Method of growing high quality single crystal silicon carbide
CN117157435BActive Publication Date: 2026-08-28KISELKARBID I STOCKHOLM AB
Patent Information
- Application Number
- CN202280018977.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-03-11
- Filing Date
- 2022-02-18
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2042-02-18
AI Technical Summary
Technical Problem
然而,这对PVT方法提出了巨大的挑战,因为随着SiC直径的增加,上述生长气氛变得越来越复杂
Benefits of technology
[0021]根据本发明的该方法的一个优点在于,通过提供具有柱状微晶粒结构的单片多晶SiC作为源材料,可以从源材料中获得高度均匀且稳定的升华,并生长出几乎不含碳夹杂物缺陷的高质量单晶SiC。
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Figure CN117157435B_ABST
Abstract
A method of growing an epitaxial layer on a substrate (20) of single crystalline silicon carbide, SiC, is disclosed. The method comprises: (S100) providing a source material (10) of single crystal poly SiC having a columnar microcrystalline grain structure and a substrate (20) of single crystalline SiC in a chamber (5) of a crucible, wherein a certain distance is present between the source material and the substrate; (S102) arranging a carbon getter (1) in the chamber (5) of the crucible close to the source material (10) and the substrate (20), the carbon getter (1) having a melting point above 2200°C and the ability to form a carbide layer with carbon species evaporated from SiC; (S106) reducing the pressure in the chamber (5); (S108) injecting an inert gas into the chamber (5); (S110) increasing the temperature in the chamber (5) to a growth temperature, such that a growth rate of 1 pm / h to 1 mm / h is achieved; and (S112) maintaining the growth temperature until a growth of at least 5 pm on the substrate (20) is completed.
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Citation Information
Patent Citations
Method of producing silicon carbide epitaxial layer
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Formed SIC product and manufacturing method thereof
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