Layout splitting method and system, device, storage medium

Abstract

A layout splitting method and system, device and storage medium, the method comprising: obtaining a mask layout to be split, the mask layout having a plurality of patterns; splitting the mask layout into a plurality of sub-mask layouts according to a layout splitting restriction rule, so that the plurality of patterns are distributed on different sub-mask layouts to obtain a pre-splitting result; performing a layout splitting restriction rule check on the plurality of sub-mask layouts to determine whether the patterns in the sub-mask layouts all satisfy the layout splitting restriction rule; if the patterns on the sub-mask layouts all satisfy the layout splitting restriction rule, taking the pre-splitting result as a final splitting result; if the patterns on the sub-mask layouts do not satisfy the layout splitting restriction rule, performing a local splitting process on a local area of the sub-mask layout that does not satisfy the layout splitting restriction rule to update the pre-splitting result, and returning to perform the layout splitting restriction rule check. The efficiency and accuracy of layout splitting are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and more particularly to a layout splitting method, system, device, and storage medium. Background Technology

[0002] With the continuous development of technology, higher demands are being placed on the performance and integration density of integrated circuits, which has become a rapid driving force for the research, development, and manufacturing of integrated circuits. According to Moore's Law, current integrated circuit design and manufacturing processes face challenges. Due to various limitations in photolithography technology (new light sources, photolithography lenses, photoresist), the smallest feature size achievable with a single pattern has reached its limit. Following Moore's Law, to meet the requirements of smaller chip feature sizes and continuously improving performance, MP (Multi-Patterning) technology is the most practical photolithography process for a considerable period of time to come.

[0003] As designs become increasingly larger and more complex, the requirements for the speed and accuracy of EDA tools in completing layout decomposition for very large-scale integrated circuit (VLSI) chips are becoming increasingly stringent. Summary of the Invention

[0004] The problem solved by the embodiments of the present invention is to provide a method for splitting a layout, which is beneficial to further improve the efficiency and accuracy of layout splitting.

[0005] To address the aforementioned problems, this invention provides a method for splitting a map layout, comprising: acquiring a mask layout to be split, wherein the mask layout contains multiple graphics; splitting the mask layout into multiple sub-mask layouts according to layout splitting constraint rules, such that the multiple graphics are distributed on different sub-mask layouts to obtain a pre-splitting result; performing layout splitting constraint rule checks on the multiple sub-mask layouts to determine whether all graphics in the sub-mask layouts satisfy the layout splitting constraint rules; if all graphics on the sub-mask layouts satisfy the layout splitting constraint rules, then using the pre-splitting result as the final splitting result; if the graphics on the sub-mask layouts do not satisfy the layout splitting constraint rules, then performing local splitting processing on the local areas of the sub-mask layouts that do not satisfy the layout splitting constraint rules to update the pre-splitting result, and returning to execute the layout splitting constraint rule check, wherein the local splitting processing is adapted to distribute the graphics in the sub-mask layouts that do not satisfy the layout splitting constraint rules on different sub-mask layouts.

[0006] Accordingly, embodiments of the present invention also provide a layout splitting system, comprising: an acquisition module for acquiring a mask layout to be split, wherein the mask layout contains multiple graphics; a splitting module for splitting the mask layout into multiple sub-mask layouts according to layout splitting restriction rules, such that the multiple graphics are distributed on different sub-mask layouts to obtain a pre-splitting result; an inspection module for performing layout splitting restriction rule checks on the multiple sub-mask layouts to determine whether the graphics in the sub-mask layouts all satisfy the layout splitting restriction rules; and a processing module for processing the graphics in the sub-mask layouts. The pre-splitting result is used as the final splitting result if all the graphics on the sub-mask layout meet the layout splitting constraint rules. If the graphics on the sub-mask layout do not meet the layout splitting constraint rules, the local areas of the sub-mask layout that do not meet the layout splitting constraint rules are partially split to update the pre-splitting result, and the layout splitting constraint rule check is returned to be executed. The local splitting process is adapted to distribute the graphics in the sub-mask layout that do not meet the layout splitting constraint rules on different sub-mask layouts.

[0007] Accordingly, embodiments of the present invention also provide an apparatus, including at least one memory and at least one processor, wherein the memory stores one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the layout splitting method provided in embodiments of the present invention.

[0008] Accordingly, embodiments of the present invention also provide a storage medium storing one or more computer instructions, which are used to implement the layout splitting method provided in embodiments of the present invention.

[0009] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0010] This invention provides a method for partitioning a mask layout. According to layout partitioning constraints, a mask layout is partitioned into multiple sub-mask layouts, with the multiple graphics distributed across different sub-mask layouts to obtain a pre-partitioning result. The sub-mask layouts are then checked against the layout partitioning constraints to determine if all graphics in each sub-mask layout satisfy the constraints. If a graphic on a sub-mask layout does not satisfy the constraints, a local partitioning process is performed on the local area of ​​the sub-mask layout that does not satisfy the constraints to update the pre-partitioning result. This embodiment reduces data processing by performing local partitioning on the local areas of the sub-mask layout that does not satisfy the constraints, thereby improving the efficiency and accuracy of layout partitioning while ensuring that multiple graphics distributed across different sub-mask layouts satisfy the layout partitioning constraints. Attached Figure Description

[0011] Figure 1 This is a flowchart of an embodiment of the layout splitting method of the present invention;

[0012] Figures 2 to 3 This is a schematic diagram of each step in one embodiment of the layout splitting method of the present invention;

[0013] Figure 4 This is a functional block diagram of an embodiment of the layout splitting system of the present invention;

[0014] Figure 5 This is a hardware structure diagram of an embodiment of the device provided by the present invention. Detailed Implementation

[0015] As can be seen from the background technology, the efficiency and accuracy of current map splitting need to be improved.

[0016] To address the aforementioned technical problem, embodiments of the present invention provide a method for partitioning a layout. (See reference...) Figure 1 The flowchart of an embodiment of the layout splitting method of the present invention is shown.

[0017] In this embodiment, the method for splitting the layout includes the following basic steps:

[0018] Step S1: Obtain the mask layout to be split, wherein the mask layout contains multiple graphics;

[0019] Step S2: According to the layout splitting restriction rules, the mask layout is split into multiple sub-mask layouts, so that the multiple graphics are distributed on different sub-mask layouts to obtain the pre-splitting result;

[0020] Step S3: Perform a layout splitting constraint rule check on multiple sub-mask layouts to determine whether the graphics in the sub-mask layouts all satisfy the layout splitting constraint rules;

[0021] Step S4: If all the graphics on the sub-mask layout satisfy the layout splitting restriction rules, then the pre-splitting result is taken as the final splitting result;

[0022] Step S5: If the graphic on the sub-mask layout does not satisfy the layout splitting constraint rules, then perform local splitting processing on the local area of ​​the sub-mask layout that does not satisfy the layout splitting constraint rules to update the pre-splitting result, and return to execute the layout splitting constraint rule check, wherein the local splitting processing is adapted to distribute the graphic in the sub-mask layout that does not satisfy the layout splitting constraint rules on different sub-mask layouts.

[0023] This invention provides a method for partitioning a mask layout. According to layout partitioning constraints, a mask layout is partitioned into multiple sub-mask layouts, with the multiple graphics distributed across different sub-mask layouts to obtain a pre-partitioning result. The sub-mask layouts are then checked against the layout partitioning constraints to determine if all graphics in each sub-mask layout satisfy the constraints. If a graphic on a sub-mask layout does not satisfy the constraints, a local partitioning process is performed on the local area of ​​the sub-mask layout that does not satisfy the constraints to update the pre-partitioning result. This embodiment reduces data processing by performing local partitioning on the local areas of the sub-mask layout that does not satisfy the constraints, thereby improving the efficiency and accuracy of layout partitioning while ensuring that multiple graphics distributed across different sub-mask layouts satisfy the layout partitioning constraints.

[0024] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the following description is provided in conjunction with... Figures 2 to 3 Specific embodiments of the present invention will be described in detail below.

[0025] refer to Figure 2 Step S1: Obtain the mask layout 120 to be split, wherein the mask layout 120 contains multiple graphics 121.

[0026] The mask layout 120 to be split provides the technological basis for the subsequent layout splitting step.

[0027] In this embodiment, the step of obtaining the mask layout 120 to be split includes: providing an original layout, which is composed of multiple initial layouts; and using the initial layout layer that needs to be split in the original layout as the mask layout 120 to be split.

[0028] In this embodiment, the pattern 121 is used to create a photomask, thereby using the photomask to perform photolithography to form the corresponding target structure on the wafer.

[0029] refer to Figure 3 Step S2: According to the layout splitting restriction rules, the mask layout 120 is split into multiple sub-mask layouts 110, so that the multiple graphics 121 are distributed on different sub-mask layouts 110 to obtain the pre-splitting result.

[0030] Compared to the approach of performing a single photolithography process using the mask pattern 120, this embodiment divides the mask pattern 120 into multiple sub-mask patterns 110. In the subsequent semiconductor structure formation process, multiple photolithography processes are performed using the multiple sub-mask patterns 110, which increases the process window in the photolithography process and improves the accuracy of pattern 121 transfer during the photolithography process.

[0031] In this embodiment, according to the requirements of the process window in the photolithography process, the layout splitting restriction rules include the minimum spacing requirement of adjacent graphics 121 on the same layout.

[0032] In other embodiments, the layout splitting restriction rule may also be the spacing between completely opposite graphics.

[0033] In this embodiment, the step of splitting the mask layout 120 into multiple sub-mask layouts 110 according to the layout splitting restriction rules includes: obtaining any pair of graphics 121 in the mask layout 120 that do not satisfy the layout splitting restriction rules as a relationship pair; determining the number of sub-mask layouts 110; and splitting the mask layout 120 into multiple sub-mask layouts 110 based on the number of sub-mask layouts 110 and the relationship pairs, so that graphics 121 in the same relationship pair are located in different sub-mask layouts 110.

[0034] It should be noted that before splitting the mask layout 120 into multiple sub-mask layouts 110, according to the layout splitting restriction rules, any pair of graphics 121 in the mask layout 120 that does not satisfy the layout splitting restriction rules is obtained as a relation pair. That is, any pair of graphics 121 in the mask layout 120 that does not satisfy the layout splitting restriction rules is identified in advance to form a relation pair. In the subsequent process of splitting the mask layout 120 into multiple sub-mask layouts 110, the running time of the splitting step can be reduced and the efficiency of layout splitting can be improved.

[0035] Continue to refer to Figure 3Step S3: Perform a layout splitting restriction rule check on multiple sub-mask layouts 110 to determine whether the graphics 121 in the sub-mask layouts 110 all satisfy the layout splitting restriction rules.

[0036] In this embodiment, by performing layout splitting constraint rule checks on multiple sub-mask layouts 110, graphics 121 in the sub-mask layouts 110 that do not meet the layout splitting constraint rules are obtained. This facilitates subsequent local splitting processing of graphics 121 in the sub-mask layouts 110 that do not meet the layout splitting constraint rules. Correspondingly, by performing local splitting processing on graphics 121 in the sub-mask layouts 110 that do not meet the layout splitting constraint rules, the probability of graphics 121 that do not meet the layout splitting constraint rules appearing in multiple sub-mask layouts 110 is also reduced.

[0037] Continue to refer to Figure 3 Step S4: If all the graphics 121 on the sub-mask layout 110 satisfy the layout splitting restriction rules, then the pre-splitting result is taken as the final splitting result.

[0038] Specifically, since the graphics 121 on the sub-mask layout 110 all satisfy the layout splitting restriction rules, the graphics 121 in multiple sub-mask layouts 110 are used as the final splitting result.

[0039] Continue to refer to Figure 3 Step S5: If the graphic 121 on the sub-mask layout 110 does not satisfy the layout splitting restriction rule, then perform local splitting processing on the local region 101 of the sub-mask layout 110 that does not satisfy the layout splitting restriction rule to update the pre-splitting result, and return to perform the layout splitting restriction rule check, wherein the local splitting processing is adapted to distribute the graphic 121 in the sub-mask layout 110 that does not satisfy the layout splitting restriction rule on different sub-mask layouts 110.

[0040] It should be noted that this embodiment reduces the amount of data processing by performing local splitting processing on local areas 101 of the sub-mask layout 110 that do not meet the layout splitting restriction rules. In this way, the efficiency and accuracy of layout splitting are improved while ensuring that multiple graphics 121 distributed on different sub-mask layouts 110 meet the layout splitting restriction rules.

[0041] It should also be noted that after the local splitting process, the graphics 121 that do not meet the layout splitting restriction rules are distributed on different sub-mask layouts 110. The sub-mask layouts 110 here are the sub-mask layouts 110 obtained in the pre-splitting result.

[0042] In this embodiment, the local splitting process includes: selecting the graphic 121 that does not meet the layout splitting restriction rules as the conflicting graphic 102 from the sub-mask layouts 110; determining a local region 101 based on the conflicting graphic 102, wherein the conflicting graphic 102 is located in the local region 101; and splitting the graphic 121 in the local region 101 according to the layout splitting restriction rules, so that the graphic 121 in the local region 101 is distributed on different sub-mask layouts 110.

[0043] It should be noted that by determining the local region 101 through the conflicting graphic 102, in the step of local splitting, only the graphic 121 within the local region 101 needs to be split, which reduces the running time of the local splitting step and also improves the efficiency of layout splitting.

[0044] In this embodiment, the step of determining the local region 101 based on the conflict pattern 102 includes: generating multiple sub-regions centered on the conflict pattern 102 in the sub-mask layout 110 that does not meet the layout splitting restriction rules; and taking each of the mutually separated sub-regions as the local region 101.

[0045] In other embodiments, the step of determining the local region 101 based on the conflict pattern 102 may also be as follows: in the sub-mask layout 110 that does not meet the layout splitting restriction rules, multiple sub-regions are generated with the conflict pattern 102 as the center, and the overlapping sub-regions are integrated to synthesize the local region 101.

[0046] By integrating the overlapping sub-regions to synthesize local region 101, the number of times the overlapping sub-regions are partially split is reduced, thereby improving the efficiency of layout splitting.

[0047] The shape of the local region 101 includes one or more of squares, rectangles, and circles. As an example, the shape of the local region 101 is a square.

[0048] Specifically, squares are commonly used in EDA tools for layout splitting, which helps improve the efficiency and accuracy of layout splitting.

[0049] It should be noted that the side length D1 of the local region 101 should not be too large or too small. If the side length D1 of the local region 101 is too large, that is, if there are too many graphics 121 in the local region 101, the running time of the layout splitting process is increased and the efficiency of the layout splitting is reduced in the step of locally splitting the graphics 121 in the local region 101. If the side length D1 of the local region 101 is too small, it is easy for the local region 101 to fail to completely surround the conflicting graphics 102, increasing the probability of conflicting graphics 102 appearing in the sub-mask layout 110. Therefore, in this embodiment, the side length D1 of the local region 101 is 3 micrometers to 5 micrometers.

[0050] It should be noted that, in this embodiment, after determining the local region 101 based on the conflicting graphics 102, before splitting the graphics 121 in the local region 101, the method further includes: determining an extended region 100 based on the local region 101, wherein the local region 101 is located inside the extended region 100, and the area where the local region 101 and the extended region 100 do not overlap is used as a buffer region 103, and the buffer region 103 surrounds the local region 101.

[0051] Specifically, the extended region 100 is determined by the local region 101. The local region 101 is located inside the extended region 100. That is, the graphic 121 in the local region 101 is separated from the graphic 121 outside the extended region 100 by the extended region 100. In the step of performing local splitting processing on the graphic 121 in the local region 101, the probability of generating new conflicting graphics 102 between the graphic 121 in the local region 101 and the graphic 121 outside the extended region 100 is reduced.

[0052] In this embodiment, the step of splitting the graphic 121 in the local region 101 according to the layout splitting restriction rules includes: splitting the graphic 121 in the extended region 100, and after the splitting process, ensuring that the graphic 121 in the buffer region 103 is still located in the sub-mask layout 110 corresponding to the pre-splitting result.

[0053] It should be noted that during the process of splitting the graphic 121 in the extended region 100, the graphic 121 in the buffer region 103 is still located in the sub-mask layout 110 corresponding to the pre-splitting result. That is, the buffer region 103 plays a constraining role, reducing the probability that the graphic 121 in the buffer region 103 and the graphic 121 in the local region 101 will generate new conflicting graphics 102 in the local splitting process.

[0054] In this embodiment, both the extended region 100 and the local region 101 are square in shape, and the distance D2 between the opposite sides of the extended region 100 and the local region 101 is equal. That is, when the distance D2 between the opposite sides of the extended region 100 and the local region 101 meets the layout splitting requirements, the distance D2 between the opposite sides of the extended region 100 and the local region 101 is set to be equal, so that the number of graphics in the buffer area meets the layout splitting requirements. In the step of splitting the graphics 121 in the extended region 100, the running time of layout splitting is reduced and the efficiency of layout splitting is improved.

[0055] It should be noted that the distance D2 between the opposite sides of the extended region 100 and the local region 101 should not be too large or too small. If the distance D2 is too large, it will easily lead to too many graphics 121 in the extended region 100. Consequently, in the step of splitting the graphics 121 in the extended region 100, the running time of the layout splitting process is increased, and the efficiency of the layout splitting is reduced. If the distance D2 is too small, it will easily lead to too few graphics in the buffer region 103. Consequently, in the process of locally splitting the graphics 121 in the local region 101, the constraint effect of the buffer region 103 is reduced, and the probability of generating new conflicting graphics 102 in the local splitting process is increased. Therefore, in this embodiment, the distance D2 between the opposite sides of the extended region 100 and the local region 101 is 1 micrometer to 2 micrometers.

[0056] In this embodiment, after the partial splitting process is completed, the pre-split result is updated, and the layout splitting restriction rule check is performed to determine whether the effect of the partial splitting process meets the requirements.

[0057] Correspondingly, local splitting processing and layout splitting constraint rule checks are performed iteratively until the graphics in each sub-mask layout meet the layout splitting constraint rules.

[0058] Accordingly, the present invention also provides a layout splitting system. Figure 4 This is a functional block diagram of an embodiment of the layout splitting system of the present invention.

[0059] In this embodiment, the layout splitting system 300 includes: an acquisition module 301, used to acquire a mask layout to be split, wherein the mask layout contains multiple graphics; a splitting module 302, used to split the mask layout into multiple sub-mask layouts according to layout splitting restriction rules, so that the multiple graphics are distributed on different sub-mask layouts to obtain a pre-splitting result; an inspection module 303, used to perform layout splitting restriction rule checks on the multiple sub-mask layouts to determine whether the graphics in the sub-mask layouts all satisfy the layout splitting restriction rules; and a processing module 304, used to process the sub-mask layouts... The pre-splitting result is used as the final splitting result if all the graphics on the sub-mask layout satisfy the layout splitting constraint rules. If all the graphics on the sub-mask layout satisfy the layout splitting constraint rules, the pre-splitting result is used as the final splitting result. If the graphics on the sub-mask layout do not satisfy the layout splitting constraint rules, the local areas of the sub-mask layout that do not satisfy the layout splitting constraint rules are locally split to update the pre-splitting result, and the layout splitting constraint rule check is returned to be executed. The local splitting process is adapted to distribute the graphics in the sub-mask layout that do not satisfy the layout splitting constraint rules on different sub-mask layouts.

[0060] The acquisition module 301 is used to acquire the mask layout to be split.

[0061] The mask layout to be split provides the basis for subsequent layout splitting steps.

[0062] In this embodiment, the step of obtaining the mask layout to be split includes: providing an original layout, which is composed of multiple initial layouts; and using the initial layout layer that needs to be split in the original layout as the mask layout to be split.

[0063] In this embodiment, the pattern is used to create a photomask, which is then used for photolithography to form the corresponding target structure on the wafer.

[0064] Compared to the approach of performing a single photolithography process using the mask pattern, this embodiment uses a splitting module 302 to split the mask pattern into multiple sub-mask patterns. In the subsequent semiconductor structure formation process, multiple photolithography processes are performed using multiple sub-mask patterns, which increases the process window in the photolithography process and improves the accuracy of pattern transfer in the photolithography process.

[0065] In this embodiment, according to the requirements of the process window in the photolithography process, the layout splitting restriction rules include the minimum spacing requirement between adjacent graphics on the same layout.

[0066] In other embodiments, the layout splitting restriction rule may also be the spacing between completely opposite graphics.

[0067] In this embodiment, the step of splitting the mask layout into multiple sub-mask layouts according to the layout splitting restriction rules includes: obtaining any pair of graphics in the mask layout that does not satisfy the layout splitting restriction rules as a relation pair; determining the number of sub-mask layouts; and splitting the mask layout into multiple sub-mask layouts based on the number of sub-mask layouts and the relation pairs, so that graphics in the same relation pair are located in different sub-mask layouts.

[0068] It should be noted that before splitting the mask layout into multiple sub-mask layouts, any pair of graphics in the mask layout that does not satisfy the layout splitting restriction rules is identified as a relation pair according to the layout splitting restriction rules. That is, any pair of graphics in the mask layout that does not satisfy the layout splitting restriction rules is identified in advance to form a relation pair. In the subsequent process of splitting the mask layout into multiple sub-mask layouts, the running time of the splitting step can be reduced and the efficiency of layout splitting can be improved.

[0069] The inspection module 303 checks the layout splitting constraint rules on multiple sub-mask layouts to identify graphics in the sub-mask layouts that do not meet the layout splitting constraint rules. This facilitates subsequent local splitting of these graphics in the sub-mask layouts. Correspondingly, by performing local splitting of these graphics in the sub-mask layouts, the probability of graphics that do not meet the layout splitting constraint rules appearing in multiple sub-mask layouts is also reduced.

[0070] The processing module 304 is used to process whether all the graphics in the sub-mask layout meet the layout splitting restriction rules. If all the graphics in the sub-mask layout meet the layout splitting restriction rules, the pre-splitting result is used as the final splitting result. If the graphics in the sub-mask layout do not meet the layout splitting restriction rules, the local area of ​​the sub-mask layout that does not meet the layout splitting restriction rules is locally split.

[0071] This embodiment reduces the amount of data processing by performing local splitting on local areas of the sub-mask layout that do not meet the layout splitting restriction rules. This improves the efficiency of layout splitting while ensuring that multiple graphics distributed on different sub-mask layouts meet the layout splitting restriction rules.

[0072] In this embodiment, the local splitting process includes: selecting the graphics that do not meet the layout splitting restriction rules as conflicting graphics in the sub-mask layouts; determining local regions based on the conflicting graphics, wherein the conflicting graphics are located in the local regions; and splitting the graphics in the local regions according to the layout splitting restriction rules, so that the graphics in the local regions are distributed on different sub-mask layouts.

[0073] It should be noted that by identifying local regions through the conflict graphics, the local splitting process only needs to split the graphics within the local region, which reduces the running time of the local splitting process and improves the efficiency of layout splitting.

[0074] In this embodiment, the step of determining local regions based on the conflict pattern includes: generating multiple sub-regions centered on the conflict pattern in the sub-mask layout that does not meet the layout splitting restriction rules; and taking each of the mutually separated sub-regions as local regions.

[0075] In other embodiments, the step of determining the local region based on the conflict pattern can also be as follows: in the sub-mask layout that does not meet the layout splitting restriction rules, multiple sub-regions are generated with the conflict pattern as the center, and the overlapping sub-regions are integrated to synthesize a local region.

[0076] By integrating the overlapping sub-regions to synthesize local region 101, the number of times the overlapping sub-regions are partially split is reduced, thereby improving the efficiency of layout splitting.

[0077] In this embodiment, the shape of the local region includes a square. Specifically, a square is commonly used in EDA tools for layout splitting, which helps improve the efficiency and accuracy of layout splitting.

[0078] In other embodiments, the shape of the local region may also include one or both of rectangles and circles.

[0079] It should be noted that the side length of the local region should not be too large or too small. If the side length of the local region is too large, that is, if there are too many graphics in the local region, the running time of the layout splitting process is increased and the efficiency of layout splitting is reduced in the step of locally splitting the graphics in the local region. If the side length of the local region is too small, it may easily lead to the local region not being able to completely surround the conflicting graphics, increasing the probability of conflicting graphics appearing in the sub-mask layout. Therefore, in this embodiment, the side length of the local region is 3 micrometers to 5 micrometers.

[0080] It should be noted that, in this embodiment, after determining the local region based on the conflicting graphics, before splitting the graphics in the local region, the method further includes: determining an extended region based on the local region, wherein the local region is located inside the extended region, and the area where the local region and the extended region do not overlap is used as a buffer region, and the buffer region surrounds the local region.

[0081] Specifically, the extended region is determined by the local region, which is located inside the extended region. That is, the graphics in the local region are separated from the graphics outside the extended region by the extended region. In the step of performing local splitting processing on the graphics in the local region, the probability of generating new conflicting graphics between the graphics in the local region and the graphics outside the extended region is reduced.

[0082] In this embodiment, the step of splitting the graphics in the local area according to the layout splitting restriction rules includes: splitting the graphics in the extended area, and after the splitting process, ensuring that the graphics in the buffer area are still located in the sub-mask layout corresponding to the pre-splitting result.

[0083] It should be noted that during the process of splitting the graphics in the extended region, the graphics in the buffer region are still located in the sub-mask layout corresponding to the pre-splitting result. That is, the buffer region plays a constraining role, reducing the probability of new conflicting graphics being generated between the graphics in the buffer region and the graphics in the local region during the local splitting process.

[0084] In this embodiment, both the extended region and the local region are square in shape, and the distance between the opposite sides of the extended region and the local region is equal. That is, when the distance between the opposite sides of the extended region and the local region meets the layout splitting requirements, by setting the distance between the opposite sides of the extended region and the local region to be equal, the number of graphics in the buffer region meets the layout splitting requirements. In the step of splitting the graphics in the extended region, the running time of layout splitting is reduced and the efficiency of layout splitting is improved.

[0085] It should be noted that the distance between the relative edges of the extended region and the local region should not be too large or too small. If the distance is too large, it will easily lead to too many graphics in the extended region, which will increase the running time and reduce the efficiency of the layout splitting process during the splitting of graphics in the extended region. If the distance is too small, it will easily lead to too few graphics in the buffer region, which will reduce the constraint effect of the buffer region during the local splitting process, increasing the probability of generating new conflicting graphics during the local splitting process. Therefore, in this embodiment, the distance between the relative edges of the extended region and the local region is 1 micrometer to 2 micrometers.

[0086] In this embodiment, after the partial splitting process is completed, the pre-split result is updated, and the layout splitting restriction rule check is performed to determine whether the effect of the partial splitting process meets the requirements.

[0087] Correspondingly, local splitting processing and layout splitting constraint rule checks are performed iteratively until the graphics in each sub-mask layout meet the layout splitting constraint rules.

[0088] This invention also provides a device that can implement the layout splitting method provided in this invention through the above-described layout splitting method in the form of a loading program. An optional hardware structure of the terminal device provided in this invention can be as follows: Figure 5 As shown, it includes: at least one processor 01, at least one communication interface 02, at least one memory 03, and at least one communication bus 04.

[0089] In this embodiment, the number of processor 01, communication interface 02, memory 03, and communication bus 04 is at least one, and the processor 01, communication interface 02, and memory 03 communicate with each other through communication bus 04. Communication interface 02 can be an interface of a communication module for network communication, such as the interface of a GSM module. Processor 01 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present invention. Memory 03 may include high-speed RAM and may also include non-volatile memory (NVM), such as at least one disk storage device. Memory 03 stores one or more computer instructions, which are executed by processor 01 to implement the layout splitting method provided in this embodiment of the present invention.

[0090] This invention also provides a storage medium storing one or more computer instructions for implementing the layout splitting method provided in this invention.

[0091] Embodiments of the present invention can be implemented by various means, such as hardware, firmware, software, or combinations thereof. In a hardware configuration, the method according to an exemplary embodiment of the present invention can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, etc. In a firmware or software configuration, embodiments of the present invention can be implemented in the form of modules, processes, functions, etc. Software code can be stored in memory units and executed by a processor. The memory units are located inside or outside the processor and can send data to and receive data from the processor via various known means.

[0092] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A method for splitting a map, characterized in that, include: Obtain the mask layout to be split, wherein the mask layout contains multiple graphics; According to the layout splitting restriction rules, the mask layout is split into multiple sub-mask layouts, so that the multiple graphics are distributed on different sub-mask layouts to obtain the pre-splitting result; A layout splitting constraint rule check is performed on multiple sub-mask layouts to determine whether all the graphics in the sub-mask layouts satisfy the layout splitting constraint rules; If all the graphics on the sub-mask layout satisfy the layout splitting constraint rules, then the pre-splitting result is taken as the final splitting result; If the graphic on the sub-mask layout does not meet the layout splitting restriction rules, then the local area of ​​the sub-mask layout that does not meet the layout splitting restriction rules is partially split to update the pre-splitting result, and then the layout splitting restriction rule check is returned to be performed. The partial splitting process is adapted to distribute the graphic in the sub-mask layout that does not meet the layout splitting restriction rules on different sub-mask layouts. The local splitting process includes: selecting the graphics that do not meet the layout splitting restriction rules as conflicting graphics in the sub-mask layouts; determining local regions based on the conflicting graphics, wherein the conflicting graphics are located in the local regions; and splitting the graphics in the local regions according to the layout splitting restriction rules, so that the graphics in the local regions are distributed on different sub-mask layouts. The step of determining local regions based on the conflict pattern includes: generating multiple sub-regions centered on the conflict pattern in the sub-mask layout that does not meet the layout splitting restriction rules; taking the mutually separated sub-regions as local regions; and / or integrating the mutually overlapping sub-regions to synthesize local regions. After determining the local region based on the conflicting graphics, before splitting the graphics in the local region, the method further includes: determining an extended region based on the local region, wherein the local region is located inside the extended region, and the region where the local region and the extended region do not overlap is used as a buffer region, and the buffer region surrounds the local region; according to the layout splitting restriction rules, the step of splitting the graphics in the local region includes: splitting the graphics in the extended region, and after the splitting process, ensuring that the graphics in the buffer region are still located in the sub-mask layout corresponding to the pre-splitting result.

2. The method for splitting a layout as described in claim 1, characterized in that, The shape of the local area includes one or more of squares, rectangles, and circles.

3. The method for splitting a layout as described in claim 2, characterized in that, The local region is square in shape, and the side length of the local region is 3 to 5 micrometers.

4. The method for splitting a layout as described in claim 2, characterized in that, Both the extended region and the local region are square in shape, and the distance between the opposite sides of the extended region and the local region is equal.

5. The method for splitting a layout as described in claim 1, characterized in that, The distance between the opposite edges of the extended region and the local region is 1 micrometer to 2 micrometers.

6. The method for splitting a layout as described in claim 1, characterized in that, The step of splitting the mask layout into multiple sub-mask layouts according to the layout splitting restriction rules includes: obtaining any pair of graphics in the mask layout that does not satisfy the layout splitting restriction rules as a relation pair according to the layout splitting restriction rules; Determine the number of sub-mask layouts; Based on the number of sub-mask layouts and the relationship pairs, the mask layout is split into multiple sub-mask layouts, so that the graphics in the same relationship pair are located in different sub-mask layouts.

7. The method for splitting a layout as described in claim 1, characterized in that, The map splitting restriction rules include the minimum spacing requirement for adjacent graphics on the same map.

8. A layout splitting system, characterized in that, include: The acquisition module is used to acquire the mask layout to be split, wherein the mask layout contains multiple graphics; The splitting module is used to split the mask layout into multiple sub-mask layouts according to the layout splitting restriction rules, so that the multiple graphics are distributed on different sub-mask layouts to obtain a pre-splitting result; The inspection module is used to perform layout splitting restriction rule checks on multiple sub-mask layouts to determine whether the graphics in the sub-mask layouts all meet the layout splitting restriction rules. The processing module is used to process whether all the graphics in the sub-mask layout meet the layout splitting restriction rules. If all the graphics in the sub-mask layout meet the layout splitting restriction rules, the pre-splitting result is used as the final splitting result. If the graphics in the sub-mask layout do not meet the layout splitting restriction rules, the local area of ​​the sub-mask layout that does not meet the layout splitting restriction rules is partially split to update the pre-splitting result, and the module returns to execute the layout splitting restriction rule check. The partial splitting process is adapted to distribute the graphics in the sub-mask layout that do not meet the layout splitting restriction rules on different sub-mask layouts. The local splitting process includes: selecting the graphics that do not meet the layout splitting restriction rules as conflicting graphics in the sub-mask layouts; determining local regions based on the conflicting graphics, wherein the conflicting graphics are located in the local regions; and splitting the graphics in the local regions according to the layout splitting restriction rules, so that the graphics in the local regions are distributed on different sub-mask layouts. The step of determining local regions based on the conflict pattern includes: generating multiple sub-regions centered on the conflict pattern in the sub-mask layout that does not meet the layout splitting restriction rules; taking the mutually separated sub-regions as local regions; and / or integrating the mutually overlapping sub-regions to synthesize local regions. After determining the local region based on the conflicting graphics, before splitting the graphics in the local region, the method further includes: determining an extended region based on the local region, wherein the local region is located inside the extended region, and the region where the local region and the extended region do not overlap is used as a buffer region, and the buffer region surrounds the local region; according to the layout splitting restriction rules, the step of splitting the graphics in the local region includes: splitting the graphics in the extended region, and after the splitting process, ensuring that the graphics in the buffer region are still located in the sub-mask layout corresponding to the pre-splitting result.

9. A device, characterized in that, It includes at least one memory and at least one processor, the memory storing one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the layout splitting method as described in any one of claims 1-7.

10. A storage medium, characterized in that, The storage medium stores one or more computer instructions, which are used to implement the layout splitting method as described in any one of claims 1-7.

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