Method of growing high quality single crystal silicon carbide

CN117157435BActive Publication Date: 2026-08-28KISELKARBID I STOCKHOLM AB
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Patent Information

Application Number
CN202280018977.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-03-11
Filing Date
2022-02-18
Publication Date
2026-08-28
Estimated Expiration
2042-02-18

AI Technical Summary

Technical Problem

然而,这对PVT方法提出了巨大的挑战,因为随着SiC直径的增加,上述生长气氛变得越来越复杂

Benefits of technology

[0021]根据本发明的该方法的一个优点在于,通过提供具有柱状微晶粒结构的单片多晶SiC作为源材料,可以从源材料中获得高度均匀且稳定的升华,并生长出几乎不含碳夹杂物缺陷的高质量单晶SiC。

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Abstract

A method of growing an epitaxial layer on a substrate (20) of single crystalline silicon carbide, SiC, is disclosed. The method comprises: (S100) providing a source material (10) of single crystal poly SiC having a columnar microcrystalline grain structure and a substrate (20) of single crystalline SiC in a chamber (5) of a crucible, wherein a certain distance is present between the source material and the substrate; (S102) arranging a carbon getter (1) in the chamber (5) of the crucible close to the source material (10) and the substrate (20), the carbon getter (1) having a melting point above 2200°C and the ability to form a carbide layer with carbon species evaporated from SiC; (S106) reducing the pressure in the chamber (5); (S108) injecting an inert gas into the chamber (5); (S110) increasing the temperature in the chamber (5) to a growth temperature, such that a growth rate of 1 pm / h to 1 mm / h is achieved; and (S112) maintaining the growth temperature until a growth of at least 5 pm on the substrate (20) is completed.
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Citation Information

Patent Citations

  • Method of producing silicon carbide epitaxial layer

    US7918937B2

  • Method of Producing silicon carbide epitaxial layer

    US20090126624A1

  • Formed SIC product and manufacturing method thereof

    US6300226B1