Silicon piezoresistive hydrostatic level sensor and thermal insulation device for a pipeline and method of installation

Abstract

The application discloses a silicon piezoresistive static force level sensor and a heat preservation device and installation method of a pipeline, the heat preservation device comprises a heat preservation shell body arranged outside the sensor, and a heat preservation protective shell body is arranged outside the heat preservation shell body to protect the heat preservation shell body; a heat preservation pipe is arranged outside the pipeline, a heat preservation protective pipe is arranged outside the heat preservation pipe, the heat preservation pipe is connected with the heat preservation shell body at the end, and the heat preservation protective pipe is connected with the heat preservation protective shell body at the end. The installation method comprises the following steps: site reconnaissance and marking of a monitoring structure, drilling a hole on the surface of the structure; installing a heat preservation protective lower cover; laying a sensor pipeline; passing the pipeline into the heat preservation pipe for heat preservation; passing the heat preservation pipe into the heat preservation protective pipe for heat preservation protection; connecting and system debugging of the sensor pipeline; installing the heat preservation shell body, installing a heat preservation protective upper cover, and completing heat preservation protection of the sensor and the pipeline. The application solves the problem of heat preservation performance reduction caused by water absorption of the leaked heat preservation material, and reduces the aging rate of the heat preservation material.

Description

Technical Field

[0001] This invention belongs to the field of installation and protection of hydrostatic level sensors, specifically relating to a silicon piezoresistive hydrostatic level sensor and its pipeline insulation device and installation method. Background Technology

[0002] Silicon piezoresistive hydrostatic level sensors are sensitive to ambient temperature. When installed on the surface of a structure, the monitored data exhibits similar fluctuations to the ambient temperature, failing to accurately reflect the true deformation of the structure. Errors caused by seasonal variations and spatial differences in ambient temperature are difficult to correct effectively using temperature correction methods. Therefore, when used in structural deformation monitoring with high accuracy and real-time requirements, insulation measures must be taken for the sensors and pipelines.

[0003] Currently, the insulation measures adopted in most monitoring projects are ineffective, mainly due to the following reasons: the insulation materials used have unstable performance and a fast aging rate, and their insulation effect decreases significantly after absorbing water; the insulation structure process has defects, making it difficult to achieve complete insulation of sensors and pipelines. Summary of the Invention

[0004] This invention is proposed to solve the problems existing in the prior art, and its purpose is to provide a silicon piezoresistive hydrostatic level sensor and a thermal insulation device and installation method for pipelines.

[0005] The technical solution of the present invention is: a heat preservation device for a silicon piezoresistive hydrostatic level sensor and its pipeline, comprising a sensor and a sensor pipeline, wherein a heat preservation shell is provided outside the sensor, and a heat preservation protective shell is provided outside the heat preservation shell to protect it, a heat preservation joint is reserved on the outer wall of the heat preservation shell so that the sensor pipeline can pass through, and a heat preservation protective joint is reserved on the outer wall of the heat preservation protective shell.

[0006] Furthermore, the insulation joint is connected to the insulation pipe, and the sensor pipeline is inserted into the insulation pipe.

[0007] Furthermore, the thermal insulation joint is connected to the thermal insulation pipe, and the thermal insulation pipe is inserted into the thermal insulation pipe.

[0008] Furthermore, the heat-insulating housing includes a lower heat-insulating cover and an upper heat-insulating cover that is fastened to the lower heat-insulating cover by a heat-insulating cover buckle. The lower heat-insulating cover and the upper heat-insulating cover form a receiving cavity inside, which accommodates the sensor.

[0009] Furthermore, the insulation joint includes an upper semi-cylindrical plate and a lower semi-cylindrical plate. The upper semi-cylindrical plate is disposed on the outer wall of the upper insulation cover, and the lower semi-cylindrical plate is disposed on the outer wall of the lower insulation cover. The upper and lower semi-cylindrical plates are joined together to form a hollow cylindrical joint.

[0010] Furthermore, the lower and upper heat-insulating covers are columnar structures.

[0011] Furthermore, the thermal insulation protective shell has a rectangular structure, including a thermal insulation protective lower cover and a thermal insulation protective upper cover disposed on the thermal insulation protective lower cover. The thermal insulation protective upper cover and the thermal insulation protective lower cover form a protective cavity inside, and the protective cavity accommodates the thermal insulation shell.

[0012] Furthermore, the side walls of the thermal insulation protective upper cover and the thermal insulation protective lower cover are joined together to form a sealing ring lock.

[0013] Furthermore, a protective pipe sealing ring is provided on the outer wall of the heat-insulating protective pipe, and the protective pipe sealing ring is locked and fixed by a sealing ring buckle.

[0014] An installation method for a silicon piezoresistive hydrostatic level sensor and its pipeline insulation device includes the following steps: A. Conduct a site survey of the monitoring structure, mark the route, and drill holes on the structure surface; B. Install the thermal insulation and protective cover according to the drilled holes; C. Lay the sensor pipelines according to the wiring markings; D. Insert the sensor tubing into the insulation pipe for heat preservation; E. Insert the insulation pipe into the insulation protection pipe for insulation protection; F. After connecting the laid sensor pipeline to the sensor, perform system debugging; G. Install the insulation casing; H. Install the thermal insulation and protective cover to complete the thermal insulation and protection of the sensor.

[0015] The beneficial effects of this invention are as follows: This invention uses a modular insulated top cover and a modular insulated bottom cover to house and insulate the sensor. The insulated joints on the outer walls of the top and bottom covers allow them to connect to the insulated pipe, facilitating the entry of pipelines into the insulated pipe and thus achieving pipeline insulation.

[0016] This invention achieves sealing protection for the insulation cover by using a combination of a top and bottom insulation cover. A sealing ring is fitted onto the insulation tube, and the sealing ring is locked in place by a locking buckle, thereby achieving overall sealing. The insulation tube is then used to contain the insulation tube.

[0017] This invention solves the problem of decreased thermal insulation performance caused by external water absorption of thermal insulation materials, and at the same time reduces the aging rate of thermal insulation materials. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a disassembly diagram of the present invention; Figure 3 This is a flowchart of the method of the present invention; in: 1. Thermal insulation protective cover 2. Thermal insulation protective cover connection hole 3. Thermal insulation protective pipe; 4. Thermal insulation protective cover fixing holes 5. Thermal insulation protective cover outer eaves; 6. Thermal insulation protective lower cover. 7. Thermal insulation protective cover fixing wing; 8. Protective tube sealing ring. 9. Insulation pipe 10. Liquid passage pipe 11 Sensor 12 Sealing gasket fixing groove 13 Sealing ring lock 14 Sealing gasket 15 Insulated top cover 16 Insulated connector 17 Insulation cover clips 18 Vent pipe 19 Communication cable 20 Insulated bottom cover Detailed Implementation

[0019] The present invention will now be described in detail with reference to the accompanying drawings and embodiments: like Figures 1 to 3 As shown, a thermal insulation device for a silicon piezoresistive hydrostatic level sensor and its pipeline includes a sensor 11 and a sensor pipeline. The sensor 11 is provided with a thermal insulation shell, and a thermal insulation protective shell is provided outside the thermal insulation shell to protect it. A thermal insulation joint 16 is reserved on the outer wall of the thermal insulation shell so that the sensor pipeline can pass through, and a thermal insulation protective joint is reserved on the outer wall of the thermal insulation protective shell.

[0020] The insulation joint 16 is connected to the insulation pipe 9, and the sensor pipeline is inserted into the insulation pipe 9.

[0021] The thermal insulation and protective joint is connected to the thermal insulation and protective pipe 3, and the thermal insulation pipe 9 is inserted into the thermal insulation and protective pipe 3.

[0022] The heat-insulating housing includes a lower heat-insulating cover 20 and an upper heat-insulating cover 15, which are fastened to the lower heat-insulating cover 20 by heat-insulating cover buckles 17. The lower heat-insulating cover 20 and the upper heat-insulating cover 15 form a receiving cavity, which accommodates the sensor 11.

[0023] The thermal insulation joint 16 includes an upper semi-cylindrical plate and a lower semi-cylindrical plate. The upper semi-cylindrical plate is disposed on the outer wall of the thermal insulation upper cover 15, and the lower semi-cylindrical plate is disposed on the outer wall of the thermal insulation lower cover 20. The upper and lower semi-cylindrical plates are joined together to form a hollow cylindrical joint.

[0024] The lower heat-insulating cover 20 and the upper heat-insulating cover 15 are columnar structures.

[0025] The thermal insulation protective shell has a rectangular structure and includes a thermal insulation protective lower cover 6 and a thermal insulation protective upper cover 1 disposed on the thermal insulation protective lower cover 6. The thermal insulation protective upper cover 1 and the thermal insulation protective lower cover 6 form a protective cavity inside, which accommodates the thermal insulation shell.

[0026] The heat-insulating protective upper cover 1 and the heat-insulating protective lower cover 6 are joined together at the side walls to form a sealing ring lock 13.

[0027] A protective pipe sealing ring 8 is provided on the outer wall of the thermal insulation protective pipe 3, and the protective pipe sealing ring 8 is locked and fixed by the sealing ring buckle 13.

[0028] Specifically, the lower insulation cover 20 and the upper insulation cover 15 are fixed together by a snap-fit ​​method, and an insulation cover snap-fit ​​17 is formed at the assembly surface between the lower insulation cover 20 and the upper insulation cover 15, and the insulation cover snap-fit ​​17 is used for interlocking fixation.

[0029] Specifically, the sensor pipeline includes a liquid inlet pipe 10, a vent pipe 18, and a communication line 19, which are connected to the sensor 11.

[0030] Specifically, the accommodating cavity formed inside the heat-insulating lower cover 20 and the heat-insulating upper cover 15 matches the outer contour of the sensor 11.

[0031] Specifically, the bottom of the thermal insulation and protective cover 6 is provided with a thermal insulation and protective cover fixing wing 7, and a thermal insulation and protective cover fixing hole 4 is formed in the thermal insulation and protective cover fixing wing 7. The thermal insulation and protective cover fixing hole 4 is used to fix the thermal insulation and protective cover 6 to the surface of the structure.

[0032] More specifically, there are four fixing wings 7 for the thermal insulation protective cover, which are located in pairs on both sides of the thermal insulation protective lower cover 6. The thermal insulation protective lower cover 6 is fixed at four points.

[0033] Specifically, the thermal insulation protective upper cover 1 and the thermal insulation protective lower cover 6 have a symmetrical structure.

[0034] Specifically, an outer edge 5 of the thermal insulation protective cover is formed at the open position of the thermal insulation protective cover 1. The outer edge 5 of the thermal insulation protective cover is used to fix it to the lower thermal insulation protective cover 6. A connection hole 2 for fixing is formed in the outer edge 5 of the thermal insulation protective cover.

[0035] Preferably, the heat-insulating protective cover has four connecting holes 2, which are fixed at four points.

[0036] Specifically, a sealing structure is provided between the thermal insulation protective upper cover 1 and the thermal insulation protective lower cover 6.

[0037] The upper end of the thermal insulation and protective lower cover 6 forms a sealing gasket fixing groove 12, and a sealing gasket 14 is provided in the sealing gasket fixing groove 12.

[0038] Specifically, adjacent sensors 11 are connected by a liquid inlet pipe 10, a vent pipe 18, and a communication line 19.

[0039] Specifically, the lower insulation cover 20 and the upper insulation cover 15 wrap the upper and lower surfaces and part of the sides of the sensor 11. The pipeline between the sensors 11 is inserted into the insulation pipe 9 to wrap the pipeline. The end of the insulation pipe 9 is embedded and connected to the insulation joint 16 of the sensor 11 to wrap the remaining sides of the sensor 11 and the pipeline joint, thereby achieving complete insulation of the sensor 11 after it is connected to the pipeline.

[0040] Specifically, after the sensor 11 is insulated by the thermal insulation shell, the thermal insulation shell is then sealed and protected by the thermal insulation protective upper cover 1 and the thermal insulation protective lower cover 6. The thermal insulation protective cover fixing wing 7 is connected and fixed to the surface of the monitoring structure through the thermal insulation protective cover fixing hole 4 and matching bolts, thereby fixing the position of the sensor 11.

[0041] Specifically, the end of the heat-insulating protective tube 3 is covered with a protective tube sealing ring 8. After the pipeline between the sensors 11 is insulated, it is inserted into the heat-insulating protective tube 3. The end of the heat-insulating protective tube 3 enters the inner cavity of the heat-insulating protective cover. The position of the protective tube sealing ring 8 is adjusted so that it is embedded between the sealing ring locks 13.

[0042] When the upper insulation cover 1 and the lower insulation cover 6 are connected and fixed, the end of the insulation tube is locked and sealed. After the insulation tube 3 is closely attached to the surface of the monitoring structure, it is fixed with a fixing buckle at a certain distance.

[0043] Specifically, before connecting the sensor pipeline to the sensor 11, the insulation pipe 9 should be installed first, followed by the insulation protection pipe 3, and the protective pipe sealing ring 8 should be installed at the end of the insulation protection pipe 3. Alternatively, the insulation pipe 9, the insulation protection pipe 3, and the protective pipe sealing ring 8 can be assembled in advance for pipeline insulation protection.

[0044] Specifically, the sensor insulation cover is made of rigid insulation material and has a certain degree of compressive strength; the insulation tube 9 is made of soft insulation material and has flexibility and axial extensibility, and can maintain coordinated deformation with the insulation protection tube 3; the sensor insulation cover and the insulation tube have equivalent insulation performance.

[0045] Specifically, the thermal insulation and protective pipe 3 is flexible and axially extensible, and can be made of steel wire corrugated pipe to avoid the end falling off when the monitoring structure is deformed, thus preventing local insulation and sealing failure.

[0046] Specifically, when there is a gap between the top surface of the sensor 11 and the bottom surface of the insulation cover 15, or between the top surface of the insulation cover 15 and the bottom surface of the insulation protective cover 1, a gasket of a certain thickness can be inserted to ensure the consistency of the sensor 11 with the insulation cover and the insulation protective cover as the structure deforms.

[0047] An installation method for a silicon piezoresistive hydrostatic level sensor and its pipeline insulation device includes the following steps: A. Conduct a site survey of the monitoring structure, mark the route, and drill holes on the structure surface; B. Install the thermal insulation and protective cover according to the drilled holes; C. Lay the sensor pipelines according to the wiring markings; D. Insert the sensor tubing into the insulation pipe for heat preservation; E. Insert the insulation pipe into the insulation protection pipe for insulation protection; F. After connecting the laid sensor pipelines, perform system debugging; G. Install the insulation casing; H. Install the thermal insulation and protective cover to complete the thermal insulation and protection of the sensor.

[0048] Specifically, step A involves conducting a site survey of the monitoring structure, marking the route, and drilling holes in the structure surface. The specific process is as follows: First, a site survey of the monitoring structure is conducted, and the pipeline laying route and sensor installation location are determined based on the monitoring deployment plan, site topography, and distribution of obstacles.

[0049] Then, based on the marked lines and sensor 11 installation positions, the drilling positions are marked using pipeline fixing clips and the thermal insulation cover fixing holes 4 of the thermal insulation cover 6 as marking molds, and drilling is performed on the structural surface.

[0050] Finally, the drilling depth is determined by the length of the matching bolt. After drilling is completed, use a vacuum cleaner to clean the residue near the hole and inside the hole.

[0051] Specifically, step B involves installing the thermal insulation and protective lower cover based on the drilled holes. The specific process is as follows: First, align the fixing hole 4 of the thermal insulation cover with the drilled hole at the installation position of the sensor 11, and observe whether it is in close contact with the structural surface. If it is not in close contact, it needs to be sanded flat and cleaned before being repositioned and aligned.

[0052] Then, ensure that the axial direction of the sealing ring latch 13 of the thermal insulation and protective cover 6 is consistent with the pipeline direction, and fix the thermal insulation and protective cover 6 to the structural surface with matching bolts.

[0053] Specifically, after the lower cover 6 of the thermal insulation protection is fixed, a pair of sealing gaskets 14 are placed into the sealing gasket fixing groove 12 of the lower cover 6 of the thermal insulation protection.

[0054] Specifically, according to the marked pipeline laying route, liquid pipe 10, air pipe 18, communication line 19, insulation pipe 9 and insulation protection pipe 3 are laid respectively, and the pipeline is inserted into the insulation pipe 9. Then, the insulation pipe 9 with the built-in pipeline is inserted into the insulation protection pipe 3, and a protective pipe sealing ring 8 is put on the end of the insulation protection pipe 3.

[0055] As a reference, the insulation pipe 9 can be inserted into the insulation protective pipe 3 first, and the protective pipe sealing ring 8 can be put on the end of the insulation protective pipe 3 before the pipeline is inserted into the insulation pipe 9.

[0056] As a reference, the insulation pipe 9 and the insulation protection pipe 3 can also be pre-processed into a single pipe, and the end can be fitted with a protective pipe sealing ring 8 before the pipeline is inserted into the single pipe.

[0057] As a reference, the insulation pipe 9, the insulation protection pipe 3 and the pipeline can be pre-processed into an integrated pipe, and the end can be fitted with a protective pipe sealing ring 8 before connection, system debugging and fixing.

[0058] To facilitate installation, after laying, the ends of the pipeline, insulation pipe 9, and insulation protective pipe 3 are cut, leaving a certain length for easy pipe threading. The reserved length of the insulation protective pipe 3 is such that after laying, it is located inside the cavity of the insulation protective cover and does not affect the installation of the sensor 11 and the sensor insulation cover. The reserved length of the insulation pipe 9 is not less than the reserved length of the insulation protective pipe 3, and the reserved length of the pipeline is not less than the reserved length of the insulation pipe 9.

[0059] Specifically, after the pipeline, insulation pipe 9, and insulation protection pipe 3 are assembled, the insulation pipe 9 and pipeline are cut a second time to ensure that the end of the insulation pipe 9 can be embedded inside the insulation joint 16 and that the pipeline joint and sensor 11 can be properly connected.

[0060] Specifically, after connecting the laid sensor pipelines in step F, system debugging is performed, and the specific process is as follows: First, connect the liquid storage device and sensor 11 sequentially into sections through pipeline connectors. At the beginning of the section, the liquid inlet pipe 10 on one side of sensor 11 is connected to the lower part of the liquid storage device, the vent pipe 18 is connected to the upper part of the liquid storage device, and the communication line 19 is connected to the signal acquisition end. Ensure that the liquid inlet pipe 10 and the vent pipe 18 are connected without air leakage and that the signal of the communication line 19 is debugged normally.

[0061] Then, inject the liquid medium into the liquid storage device, and after expelling all the gas from the liquid pipe 10 and the sensor liquid chamber, seal the liquid pipe joint and the vent pipe joint on the sensor side at the end of the section respectively.

[0062] Specifically, step G involves installing the insulation housing and debugging the sensor. The detailed process is as follows: First, place the insulation lower cover 20 with its opening facing upward inside the fixed insulation protection lower cover 6, ensuring that the outer plane of the insulation lower cover 20 is in close contact with the inner plane of the insulation protection lower cover 6, and that the axial direction of the insulation joint of the insulation lower cover 6 is consistent with the pipeline route.

[0063] Then, place the sensor 11 in the inner groove of the lower insulation cover 6, so that the bottom plane of the sensor 11 is in close contact with the inner plane of the lower insulation cover 6. Insert the ends of the insulation tubes on both sides of the sensor 6 into the insulation connectors 16. Connect and lock the upper insulation cover 15 and the lower insulation cover 20 through the insulation cover buckle 17.

[0064] Finally, when there is a gap between the top plane of the sensor 11 and the inner plane of the insulation cover 15, a gasket of a certain thickness can be added between the two planes.

[0065] Specifically, step H involves installing the thermal insulation cover to complete the thermal insulation protection of the sensor. The specific process is as follows: First, adjust the longitudinal position of the protective tube sealing rings 8 on both sides of the sensor so that they are between the sealing ring latches 13. Align the thermal insulation protective upper cover 1 and the thermal insulation protective lower cover 6 through the thermal insulation protective cover connection hole, and then connect and lock them with the matching bolts.

[0066] Then, when there is a gap between the outer plane of the thermal insulation cover 15 and the inner plane of the thermal insulation protective cover 1, a gasket of a certain thickness can be added between the two planes to ensure that the sensor and the monitoring structure can deform in a consistent manner.

[0067] Finally, the heat-insulating protective tube 3 is made to fit tightly against the surface of the monitoring structure, and fixed with fasteners at certain intervals to complete the installation and fixing of the liquid storage device, the acquisition system and other components.

[0068] This invention uses a modular insulated top cover and a modular insulated bottom cover to house and insulate the sensor. The insulated joints on the outer walls of the top and bottom covers allow them to connect to the insulated pipe, facilitating the entry of pipelines into the insulated pipe and thus achieving pipeline insulation.

[0069] This invention achieves sealing protection for the insulation cover by using a combination of a top and bottom insulation cover. A sealing ring is fitted onto the insulation tube, and the sealing ring is locked in place by a locking buckle, thereby achieving overall sealing. The insulation tube is then used to contain the insulation tube.

[0070] This invention solves the problem of decreased thermal insulation performance caused by external water absorption of thermal insulation materials, and at the same time reduces the aging rate of thermal insulation materials.

Claims

1. A heat insulation device for a silicon piezoresistive hydrostatic level sensor and its pipeline, comprising a sensor (11) and a sensor pipeline, characterized in that: The sensor (11) is provided with an insulation shell, and an insulation protective shell is provided outside the insulation shell to protect it. An insulation connector (16) for the sensor pipeline to pass through is reserved on the outer wall of the insulation shell, and an insulation protective connector is reserved on the outer wall of the insulation protective shell. The heat-insulating shell includes a heat-insulating lower cover (20) and a heat-insulating upper cover (15) which is fastened to the heat-insulating lower cover (20) by a heat-insulating cover buckle (17). The heat-insulating lower cover (20) and the heat-insulating upper cover (15) form a receiving cavity, which accommodates the sensor (11). The insulation joint (16) includes an upper semi-cylindrical plate and a lower semi-cylindrical plate. The upper semi-cylindrical plate is located on the outer wall of the insulation upper cover (15), and the lower semi-cylindrical plate is located on the outer wall of the insulation lower cover (20). The upper semi-cylindrical plate and the lower semi-cylindrical plate are joined together to form a hollow cylindrical joint. The lower insulation cover (20) and the upper insulation cover (15) wrap the upper and lower surfaces and part of the sides of the sensor (11). The pipeline between the sensors (11) is inserted into the insulation pipe (9) to wrap the pipeline. The end of the insulation pipe (9) is embedded and connected to the insulation joint (16) of the sensor (11) to wrap the remaining sides of the sensor (11) and the pipeline joint, thereby achieving complete insulation of the sensor (11) after it is connected to the pipeline. After the sensor (11) is insulated by the heat insulation shell, the heat insulation shell is then sealed and protected by the heat insulation protective upper cover (1) and the heat insulation protective lower cover (6). The heat insulation protective cover fixing wing (7) is connected and fixed to the surface of the monitoring structure through the heat insulation protective cover fixing hole (4) and matching bolts to fix the position of the sensor (11). The sensor insulation cover is made of rigid insulation material and has pressure resistance; the insulation tube (9) is made of soft insulation material and has flexibility and axial extensibility, and maintains coordinated deformation with the insulation protection tube (3); the sensor insulation cover and the insulation tube (9) have equivalent insulation performance. The heat-insulating protective upper cover (1) and the heat-insulating protective lower cover (6) are joined together at the side walls to form a sealing ring lock (13). The outer wall of the heat-insulating protective pipe (3) is provided with a protective pipe sealing ring (8), and the protective pipe sealing ring (8) is locked and fixed by the sealing ring buckle (13).

2. The silicon piezoresistive hydrostatic level sensor and pipeline insulation device according to claim 1, characterized in that: The insulation connector (16) is connected to the insulation pipe (9), and the sensor pipeline is inserted into the insulation pipe (9).

3. The silicon piezoresistive hydrostatic level sensor and pipeline insulation device according to claim 2, characterized in that: The thermal insulation and protective joint is connected to the thermal insulation and protective pipe (3), and the thermal insulation pipe (9) is inserted into the thermal insulation and protective pipe (3).

4. The silicon piezoresistive hydrostatic level sensor and pipeline insulation device according to claim 1, characterized in that: The lower heat-insulating cover (20) and the upper heat-insulating cover (15) are columnar structures.

5. The silicon piezoresistive hydrostatic level sensor and pipeline insulation device according to claim 3, characterized in that: The thermal insulation protective shell is a rectangular structure. The thermal insulation protective shell includes a thermal insulation protective lower cover (6) and a thermal insulation protective upper cover (1) set on the thermal insulation protective lower cover (6). The thermal insulation protective upper cover (1) and the thermal insulation protective lower cover (6) form a protective cavity inside, and the protective cavity accommodates the thermal insulation shell.

6. The installation method of the silicon piezoresistive hydrostatic level sensor and pipeline insulation device according to claim 1, characterized in that: Includes the following steps: A. Conduct a site survey of the monitoring structure, mark the route, and drill holes on the structure surface; B. Install the thermal insulation and protective lower cover according to the drilled holes; C. Lay the sensor pipelines according to the wiring markings; D. Insert the sensor tubing into the insulation pipe for heat preservation; E. Insert the insulation pipe into the insulation protection pipe for insulation protection; F. After connecting the laid sensor pipelines, perform system debugging; G. Install the insulation casing; H. Install the thermal insulation and protective cover to complete the thermal insulation and protection of the sensor and pipeline.

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