Presser foot replacement system, processing equipment and presser foot replacement method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-27
- Publication Date
- 2026-08-14
AI Technical Summary
[0007]1、人工更换需要弯腰低头,上半生探入机器内部,存在安全风险;
Smart Images

Figure CN117140025B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of processing equipment technology, and in particular to a presser foot replacement system, processing equipment, and a presser foot replacement method thereof. Background Technology
[0002] This patent relates to a chip suction hood module for PCB drilling equipment. Drilling accuracy is a key parameter for evaluating a drilling machine. In actual processing, the spindle holds the drill bit to drill the required small holes in the board material. The board material consists of multiple layers, with the top layer being a 0.2mm aluminum sheet. This sheet prevents scratches during board handling and also prevents shavings from forming on the copper-clad laminate during drilling, while also providing heat dissipation. This aluminum sheet is bonded to the copper-clad laminate around the perimeter with tape, while the middle part relies solely on gravity for adhesion. Therefore, during drilling, the chip suction hood's pressure feet need to hold the aluminum sheet in place for precise drilling positioning, effectively improving drilling accuracy.
[0003] The drill bit consists of a drill bit and rubber pellets. The diameter of the drill bit is between 0.1mm and 6.5mm, which is a large range. When drilling holes of different diameters, the drill bit needs to be changed frequently. Therefore, a limit is set and two different sizes of pressure feet are designed for use as pressure plates when drilling large holes and small holes, respectively.
[0004] During the chip removal process, the presser foot of the chip suction hood will wear down continuously and need to be replaced in time after reaching a certain level. When manufacturing some high-precision sheets, regardless of whether the wear of the presser foot has reached the replacement standard, a new presser foot needs to be replaced to ensure machining accuracy.
[0005] Currently, the presser foot is replaced once a week, and a manual replacement method is used.
[0006] The current problems with presser foot replacement include:
[0007] 1. Manual replacement requires bending over and reaching the upper body into the machine, which poses a safety risk;
[0008] 2. Manual replacement lacks inspection methods and relies entirely on the skills and experience of each operator, making it impossible to standardize the pressure applied.
[0009] 3. Manual installation is time-consuming, requiring each shaft to be replaced individually;
[0010] 4. The presser feet may have been installed incorrectly;
[0011] 5. The cylindrical pressure foot relies on the sealing ring to ensure a firm assembly, which makes installation relatively difficult. The sealing ring has deformation and rebound, making it easy to misinstall. Summary of the Invention
[0012] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a presser foot replacement system that improves presser foot replacement efficiency, enhances presser foot assembly quality, and reduces safety risks for operators.
[0013] The present invention also proposes a processing device having the above-mentioned presser foot replacement system.
[0014] The present invention also proposes a method for replacing the presser foot of the above-mentioned processing equipment.
[0015] 1. A presser foot changing system according to a first aspect of the present invention, applied to a PCB processing equipment, comprising: the PCB processing equipment including a Z-axis, the Z-axis being configured to move along a first direction;
[0016] A pressure foot switching assembly is mounted on the bottom end of the Z-axis and is configured to move along a second direction. At least one pressure foot is mounted on the pressure foot switching assembly.
[0017] A material changing assembly, the material changing assembly including a base, the base being respectively provided with a material unloading position and a material loading position;
[0018] The unloading position is configured to remove and store the pressure foot on the pressure foot switching assembly;
[0019] The loading position is configured to store unused presser feet, and the presser feet are mounted on the presser foot switching assembly.
[0020] The presser foot replacement system of the present invention can be used to replace worn presser feet on processing equipment. It boasts a high degree of automation, avoiding the poor assembly stability and low consistency issues associated with manual presser foot replacement, thus improving presser foot replacement efficiency. Furthermore, unlike existing presser foot replacement operations that require the operator to extend their body into the machine and perform disassembly directly below the Z-axis, this system reduces operator safety risks. The presser foot replacement system also features a simple structure, low cost, and can be easily adapted from older PCB processing equipment by modifying a few machined parts. Additionally, the presser foot switching assembly can accommodate more than one presser foot, making it compatible with presser feet of different sizes and highly versatile.
[0021] Furthermore, the unloading position is provided with a disassembly assembly, which fixes the pressure foot so that the pressure foot can be disengaged from a Z-axis;
[0022] The disassembly assembly includes a baffle and a storage box. The baffle is mounted on the storage box and cooperates with the pressure foot switching assembly. When the Z-axis moves away from the baffle in a first direction, the baffle can lock the pressure foot on the Z-axis, causing the pressure foot to fall into the storage box.
[0023] Furthermore, the material changing assembly also includes a tool inspection station, which is disposed on the base and is equipped with a tool detection mechanism.
[0024] Furthermore, the baffle is recessed inward to form a latch with a certain tilt angle, the latch being configured to fit tightly with the presser foot and lock the presser foot in place.
[0025] Furthermore, the feeding position is provided with a feeding component, which fixes the presser foot so that the presser foot is mounted to a Z-axis. The feeding component is provided with a positioning boss, which fixes the presser foot so that the presser foot is mounted to the Z-axis.
[0026] Furthermore, the positioning boss includes a large boss and a small boss, the small boss is disposed on the large boss, the outer circle of the large boss is used for positioning the large-sized presser foot, and the outer circle of the small boss is used for positioning the small-sized presser foot.
[0027] Furthermore, a pressure foot detection component is also installed on the Z-axis. The pressure foot detection component moves along the Z-direction with the Z-axis and is configured to detect whether the pressure foot switching component is equipped with a pressure foot.
[0028] Furthermore, a sealing ring is provided on the outer periphery of one end of the pressure foot, and the pressure foot is tightly fitted with the mounting hole of the pressure foot switching assembly through the sealing ring.
[0029] Furthermore, the presser foot switching assembly includes a presser foot mounting plate, on which a driver is disposed. The driver is mounted on the Z-axis and is configured to drive the presser foot mounting plate to move along a second direction.
[0030] The processing apparatus according to a second aspect of the present invention includes:
[0031] A worktable; a machining mechanism, the machining mechanism being movable relative to the worktable, the machining mechanism including a Z-axis and a detachable chip suction cover disposed on the Z-axis, the chip suction cover having a pressure foot detachably mounted thereon;
[0032] A presser foot replacement system is provided on the worktable for replacing the presser foot. According to the processing equipment of the present invention, by setting the presser foot replacement system of the above embodiment, the automation level of presser foot replacement is improved, avoiding the defects of poor assembly stability and low consistency caused by manual presser foot replacement, and the replacement efficiency of presser foot can be improved. In addition, compared with the existing presser foot replacement operation which requires the operator to put their body into the machine and perform the disassembly operation directly below the Z-axis, the safety of the operator can be improved.
[0033] A method for changing the pressure foot of a processing apparatus according to a third aspect of the present invention, used in a processing apparatus according to a second aspect of the present invention, the method for changing the pressure foot includes the following steps:
[0034] Step S1: Determine whether the pressure foot is installed on the Z-axis;
[0035] Step S2: If it is determined that there is a pressure foot on the Z-axis, control the Z-axis to move to the unloading position;
[0036] The Z-axis is controlled to drive the presser foot to the unloading position, and the disassembly assembly fixes the presser foot to cooperate with the Z-axis to remove the presser foot; the presser foot is detected as to whether it has been disassembled.
[0037] If it is determined that there is no presser foot on the Z-axis, control the Z-axis to move to the loading position;
[0038] The Z-axis is controlled to drive the presser foot to the loading position, and the presser foot to be installed is positioned and installed by the loading assembly; the installation of the presser foot is then checked to see if it is successfully installed.
[0039] According to the method for replacing the presser foot of the processing equipment of the present invention, when replacing the presser foot of the processing equipment, the presser foot can be replaced in time after wear occurs, so as to ensure the fixing effect of the presser foot on the workpiece during the processing. Furthermore, the presser foot replacement is highly automated, enabling rapid disassembly of the presser foot, rapid multi-axis synchronous installation of the presser foot, and detection of whether the new presser foot is installed in place.
[0040] Furthermore, the disassembly assembly secures the pressure foot to facilitate Z-axis removal of the pressure foot, including:
[0041] Control the Z-axis to move horizontally to the initial descent position, which is located directly above the unloading position;
[0042] Control the Z-axis to descend along the first direction to a first position; that is, the first position is when the curved surface of the pressure foot mounting plate is flush with the bayonet.
[0043] The Z-axis is controlled to move along the X direction to a second position; the second position is where the bayonet locks the outer circle of the pressure foot.
[0044] Control the Z-axis to rise in a first direction, so that the pressure foot disengages from the Z-axis.
[0045] This application uses a bayonet-type baffle to press and hold the outer circumference of the presser foot. At this time, the chip suction cover is lifted, allowing for quick removal of the presser foot. This application's removal method is highly versatile, unaffected by the thickness and size of the presser foot, and also highly efficient.
[0046] Furthermore, the positioning and installation of the pressure foot to be installed by the feeding assembly includes:
[0047] Control the Z-axis to move horizontally to the initial loading position, which is located directly above the loading position; the positioning boss is concentric with the pressure foot;
[0048] Control the Z-axis to descend along the first direction to a first height; that is, the first height is when the curved surface of the presser foot mounting plate is flush with the upper end surface of the presser foot; repeat the pressing action multiple times to press the sealing ring on the presser foot into the mounting hole of the presser foot mounting plate;
[0049] Controlling Z-axis point pressure: Control the Z-axis to move in the second direction to the point pressure position, control the Z-axis to descend a second height along the first direction and then rise a second height, so that the point pressure position of the presser foot presses against the small boss; repeat the point pressure action multiple times;
[0050] Controlling Z-axis repressurization: Controlling the Z-axis to move horizontally to the initial loading position, and controlling the Z-axis to descend along the first direction to the first height.
[0051] This application uses a method of applying pressure around the presser foot while simultaneously applying negative pressure to accurately simulate manual installation, ensuring that the presser foot is installed in place and greatly improving the success rate of presser foot installation.
[0052] Further, step S also includes: Step S: Detecting whether the pressure foot is in a certain state; if the pressure foot is a large-sized pressure foot, the control driver drives the large mounting hole of the pressure foot mounting plate to be directly above the large-sized pressure foot; if the pressure foot is a small-sized pressure foot, the control driver drives the small mounting hole of the pressure foot mounting plate to be directly above the large-sized pressure foot. Further, 15. Step S1: Determining whether the pressure foot is installed on the Z-axis also includes:
[0053] Control the Z-axis to move the dust collection cover to the first position, and then control the Z-axis to continue moving to the second position. If the dust collection cover can trigger the pressure foot detection component on the Z-axis, it means that the pressure foot has been installed on the dust collection cover; otherwise, it means that the installation has failed.
[0054] This application uses a presser foot detection component to determine whether the chip suction hood cylinder should be compressed at a corresponding height to trigger a photoelectric sensor, thereby determining whether the corresponding presser foot is installed at this time.
[0055] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0056] Figure 1 This is a structural schematic diagram of the presser foot replacement system according to this application;
[0057] Figure 2 This is a structural cross-sectional view of the feeding assembly according to this application;
[0058] Figure 3 This is a schematic diagram of the feeding assembly according to this application. Figure 1 ;
[0059] Figure 4 This is a schematic diagram of the feeding assembly according to this application. Figure 2 ;
[0060] Figure 5 This is a schematic diagram of the disassembly assembly according to this application. Figure 1 ;
[0061] Figure 6 This is a schematic diagram of the disassembly assembly according to this application. Figure 2 ;
[0062] Figure 7 This is a schematic diagram of the structure of the baffle according to this application;
[0063] Figure 8 This is a structural schematic diagram of the dust collection hood according to this application;
[0064] Figure 9 This is a schematic diagram of the position of the pressure foot according to this application;
[0065] Figure 10 This is a structural schematic diagram of the Z-axis according to this application;
[0066] Figure 11 This is a structural schematic diagram of the processing equipment according to this application;
[0067] Figure 12 This is a schematic diagram of the location of the presser foot replacement system according to this application;
[0068] Figure 13 This is a schematic diagram of the testing process for the small presser foot according to this application;
[0069] Figure 14 This is a schematic diagram of the testing process for the large presser foot according to this application.
[0070] Figure label:
[0071] 1. Processing equipment; 2. Presser foot changing system; 3. Base; 4. Z-axis; 5. Chip suction hood; 6. Material changing assembly; 7. Unloading position; 8. Presser foot switching assembly; 9. Loading position; 10. Disassembly assembly; 11. Baffle; 12. Storage box; 13. Tool inspection position; 14. Positioning boss; 15. Bayonet; 16. Loading assembly; 17. Large boss; 18. Small boss; 19. Presser foot detection assembly; 20. Presser foot mounting plate; 21. Driver; 22. Photoelectric sensor; 23. Induction bracket; 24. Spindle clamp; 25. Slide; 26. Slide plate; 27. Mounting hole; 28. Shoulder; 29. Point pressing position; 30. Grating ruler; 31. Worktable; 32. Presser foot; 33. Large presser foot; 34. Small presser foot. Detailed Implementation
[0072] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0073] In this application, the first direction, the second direction, and the third direction are all perpendicular to each other;
[0074] refer to Figure 1-12 A presser foot replacement system 2 according to an embodiment of the first aspect of the present invention is described.
[0075] refer to Figure 1 , Figures 10-12 According to the first aspect of the present invention, the presser foot replacement system 2 can be used in PCB processing equipment 1. The processing equipment 1 can be a product in the PCB processing field, such as a drilling machine, milling machine, or drilling and milling machine for processing PCB boards.
[0076] PCB processing equipment 1 includes a Z-axis 4 configured to move along a first direction; a presser foot switching assembly 8 mounted at the bottom of the Z-axis 4 and configured to move along a second direction, with at least one presser foot 32 mounted on the presser foot switching assembly 8; and a material changing assembly 6 including a base 3, on which an unloading position 7 and a loading position 9 are respectively provided; the unloading position 7 is configured to remove and store the presser foot 32 on the presser foot switching assembly 8; and the loading position 9 is configured to store unused presser feet 32 and mount the presser feet 32 on the presser foot switching assembly 8.
[0077] The PCB processing equipment 1 in this application also includes a driver 21, which is used to drive the Z-axis 4 to move along the second direction;
[0078] Specifically, the Z-axis 4 section includes a base plate, a guide rail, a driver 21, a spindle clamp 24, and a spindle. The guide rail is mounted on the base plate, and the spindle clamp 24 is guided and engaged with the guide rail. The driver 21 is fixed to the base plate and is connected to the spindle clamp 24, driving the spindle clamp 24 and its associated components to move up and down along the guide rail. The spindle is mounted on the spindle clamp 24 and moves up and down in sync with the clamp's movement. When drilling into a PCB (circuit board), the drill bit is mounted on the spindle, and the driver 21 controls the spindle clamp 24 to move downwards. The spindle synchronously drives the drill bit downwards, and the drill bit, driven by the spindle's rotation, drills into the PCB.
[0079] Because the drill bit generates a lot of debris and dust when drilling at high speed, a chip suction hood 5 is also installed on the Z-axis 4 section to prevent environmental pollution caused by these debris and dust. The chip suction hood 5 is installed on the spindle clamp 24 through the mounting structure and can be connected to the suction system. The debris and dust generated during drilling can be sucked away by the suction system to prevent pollution.
[0080] When the spindle clamp 24 moves downwards, the chip suction cover 5 contacts the PCB before the drill bit. To ensure the drill bit is perpendicular to the PCB when it contacts the PCB, the chip suction cover 5 has a pressure foot 32. The chip suction cover 5 presses the PCB firmly with the pressure foot 32, thus preventing the drill bit from being misaligned or even breaking due to non-perpendicularity. When the spindle clamp 24 moves upwards, the drill bit can separate from the PCB before the chip suction cover 5, preventing the drill bit from scratching the PCB during subsequent movement. Thus, during drilling, the spindle clamp 24 moves downwards, and the pressure foot 32 of the chip suction cover 5 contacts the PCB first. The spindle clamp 24 then moves downwards a certain distance before the drill bit tip contacts the PCB. After drilling is completed, the spindle clamp 24 moves upwards, and the drill bit tip moves to a certain distance from the PCB surface before the pressure foot 32 of the chip suction cover 5 separates from the PCB. The chip suction cover 5 needs to be mounted on the spindle frame via a guide rod.
[0081] Furthermore, a presser foot switching assembly 8 is installed on the slag suction hood 5. The presser foot switching assembly 8 is configured to move along the second direction. At least one presser foot 32 is installed on the presser foot switching assembly 8. Specifically, the presser foot switching assembly 8 includes a sliding device and the main body of the slag suction hood 5. The presser foot mounting plate 20 and the drive mechanism are disposed on the main body of the slag suction hood 5. The presser foot mounting plate 20 includes a slide 25 and a slide plate 26. The slide plate 26 is disposed on the slide 25, and one end of the slide plate 26 is connected to the driver 21. The slide plate 26 is provided with mounting holes 27 for placing presser feet 32 of different sizes. In this embodiment, the linear motion device is a cylinder.
[0082] In this embodiment, the presser foot changing system 2 includes a material changing assembly 6, which includes a base 3, a loading position 9, and a unloading position 7. The loading position 9 and the unloading position 7 are mounted on the base 3 and are fixedly located on the base 3 to position the presser foot 32 at the material changing position. That is, through the movement of the Z-axis 4, the Z-axis 4 can be moved to a position directly above the presser foot 32 at the unloading position 7 for separation of the Z-axis 4 and the presser foot 32, or the Z-axis 4 can be moved to a position directly above the presser foot 32 at the loading position 9 for installation and fixation. The drive unit can be connected to the loading position 9 and the unloading position 7 via a snap-fit connection.
[0083] In other embodiments, the presser foot changing system 2 includes a material changing assembly 6, which includes a base 3, a loading position 9, and a unloading position 7. The loading position 9 and the unloading position 7 are mounted on the base 3 and are movably disposed on the base 3 to position the presser foot 32 at the material changing position. That is, through the movement of the base 3, the unloading position 7 can be moved to a position directly below the presser foot 32 on the Z-axis 4 to facilitate the separation of the Z-axis 4 and the presser foot 32, or the loading position 9 can be moved to a position directly below the presser foot 32 on the Z-axis 4 to facilitate the installation and fixation of the Z-axis 4 and the presser foot 32. The drive unit can be connected to the loading position 9 and the unloading position 7 via a transmission, so that the drive unit can move the loading position 9 and the unloading position 7 to fix or release the presser foot 32.
[0084] In this embodiment: (combined) Figure 1 , Figure 5-7 , Figure 10Specifically: A chip suction hood 5 is installed on the Z-axis 4 of the drilling machine, and a pressure foot 32 is mounted on the chip suction hood 5. The Z-axis 4 can drive the chip suction hood 5 to move together. The drilling machine is equipped with a pressure foot changing system 2, which includes a material changing assembly 6. The material changing assembly 6 includes a base 3, a loading position 9, and a unloading position 7. The loading position 9 and the unloading position 7 can be connected to each other or set up independently. Specifically, depending on the actual situation of the drilling machine, multiple loading positions 9 and unloading positions 7 can be set on the drilling machine. The unloading position 7 is equipped with a disassembly assembly 10. The presser foot 32 on the Z-axis 4 can move to a position directly above the disassembly assembly 10. The disassembly assembly 10 fixes the presser foot 32 so that it can be disengaged from the Z-axis 4. The disassembly assembly 10 includes a baffle 11 and a storage box 12. The baffle 11 is mounted on the storage box 12 and engages with the presser foot switching assembly 8. When the Z-axis 4 moves away from the baffle 11 in a first direction, the baffle 11 can lock the presser foot 32 on the Z-axis 4, causing the presser foot 32 to fall into the storage box 12. Specifically, when the Z-axis 4 moves away from the baffle 11 in a first direction, the baffle 11 can engage with the presser foot 32 of the chip suction hood 5 along the height direction of the presser foot changing system 2 to disassemble the presser foot 32. The baffle 11 limits the pressure foot 32 and holds it on the storage box 12, thereby disengaging the pressure foot 32 from the Z-axis 4 and completing the disassembly process of the pressure foot 32 on the Z-axis 4. The disassembled pressure foot 32 will be temporarily stored in the storage box 12, which has a certain capacity to hold the pressure foot 32 temporarily removed from behind the chip suction hood 5.
[0085] Referring to the figure, the loading position 9 is equipped with a loading assembly 16, which fixes the pressure foot 32 so that the pressure foot 32 is installed on a Z-axis 4. The loading assembly 16 is provided with a positioning boss 14, which fixes the pressure foot 32 so that the pressure foot 32 is installed on the Z-axis 4. When the Z-axis 4 moves towards the positioning boss 14, the positioning boss 14 can cooperate with the pressure foot 32 of the dust suction hood 5 along the height direction of the dust suction hood 5. The top of the positioning boss 14 abuts against the pressure foot 32. As the Z-axis 4 continues to move, the outer circle of the positioning boss 14 will limit the pressure foot 32, keeping the pressure foot 32 on the positioning boss 14. As the Z-axis 4 continues to move, the pressure foot 32 is fixed to the mounting hole 27 of the dust suction hood 5, completing the installation process of the pressure foot 32 on the Z-axis 4. After installation, the pressure foot 32 will disengage from the positioning boss 14 under the movement of the Z-axis 4.
[0086] This application utilizes the unloading position 7 and loading position 9 of the material changing assembly 6 to install or remove the presser foot 32 on the Z-axis 4. The presser foot 32 is detached from the Z-axis 4 by the baffle 11 on the disassembly assembly 10 in conjunction with the movement of the Z-axis 4; the presser foot 32 is installed on the Z-axis 4 by the positioning boss 14 on the loading assembly 16 in conjunction with the movement of the Z-axis 4. By setting two material changing positions, the unloading position 7 and the loading position 9, the disassembly and installation of the presser foot 32 can be separated, making the replacement of the presser foot 32 more orderly and easier to control. It also facilitates placing the presser foot 32 to be installed in the loading position 9 while disassembling the presser foot 32, thereby improving the efficiency of presser foot 32 replacement.
[0087] Simultaneously, after Z-axis 4 completes the unloading of the old presser foot 32, Z-axis 4 can continue to move to the loading position 9, where unused presser feet 32 are stored. Z-axis 4 can then engage with the unused presser feet 32, allowing them to be installed on Z-axis 4, thus completing the replacement of the presser feet 32. By setting up the presser foot replacement system 2 on the drilling machine, the need for labor is reduced, which not only improves the accuracy and efficiency of presser foot 32 replacement but also helps to enhance the level of automation.
[0088] Meanwhile, using the pressure foot replacement system 2 helps increase the frequency of pressure foot 32 replacement on the Z-axis 4, reducing the possibility of excessive wear on the pressure foot 32, and thus reducing the likelihood of poor chip removal during circuit board processing by the drilling machine. Furthermore, it reduces the failure rate of the drilling machine, which is beneficial for improving the processing efficiency and production quality of the circuit boards.
[0089] Meanwhile, the presser foot changing system 2 can replace presser feet 32 of different sizes as needed via the presser foot switching component 8. It can be used to replace worn presser feet 32 on the processing equipment 1. It has a high degree of automation, avoiding the defects of poor assembly stability and low consistency caused by manual presser foot 32 replacement, and can improve the replacement efficiency of presser foot 32. In addition, compared with the existing operation of replacing presser foot 32, which requires the operator to put their body into the machine and perform the disassembly operation directly under the Z-axis 4, it can improve the safety of the operator.
[0090] Optionally, combined Figure 5-7The unloading position 7 is equipped with a disassembly assembly 10, which fixes the pressure foot 32 so that the pressure foot 32 can be disengaged from a Z-axis 4. The disassembly assembly 10 includes a baffle 11 and a storage box 12. The baffle 11 is installed on the storage box 12 and cooperates with the pressure foot switching assembly 8. When the Z-axis 4 moves away from the baffle 11 in a first direction, the baffle 11 can lock the pressure foot 32 on the Z-axis 4, so that the pressure foot 32 falls into the storage box 12. In this embodiment, the disassembly assembly 10 can be detachably installed on the worktable 31. In this embodiment, bolt connection is used, but it is not limited to this. The storage box is installed on the worktable 31 by bolts. The storage box has multiple bolt holes, which are arranged at intervals along one side of the storage box. The baffle 11 and the storage box are connected by bolt fasteners passing through the bolt holes and mating holes in sequence.
[0091] In this embodiment, a shoulder 28 is provided at the connection between the storage box and the baffle 11. A limiting groove is formed between the shoulder 28 and the storage box. The baffle 11 is installed in the limiting groove and is fixed to the storage box by the shoulder 28.
[0092] Furthermore, the baffle 11 is recessed inward to form a latch 15 with a certain tilt angle. The latch 15 is configured to fit tightly with and hold the presser foot 32. At this time, the motor controls the Z-axis to descend until the curved surface of the chip suction cover 5 slide plate 26 is flush with the latch 15 of the baffle 11. At this time, the Z-axis moves to the right by -mm, the latch 15 of the baffle 11 holds the outer circle of the large presser foot 33, and the Z-axis is lifted upward, causing the large presser foot 33 to fall off the slide plate 26 and into the storage box 12. In this embodiment, the shape of the latch 15 matches the presser foot 32; and the diameter of the upper end face of the latch 15 is smaller than the diameter of the lower end face of the latch 15. The lower end face of the latch 15 is configured to cooperate with and position the outer circle of the presser foot 32, and the upper end face is used to fix and limit the presser foot 32. By holding the outer circle of the large presser foot 33 in place by the upper end face, the Z-axis is lifted upward, causing the large presser foot 33 to fall off the slide plate 26.
[0093] Optionally, combined Figure 1-4 The loading position 9 is equipped with a loading assembly 16, which fixes the pressure foot 32 so that the pressure foot 32 is installed on a Z-axis 4. The loading assembly 16 is provided with a positioning boss 14, which fixes the pressure foot 32 so that the pressure foot 32 is installed on the Z-axis 4. The outer circle of the positioning boss 14 is used to position the outer circle of the pressure foot 32, so that the pressure foot 32 will not have any positional displacement problems during the installation process.
[0094] Meanwhile, the top of the positioning boss 14 is used to press the pressure foot 32. Specifically, the upper pressure point 29 of the pressure foot 32 is adjusted to be concentric with the positioning boss 14, and then the z-axis is lowered to a certain height until the pressure point 29 of the pressure foot 32 presses the top of the boss. At this time, the lifting cylinder of the chip suction hood 5 rebounds slightly, holds for a few seconds and then lifts up to complete the pressing and installation of the pressure foot 32.
[0095] Furthermore, the positioning boss 14 includes a large boss 17 and a small boss 18. The small boss 18 is set on the large boss 17. The outer circle of the large boss 17 is used for positioning the large-sized presser foot 32, and the outer circle of the small boss 18 is used for positioning the small-sized presser foot 32. After all the presser feet 32 are disassembled, new presser feet 34 of different sizes are manually placed on the feeding assembly 16, with the large presser foot 33 at the bottom and the small presser foot 34 at the top. The large presser foot 33 is positioned against the outer circle of the large boss 17, and the lower end face of the presser foot 32 is flat against the feeding assembly 16; the small presser foot 34 is positioned against the outer circle of the small boss 18, and the lower end face of the small presser foot 34 is close to the upper end face of the large boss 17.
[0096] Furthermore, according to actual needs: the positioning boss 14 is provided with a positioning block, which cooperates with the pressure foot 32. The pressure foot 32 is limited to the positioning boss 14 through the positioning hole and the positioning block. There can be multiple pressure foot replacement systems 2, with one pressure foot replacement system 2 provided on one side of the processing area on each worktable 31. This arrangement is conducive to the replacement of pressure feet 32 in a single processing area, making the replacement of pressure feet 32 more convenient. A positioning block is formed on one side of the positioning boss 14. The positioning block can be formed by radially protruding outward from the peripheral wall of the positioning boss 14. The positioning hole of the pressure foot 32 is adapted to press against the positioning block of the positioning boss 14. That is to say, during the replacement of the pressure foot 32, the positioning block can engage with the peripheral wall of the new pressure foot 32 so that the pressure foot 32 is stored on the positioning boss 14 in the same direction. At the same time, the positioning block plays a limiting role to prevent the pressure foot 32 from rotating during the pressing and installation process with the Z-axis 4 chip suction cover 5. In this way, the positioning of the pressure foot 32 can be achieved, and the stability of the pressure foot 32 is higher. It can prevent the pressure foot 32 from being misaligned when it contacts the Z-axis 4, which would make it difficult to install or result in poor installation effect, and thus make it difficult to effectively press the workpiece during processing, resulting in a reduction in the processing accuracy of the workpiece.
[0097] Preferably, the loading position 9 further includes a spring-loaded section located at the bottom of the loading assembly 16. A positioning boss 14 is connected to the top of the spring-loaded section, and the spring-loaded section is configured to drive the positioning boss 14 to move along the loading assembly 16. The spring-loaded section includes a spring-loaded block and an elastic element. The upper surface of the spring-loaded block is detachably connected to the positioning boss 14. The spring-loaded block and the elastic element are interconnected. The elastic element can be a spring, and it can drive the spring-loaded block to move along the loading assembly 16. When the elastic element is in a contracted state, the spring-loaded block is located within the loading assembly 16. When the elastic element is in an extended state, the spring-loaded block can be pushed out of the loading assembly 16 by the elastic element, meaning at least a portion of the spring-loaded block can be located inside the loading position 9. The positioning boss 14 can contact the pressure foot 32 of the loading position 9.
[0098] Preferably, a sealing ring is provided on the outer periphery of one end of the pressure foot 32, and the pressure foot 32 is tightly fitted with the mounting hole 27 of the pressure foot switching assembly 8 through the sealing ring; the fit between the pressure foot 32 and the dust collection cover 5 is achieved by using an elastic sealing ring to fit into a specially designed round hole of the cylindrical dust collection cover 5 for quick replacement. Multiple presses can be used to press the large / small pressure foot 34 into its mounting position. The sealing ring is mainly made of elastic material.
[0099] Further: The material changing assembly 6 also includes a tool detection position 13, which is set on the base 3 and has a tool detection mechanism. Specifically: In this embodiment, the tool detection mechanism is equipped with a dust sensing device to detect dust particles and broken tools generated by the circuit board processing equipment 1 during the circuit board processing process. Preferably: a first sub-processing module for processing dust concentration signals and a second sub-processing module for processing broken tool signals are respectively set up. The signals based on dust and broken tool information are collected and processed simultaneously, and the processed output is sent to the controller for judgment. This allows the two judgment results to verify each other, improving the accuracy of broken tool detection. Moreover, its structure is simple and easy to operate, realizing real-time detection of broken tool conditions, solving the problems of errors and low production efficiency caused by manual adjustment, and reducing the cumbersomeness of the processing process and the scrapping of the board.
[0100] A pressure foot detection component 19 is also installed on the Z-axis 4. The pressure foot detection component 19 moves along the Z-direction with the Z-axis 4. The pressure foot detection component 19 is configured to detect whether the pressure foot switching component 8 is equipped with pressure foot 32. After the chip suction hood 5 moves to the designated position, the motor descends to the designated height. If the pressure foot detection component 19 on the chip suction hood 5 can be triggered at this time, it means that the pressure foot 32 has been installed on the chip suction hood 5; otherwise, it means that the installation has failed.
[0101] Specifically: combining Figure 7 , Figure 10 The presser foot detection assembly 19 includes a photoelectric sensor 22 and a sensing bracket 23: the sensing bracket 23 is mounted on the chip suction cover 5, and the photoelectric sensor 22 is mounted on the spindle. After the chip suction cover 5 moves to the designated position, the motor descends to the designated height. If the sensing bracket 23 of the chip suction cover 5 can trigger the photoelectric sensor 22, it means that the presser foot 32 has been installed on the chip suction cover 5; otherwise, it means that the installation has failed.
[0102] The presser foot detection assembly 19 also includes a grating ruler 30, which is mounted on the Z-axis 4. By reading the grating ruler 30, it is determined whether the cylinder of the chip suction hood 5 should be compressed at the corresponding height to trigger the photoelectric sensor 22, so as to determine whether the corresponding presser foot 32 is installed at this time, and to prevent drilling abnormalities caused by incorrect installation of the presser foot 32.
[0103] In actual work, there are abnormal situations such as missing large and small presser feet 34, double large presser feet 33 (the state of double small presser feet 34 has been prevented by mechanical structure), replacing large presser feet 33 but placing small presser feet 34, and replacing small presser feet 34 but placing large presser feet 33. Therefore, it is necessary to perform error-proofing tests.
[0104] like Figure 1-10 As shown, when Z-axis 4 descends to the first height, if there is a pressure foot 32 on the fixture, the chip suction hood 5 should not descend further, the lifting cylinder should rebound, and the induction switch should trigger the photoelectric sensor 22 at this time. If it is not triggered, it means that there is no pressure foot 32 on the fixture, and the program should alarm to indicate that there is a pressure foot 32 here.
[0105] In actual work, there are abnormal situations such as missing large and small presser feet 32, double large presser feet 33 (the state of double small presser feet 34 has been prevented by mechanical structure), replacing large presser feet 33 but placing small presser feet 34, and replacing small presser feet 34 but placing large presser feet 33. Therefore, it is necessary to perform error-proofing tests.
[0106] like Figure 2 As shown, on the feeding assembly 16, the large pressure foot 33 is at the bottom and the small pressure foot 34 is at the top; this embodiment includes at least the switching between the large pressure foot 33 and the small pressure foot 34. When the Z-axis 4 descends to the third height, if there is a pressure foot 32 on the tooling, the chip suction hood 5 should not descend further, the lifting cylinder should rebound, and the induction switch should trigger the photoelectric sensor 22 at this time. If it is not triggered, it means that there is no pressure foot 32 on the tooling, and the program should alarm to indicate that there is a pressure foot 32 here. Specifically, manual intervention is required for inspection. The large pressure foot 33 is installed, and the pressure foot 32 of the chip suction hood 5 is switched to the large pressure foot 33 state. The magnetic switch of the cylinder switching cylinder transmits the corresponding signal. The Z-axis descends to the fifth height. During the descent, it passes through the third height. At this time, the photoelectric sensor 22 should not be triggered, and there should be no small pressure foot 34 on the fixture. If the photoelectric sensor 22 is triggered at the third height, it indicates an alignment error or the presence of a small pressure foot 34. The program alarms to indicate an assembly error, requiring manual intervention. At the fifth height, if a large pressure foot 33 is placed on the fixture, the chip suction hood 5 should not descend further, the lifting cylinder should rebound, and the induction switch should trigger the photoelectric sensor 22. If it is not triggered, it indicates that there is no large pressure foot 33 on the fixture, and the program should alarm to indicate that there is no large pressure foot 33 here, requiring manual intervention.
[0107] The first height indicates that the curved surface of the presser foot mounting plate 20 is flush with the upper surface of the presser foot 32, that is, the mounting surface of the presser foot 32 is flush with the bottom of the slide plate 26, and the lifting cylinder of the dust suction cover 5 rebounds 1-5mm.
[0108] The second height refers to the pressure surface of the presser foot at point 32 fitting against the upper surface of the small boss 18, and the rebound of the chip suction hood 5 by the lifting cylinder being 1-5mm.
[0109] The third height: the mounting surface of the small presser foot 34 fits the bottom of the slide plate 26, and the dust suction hood 5 has a lifting cylinder that rebounds 1-5mm.
[0110] The fourth height feature includes: a small presser foot with 34 points pressing against the upper surface of the small boss 18; and a chip suction hood with a lifting cylinder that rebounds 1-5mm.
[0111] The fifth feature is: the large pressure foot 33 mounting surface fits snugly against the bottom of the skateboard 26, and the dust suction hood 5 has a lifting cylinder that rebounds 1-5mm.
[0112] The sixth height feature includes: a large presser foot with 33 points of pressure surface fitting against the upper surface of the small protrusion 18; and a chip suction hood with a lifting cylinder that rebounds 1-5mm.
[0113] The seventh height: the lower end face of the large presser foot 33 is fitted with the baffle plate 11;
[0114] The eighth height is where the lower end face of the small presser foot 34 is attached to the baffle plate 11; the rebound amount in the height is not fixed and is changed according to the thickness of the presser foot 32.
[0115] In this embodiment, a cylindrical motor is used.
[0116] Combination Figure 1 , Figure 10-12 According to a second aspect of the present invention, the processing equipment 1 may include a machine base, a worktable 31, a processing mechanism, and a presser foot changing system 2 according to the above-described embodiments of the present invention.
[0117] Specifically, the machine tool may include a bed and a crossbeam disposed on the bed. The worktable 31 is disposed on the bed and can move back and forth. The machining mechanism is disposed on the crossbeam and can move left and right. The worktable 31 is provided with multiple machining positions. The machining mechanism includes multiple machining positions corresponding to each machining position. The machining mechanism includes a Z-axis 4 and a presser foot 32. The presser foot 32 is disposed at one end of the Z-axis 4 adjacent to the worktable 31. The machining mechanism includes a Z-axis 4 and a presser foot 32 that can be detachably disposed on the Z-axis 4. The presser foot changing system 2 includes multiple pressing feet corresponding to each machining mechanism. In this way, the presser foot changing system 2 can avoid interfering with the workpiece machining.
[0118] The worktable 31 is movable relative to the machine tool, and the machining mechanism is movable relative to the worktable 31. For example, the machine tool may include a bed and a crossbeam. The worktable 31 is movably mounted on the bed, and the machining mechanism is mounted on the crossbeam in a second direction. The worktable 31 moves along a third direction.
[0119] The Z-axis 4 section includes a base plate, guide rails, a driver 21, a spindle clamp 24, and a spindle. The guide rails are mounted on the base plate, and the spindle clamp 24 is guided and engaged with the guide rails. The driver 21 is fixed to the base plate and connected to the spindle clamp 24, driving the spindle clamp 24 and its associated components to move up and down along the guide rails. The spindle is mounted on the spindle clamp 24 and moves up and down in sync with its movement. When drilling into a PCB (circuit board), the drill bit is mounted on the spindle, and the driver 21 controls the spindle clamp 24 to move downwards. The spindle synchronously drives the drill bit downwards, and the drill bit, driven by the spindle's rotation, drills into the PCB.
[0120] The following describes a method for changing the presser foot of a processing device according to a fourth aspect embodiment of the present invention.
[0121] According to the fourth aspect of the present invention, the method for replacing the presser foot of a processing apparatus can be used in the processing apparatus 1 described above. The method for replacing the presser foot 32 includes the following steps:
[0122] Step S1: Determine whether pressure foot 32 is installed on Z-axis 4;
[0123] Step S2: If it is determined that there is a pressure foot 32 on the Z-axis 4, control the Z-axis 4 to move to the unloading position 7;
[0124] Control the Z-axis 4 to drive the presser foot 32 to move to the unloading position 7, and fix the presser foot 32 with the disassembly assembly 10 to cooperate with the Z-axis 4 to remove the presser foot 32; check whether the presser foot 32 has been disassembled.
[0125] If it is determined that there is no presser foot 32 on Z-axis 4, control Z-axis 4 to move to loading position 9;
[0126] Control the Z-axis 4 to drive the presser foot 32 to move to the loading position 9, and use the loading component 16 to position and install the presser foot 32 to be installed; check whether the presser foot 32 is successfully installed.
[0127] The control center, in conjunction with sensors, determines whether a pressure foot 32 is installed on Z-axis 4. If a pressure foot 32 is installed on Z-axis 4, the system controls the worktable 31 assembly to move backward, positioning the chip suction cover 5 module on the Z-axis assembly above the disassembly fixture. The motor drives the chip suction cover 5 downward. When the pressure foot 32 is flush with the disassembly fixture, the Z-axis assembly moves laterally. After reaching the designated position, the motor lifts upward, and the disassembly fixture clamps the pressure foot 32, disassembling it and dropping it into the storage box 12. Then, the pressure foot 32 is placed on the loading position 9, and the chip suction cover 5 module moves above the loading position 9. The cylindrical motor drives the chip suction cover 5 downward. After reaching the designated position, it is held for a period of time and then lifted, repeating this process multiple times. When the installation is complete, after the chip suction cover 5 moves to the designated position, the cylindrical motor lowers to the designated height. If the chip suction cover 5 sensing bracket 23 triggers the photoelectric sensor 22, it indicates that the pressure foot 32 has been installed on the chip suction cover 5; otherwise, it indicates that the installation has failed.
[0128] The disassembly and installation of presser foot 32 allows for the simultaneous replacement or individual replacement of both large and small presser feet 34.
[0129] The following steps can be performed in a coordinated manner: disassembly of large presser foot 33 → disassembly and inspection → disassembly of small presser foot 34 → disassembly and inspection → installation of small presser foot 34 → installation and inspection → installation of large presser foot 33 → installation and inspection.
[0130] Alternatively, the presser feet of different sizes can be used to perform the process in 3-4 steps separately:
[0131] Large presser foot 33: Large presser foot 33 disassembly → disassembly inspection → large presser foot 33 installation → installation inspection;
[0132] Small presser foot 34: Small presser foot 34 disassembly → disassembly inspection → Small presser foot 34 installation → installation inspection;
[0133] The beneficial effects of this method are: automated disassembly and installation, eliminating the need for manual disassembly and installation, multi-axis synchronous operation, saving time and labor; installation stability is higher than manual installation, ensuring smooth and stable installation; easy to modify, with a simple structure.
[0134] Furthermore, in this embodiment, the disassembly assembly 10 fixes the presser foot 32 to cooperate with the Z-axis 4 to remove the presser foot 32, including: controlling the Z-axis 4 to move horizontally to the initial descending position, which is directly above the unloading position 7; controlling the Z-axis 4 to descend along the first direction to the first position, that is, the first position is when the curved surface of the presser foot mounting plate 20 is flush with the bayonet 15; controlling the Z-axis 4 to move along the X direction to the second position, where the bayonet 15 locks the outer circle of the presser foot 32; and controlling the Z-axis 4 to rise in the first direction, so that the presser foot 32 is disengaged from the Z-axis 4.
[0135] Combination Figure 1-10Specifically: First, align the Z-axis 4 assembly and the worktable 31 assembly to move the cylindrical chip suction cover 5 to the initial lowering position, that is, directly above the disassembly fixture. Then, control the Z-axis 4 to descend along the first direction to the first position; that is, the first position is when the curved surface of the presser foot mounting plate 20 is flush with the bayonet 15, that is, the outer circle of the presser foot 32 is tangent to the bayonet 15 of the baffle 11. The tangent position is obtained during machine assembly and debugging.
[0136] Disassembly: At this time, the motor controls the Z-axis to descend until the curved surface of the chip suction hood 5 slide plate 26 is flush with the baffle 11 latch 15. At this time, the Z-axis 4 moves to the right by 1-5mm, the baffle 11 latch 15 locks the outer circle of the pressure foot 32, and the Z-axis is lifted upward, so that the large pressure foot 33 falls off the chip suction hood 5 slide plate 26 and falls into the storage box 12.
[0137] This embodiment involves the installation of presser feet 32 of different sizes, specifically categorized as the replacement of large presser feet 33 and small presser feet 34:
[0138] Disassembly of large presser foot 33: First, align: Move the Z-axis 4 assembly and the worktable 31 assembly so that the cylindrical chip suction cover 5 is moved directly above the disassembly fixture, and the outer circle of presser foot 32 is tangent to the retaining plate 11 latch 15; Disassembly: At this time, the cylindrical motor controls the Z-axis to descend until the curved surface of the chip suction cover 5 slide plate 26 is flush with the retaining plate 11 latch 15. At this time, the X-axis moves 1-5mm to the right, the retaining plate 11 latch 15 locks the outer circle of the large presser foot 33, and the Z-axis is lifted upward so that the large presser foot 33 falls off the slide plate 26 and into the storage box 12; Detection: Move the chip suction cover 5 so that the large presser foot 33 and the presser foot 32 disassembly fixture detection position screw are concentric. The Z-axis descends to the seventh height. The Z-axis continues to descend 3mm. The photoelectric sensor 22 should not be triggered, indicating that the large presser foot 33 has been disassembled.
[0139] Disassembly of small presser foot 34: After disassembling large presser foot 33, move the Z-axis upward by 5-15mm, switch the cylinder action, and switch slide plate 26 to the small presser foot 34 state. Repeat the disassembly action of large presser foot 33. Detection: Move the chip suction cover 5 to make the small presser foot 34 and the presser foot 32 disassembly tool detection position screw concentric. The Z-axis descends to the eighth height. The Z-axis continues to descend 1-5mm. If the photoelectric sensor 22 is not triggered, it means that the small presser foot 34 has been disassembled.
[0140] Further: Combining Figure 1-4The loading assembly 16 positions and installs the presser foot 32 to be installed, including: controlling the Z-axis 4 to move horizontally to the initial loading position 9, which is directly above the loading position 9; the positioning boss 14 is concentric with the presser foot 32; controlling the Z-axis 4 to descend along the first direction to the first height; that is, the first height is when the curved surface of the presser foot mounting plate 20 is flush with the upper end face of the presser foot 32; repeating the pressing action multiple times to press the sealing ring on the presser foot 32 into the mounting hole 27 of the presser foot mounting plate 20; controlling the Z-axis 4 to press: controlling the Z-axis 4 to move in the second direction to the pressing position 29, controlling the Z-axis 4 to descend along the first direction to the second height and then raise it to the second height, so that the pressing position 29 of the presser foot 32 presses the small boss 18; repeating the pressing action multiple times; controlling the Z-axis 4 to press again: controlling the Z-axis 4 to move horizontally to the initial loading position 9, and controlling the Z-axis 4 to descend along the first direction to the first height.
[0141] Combination Figure 13-14 Specifically: Alignment: Move the Z-axis 4 assembly and the worktable 31 assembly to move the cylindrical chip suction hood 5 directly above the feeding assembly 16, and switch the cylinder extension to put the cylindrical chip suction hood 5 in the large pressure foot 33 state.
[0142] Installation: Lower the Z-axis to the first height. At this time, the upper surface of the presser foot 32 is flat with the slide plate 26, and the sealing ring enters the slide plate 26. Hold for 5 seconds, then raise the Z-axis by 1-15mm and lower it by 1-5mm. Hold for another 5 seconds. Repeat this action 3 times before starting to apply pressure.
[0143] Point pressing: The center of point pressing position 29 is 1-5mm away from the outer circle of presser foot 32. The four points are located on the same circumference and are 90° to each other. Adjust the upper point pressing position 29 of presser foot 32 to be concentric with the small boss 18 on the positioning boss 14. Then lower the z-axis to the second height, and the upper point pressing position 29 presses down on the small boss 18. At this time, the lifting cylinder of the chip suction hood 5 will slightly rebound. After holding for 3 seconds, it will be raised and then moved to the symmetrical point pressing position 29. Repeat the above action and complete the pressing of the remaining two points. Re-pressing: After point pressing is completed, return to the installation position of presser foot 32, that is, the large presser foot 33 is concentric with the feeding assembly 16. Lower the z-axis to the first height and repeat the installation action once. Detection: Move the dust collection cover 5 so that the pressure foot 32 is concentric with the detection position screw of the pressure foot 32 disassembly component 10. The dust collection cover 5 descends to the second height. At this time, the lower end face of the large pressure foot 33 contacts the baffle 11, and the lifting cylinder does not rebound. On this basis, the Z-axis continues to descend a certain distance. If the dust collection cover 5 is equipped with the pressure foot 32 at this time, the dust collection cover 5 cannot continue to descend because the pressure foot 32 is against the baffle 11, but the Z-axis is still descending. The sensing bracket 23 on the dust collection cover 5 will trigger the photoelectric sensor 22. If the system receives the signal from the photoelectric sensor 22, it means that the pressure foot 32 is installed at the dust collection cover 5; otherwise, it means that the pressure foot 32 is not installed. The system prompts an installation abnormality and manual handling is required.
[0144] This embodiment involves the installation of presser feet 32 of different sizes, specifically categorized as the replacement of large presser feet 33 and small presser feet 34:
[0145] Installation of small presser foot 34: After all presser feet 32 have been disassembled, manually place the new presser feet 34 (large and small) onto the feeding assembly 16, such as... Figure 2 The large presser foot 33 is at the bottom and the small presser foot 34 is at the top. The large presser foot 33 is positioned against the outer circle of the large boss 17, and the lower end face of the presser foot 32 is flat against the bottom surface of the positioning boss 14. The small presser foot 34 is positioned against the outer circle of the small boss 18, and the lower end face of the small presser foot 34 is close to the upper end face of the large boss 17.
[0146] Alignment: Move the Z-axis 4 assembly and the worktable 31 assembly so that the chip suction hood 5 is directly above the feeding assembly 16. Retract the switching cylinder, so that the pressure foot switching assembly 8 is in the small pressure foot 34 state, with the center of the small pressure foot 34 concentric with the positioning boss 14 of the feeding assembly 16. Installation: Lower the Z-axis to the third height. At this point, the upper surface of the small pressure foot 34 is flush with the slide plate 26, and the sealing ring enters the slide plate 26. Hold for 5 seconds, then raise the Z-axis 1-15mm and lower it again 1-15mm, holding for another 1-5 seconds. Repeat this action 3 times, then begin point pressing (e.g., ...). Figure 12 Point pressing: The center of the pressing point is 2mm away from the outer circle of the presser foot 32. The four points are located on the same circumference and are 90° to each other. Adjust the upper pressing point of the small presser foot 34 to be concentric with the small boss 18 of the feeding assembly 16. Then, lower the Z-axis to the fourth height, and press the upper pressing point against the small boss 18. At this time, the lifting cylinder of the chip suction hood 5 will slightly rebound. Hold for 1-3 seconds and then lift. Then move to the symmetrical pressing point position, repeat the above action and complete the pressing of the remaining two points. Re-pressing: After the point pressing is completed, return to the chip suction hood 5 and move it to the installation position of the small presser foot 34, that is, the small presser foot 34 is concentric with the feeding assembly 16. Lower the Z-axis to the third height and repeat the installation action once. Inspection: Move the chip suction hood 5 so that the small presser foot 34 and the screw of the inspection position of the disassembly tooling of the presser foot 32 are concentric. Figure 2 When the chip suction hood 5 descends to the eighth height, the lower end face of the small pressure foot 34 contacts the baffle plate 11, and the lifting cylinder does not rebound. Based on this, the Z-axis continues to descend 1-5mm. If the chip suction hood 5 is equipped with a pressure foot 32 at this time, the pressure foot 32 will press against the baffle plate 11, and the chip suction hood 5 cannot continue to descend, but the Z-axis will still descend. The sensing bracket 23 on the chip suction hood 5 will trigger the photoelectric sensor 22. If the system receives the signal from the photoelectric sensor 22, it means that the pressure foot 32 is installed at the chip suction hood 5; otherwise, it means that the pressure foot 32 is not installed, and the system will prompt an installation abnormality, which needs to be handled manually.
[0147] Large presser foot 33 installation: Alignment: Move the Z-axis 4 assembly and the worktable 31 assembly so that the chip suction hood 5 is directly above the feeding assembly 16. Extend the switching cylinder to put the presser foot switching assembly 8 into the large presser foot 33 state; Installation: Lower the Z-axis to the fifth height. At this time, the upper surface of the large presser foot 33 is flush with the slide plate 26, and the sealing ring enters the slide plate 26. Hold for 1-5 seconds, then raise the Z-axis 1-15mm and lower it again 1-15mm. Hold for another 1-5 seconds. Repeat this action 3 times, then begin point pressing (e.g. Figure 13 ).
[0148] Point pressing: The center of the pressing point is 1-3mm away from the outer circle of the presser foot 32. The four points are located on the same circumference and are 90° to each other. Adjust the upper pressing point of the large presser foot 33 to be concentric with the small protrusion 18 of the feeding assembly 16. Then, lower the Z-axis to the sixth height, and press the upper pressing point against the small protrusion 18. At this time, the lifting cylinder of the chip suction hood 5 will slightly rebound. Hold for 1-3 seconds and then lift. Then move to the symmetrical pressing point position and repeat the above action to complete the pressing of the remaining two points. Re-pressing: After the point pressing is completed, return to the chip suction hood 5 and move it to the installation position of the large presser foot 33, that is, the large presser foot 33 is concentric with the feeding assembly 16. Lower the Z-axis to the fifth height and repeat the installation action once. Detection: Move the chip suction hood 5 so that the screws of the large pressure foot 33 and the pressure foot 32 disassembly fixture are concentric. The chip suction hood 5 descends to the seventh height. At this time, the lower end face of the large pressure foot 33 contacts the baffle 11, and the lifting cylinder does not rebound. Based on this, the Z-axis continues to descend 1-2mm. If the chip suction hood 5 is equipped with the pressure foot 32 at this time, the chip suction hood 5 cannot continue to descend because the pressure foot 32 is against the baffle 11, but the Z-axis is still descending. The sensing bracket 23 on the chip suction hood 5 will trigger the photoelectric sensor 22. If the system receives the signal from the photoelectric sensor 22, it means that the pressure foot 32 is installed at the chip suction hood 5; otherwise, it means that the pressure foot 32 is not installed. The system prompts an installation abnormality, which needs to be handled manually.
[0149] The switching method of the presser foot replacement system 2 in this application involves switching between the large mounting hole 27 and the small mounting hole 27 via a drive mechanism. The drive mechanism moves the slide plate 26 back and forth between the large and small mounting holes 27. When the presser foot 33 is in the large mounting hole 27, it can be disassembled or installed; when the presser foot 34 is in the small mounting hole 27, it can be disassembled or installed. This method allows for the simultaneous use of both the large and small presser feet 33 and 34, improving drilling stability.
[0150] Further: Step S1 also includes; Step S12: Detecting the state of the pressure foot 32. If the pressure foot 32 is a large-size pressure foot 32, the control driver 21 drives the large mounting hole 27 of the pressure foot mounting plate 20 to be directly above the large-size pressure foot 32; if the pressure foot 32 is a small-size pressure foot 32, the control driver 21 drives the small mounting hole 27 of the pressure foot mounting plate 20 to be directly above the large-size pressure foot 32. This solution is used to replace the pressure foot 32 according to the actual different sizes of the pressure foot 32.
[0151] Further: Step S1: Determining whether a pressure foot 32 is installed on the Z-axis 4 also includes: controlling the Z-axis 4 to move the dust collection cover 5 to the first position, and controlling the Z-axis 4 to continue moving to the second position. If the dust collection cover 5 sensing bracket 23 can trigger the photoelectric sensor 22 on the Z-axis 4, it means that the pressure foot 32 has been installed on the dust collection cover 5; otherwise, it means that the installation has failed.
[0152] In practical work, there are abnormal situations such as missing large and small presser feet 34, double large presser feet 33 (the double small presser feet 34 state has been prevented by mechanical structure), replacing large presser feet 33 but placing small presser feet 34, and replacing small presser feet 34 but placing large presser feet 33. Therefore, it is necessary to perform error-proofing checks in the procedure. Figure 2 As shown, on the installation fixture, the large presser foot 33 is at the bottom and the small presser foot 34 is at the top.
[0153] Combination Figure 12 As shown: To install the small pressure foot 34, first switch the pressure foot 32 of the chip suction hood 5 to the small pressure foot 34 state. The magnetic switch of the cylinder switching cylinder transmits the corresponding signal. When the Z-axis 4 descends to the third height, if there is a small pressure foot 34 on the fixture, the chip suction hood 5 should not descend further, the lifting cylinder should rebound, and the induction switch should trigger the photoelectric sensor 22 at this time. If it is not triggered, it means that there is no small pressure foot 34 on the fixture, the program should alarm, indicating that there is no small pressure foot 34 here, and manual intervention is required for inspection.
[0154] Combination Figure 13 As shown: When installing the large pressure foot 33, switch the pressure foot 32 of the chip suction hood 5 to the large pressure foot 33 state. The magnetic switch of the cylinder switching cylinder transmits the corresponding signal. The Z-axis descends to the fifth height. During the descent, it will pass through the third height. At this time, the photoelectric sensor 22 should not be triggered, and there should be no small pressure foot 34 on the fixture. If the photoelectric sensor 22 is triggered at the third height, it indicates an alignment error or the presence of a small pressure foot 34. The program alarms to indicate an assembly error and manual intervention is required. At the fifth height, if there is a large pressure foot 33 on the fixture, the chip suction hood 5 should not descend, the lifting cylinder should rebound, and the induction switch should trigger the photoelectric sensor 22 at this time. If it is not triggered, it indicates that there is no large pressure foot 33 on the fixture. The program should alarm to indicate that there is no large pressure foot 33 here and manual intervention is required.
[0155] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0156] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A presser foot replacement system, applied to PCB processing equipment, characterized in that, include: The PCB processing equipment includes a Z-axis, which is configured to move along a first direction; The presser foot replacement system includes: A pressure foot switching assembly is mounted on the bottom end of the Z-axis. The pressure foot switching assembly is configured to move along a second direction, and at least one pressure foot is mounted on the pressure foot switching assembly. The material changing assembly includes a base, on which a discharge position and a loading position are respectively provided; The unloading position is used to disassemble and store the presser foot on the presser foot switching assembly; the unloading position is provided with a disassembly assembly, which includes a baffle and a storage box, the baffle being installed on the storage box; the baffle has an inwardly recessed slot with an inclined angle, the diameter of the upper end face of the slot is smaller than the diameter of the lower end face, the lower end face is used to cooperate in positioning the outer circle of the presser foot, and the upper end face is used to press the presser foot; when the Z-axis moves away from the baffle in the first direction, the upper end face of the slot locks the presser foot, causing the presser foot to disengage from the presser foot switching assembly and fall into the storage box; The loading position is used to store unused presser feet and install them on the presser foot switching assembly. The loading position is equipped with a loading assembly, which has a positioning boss. The outer circle of the positioning boss limits the unused presser foot, keeping it on the positioning boss. When the Z-axis moves closer to the positioning boss along the first direction, the positioning boss guides the unused presser foot to be fixed in the mounting hole of the presser foot switching assembly, completing the installation.
2. The presser foot replacement system according to claim 1, characterized in that, The disassembly assembly secures the pressure foot, and the baffle cooperates with the pressure foot switching assembly to disengage the pressure foot from the Z-axis.
3. The presser foot replacement system according to claim 1, characterized in that, The material changing assembly also includes a tool inspection station, which is located on the base and has a tool detection mechanism.
4. The presser foot replacement system according to claim 2, characterized in that, The bayonet is used to fit tightly with the presser foot and lock the presser foot in place.
5. The presser foot replacement system according to claim 1, characterized in that, The positioning boss fixes the pressure foot so that the pressure foot is mounted to the Z-axis.
6. The presser foot replacement system according to claim 5, characterized in that, The positioning boss includes a large boss and a small boss. The small boss is disposed on the large boss. The outer circle of the large boss is used to position a large-sized presser foot, and the outer circle of the small boss is used to position a small-sized presser foot.
7. The presser foot replacement system according to claim 1, characterized in that, A pressure foot detection component is also installed on the Z-axis. The pressure foot detection component moves along the first direction with the Z-axis. The pressure foot detection component is used to detect whether the pressure foot is installed on the pressure foot switching component.
8. The presser foot replacement system according to claim 1, characterized in that, A sealing ring is provided on the outer periphery of one end of the presser foot, and the presser foot is tightly fitted with the mounting hole of the presser foot switching assembly through the sealing ring.
9. The presser foot replacement system according to claim 1, characterized in that, The presser foot switching assembly includes a presser foot mounting plate, on which a driver is provided. The driver is mounted on the Z-axis and is used to drive the presser foot mounting plate to move along the second direction.
10. A processing device, characterized in that, include: Workbench; A machining mechanism is movable relative to the worktable. The machining mechanism includes a Z-axis and a detachable chip suction cover disposed on the Z-axis. A pressure foot is detachably mounted on the chip suction cover. A presser foot replacement system, wherein the presser foot replacement system is as described in any one of claims 1 to 9, the presser foot replacement system is disposed on the workbench and is used to replace the presser foot.
11. A method for changing the pressure foot of a processing equipment, characterized in that, The presser foot replacement method for the processing equipment according to claim 10 includes the following steps: Step S1: Determine whether the pressure foot is installed on the Z-axis; Step S2: If it is determined that there is a pressure foot on the Z-axis, control the Z-axis to move to the unloading position; fix the pressure foot with the disassembly assembly, and remove the pressure foot with the Z-axis; check whether the pressure foot has been successfully disassembled; If it is determined that the presser foot is not installed on the Z-axis, the Z-axis is controlled to move to the loading position; the unused presser foot is positioned and installed by the loading assembly; and the installation of the presser foot is checked to see if it is successful.
12. The method for changing the presser foot of the processing equipment according to claim 11, characterized in that, The disassembly assembly secures the pressure foot, and the Z-axis is used to remove the pressure foot, comprising: Control the Z-axis to move horizontally to the initial descent position, which is located directly above the unloading position; Control the Z-axis to descend along the first direction to a first position; the first position is where the curved surface of the pressure foot mounting plate is flush with the bayonet. Control the Z-axis to move along the second direction to a second position; the second position is the position where the bayonet engages the outer circle of the pressure foot. Control the Z-axis to rise along the first direction, so that the pressure foot is disengaged from the Z-axis.
13. The method for changing the presser foot of the processing equipment according to claim 11, characterized in that, The feeding assembly positions and installs the unused presser foot, including: The Z-axis is controlled to move horizontally to the initial loading position, which is located directly above the loading position; and the positioning boss is concentric with the pressure foot. Control the Z-axis to descend along the first direction to a first height; that is, the first height is the height at which the curved surface of the presser foot mounting plate is flush with the upper end surface of the presser foot; repeat the pressing action multiple times to press the sealing ring on the presser foot into the mounting hole of the presser foot mounting plate; Control the Z-axis to perform point pressing: control the Z-axis to move along the second direction to the point pressing position, control the Z-axis to descend a second height along the first direction, and then rise a second height, so that the point pressing position of the presser foot presses against the small boss; repeat the point pressing action multiple times; Control the Z-axis to perform re-pressing: control the Z-axis to move horizontally back to the initial loading position, and then control the Z-axis to descend along the first direction to the first height.
14. The method for replacing the presser foot of the processing equipment according to claim 11, characterized in that, Step S1 further includes step S11: detecting the specifications of the presser foot; if the presser foot is a large-sized presser foot, controlling the driver to move the large mounting hole of the presser foot mounting plate to directly above the large-sized presser foot; if the presser foot is a small-sized presser foot, controlling the driver to move the small mounting hole of the presser foot mounting plate to directly above the small-sized presser foot.
15. The method for changing the presser foot of the processing equipment according to claim 12, characterized in that, The step S1 of determining whether the pressure foot is installed on the Z-axis further includes: controlling the Z-axis to move the dust collection cover to the first position, controlling the Z-axis to continue moving to the second position, and if the dust collection cover can trigger the pressure foot detection component installed on the Z-axis at this time, it is determined that the pressure foot has been installed on the dust collection cover; otherwise, it is determined that the installation has failed.
Citation Information
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