Electroplating electrode and electroplating method using the same

Abstract

The plating electrode has a plating liquid impregnated cloth, a ring member, a first rotating member, and a second rotating member. An anode of a direct current power supply is electrically connected to the first rotating member, and a cathode of the direct current power supply is electrically connected to the plated object. The ring member is rotated in synchronization with the rotation of the first and second rotating members, whereby the plating liquid impregnated cloth is rotated in a ring direction and slides in contact with the plated portion of the plated object.

Description

Technical Field

[0001] This disclosure relates to an electroplating electrode for forming an electroplating film on an electroplated object and an electroplating method using the electroplating electrode. Background Technology

[0002] Conventional electroplating methods are known to form an electroplated film by electroplating an object. In these methods, to prevent the electroplated film from forming on areas other than the portion to be plated (i.e., the part to be plated), a masking process is performed before electroplating, using a masking material such as a photoresist to protect the areas outside the plated portion. However, existing electroplating methods suffer from the following problem: this masking process increases processing time and reduces productivity. Therefore, for example, Patent Document 1 discloses a partial electroplating method that eliminates the masking process. This partial electroplating method involves immersing the portion of the object to be plated in the electroplating solution in an electroplating bath, while exposing the non-plated portion above the surface of the solution, thus forming an electroplated film only on the surface of the portion to be plated.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6510993 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in the partial electroplating method disclosed in Patent Document 1, the entire portion to be electroplated is immersed in the electroplating solution in the electroplating tank, thus forming an electroplating film around the immersed portion. Therefore, it is impossible to selectively form an electroplating film only on a portion of the surface of the object being electroplated. In other words, in the partial electroplating method of Patent Document 1, the portion to be partially electroplated is limited, and partial electroplating of various patterns is not possible.

[0008] This disclosure was made to solve the aforementioned problem, and its purpose is to provide an electroplating electrode and an electroplating method using the electroplating electrode such that there is no need to use a masking material to protect the part other than the part to be electroplated, and it is possible to selectively perform local electroplating only on a part of the surface of the object to be electroplated.

[0009] Methods for solving problems

[0010] The electroplating electrode disclosed herein is used to form an electroplated film on an object to be electroplated. The electroplating electrode comprises: an electroplating solution impregnated cloth formed in a ring shape; a conductive annular member disposed within the ring of the electroplating solution impregnated cloth, configured such that its outer surface is in close contact with the inner surface of the electroplating solution impregnated cloth; a first rotating member disposed within the annular member and electrically connected to it, capable of rotating while ensuring conductivity; and a second rotating member disposed within the annular member, rotating synchronously with a motor drive. The first rotating member is electrically connected to the anode of a DC power supply, and the object to be electroplated is electrically connected to the cathode of the DC power supply. The annular member rotates synchronously with the rotation of the first and second rotating members, thereby causing the electroplating solution impregnated cloth to rotate in the annular direction and slide in contact with the electroplated portion of the object to be electroplated.

[0011] The electroplating method disclosed herein uses the aforementioned electroplating electrode, wherein, while the electroplating solution is permeated into the electroplating solution impregnating cloth, the electroplating solution impregnating cloth is rotated, and a DC power supply is applied to make the electroplating solution impregnating cloth slide in contact with the electroplated part of the object to be electroplated, thereby performing the electroplating treatment.

[0012] Invention Effects

[0013] According to this disclosure, the electroplating solution-impregnated cloth, which is in close contact with the annular member electrically connected to the anode of the DC power supply via the first rotating member, slides on one side in contact with the electroplated portion of the workpiece electrically connected to the cathode of the DC power supply. This allows an electroplating film to be formed only on the electroplated portion in contact with the electroplating solution-impregnated cloth. Therefore, masking operations that require masking materials to protect portions other than the electroplated portion are eliminated, and an electroplating film can be selectively formed only on a portion of the surface of the workpiece. Attached Figure Description

[0014] Figure 1 This is a perspective view schematically showing the electroplating electrode of Embodiment 1.

[0015] Figure 2 This is an explanatory diagram schematically showing the structure of the electroplating electrode of Embodiment 1, in which the annular member is rotated in the annular direction.

[0016] Figure 3 This is a cross-sectional view schematically showing the electroplating electrode of Embodiment 1, with the electroplating solution impregnated cloth fixed to the annular component.

[0017] Figure 4 This is a perspective view schematically showing the electroplating electrode of Embodiment 1 in a state where an electroplating film has been formed on the workpiece.

[0018] Figure 5This is an explanatory diagram showing an example of an electroplating electrode of Embodiment 1 forming an electroplating film on an electroplated object having a recess.

[0019] Figure 6 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1.

[0020] Figure 7 This is a flowchart of a variation of the electroplating method of Embodiment 1.

[0021] Figure 8 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1, Example 2.

[0022] Figure 9 This is a flowchart of a variation of the electroplating method of Embodiment 1, Example 2.

[0023] Figure 10 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1, Example 3.

[0024] Figure 11 This is a flowchart of a variation of the electroplating method of Embodiment 1, Example 3.

[0025] Figure 12 This is an explanatory diagram schematically showing the main parts of the electroplating electrode of Embodiment 2.

[0026] Figure 13 It is a schematic representation of from Figure 12 The diagram illustrates the state in which the electroplating electrode moves and the electroplating solution permeates the cloth and comes into contact with the object being electroplated.

[0027] Figure 14 It is a schematic representation of from Figure 12 The diagram shows the state in which all the first movable contact parts are movable, and the electroplating solution-impregnated cloth is in contact with the object being electroplated.

[0028] Figure 15 It is a schematic representation of from Figure 12 The diagram shows a state in which a portion of the first movable contact is movable, and the electroplating solution-impregnated cloth comes into contact with the object being electroplated.

[0029] Figure 16 It is a schematic representation of from Figure 12 The diagram shows a state in which a portion of the first movable contact is movable, and the electroplating solution-impregnated cloth comes into contact with the object being electroplated.

[0030] Figure 17 It is a schematic representation of from Figure 12 The diagram shows the state in which the first movable contact is movable and the electroplating solution-impregnated cloth contacts the curved surface of the object being electroplated.

[0031] Figure 18 It is a schematic representation of from Figure 12 The diagram shows the state in which the first movable contact is movable and the electroplating solution-impregnated cloth contacts the convex surface of the object being electroplated.

[0032] Figure 19 This is an explanatory diagram schematically showing a modified example of the electroplating electrode of Embodiment 2.

[0033] Figure 20 It is a schematic representation of from Figure 19 The diagram shows a state in which a portion of the first movable contact is movable, and the electroplating solution-impregnated cloth comes into contact with the object being electroplated.

[0034] Figure 21 This is an explanatory diagram schematically showing the electroplating electrode of Embodiment 3.

[0035] Figure 22 yes Figure 21 The view shown is along line A.

[0036] Figure 23 This is a perspective view schematically showing the electroplating electrode of Embodiment 4.

[0037] Figure 24 This is an explanatory diagram schematically showing the electroplating electrode of Embodiment 5.

[0038] Figure 25 This is an explanatory diagram schematically showing a modified example 1 of the electroplating electrode of Embodiment 5.

[0039] Figure 26 This is an explanatory diagram schematically showing a modified example 2 of the electroplating electrode of Embodiment 5.

[0040] Figure 27 This is an explanatory diagram schematically showing a modified example 3 of the electroplating electrode of Embodiment 5. Detailed Implementation

[0041] The embodiments will now be described with reference to the accompanying drawings. Furthermore, in each drawing, identical or equivalent parts are labeled with the same reference numerals, and their descriptions are omitted or simplified as appropriate. Additionally, the shape, size, and arrangement of the structures depicted in each drawing can be appropriately modified.

[0042] Implementation Method 1

[0043] Figure 1 This is a perspective view schematically showing the electroplating electrode of Embodiment 1. Figure 2 This is an explanatory diagram schematically showing the structure of the electroplating electrode of Embodiment 1, in which the annular member is rotated in the annular direction. Figure 3This is a cross-sectional view schematically showing the electroplating electrode of Embodiment 1, with the electroplating solution impregnated cloth fixed to the annular component. Figure 4 This is a perspective view schematically showing the electroplating electrode of Embodiment 1 in a state where an electroplating film has been formed on the workpiece. Figure 5 This is an explanatory diagram showing an example of the electroplating electrode of Embodiment 1 forming an electroplated film on a workpiece having a recess. Additionally, Figure 1 , Figure 2 and Figure 4 The hollow arrow 'a' shown indicates the direction of rotation of the electroplating solution impregnated cloth 1 and the annular component 2. Furthermore, Figure 2 The hollow arrow b shown indicates the rotation direction of the first rotating component 3 and the second rotating component 4.

[0044] In this embodiment, the electroplating electrode 100 is used to form an electroplating film on the electroplated portion 200a of the workpiece 200. The electroplated portion 200a refers to the area on the surface of the workpiece 200 where the electroplating film is formed. Figure 1 As shown, the electroplating electrode 100 includes an electroplating solution impregnated cloth 1, an annular component 2, a first rotating component 3, a second rotating component 4, a motor 6, and an electroplating solution supply unit 7.

[0045] like Figure 1 and Figure 2 As shown, the electroplating solution impregnated cloth 1 is annular, and the outer surface of the annulus contacts the electroplated portion 200a of the object to be electroplated 200 to form an electroplating film. Inside the annulus, the electroplating solution impregnated cloth 1 is arranged an annular component 2, a first rotating component 3, and a second rotating component 4. The electroplating solution impregnated cloth 1 is formed of a material capable of absorbing the electroplating solution and not reacting with it. For example, the electroplating solution impregnated cloth 1 is formed of woven fabric, non-woven fabric, or sponge.

[0046] The annular component 2 is, for example, a conductive mesh. The annular component 2 is formed of a material that is insoluble in the electroplating solution used or is difficult to dissolve in the electroplating solution used. As an example, the annular component 2 is formed of platinum (Pt), titanium-platinum (Ti-Pt), titanium-iridium oxide (Ti-IrO2), stainless steel (SUS), carbon (C), etc.

[0047] like Figure 2 As shown, the annular component 2 is disposed inside the annulus of the electroplating solution impregnated cloth 1, and is configured to have its outer surface tightly bonded to the inner surface of the electroplating solution impregnated cloth 1. As a method for tightly bonding the outer surface of the annular component 2 to the inner surface of the electroplating solution impregnated cloth 1, for example... Figure 3As shown, there is a method where the folded-back portion 1a, formed by folding the annular end edge of the electroplating solution impregnated cloth 1 inwards, is hooked onto the annular end edge of the annular member 2 and fixed using a fixing member 20. The fixing member 20 is a clamp or the like made of a material that does not react with the electroplating solution. Furthermore, in this case, the annular end edge of the annular member 2 is bent at an inward angle towards the annulus, thereby preventing the fixing member 20 from contacting the object to be electroplated 200. Alternatively, as another method, the annular member 2 can be sewn onto the electroplating solution impregnated cloth 1 using thread made of a material that does not react with the electroplating solution, thereby ensuring a tight fit between the outer surface of the annular member 2 and the inner surface of the electroplating solution impregnated cloth 1.

[0048] Furthermore, a first rotating member 3 and a second rotating member 4 are disposed inside the annular member 2. The annular member 2 is electrically connected to the first rotating member 3. The annular member 2 rotates synchronously in the annular direction with the rotation of the first rotating member 3 and the second rotating member 4. As the annular member 2 rotates in the annular direction, the electroplating solution impregnated cloth 1, which is in close contact with the annular member 2, also rotates synchronously in the annular direction with the rotation of the first rotating member 3 and the second rotating member 4.

[0049] Furthermore, although the illustration is omitted, it is preferable that the annular member 2 has a cut at its annular end edge 2a. By forming a cut at the annular end edge 2a of the annular member 2, excessive tension generated in the annular member 2 can be suppressed when the first rotating member 3 and the second rotating member 4 come into contact with the annular member 2, and damage to the end of the annular member 2 can be prevented.

[0050] Furthermore, the annular component 2 is not limited to the aforementioned mesh; it can rotate in the annular direction synchronously with the rotation of the first rotating component 3 and the second rotating component 4 while being electrically connected to the first rotating component 3. It can also be composed of other components such as thin plates.

[0051] The first rotating component 3 is a rotating connector having a rotating shaft 30 and a cylindrical rotating body 31 electrically connected to the rotating shaft 30. The first rotating component 3 is disposed inside the annular component 2. The first rotating component 3 is electrically connected to the annular component 2 and is configured to rotate while ensuring the conductivity of the rotating shaft 30 and the rotating body 31.

[0052] The first rotating component 3 is formed of a material that is insoluble in or difficult to dissolve in the electroplating solution used. For example, the first rotating component 3 is formed of platinum (Pt), titanium-platinum (Ti-Pt), titanium-iridium oxide (Ti-IrO2), stainless steel (SUS), carbon (C), etc. Alternatively, the first rotating component 3 may also use commercially available connectors that ensure conductivity between the rotating shaft 30 and the rotating body 31, such as carbon brushes, mercury / gallium alloys, or roller current collectors.

[0053] The rotation shaft 30 of the first rotating component 3 is electrically connected to the anode of the DC power supply 5 via a wire 5a. The electroplated object 200 is electrically connected to the cathode of the DC power supply 5 via a wire 5b. The rotating body 31 of the first rotating component 3 can rotate independently of the rotation shaft 30. In addition, the DC power supply 5 has a power supply circuit that controls the output voltage of DC to always be a constant value.

[0054] like Figure 2 As shown, the first rotating member 3 has a plurality of protrusions 32 with a width smaller than the opening of the annular member 2. The protrusions 32 are spaced apart on the outer peripheral surface of the rotating body 31 along the rotation direction of the rotating body 31. The rotating body 31 has the protrusions 32, thus becoming gear-shaped. The protrusions 32 are inserted into the opening of the annular member 2 by the rotation of the first rotating member 3. Therefore, the rotation of the annular member 2 and the rotating body 31 can be synchronized, and the annular member 2 can rotate in the annular direction. Furthermore, the means of synchronizing the rotation of the annular member 2 and the rotating body 31 is not limited to the structure of providing protrusions 32 on the rotating body 31. For example, tension can be generated between the rotating body 31 and the annular member 2, and friction can be used to synchronize the rotation of the annular member 2 and the rotating body 31; other structures are also possible.

[0055] The second rotating component 4 has a rotation axis 40 and a cylindrical rotating body 41 that rotates through the rotation axis 40. The second rotating component 4 is formed of a material that is insoluble in the electroplating solution or is difficult to dissolve in the electroplating solution. As an example, the second rotating component 4 is formed of platinum (Pt), titanium-platinum (Ti-Pt), titanium-iridium oxide (Ti-IrO2), stainless steel (SUS), carbon (C), etc.

[0056] The rotating shaft 40 is located at the center of the rotating body 41. A motor 6 connected to a power source (not shown) is connected to one end of the rotating shaft 40. Driven by the motor 6, the rotating body 41 of the second rotating component 4 rotates around the rotating shaft 40.

[0057] like Figure 2As shown, the first rotating member 3 has a plurality of protrusions 42 with a width smaller than the opening of the annular member 2. The protrusions 42 are spaced apart on the outer peripheral surface of the rotating body 41 along the rotation direction of the rotating body 41. The rotating body 41 has the protrusions 42, thus forming a gear shape. The protrusions 42 are inserted into the opening of the annular member 2 by the rotation of the second rotating member 4. Therefore, the rotation of the annular member 2 and the rotating body 41 can be synchronized, and the annular member 2 can rotate in the annular direction. Furthermore, the means of synchronizing the rotation of the annular member 2 and the rotating body 41 is not limited to the structure of providing protrusions 42 on the rotating body 41. For example, tension can be generated between the rotating body 41 and the annular member 2, and friction can be used to synchronize the rotation of the annular member 2 and the rotating body 41; other structures are also possible.

[0058] Furthermore, the rotating bodies 31 and 41 are not limited to the cylindrical shape shown in the figure. For example, the rotating bodies 31 and 41 can also be spheres with shafts, shapes formed by connecting multiple gears, polygonal prisms with shafts, or structures formed by connecting multiple cylinders. Moreover, the rotating components that cause the annular component 2 to rotate synchronously are not limited to the first rotating component 3 and the second rotating component 4 shown in the figure; depending on the application and the shape of the electroplated object 200, they can also be composed of three or more components. For example, as shown... Figure 5 As shown, when electroplating the object 200 with a concave portion, the addition of the third rotating member 11, which is composed of the third rotating member, enables a uniform electroplating film to be obtained in the concave portion.

[0059] The electroplating solution supply unit 7 is a device for supplying electroplating solution 70 to the electroplating solution impregnated cloth 1. Figure 1 The electroplating solution supply unit 7 shown is configured to supply electroplating solution 70 by dripping it onto the electroplating solution impregnation cloth 1. However, the electroplating solution supply unit 7 is not limited to the structure shown; it can supply electroplating solution 70 to the electroplating solution impregnation cloth 1, or it can be used in other ways. Furthermore, the electroplating electrode 100 may not necessarily require the electroplating solution supply unit 7. For example, a separate tank filled with electroplating solution 70 can be prepared, and the electroplating solution impregnation cloth 1 can be placed in this tank, allowing the electroplating solution to pre-impregnate the cloth 1.

[0060] like Figure 1 As shown, the electroplating solution impregnated cloth 1, the annular component 2, the first rotating component 3, the second rotating component 4, and the motor 6 are held by a holding device 8. Specifically, the rotation shaft 30 of the first rotating component 3 and the rotation shaft 40 of the second rotating component 4 are rotatably connected to the holding device 8, thereby holding the electroplating solution impregnated cloth 1 and the annular component 2 together with the holding device 8. In addition, one end of the rotation shaft 40 of the second rotating component 4 is connected to the holding device 8 via the motor 6.

[0061] Preferably, the retaining device 8 is configured to hold the electroplating electrode 100 via the outer sides of the first rotating member 3, the second rotating member 4, and the annular member 2. This is to avoid obstructing the rotation of the first rotating member 3, the second rotating member 4, and the motor 6. Furthermore, this is to avoid obstructing the conduction of the electroplating solution impregnated cloth 1, the annular member 2, and the first rotating member 3. Moreover, this is also to avoid interference with the rotation path of the electroplating solution impregnated cloth 1.

[0062] An operating mechanism, including an arm (not shown in the figure) of a robot, is connected to the holding device 8. The operating mechanism is configured to allow free movement of the electroplating electrode 100 via the holding device 8, and, for example, to adjust the contact pressure of the electroplating solution impregnated cloth 1 relative to the electroplated portion 200a. Alternatively, the operating mechanism may include a gripping part that allows manual operation by an operator. In this case, the gripping part is formed of an insulating material such as resin.

[0063] Next, the electroplating method using the aforementioned electroplating electrode will be described. The electroplating method is performed in the following order: degreasing, pickling, neutralization, and electroplating. Each step will be described in detail below. Additionally, as an example, a method for silver plating a highly versatile copper alloy material that is suitable for electroplating will be described.

[0064] <Degreasing process>

[0065] First, a copper alloy material to be processed into the desired shape is prepared as the electroplating object 200. Then, a degreasing agent is used to degrease the electroplating object 200. This removes surface contaminants such as organic matter from the surface of the electroplating object 200, ensuring wettability with liquids. Commercially available alkaline degreasing agents, such as sodium hydroxide-based or sodium carbonate-based degreasing agents, can be used as examples.

[0066] <Pickling Process>

[0067] Next, the workpiece 200 is pickled using a pickling agent. This removes surface contaminants such as inorganic foreign matter and oxide film from the surface of the copper alloy material. The pickling process exposes the active metal surface, thereby ensuring liquid wettability and ensuring a tight adhesion between the electroplated film formed in the subsequent electroplating process and the workpiece 200, which serves as the substrate. The pickling agent can be, for example, an etching solution diluted with nitric acid or sulfuric acid, or a commercially available pickling agent.

[0068] <Neutralization Process>

[0069] Next, the electroplated material 200 is neutralized using a neutralizing agent. This removes any residual acid from the surface of the copper alloy material and inhibits corrosion. Neutralizing agents such as cyanide-based sodium cyanide, diluted sodium hydroxide cleaning solutions, or commercially available neutralizing agents can be used.

[0070] <Electroplating process>

[0071] Next, the workpiece 200 is subjected to silver plating using a silver plating solution via electroplating. During the electroplating process, a silver film is formed on the electroplated portion 200a of the surface of the workpiece 200. As the silver plating method, cathodic electrolysis, a process typically performed in electroplating, is conducted.

[0072] In the silver electroplating method, the electroplating time, current density, and liquid temperature of the silver plating solution can be appropriately set. The electroplating time is the time during which the silver plating solution-impregnated cloth 1 comes into contact with the part to be electroplated 200a. For example, let the electroplating time be 30 seconds and the current density be 20 A / dm³. 2 Assuming the liquid temperature of the silver plating solution is 25°C, a silver film with a thickness of 5 μm is obtained. Furthermore, regarding the liquid temperature of the silver plating solution, around 25°C is considered an optimal temperature. When a silver film is formed at an inappropriate temperature, it may result in a decrease in the film formation rate, decomposition of the silver plating solution, the formation of defects in the silver film, or a rough silver film.

[0073] The silver plating solution used in the electroplating process is a conventionally known silver plating solution. Conventionally known silver plating solutions include, for example, those adjusting the pH to 7 using 1 wt% to 5 wt% silver ions, 30 wt% to 40 wt% potassium iodide, and 1 wt% to 5 wt% methanesulfonic acid as metal salts. Alternatively, silver plating solutions adjusted using 3 wt% to 15 wt% silver ions, 5 wt% to 15 wt% free cyanide, and 2 wt% to 7 wt% potassium carbonate as metal salts. Note that wt% refers to the value relative to the total adjusted solution.

[0074] In the electroplating process, firstly, the object to be electroplated 200 is fixed, and the electroplating electrode 100 is held in place using an operating mechanism (not shown) connected to the holding device 8. At this time, the electroplating electrode 100 is separated from the object to be electroplated 200.

[0075] Next, the contact pressure of the electroplating solution impregnated cloth 1 that contacts the electroplated portion 200a is set. The contact pressure is adjusted so that the thickness of the electroplated film formed on the electroplated portion 200a becomes the target film thickness. Preferably, the contact pressure is 0.25 kgf / cm². 2 ~2.0 kgf / cm 2 This is because, in silver-plated films, when the contact pressure is less than 0.25 kgf / cm², 2 Under certain conditions, burns can easily occur in the electroplated film, resulting in the inability to obtain a complete electroplated film. Furthermore, this is because when the contact pressure exceeds 2.0 kgf / cm², [further damage can occur]. 2In this case, the deposited electroplated film is worn by the electroplating solution-impregnated cloth 1, which hinders the growth of the electroplated film and makes it impossible to obtain the target electroplating thickness.

[0076] After setting the contact pressure between the electroplating electrode 100 and the workpiece 200, the motor 6 is driven to rotate the second rotating member 4. As a result, the electroplating solution impregnated cloth 1 can be rotated in the annular direction by the annular member 2, which rotates synchronously with the second rotating member 4 in the annular direction.

[0077] Next, while the electroplating solution impregnated cloth 1 is rotating, the DC power supply 5 is switched from the off state to the on state. After the DC power supply 5 is switched on, the holding device 8 is moved by operating the mechanism (not shown), causing the electroplating solution impregnated cloth 1 to contact the electroplated part 200a with a set contact pressure. Power is applied at the instant the electroplating solution impregnated cloth 1 contacts the electroplated part 200a. In this state, the electroplating solution impregnated cloth 1 is slid across the electroplated part 200a, thereby performing silver plating. The electroplating time is, for example, 30 seconds. The electroplating time is appropriately determined based on the desired electroplating film thickness.

[0078] Furthermore, the preferred sliding speed of the electroplating solution impregnated cloth 1 relative to the object to be electroplated 200 is in the range of 12.5 m / min to 17.5 m / min. This is because, in silver plating, when the sliding speed is less than 12.5 m / min, burns occur in the electroplating film, resulting in the inability to obtain a complete electroplating film. Moreover, when the sliding speed is greater than 17.5 m / min, abrasion increases between the deposited electroplating film and the electroplating solution impregnated cloth 1, hindering film growth and preventing the attainment of the desired plating thickness.

[0079] Furthermore, energizing can be performed while the electroplating solution impregnated cloth 1 is rotating, or the above sequence can be changed. For example, after the electroplating solution impregnated cloth 1 comes into contact with the part to be electroplated 200a, the electroplating solution impregnated cloth 1 can be rotated, and then the DC power supply 5 can be turned on to energize it. However, in cases such as silver plating of copper alloy materials, where the ionization tendency of the metal in the electroplated film is less than that of the object to be electroplated 200a, it is preferable to contact the electroplating solution impregnated cloth 1 with the part to be electroplated 200a after turning on the DC power supply 5. This is because when the electroplating solution impregnated cloth 1 comes into contact with the part to be electroplated 200a, a displacement electroplating film with weak adhesion is formed.

[0080] After a silver plating film is formed on the electroplated part 200a, such as Figure 4As shown, the operating mechanism (not illustrated) is used to move the electroplating electrode 100 using the holding device 8, separating the electroplating solution-impregnated cloth 1 from the object to be electroplated 200. Then, the object to be electroplated 200 is post-treated as needed, including a water washing process, thereby obtaining a silver-plated film 200b. Post-treatments include, for example, chemical conversion treatment with chromates or discoloration prevention treatment. In the electroplating solution, there may be substances that produce unwanted reaction products on the surface when in direct contact with water. In such cases, a post-treatment using a special liquid is performed to remove the electroplating solution before water washing after the electroplating process. Furthermore, various post-treatments are performed depending on the type of electroplating solution.

[0081] In addition, after each process is completed, a water washing process can be added, in which the electroplating solution impregnated cloth 1 is immersed in pure water and then dried. Through the water washing process, the deteriorated treatment solution contained in the electroplating solution impregnated cloth 1 can be removed.

[0082] Furthermore, the electroplating process is not limited to copper alloy materials. Also, the types of electroplating are not limited to silver plating. The aforementioned electroplating method can also be applied to the formation of multiple plating layers; for example, forming nickel plating on an aluminum alloy material to be electroplated, and then forming tin plating on the upper surface of the nickel plating.

[0083] Furthermore, in the aforementioned electroplating method, electrolytic treatment can also be applied in the degreasing process, pickling process, neutralization process, post-treatment after electroplating, and water washing process. For example, the electrolytic treatment applied in the degreasing process is electrolytic degreasing. In this case, the degreasing solution, which serves as the degreasing agent, is impregnated into the electroplating solution impregnated cloth 1, and the electroplating solution impregnated cloth 1 is brought into contact with the part to be electroplated 200a. In this state, the anode of the DC power supply 5 is connected to the rotation shaft 30 of the first rotating member 3, and the cathode of the DC power supply 5 is connected to the workpiece to be electroplated 200, so that the DC power supply 5 is turned on and energized, thereby enabling the application of cathodic electrolytic treatment in the degreasing process. On the other hand, the cathode of the DC power supply 5 is connected to the rotation shaft 30 of the first rotating member 3, and the anode of the DC power supply 5 is connected to the workpiece to be electroplated 200, so that the DC power supply 5 is turned on and energized, thereby enabling the application of anodic electrolytic treatment in the degreasing process. In addition, when electrolytic treatment is applied in a process other than electroplating, it is not necessary to slide the electroplating solution-impregnated cloth 1 on the electroplated part 200a.

[0084] Incidentally, in the above-described electroplating method, it is also possible to directly contact the electroplating solution-impregnated cloth 1 with the first rotating component 3 and the second rotating component 4 without using the annular component 2, causing the electroplating solution-impregnated cloth 1 to rotate and form an electroplated film 200b. However, in this case, the current density in the vicinity of the first rotating component 3, which acts as the anode in the electroplated part 200a, is significantly higher than in other parts, making it impossible to obtain a normal electroplated film, and the uniformity of the film thickness may also deteriorate. That is, by inserting the annular component 2, the current density distribution can be made more uniform, thereby improving the uniformity of the film thickness.

[0085] As described above, the electroplating electrode 100 of this embodiment 1 includes: an electroplating solution impregnated cloth 1, which is formed in a ring shape; and a conductive ring-shaped member 2, which is disposed inside the ring shape of the electroplating solution impregnated cloth 1 and is configured such that its outer surface is in close contact with the inner surface of the electroplating solution impregnated cloth 1. Furthermore, it includes: a first rotating member 3, which is disposed inside the ring-shaped member 2 and electrically connected to the ring-shaped member 2, and is capable of rotating while ensuring conductivity; and a second rotating member 4, which is disposed inside the ring-shaped member 2 and rotates synchronously with the drive of the motor 6. The anode of the DC power supply 5 is electrically connected to the first rotating member 3, and the cathode of the DC power supply 5 is electrically connected to the workpiece 200 to be electroplated. The ring-shaped member 2 is rotated synchronously with the rotation of the first rotating member 3 and the second rotating member 4, thereby causing the electroplating solution impregnated cloth 1 to rotate in the ring direction and slide in contact with the electroplated portion 200a of the workpiece 200 to be electroplated.

[0086] Therefore, according to the electroplating electrode 100 and electroplating method of this embodiment 1, the electroplating solution impregnated cloth 1, which is in close contact with the annular member 2 electrically connected to the anode of the DC power supply 5 via the first rotating member 3, slides while contacting the electroplated portion 200a of the workpiece 200, which is electrically connected to the cathode of the DC power supply 5. This allows an electroplating film to be formed only on the electroplated portion 200a in contact with the electroplating solution impregnated cloth 1. Consequently, there is no need for masking operations that use masking materials to protect portions other than the electroplated portion; an electroplating film can be selectively formed only on a portion of the surface of the workpiece 200.

[0087] The annular component 2 is mesh-like. The first rotating component 3 and the second rotating component 4 have protrusions 32 or 42 with a width smaller than the opening of the annular component 2. The protrusions 32 and 42 are inserted into the opening of the annular component 2 by the rotation of the first rotating component 3 and the second rotating component 4. As a result, frictional force can be generated between the annular component 2 and the first rotating component 3 and the second rotating component 4, and the annular component 2 can be rotated in the annular direction synchronously with the rotation of the first rotating component 3 and the second rotating component 4.

[0088] The electroplating solution impregnated cloth 1 has a folded-back portion 1a formed by folding the annular end edge inward. The folded-back portion 1a hooks onto the annular end edge of the annular member 2 and is fixed by the fixing member 20. As a result, the electroplating solution impregnated cloth 1 can be reliably and tightly fitted to the annular member 2.

[0089] The electroplating electrode 100 of this embodiment 1 also includes an electroplating solution supply unit 7, which is disposed on the rotation path of the electroplating solution impregnated cloth 1 and supplies electroplating solution 70 to the electroplating solution impregnated cloth 1. Therefore, in the electroplating electrode 100 and electroplating method of this embodiment 1, electroplating solution 70 can be supplied to the electroplating solution impregnated cloth 1 simultaneously with the electroplating process. Thus, insufficient electroplating solution 70 in the electroplating solution impregnated cloth 1 can be suppressed, and the quality reduction of the electroplated film can be prevented.

[0090] Next, refer to Figure 6 and Figure 7 A variation of the electroplating method of Embodiment 1 will be described. Figure 6 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1. Figure 6 In the electroplating method of Modified Example 1 shown, during the electroplating process described above, the movement of the holding device 8 that holds the electroplating electrode 100 is operated by the operating mechanism 80. The operating mechanism 80 is controlled based on the measurement value of the load measuring unit that measures the load on the electroplating electrode 100, so that the contact pressure of the electroplating solution impregnated cloth 1 that contacts the part to be electroplated 200a becomes a preset target contact pressure. The operating mechanism 80 is configured as an arm including a robot or the like, and is connected to the holding device 8. The operating mechanism 80 is controlled by a control device 81. The control device 81 is, for example, a computing device such as a microcomputer or CPU and software executed on the computing device. Alternatively, the control device 81 may also be configured as hardware such as circuit devices that implement its function. As an example, the load measuring unit 82 is preferably a force sensor, but other structures are also possible. The load measuring unit 82, which is composed of a force sensor, is assembled into the operating mechanism 80.

[0091] Figure 7This is a flowchart of a variation of the electroplating method of Embodiment 1. First, in step S101, the control device 81 drives the motor 6 to rotate the second rotating member 4, thereby causing the electroplating solution impregnated cloth 1 to rotate in the annular direction. Next, in step S102, the control device 81 controls the operating mechanism 80 to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the workpiece 200. Alternatively, energizing can be performed while the electroplating solution impregnated cloth 1 is rotating, and the order of steps S101 and S102 can be interchanged. That is, after controlling the operating mechanism 80 to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the workpiece 200, the motor 6 can be driven to rotate the electroplating solution impregnated cloth 1 in the annular direction.

[0092] Next, in step S103, the control device 81 determines whether the measured value measured by the load measuring unit 82 is below a preset lower limit. If the control device 81 determines that the measured value measured by the load measuring unit 82 is not below the preset lower limit, it proceeds to step S104, controlling the operating mechanism 80 to move the electroplating electrode 100 closer to the workpiece 200 and adjust the contact pressure. Then, the control device 81 returns to step S103 to determine whether the measured value measured by the load measuring unit 82 is below the preset lower limit.

[0093] If, in step S103, the control device 81 determines that the measured value obtained by the load measuring unit 82 is below a preset lower limit, it proceeds to step S105. In step S105, the control device 81 determines whether the measured value obtained by the load measuring unit 82 is above or above a preset upper limit. If the control device 81 determines that the measured value obtained by the load measuring unit 82 is not above or above the preset upper limit, it proceeds to step S106, controlling the operating mechanism 80 to move the electroplating electrode 100 away from the workpiece 200 and adjusting the contact pressure. Then, the control device 81 returns to step S105 to determine whether the measured value obtained by the load measuring unit 82 is above or above the preset upper limit.

[0094] If, in step S105, the control device 81 determines that the measured value obtained by the load measuring unit 82 is above the preset upper limit, it proceeds to step S107. In step S107, the control device 81 determines whether the electroplating time has exceeded the preset target time. If the control device 81 determines that the electroplating time has not exceeded the preset target time, it returns to step S103 to determine whether the measured value obtained by the load measuring unit 82 is below the preset lower limit. On the other hand, if the control device 81 determines in step S107 that the electroplating time has exceeded the preset target time, it proceeds to step S108, stopping the drive of the motor 6 and ending the rotation of the electroplating solution impregnation cloth 1.

[0095] Next, refer to Figure 8 and Figure 9 A variation of the electroplating method of Embodiment 1, Example 2, will be described. Figure 8 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1, Example 2. Figure 8 In the electroplating method of Modified Example 2 shown, during the electroplating process described above, the movement of the holding device 8 that holds the electroplating electrode 100 is operated by the operating mechanism 80. The operating mechanism 80 is controlled according to the measurement value of the load measuring unit 82 that measures the load on the electroplating electrode 100, so that the contact pressure of the electroplating solution impregnated cloth 1 that is in contact with the electroplated part 200a becomes a preset target contact pressure. At this time, based on the measurement value measured by the load measuring unit 82, the notification unit 83 notifies whether the contact pressure of the electroplating solution impregnated cloth 1 that is in contact with the electroplated part 200a is the preset target contact pressure.

[0096] In Modification 2, the operating mechanism 80 is configured to have a gripping part that allows for manual operation by the operator, and the gripping part is used to hold the retaining device 8. As an example, the load measuring unit 82 is preferably a load cell, but other structures are also possible. Based on the measured value from the load measuring unit 82, the control device 81 controls the notification unit 83. The notification unit 83 may be, for example, a light, a buzzer, or a vibrator. If the notification unit 83 is a light, notification is given by lighting or flashing the light. If the notification unit 83 is a buzzer, notification is given by a buzzing sound. If the notification unit 83 is a vibrator, notification is given by vibration. Alternatively, the notification unit 83 may also be configured to display the contact pressure numerically.

[0097] Figure 9 This is a flowchart of a variation of the electroplating method in Embodiment 1, Example 2. Additionally, in Figure 9The following describes the case where a lamp is used to construct the notification unit 83. First, in step S201, the motor 6 is driven to rotate the second rotating member 4, thereby causing the electroplating solution impregnated cloth 1 to rotate in the annular direction. Next, in step S202, the control device 81 controls the operating mechanism 80 to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the object to be electroplated 200. Alternatively, energizing can be performed while the electroplating solution impregnated cloth 1 is rotating, and the order of steps S201 and S202 can be interchanged. That is, after controlling the operating mechanism 80 to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the object to be electroplated 200, the motor 6 can be driven to rotate the electroplating solution impregnated cloth 1 in the annular direction.

[0098] Next, in step S203, the control device 81 determines whether the measured value measured by the load measuring unit 82 is below a preset lower limit. If the control device 81 determines that the measured value measured by the load measuring unit 82 is not below the preset lower limit, it proceeds to step S204 and causes the light in the notification unit 83 to flash to indicate that it is not the target contact pressure. Then, the control device 81 returns to step S203 again to determine whether the measured value measured by the load measuring unit 82 is below the preset lower limit.

[0099] If, in step S203, the control device 81 determines that the measured value measured by the load measuring unit 82 is below a preset lower limit, it proceeds to step S205. In step S205, the control device 81 determines whether the measured value measured by the load measuring unit 82 is above a preset upper limit. If the control device 81 determines that the measured value measured by the load measuring unit 82 is not above the preset upper limit, it proceeds to step S206, causing the light in the notification unit 83 to flash to indicate that the contact pressure is not the target. Then, the control device 81 returns to step S205 to determine whether the measured value measured by the load measuring unit 82 is above the preset upper limit.

[0100] If, in step S205, the control device 81 determines that the measured value obtained by the load measuring unit 82 is above a preset upper limit, it proceeds to step S207. In step S205, the control device 81 illuminates a lamp, which serves as a notification unit 83, to notify that the contact pressure of the electroplating electrode 100 in contact with the electroplated part 200a is the target contact pressure. Thus, the operator can know that the contact pressure of the electroplating solution impregnated cloth 1 in contact with the electroplated part 200a is the target contact pressure.

[0101] Next, the control device 81 proceeds to step S208 to determine whether the electroplating time has exceeded the preset target time. If the control device 81 determines that the electroplating time has not exceeded the preset target time, it returns to step S203 to determine whether the measured value measured by the load measuring unit 82 is below the preset lower limit. On the other hand, if the control device 81 determines in step S208 that the electroplating time has exceeded the preset target time, it proceeds to step S209 to stop the drive of the motor 6 and end the rotation of the electroplating solution impregnation cloth 1.

[0102] Furthermore, the notification unit 83 is not required. In this case, while confirming the measurement value of the load measuring unit 82, the operator operates the operating mechanism 80, and while confirming, brings the electroplating electrode 100 into contact with the part to be electroplated 200a to achieve an appropriate contact pressure.

[0103] Next, refer to Figure 10 and Figure 11 A variation of the electroplating method of Embodiment 1, Example 3, will be described. Figure 10 This is a block diagram of the structural elements used in a variation of the electroplating method of Embodiment 1, Example 3. Figure 10 In the electroplating electrode 100 of Modified Example 3 shown, during the electroplating process described above, the rotational speed of the motor 6 is measured by the rotational speed measuring unit 84. Based on the measured value from the rotational speed measuring unit 84, the motor 6 is controlled to achieve a preset target rotational speed. Then, the rotational speed of the second rotating component 4 is controlled to adjust the rotational speed of the electroplating solution impregnated cloth 1, so that the sliding speed of the electroplating solution impregnated cloth 1 relative to the object to be electroplated 200 remains constant. As an example, the rotational speed measuring unit 84 is preferably an encoder; however, other structures are also possible.

[0104] Figure 11 This is a flowchart of a variation of the electroplating method of Embodiment 1, Example 3. First, in step S301, the control device 81 drives the motor 6 to rotate the second rotating member 4, thereby causing the electroplating solution impregnation cloth 1 to rotate in the annular direction.

[0105] Next, in step S302, the operating mechanism 80 is controlled to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the object to be electroplated 200. The operating mechanism 80 can be configured as an arm such as a robot, or it can be configured to have a gripping part that allows for manual operation by an operator. Furthermore, energizing the electroplating solution impregnated cloth 1 while it is rotating is sufficient; the order of steps S301 and S302 can also be interchanged. That is, after controlling the operating mechanism 80 to bring the electroplating solution impregnated cloth 1 into contact with the electroplated portion 200a of the object to be electroplated 200, the motor 6 can be driven to rotate the electroplating solution impregnated cloth 1 in a circumferential direction.

[0106] Next, in step S303, the control device 81 determines whether the measured value obtained by the speed measuring unit 84 is below a preset lower limit. If the control device 81 determines that the measured value obtained by the speed measuring unit 84 is not below the preset lower limit, it proceeds to step S304, increasing the speed of the motor 6 to increase the sliding speed of the electroplating solution impregnated cloth 1 relative to the electroplated object 200. Then, the control device 81 returns to step S303 again to determine whether the measured value obtained by the speed measuring unit 84 is below the preset lower limit.

[0107] If, in step S303, the control device 81 determines that the measured value obtained by the speed measuring unit 84 is below a preset lower limit, it proceeds to step S305. In step S305, the control device 81 determines whether the measured value obtained by the speed measuring unit 84 is above or below a preset upper limit. If the control device 81 determines that the measured value obtained by the speed measuring unit 84 is not above or below the preset upper limit, it proceeds to step S306, reducing the speed of the motor 6 to decrease the sliding speed of the electroplating solution impregnated cloth 1 relative to the electroplated object 200. Then, the control device 81 returns to step S305 to determine whether the measured value obtained by the speed measuring unit 84 is above or below the preset upper limit. This ensures that the sliding speed of the electroplating solution impregnated cloth 1 relative to the electroplated object 200 is kept constant, thus preventing a decrease in electroplating quality due to changes in sliding speed.

[0108] If, in step S305, the control device 81 determines that the measured value obtained by the speed measuring unit 84 is above the preset upper limit, it proceeds to step S307. In step S307, the control device 81 determines whether the electroplating time has exceeded the preset target time. If the control device 81 determines that the electroplating time has not exceeded the preset target time, it returns to step S303 to determine whether the measured value obtained by the speed measuring unit 84 is below the preset lower limit. On the other hand, if the control device 81 determines in step S307 that the electroplating time has exceeded the preset target time, it proceeds to step S308, stopping the drive of the motor 6 and ending the rotation of the electroplating solution impregnation cloth 1.

[0109] Implementation Method 2

[0110] Next, refer to Figures 1 to 11 and according to Figures 12-20 The electroplating electrode 101 of this embodiment 2 and the electroplating method using the electroplating electrode 101 will be described. Figure 12 This is an explanatory diagram schematically showing the main parts of the electroplating electrode of Embodiment 2. Figure 13 It is a schematic representation of from Figure 12The diagram illustrates the state in which the electroplating electrode moves and the electroplating solution permeates the cloth and comes into contact with the object being electroplated. Figure 14 It is a schematic representation of from Figure 12 The diagram shows a state in which all the first movable contact members are movable, and the electroplating solution-impregnated cloth is in contact with the object being electroplated. Furthermore, structural elements identical to those in Embodiment 1 are labeled with the same reference numerals, and their descriptions are omitted where appropriate.

[0111] Figure 12 The electroplating electrode 101 of Embodiment 2 is characterized in that it is capable of forming multiple patterns of localized electroplating using only one electroplating electrode 101. The electroplating electrode 101 of Embodiment 2, based on the structure of Embodiment 1, includes a movable contact assembly 9 and a tension adjustment member 10. Furthermore, the electroplating solution impregnated cloth 1, the annular member 2, the first rotating member 3, the second rotating member 4, the DC power supply 5, the motor 6, the electroplating solution supply unit 7, and the holding device 8 are the same structures as in Embodiment 1.

[0112] The movable contact assembly 9 and the tension adjusting member 10 are disposed together with the first rotating member 3 and the second rotating member 4 inside the annular member 2. The movable contact assembly 9 is configured to have a plurality of first movable contacts 9a, which are cylindrical in shape, arranged side by side along the annular direction of the annular member 2. In the illustrated example, the movable contact assembly 9 is composed of an assembly of five first movable contacts 9a. The first movable contacts 9a are formed of a material that is insoluble in the electroplating solution used or is difficult to dissolve in the electroplating solution used. As an example, the first movable contacts 9a are formed of platinum (Pt), titanium-platinum (Ti-Pt), titanium-iridium oxide (Ti-IrO2), stainless steel (SUS), carbon (C), etc.

[0113] The first movable contact 9a is held in a movable position by the holding device 8, for example. The first movable contact 9a can move towards the object to be electroplated 200 from inside the annular member 2. The movement of the first movable contact 9a is controlled by a control unit (not shown). By moving the first movable contact 9a, the electroplating solution impregnated cloth 1 can be pressed onto the object to be electroplated 200a through the annular member 2. The movable contact assembly 9 can move all of the first movable contacts 9a or only a portion of the first movable contacts 9a.

[0114] Furthermore, the movable contact assembly 9 is not limited to an assembly of five first movable contact elements 9a; it can be configured to have one or more first movable contact elements 9a. The number of first movable contact elements 9a can be arbitrarily changed depending on the application and the shape of the object to be electroplated 200. Moreover, the first movable contact element 9a is not limited to the cylindrical shape shown in the figure; any shape that does not hinder the rotation of the annular member 2 and the electroplating solution impregnated cloth 1 is acceptable. For example, the first movable contact element 9a can be constructed from a cylinder, semi-cylinder, prism, or thin plate with a smooth surface, or a columnar or spherical body with a mechanism for rotating around an axis. Furthermore, the first movable contact element 9a can also be shaped to follow the shape of the part to be electroplated 200a. By adopting this shape, the tightness of the fit between the electroplating solution impregnated cloth 1 and the part to be electroplated 200a can be improved during electroplating.

[0115] The tension adjusting element 10 is provided to maintain a constant tension between the electroplating solution impregnated cloth 1 and the annular component 2. The tension adjusting element 10 is formed of a material that is insoluble in the electroplating solution or is difficult to dissolve in the solution. For example, the tension adjusting element 10 is formed of platinum (Pt), titanium-platinum (Ti-Pt), titanium-iridium oxide (Ti-IrO2), stainless steel (SUS), carbon (C), etc.

[0116] The tension adjusting member 10 is cylindrical in shape and has a mechanism for rotating around a shaft. The tension adjusting member 10 is disposed inside the annular member 2 with its outer surface in contact with the inner surface of the annular member 2. The tension adjusting member 10 does not impede the rotation of the annular member 2 and the electroplating solution impregnated cloth 1, and can be made of a cylinder, semi-cylinder, prism, or thin plate with a smooth surface. Furthermore, the number of tension adjusting members 10 is not limited to the one shown in the figure, and can be arbitrarily changed according to the application and the shape of the object to be electroplated 200.

[0117] The tension adjusting member 10 is held in a movable position by the holding device 8, for example. The movement of the tension adjusting member 10 is controlled by a control unit (not shown). When the first movable contact member 9a is moved, the tension adjusting member 10 moves together with the first movable contact member 9a, thereby maintaining a constant tension between the electroplating solution impregnated cloth 1 and the annular member 2. Thus, when the first movable contact member 9a moves, excessive tension generated in the electroplating solution impregnated cloth 1 and the annular member 2 can be suppressed, preventing damage to the electroplating solution impregnated cloth 1 and the annular member 2. Alternatively, the tension adjusting member 10 is not mandatory; it can also be configured to move either or both of the first rotating member 3 and the second rotating member 4, thereby maintaining a constant tension between the electroplating solution impregnated cloth 1 and the annular member 2.

[0118] Alternatively, the first movable contact 9a can be configured to move from the inside to the outside of the annular member 2 through the annular opening of the annular member 2. When a portion of the first movable contact 9a is not needed, the unwanted first movable contact 9a can be removed so as not to obstruct other first movable contacts 9a. Furthermore, when the annular member 2 is not used, the tension adjusting member 10 can be in direct contact with the electroplating solution impregnated cloth 1.

[0119] Next, the electroplating method using the electroplating electrode 101 of Embodiment 2 will be described. Similar to Embodiment 1, the electroplating method of Embodiment 2 is performed in the order of degreasing, pickling, neutralization, and electroplating. Furthermore, as an example, a method for silver plating a copper alloy material, which is highly versatile and suitable for electroplating, will be described.

[0120] The degreasing, pickling, neutralization, post-treatment after electroplating, and rinsing processes are the same as in Embodiment 1. Furthermore, the conditions related to the silver plating solution, current density, electroplating time, and rotation of the electroplating solution-impregnated cloth 1 during electroplating are also the same as in Embodiment 1.

[0121] In the electroplating electrode 101 of this embodiment 2, such as Figure 13 As shown, without the movable contact assembly 9 contacting the electroplating solution impregnated cloth 1, the operating mechanism (not shown) is operated to bring the electroplating solution impregnated cloth 1 into contact with the electroplated part 200a. Thus, local electroplating treatment can be performed in the same way as in Embodiment 1.

[0122] On the other hand, in the electroplating electrode 101 of this embodiment 2, such as Figure 14 As shown, when the electroplating solution-impregnated cloth 1 comes into contact with the part to be electroplated 200a, the movable contact assembly 9 is moved, thereby changing the contact range and contact position. Specifically, in the electroplating electrode 101, the first movable contact 9a is moved to contact the inner surface of the annular member 2, causing a portion of the electroplating solution-impregnated cloth 1 to protrude toward the part to be electroplated 200a together with the annular member 2. Figure 14 The diagram shows the situation after all five first movable contact members 9a have been moved. Only the protruding portion of the electroplating solution-impregnated cloth 1 comes into contact with the electroplated portion 200a, thereby reducing the area of ​​the formed electroplated film.

[0123] Figure 15 It is a schematic representation of from Figure 12 The diagram illustrates a state in which a portion of the first movable contact element is movable, and the electroplating solution-impregnated cloth is in contact with the object to be electroplated. In the electroplating electrode 101, as... Figure 15As shown, by moving only a portion of the first movable contact member 9a, the area of ​​the protruding portion of the electroplating solution impregnated cloth 1 can be reduced, thereby reducing the contact area of ​​the electroplating solution impregnated cloth 1 with the electroplated part 200a. Figure 15 The image shows the situation after moving the three first movable contacts 9a, which are positioned in the middle, out of the five first movable contacts 9a arranged side by side.

[0124] Figure 16 It is a schematic representation of from Figure 12 The diagram illustrates a state in which a portion of the first movable contact element is movable, and the electroplating solution-impregnated cloth is in contact with the object to be electroplated. In the electroplating electrode 101, as... Figure 16 As shown, by modifying the movable first movable contact member 9a, the position of the protruding portion of the electroplating solution impregnated cloth 1 is changed, thereby changing the contact position of the electroplating solution impregnated cloth 1 in contact with the electroplated part 200a. Figure 16 The diagram shows the configuration where two of the five adjacent first movable contact members 9a, located at the left end, are movable. Furthermore, the location and number of movable first movable contact members 9a are not limited to... Figure 15 and Figure 16 The structure shown may be appropriately modified depending on the application and the shape of the object to be electroplated 200.

[0125] Figure 17 It is a schematic representation of from Figure 12 The diagram shows the state in which the first movable contact is movable and the electroplating solution-impregnated cloth contacts the curved surface of the object being electroplated. Figure 18 It is a schematic representation of from Figure 12 The diagram illustrates the state in which the first movable contact element is movable, and the electroplating solution-impregnated cloth contacts the convex surface of the object being electroplated. (See diagram for reference.) Figure 17 As shown, when the electroplated portion 200a is a curved surface, the movable contact assembly 9 is movable along the curved surface, thereby allowing the electroplating solution-impregnated cloth 1 to contact a portion of the curved surface. Furthermore, as... Figure 18 As shown, when the electroplated part 200a is a convex surface, the movable contact assembly 9 is moved along the convex surface, thereby enabling the electroplating solution impregnated cloth 1 to contact a portion of the convex surface.

[0126] The first movable contact 9a is configured to adjust the contact pressure between the electroplating solution impregnated cloth 1 and the electroplated portion 200a. The contact pressure is adjusted, for example, by a control unit. This allows the thickness of the electroplated film formed on the electroplated portion 200a to reach the target thickness. A preferred contact pressure is 0.25 kgf / cm². 2 ~2.0 kgf / cm 2 .

[0127] In the electroplating electrode 101, with the electroplating solution impregnated cloth 1 in contact with the electroplated part 200a, the electroplating solution impregnated cloth 1 is rotated and energized, thereby forming a silver plating film on the electroplated part 200a. Similar to Embodiment 1, it is preferable that the sliding speed of the electroplating solution impregnated cloth 1 relative to the electroplated object 200 is in the range of 12.5 m / min to 17.5 m / min.

[0128] After a silver-plated film is formed on the electroplated part 200a, the movable contact assembly 9 is moved to separate the electroplating solution-impregnated cloth 1 from the electroplated object 200. Then, the electroplated object 200 is post-treated as needed, and a water washing process is performed, thereby forming a silver-plated film.

[0129] Furthermore, in the electroplating electrode 101, the anode of the DC power supply 5 is electrically connected to the movable contact assembly 9, thereby reducing the resistance during energization and ensuring reliable conduction between the anode and cathode. The movable contact assembly 9 can be, for example, a rotary connector that electrically connects the rotating shaft and surrounding rotating parts to the anode of the DC power supply 5. The rotary connector can be, for example, a commercially available connector that utilizes a carbon brush, mercury / gallium alloy, or roller current collector to ensure conductivity between the rotating shaft and surrounding rotating parts.

[0130] Furthermore, the electroplating process is not limited to copper alloy materials. Also, the type of electroplating is not limited to silver plating. The above-described electroplating method can also be applied to the formation of multiple plating layers; for example, forming nickel plating on an aluminum alloy material to be electroplated, and then forming tin plating on the upper surface of the nickel plating. Furthermore, while the electroplating electrode 101 is primarily used in the electroplating process, it can also be used in degreasing, pickling, and neutralization processes. Moreover, the electroplating electrode 101 can also be used in the water washing process performed between the various steps of the electroplating method.

[0131] As described above, the electroplating electrode 101 of this embodiment 2 has: one or more first movable contact members 9a, which are disposed inside the annular member 2 and press the electroplating solution impregnated cloth 1 onto the electroplated object 200 through the annular member 2; and one or more tension adjusting members 10, which are movably disposed inside the annular member 2 to keep the tension of the electroplating solution impregnated cloth 1 and the annular member 2 constant.

[0132] Therefore, the electroplating electrode 101 of this embodiment 2 and the electroplating method using the electroplating electrode 101 can freely change the range and position of the electroplating solution impregnation cloth 1 that contacts the electroplated part 200a, and can handle multiple local electroplating patterns.

[0133] Figure 19 This is an explanatory diagram schematically showing a modified example of the electroplating electrode of Embodiment 2. Figure 20 It is a schematic representation of from Figure 19The diagram shows a state in which a portion of the first movable contact is movable, and the electroplating solution-impregnated cloth comes into contact with the object being electroplated. Figure 19 The electroplating electrode 101 of this embodiment 2 is characterized by the following structure: a second movable contact 9b is provided on the outer side of the annular shape of the electroplating solution impregnated cloth 1, and this second movable contact 9b presses the electroplating solution impregnated cloth 1 towards the inner side of the annulus. The second movable contact 9b has the same structure as the first movable contact 9a disposed on the inner side of the annular member 2. The second movable contact 9b is disposed between the movable contact group 9 and the electroplated portion 200a. Figure 19 The image shows a second movable contact 9b positioned opposite the center of the five first movable contact 9a arranged side-by-side. Furthermore, the second movable contact 9b can be positioned as follows: Figure 19 The image shows one instance, but you can also set two or more.

[0134] exist Figure 19 In the electroplating electrode 101 shown, as Figure 20 As shown, the first movable contact 9a at both ends of the five first movable contact 9a arranged side by side is movable and contacts the inner side of the annular member 2, causing a portion of the electroplating solution impregnated cloth 1 to protrude. The electroplating solution impregnated cloth 1 located between the movable first movable contact 9a is pressed towards the inner side of the annular member 2 by the second movable contact 9b, preventing contact with the object to be electroplated 200. That is, in Figure 19 In the electroplating electrode 101 shown, only the portion protruding from the first movable contact 9a, positioned with the second movable contact 9b sandwiched in the middle, can contact the portion to be electroplated 200a. Therefore, an electroplating film can be formed simultaneously on multiple portions 200a. Thus, when an electroplating film is formed on multiple portions of the electroplated object 200, Figure 19 The electroplating electrode 101 shown can be handled by one electroplating electrode 101. Therefore, it is not necessary to prepare multiple electroplating electrodes, which can save space and eliminate the process of replacing electroplating electrodes 100, thereby improving productivity.

[0135] Implementation Method 3

[0136] Next, refer to Figures 1 to 11 and according to Figure 21 and Figure 22 The electroplating electrode 102 of this embodiment 3 and the electroplating method using the electroplating electrode 102 will be described. Figure 21 This is an explanatory diagram schematically showing the electroplating electrode of Embodiment 3. Figure 22 yes Figure 21 The view shown is along line A. Additionally, structural elements identical to those in Embodiment 1 are labeled with the same reference numerals, and their descriptions are omitted where appropriate.

[0137] like Figure 21 As shown, the electroplating electrode 102 in this embodiment 3 is configured as an electroplating tank 71 filled with electroplating solution 70 as an electroplating solution supply unit 7. In addition, the electroplating solution impregnated cloth 1, the annular member 2, the first rotating member 3, the second rotating member 4, the DC power supply 5, the motor 6, and the holding device 8 are the same structures as in embodiment 1.

[0138] The electroplating tank 71 is positioned along the path of the rotating electroplating solution impregnated cloth 1. In the electroplating electrode 102 of this embodiment 3, electroplating solution 70 is supplied to the rotating electroplating solution impregnated cloth 1 through the electroplating tank 71 while electroplating is being performed. A third rotating member 11 is disposed inside the electroplating tank 71. The third rotating member 11 has the same structure as the second rotating member 4. As an example, the third rotating member 11 is held by a holding device 8. The third rotating member 11 is disposed inside the annular member 2, and the outer surface of the rotating body is in contact with the inner surface of the annular member 2.

[0139] Furthermore, in the electroplating electrode 102 of this embodiment 3, pressure adjusting members 12 and 13 are provided between the first rotating member 3 and the third rotating member 11, and between the second rotating member 4 and the third rotating member 11, along the path of rotation of the electroplating solution impregnated cloth 1. As an example, pressure adjusting members 12 and 13 are held by a holding device 8. Pressure adjusting members 12 and 13 adjust the pressure and apply it to the rotating electroplating solution impregnated cloth 1 and the annular member 2. The pressure adjusting member 12, located between the first rotating member 3 and the third rotating member 11, is disposed inside the annular member 2 and applies pressure towards the outer side of the annulus. The pressure adjusting member 13, located between the second rotating member 4 and the third rotating member 11, is disposed on the outer side of the annulus of the electroplating solution impregnated cloth 1 and applies pressure towards the inner side of the annulus. Therefore, tension can be applied to the electroplating solution impregnated cloth 1, enabling efficient electroplating. Furthermore, when the holding device 8 is moved using the operating mechanism (not shown in the figure), it can cope with changes in the tension of the electroplating solution impregnated cloth 1 and prevent damage to the electroplating solution impregnated cloth 1 due to excessive tension.

[0140] The operating mechanism is configured to adjust the contact pressure between the electroplating solution impregnated cloth 1 and the electroplated portion 200a. This allows the thickness of the electroplated film formed on the electroplated portion 200a to reach the target thickness. A preferred contact pressure is, for example, 0.25 kgf / cm². 2 ~2.0 kgf / cm 2 .

[0141] In the electroplating electrode 102 of this embodiment 3, such as Figure 21 and Figure 22As shown, the electroplating solution impregnating cloth 1 is rotated, and after the DC power supply 5 is turned on, the electroplating solution impregnating cloth 1 comes into contact with the part to be electroplated 200a. This allows the electroplating solution 70 to be supplied to the electroplating solution impregnating cloth 1 while a silver plating film is formed. Preferably, the sliding speed of the electroplating solution impregnating cloth 1 relative to the part to be electroplated 200 is in the range of 12.5 m / min to 17.5 m / min.

[0142] As described above, according to the electroplating electrode 102 of Embodiment 3 and the electroplating method using the electroplating electrode 102, electroplating is performed while the electroplating solution 70 is supplied to the electroplating solution impregnated cloth 1. Therefore, there is no need to additionally immerse the electroplating solution impregnated cloth 1 in the electroplating solution 70, which improves productivity. In addition, a large amount of electroplating solution 70 can be supplied to the electroplating solution impregnated cloth 1, thus preventing electroplating defects such as burns caused by insufficient electroplating solution. Furthermore, the electroplating electrode 102 of Embodiment 3 and the electroplating method using the electroplating electrode 102 can utilize the structure of Embodiment 2 described above.

[0143] Implementation Method 4

[0144] Next, refer to Figures 1 to 11 and according to Figure 23 The electroplating electrode 100 of this embodiment 4 and the electroplating method using the electroplating electrode 100 will be described. Figure 23 This is a schematic perspective view of the electroplating electrode according to Embodiment 4. Figure 23 in, omit Figure 1 The DC power supply 5 and the electroplating solution supply unit 7 are shown. Furthermore... Figure 23 The hollow arrow c shown indicates the rotation of the electroplating electrode 100. Furthermore, Figure 23 The hollow arrow d shown indicates the direction of movement of the electroplating electrode 100. Furthermore, structural elements identical to those in Embodiment 1 are labeled with the same reference numerals, and their descriptions are omitted where appropriate.

[0145] The electroplating electrode 100 used in the electroplating method of Embodiment 4 has the same structure as the electroplating electrode 100 described in Embodiment 1. Figure 23 As shown, when an electroplated film 200b needs to be formed in a region A larger than the area of ​​the electroplated portion 200a in contact with the electroplating solution impregnated cloth 1, the electroplating method of Embodiment 4 is implemented. Furthermore, in the electroplating method of Embodiment 4, as in Embodiment 1, a degreasing process, an acid pickling process, a neutralization process, a post-treatment after the electroplating process, and a water washing process are also performed. Moreover, the electroplating solution used in the electroplating treatment is the same as in Embodiment 1.

[0146] In the electroplating electrode 100, the holding device 8 is moved by operating the operating mechanism (not shown), bringing the rotating electroplating solution impregnated cloth 1 into contact with the part to be electroplated 200a. Electrification begins the instant the electroplating solution impregnated cloth 1 contacts the part to be electroplated 200a. In this state, the operating mechanism is operated along the region A where the electroplating film 200b is to be formed, causing the electroplating solution impregnated cloth 1 to move. This allows the formation of an electroplating film 200b with an area larger than the area of ​​the part to be electroplated 200a in contact with the electroplating solution impregnated cloth 1.

[0147] The preferred sliding speed of the electroplating solution impregnated cloth 1 relative to the object to be electroplated 200 is in the range of 12.5 m / min to 17.5 m / min. The electroplating time is calculated and set based on the current density, the target film thickness, the contact area between the electroplating solution impregnated cloth 1 and the object to be electroplated 200, and the area A of the region where the electroplated film 200b is to be formed. Specifically, it is set using the following formula (1).

[0148] t=(TvCdS) / (IsA)……(1)

[0149] Here, t is the electroplating time, T is the target film thickness, v is the atomic valence of the electroplated metal ions, C is the Faraday constant, d is the density of the electroplated metal, S is the area A of the region where the electroplated film 200b is to be formed, I is the current density, s is the area of ​​the electroplating solution impregnated cloth 1 in contact with the object to be electroplated 200, and A is the atomic weight of the electroplated metal. Furthermore, the current density is obtained by dividing the current flowing when a voltage is applied by the area of ​​the electroplating solution impregnated cloth 1 in contact with the object to be electroplated 200.

[0150] In the electroplating method of Embodiment 4, when the electroplating solution impregnated cloth 1 is moved along region A by operating the operating mechanism, the sliding speed of the electroplating solution impregnated cloth 1 relative to the workpiece 200 changes at the start of rotation of the electroplating solution impregnated cloth 1 and when the direction of the electroplating solution impregnated cloth 1 changes. The sliding speed of the electroplating solution impregnated cloth 1 has a significant impact on the quality of electroplating. Changes in the sliding speed may lead to a decrease in the quality of electroplating.

[0151] Therefore, by varying the moving speed of the electroplating electrode 100 due to the operation of the operating mechanism, the rotational speed of the motor 6 is changed, thereby changing the rotational speed of the electroplating solution impregnation cloth 1. As a result, the sliding speed of the electroplating solution impregnation cloth 1 relative to the object to be electroplated 200 can be kept constant, thus stabilizing the electroplating quality. For example, by controlling the rotational speed of the electroplating solution impregnation cloth 1 by increasing it by 1 m / min when the moving speed of the electroplating electrode decreases by 1 m / min, a decrease in sliding speed can be prevented. Furthermore, by rotating the electroplating electrode 100 using the operating mechanism with the direction perpendicular to the region A where the electroplating film 200b is to be formed as the axis, the sliding direction of the electroplating solution impregnation cloth 1 can be changed. In this way, by changing the sliding direction of the electroplating electrode 100 at regular intervals, the anisotropy of the electroplating film caused by the sliding direction can be reduced, and deviations in the quality of the electroplating film can be suppressed.

[0152] After an electroplated film is formed on the electroplated part 200a, the operating mechanism is operated to move the holding device 8, separating the electroplating solution-impregnated cloth 1 from the electroplated object 200. Then, the electroplated object 200 is post-treated as needed, and after a water washing process, a silver-plated film 200b can be obtained.

[0153] Furthermore, the region A where it is desired to form the electroplated film 200b is not limited to... Figure 23 The rectangle shown can also be other shapes such as a circle. Furthermore, by operating the operating mechanism, the direction of movement of the electroplating electrode 100 can be changed, thus enabling it to be applied not only to a single plane, but also to a region spanning multiple planes and curved surfaces.

[0154] Furthermore, this embodiment 4 can utilize the structure of embodiment 3 described above. In this case, the electroplating tank 71, which is disposed on the path of the electroplating solution impregnated cloth 1, also moves in conjunction with the electroplating electrode 100, thereby preventing changes in tension and damage to the electroplating solution impregnated cloth 1.

[0155] As described above, according to the electroplating electrode 100 and electroplating method of this embodiment 4, when an electroplating film 200b needs to be formed in a region A larger than the area of ​​the electroplated portion 200a in contact with the electroplating solution impregnated cloth 1, it is possible to use only one electroplating electrode 100. Therefore, it is not necessary to prepare multiple electroplating electrodes, which saves space and eliminates the need for replacing the electroplating electrode 100, thereby improving productivity.

[0156] Furthermore, by controlling the rotation speed of the second rotating component 4 to adjust the rotation speed of the electroplating solution impregnated cloth 1, the sliding speed of the electroplating solution impregnated cloth 1 relative to the object to be electroplated 200 is kept constant. Therefore, it is possible to prevent the reduction in electroplating quality caused by changes in sliding speed.

[0157] Implementation Method 5

[0158] Next, according to Figures 24-27 The electroplating electrode 103 of this embodiment 5 and the electroplating method using the electroplating electrode 103 will be described. Figure 24 This is an explanatory diagram schematically showing the electroplating electrode of Embodiment 5. Figure 25 This is an explanatory diagram schematically showing a modified example 1 of the electroplating electrode of Embodiment 5. Figure 26 This is an explanatory diagram schematically showing a modified example 2 of the electroplating electrode of Embodiment 5. Figure 27 This is an explanatory diagram schematically showing a modified example 3 of the electroplating electrode of Embodiment 5. Furthermore, structural elements identical to those in Embodiments 1-4 are labeled with the same reference numerals, and their descriptions are omitted where appropriate.

[0159] like Figure 24 As shown, in this embodiment 5, the electroplating solution impregnated cloth 1 of the electroplating electrode 103 is configured such that the surface in contact with the electroplated portion 200a of the work to be electroplated 200 faces upward. The work to be electroplated 200 is positioned directly above the electroplating solution impregnated cloth 1. The electroplated portion 200a of the work to be electroplated 200 is positioned downward opposite the electroplating solution impregnated cloth 1. Furthermore, the electroplating solution impregnated cloth 1, the annular member 2, the first rotating member 3, the second rotating member 4, the DC power supply 5, the motor 6, and the third rotating member 11 have the same structure as in embodiments 1 to 4. The electroplating solution supply unit 7 is configured to have an electroplating tank 71 filled with electroplating solution 70. The electroplating tank 71 is positioned along the path of rotation of the electroplating solution impregnated cloth 1 and is positioned below the work to be electroplated 200. In the electroplating electrode 103 of this embodiment 5, electroplating solution 70 is supplied to the rotating electroplating solution impregnated cloth 1 through the electroplating tank 71 while electroplating is being performed. A third rotating member 11 is disposed inside the electroplating tank 71. The third rotating member 11 has the same structure as the second rotating member 4. The third rotating member 11 is disposed inside the annular member 2, and the outer surface of the rotating body is in contact with the inner surface of the annular member 2.

[0160] Figure 25 The electroplating electrode 103 shown has an electroplating solution impregnated cloth 1 arranged such that the surface in contact with the electroplated portion 200a of the workpiece 200 faces horizontally. The electroplated portion 200a of the workpiece 200 is arranged horizontally opposite the electroplating solution impregnated cloth 1. Furthermore, the electroplating electrode 103 of Embodiment 5 is not limited to... Figure 24 and Figure 25 The structure shown. The electroplating solution impregnated cloth 1 can also be configured such that the surface in contact with the electroplated portion 200a of the object to be electroplated 200 is inclined relative to the horizontal direction. As an example, the inclination angle is 45 degrees relative to the horizontal direction. The electroplating electrode 103 is arranged in various directions corresponding to the shape of the object to be electroplated 200 or the structure of the device using the electroplating electrode 103.

[0161] exist Figure 26 In the electroplating electrode 103 shown, a liquid splash prevention wall 72 is provided around the electroplating bath 71, covering the periphery of the electroplating solution impregnated cloth 1. The liquid splash prevention wall 72 is disposed in the electroplating bath 71 from the wall portion along the surface of the electroplating solution impregnated cloth 1. The liquid splash prevention wall 72 is provided to catch the electroplating solution splashed during the electroplating process and return the caught electroplating solution 70 to the electroplating bath 71. The liquid splash prevention wall 72 can be made of materials with excellent chemical resistance, heat resistance to withstand the electroplating process temperature, and no electroplating precipitation, such as resin or stainless steel.

[0162] exist Figure 27 In the electroplating method shown, according to Figure 24 The electroplating electrode 103 is fixed in a predetermined position, and the workpiece 200 to be electroplated is moved using an operating mechanism, bringing the electroplated portion 200a into contact with the electroplating solution-impregnated cloth 1. The operating mechanism can be configured as an arm such as a robot, or it can be configured as a gripper capable of manual operation by an operator. Figure 27 In the electroplating method shown, the workpiece 200 to be electroplated is transported to the electroplating solution impregnated cloth 1 before treatment, so that the workpiece 200 comes into contact with the electroplating solution impregnated cloth 1 for electroplating treatment. After electroplating treatment, the workpiece 200 is transported to the next process. This series of electroplating processes is carried out solely by the equipment used to transport the workpiece 200.

[0163] exist Figures 24-27 In the operating mechanism of the electroplating electrode 103 of this embodiment 5, it is configured to adjust the contact pressure between the electroplating solution impregnation cloth 1 and the electroplated portion 200a. This allows the thickness of the electroplated film formed on the electroplated portion 200a to reach a target thickness. A preferred contact pressure is, for example, 0.25 kgf / cm². 2 ~2.0 kgf / cm 2 .

[0164] In addition, Figures 24-27 In the electroplating electrode 103 of this embodiment 5, after rotating the electroplating solution impregnation cloth 1 and turning on the DC power supply 5, the electroplating solution impregnation cloth 1 comes into contact with the part to be electroplated 200a. This allows electroplating solution 70 to be supplied to the electroplating solution impregnation cloth 1 while an electroplating film is formed. Preferably, the sliding speed of the electroplating solution impregnation cloth 1 relative to the object to be electroplated 200 is in the range of 12.5 m / min to 17.5 m / min.

[0165] As described above, according to the electroplating electrode 103 of this embodiment 5 and the electroplating method using the electroplating electrode 103, electroplating can be performed while the electroplating solution 70 is supplied to the electroplating solution impregnated cloth 1. Therefore, there is no need to set up a complicated step of supplying the electroplating solution 70 to the electroplating solution impregnated cloth 1, and a large amount of electroplating solution 70 can be supplied to the electroplating solution impregnated cloth 1, preventing electroplating defects such as burns caused by insufficient electroplating solution 70. In addition, the detachment of the electroplating solution 70 adhering to the workpiece 200 can be promoted by gravity, so the amount of electroplating solution 70 carried to the next process can be reduced. Furthermore, since the electroplating tank 71 is located below the electroplating electrode 103, the recovery of the detached electroplating solution 70 is easy, and the loss of electroplating solution 70 can be minimized. Furthermore, in Figure 27 In the electroplating method shown, the workpiece 200 is moved by an operating mechanism. Therefore, it is not necessary to set up an operating mechanism that matches the structure of the electroplating electrode 103, which simplifies the overall equipment.

[0166] Furthermore, the electroplating electrode 103 of Embodiment 5 and the electroplating method using the electroplating electrode 103 can utilize the structures of Embodiments 1 to 4 described above. For example, when... Figure 27 When the electroplating method shown is applied to the structure of Embodiment 4, the operating mechanism is operated to move the workpiece 200 to be electroplated, bringing the rotating electroplating solution impregnated cloth 1 into contact with the part to be electroplated 200a. Electricity is applied at the instant the electroplating solution impregnated cloth 1 contacts the part to be electroplated 200a. In this state, the operating mechanism is operated to move the part to be electroplated 200a along the region A where the electroplating solution impregnated cloth 1 is to be formed, thereby forming an electroplating film 200b with an area larger than the area of ​​the part to be electroplated 200a in contact with the electroplating solution impregnated cloth 1.

[0167] The electroplating electrodes (100, 101, 102, 103) and the electroplating method using the electroplating electrodes (100, 101, 102, 103) have been described above according to embodiments. However, the electroplating electrodes (100, 101, 102, 103) are not limited to the structures of the embodiments described above. For example, the electroplating electrodes (100, 101, 102, 103) illustrated are one example, and other structural elements may also be included. In summary, the electroplating electrodes (100, 101, 102, 103) encompass the range of design changes and application variations commonly made by those skilled in the art without departing from their technical concept.

[0168] Label Explanation

[0169] 1: Electroplating solution impregnated cloth; 1a: Fold-back section; 2: Annular component; 2a: End edge; 3: First rotating component; 4: Second rotating component; 5: DC power supply; 5a, 5b: Wires; 6: Motor; 7: Electroplating solution supply unit; 8: Holding device; 9: Movable contact assembly; 9a: First movable contact; 9b: Second movable contact; 10: Tension adjustment component; 11: Third rotating component; 12, 13: Pressure adjustment component; 20: Fixing component; 30 31: Rotating shaft; 32: Protrusion; 40: Rotating shaft; 41: Rotating body; 42: Protrusion; 70: Electroplating solution; 71: Electroplating tank; 72: Liquid splash prevention wall; 80: Operating mechanism; 81: Control device; 82: Load measuring unit; 83: Notification unit; 84: Speed ​​measuring unit; 100, 101, 102, 103: Electroplating electrodes; 200: Electroplated object; 200a: Electroplated part; 200b: Electroplated film.

Claims

1. An electroplating electrode for forming an electroplated film on an object to be electroplated, wherein, The electroplating electrode has the following characteristics: The electroplating solution impregnates the cloth, forming a ring shape; A conductive ring-shaped component is disposed inside the ring of the electroplating solution impregnated cloth and is configured such that its outer surface is in close contact with the inner surface of the electroplating solution impregnated cloth. A first rotating component, disposed inside the annular component and electrically connected to the annular component, is capable of rotating while ensuring conductivity; and The second rotating component is located inside the annular component and rotates synchronously with the drive of the motor. The first rotating component is electrically connected to the anode of a DC power supply, and the workpiece to be electroplated is electrically connected to the cathode of the DC power supply. The annular component rotates synchronously with the rotation of the first and second rotating components, thereby causing the electroplating solution-impregnated cloth to rotate in the annular direction and slide in contact with the electroplated portion of the object to be electroplated. The annular component is a mesh. The first rotating component and the second rotating component have protrusions with a width smaller than the opening of the annular component. The protrusion is inserted into the orifice of the annular component by the rotation of the first rotating component and the second rotating component.

2. The electroplating electrode according to claim 1, wherein, The electroplating solution impregnated cloth has a folded-back portion formed by folding the annular end edge inward. The folding part hooks onto the annular end edge of the annular component and is fixed by the fixing component.

3. The electroplating electrode according to claim 1, wherein, The electroplating electrode also has an electroplating solution supply unit, which is arranged on the rotation path of the electroplating solution impregnated cloth to supply electroplating solution to the electroplating solution impregnated cloth.

4. The electroplating electrode according to claim 2, wherein, The electroplating electrode also has an electroplating solution supply unit, which is arranged on the rotation path of the electroplating solution impregnated cloth to supply electroplating solution to the electroplating solution impregnated cloth.

5. The electroplating electrode according to claim 3, wherein, The electroplating solution supply unit is configured to supply electroplating solution by dripping it onto the electroplating solution impregnation cloth.

6. The electroplating electrode according to claim 4, wherein, The electroplating solution supply unit is configured to supply electroplating solution by dripping it onto the electroplating solution impregnation cloth.

7. The electroplating electrode according to any one of claims 1 to 6, wherein, The electroplating electrode also has: One or more first movable contacts are disposed inside the annular member, pressing the electroplating solution-impregnated cloth onto the object to be electroplated through the annular member; and One or more tension adjustment components are movably disposed inside the annular component to keep the tension of the electroplating solution impregnated cloth and the annular component constant.

8. The electroplating electrode according to claim 7, wherein, The electroplating electrode also has a second movable contact, which is disposed on the outside of the electroplating solution impregnated cloth and presses the electroplating solution impregnated cloth toward the annular inner side.

9. The electroplating electrode according to any one of claims 1 to 6, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object faces upward.

10. The electroplating electrode according to claim 7, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object faces upward.

11. The electroplating electrode according to claim 8, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object faces upward.

12. The electroplating electrode according to any one of claims 1 to 6, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object is oriented in a horizontal direction, or is configured such that the surface in contact with the electroplated portion of the object is inclined relative to the horizontal direction.

13. The electroplating electrode according to claim 7, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object is oriented in a horizontal direction, or is configured such that the surface in contact with the electroplated portion of the object is inclined relative to the horizontal direction.

14. The electroplating electrode according to claim 8, wherein, The electroplating solution impregnated cloth is configured such that the surface in contact with the electroplated portion of the object is oriented in a horizontal direction, or is configured such that the surface in contact with the electroplated portion of the object is inclined relative to the horizontal direction.

15. An electroplating method using the electroplating electrode according to any one of claims 1 to 14, wherein, While the electroplating solution is permeated into the electroplating solution impregnation cloth, the electroplating solution impregnation cloth is rotated, and a DC power supply is applied to make the electroplating solution impregnation cloth slide in contact with the electroplated part of the object to be electroplated, thereby performing the electroplating treatment.

16. The electroplating method according to claim 15, wherein, The first movable contact member is made movable, so that a portion of the electroplating solution impregnated cloth comes into contact with the part to be electroplated. At the same time, the tension adjustment member is moved to apply tension to the electroplating solution impregnated cloth. In this state, the electroplating solution impregnated cloth slides in contact with the part to be electroplated of the object.

17. The electroplating method according to claim 15, wherein, The electroplating electrode is moved by the operating mechanism, so that the electroplating solution-impregnated cloth comes into contact with the part to be electroplated.

18. The electroplating method according to claim 16, wherein, The electroplating electrode is moved by the operating mechanism, so that the electroplating solution-impregnated cloth comes into contact with the part to be electroplated.

19. The electroplating method according to claim 15, wherein, The object to be electroplated is moved using an operating mechanism, so that the part to be electroplated comes into contact with the cloth impregnated with the electroplating solution.

20. The electroplating method according to claim 16, wherein, The object to be electroplated is moved using an operating mechanism, so that the part to be electroplated comes into contact with the cloth impregnated with the electroplating solution.

21. The electroplating method according to claim 17, wherein, The operating mechanism is controlled based on the load measurement unit that measures the load on the electroplating electrode or the object to be electroplated, so that the contact pressure between the electroplated part and the electroplating solution impregnated cloth becomes a preset target contact pressure.

22. The electroplating method according to claim 18, wherein, The operating mechanism is controlled based on the load measurement unit that measures the load on the electroplating electrode or the object to be electroplated, so that the contact pressure between the electroplated part and the electroplating solution impregnated cloth becomes a preset target contact pressure.

23. The electroplating method according to claim 19, wherein, The operating mechanism is controlled based on the load measurement unit that measures the load on the electroplating electrode or the object to be electroplated, so that the contact pressure between the electroplated part and the electroplating solution impregnated cloth becomes a preset target contact pressure.

24. The electroplating method according to claim 20, wherein, The operating mechanism is controlled based on the load measurement unit that measures the load on the electroplating electrode or the object to be electroplated, so that the contact pressure between the electroplated part and the electroplating solution impregnated cloth becomes a preset target contact pressure.

25. The electroplating method according to claim 21, wherein, Based on the measured value obtained by the load measuring unit, the notification unit notifies whether the contact pressure between the electroplated part and the electroplating solution impregnated cloth is the preset target contact pressure.

26. The electroplating method according to claim 22, wherein, Based on the measured value obtained by the load measuring unit, the notification unit notifies whether the contact pressure between the electroplated part and the electroplating solution impregnated cloth is the preset target contact pressure.

27. The electroplating method according to claim 23, wherein, Based on the measured value obtained by the load measuring unit, the notification unit notifies whether the contact pressure between the electroplated part and the electroplating solution impregnated cloth is the preset target contact pressure.

28. The electroplating method according to claim 24, wherein, Based on the measured value obtained by the load measuring unit, the notification unit notifies whether the contact pressure between the electroplated part and the electroplating solution impregnated cloth is the preset target contact pressure.

29. The electroplating method according to any one of claims 15 to 28, wherein, When the area of ​​the electroplated part is larger than the area of ​​the electroplated object in contact with the electroplating solution-impregnated cloth, While the electroplating solution-impregnated cloth is moved relative to the electroplated part in such a way that it is impregnated along the part to be electroplated, the electroplating process is performed by sliding the electroplating solution-impregnated cloth in contact with the electroplated part of the object.

30. The electroplating method according to claim 29, wherein, Electroplating is performed while the sliding direction of the electroplating solution-impregnated cloth relative to the object being electroplated is changed at regular intervals.

31. The electroplating method according to any one of claims 15 to 28, wherein, The rotational speed of the second rotating component is controlled to adjust the rotational speed of the electroplating solution impregnated cloth, so that the sliding speed of the electroplating solution impregnated cloth relative to the object being electroplated is constant.

32. The electroplating method according to claim 29, wherein, The rotational speed of the second rotating component is controlled to adjust the rotational speed of the electroplating solution impregnated cloth, so that the sliding speed of the electroplating solution impregnated cloth relative to the object being electroplated is constant.

33. The electroplating method according to claim 30, wherein, The rotational speed of the second rotating component is controlled to adjust the rotational speed of the electroplating solution impregnated cloth, so that the sliding speed of the electroplating solution impregnated cloth relative to the object being electroplated is constant.

34. The electroplating method according to claim 31, wherein, The motor speed is measured by a speed measurement unit. Based on the measured value from the speed measuring unit, the motor is controlled to reach a preset target speed, thereby controlling the speed of the second rotating component.

35. The electroplating method according to claim 32, wherein, The motor speed is measured by a speed measurement unit. Based on the measured value from the speed measuring unit, the motor is controlled to reach a preset target speed, thereby controlling the speed of the second rotating component.

36. The electroplating method according to claim 33, wherein, The motor speed is measured by a speed measurement unit. Based on the measured value from the speed measuring unit, the motor is controlled to reach a preset target speed, thereby controlling the speed of the second rotating component.

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