9. Circular through hole; 10. Threaded groove; 11. Bolt; 12. Rubber sealing ring; 20. First low-frequency component; 21. Second low-frequency component; 22. Third low-frequency component; 30. Waveguide structure; 31. External RF connector; 32. Chip. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0022] It is important to note that terms such as "first," "second," "symmetric," and "array" are used only to distinguish between descriptive and positional descriptions, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified with "first," "symmetric," etc., may explicitly or implicitly include one or more of that feature; similarly, when the quantity of certain features is not limited by words such as "two" or "three," it should be noted that such features also explicitly or implicitly include one or more features.

[0023] In this invention, unless otherwise explicitly specified and limited, terms such as "installation," "connection," and "fixation" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection, a direct connection, a welding connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the accompanying drawings and specific circumstances.

[0024] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0025] like Figures 1-5 As shown, this embodiment of the invention provides a miniaturized microwave component airtight structure, including a housing 1, a sealing component 2, and a microwave component 3. The sealing component 2 is disposed on the housing 1. Two L-shaped through grooves 6 are symmetrically opened on the outer wall of the housing 1. A fixing plate 5 is attached to the inner wall of the L-shaped through groove 6. L-shaped connecting plates 4 are linearly arranged on the upper surface of the fixing plate 5. The L-shaped connecting plates 4 are disposed on the sealing component 2. Threaded grooves 10 are linearly arranged on the inner bottom wall of the L-shaped through groove 6. Circular through holes 9 are linearly arranged on the upper surface of the fixing plate 5. Bolts 11 are attached to the inner wall of the circular through holes 9. The outer wall of the bolts 11 is threadedly connected to the inner wall of the threaded grooves 10.

[0026] In this embodiment, specifically, the sealing component 2 includes a first low-frequency component 20, a second low-frequency component 21, and a third low-frequency component 22. The upper surface of the second low-frequency component 21 is disposed on the lower surface of the first low-frequency component 20, and the upper surface of the third low-frequency component 22 is disposed on the lower surface of the second low-frequency component 21. The first low-frequency component 20 is made of ferrite, the second low-frequency component 21 is made of carbon fiber, and the third low-frequency component 22 is made of mineral wool. Through the above configuration, the first low-frequency component 20, the second low-frequency component 21, and the third low-frequency component 22 have electromagnetic shielding, stealth, anti-metal interference, conductivity, microwave absorption, and noise absorption properties.

[0027] In this embodiment, specifically, the first low-frequency component 20 and the housing 1 are laser-sealed.

[0028] In this embodiment, specifically, the microwave component 3 includes a waveguide structure 30, an external radio frequency connector 31, and a chip 32. The waveguide structure 30 is disposed on the inner bottom wall of the housing 1, the external radio frequency connector 31 is soldered to the inner bottom wall of the housing 1, and the chip 32 is disposed on the external radio frequency connector 31. The opening direction of the waveguide structure 30 is in the same normal direction as the microwave signal transmission direction of the external radio frequency connector 31. Through the above arrangement, the microwave signal is input from the opening of the waveguide structure 30, enters the electronic circuit composed of several chips 32, and is then output from the external radio frequency connector 31, realizing the smooth transmission of the microwave signal, resulting in better microwave signal transmission performance, and miniaturizing the thickness of the microwave component 3 to the greatest extent, thus achieving miniaturization and thinning of the microwave component 3.

[0029] In this embodiment, specifically, a rubber sealing ring 12 is embedded on the lower surface of the first low-frequency component 20, and the lower surface of the rubber sealing ring 12 is in contact with the upper surface of the housing 1. The rubber sealing ring 12 is provided to enhance the airtightness between the first low-frequency component 20 and the housing 1.

[0030] In this embodiment, specifically, a limiting groove 7 is formed on the lower surface of the L-shaped through groove 6, and a limiting plate 8 is attached to the inner wall of the limiting groove 7. The limiting plate 8 and the fixing plate 5 are integrally formed. By setting the limiting plate 8 to move in the limiting groove 7, the position of the first low-frequency component 20 can be limited.

[0031] When the invention is in operation: relevant personnel hold the sealing assembly 2 and move multiple L-shaped connecting plates 4 and two fixing plates 5, so that the fixing plates 5 move the limiting plate 8 in the L-shaped through groove 6. When the sealing assembly 2 moves above the housing 1, relevant personnel hold the bolt 11 and pass it through the circular through hole 9 to thread it in the threaded groove 10, so that the first low-frequency component 20 in the sealing assembly 2 is tightly combined with the housing 1. Afterwards, relevant personnel use laser sealing welding to weld the first low-frequency component 20 and the housing 1.

[0032] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in the present invention, and these should all be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A miniaturized microwave component hermetic structure, comprising a housing (1), a sealing component (2), and a microwave component (3), characterized in that... It lies in: The sealing assembly (2) is disposed on the housing (1). Two L-shaped through grooves (6) are symmetrically opened on the outer wall of the housing (1). A fixing plate (5) is attached to the inner wall of the L-shaped through groove (6). An L-shaped connecting plate (4) is linearly arranged on the upper surface of the fixing plate (5). The L-shaped connecting plate (4) is disposed on the sealing assembly (2). A threaded groove (10) is linearly arranged on the inner bottom wall of the L-shaped through groove (6). A circular through hole (9) is linearly arranged on the upper surface of the fixing plate (5). A bolt (11) is attached to the inner wall of the circular through hole (9). The outer wall of the bolt (11) is threadedly connected to the inner wall of the threaded groove (10). The sealing assembly (2) includes a first low-frequency component (20), a second low-frequency component (21) and a third low-frequency component (22). The upper surface of the second low-frequency component (21) is disposed on the lower surface of the first low-frequency component (20), and the upper surface of the third low-frequency component (22) is disposed on the lower surface of the second low-frequency component (21). The first low-frequency component (20) is made of ferrite, the second low-frequency component (21) is made of carbon fiber, and the third low-frequency component (22) is made of mineral wool. The first low-frequency component (20) is laser-sealed to the housing (1); The lower surface of the L-shaped through groove (6) is provided with a limiting through groove (7), and the inner wall of the limiting through groove (7) is fitted with a limiting plate (8). The limiting plate (8) and the fixing plate (5) are integrally formed.

2. The hermetic structure for a miniaturized microwave component according to claim 1, characterized in that: The microwave component (3) includes a waveguide structure (30), an external radio frequency connector (31), and a chip (32). The waveguide structure (30) is disposed on the inner bottom wall of the housing (1). The external radio frequency connector (31) is welded to the inner bottom wall of the housing (1). The chip (32) is disposed on the external radio frequency connector (31). The opening direction of the waveguide structure (30) is in the same normal direction as the microwave signal transmission direction of the external radio frequency connector (31).

3. The hermetic structure for a miniaturized microwave component according to claim 2, characterized in that: A rubber sealing ring (12) is embedded on the lower surface of the first low-frequency component (20), and the lower surface of the rubber sealing ring (12) is in contact with the upper surface of the housing (1).

Images