A multimode high-speed optical transceiver integrated module and a preparation method thereof

Abstract

The application provides a multimode high-speed optical transceiver integrated module and a preparation method thereof, and comprises a vertical cavity surface emitting laser, a photodiode, a monitoring photodiode, a DSP processor, a PCBA circuit board, a lens module, an attenuation sheet, a jumper connector, a TX optical fiber adapter and a RX optical fiber adapter, two sides of the lens module are respectively used for setting a TX end and a RX end, the vertical cavity surface emitting laser and the monitoring photodiode are arranged below the TX end, the photodiode is arranged below the RX end, and the photodiode is arranged in a matched mode with the vertical cavity surface emitting laser; the jumper connector is connected to the TX optical fiber adapter and the RX optical fiber adapter through optical fibers; the application can greatly reduce the size and occupied space of the product, reduce the thermal expansion of the product, effectively reduce the mold opening and processing cost, simplify the coupling and preparation process of the product, and has high working efficiency and strong flexibility.

Description

Technical Field

[0001] This invention relates to an optical transceiver module, more particularly to a multimode high-speed optical transceiver integrated module, and further to a method for fabricating the multimode high-speed optical transceiver integrated module. Background Technology

[0002] Currently, most optical transceiver modules use separate plastic lenses for coupling the transmitter (TX) and receiver (RX), followed by adhesive dispensing and curing. While this separate coupling method is simple and easy to implement, it requires separate molds for the transmitter and receiver lenses, resulting in higher costs, larger space requirements, and poorer electromagnetic interference resistance. Furthermore, the difficulty in dispensing adhesive between the transmitter (TX) and receiver (RX) further wastes space. Although some existing technologies integrate the transmitter (TX) and receiver (RX) lenses into a single plastic lens, limitations in chip selection and structural design result in a large overall module size and footprint, high thermal expansion, and difficulty in achieving proper coupling. Consequently, this approach also fails to adequately meet the practical application requirements of multimode high-speed optical transceiver modules. Summary of the Invention

[0003] The technical problem to be solved by this invention is to provide a multimode high-speed optical transceiver module with optimized overall structural design, aiming to effectively reduce its size and space occupation, reduce thermal expansion, simplify coupling, and improve its flexibility of application. Furthermore, this invention provides a method for fabricating the multimode high-speed optical transceiver module, making the fabrication process simpler and more efficient, and reasonably reducing its production cost.

[0004] To address this issue, the present invention provides a multimode high-speed optical transceiver module, comprising: a vertical-cavity surface-emitting laser (VCSEL), a photodiode, a monitoring photodiode, a DSP processor, a PCBA circuit board, a lens module, an attenuator, a patch cord connector, a TX fiber optic adapter, and an RX fiber optic adapter. The lens module has a TX end and an RX end on its two sides, respectively. The VCSEL and the monitoring photodiode are positioned below the TX end, and the photodiode is positioned below the RX end, with the photodiode being configured in conjunction with the VCSEL. The DSP processor is located at one end of the VCSEL and the photodiode and is mounted on the PCBA circuit board. The attenuator is positioned at a slot in the lens module and is located between the lens module and the patch cord connector. The patch cord connector is softly connected to the TX fiber optic adapter and the RX fiber optic adapter via optical fibers. At the TX end, the diverging light emitted by the vertical cavity surface emitter is converted into parallel light by the first TX lens. 95% of the parallel beam is totally reflected after passing through the first inclined plane and then reaches the second TX lens. This portion of the parallel beam is then converted into converging light, and the converged beam passes through the attenuator and converges into the optical fiber. The remaining 5% of the parallel light undergoes three total internal reflections through the second inclined plane, the upper plane, and the third inclined plane, and then undergoes one refraction through the lower plane to reach the monitoring photodiode. At the RX end, divergent light is emitted from the optical fiber of the RX fiber adapter. The divergent light is converted into parallel light after passing through the second RX lens. The parallel light is then reflected by the fourth inclined plane and reaches the first RX lens. The first RX lens converts the parallel light into converging light. After the converging light reaches the photosensitive surface of the photodiode, the photodiode converts the converging light into a current signal.

[0005] A further improvement of the present invention is that the lens module includes two sets of channels arranged in parallel. The first set of channels uses a vertical cavity surface emission laser with a height of 200 μm and a photodiode with a height of 150 μm, and the second set of channels uses a vertical cavity surface emission laser with a height of 150 μm and a photodiode with a height of 150 μm. In both sets of channels, the center distance between the lens ends of the TX end and the RX end is 2.5 mm.

[0006] A further improvement of the present invention is that the first inclined surface is connected to the upper plane through the second inclined surface, the angle between the first inclined surface and the horizontally placed surface is 45°, and the angle between the second inclined surface and the horizontally placed surface is 60°.

[0007] A further improvement of the present invention is that the third inclined surface is disposed at the end of the upper plane away from the second inclined surface, and the angle between the third inclined surface and the vertical line is 34°.

[0008] A further improvement of the present invention is that the optical fibers at both the TX and RX ends are APC optical fibers at an 8° angle to the vertical line.

[0009] A further improvement of the present invention is that the fourth inclined surface is disposed horizontally at the end of the second RX lens away from the optical fiber and vertically above the first RX lens; the first RX lens is disposed above the photodiode, and the angle between the fourth inclined surface and the horizontal placement surface is 45°.

[0010] A further improvement of the present invention is that both the TX fiber optic adapter and the RX fiber optic adapter are metal adapters.

[0011] This invention also provides a method for fabricating a multimode high-speed optical transceiver module, used to fabricate the multimode high-speed optical transceiver module as described above, and includes the following steps: Step S1: The vertical cavity surface-emitting laser, photodiode, monitoring photodiode, and DSP processor are mounted and connected to the PCBA circuit board according to preset positions. During the mounting process, the center distance between the vertical cavity surface-emitting laser and the photodiode is controlled to be 2.5 mm, and the center distance between the vertical cavity surface-emitting laser and the monitoring photodiode is controlled to be 1.15 mm. Step S2: The attenuation plate is attached to the slotted position of the lens module, and the slotted position is located on the side of the lens module near the jumper connector; Step S3: Insert the patch cord connector, which is integrated with the TX fiber optic adapter and the RX fiber optic adapter, into the lens module and fix it with adhesive. Step S4: The lens module is held in place by the upper clamp and the PCBA circuit board is fixed by the lower clamp, thereby achieving coupling and fixing of the lens module.

[0012] A further improvement of the present invention is that step S4 includes the following sub-steps: Step S401: Insert the fiber optic patch cord into the adapter, hold the lens module with the upper clamp, hold both sides of the PCBA circuit board with the lower clamp, and power on the PCBA circuit board; Step S402: Control the lens module to move downwards via the upper clamp, so that the first TX lens and the first RX lens of the lens module move to the light emission center of the vertical cavity surface emitter laser and the light receiving center of the photodiode, respectively, and couple to the optimal operating point; Step S403: Control the lens module to move vertically upward through the upper clamp, and apply UV glue to the bottom protrusion and the area below the edge of the lens module; Step S404: Control the lens module to move vertically downwards through the upper clamp and recouple it to the optimal working point to dry the UV adhesive and fix the lens module. Step S405: Apply black glue to both sides of the lens module and bake it dry; after passing the test, assemble the multimode high-speed optical transceiver module into the housing, and snap the TX fiber optic adapter and RX fiber optic adapter into the adapter slots of the housing.

[0013] A further improvement of the present invention is that the process of coupling the lens module to the optimal operating point is as follows: after the PCBA circuit board is powered on, the power values ​​of the TX terminal in the X and Y directions are read by software, and the current values ​​of the RX terminal in the X and Y directions are read until the maximum power value and the maximum current value are obtained, then it is determined that the optimal operating point has been coupled.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the two sides of the lens module are respectively used to set the TX end and the RX end; the vertical cavity surface-emitting laser and the monitoring photodiode are set below the TX end, and the photodiode is set below the RX end, and the photodiode is matched with the vertical cavity surface-emitting laser; the jumper connector is softly connected to the TX fiber optic adapter and the RX fiber optic adapter respectively through optical fibers. At the TX end, the positions and structures of the vertical cavity surface-emitting laser, the first TX lens, the first inclined plane, the second TX lens, the second inclined plane, the third inclined plane, and the monitoring photodiode are optimized as a whole. At the RX end, the positions and structures of the second RX lens, the fourth inclined plane, the first RX lens, and the photodiode are optimized as a whole, thereby significantly reducing the size and space occupied by the product, reducing the thermal expansion of the product, effectively reducing mold opening and processing costs, and simplifying the coupling process; the jumper connector is softly connected to the TX fiber optic adapter and the RX fiber optic adapter respectively through optical fibers, avoiding the deformation problem caused by the hard connection between the lens module and the module slot, and only requires one dispensing, resulting in high work efficiency. Building on this, the parallel arrangement of two sets of channels further enhances the product's flexibility, allowing it to adapt to a wider range of usage environments and increase its versatility. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of one embodiment of the present invention; Figure 1-1 This is a schematic cross-sectional view of the TX end according to an embodiment of the present invention; Figure 1-2 This is a schematic cross-sectional view of the RX end according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the lens module according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the lens module of one embodiment of the present invention from another perspective; Figure 4 This is a front view structural diagram of a lens module according to an embodiment of the present invention; Figure 5 This is a side view structural diagram of a lens module according to an embodiment of the present invention; Figure 6 yes Figure 5 A schematic diagram of the cross-sectional structure of AA; Figure 7 yes Figure 6 A magnified structural diagram of C; Figure 8 yes Figure 5 Schematic diagram of the cross-sectional structure of BB; Figure 9 yes Figure 8 A magnified structural diagram of D in the diagram; Figure 10 This is a rear view structural schematic diagram of a lens module according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of a parallel beam at the TX end of an embodiment of the present invention, in which the beam is split by 95% and 5% through the first inclined plane and the second inclined plane, respectively. Figure 12 This is a schematic diagram of the mounting process in step S1 of an embodiment of the present invention; Figure 13 This is a schematic diagram of the mounting process in step S2 of an embodiment of the present invention; Figure 14 This is a schematic diagram of the fixing process in step S3 of an embodiment of the present invention; Figure 15 This is a schematic diagram of the coupling process in step S4 of an embodiment of the present invention; Figure 16 This is a coupled simulation diagram of the optimal operating point of step S4 in one embodiment of the present invention; Figure 17 This is a schematic diagram of the overall structure of one embodiment of the present invention; Figure 18 This is a schematic diagram of the exploded structure of one embodiment of the present invention; Figure 19 This is a simulation diagram of electromagnetic interference resistance according to an embodiment of the present invention; Figure 20 This is a schematic diagram illustrating the test results of one embodiment of the present invention.

[0016] Figure labels: 1-Vertical cavity surface-emitting laser; 2-Photodiode; 3-Monitoring photodiode; 4-DSP processor; 5-PCBA circuit board; 6-Lens module; 601-Slot position; 602-Bottom protrusion; 7-Attenuator; 8-Patch connector; 9-TX fiber optic adapter; 10-RX fiber optic adapter; 11-First TX lens; 12-First bevel; 13-Second TX lens; 14-Fiber optic cable; 15-Second bevel; 16-Upper plane; 17-Third bevel; 18-Second RX lens; 19-Fourth bevel; 20-First RX lens; 21-Housing; 22-Adapter slot; 23-Lower plane. Implementation

[0017] In the description of this invention, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. If a technical feature is referred to as "set," "fixed," "connected," or "installed" on another technical feature, it can be directly set, fixed, or connected to the other technical feature, or it can be indirectly set, fixed, connected, or installed on the other technical feature.

[0018] In the description of this invention, the term "several" means one or more; the term "multiple" means two or more; the terms "greater than," "less than," and "exceeding" are all understood to exclude the stated number; and the terms "above," "below," and "within" are all understood to include the stated number. The terms "first," "second," etc., are understood to be used only to distinguish identical or similar technical feature names, and should not be construed as implying / indicating the relative importance of the technical features, the number of technical features, or the sequential relationship between the technical features.

[0019] In this embodiment, the names are explained first: Vertical cavity surface-emitting laser 1 is also called VCSEL; photodiode 2 is also called PD, i.e., photo diode; monitoring photodiode 3 is also called MPD, i.e., monitor photo diode; TX refers to transmitter; RX refers to receiver; Lens refers to lens, which can include all lenses; APC refers to angled physical contact; jumper connector 8 is also called jumper; DSP refers to digital signal processor; and optical fiber is also called fiber.

[0020] The preferred embodiments of the present invention will now be described in further detail with reference to the accompanying drawings.

[0021] like Figures 1 to 11 As shown, this embodiment provides a multimode high-speed optical transceiver module, including: a vertical-cavity surface-emitting laser 1, a photodiode 2, a monitoring photodiode 3, a DSP processor 4, a PCBA circuit board 5, a lens module 6, an attenuator 7, a jumper connector 8, a TX fiber optic adapter 9, and an RX fiber optic adapter 10. The lens module 6 has a TX end and an RX end on its two sides, respectively. The vertical-cavity surface-emitting laser 1 and the monitoring photodiode 3 are located below the TX end, and the photodiode 2 is located below the RX end, with the photodiode 2 being configured in conjunction with the vertical-cavity surface-emitting laser 1. The DSP processor 4 is located at one end of the vertical-cavity surface-emitting laser 1 and the photodiode 2, and is mounted on the PCBA circuit board 5. The attenuator 7 is located at a slot in the lens module 6 and is positioned between the lens module 6 and the jumper connector 8. The jumper connector 8 is softly connected to the TX fiber optic adapter 9 and the RX fiber optic adapter 10 via optical fibers 14.

[0022] This embodiment is in Figure 5 The structure of the TX terminal and its electro-optical conversion process described in this embodiment are illustrated through a cross-section of AA. See details in [link to documentation]. Figure 6 and Figure 7 The structure of the RX terminal and its photoelectric conversion process described in this embodiment are illustrated through a cross-section of BB. See details in [link to documentation]. Figure 8 and Figure 9 .

[0023] like Figure 1-1 , Figure 6 , Figure 7 and Figure 11 As shown, at the TX end, the diverging light emitted by the vertical cavity surface-emitting laser 1 is converted into parallel light by the first TX lens 11 directly above it. 95% of the parallel beam undergoes total internal reflection after passing through the first inclined plane 12 and reaches the second TX lens 13. This portion of the parallel beam is then converted into converging light, which is then focused by the attenuator 7 and converged to the optical fiber 14. The remaining 5% of the parallel light undergoes three total internal reflections through the second inclined plane 15, the upper plane 16, and the third inclined plane 17, and then undergoes one refraction through the lower plane 23 to reach the monitoring photodiode 3, thus completing the electro-optical conversion process. Similarly, in this embodiment, the first inclined plane 12, the second inclined plane 15, and the upper plane 16 are all light-reflecting surfaces. However, the angles of these reflective surfaces are different based on different reflection requirements. The lower plane 23 is a refractive surface.

[0024] like Figure 1-2 , Figure 5 , Figure 8 and Figure 9 As shown, at the RX end, divergent light is emitted from the optical fiber 14 of the RX fiber adapter 10. The divergent light is converted into parallel light after passing through the second RX lens 18. The parallel light is reflected by the fourth inclined plane 19 and then reaches the first RX lens 20. The first RX lens 20 converts the parallel light into converging light. After the converging light reaches the photosensitive surface of the photodiode 2, the photodiode 2 converts the converging light into a current signal to complete the photo-to-electricity conversion process.

[0025] It is worth noting that, such as Figure 3 , Figure 5 and Figure 10 As shown, the lens module 6 in this embodiment includes two sets of channels arranged in parallel. The first set of channels uses a 200µm high vertical-cavity surface-emitting laser 1 and a 150µm high photodiode 2, and the second set of channels uses a 150µm high vertical-cavity surface-emitting laser 1 and a 150µm high photodiode 2; and, as... Figure 5 As shown, in both sets of channels, the lens center distance between the TX end and the RX end is 2.5mm. Therefore, this embodiment can also effectively improve the flexibility of the product without changing the product size by using two sets of channels arranged in parallel, so as to adapt to more different usage environments. In practical applications, one set of channels can be selected according to actual needs, which helps to enhance the versatility of the product.

[0026] like Figure 7 As shown, in this embodiment, the first inclined surface 12 is connected to the upper plane 16 via the second inclined surface 15. The angle between the first inclined surface 12 and the horizontally placed surface is 45°, and the angle between the second inclined surface 15 and the horizontally placed surface is 60°. The third inclined surface 17 is disposed at the end of the upper plane 16 away from the second inclined surface 15, and the angle between the third inclined surface 17 and the vertical line is 34°. In this embodiment, the first inclined surface 12, the second inclined surface 15, the upper plane 16, and the third inclined surface 17 are connected sequentially, thereby enabling the electro-optical conversion process at the TX end to be well realized in a confined space. It is worth noting that these angle limitations are not conventional methods in the art, but are specifically proposed in conjunction with the specific optimized structure of this embodiment.

[0027] It is also worth noting that, for example Figure 7 and Figure 9 As shown, to match the photoelectric conversion process at the TX and RX ends, in this embodiment, the optical fibers 14 at both the TX and RX ends preferably use APC optical fibers at an 8° angle to the vertical. Figure 8 and Figure 9 As shown, in this embodiment, the fourth inclined surface 19 is horizontally disposed at the end of the second RX lens 18 away from the optical fiber 14, and vertically disposed above the first RX lens 20; the first RX lens 20 is disposed above the photodiode 2, and the angle between the fourth inclined surface 19 and the horizontal placement surface is 45°, so that the above-mentioned photo-to-electric conversion process at the RX end can be realized in a narrow space.

[0028] In this embodiment, both the TX fiber optic adapter 9 and the RX fiber optic adapter 10 are preferably metal adapters to effectively improve electromagnetic interference resistance. Figure 19 As shown, simulations using test results@18G-40GHz demonstrate that this embodiment can largely meet the requirements of the EMI protocol and effectively improve the product's electromagnetic interference immunity.

[0029] This embodiment also provides a method for fabricating a multimode high-speed optical transceiver module, used to fabricate the multimode high-speed optical transceiver module as described above, and includes the following steps: Step S1, as follows Figure 12 As shown, the vertical-cavity surface-emitting laser 1, photodiode 2, monitoring photodiode 3, and DSP processor 4 are mounted and connected to the PCBA circuit board 5 according to preset positions. These preset positions match the structure of the multimode high-speed optical transceiver module described above. During mounting, the center distance between the vertical-cavity surface-emitting laser 1 and photodiode 2 is controlled to be 2.5 mm, and the center distance between the vertical-cavity surface-emitting laser 1 and monitoring photodiode 3 is controlled to be 1.15 mm. The connection between each chip and the PCBA circuit board 5 is preferably achieved using gold wire. Step S2, as follows Figure 13 As shown, the attenuation plate 7 is attached to the slotted position 601 of the lens module 6, and the slotted position 601 is located on the side of the lens module 6 near the jumper connector 8. Step S3, as follows Figure 14 As shown, the patch cord connector 8, which is integrated with the TX fiber optic adapter 9 and the RX fiber optic adapter 10, is inserted into the lens module 6 and fixed by adhesive dispensing; the adhesive dispensing position is preferably on the two sides of the patch cord connector 8, thereby achieving structural reinforcement between the lens module 6 and the patch cord connector 8; Step S4: The lens module 6 is held in place by the upper clamp, and the PCBA circuit board 5 is fixed by the lower clamp, as shown below. Figure 15 As shown, the lens module 6 is coupled and fixed.

[0030] More specifically, step S4 in this embodiment includes the following sub-steps: Step S401: Insert the fiber optic patch cord into the adapter, preferably a metal adapter, hold the lens module 6 with the upper clamp, and hold both sides of the PCBA circuit board 5 with the lower clamp to power on the PCBA circuit board 5. Step S402: The lens module 6 is slowly moved downward by the upper clamp, so that the first TX lens 11 and the second RX lens 18 of the lens module 6 are moved to the light emission center of the vertical cavity surface-emitting laser 1 and the light receiving center of the photodiode 2, respectively, that is, moved to the vicinity of the lens focal point and coupled to the optimal operating point. Step S403: Control the lens module 6 to move vertically upward through the upper clamp, and apply UV glue to the bottom protrusion 602 and the lower edge of the lens module 6; In this embodiment, the lens module 6 is provided with a bottom protrusion 602, which on the one hand facilitates the application and fixing of UV glue, and on the other hand provides a support and detection function for the PCBA circuit board 5. Step S404: Control the lens module 6 to move vertically downwards through the upper clamp and recouple it to the optimal working point to dry the UV adhesive and fix the lens module 6. Step S405: Apply black glue to both sides of the lens module 6 and bake it dry; and after passing the test, as follows... Figure 17 and Figure 18 As shown, the multimode high-speed optical transceiver module is assembled into the housing 21, and the TX fiber optic adapter 9 and RX fiber optic adapter 10 are snapped into the adapter slots 22 of the housing 21, thus obtaining the complete product.

[0031] In this embodiment, the process of coupling the lens module 6 to the optimal operating point is as follows: After the PCBA circuit board 5 is powered on, the power values ​​of the TX terminal in the X and Y directions are read by software, and the current values ​​of the RX terminal in the X and Y directions are read, such as... Figure 16 As shown, after coupling begins, values ​​appear on both the X and Y axes (i.e., the X and Y directions) and gradually increase until the maximum power and maximum current values ​​are obtained. Figure 16 The top of the flat area of ​​the curve is considered to be coupled to the optimal working point. It is worth noting that in this embodiment, the optimal working point coupling is performed twice in steps S402 and S403. This setting ensures that the product is coupled to the optimal working point before and after dispensing and fixing, thereby improving product performance.

[0032] In summary, this embodiment features an overall optimized design for the positions and structures of the vertical-cavity surface-emitting laser 1, the first TX lens 11, the first inclined plane 12, the second TX lens 13, the second inclined plane 15, the third inclined plane 17, and the monitoring photodiode 3 on the TX end. On the RX end, the positions and structures of the second RX lens 18, the fourth inclined plane 19, the first RX lens 20, and the photodiode 2 are also optimized. This significantly reduces the product's size and space requirements, minimizes thermal expansion, effectively lowers mold and processing costs, and simplifies the coupling process. The jumper connector 8 is softly connected to the TX fiber optic adapter 9 and the RX fiber optic adapter 10 via optical fiber 14, avoiding deformation problems caused by hard connections between the lenses and the module slots. Furthermore, this process requires only one dispensing operation, resulting in high efficiency.

[0033] Based on this, tests have shown that the return loss at the RX end of this embodiment can largely meet the actual production and application requirements under high and low temperatures, as detailed in the table below.

[0034]

[0035] It is worth noting that since the modulation method of the multimode high-speed optical transceiver module is PAM4 modulation, not NRZ modulation, the design and manufacturing process requirements are very high, as are the loop throughput requirements under self-transmission and self-reception. In the technical solution of this application, the coupling error can be controlled within 2~3µm, and the loop throughput can reach 98%, significantly higher than the general requirement of 86%. The sensitivity of the test results is very good, reaching -10.5dBm@5E-5 at a rate of 64G. Specifically, as shown below... Figure 20 As shown.

[0036] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A multimode high-speed optical transceiver module, characterized in that, include: The system comprises a vertical-cavity surface-emitting laser (VCSEL), a photodiode, a monitoring photodiode, a DSP processor, a PCBA circuit board, a lens module, an attenuator, a patch cord connector, a TX fiber optic adapter, and an RX fiber optic adapter. The lens module has TX and RX ends on its two sides, respectively. The VCSEL and monitoring photodiode are positioned below the TX end, and the photodiode is positioned below the RX end, with the photodiode being paired with the VCSEL. The DSP processor is located at one end of the VCSEL and photodiode and is mounted on the PCBA circuit board. The attenuator is positioned at a slot in the lens module and between the lens module and the patch cord connector. The patch cord connector is softly connected to the TX and RX fiber optic adapters via optical fibers. At the TX end, the diverging light emitted by the vertical cavity surface emitter is converted into parallel light by the first TX lens. 95% of the parallel beam is totally reflected after passing through the first inclined plane and then reaches the second TX lens. This portion of the parallel beam is then converted into converging light, and the converged beam passes through the attenuator and converges into the optical fiber. The remaining 5% of the parallel light undergoes three total internal reflections through the second inclined plane, the upper plane, and the third inclined plane, and then undergoes one refraction through the lower plane to reach the monitoring photodiode. At the RX end, divergent light is emitted from the optical fiber of the RX fiber adapter. The divergent light is converted into parallel light after passing through the second RX lens. The parallel light is reflected by total internal reflection through the fourth inclined plane and reaches the first RX lens. The first RX lens converts the parallel light into convergent light. After the convergent light reaches the photosensitive surface of the photodiode, the photodiode converts the convergent light into a current signal. The lens module includes two sets of channels arranged in parallel. The first set of channels uses a vertical cavity surface-emitting laser with a height of 200 μm and a photodiode with a height of 150 μm. The second set of channels uses a vertical cavity surface-emitting laser with a height of 150 μm and a photodiode with a height of 150 μm. In both sets of channels, the center distance between the lens ends of the TX and RX ends is 2.5 mm. The first inclined plane is connected to the upper plane through the second inclined plane, the angle between the first inclined plane and the horizontally placed surface is 45°, and the angle between the second inclined plane and the horizontally placed surface is 60°; The third inclined plane is located at the end of the upper plane away from the second inclined plane, and the angle between the third inclined plane and the vertical line is 34°.

2. The multimode high-speed optical transceiver module according to claim 1, characterized in that, Both the TX and RX ends use APC optical fibers at an 8° angle to the vertical.

3. The multimode high-speed optical transceiver module according to claim 1, characterized in that, The fourth inclined surface is horizontally disposed at the end of the second RX lens away from the optical fiber, and vertically disposed above the first RX lens; the first RX lens is disposed above the photodiode, and the angle between the fourth inclined surface and the horizontal placement surface is 45°.

4. The multimode high-speed optical transceiver module according to claim 1, characterized in that, Both the TX fiber optic adapter and the RX fiber optic adapter are metal adapters.

5. A method for fabricating a multimode high-speed optical transceiver module, characterized in that, The method for preparing the multimode high-speed optical transceiver module as described in any one of claims 1 to 4 includes the following steps: Step S1: The vertical cavity surface-emitting laser, photodiode, monitoring photodiode, and DSP processor are mounted and connected to the PCBA circuit board according to preset positions. During the mounting process, the center distance between the vertical cavity surface-emitting laser and the photodiode is controlled to be 2.5 mm, and the center distance between the vertical cavity surface-emitting laser and the monitoring photodiode is controlled to be 1.15 mm. Step S2: The attenuation plate is attached to the slotted position of the lens module, and the slotted position is located on the side of the lens module near the jumper connector; Step S3: Insert the patch cord connector, which is integrated with the TX fiber optic adapter and the RX fiber optic adapter, into the lens module and fix it with adhesive. Step S4: The lens module is held in place by the upper clamp and the PCBA circuit board is fixed by the lower clamp, thereby achieving coupling and fixing of the lens module.

6. The method for fabricating a multimode high-speed optical transceiver module according to claim 5, characterized in that, Step S4 includes the following sub-steps: Step S401: Insert the fiber optic patch cord into the adapter, hold the lens module with the upper clamp, hold both sides of the PCBA circuit board with the lower clamp, and power on the PCBA circuit board; Step S402: Control the lens module to move downwards via the upper clamp, so that the first TX lens and the first RX lens of the lens module move to the light emission center of the vertical cavity surface emitter laser and the light receiving center of the photodiode, respectively, and couple to the optimal operating point; Step S403: Control the lens module to move vertically upward through the upper clamp, and apply UV glue to the bottom protrusion and the area below the edge of the lens module; Step S404: Control the lens module to move vertically downwards through the upper clamp and recouple it to the optimal working point to dry the UV adhesive and fix the lens module. Step S405: Apply black glue to both sides of the lens module and bake it dry; After passing the test, the multimode high-speed optical transceiver module is assembled into the housing, and the TX fiber optic adapter and RX fiber optic adapter are snapped into the adapter slots of the housing.

7. The method for fabricating a multimode high-speed optical transceiver module according to claim 6, characterized in that, The process of coupling the lens module to the optimal operating point is as follows: after the PCBA circuit board is powered on, the power values ​​of the TX terminal in the X and Y directions are read by software, and the current values ​​of the RX terminal in the X and Y directions are read until the maximum power value and the maximum current value are obtained, then it is determined that the optimal operating point has been coupled.

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