Assembling device

Abstract

The application provides an assembling device, and relates to the technical field of BMS assembling. According to the assembling device provided in the application, the first feeding mechanism and the second feeding mechanism are used to supply BMS shells and PCBs respectively, a six-axis robot is used to grab the BMS shells to the bearing assembly of the positioning mechanism, and the second feeding mechanism is used to supply the PCBs to the positioning mechanism, so that after the BMS shells and the PCBs are positioned, a locking mechanism comprising a three-axis module is used to lock the BMS shells and the PCBs. Compared with the uncertainty of manual assembling in the prior art, the assembling device provided in the application uses the feeding mechanism to supply materials, uses the six-axis robot to transfer the materials, and uses the three-axis module and the locking assembly to lock the assembling materials, so that the uncertainty of manual assembling is eliminated to a certain extent.

Description

Technical Field

[0001] This application relates to the field of BMS assembly technology, and in particular to an assembly apparatus. Background Technology

[0002] In existing technologies, BMS (Battery Management System) assembly is typically done manually. This involves manually assembling the PCB (Printed Circuit Board) to the BMS housing, securing the PCB with a handheld screwdriver, and then applying thermal paste. This method suffers from inherent limitations in fixtures and human subjectivity, making it difficult to guarantee consistency in PCB assembly, housing securing, and thermal paste application. This can lead to rework and errors in subsequent processes. Summary of the Invention

[0003] In view of this, this application provides an assembly apparatus, which aims to solve the above-mentioned technical problems to a certain extent.

[0004] This application provides an assembly apparatus, the assembly apparatus comprising:

[0005] A first feeding mechanism and a second feeding mechanism, wherein the first feeding mechanism is used to supply the BMS housing and the second feeding mechanism is used to supply the PCB;

[0006] A six-axis robot and a positioning mechanism, wherein the six-axis robot includes a gripping component, the positioning mechanism includes a carrying component, a second feeding mechanism is used to supply PCB to the positioning mechanism, and the gripping component is used to grip the BMS housing onto the carrying component and assemble it with the PCB;

[0007] A locking mechanism, comprising a three-axis module and a locking component connected to and driven by the three-axis module, the locking component being used to lock the BMS housing and the PCB.

[0008] Preferably, the assembly device further includes a patching mechanism, which includes a pick-up component for picking up heat sinks. The pick-up component includes a pick-up body and a pressure sensor. The pressure sensor is disposed on the pick-up body and is used to detect the pressure exerted by the pick-up component on the locked BMS housing and the PCB.

[0009] Preferably, the assembly device further includes a patching mechanism, which includes a plurality of storage bins arranged side by side, each storage bin being used to store stacked heat sinks. The patching mechanism also includes a lifting mechanism corresponding to each storage bin, each lifting mechanism being disposed at the bottom of the corresponding storage bin to support and lift the stacked heat sinks.

[0010] Preferably, the bottom of each storage bin is configured as a base plate for supporting stacked heat sinks, the base plate being connected to a corresponding lifting mechanism, the lifting mechanism being a linear drive mechanism, so that the heat sinks in each storage bin can be raised above the upper edge of the storage bin.

[0011] Preferably, the patching mechanism includes a flipping component and a picking component. The picking component is used to pick up the heat sink. The flipping component is disposed outside the plurality of side-by-side storage bins. The picking component is configured to pick up the heat sink and place it onto the flipping component. The flipping component is used to flip the heat sink.

[0012] Preferably, the flipping assembly includes a flipping plate and an adsorption member, the adsorption member being disposed on the flipping plate and used to adsorb the heat sink. The flipping assembly further includes a connecting rod assembly disposed on at least one side of the flipping plate, the connecting rod assembly being hinged to the flipping plate, and the connecting rod assembly being configured to be driven so that the flipping plate and the heat sink located on the flipping plate flip together.

[0013] Preferably, the assembly apparatus further includes a patching mechanism, which includes a material picking component and a film peeling component. The material picking component is used to pick up the heat sink, and the film peeling component includes a clamping member configured to clamp the film on the heat sink. The clamping member is also configured to move relative to the heat sink to separate the film from the heat sink.

[0014] Preferably, the film-tearing assembly further includes a range-extending slide cylinder, an inclined push cylinder, and a gripper cylinder. The inclined push cylinder is disposed on the range-extending slide cylinder, and the gripper cylinder is disposed at the output end of the inclined push cylinder. The gripper cylinder is disposed at the output end of the gripper cylinder. The inclined push cylinder can push the gripper cylinder to move in an oblique direction that is inclined to the horizontal direction, so as to drive the gripper cylinder to separate the film from the heat sink.

[0015] Preferably, the assembly device is further provided with an air blowing hose and a waste box corresponding to the film tearing assembly. The air blowing hose can be bent and directed toward the film tearing assembly to blow off the film torn off by the film tearing assembly. The waste box is used to collect the blown-off film.

[0016] Preferably, the grasping component includes:

[0017] Base;

[0018] A first gripping member is connected to the base, and the first gripping member is configured to grip the BMS housing and the first one in the PCB;

[0019] An adjusting member is connected to the base, the adjusting member including a movable part configured to move toward and away from the base;

[0020] A second gripping member, connected to the moving part, is configured to grip the second of the BMS housing and the PCB, wherein the second gripping member is driven by the moving part to extend beyond the side of the first gripping member away from the base.

[0021] Preferably, the six-axis robot includes a robotic arm, and the gripping assembly further includes a first coupling member and a second coupling member, the first coupling member being used to connect with the robotic arm, and the second coupling member being used to detachably connect with the first coupling member.

[0022] Preferably, the first feeding mechanism includes a transfer component, the transfer component comprising:

[0023] Placement components are used to support the BMS housing;

[0024] A positioning member configured to approach the placement member to abut the BMS housing against the placement member;

[0025] A sensing component is disposed on the placement component, the sensing component being used to sense the orientation of a predetermined side of the BMS housing toward the sensing component.

[0026] Preferably, the assembly apparatus further includes a vision inspection mechanism and a conveying mechanism. The vision inspection mechanism is used to detect the width of the PCB supplied by the second feeding mechanism. The conveying mechanism is communicatively connected to the inspection mechanism and is configured to have an adjustable width.

[0027] Preferably, the conveying mechanism includes:

[0028] A first conveyor belt and a second conveyor belt, the width between the first conveyor belt and the second conveyor belt being configured to be adjustable to adjust the width of the conveying mechanism;

[0029] The guide members are provided on both the side of the first conveyor belt away from the second conveyor belt and the side of the second conveyor belt away from the first conveyor belt, along the conveying direction of the conveying mechanism, wherein the guide members are configured to be rotatable.

[0030] According to the assembly apparatus provided in this application, the BMS housing and PCB are supplied by a first feeding mechanism and a second feeding mechanism, respectively. A six-axis robot grips the BMS housing onto the bearing component of the positioning mechanism, and the second feeding mechanism supplies the PCB to the positioning mechanism. After the BMS housing and PCB are in place, a locking mechanism including a three-axis module locks the BMS housing and PCB. Compared to the uncertainty of manual assembly in the prior art, the assembly apparatus provided in this application uses a feeding mechanism to supply materials, a six-axis robot to transfer materials, and a three-axis module and locking component to lock the assembly materials, thereby eliminating the uncertainty of manual assembly to a certain extent.

[0031] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A schematic plan view of an assembly apparatus provided according to an embodiment of this application is shown.

[0034] Figure 2 A schematic perspective view of the AGV loading platform of the assembly apparatus provided according to an embodiment of this application is shown.

[0035] Figure 3 A schematic perspective view of a transfer component of an assembly apparatus provided according to an embodiment of this application is shown.

[0036] Figure 4 A schematic perspective view of the gripping component of the assembly apparatus provided according to an embodiment of this application is shown.

[0037] Figure 5 A schematic perspective view of the conveying mechanism of the assembly apparatus provided according to an embodiment of this application is shown.

[0038] Figure 6 A schematic perspective view of the locking mechanism of the assembly apparatus provided according to an embodiment of this application is shown.

[0039] Figure 7 A schematic perspective view of the patching mechanism of the assembly apparatus provided according to an embodiment of this application is shown.

[0040] Figure 8 A schematic perspective view of the film-tearning assembly of the assembly apparatus provided according to an embodiment of this application is shown.

[0041] Figure 9 A schematic perspective view of the material handling component of the assembly apparatus provided according to an embodiment of this application is shown.

[0042] Figure label:

[0043] 100 - Positioning mechanism; 110 - Upper CCD camera; 120 - Lower CCD camera;

[0044] 200 - Six-axis robot; 210 - Gripping assembly; 220 - Robot adapter; 230 - First joining member; 240 - Second joining member; 250 - Adjustment member; 260 - First gripping member; 270 - Second gripping member; 280 - Base;

[0045] 310-AGV loading platform; 320-Transfer assembly; 321-Transfer platform; 322-Clamping block; 323-Reflective switch; 324-Sensing component; 400-Patching mechanism; 410-Material handling assembly; 411-Material handling body; 412-Rotary cylinder; 413-Pressure sensor; 414-Suction cup; 420-Film tearing assembly; 421-Extend-range slide cylinder; 422-Angled dual-axis cylinder; 423-Gripper; 424-Waste box; 425-Recycled film drawer; 430-Storage bin; 431-Lifting mechanism; 440-Tilting assembly; 450-Lifting platform; 460-Air blowing hose;

[0046] 500 - Conveying mechanism; 510 - First conveyor belt; 520 - Second conveyor belt; 530 - Guide component; 540 - Blocking mechanism; 550 - Width adjustment mechanism; 600 - Locking mechanism; 610 - Locking assembly. Detailed Implementation

[0047] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0048] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0051] According to an embodiment of this application, an assembly apparatus is provided, which will be described below in conjunction with... Figures 1 to 9 Describe in detail the structure and tooling principle of the assembly device.

[0052] According to the assembly apparatus provided in the embodiments of this application, the assembly apparatus includes a first feeding mechanism, a second feeding mechanism, a six-axis robot 200, a positioning mechanism 100, and a locking mechanism 600. The first feeding mechanism supplies the BMS housing, and the second feeding mechanism supplies the PCB. The six-axis robot 200 includes a gripping component 210, the positioning mechanism 100 includes a carrying component, the second feeding mechanism supplies the PCB to the positioning mechanism, and the gripping component 210 grips the BMS housing onto the carrying component and assembles it with the PCB. The locking mechanism 600 includes a three-axis module and a locking component 610 connected to and driven by the three-axis module, the locking component 610 locking the BMS housing and the PCB.

[0053] According to the assembly apparatus provided in this application embodiment, the BMS housing and PCB are supplied by a first feeding mechanism and a second feeding mechanism, respectively. A six-axis robot 200 grips the BMS housing onto the bearing component of the positioning mechanism 100, and the second feeding mechanism supplies the PCB to the positioning mechanism 100. After the BMS housing and PCB are in place, a locking mechanism 600, including a three-axis module, locks the BMS housing and PCB. Compared to the uncertainty of manual assembly in the prior art, the assembly apparatus provided in this application embodiment uses a feeding mechanism to supply materials, a six-axis robot 200 to transfer materials, and a three-axis module and locking component 610 to lock the assembly materials, thereby eliminating the uncertainty of manual assembly to a certain extent.

[0054] In this embodiment, the first loading mechanism may include an AGV (Automated Guided Vehicle) cart, which transports BMS housings, such as the BMS upper housing, in batches. The first loading mechanism may also include a platform that connects with the AGV cart; this platform is referred to here as the AGV loading platform 310. The connection structure between the AGV loading platform 310 and the AGV cart is an existing structure and will not be described in detail here.

[0055] According to the assembly apparatus provided in the embodiments of this application, the assembly apparatus may further include a patching mechanism 400. The patching mechanism 400 may include a material picking component 410. The material picking component 410 is used to pick up the heat sink. The material picking component 410 includes a material picking body 411 and a pressure sensor 413. The pressure sensor 413 is disposed on the material picking body 411 and is used to detect the pressure of the material picking component 410 on the locked BMS housing and PCB.

[0056] According to the assembly apparatus provided in the embodiments of this application, the pick-up component 410 of the patching mechanism 400 is used to pick up heat sinks, such as thermal silicone, which helps to eliminate the uncertainty of manual heat sink loading. The pick-up component 410 includes a pick-up body 411 and a pressure sensor 413. The pressure sensor 413 is disposed on the pick-up body 411, so that when the pick-up body 411 picks up the heat sink and applies it to the locked BMS housing and PCB, it can obtain the pressure applied by the pick-up body 411, thereby helping to ensure the safety of the locked BMS housing and PCB.

[0057] In this embodiment, the material handling body 411 may include a main component and a suction cup 414 disposed on the main component. The patching mechanism 400 may also include a three-axis module and a rotary cylinder 412. The rotary cylinder 412 may be driven by the three-axis module, the base 280 may be connected to the rotary cylinder 412, and a pressure sensor 413 may be disposed between the rotary cylinder 412 and the main component. Thus, the main component can be driven by the three-axis module to have movement in two horizontal directions and one vertical direction, and can also be driven by the rotary cylinder 412 to have rotational movement about an axis extending in the vertical direction, thereby effectively adjusting the position of the main component to ensure accurate patching of the heat sink.

[0058] In this embodiment, a CCD (charge coupled device) camera may be installed on the three-axis module. The visual sensing of the CCD camera is used to capture the location of the heat sink and to confirm whether there is any film residue on the heat sink.

[0059] In this embodiment, the positioning mechanism 100 may also include a CCD camera, for example, two sets of CCD cameras. The two sets of CCD cameras may be an upper CCD camera 110 and a lower CCD camera 120, respectively. The upper CCD camera 110 is located above the carrier component and can communicate with the six-axis robot 200 to achieve visual interaction with the six-axis robot 200, thereby improving the assembly accuracy of the BMS housing and the PCB. The lower CCD camera 120 can be located below the carrier component and can be used to photograph the PCB for board width analysis and barcode scanning.

[0060] According to the assembly apparatus provided in the embodiments of this application, the assembly apparatus may further include a patching mechanism 400 (such as the patching mechanism 400 described above). The patching mechanism 400 may include a plurality of storage bins 430 arranged side by side. Each storage bin 430 may be used to store stacked heat sinks. The patching mechanism 400 may further include a lifting mechanism 431 provided for each storage bin 430. Each lifting mechanism 431 may be provided at the bottom of the corresponding storage bin 430 to support and lift the stacked heat sinks.

[0061] According to the assembly apparatus provided in the embodiments of this application, the patching mechanism 400 uses a plurality of storage bins 430 arranged side by side to store heat sinks. That is, for each storage bin 430, each storage bin 430 can be provided with stacked heat sinks inside, thereby effectively storing more heat sinks and avoiding frequent loading.

[0062] In this embodiment, multiple storage bins 430 can be defined by multiple partitions arranged at intervals. For example, in this embodiment, four partitions are used to define three storage bins 430. The bottom of each storage bin 430 can be a base plate for supporting stacked heat sinks, wherein the base plate can be connected to a lifting mechanism 431 corresponding to the storage bin 430. In this embodiment, the lifting mechanism 431 can be a linear drive mechanism, such as a lead screw mechanism, which uses a lead screw nut to drive the base plate to rise, thereby allowing the heat sinks in the storage bin 430 to rise above the upper edge of the storage bin 430, so as to facilitate the removal of the heat sinks.

[0063] According to the assembly apparatus provided in the embodiments of this application, the patching mechanism 400 may include a flipping component 440 and a picking component 410 (e.g., the picking component 410 described above). The picking component 410 is used to pick up the heat sink. The flipping component 440 is disposed on the outside of a plurality of side-by-side storage bins 430. The picking component 410 is configured to pick up the heat sink to the flipping component 440. The flipping component 440 is used to flip the heat sink.

[0064] According to the assembly apparatus provided in the embodiments of this application, a flipping component 440 is provided to flip the heat sink taken out of the storage bin 430. This allows the heat sink to be stacked in the storage bin 430 with the side with the film facing down, thereby preventing the film on the heat sink from accidentally falling off.

[0065] In one embodiment, the flipping assembly 440 may have a flipping plate, on which an adsorption component, such as a suction cup 414, may be provided. This adsorption component can be connected to an external vacuum device to adsorb the heat sink on it. In another embodiment, the flipping assembly 440 may further include a connecting rod assembly disposed on at least one side of the flipping plate. The connecting rod assembly is hinged to the flipping plate and can be driven by a motor, thereby causing the flipping plate and the heat sink located thereon to flip together. During this process, the side of the heat sink that was originally facing upwards becomes the side that faces downwards, thus causing the heat sink to flip.

[0066] In this embodiment, a lifting platform 450 may be provided on the side of the flipping assembly 440 (i.e., the flipping platform) opposite to the storage bin 430. The lifting platform 450 may include a lifting plate and a linear drive assembly for driving the lifting plate to move up and down, such as a lead screw nut or a linear motor. After the heat sink is flipped, the lifting platform 450 can adjust the height of the heat sink to facilitate the subsequent film-tearing action on the heat sink.

[0067] According to the assembly apparatus provided in the embodiments of this application, the assembly apparatus may further include a patching mechanism 400. The patching mechanism 400 may include a material picking component 410 (e.g., the material picking component 410 described above) and a film peeling component 420. The material picking component 410 is used to pick up the heat sink, and the film peeling component 420 may include a clamping member. The clamping member may be configured to clamp the film on the heat sink, and the clamping member is also configured to be movable relative to the heat sink to separate the film from the heat sink.

[0068] In this embodiment, the film on the heat sink is held by a clamping member in the film-peeling assembly 420. By utilizing the movement of the clamping member relative to the heat sink, the film can be separated from the heat sink, thereby realizing the film-peeling process. In this case, the heat sink with the film peeled off can be removed from the film-peeling assembly 420 by the material-retrieving assembly 410.

[0069] In this embodiment, specifically, the material-grabbing component 410 can be used to grab the flipped heat sink on the lifting platform 450 and place it onto the film-removing component 420. After the film-removing operation is completed, the material-grabbing component 410 is used to remove the heat sink from the film-removing component 420 so that it can be attached to the locked BMS housing and PCB.

[0070] In this embodiment, the film-tearing assembly 420 may include a platform for supporting a heat sink, with a slide rail arranged along the length of the platform. The film-tearing assembly 420 includes a range-extending slide cylinder 421 that cooperates with the slide rail. A diagonal-push dual-axis cylinder 422 is provided on the range-extending slide cylinder 421. The output end of the diagonal-push dual-axis cylinder 422 may be connected to a gripper cylinder, and the output end of the gripper cylinder may be provided with grippers 423 for gripping the film on the heat sink. Thus, the grippers 423 can grip the film on the heat sink. By driving the diagonal-push dual-axis cylinder 422 to move obliquely in a direction inclined to the horizontal, the film on the heat sink is lifted by the gripper cylinder. Subsequently, with the movement along the slide rail provided by the range-extending slide cylinder 421, the film is torn off the heat sink by the grippers 423.

[0071] In this embodiment, the assembly device is further provided with an air blowing hose 460 corresponding to the film tearing assembly 420. The air blowing hose 460 can be bent to face the film tearing assembly 420, thereby blowing off the film torn off by the film tearing assembly 420. In this embodiment, the assembly device may also be provided with a waste box 424 and a recycling film drawer 425 communicating with the waste box 424 corresponding to the film tearing assembly 420, so that the film blown off by the air blowing hose 460 can be returned to the recycling film drawer 425 via the waste box 424.

[0072] According to the assembly apparatus provided in the embodiments of this application, the gripping assembly 210 may include a base 280, a first gripping member 260, an adjusting member 250, and a second gripping member 270. The first gripping member 260 is connected to the base 280 and is configured to grip a first of the BMS housing and the PCB. The adjusting member 250 is connected to the base 280 and includes a moving part configured to approach and move away from the base 280. The second gripping member 270 is connected to the moving part and can be configured to grip a second of the BMS housing and the PCB, wherein the second gripping member 270 can be driven by the moving part to extend beyond the side of the first gripping assembly 210 away from the base 280.

[0073] According to the gripping component 210 provided in the embodiments of this application, the gripping component 210 can adjust the height of the first gripping member 260 relative to the second gripping member 270 as needed, so that the gripping component 210 can adjust its own shape according to the actual situation to adapt to the gripping of the BMS housing and the gripping of the PCB.

[0074] In an embodiment, the base 280 may be formed as a plate, for example, and an adjustment member 250 may be disposed below the plate. As an example, the adjustment member 250 may be a linear drive, for example, a cylinder, and the moving part may be, for example, the piston rod of the drive. In an embodiment, the second gripping member 270 may be connected to the moving part, and in contrast, the first gripping member 260 may be connected to the lower side of the base 280 via an intermediary member.

[0075] In one embodiment, the first gripping member 260 may include a frame connected to the moving part and a plurality of suction cups 414 disposed on the frame. These suction cups 414 are the same as those mentioned above and can be connected to an external vacuum device. As an example, the second gripping member 270 may also be configured in this way, including a frame and a plurality of suction cups 414 disposed on the frame.

[0076] According to the assembly apparatus provided in the embodiments of this application, the six-axis robot 200 may include a robotic arm, and the gripping component 210 may also include a first connecting member 230 and a second connecting member 240. The first connecting member 230 is used to connect with the robotic arm, and the second connecting member 240 is used to detachably connect with the first connecting member 230.

[0077] In this embodiment, the detachable connection between the first connecting member 230 and the second connecting member 240 enables the gripping component 210 to be quickly disassembled from the robotic arm, thereby facilitating the adaptation of the six-axis robot 200 to different objects to be gripped. In this embodiment, the first connecting member 230 and the second connecting member 240 can together form a quick-change chuck, for example, the main disk and negative disk of the quick-change chuck, respectively. Furthermore, the main disk of the quick-change chuck can be connected to the robotic arm via a robot adapter 220.

[0078] According to the assembly apparatus provided in the embodiments of this application, the first loading mechanism may include a transfer component 320, which may include a placement component, a positioning component, and a sensing component 324. The placement component may be used to carry the BMS housing, and the positioning component may be configured to approach the placement component to abut the BMS housing against the placement component. The sensing component 324 may be disposed on the placement component and may be used to sense the orientation of a predetermined side of the BMS housing toward the sensing component 324.

[0079] According to the assembly apparatus provided in the embodiments of this application, the first loading mechanism can detect the orientation of the BMS housing via the transfer component 320, thereby ensuring that the BMS housing is gripped and positioned by the positioning mechanism 100 in the correct posture. In the embodiments, the transfer component 320 may include a transfer platform 321, which is used to support the BMS housing. A sensing component 324 may be provided below the transfer platform 321. The sensing component 324 can, for example, sense the distance between the surface of the BMS housing facing the sensing component 324 and the sensing component 324. Because the BMS housing has a certain depth, the distance from the sensing component 324 when the side with depth is placed on the transfer platform 321 and the side without depth is placed on the transfer platform 321 are different, thereby determining the orientation of the BMS housing. As an example, the sensing component 324 may be a proximity switch. In addition, a reflective switch 323 may be provided on the transfer platform 321 to sense that the BMS housing is held on the transfer platform 321.

[0080] In an embodiment, the positioning component may be a clamping block 322 driven by a linear drive mechanism such as a lead screw and nut mechanism. The clamping block 322 can press the BMS housing against the protrusion provided on the transfer platform 321, thereby positioning the BMS housing.

[0081] According to the assembly apparatus provided in the embodiments of this application, the assembly apparatus may further include a vision inspection mechanism and a conveying mechanism 500. The vision inspection mechanism can be used to detect the width of the PCB supplied by the second feeding mechanism. The conveying mechanism 500 can be communicatively connected to the inspection mechanism and is configured to have an adjustable width. Here, the vision inspection mechanism may be the lower CCD camera 120 mentioned above, and the conveying mechanism 500 may be, for example, a width-adjustable conveying mechanism 500. The conveying mechanism 500 can transport the assembled BMS housing and PCB to the side where the heat sink is attached. When the PCB width is known, the width of the conveying mechanism 500 can be adjusted according to the actual situation to ensure that the assembled BMS housing and PCB are transported stably.

[0082] According to an embodiment of the present application, the assembly apparatus for use includes a conveying mechanism 500, which may include a first conveyor belt 510, a second conveyor belt 520, and guide members 530. The width between the first conveyor belt 510 and the second conveyor belt 520 may be configured to be adjustable to adjust the width of the conveying mechanism 500. Multiple guide members 530 are provided along the conveying direction of the conveying mechanism 500 on both the side of the first conveyor belt 510 away from the second conveyor belt 520 and the side of the second conveyor belt 520 away from the first conveyor belt 510. The guide members 530 are configured to be rotatable.

[0083] In this embodiment, the conveying mechanism 500 can be configured as substantially side-by-side conveyor belts, each of which can be mounted on two different frames. The aforementioned guide member 530 can be a rolling element, such as a bearing, and more specifically, a plastic bearing. The plastic bearing can be rotatably mounted on the frame to guide the assembled BMS housing and PCB. In this embodiment, a width adjustment mechanism 550, such as a lead screw and nut mechanism, can be provided between the two frames. The two frames can be connected to two nuts respectively, and the threads of the two nuts can be opposite, thereby allowing the two frames to move closer to or further away from each other, thus adjusting the width of the conveying mechanism 500.

[0084] In this embodiment, the aforementioned positioning mechanism 100 can be provided on the upstream side of the conveying mechanism 500. The assembled BMS housing and PCB can be conveyed downstream of the conveying mechanism 500 along its conveying direction. Downstream of the conveying mechanism 500, between the two conveyor belts, a blocking mechanism 540 and a lifting positioning mechanism 100 can be provided. The blocking mechanism 540 extends from between the two conveyor belts to block the assembled BMS housing and PCB. The lifting positioning mechanism 100 can include a lifting platform 450 and a lifting drive assembly. The lifting drive assembly can be a linear drive assembly, such as a lead screw, cylinder, or linear motor. The lifting positioning mechanism 100 can lift the assembled BMS housing and PCB to detach them from the conveying mechanism 500, allowing the heat sink application operation to continue.

[0085] The above are merely preferred embodiments of this application and do not limit the scope of protection of this application. Any equivalent structural transformations made based on the innovative concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. An assembly apparatus, characterized in that, The assembly device includes: A first feeding mechanism and a second feeding mechanism, wherein the first feeding mechanism is used to supply the BMS housing and the second feeding mechanism is used to supply the PCB; A six-axis robot and a positioning mechanism, wherein the six-axis robot includes a gripping component, the positioning mechanism includes a carrying component, a second feeding mechanism is used to supply PCB to the positioning mechanism, and the gripping component is used to grip the BMS housing onto the carrying component and assemble it with the PCB; A locking mechanism, comprising a three-axis module and a locking component connected to and driven by the three-axis module, the locking component being used to lock the BMS housing and the PCB; The crawling component includes: Base; A first gripping member is connected to the base, and the first gripping member is configured to grip the BMS housing and the first one in the PCB; An adjusting member is connected to the base, the adjusting member including a movable part configured to move toward and away from the base; A second gripping member is connected to the moving part and is configured to grip the second of the BMS housing and the PCB, wherein the second gripping member is driven by the moving part to extend beyond the side of the first gripping member away from the base. The adjusting member is disposed below the base, the first gripping member is disposed below the base, and the second gripping member is disposed below the base. The height of the first gripping member relative to the second gripping member is adjustable, thereby enabling the gripping assembly to adjust its shape according to actual conditions to adapt to the gripping of the BMS housing and the PCB.

2. The assembly apparatus according to claim 1, characterized in that, The assembly device further includes a patching mechanism, which includes a pick-up component for picking up heat sinks. The pick-up component includes a pick-up body and a pressure sensor. The pressure sensor is disposed on the pick-up body and is used to detect the pressure exerted by the pick-up component on the locked BMS housing and the PCB.

3. The assembly apparatus according to claim 1, characterized in that, The assembly device further includes a patching mechanism, which includes multiple storage bins arranged side by side. Each storage bin is used to store stacked heat sinks. The patching mechanism also includes a lifting mechanism corresponding to each storage bin. Each lifting mechanism is located at the bottom of the corresponding storage bin to support and lift the stacked heat sinks.

4. The assembly apparatus according to claim 3, characterized in that, The bottom of each of the storage bins is configured as a base plate for supporting stacked heat sinks. The base plate is connected to a corresponding lifting mechanism, which is a linear drive mechanism, so that the heat sinks in each of the storage bins can be raised above the upper edge of the storage bin.

5. The assembly apparatus according to claim 3, characterized in that, The patching mechanism includes a flipping component and a picking component. The picking component is used to pick up the heat sink. The flipping component is located outside the plurality of side-by-side storage bins. The picking component is configured to pick up the heat sink and place it onto the flipping component. The flipping component is used to flip the heat sink.

6. The assembly apparatus according to claim 5, characterized in that, The flipping assembly includes a flipping plate and an adsorption member. The adsorption member is disposed on the flipping plate and is used to adsorb the heat sink. The flipping assembly also includes a connecting rod assembly disposed on at least one side of the flipping plate. The connecting rod assembly is hinged to the flipping plate and is configured to be driven so that the flipping plate and the heat sink located on the flipping plate flip together.

7. The assembly apparatus according to claim 1, characterized in that, The assembly apparatus further includes a patching mechanism, which includes a material picking component and a film peeling component. The material picking component is used to pick up a heat sink, and the film peeling component includes a clamping member configured to clamp the film on the heat sink. The clamping member is also configured to move relative to the heat sink to separate the film from the heat sink.

8. The assembly apparatus according to claim 7, characterized in that, The film-tearing assembly further includes a range-extending slide cylinder, an inclined push cylinder, and a gripper cylinder. The inclined push cylinder is disposed on the range-extending slide cylinder, and the gripper cylinder is disposed at the output end of the inclined push cylinder. The gripper cylinder is disposed at the output end of the gripper cylinder. The inclined push cylinder can push the gripper cylinder to move along an oblique direction that is inclined to the horizontal direction, so as to drive the gripper cylinder to separate the film from the heat sink.

9. The assembly apparatus according to claim 7, characterized in that, The assembly device is also provided with an air blowing hose and a waste box corresponding to the film tearing assembly. The air blowing hose can be bent and directed toward the film tearing assembly to blow off the film torn off by the film tearing assembly. The waste box is used to collect the blown-off film.

10. The assembly apparatus according to claim 1, characterized in that, The six-axis robot includes a robotic arm, and the gripping assembly further includes a first coupling member and a second coupling member, wherein the first coupling member is used to connect to the robotic arm, and the second coupling member is used to detachably connect to the first coupling member.

11. The assembly apparatus according to claim 1, characterized in that, The first feeding mechanism includes a transfer component, which includes: Placement components are used to support the BMS housing; A positioning member configured to approach the placement member to abut the BMS housing against the placement member; A sensing component is disposed on the placement component, the sensing component being used to sense the orientation of a predetermined side of the BMS housing toward the sensing component.

12. The assembly apparatus according to claim 1, characterized in that, The assembly apparatus further includes a vision inspection mechanism and a conveying mechanism. The vision inspection mechanism is used to detect the width of the PCB supplied by the second feeding mechanism. The conveying mechanism is communicatively connected to the inspection mechanism and is configured to have an adjustable width.

13. The assembly apparatus according to claim 12, characterized in that, The conveying mechanism includes: A first conveyor belt and a second conveyor belt, the width between the first conveyor belt and the second conveyor belt being configured to be adjustable to adjust the width of the conveying mechanism; The guide members are provided on both the side of the first conveyor belt away from the second conveyor belt and the side of the second conveyor belt away from the first conveyor belt, along the conveying direction of the conveying mechanism, wherein the guide members are configured to be rotatable.

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