Inspection substrate, substrate inspection system, and substrate inspection method

Abstract

The embodiment of the application discloses a kind of detection substrate, substrate detection system and substrate detection method, belong to display technical field.The detection substrate includes: detection module, the controlled end of the detection module is connected gate line, the input end of the detection module is connected bias line, the output end of the detection module is connected data line;Test transistor, the gate of the test transistor is connected the gate line, the source of the test transistor is connected the bias line, the drain of the test transistor is connected between the input end and the output end of the detection module.This application embodiment realizes in the case where not using X light to detection substrate is bonded test, also can find abnormal problem in time and achieve timely repair, and then improve yield.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to the detection of substrates, substrate detection systems, and substrate detection methods. Background Technology

[0002] Currently, TFT (Thin Film Transistor) detectors are increasingly used in the medical field.

[0003] When manufacturing TFT detector panels, COF (Chip On Flex, or Chip On Film) ICs (Integrated Circuits) need to be bonded onto the glass. During production, factories need to perform bonding tests on the detection substrate to improve yield. If X-ray equipment is used for testing, not only is the equipment expensive, but X-rays also emit radiation, requiring strict factory environmental conditions and personnel management, resulting in high costs. However, if X-ray testing is performed outside the factory, it is impossible to repair abnormal panels, leading to a low yield of TFT detector panels. Summary of the Invention

[0004] The main objective of this application is to provide a substrate inspection system and a substrate inspection method, which aims to enable timely detection and repair of abnormal problems without using X-rays to perform bonding tests on the substrate, thereby improving yield.

[0005] To achieve the above objectives, embodiments of this application provide a detection substrate, the detection substrate comprising:

[0006] A detection module, wherein the controlled terminal of the detection module is connected to the gate line, the input terminal of the detection module is connected to the bias line, and the output terminal of the detection module is connected to the data line;

[0007] A test transistor is provided, wherein the gate of the test transistor is connected to the gate line, the source of the test transistor is connected to the bias line, and the drain of the test transistor is connected between the input and output terminals of the detection module.

[0008] Optionally, the detection module includes a photodiode and a detection transistor, wherein the anode of the photodiode is connected to the bias line, the cathode of the photodiode is connected to the source of the detection transistor, the gate of the detection transistor is connected to the gate line, the drain of the detection transistor is connected to the data line, and the drain of the test transistor is connected to the cathode of the photodiode and the source of the detection transistor.

[0009] Optionally, when the bias line receives a positive voltage, the photodiode is turned off, and the gate line outputs a high-level signal, the detection transistor and the test transistor are turned on, and the leakage voltage on the bias line is output to the data line through the test transistor and the detection transistor.

[0010] In addition, to achieve the above objectives, this application also provides a substrate inspection system, which includes a readout integrated circuit, a gate driving circuit, a driving board, and a detection substrate as described above. The driving board is connected to the detection substrate through the readout integrated circuit and the gate driving circuit.

[0011] Optionally, the readout integrated circuit is connected to the bias line and the data line.

[0012] Optionally, the gate drive circuit is connected to the gate line.

[0013] Optionally, the driver board includes:

[0014] A logic module is connected to the detection substrate through the readout integrated circuit and the gate drive circuit. The logic module is used to transmit and receive logic signals.

[0015] A power module is connected to the readout integrated circuit, the gate drive circuit, and the logic module, and the power module is used to supply power.

[0016] A graphics algorithm module is connected to the logic module, and the graphics algorithm module is used to perform image processing on the logic signal;

[0017] A data port is provided, which is connected to the graphics algorithm module and the external display device. The data port is used to transmit image signals to the external display device to obtain the display screen.

[0018] Furthermore, to achieve the above objectives, this application also provides a substrate inspection method, which is applied to the substrate inspection system described above, and the substrate inspection method includes:

[0019] It outputs a positive voltage to the bias line and a high-level signal to the gate line;

[0020] Receive the leakage voltage from the data line, and perform image processing based on the leakage voltage to obtain the processing result;

[0021] Based on the processing results, it is determined whether the detection substrate meets the preset requirements.

[0022] Optionally, the step of determining whether the detection substrate meets the preset requirements based on the processing result includes:

[0023] The processing result is output to an external display device to obtain a display screen;

[0024] If no abnormalities are found in the displayed image, the detection substrate is determined to meet the preset requirements;

[0025] If there are abnormal points in the displayed screen, it is determined that the detection substrate does not meet the preset requirements.

[0026] Optionally, after the step of determining that the substrate does not meet the preset requirements, the substrate detection method further includes:

[0027] Locate the abnormal point in the displayed screen;

[0028] Based on the anomalies, the corresponding detection module in the detection substrate is determined;

[0029] Repair the detection transistor in the detection module.

[0030] This application proposes a substrate inspection system, a substrate inspection method, and a substrate inspection module. The substrate inspection module includes: a detection module, the controlled terminal of which is connected to a gate line, the input terminal of which is connected to a bias line, and the output terminal of which is connected to a data line; and a test transistor, the gate of which is connected to the gate line, the source of which is connected to the bias line, and the drain of which is connected between the input and output terminals of the detection module. Based on the TFT detector in related technologies, this application adds a test TFT. When a positive voltage is applied to the bias line, all TFTs are turned on, and the positive voltage of the bias line leaks to the data line through the TFTs. Furthermore, when a positive voltage is applied to the bias line, the photodiode is in the off state. This allows for timely detection and repair of abnormalities without using X-rays for bonding testing of the substrate, thereby improving yield. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a detection substrate provided in one embodiment of this application;

[0033] Figure 2This is a schematic diagram of the structure of a detection module in a detection substrate according to an embodiment of this application;

[0034] Figure 3 This is a schematic diagram of the structure of a substrate inspection system provided in one embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the structure of a drive board in a substrate detection system according to an embodiment of this application;

[0036] Figure 5 This is a schematic flowchart of a substrate testing method provided in an embodiment of this application.

[0037] Explanation of icon numbers:

[0038] 100 Detection module 200 Testing transistors G gate S Source D Drain 101 Photodiode 102 Detection transistor 10 Test substrate 20 driver board RO IC Reading out integrated circuits Gate IC Gate drive circuit 201 Logic Module 202 Power module 203 Graphics Algorithm Module 204 Data port Detailed Implementation

[0039] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that the embodiments of this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the embodiments of this application with unnecessary detail.

[0040] It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0041] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0042] Currently, TFT detectors are increasingly used in the medical field. When X-rays irradiate the object being tested, because X-rays have a short wavelength and high energy, the object being tested can only absorb a small portion of them. The X-rays will penetrate the object and irradiate the TFT detector. The TFT detector will display the image inside the object being tested based on the amount of visible light formed by the X-ray penetration.

[0043] In traditional X-ray solutions, a TFT panel acts as the detection device. The TFT collects visible light formed by X-rays passing through the object being inspected. At this time, a photodiode converts the visible light into an electrical signal. The electrical signal is collected by a Read Out Integrated Circuit (DIC) and then transmitted to the MCU (Micro Controller Unit) processor on the driver board in the form of a differential signal through an ADC (analog-to-digital converter) module. The MCU processor generates an image based on the strength of the electrical signal corresponding to different areas, and finally displays it in the form of an image, that is, the internal impression of the object being inspected.

[0044] When producing TFT detector panels, COF ICs need to be bonded onto the glass. The factory needs to test the bonding during production (to improve the factory yield). If X-ray equipment is used for testing, not only is the equipment expensive, but X-rays also emit radiation, have strict requirements for the factory environment, and require personnel management, resulting in high costs. The current practice is to use X-ray inspection at the customer's site, which leads to a lower yield of TFT detector panels and makes it impossible to repair abnormal panels.

[0045] Based on this, the present application provides a substrate inspection system and a substrate inspection method. By adding a test TFT to the TFT detector in the related art, when a positive voltage is applied to the bias line, all TFTs are turned on, and the positive voltage of the bias line will leak to the data line through the TFT. When a positive voltage is applied to the bias line, the photodiode is in the off state. This enables timely detection and repair of abnormal problems without using X-rays to perform bonding tests on the substrate, thereby improving the yield.

[0046] The detection substrate, substrate detection system, and substrate detection method provided in this application are specifically described through the following embodiments. First, the detection substrate in the embodiments of this application is described.

[0047] This application provides a detection substrate, referring to... Figure 1 , Figure 1 This is a schematic diagram of a detection substrate provided in an embodiment of this application. In this embodiment, the detection substrate includes:

[0048] The detection module 100 has a controlled terminal connected to the gate G line, an input terminal connected to the bias line, and an output terminal connected to the data line.

[0049] A test transistor 200 is used, wherein the gate G of the test transistor 200 is connected to the gate G line, the source S of the test transistor 200 is connected to the bias line, and the drain of the test transistor 200 is connected between the input and output terminals of the detection module 100.

[0050] In some feasible embodiments, the detection module 100 includes a photodiode 101 and a detection transistor 102. The anode of the photodiode 101 is connected to the bias line, the cathode of the photodiode 101 is connected to the source S of the detection transistor 102, the gate G of the detection transistor 102 is connected to the gate G line, the drain D of the detection transistor 102 is connected to the data line, and the drain of the test transistor 200 is connected to the cathode of the photodiode 101 and the source S of the detection transistor 102.

[0051] In some feasible embodiments, when the bias line receives a positive voltage, the photodiode 101 is turned off, and the gate G line outputs a high-level signal, the detection transistor 102 and the test transistor 200 are turned on, and the leakage voltage on the bias line is output to the data line through the test transistor 200 and the detection transistor 102.

[0052] It should be noted that in related technologies, X-ray irradiation is generally used to turn on the photodiode, thereby causing the positive voltage on the bias line to leak to the data line. However, in this embodiment, considering the various inconveniences of X-ray irradiation, a test TFT, i.e., test transistor 200, is added to realize the bonding test of the detection transistor 102 in the detection substrate.

[0053] This application provides a detection substrate in which the gate G of the test transistor 200 is connected to the gate line, the source S of the TFT is connected to the bias line, and the drain D is connected to the source S of the detection transistor 102. This allows both TFTs to turn on when a positive voltage is applied to the bias line, and the positive voltage of the bias line will leak through the test transistor 200 to the data line. When a positive voltage is applied to the bias line, the photodiode 101 is in the off state, thus fulfilling the testing requirements. This allows for timely detection and repair of abnormal problems without using X-rays to perform bonding tests on the detection substrate, thereby improving yield.

[0054] Furthermore, embodiments of this application also provide a substrate inspection system, referring to... Figure 3 In this embodiment, the substrate detection system includes a readout integrated circuit RO IC, a gate driving circuit Gate IC, a driver board 20, and a detection substrate 10 provided in the above embodiment. The driver board 20 is connected to the detection substrate 10 through the readout integrated circuit RO IC and the gate driving circuit Gate IC.

[0055] In some feasible embodiments, the readout integrated circuit RO IC is connected to the bias line and the data line.

[0056] In some feasible embodiments, the gate drive circuit Gate IC is connected to the gate line.

[0057] Reference Figure 4 In some feasible embodiments, the driver board 20 includes:

[0058] Logic module 201 is connected to the detection substrate 10 through the readout integrated circuit RO IC and the gate drive circuit Gate IC. The logic module 201 is used to transmit and receive logic signals.

[0059] Power module 202 is connected to the readout integrated circuit RO IC, the gate drive circuit Gate IC and the logic module 201, and the power module 202 is used to supply power.

[0060] A graphics algorithm module 203 is connected to the logic module 201, and the graphics algorithm module 203 is used to perform image processing on the logic signal.

[0061] Data port 204 is connected to the graphics algorithm module 203 and the external display device. The data port 204 is used to transmit image signals to the external display device to obtain the display screen.

[0062] It should be noted that in this embodiment, the driver board adopts an FPGA (Field Programmable Gate Array) driver board. The FPGA driver board can receive differential signals from the RO IC and perform image processing to display the image through the display panel. The specific design scheme is as follows: 1) The driver board continuously provides a positive voltage to the bias line through the readout integrated circuit RO IC, and provides a VGH (V gate high) voltage to the gate line and a VGL (V gate low) voltage to turn off the TFT through the gate driving circuit Gate IC; 2) The driver board receives the differential signal returned by the RO IC and performs image processing on the differential information; 3) The driver board displays the processed image through the data network port via HDMI on the display panel of the external display device.

[0063] As an example, in this embodiment, the display panel of the external display device can be a TN (Twisted Nematic) display panel, an IPS (In-Plane Switching) display panel, a VA (Vertical Alignment) display panel, or an MVA (Multi-Domain Vertical Alignment) display panel. Of course, it can also be other types of display panels, such as an OLED (Organic Light-Emitting Diode) display panel.

[0064] The specific structure of the detection substrate 10 in this embodiment refers to the above embodiments. Since the substrate detection system provided in this embodiment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0065] In addition, embodiments of this application also provide a substrate inspection method, referring to... Figure 5 The substrate detection method is applied to the substrate detection system provided in the above embodiments, and the substrate detection method includes steps S10 to S30.

[0066] Step S10: Output a positive voltage to the bias line and a high-level signal to the gate line;

[0067] Step S20: Receive the leakage voltage from the data line and perform image processing based on the leakage voltage to obtain the processing result;

[0068] Step S30: Based on the processing results, determine whether the detection substrate meets the preset requirements.

[0069] In some feasible embodiments, step S30 above includes:

[0070] Step S301: Output the processing result to an external display device to obtain a display screen;

[0071] Step S302: If there are no abnormal points in the displayed screen, it is determined that the detection substrate meets the preset requirements;

[0072] Step S303: If there are abnormal points in the displayed screen, it is determined that the detection substrate does not meet the preset requirements.

[0073] In some feasible embodiments, after step S303 above, the substrate detection method further includes: locating the abnormal point in the display screen; determining the corresponding detection module in the detection substrate based on the abnormal point; and repairing the detection transistor in the detection module.

[0074] It should be noted that, combining the above-mentioned detection substrate and substrate detection system, the overall test scheme of this embodiment is as follows: The detection substrate is connected to the test driver board. After the driver board is powered on, it will provide a positive voltage to the bias line through the RO IC. The driver board will provide the gate driver with the required signals (timing, VGH, VGL). The gate driver will turn on the TFTs line by line. At this time, the leakage voltage on the bias line will leak through the TFTs to the data line. The RO IC will collect the leakage voltage on the data line. The RO IC will convert the collected leakage voltage signal into a differential signal through the ADC module and send it to the FPGA. The FPGA will process the differential signal and display it on the display panel. Since the test TFTs are all in the open state, the collected leakage voltage is theoretically the same. Therefore, the final image will definitely be a white screen. If dark spots or dark lines are found on the display panel, the abnormal problem point of the TFT detector panel can be found by locating the position on the display image. Then, the abnormal problem point can be repaired. After the repair is completed, the test verification can be performed. This greatly reduces the test cost and also greatly improves the yield of the TFT detector panel.

[0075] Since the display panel proposed in this embodiment adopts all the technical solutions of all the above embodiments and belongs to the same inventive concept, this embodiment has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0076] It should be noted that the technical solutions of the various embodiments of this application can be combined with each other, but only if they are implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, the user should consider that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0077] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of the specification and drawings of this application under the concept of this application, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A detection substrate, characterized in that, The detection substrate includes: A detection module, wherein the controlled terminal of the detection module is connected to the gate line, the input terminal of the detection module is connected to the bias line, and the output terminal of the detection module is connected to the data line; A test transistor, wherein the gate of the test transistor is connected to the gate line, the source of the test transistor is connected to the bias line, and the drain of the test transistor is connected between the input and output terminals of the detection module; The detection module includes a photodiode and a detection transistor. The anode of the photodiode is connected to the bias line, the cathode of the photodiode is connected to the source of the detection transistor, the gate of the detection transistor is connected to the gate line, the drain of the detection transistor is connected to the data line, and the drain of the test transistor is connected to the cathode of the photodiode and the source of the detection transistor. When the bias line receives a positive voltage, the photodiode is turned off, and the gate line outputs a high-level signal, the detection transistor and the test transistor are turned on. The leakage voltage on the bias line is output to the data line through the test transistor and the detection transistor. Based on the leakage voltage from the data line, image processing is performed to perform bonding testing on the detection substrate without using X-rays.

2. A substrate inspection system, characterized in that, The substrate detection system includes a readout integrated circuit, a gate driving circuit, a driving board, and a detection substrate as described in claim 1, wherein the driving board is connected to the detection substrate through the readout integrated circuit and the gate driving circuit.

3. The substrate inspection system as described in claim 2, characterized in that, The readout integrated circuit is connected to the bias line and the data line.

4. The substrate inspection system as described in claim 3, characterized in that, The gate drive circuit is connected to the gate line.

5. The substrate inspection system as described in claim 2, characterized in that, The driver board includes: A logic module is connected to the detection substrate through the readout integrated circuit and the gate drive circuit. The logic module is used to transmit and receive logic signals. A power module is connected to the readout integrated circuit, the gate drive circuit, and the logic module, and the power module is used to supply power. A graphics algorithm module is connected to the logic module, and the graphics algorithm module is used to perform image processing on the logic signal; A data port is provided, which is connected to the graphics algorithm module and the external display device. The data port is used to transmit image signals to the external display device to obtain the display screen.

6. A substrate inspection method, characterized in that, The substrate detection method is applied to the substrate detection system as described in any one of claims 2 to 5, and the substrate detection method includes: It outputs a positive voltage to the bias line and a high-level signal to the gate line; Receive the leakage voltage from the data line, and perform image processing based on the leakage voltage to obtain the processing result; Based on the processing results, it is determined whether the detection substrate meets the preset requirements.

7. The substrate inspection method as described in claim 6, characterized in that, The step of determining whether the detection substrate meets the preset requirements based on the processing result includes: The processing result is output to an external display device to obtain a display screen; If there are no abnormal points in the displayed screen, the detection substrate is determined to meet the preset requirements; If there are abnormal points in the displayed screen, it is determined that the detection substrate does not meet the preset requirements.

8. The substrate inspection method as described in claim 7, characterized in that, After the step of determining that the substrate does not meet the preset requirements, the substrate detection method further includes: Locate the abnormal point in the displayed screen; Based on the anomalies, the corresponding detection module in the detection substrate is determined; Repair the detection transistor in the detection module.

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