Heat dissipation structure and electronic device

Abstract

This application discloses a heat dissipation structure and an electronic device. The heat dissipation structure includes: a multilayer heat dissipation film, which is stacked on top of each other; a telescopic member located on both sides of the multilayer heat dissipation film, which connects the multilayer heat dissipation film to each other. The telescopic member can extend and retract to drive at least part of the heat dissipation film to move, so that the multilayer heat dissipation film has a first state and a second state. In the first state, the multilayer heat dissipation film is separated from each other; in the second state, the multilayer heat dissipation film is attached to each other.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a heat dissipation structure and an electronic device. Background Technology

[0002] Currently, with the rapid development of electronic devices and communication technologies, the performance of electronic devices is constantly improving, which in turn leads to a continuous increase in power consumption. Heat dissipation of electronic devices has become a severe challenge for major manufacturers.

[0003] In related technologies, heat is transferred from high-temperature areas to low-temperature areas by attaching thermally conductive materials inside electronic devices. However, the heat dissipation efficiency is limited by the properties of the heat dissipation material itself and the heat dissipation environment. This conductive heat dissipation efficiency is also relatively low. Furthermore, this solution does not have the ability to self-adjust, making the heat dissipation efficiency of the heat dissipation structure unadjustable. Summary of the Invention

[0004] This application aims to provide a heat dissipation structure and electronic device, which at least solves one of the problems of low heat dissipation efficiency and non-adjustable heat dissipation efficiency in related technologies.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application propose a heat dissipation structure, comprising: a multilayer heat dissipation film, wherein the multilayer heat dissipation film is stacked; a telescopic member, wherein the telescopic member is located on both sides of the multilayer heat dissipation film, the multilayer heat dissipation film is connected to each other through the telescopic member, the telescopic member is capable of telescopic extension and retraction to drive at least part of the heat dissipation film to move, thereby causing the multilayer heat dissipation film to have a first state and a second state; in the first state, the multilayer heat dissipation film is separated from each other; in the second state, the multilayer heat dissipation film is attached to each other.

[0007] Secondly, embodiments of this application provide an electronic device, including a heat dissipation structure as described in any of the first aspects.

[0008] In the embodiments of this application, the heat dissipation structure includes multiple layers of heat dissipation film and telescopic members. The multiple layers of heat dissipation film are stacked together, and the telescopic members are disposed on both sides of the multiple layers of heat dissipation film and connected to the multiple layers of heat dissipation film. During the extension and retraction of the telescopic members, the multiple layers of heat dissipation film can be moved, so that the multiple layers of heat dissipation film are in a first state. In the first state, the multiple layers of heat dissipation film are separated from each other, thereby increasing the heat dissipation area and improving the heat dissipation effect. The telescopic members can also move the multiple layers of heat dissipation film, so that the multiple layers of heat dissipation film are in a second state. In the second state, the multiple layers of heat dissipation film are adhered to each other, thereby reducing the heat dissipation area and reducing the heat dissipation effect. The heat dissipation structure proposed in this application can both improve the heat dissipation effect and reduce the heat dissipation amount, so that the heat dissipation structure can be applied to different application scenarios. When it is necessary to increase the heat dissipation amount, the movement of the telescopic members can be used to move the multiple layers of heat dissipation film to separate from each other, thereby increasing the heat dissipation area and thus increasing the heat dissipation amount; when it is necessary to reduce the heat dissipation amount, the movement of the telescopic members can be used to move the multiple layers of heat dissipation film to adhere to each other, thereby reducing the heat dissipation area and thus reducing the heat dissipation amount.

[0009] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0010] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0011] Figure 1 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present application with the heat dissipation film in a first state;

[0012] Figure 2 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present application when the heat dissipation film switches from the first state to the second state;

[0013] Figure 3 This is a schematic diagram of the heat dissipation structure according to an embodiment of this application with the heat dissipation film in a second state;

[0014] Figure 4 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present application when the heat dissipation film switches from the second state to the first state;

[0015] Figure 5 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present application when the heat dissipation film switches between a first state and a second state.

[0016] Figure 6 This is a schematic diagram of the heat dissipation structure and the housing according to an embodiment of this application;

[0017] Figure 7This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0018] Figure 8 This is a schematic diagram illustrating the shape memory effect principle of a shape memory alloy part according to an embodiment of this application.

[0019] Figure label:

[0020] 1. Heat dissipation structure, 10. Heat dissipation film, 100. Heat dissipation holes, 12. Telescopic component, 14. Flexible component, 16. Thermal conductive component, 2. Housing. Detailed Implementation

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects.

[0023] In the description of this application, it should be understood that the terms "thickness", "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The following is combined Figures 1-8 This application describes a heat dissipation structure 1 and an electronic device according to embodiments thereof.

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation structure 1 according to some embodiments of this application includes: a multilayer heat dissipation film 10, the multilayer heat dissipation film 10 being stacked; a telescopic member 12, the telescopic member 12 being located on both sides of the multilayer heat dissipation film 10, the multilayer heat dissipation film 10 being connected to each other through the telescopic member 12, the telescopic member 12 being able to extend and retract to drive at least a portion of the heat dissipation film 10 to move, so that the multilayer heat dissipation film 10 has a first state and a second state; in the first state, the multilayer heat dissipation film 10 is separated from each other; in the second state, the multilayer heat dissipation film 10 is attached to each other.

[0027] In the embodiments of this application, the heat dissipation structure 1 includes a multi-layer heat dissipation film 10 and a telescopic member 12. The multi-layer heat dissipation film 10 is stacked, and the telescopic member 12 is disposed on both sides of the multi-layer heat dissipation film 10. The telescopic member 12 is connected to the multi-layer heat dissipation film 10. During the extension and retraction of the telescopic member 12, it can drive the multi-layer heat dissipation film 10 to move, so that the multi-layer heat dissipation film 10 is in a first state. In the first state, the multi-layer heat dissipation film 10 is separated from each other, thereby increasing the heat dissipation area and improving the heat dissipation effect. The telescopic member 12 can also drive the multi-layer heat dissipation film 10 to move, so that the multi-layer heat dissipation film 10 is in a second state. In the second state, the multi-layer heat dissipation film 10 is adhered to each other, thereby reducing the heat dissipation area and reducing the heat dissipation effect. The heat dissipation structure 1 proposed in this application can both improve the heat dissipation effect and reduce the heat dissipation amount, so that the heat dissipation structure 1 can be applied to different application scenarios. When it is necessary to increase the heat dissipation amount, the movement of the telescopic member 12 can cause the multi-layer heat dissipation film 10 to separate from each other, thereby increasing the heat dissipation area and thus increasing the heat dissipation amount. When it is necessary to reduce the heat dissipation amount, the movement of the telescopic member 12 can cause the multi-layer heat dissipation film 10 to stick together, thereby reducing the heat dissipation area and thus reducing the heat dissipation amount. Thus, the heat dissipation structure 1 proposed in this application has an adaptive adjustment capability.

[0028] In specific applications, when the heat dissipation structure 1 is applied to electronic devices, when the temperature of the electronic device is high, it is necessary to improve the heat dissipation effect, that is, the telescopic member 12 extends, causing the multi-layer heat dissipation film 10 to separate from each other; when the electronic device is in a low-temperature environment, in order to avoid the battery being consumed too quickly, the telescopic member 12 can cause the multi-layer heat dissipation film 10 to stick together, so that the multi-layer heat dissipation film 10 becomes a single layer, reducing the heat dissipation area, thereby reducing the heat dissipation efficiency, and preventing the battery from consuming too much power due to the low temperature.

[0029] During the extension of the telescopic component 12, the movement of the heat dissipation film 10 can also drive airflow convection, thereby improving the heat dissipation effect.

[0030] like Figures 1 to 4As shown, according to some embodiments of this application, the telescopic member 12 includes a shape memory alloy member; when the temperature value of the shape memory alloy member is greater than or equal to a first temperature threshold, the shape memory alloy member extends to switch the multilayer heat dissipation film 10 to a first state; when the temperature value of the shape memory alloy member is less than or equal to a second temperature threshold, the shape memory alloy member contracts to switch the multilayer heat dissipation film 10 to a second state; wherein, the first temperature threshold is greater than the second temperature threshold.

[0031] In this embodiment, the telescopic component 12 includes a shape memory alloy component. This component undergoes a phase change with temperature, elongating or shortening, which in turn moves the multilayer heat dissipation film 10. Specifically, when the temperature of the shape memory alloy component is greater than or equal to a first temperature threshold, the ambient temperature is high, causing the component to elongate. This elongates the multilayer heat dissipation film 10, causing it to move along the elongation direction and separate, placing it in a first state and increasing the heat dissipation area, thus improving heat dissipation. When the temperature of the shape memory alloy component is less than or equal to a second temperature threshold, the component contracts, causing the multilayer heat dissipation film 10 to move closer together, merging into a single layer and reducing the heat dissipation area, thereby minimizing heat loss.

[0032] Under normal circumstances, when the temperature is low, the battery power of electronic devices is consumed faster. At this time, the heat is beneficial to the loss of power in electronic devices, and there is no need to dissipate the heat. When the temperature is high, the heat will cause electronic devices to lag. At this time, the heat is harmful to electronic devices, and it is necessary to dissipate the heat in time.

[0033] It should be noted that the first and second temperature thresholds are the temperature values ​​at which the shape memory alloy component deforms. When the ambient temperature of the shape memory alloy component reaches the first temperature threshold, it indicates that the ambient temperature of the shape memory alloy component is relatively high. The shape memory alloy component begins to expand and elongate, causing the multi-layer heat dissipation film 10 to separate. This can accelerate heat dissipation, improve the heat dissipation effect, and avoid causing electronic devices to lag. When the ambient temperature of the shape memory alloy component drops to the second temperature threshold, it indicates that the ambient temperature of the shape memory alloy component is relatively low. The shape memory alloy component begins to contract, causing the multi-layer heat dissipation film 10 to adhere. By reducing the heat dissipation area, the amount of heat dissipation is reduced, ensuring the normal operation of electronic devices and reducing the power consumption of the battery at low temperatures.

[0034] It should be noted that, generally, different materials have different phase transition temperatures, and the first and second temperature thresholds can be set according to the actual material selected.

[0035] According to some embodiments of this application, the first temperature threshold is greater than or equal to 37°C and less than or equal to 48°C; the second temperature threshold is greater than or equal to -10°C and less than or equal to 10°C.

[0036] In this embodiment, if the first temperature threshold is too high, the shape memory alloy component will only elongate at higher temperatures, resulting in lower heat dissipation efficiency of the electronic device before deformation, which will affect the operation of the electronic device. If the second temperature threshold is set too low, it will also accelerate the power consumption of the electronic device in low-temperature environments. Therefore, setting the first temperature threshold between 37°C and 48°C and the second temperature threshold between -10°C and 10°C can improve the heat dissipation effect in time when heat dissipation is needed, and reduce the heat dissipation in time when the temperature is low, thus ensuring the reliability of the electronic device.

[0037] In practical applications, the first temperature threshold is any value among 38℃, 39℃, 40℃, 41℃, 42℃, 43℃, 44℃, 45℃, 46℃, and 47℃.

[0038] The second temperature threshold is any value among -9℃, -8℃, -7℃, -6℃, -5℃, -4℃, -3℃, -2℃, -1℃, 0℃, 1℃, 2℃, 3℃, 4℃, 5℃, 6℃, 7℃, 8℃, and 9℃.

[0039] Optionally, the height of the shape memory alloy part along the elongation direction is greater than or equal to 50 μm and less than or equal to 100 μm.

[0040] Optionally, the thickness of any heat dissipation film 10 is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0041] According to some embodiments of this application, the telescopic member 12 includes a two-way shape memory alloy member.

[0042] In this embodiment, the telescopic member 12 includes a two-way shape memory alloy component, which enables the telescopic member 12 to extend and shorten.

[0043] Understandably, the recovery effect of the two-way shape memory effect applies to the entire temperature change process. When the temperature drops, it can be restored to the shape before the temperature rises, and the deformation can be repeated cyclically.

[0044] According to some embodiments of this application, shape memory alloy parts include titanium-nickel alloy parts.

[0045] In this embodiment, the shape memory alloy part includes a titanium-nickel alloy part. The nickel-titanium alloy part has good performance, low price, and a suitable phase transition temperature, which makes it easy to determine the phase transition temperature of the shape memory alloy part.

[0046] like Figure 4As shown, according to some embodiments of this application, the heat dissipation structure 1 further includes: a flexible member 14, which covers the outside of the telescopic member 12 and is connected to the heat dissipation film 10.

[0047] In this embodiment, the heat dissipation structure 1 further includes a flexible member 14, which wraps around the outside of the telescopic member 12, so that the telescopic member 12 and the flexible member 14 are fixedly connected. Furthermore, the flexible member 14 is connected to the heat dissipation film 10, thereby realizing the connection between the heat dissipation film 10 and the telescopic member 12, without affecting the telescopic movement of the telescopic member 12.

[0048] According to some embodiments of this application, the material of the flexible element 14 is the same as the material of the heat dissipation film 10.

[0049] In this embodiment, the flexible element 14 is made of the same material as the heat dissipation film 10, which improves the connection effect between the flexible element 14 and the heat dissipation film 10 and ensures the reliability of the multilayer heat dissipation film 10 switching between the first state and the second state.

[0050] Optionally, the flexible component 14 and the heat dissipation film 10 are any one of natural graphite material, artificial graphite material, and nano-carbon material.

[0051] According to some embodiments of this application, the flexible element 14 is integrally formed with the heat dissipation film 10.

[0052] In this embodiment, the flexible member 14 and the heat dissipation film 10 are integrally formed, which improves the connection strength between the flexible member 14 and the heat dissipation film 10. At the same time, it also enables the telescopic member 12 and the heat dissipation film 10 to be integrated, ensuring the reliability of the movement of the heat dissipation film 10.

[0053] like Figures 1 to 4 As shown, according to some embodiments of this application, the heat dissipation film 10 is provided with heat dissipation holes 100; in the first state, there is a gap between adjacent heat dissipation films 10, and the heat dissipation holes 100 on adjacent heat dissipation films 10 are connected through the gap.

[0054] In this embodiment, heat dissipation holes 100 are provided on the heat dissipation film 10. When the multiple heat dissipation films 10 are separated, there are gaps between adjacent heat dissipation films 10. The heat dissipation holes 100 can connect the gaps between the multiple heat dissipation films 10, thereby allowing airflow to circulate between the multiple heat dissipation films 10 and improving heat dissipation efficiency. During the extension and retraction of the telescopic member 12, the multiple heat dissipation films 10 come closer together, and air can be discharged through the heat dissipation holes 100, achieving the adhesion of the multiple heat dissipation films 10. At the same time, during the process of the telescopic member 12 causing the multiple heat dissipation films 10 to separate or adhere, vibration can be generated, thereby enhancing air convection through the provision of heat dissipation holes 100, which helps to improve heat dissipation capacity.

[0055] Optionally, any heat dissipation film 10 may have a plurality of heat dissipation holes 100.

[0056] like Figure 6 As shown, according to some embodiments of this application, the heat dissipation structure 1 further includes: at least two heat-conducting elements 16 located on both sides of the multilayer heat dissipation film 10, and the two ends of the telescopic element 12 are connected to the heat-conducting elements 16.

[0057] In this embodiment, the heat dissipation structure 1 further includes at least two heat-conducting elements 16, which are disposed on both sides of the multilayer heat dissipation film 10 to conduct heat to the external structure and thus dissipate heat through the heat dissipation film 10. The two ends of the telescopic member 12 are connected to the heat-conducting elements 16, so that the telescopic member 12 and the heat-conducting elements 16 together surround the heat dissipation film 10 within the space formed by the two, thereby protecting the heat dissipation film 10.

[0058] In practical applications, the heat-conducting component 16 is attached to the housing 2 of the electronic device.

[0059] It should be noted that at least two heat-conducting elements 16 are disposed on both sides of the plurality of heat dissipation films 10 along the extension and retraction direction of the telescopic member 12, as shown in the figure. Figure 1 As shown.

[0060] Optionally, the telescopic members 12 located on both sides of the heat dissipation film 10 and the heat-conducting members 16 located on both sides of the heat dissipation film 10 in the telescopic direction of the telescopic members 12 enclose a cavity, and the heat dissipation film 10 is located in the cavity.

[0061] According to some embodiments of this application, the heat-conducting element 16 includes a flexible heat-conducting element; during the extension of the telescopic element 12, the flexible heat-conducting element is compressed by the telescopic element 12; during the contraction of the telescopic element 12, the flexible heat-conducting element recovers its deformation.

[0062] In this embodiment, the heat-conducting element 16 includes a flexible heat-conducting element, meaning that the heat-conducting element 16 can have a certain degree of deformation. Furthermore, both ends of the telescopic element 12 are connected to the flexible heat-conducting element. Thus, during the extension of the telescopic element 12, the flexible heat-conducting element can be compressed. During the contraction of the telescopic element 12, the flexible heat-conducting element recovers its deformation, providing deformation space for the telescopic element 12 during the next deformation. In the embodiment proposed in this application, the flexible heat-conducting element provides space for the telescopic element 12 to expand and contract, avoiding large deformation of the entire heat dissipation structure 1 due to the expansion and contraction of the telescopic element 12. This reduces the space occupied by the heat dissipation structure 1 when applied in electronic devices and also reduces the limitations of the layout of the heat dissipation structure 1 in electronic devices.

[0063] Optionally, the flexible thermal conductive element includes thermally conductive silicone or thermally conductive grease.

[0064] like Figure 5As shown, according to some embodiments of this application, the heat dissipation film 10 has three layers; in the first state, the three heat dissipation films 10 are separated from each other; in the second state, the three heat dissipation films 10 are bonded together as one layer.

[0065] In this embodiment, when the heat dissipation film 10 has three layers, the telescopic member 12 drives the three heat dissipation films 10 to move, so that the three heat dissipation films 10 are separated from each other to a first state, which increases the heat dissipation area and improves the heat dissipation efficiency; the telescopic member 12 can also drive the three heat dissipation films 10 to move, so that the three heat dissipation films 10 are bonded together into one layer, which reduces the heat dissipation area, thereby reducing the heat dissipation and reducing the power consumption rate of the battery.

[0066] It should be noted that the number of heat dissipation films 10 can be set according to the actual situation, and is not limited to the three layers proposed in this application.

[0067] According to some embodiments of this application, the telescopic member 12 includes: an elastic member located on both sides of the multilayer heat dissipation film 10 and connected to the multilayer heat dissipation film 10; a driving member connected to the elastic member for driving the elastic member to extend or retract; and a temperature detection member connected to the elastic member for detecting the temperature value of the environment in which the elastic member is located. When the temperature value is greater than or equal to a first temperature threshold, the driving member drives the elastic member to extend, so that the multilayer heat dissipation film 10 switches to a first state; when the temperature value is less than or equal to a second temperature threshold, the driving member drives the elastic member to contract, so that the multilayer heat dissipation film 10 switches to a second state, wherein the first temperature threshold is greater than the second temperature threshold.

[0068] In this embodiment, the telescopic member 12 includes an elastic member, a driving member, and a temperature detection member. The elastic member is disposed on both sides of the multilayer heat dissipation film 10 and is connected to the multilayer heat dissipation film 10. The driving member drives the elastic member to extend and retract, thereby causing the multilayer heat dissipation film 10 to move, allowing the multilayer heat dissipation film 10 to switch between a first state and a second state. The temperature detection member detects the temperature of the environment in which the elastic member is located. When the temperature of the elastic member is greater than or equal to a first temperature threshold, the ambient temperature is high, and the driving member drives the elastic member to extend, causing the multilayer heat dissipation film 10 to separate, increasing the heat dissipation area and improving heat dissipation efficiency. When the temperature of the environment in which the elastic member is located is less than or equal to a second temperature threshold, the ambient temperature is low, and the driving member drives the elastic member to contract, causing the multilayer heat dissipation film 10 to move closer together, reducing the heat dissipation area and decreasing the heat dissipation amount.

[0069] It is understandable that the driving component can be driven by a motor or by magnetic force. For example, magnets are set at both ends of the elastic component, and coils are set at the parts opposite to the two ends of the elastic component. When the temperature value of the elastic component is greater than or equal to the first temperature threshold, the coil is energized to attract the magnets, thereby causing the elastic component to elongate. When the temperature value of the elastic component is less than or equal to the second temperature threshold, the coil is de-energized or a current in the opposite direction is passed through the coil to repel the magnets, and the elastic component recovers its deformation. The multi-layer heat dissipation film 10 is then attached.

[0070] like Figure 7 As shown, this application provides an electronic device including a heat dissipation structure 1 as described in any of the above embodiments, thus possessing all the beneficial effects of the heat dissipation structure 1 in any of the above embodiments, which will not be repeated here.

[0071] like Figure 7 As shown, according to some embodiments of this application, the electronic device further includes: a housing 2, and a heat dissipation structure 1 located on at least a portion of the surface of the housing 2.

[0072] In this embodiment, the electronic device also includes a housing 2, and a heat dissipation structure 1 is disposed on at least a portion of the surface of the housing 2, so that the heat inside the electronic device is uniformly transferred to the housing 2 through the heat dissipation structure 1, and then transferred to the outside of the electronic device through the housing 2, thereby achieving heat dissipation of the electronic device. Furthermore, the electronic device can also reduce the amount of heat dissipation and slow down the battery consumption rate when the temperature is low.

[0073] Specifically, housing 2 is the rear housing of the electronic device.

[0074] Optionally, the heat-conducting element 16 of the heat dissipation structure 1 is fixed to the rear shell.

[0075] Optionally, the electronic device also includes a camera, with the housing 2 avoiding the camera.

[0076] Specifically, the heat dissipation structure 1 is located inside the housing 2. The inside of the housing 2 is the side of the housing 2 facing the battery of the electronic device.

[0077] It should be noted that electronic devices include mobile phones, tablets, wearable devices, etc.

[0078] In practical applications, this application provides a heat dissipation structure 1 (specifically, an adaptive heat dissipation structure) that can adjust heat dissipation efficiency according to temperature. When the phone's temperature is high and affects its smooth operation, the heat dissipation efficiency is increased; conversely, when the phone's temperature is low and causes the battery to drain too quickly, the heat dissipation efficiency is reduced.

[0079] Specifically, 1. Based on the effects of heat conduction and heat convection, a heat dissipation structure 1 is designed. This heat dissipation structure 1 utilizes the thermoelasticity of shape memory alloys to control the layering of multilayer heat dissipation films 10 (e.g., nano heat dissipation films) to increase the heat dissipation area.

[0080] 2. The heat dissipation structure 1 has an adaptive adjustment function. When the temperature rises, the shape memory alloy component stretches, and the nano heat dissipation film layers into a multi-layer film state, increasing the heat dissipation area and improving heat dissipation efficiency; when the temperature drops, the shape memory alloy component contracts, and the nano heat dissipation film closes into a single-layer film state, reducing the heat dissipation area and reducing heat dissipation efficiency, thereby retaining a certain amount of heat and improving battery life.

[0081] Specifically, this application places an adaptive heat dissipation structure within the back cover of the mobile phone. Based on the effects of heat conduction and convection, the heat dissipation efficiency of the heat dissipation structure 1 is improved. By utilizing the thermoelasticity of shape memory alloys (such as Ni-Ti based alloys, Cu-based alloys, and Fe-based alloys), at higher temperatures, the nano-heat dissipation film is delaminated, increasing the heat dissipation area and promoting the uniform transfer of localized heat from the inside of the phone to the back cover. Simultaneously, the heat dissipation structure 1 has an adaptive adjustment function; when the temperature decreases, the shape memory alloy contracts, closing the nano-heat dissipation film into a single-layer state, reducing the heat dissipation area and efficiency, thereby improving battery life and achieving the purpose of adaptive adjustment.

[0082] According to some embodiments of this application, the adaptive heat dissipation structure is placed in a partial or overall part of the back cover of the mobile phone, and its specific location in the whole device is as follows: Figure 7 As shown.

[0083] The adaptive heat dissipation structure consists of a multi-layered nanoporous heat dissipation film, a shape memory alloy component, and a thermally conductive component 16 (e.g., thermally conductive silicone). The nanoporous heat dissipation film is fixed to the shape memory alloy component, and both ends of the shape memory alloy component are fixed to the thermally conductive silicone. One piece of thermally conductive silicone is fixed to the back shell. Specifically, the thicknesses of each component are as follows: back shell (which can be a plastic back shell): 100μm–500μm; thermally conductive silicone layer (symmetrical at both ends): 10μm–50μm; shape memory alloy component: 50μm–100μm; nano-heat dissipation film: 0.5μm–10μm.

[0084] Nanoporous heat dissipation films are made by adding porous structures to heat dissipation films. Due to the thermoelastic effect of shape memory alloys, when the system temperature is at the phase transition point of the shape memory alloy, the shape memory alloy deforms, causing the multilayer nano heat dissipation films fixed on the shape memory alloy to separate or close, thereby generating vibration, enhancing air convection, and helping to improve heat dissipation capacity.

[0085] The structure of the nanoporous heat dissipation film and its two different states (first state: film separated state, second state: film closed state) are as follows: Figures 1 to 4 As shown.

[0086] Working principle of shape memory alloy parts:

[0087] The shape memory effect refers to the phenomenon where, when the temperature rises to a certain value, the plastic deformation of a shape memory alloy part in a low-temperature environment causes it to recover its initial shape due to the recovery stress generated within the shape memory alloy. Figure 8 As shown, M s M represents the temperature at which the martensitic phase transformation begins during the cooling process. f For: the temperature at which the martensitic phase transformation ends during the cooling process; A s A: The temperature at which the reverse martensitic transformation begins during the heating process; f For: the temperature at which the reverse martensitic transformation ends during the heating process, with the horizontal axis representing temperature and the vertical axis representing stress, σ. s To eliminate the phase transformation stress at the inception of twinned martensite, σ f To alleviate the final phase transformation stress of twinned martensite. Shape memory alloy parts are composed of a martensitic phase (low-temperature phase) and an austenitic phase (high-temperature phase), and the thermoelastic phase transformation between the two is the fundamental reason for the shape memory effect. According to the recovery effect, shape memory effects are divided into single-pass shape memory effect, two-pass shape memory effect, and full-pass shape memory effect. Among them, the recovery effect of the two-pass shape memory effect acts on the entire temperature change process; when the temperature drops, it can recover to the shape before heating, enabling cyclic deformation. Therefore, the shape memory alloy parts used in this application can be selected as two-pass shape memory alloy parts.

[0088] For two-way shape memory alloy parts, during the heating process, the temperature is higher than A. s It begins to expand; during the cooling process, the temperature drops below M. s It begins to shrink. Ni-Ti based alloys have the best performance and the widest application; this application may use a Ni-Ti based alloy, whose M... s The temperature is generally between -50℃ and 100℃, M s and A s The specific temperature is related to the chemical element content in the alloy, and a suitable M can be selected based on the chemical element content of the alloy. s and A s .

[0089] The working principle of heat dissipation structure 1 in this application is as follows: Figure 5 As shown. When the internal temperature of the entire machine rises and exceeds the A value of the shape memory alloy... s Time (A) sThe perceived heat temperature can be selected (e.g., 37℃~48℃). The shape memory alloy component is stretched to create layers of nano-heat dissipation film, resulting in a multi-layered nano-film structure, increasing the heat dissipation area and improving heat dissipation efficiency. When the overall internal temperature decreases and falls below the M value of the shape memory alloy component... s When (e.g., for outdoor use in winter, M) s The shape memory alloy parts can be selected to shrink (from -10℃ to 10℃) to close the multi-layer heat dissipation film into a single layer, thereby reducing the heat dissipation area and thus reducing the heat dissipation capacity, increasing the battery life, and achieving the purpose of adaptive adjustment.

[0090] In this design, the multilayer nanofilm consists of three layers. When the operating temperature is high (37℃~48℃), the three nanofilm layers separate to enhance heat dissipation; when the operating temperature is low (-10℃~10℃), the three nanofilm layers merge into one layer to reduce heat dissipation. The shape memory alloy component is covered by a flexible material of the same material as the heat dissipation film 10. This flexible material and the heat dissipation film 10 are integrally formed through processing, thus integrating the shape memory alloy component with the heat dissipation film 10. The heat dissipation film 10, thermally conductive silicone, etc., are all flexible materials that can undergo elastic deformation within a controllable range, and the deformation is reversible. The two ends of the shape memory alloy component are connected to the thermally conductive silicone. When the shape memory alloy component expands, it compresses the silicone; when the shape memory alloy component contracts, the silicone returns to its original shape.

[0091] The heat dissipation structure 1 proposed in this application helps to solve the problem of low heat dissipation efficiency in existing smartphones; and it has an adaptive adjustment function, which can adjust the heat dissipation according to the temperature, improve the user experience, and enhance the phone's battery life.

[0092] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0093] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation structure, characterized in that, include: A multi-layer heat dissipation film, wherein the multiple heat dissipation films are stacked together; The telescopic component is located on both sides of the multilayer heat dissipation film, and the multilayer heat dissipation film is connected to each other through the telescopic component. The telescopic component can extend and retract to drive at least part of the heat dissipation film to move, so that the multilayer heat dissipation film has a first state and a second state. The heat dissipation film is provided with heat dissipation holes, and the heat dissipation holes on adjacent heat dissipation films are staggered. When the temperature value of the telescopic component is greater than or equal to the first temperature threshold, the telescopic component causes the multiple layers of heat dissipation films to separate from each other, the multiple layers of heat dissipation films are in the first state, there is a gap between adjacent heat dissipation films, and the heat dissipation holes on adjacent heat dissipation films are connected through the gap; When the temperature value of the telescopic component is less than or equal to the second temperature threshold, the telescopic component causes the multiple layers of heat dissipation films to stick together, the multiple layers of heat dissipation films are in the second state, and the heat dissipation holes on adjacent heat dissipation films are not connected. Wherein, the first temperature threshold is greater than the second temperature threshold.

2. The heat dissipation structure according to claim 1, characterized in that, The telescopic component includes a shape memory alloy component; When the temperature value of the shape memory alloy component is greater than or equal to the first temperature threshold, the shape memory alloy component extends to allow the multilayer heat dissipation film to switch to the first state. When the temperature of the shape memory alloy component is less than or equal to the second temperature threshold, the shape memory alloy component contracts to switch the multilayer heat dissipation film to the second state.

3. The heat dissipation structure according to claim 2, characterized in that, The first temperature threshold is greater than or equal to 37°C and less than or equal to 48°C; The second temperature threshold is greater than or equal to -10℃ and less than or equal to 10℃.

4. The heat dissipation structure according to any one of claims 1 to 3, characterized in that, Also includes: A flexible component is provided, which covers the outside of the telescopic component and is connected to the heat dissipation film.

5. The heat dissipation structure according to any one of claims 1 to 3, characterized in that, Also includes: At least two heat-conducting elements are located on both sides of the multilayer heat dissipation film, and the two ends of the telescopic element are connected to the heat-conducting elements.

6. The heat dissipation structure according to claim 5, characterized in that, The heat-conducting component includes a flexible heat-conducting component; During the extension of the telescopic component, the flexible heat-conducting component is compressed by the telescopic component; during the contraction of the telescopic component, the flexible heat-conducting component recovers its deformation.

7. The heat dissipation structure according to any one of claims 1 to 3, characterized in that, The heat dissipation film consists of three layers; In the first state, the three heat dissipation films are separated from each other; In the second state, the three heat dissipation films are bonded together as one layer.

8. An electronic device, characterized in that, include: The heat dissipation structure as described in any one of claims 1 to 7.

9. The electronic device according to claim 8, characterized in that, Also includes: The housing has a heat dissipation structure located on at least a portion of its surface.

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